JP2002326217A - Drum die working apparatus using wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low cost working apparatus, capable of accurately grinding planes of a wide area or grooving one planar part by effectively utilising a wire saw. SOLUTION: A drum die working apparatus using the wire saws comprises the wire saws 12 wound at an interval in the longitudinal direction of the shell of the drum 11 on the peripheral surface of the rotatably driven drum 11 to work a work piece W by relatively moving the work piece W to the wire saws 12 on the peripheral surface of the drum 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus used for grinding, polishing, grooving, etc. of concrete, stone, and other hard and brittle materials.

[0002]

2. Description of the Related Art Conventionally, diamond abrasive grains and cBN abrasive grains are fixed to a base metal as tools for grinding, polishing and grooving hard and brittle materials such as concrete, stone, glass, ceramics and magnetic materials. A grindstone is generally used. There are many classifications of grinding stones according to the classification criteria such as the shape of the grinding wheel base, the material of the abrasive grains, the type of bonding material, and the method of forming the abrasive grain layer. There are whetstones, cup-type whetstones, and stick-type whetstones, which are used properly according to the type of processing target and processing content.
In addition, the classification according to the type of the bonding material (bond) includes a metal bond grindstone, a resin bond grindstone, and a vitrified bond grindstone, which are properly used according to the type of the workpiece.

[0003] The disc-type grindstones, cup-type grindstones and stick-type grindstones have different types of processing objects and processing contents suitable for each of the shapes of the base metal, and the disk-type grindstones have a contact area with the workpiece. Because of its small size and high machining efficiency, it is mainly used for roughing and grooving of stone and concrete, etc.The cup-type grindstone has a large contact area with the workpiece, flatness and roughness of the machined surface. Because of its good degree, it is mainly used for surface finishing of ceramics and glass, etc.Stick whetstone is mainly used for shape correction of whetstone of rotating body etc. because it can be used by hand. .

[0004] Metal bond grindstones, resin bond grindstones, and vitrified bond grindstones by type of bond each have advantages and disadvantages. Metal bond grindstones are mainly made of glass,
Used for rough machining of ceramics and magnetic materials.Resin bond grindstones are mainly used for finishing of cemented carbides, ceramics and magnetic materials due to the low strength of the bond and abrasive grains. Since the bond has a high Young's modulus and a low coefficient of thermal expansion, it is mainly used for high-precision finishing of steel and ceramics.

[0005]

The so-called superabrasive grindstone in which superabrasive grains such as diamond abrasive grains and cBN abrasive grains are fixed to a base metal as described above is expensive. Since the manufacturing process is complicated and the manufacturing cost is high, the whetstone is expensive.

For example, when performing surface grinding of a large area such as surface grinding of a concrete pavement road,
A grindstone in which superabrasive grains are fixed to the peripheral surface of a wide drum-type base metal will be used.However, such a wide drum-type grindstone has a particularly high manufacturing cost. One set of a narrow drum-type grindstone is manufactured as a standard grindstone, and a method is used in which several grindstones are used in combination. However, in such a method, there is a case where it is not possible to combine a grindstone having an appropriate width with respect to various processing areas, so that there is a problem that processing efficiency is reduced.

[0007] Further, in the case of processing different from surface grinding, for example, when grooving is performed on a plane portion, a grindstone for grooving is required separately from a drum-type grindstone for surface grinding. The grindstone for grooving is a disk-type grindstone in which abrasive grains are fixed to the outer periphery of a disc-shaped substrate. Is performed using a compound grindstone arranged at regular intervals. However, in this way, there is a problem that various types of grindstones must be prepared according to the processing content.

In order to solve such a problem, an apparatus for performing surface grinding using a plurality of wire saws has been disclosed in Japanese Patent Application Laid-Open No. 2000-2000.
No. 288,903. This surface grinding device stretches a plurality of wire saws running between rolls at equal pitches and moves the work table of the workpiece in a direction perpendicular to the traveling direction of the wire saw row and in the cutting direction to the workpiece. With this apparatus, the cutting position is gradually changed in a direction perpendicular to the running direction of the wire row, and the cutting is performed.

However, in the grinding apparatus described in the above publication,
Since surface grinding is performed by oscillating the workpiece under the incision of the wire saw where the traveling position is fixed, the traveling speed of the wire saw is limited and high machining efficiency cannot be obtained. There is. In addition, there is a problem in that good processing accuracy cannot be obtained due to loosening or sagging of the wire saw.

The problem to be solved by the present invention is to provide a low-cost processing apparatus capable of performing surface grinding of a large area and grooving a plane portion with high accuracy by effectively utilizing a wire saw. is there.

[0011]

In a drum type processing apparatus using a wire saw according to the present invention, a wire saw is wound around a peripheral surface of a rotationally driven drum at intervals in a drum body length direction. The workpiece is processed by relatively moving the workpiece with respect to the wire saw.

With such a configuration, when the drum is rotated, the wire saw wound on the drum travels in the winding direction together with the rotation of the drum, so that the drum and the workpiece are relatively pressed and moved. By this, the workpiece is ground by the wire saw,
Surface grinding and grooving are performed. Since the main part of the device is only the drum and the wire saw wound therearound, the structure is simple, the device can be manufactured at low cost, and the workpiece is moved relatively to the wire saw on the drum peripheral surface. Thus, since the workpiece is machined, the wire saw does not sag as in the machining apparatus described in JP-A-2000-288903, and the relative position control between the drum and the workpiece is easy. And good processing accuracy can be obtained.

[0013] The wire saw wound around the drum peripheral surface may be a single endless wire saw wound spirally at intervals in the drum body length direction. Also, one endless wire saw wound in parallel with an interval in the drum body length direction can be used. When the wire saw is spirally wound, surface grinding can be performed without moving the workpiece horizontally, which is suitable for grinding. If the wire saw is wound in parallel,
Since a plurality of grooves can be simultaneously formed on the workpiece, it is suitable for grooving.

As the drum, a hollow cylindrical metal drum made of steel, aluminum, or the like, or a drum having a rubber coating layer formed on the outer peripheral surface of these metal drums is used, and a support shaft is used as a rotary drive mechanism. The connection enables rotation at an arbitrary rotation speed. When a rubber coating layer is formed on the outer peripheral surface, the noise during processing is reduced, and the movement of the wire saw is free, and the wire saw becomes strong against impact, so that the wire saw is less likely to break. In winding the wire saw around the drum, a groove for winding the wire saw may be formed on the outer peripheral surface of the drum so that the wire saw wound around the drum does not slip in the drum length direction. In addition, by winding the wire saw around the drum, not the entire area in the body length direction of the drum, the wire saw is wound around part of the drum, so that the processing area on the workpiece can be adjusted using one drum. it can.

Further, the wire saw can be configured to rotate on its own when the drum rotates. As a method for rotating the wire saw wound around the drum, for example, by changing the inclination angles of the left and right sides of the wire saw winding groove on the outer peripheral surface of the drum, the wire saw falls down to the side having the gentler inclination angle and rotates. A method of twisting the wire saw when connecting the wire saw endlessly, a method of interposing a pulley for hanging the wire saw separately from the drum, and the like. Since the wire saw itself rotates along with the running of the wire saw in the winding direction due to the rotation of the drum, uneven wear of the abrasive grain layer of the wire saw can be prevented.

As the wire saw, a conventionally used wire saw can be used as it is. For example, for processing such as grinding, polishing and grooving of a concrete pavement surface or an asphalt pavement surface, a wire saw used to cut a concrete structure into small pieces for demolition is most suitable. As the wire saw, a so-called bead-type wire saw is used, but the wire saw used in the present invention is not limited to the bead-type wire saw, and a wire saw having an abrasive layer formed on the entire length of the wire can also be used.

[0017]

FIG. 1 is a front view showing a main part of a drum type machining apparatus according to a first embodiment of the present invention, and FIG. 2 is a view showing an example of a wire saw used.

The drum type machining apparatus 10 of the present embodiment spirally winds an endless wire saw 12 at a constant pitch in the length direction of a drum body around a peripheral surface of a rotatably driven drum 11, between a winding start end and a winding end. Wire saw 12 to drum 11
Pulleys 13a, 13 provided near the upper starting end and the upper end
b.

The drum 11 is a hollow cylindrical steel drum having an outer diameter of about 400 mm and a body length of about 600 mm. A spiral groove 11a having a width of about 25 mm and a depth of about 4 mm is formed on the drum surface at a constant pitch. The drum 11 is rotated in the direction of arrow A by a rotation driving device (not shown).

As shown in FIG. 2, the wire saw 12 is composed of a steel wire core wire 23 and an annular bead 22 having an abrasive layer 21 formed on the outer periphery of a base metal 20 by an electrodeposition method or a metal sintering method.
Are arranged at regular intervals, the ends of the core wires 23 are joined to form an endless ring, and the outer periphery of the core wire 23 between the beads 22 is covered with a coating material 24 such as rubber or rigid resin to form a spacer 25. And a conventionally known structure. The wire saw 12 is wound around the drum 11 as shown in FIG. 1 with a part embedded in a spiral groove 11 a on the peripheral surface of the drum 11.

Since the drum type processing apparatus 10 is configured as described above, when the drum 11 is rotated in the direction of arrow A while the wire saw 12 is wound around the drum 11, the wire saw 12 moves while moving in the direction of arrow B. Rotates with 11. Therefore, when the workpiece is pressed against the peripheral surface of the drum while rotating the drum 11, the wire saw 12
The workpiece is ground by the beads 22.

FIG. 3 is a view showing a region to be ground by the drum type processing apparatus 10. In the state where the workpiece W is pressed against the peripheral surface of the drum while rotating the drum 11, the workpiece W is moved in the direction of arrow C. Then, the region S is ground. The grinding width of the region S corresponds to the winding width of the wire saw 12 around the drum 11, and the grinding depth per operation corresponds to a value obtained by subtracting the depth of the groove 11 a from the outer diameter of the abrasive layer 21 of the wire saw 12. .

FIG. 4 is a front view showing a main part of a drum type processing apparatus according to a second embodiment of the present invention, and FIG. 5 is a view showing an example of a wire saw used.

The drum type machining apparatus 30 according to the present embodiment winds an endless wire saw 32 in parallel with a constant pitch in the drum body length direction on a peripheral surface of a rotationally driven drum 31, and a wire saw between a winding start end and a winding end. Pulleys 32a, 33b provided near the start end and the end end above the drum 31
And around three guide rollers 34, 35 and 36 disposed above the drum 31.

The drum 31 is a drum 1 according to the first embodiment.
This is a hollow cylindrical steel drum similar to that described above, and a rubber coating layer 31a is formed on the drum surface. The drum 31 is rotated in the direction of arrow D by a rotation driving device (not shown).

The guide rollers 34 to 36 are for keeping the wire saw 32 wound in parallel with the drum 31 in a parallel state.
A groove (not shown) is formed so that 2 does not shift,
While rotating the guide rollers 34 to 36 in the same rotational direction (the direction of arrow D) and the peripheral speed as the drum 31, the wire saw 3
The wire saw 32 can be kept parallel to the surface of the drum 31 at a constant interval by changing the angle of 2 in a stepwise manner and feeding it to the groove of the next guide roller. When increasing the pitch of the wire saw 32 wound around the drum 31, it is desirable to increase the number of guide rollers.

As shown in FIG. 5, the wire saw 32 is a conventionally known resin bond wire saw in which an abrasive layer 32b is fixed to a core wire 32a. This wire saw 32 is shown in FIG.
As shown in the figure, the drum 31 is wound around the surface of the rubber coating layer 31a.

Since the drum type processing device 30 has the above-described configuration, when the drum 31, the pulleys 33a and 33b, and the guide rollers 34 to 36 are rotated in the direction of arrow D with the wire saw 32 wound around the drum 31, The wire saw 32 rotates together with the drum 31 while traveling in the direction of arrow E. Therefore, when the workpiece is pressed against the peripheral surface of the drum while rotating the drum 31, the wire saw 32 is pressed.
The groove is ground on the workpiece by the abrasive layer 32b.

FIG. 6 is a view showing grooves formed by grinding by the drum type machining apparatus 30. The workpiece W is pressed by an arrow while rotating the drum 31 while pressing the workpiece W against the drum peripheral surface. When it is moved in the F direction, three rows of processing grooves G are formed. The processing groove G has a width corresponding to the outer diameter of the wire saw 32 and has a semicircular bottom at the bottom (however, the drawing is exaggerated).

[0030]

(1) A wire saw is wound around a peripheral surface of a rotating drum at a distance in a drum body length direction, and a workpiece is relatively moved with respect to the wire saw on the peripheral surface of the drum. By employing a configuration for processing a workpiece, surface grinding and grooving of the workpiece can be efficiently performed by the wire saw.
Since the main part of the device is only the drum and the wire saw wound around it, the structure is simple, the device can be manufactured at low cost, and the relative position control between the drum and the workpiece is easy, so good processing Accuracy can be obtained.

(2) When one wire saw is spirally wound at intervals in the drum length direction, surface grinding can be performed without moving the workpiece in the horizontal direction. When a plurality of wire saws are wound in parallel, a plurality of grooves can be simultaneously formed on the workpiece.

(3) By forming a rubber coating layer on the outer peripheral surface of the drum and winding a wire saw on this coating layer, noise during processing is reduced, and the movement of the wire saw is free, so that it is strong against impact. And the wire saw is less likely to break. Further, by forming a groove on the peripheral surface of the drum and winding the wire saw so as to embed a part of the wire saw in the groove, the wire saw wound on the drum does not slip in the drum length direction of the drum.

[Brief description of the drawings]

FIG. 1 is a front view showing a main part of a drum type processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of a wire saw used in the drum-type processing device of FIG.

FIG. 3 is a view showing a region to be ground by the drum type processing apparatus of FIG. 1;

FIG. 4 is a front view showing a main part of a drum type processing apparatus according to a second embodiment of the present invention.

FIG. 5 is a view showing an example of a wire saw used in the drum-type processing apparatus of FIG.

FIG. 6 is a view showing grooves formed by grinding by the drum type processing apparatus of FIG. 4;

[Explanation of symbols]

 10, 30 Drum type processing device 11, 31 Drum 11a Groove 12, 32 Wire saw 13a, 13b, 33a, 33b Pulley 20 Base metal 21, 32b Abrasive layer 22 Beads 23, 32a Core wire 24 Coating material 25 Spacer 31a Rubber coating layer 34 , 35, 36 Guide roller W Workpiece S Grinding area G Machining groove

Continuing on the front page (72) Inventor Yoji Niizawa 210 Noritake Diamond Co., Ltd., Tanushimaru-cho, Ukiha County, Fukuoka Prefecture ) Inventor Minoru Takakura 210-chome Takeno, Tanushimaru-cho, Ukiha-gun, Fukuoka F-term in Noritake Diamond Co., Ltd.

Claims (4)

[Claims] 1. A wire saw is wound around a peripheral surface of a rotationally driven drum at intervals in a drum body length direction, and a workpiece is moved by moving a workpiece relatively to the wire saw on the peripheral surface of the drum. A drum type processing device using a wire saw configured to process a workpiece. 2. A drum type using a wire saw according to claim 1, wherein the wire saw wound around the drum peripheral surface is a single endless wire saw wound spirally at intervals in a drum body length direction. Processing equipment. 3. The drum according to claim 1, wherein the drum is a hollow cylindrical metal drum,
The drum type processing apparatus using a wire saw according to claim 1, wherein the drum is a drum having a rubber coating layer formed on an outer peripheral surface of a hollow cylindrical metal drum. 4. A drum type processing apparatus using a wire saw according to claim 3, wherein a groove for winding the wire saw is formed on an outer peripheral surface of the drum.