JP2003092239A - Semiconductor product production system - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a semiconductor product production system capable of more reliably maintaining or improving the product yield. SOLUTION: A semi-finished product produced through a plurality of assembling steps and a characteristic inspection step and obtained by performing a first half of a plurality of assembling steps in a first factory 1 is a second factory 2
And a semiconductor product production system produced by performing the latter half of the assembling process and the characteristic inspection process 27 in the second factory 2, comprising a first factory 1 and a second factory 2. And these first factory 1 and second factory 2
, And the production management information and the inspection result information obtained in the second factory 2 are transmitted to the first factory 1 via the Internet communication network 3, Based on the production management information and the inspection result information, the production conditions of the assembly process performed in the first factory 1 are changed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor product production system produced through a production process including a plurality of assembly processes and characteristic inspection processes. The present invention relates to a semiconductor product production system that is completed by transferring finished products to a second factory and performing the remaining assembly steps in the second factory.

[0002]

2. Description of the Related Art As an example of a conventional semiconductor product production process, a wafer process including epitaxial growth on a semiconductor wafer, channel formation, electrode formation, etc.
An assembly process (hereinafter, referred to as “second half process”) including a “first half process”, a process of dividing the semiconductor wafer after the wafer process into chips, a die bonding process, a wire bonding process, and a sealing process. )) As well as a characteristic inspection process for inspecting electro-optical characteristics of individual semiconductor products.

FIG. 4 is an explanatory view showing an example of a conventional semiconductor product production process. In the figure, solid arrows indicate the flow of work, and broken arrows indicate the flow of information.

Conventionally, in the production of semiconductor products such as semiconductor lasers and light emitting diodes, the first half of the substrate acceptance inspection step 101, the epitaxial growth step 102, the channel formation step 103, and the electrode formation step 104, and wafer division (chip formation). A second half process including a process 105, a die bonding process 106, a wire bonding process 107, and a sealing process 108, a characteristic inspection process 109, and a finished product process 110. Of these, in the first half of the process,
A batch having 10 to 50 semiconductor wafers as one unit is formed, and processing is performed in this batch unit. Further, the latter half process, the characteristic inspection process 109 and the finished product process 110.
In, the processing steps are carried out in lot units with one semiconductor wafer as one unit.

In such a semiconductor product production system, after the processing of one batch or lot is completed in each process, a new batch or lot is introduced, and the processing steps are successively advanced in batch or lot units. Then, when the first lot became a finished product, a production system was adopted so that each process was carried out for a plurality of batches and lots.

Then, the inspection data obtained in the characteristic inspection step 109 is fed back to the first half step to change the parameters of a specific step of the first half step, for example, the epitaxial growth step 102, in order to stabilize and improve the yield. It was

[0007]

Among the semiconductor product production processes, the first half process is performed in the first factory 114 having a high cleanliness of class 100 or less, and the second half of the processes is a little clean with a class of 10,000 or so. Lower second factory 1
It is common to be implemented at 15. Further, the first half process is generally a device-intensive type with high production efficiency, whereas the latter half process is generally a labor-intensive type with low production efficiency.

Further, in the conventional production of semiconductor products, the characteristic value of the finished product is greatly influenced by the specific process of the first half process, so the inspection data is fed back to the specific process, and the parameter of this specific process is fed back. Is changed so that the characteristic value of the finished product becomes a predetermined value, and the yield is maintained and improved.

The first factory 114 and the second factory 115 are often installed at bases distant from each other, and particularly the second factory 115 is often installed overseas. Therefore, as a method of the feedback, the inspection data obtained at the second factory 115 is printed out 111, and the offline communication 112 using a public telephone line network such as a facsimile is performed.
Was going on.

As described above, when the inspection data is sent to the first factory 114 by the offline communication 112 using a facsimile or the like, in order to analyze the inspection data, the first factory 1
It is necessary to input data to the personal computer on the 14th side and change the parameters of a specific process (data input, process parameter change 113). As a result, there has been a problem that it is not possible to change the parameters of a specific process, which has a great influence on the characteristic value, in a timely manner.

In addition, it takes time to know how many work-in-process products are present in the second factory 115.
There is also a problem that it is not possible to timely determine which semi-finished product produced in the factory 114 should be sent to which second factory 115 out of a plurality of products.

The present invention was devised to solve such a problem, and by obtaining inspection data in a timely manner, it is possible to more surely maintain or improve the yield of the semiconductor product. The purpose is to provide a system.

[0013]

A semiconductor product production system according to the present invention is manufactured through a plurality of assembly steps and a characteristic inspection step, and at least a part of the plurality of assembly steps is carried out in a first factory. The semi-finished product thus obtained is shipped to one or a plurality of second factories, and the remaining assembly process and characteristic inspection process are carried out in this second plant to produce a semiconductor product. It is composed of a first factory, a second factory, and a communication line used for data transfer between the first factory and the second factory. According to the characteristic inspection process carried out in the second factory. The obtained production management information and inspection result information are transmitted to the first factory via a communication line, and the assembly is performed in the first factory based on the production management information and the inspection result information. Are those such as the change of the extent of the production conditions is carried out.

According to the present invention, after the production control information and the inspection result information are obtained by the characteristic inspection process performed on the completed semiconductor product, the assembly to be performed from now on the basis of the production control information and the inspection result information. It is possible to constantly change the production conditions of the process to produce semiconductor products having desired characteristics.

Further, the first factory and the second factory are connected to a communication line by a transmission / reception server computer provided in each of the first factory and the second factory, and these transmission / reception server computers send a transmission request. Alternatively, it may be set so as to exchange only predetermined process control data and inspection result data.

In this case, a transmission / reception server computer having a function of preventing intrusion from the outside such as a firewall is used, so that the production management information and the inspection result information can be stored in the second factory without fear of leaking the information in the second factory to others. Quick feedback can be provided to one factory.

Further, the production management information may be transmitted from the second factory to the first factory when a transmission request is issued from the first factory.

In this case, the data transmission becomes irregular and the possibility that the data will be intercepted by a third party decreases.

Further, the inspection result information includes data relating to the characteristics of the semiconductor product, and when the production conditions are changed, a plurality of assembling steps are performed so that the characteristics of the semiconductor product have predetermined values based on the inspection result information. It may be a change of a parameter of an assembling process that affects the characteristics of the semiconductor product in the process.

In this case, a semiconductor product having desired characteristics can be obtained.

Further, there are a plurality of the second factories, and as a change of the production condition, at least a part of the semi-finished products scheduled to be shipped to the second factories with a lower yield is the higher factor based on the production management information. The quantity of the semi-finished products shipped from the first factory to the second factory may be changed so as to be shipped to the two plants.

In this case, the second factory having a higher yield can be efficiently used.

Further, the production management information is created in association with each assembling process carried out in the second factory, the model name of the semiconductor product, the symbol for identifying the semiconductor product, the quantity, the process name and the process completion date and time. May be included at least.

In this case, production control can be carried out more reliably.

The semiconductor product may be a semiconductor device.

In this case, such as a semiconductor laser,
It is possible to more surely improve the yield of a semiconductor product whose characteristic inspection can be performed only when the product is completed.

Further, the assembling step that affects the characteristics of the semiconductor product may be a step of epitaxially growing a semiconductor crystal or a step of diffusing impurities into the semiconductor crystal.

In this case, the characteristics of the semiconductor product can be improved more reliably.

The communication line may be an internet communication network.

In this case, the production control information and the inspection result information can be transmitted more quickly.

Further, the communication line may be a dedicated line.

In this case, it is possible to more reliably prevent the production management information and the inspection result information from leaking to a third party.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a semiconductor product production system of the present invention will be described.

[First Embodiment] First, a first embodiment of a semiconductor product production system of the present invention will be described with reference to the drawings.

In this specification, a semiconductor laser is used as an example of a semiconductor product to be produced, but the semiconductor product produced using the semiconductor product production system of the present invention is not limited to this. is not.

FIG. 1 is an explanatory diagram showing an embodiment of a semiconductor product production system of the present invention. In the figure,
The solid arrow indicates the flow of work, and the broken arrow indicates the flow of information.

This semiconductor product production system comprises a first factory 1, a second factory 2, and an internet communication network 3 used for data transfer between the first factory 1 and the second factory 2. There is. Furthermore, the first factory 1
In each of the second factory 2, there are installed in-factory server computers (hereinafter referred to as “in-factory server”) 11 and 21 and transmission / reception server computers (hereinafter referred to as “transmission / reception server”) 12 and 22. .

In the first factory 1, of the semiconductor laser assembling process, the first half process including the substrate acceptance inspection process 13, the epitaxial growth process 14, the channel formation process 15, and the electrode formation process 16 is carried out to obtain a semi-finished product. To be

In the substrate acceptance inspection step 13 of the first half steps, the semiconductor wafer used as a substrate when forming the semiconductor laser is inspected. Epitaxial growth process 1
In 4, a semiconductor crystal is formed on the semiconductor wafer. In the channel forming step 15, for example, etching, sputtering, diffusion of impurities into a semiconductor crystal, etc. are performed, and then, if necessary, a predetermined region of the stacked thin films is removed or a semiconductor layer is formed on the predetermined region. To form. In the electrode forming step 16, an electrode is formed at a predetermined position of the laminated thin films, and then a protective film is formed so as to cover the exposed portion of the thin films.

This first-half process is carried out in the first factory 1 in a very high degree of cleanliness. After that, the semi-finished product is transferred from the first factory 1 to the second factory, which is a factory with a slightly lower cleanness.

In the second factory 2, the wafer division (chip formation) process 23, the die bonding process 24, the wire bonding process 25, and the sealing process 2 in the process of assembling the semiconductor laser.
The latter half process consisting of 6 and the characteristic inspection process 27 and the finished product process 28 are carried out to obtain a finished product (semiconductor laser) ready for shipping.

In the latter half of the steps, in the wafer dividing step 23, the semiconductor wafer is cut using a diamond cutter or the like to divide the individual chips formed on one semiconductor wafer. In the die-bonding step 24, one chip is mounted on a frame made of metal by using a conductive epoxy resin or solder. Wire bond process 2
In 5, the electrodes of the chip and the leads are electrically connected by a conductive wire (eg, gold wire, copper wire or aluminum wire). In the sealing step 26, the chip after bonding is set in a mold together with the frame, a thermosetting resin (for example, epoxy resin) is poured into the mold to be molded, and unnecessary portions of the frame are cut. To do.

In general, a semiconductor integrated product formed by using silicon is easy to electrically separate between elements by forming a PN junction or an insulator in a specific portion of the substrate, and thus is semi-finished in the first half step. By inspecting the electrical characteristics of the product, it is possible to adopt a production system in which the latter half process is carried out only for non-defective chips. However, semiconductor products such as semiconductor lasers have PN on certain parts of the substrate.
It is difficult to provide a joint or an insulator, and the above production system cannot be adopted.

Therefore, until the characteristic inspection step 27 after the end of the sealing step 26, the quality of the product is not known, and the wafer made in the first half step, that is, all the chips made by dividing this wafer are assembled ( It is necessary to perform the latter half process) and to select the quality in the characteristic inspection process 27.

Then, based on the inspection result in the characteristic inspection step 27, a parameter change in the epitaxial growth step 14 is promptly instructed, and a production system is adopted so that as many finished products having predetermined characteristic values as possible can be produced. There is a need.

However, in the conventional production system, since the transmission of the inspection result information is performed off-line, the second
When the factory is remote from the first factory, quick feedback was difficult.

In the semiconductor product production system of the present embodiment, the in-plant server 21 is installed in the second factory 2, and the characteristic inspection value of each work, the average value and distribution of the characteristic inspection values, the quality judgment and the non-defective rate. Is used as the inspection result information 211 from the tester used in the characteristic inspection process 27 to the factory server 21.
Are transferred to. As a symbol for identifying each work, for example, a model name used in each process from the wafer dividing process 23 to the finished product process 28, a symbol for identifying a batch of 50 to 100 wafers, and one wafer A symbol for identifying a lot is used.

Further, the in-plant server 21 stores the quantity of non-defective works in a specific process, the process completion date and time, etc. as the production management information 212. The production management information 212 is, for example, the inspection result information 211 for each lot.
Is managed with.

The inspection result information 211 and the production management information 212 are sent from the sending / receiving server 22 of the second factory 2 to the sending / receiving server 12 of the first factory 1 via the Internet communication network 3. It is taken into the server 11 in the factory of the first factory 1. In addition, these transmission / reception servers 12, 22
Plays a role of transmitting and receiving data and preventing intrusion of the servers 11 and 21 in the factory by a third party.

Then, based on the data (inspection result information 211 and production management information 212) collected in the in-plant server 11 of the first factory 1, the in-plant server 11 determines whether or not the parameters of the epitaxial growth step 14 need to be changed. Then, if necessary, the process parameter change 17 is carried out. These inspection result information 211 and production management information 2
No. 12 is the second one after the characteristic inspection of one lot is completed.
The production system is configured so that the in-plant server 21 of the factory 2 collects the data and immediately transmits it to the in-plant server 11 of the first factory 1.

Further, in the in-plant server 11 of the first factory 1, the inspection result information 211 and the production management information 2 are stored.
Twelve accumulations and updates have been performed, and a large amount of parameter updates and the resulting related data are collected to enable qualified and rapid feedback. For example,
When the yield decrease is detected in the characteristic inspection step 27, the epitaxial growth step 14 is immediately instructed to change the process parameter 17 based on the data accumulated in the in-plant server 11 of the first factory 1, and As a result, the yield can be surely improved.

Further, by using the Internet communication network 3, it is not necessary to install a dedicated line, so that the degree of freedom regarding the location of the second factory 2 is increased. On the other hand, regarding the Internet communication network 3, since the security management of data is important, the first factory 1 and the second factory 2
In between, only the minimum necessary data is transmitted / received, and in the transmission / reception servers 12 and 22, only predetermined information is tagged so that information other than this predetermined information is not transmitted or received. .

[Second Embodiment] Next, a second embodiment of the semiconductor product production system of the present invention will be described with reference to the drawings.

FIG. 2 is an explanatory view showing another embodiment of the semiconductor product production system of the present invention. In the figure, solid arrows indicate the flow of work, and broken arrows indicate the flow of information.

Generally, the first factory 1 for carrying out the first half process
Is required to have a high degree of cleanliness and the equipment costs are high, so it will be installed in a single location. However, since the second factory 2 has loose requirements for the degree of cleanliness, it will not reach the consumption area of finished products. It is often installed at multiple locations, including overseas, after considering distances, personnel costs, and material procurement. In the present embodiment, a production system including a plurality of such second factories will be described.

In addition to the second factory 2, the semiconductor product production system according to the present embodiment has the same equipment as the second factory 2, and another second factory 2a that carries out the same steps.
And the other second factory 2b.

Like the second factory 2, the other second factory 2a includes an in-factory server 21a and a transmission / reception server 22a, and a wafer dividing (chip forming) step 23a, a die bonding step 24a, a wire bonding step. The latter half process including 25a and the sealing process 26a, the characteristic inspection process 27a, and the finished product process 28a are performed. In addition, another second
Like the second factory 2, the factory 2b also has a server 21b in the factory.
And a server 22b for transmission / reception, and includes a second half process including a wafer dividing (chip formation) process 23b, a die bonding process 24b, a wire bonding process 25b and a sealing process 26b, a characteristic inspection process 27b and a finished product process 28b. carry out. .

Each data (inspection) obtained by the characteristic inspection steps 27, 27a, 27b performed in each of the three second factories, that is, the second factories 2, the other second factories 2a, and the other second factories 2b. Result information 211, 211a, 211
b) is the in-plant server 21, 21a, 21 of each of the second factory 2, the other second factory 2a, and the other second factory 2b.
b, and is transmitted from the transmission / reception servers 22, 22a, 22b to the transmission / reception server 12 of the first factory 1 via the Internet communication network 3, and is collected by the in-plant server 11. Then, based on this data, the process parameters change 17 is instructed to the epitaxial growth process 14, and as a result, the yield can be surely improved.

These inspection result information 211, 211a,
Since the transmission of 211b is carried out online via the Internet communication network 3, the inspection result information 21 regardless of the location of the factory (for example, even when it is constructed overseas).
It is possible to always feed back 1,211a, 211b to the first factory 1 quickly.

In the present embodiment, an example in which three second factories are provided has been shown, but the number of second factories is not limited to this, and may be more than three. .

[Third Embodiment] Next, a third embodiment of the semiconductor product production system of the present invention will be described with reference to the drawings.

FIG. 3 is an explanatory view showing still another embodiment of the production system for semiconductor products of the present invention. In the figure, solid arrows indicate the flow of work, and broken arrows indicate the flow of information.

According to the second embodiment described above, it is apparent that the yield improvement and stability can be maintained by rapidly feeding back the characteristic inspection data to the epitaxial growth process in the semiconductor product production system having a plurality of second factories. Became. However, even when the above-described semiconductor product production system is adopted, some fluctuation in the yield of semiconductor products cannot be avoided. Therefore, when semiconductor products are manufactured using a plurality of second factories, particularly when the same model is manufactured by a plurality of second factories, it is difficult to adjust the production quantity as planned while considering the yield. Met. According to the semiconductor product production system of the present embodiment, even when such an identical model is produced in a plurality of second plants, the production quantity can be easily adjusted.

The difference between the semiconductor product production system of the present embodiment and the semiconductor product production system of the second embodiment is that the factory-specific wafer allocation step 18 is performed in the first factory 1. That is the point.

Similar to the second embodiment, the first factory 1
From the second factory 2, another second factory 2a, and further another second factory 2b, the semi-finished wafers are sent, and the latter half of the wafer dividing (chip forming) steps 23, 23a, 23b,
Die bonding process 24, 24a, 24b, wire bonding process 25, 25a, 25b and sealing process 26, 26a,
26b each is carried out. In each of these processes, process management data consisting of model name, batch identifying symbol, lot identifying symbol, quantity, process name, and process completion date and time is obtained. It is collected by the servers 21, 21a and 21b. Information is collected by the in-plant servers 21, 21a, and 21b by a device that executes each process automatically reading production management data and performing LAN (Local Area Network).
ork) to the in-plant servers 21, 21a, 21b, or the production manager reads in the factory management data read by the device that executes each process.
Any method may be used, such as manual key input using the keyboard of the terminal constituting 21a, 21b.

Then, the characteristic inspection steps 27, 27a, 27
b, the process management information 212, 212a, 212b
At the same time, the inspection result information 21 indicates the characteristic inspection value of each work, the average value and distribution of the characteristic inspection values, the quality judgment and the non-defective rate.
Servers 21 and 21 in the factory as 1, 211a and 211b
Collected in 1a and 21b. In addition, the finished product process 28,
Also in 28a and 28b, the process management data is transmitted to the in-plant servers 21, 21a and 21b, and the process management information 21
2, 212a and 212b are collected.

After that, the second factory 2, another second factory 2a,
In-plant server 21 of each of the other second factories 2b,
Production management information 211, 21 collected in 21a, 21b
1a, 211b and production management information 212, 212a, 21
2b is sent from the transmission / reception servers 22, 22a, 22b to the transmission / reception server 12 of the first factory 1 via the Internet communication network 3 and is collected by the in-factory server 11.

The collected production management information 211, 211
a, 211b and production management information 212, 212a, 212
b is collected for each lot in units of about 1000 and is constantly collected in real time on the server 11 in the factory of the first factory 1. In shipping the semi-finished products at the first factory 1, the latest production management information 2 is sent to each of the second factory 2, another second factory 2a and still another second factory 2b.
Request the transmission of 11, 211a, 211b.

The in-plant server 11 includes the production management information 212, 21 of the second factory 2, the other second factory 2a and the other second factory 2b collected in the in-plant server 11, respectively.
2a, 212b, check how many lots of a specific model that is ready for shipment are in each process, and how many good products are produced, and then check the second factory 2 and the other second factory 2a. For each of the second factory 2b and the other second factory 2b, the in-process status of the process of the specific model, the yield, and the quantity of finished products are determined.

In the factory-specific wafer allocation step 18, based on this judgment, the first factory 1 to the first factory 1 are arranged so as to match the instructed production quantity (in the figure, referred to as “factory-specific production quantity instruction”). 2 factories 2, another 2nd factory 2a and another 2nd factory
The number of wafers shipped to each factory 2b is constantly adjusted.

For example, a trouble occurs in the device that is performing the latter half process in the second factory 2, and the yield decreases due to the trouble, and the work-in-process concentrates on a specific process.
If there is a possibility of delivery delay, production control information 212
If, at the same time, the other second factory 2a has no equipment trouble and the production management information 212a can determine that the yield and the product quantity have exceeded the planned values, the product is shipped to the second factory 2. The wafer distribution is adjusted such that the wafers scheduled to be shipped are shipped to another second factory 2a.

Since the wafer distribution is determined based on the production management information as described above, the adjustment processing of the wafer distribution can be executed quickly, and the production yield can be improved and the delivery time can be shortened. Further, only when there is a request from the first factory 1, the second factory 2, another second factory 2a and still another second factory 2b.
From data (production management information 211, 211a, 211
By transmitting b), the transmission of the data becomes irregular and the possibility that the data will be intercepted by a third party is reduced.

In the present specification, the epitaxial growth step is given as an example of the step of changing the process parameter based on the collected data, but the present invention is not limited to this and, for example, is related to diffusion in the channel forming step. Even when the process parameters are changed, the same effects as those described in the present specification can be obtained.

In this specification, the Internet communication network, which is a public line for computer communication, is used for data transmission, but the present invention is not limited to this, and a dedicated line (for example, LAN) is used. However, it is preferable to use this dedicated line in terms of maintaining confidentiality of data.

[0075]

The semiconductor product production system of the present invention comprises:
Produced through multiple assembly processes and characteristic inspection processes,
The semi-finished products obtained by performing at least a part of the plurality of assembly processes in the first factory are shipped to one or more second plants, and the remaining assembly processes and characteristic tests are performed in the second factory. And a communication line used for data transfer between the first factory and the second factory and the first factory and the second factory. And
The production control information and the inspection result information obtained by the characteristic inspection process performed in the second factory are transmitted to the first factory through a communication line, and the first control is performed based on the production control information and the inspection result information. According to the present invention, the production yield can be maintained or improved more reliably, because the production conditions of the assembly process performed in the factory are changed.

Further, the first factory and the second factory are connected to the communication line by the transmission / reception server computers provided in the first factory and the second factory, respectively, and these transmission / reception server computers send the transmission request. It may be set so as to send and receive only predetermined process control data and inspection result data. In this case, the production control information and the inspection result information may be transferred in a safer environment.
We can provide quick feedback to the factory.

Further, the production management information may be transmitted from the second factory to the first factory when the first factory makes a transmission request, and in this case, it may be transmitted to a third party. The possibility of intercepting data can be reduced.

Further, the inspection result information includes data relating to the characteristics of the semiconductor product, and the change of the production condition is performed based on the inspection result information so that the characteristics of the semiconductor product have a predetermined value. It may be a modification of the parameters of the assembly process that affects the characteristics of the semiconductor product in the process, and in this case, the yield can be further improved.

Further, there are a plurality of the second factories, and as a change of the production condition, at least a part of the semi-finished products scheduled to be shipped to the second factories with a lower yield is the higher factor based on the production management information. The quantity of semi-finished products shipped from the first factory to the second factory may be changed so as to be shipped to two plants. In this case, the yield of the entire production system is improved. can do.

Further, the production control information is created in association with each assembling process carried out in the second factory, the model name of the semiconductor product, the symbol for identifying the semiconductor product, the quantity, the process name and the process completion date and time. May be included at least, and in this case, the production control can be performed more reliably.

Further, the semiconductor product may be a semiconductor element, and in this case, the yield can be more surely improved for a semiconductor product such as a semiconductor laser whose characteristic inspection can be performed only when the product is completed.

The assembling step that affects the characteristics of the semiconductor product may be a step of epitaxially growing a semiconductor crystal or a step of diffusing impurities into the semiconductor crystal. In this case, the yield is improved. be able to.

Further, the communication line may be an internet communication network, in which case the production conditions can be changed more quickly.

Further, the communication line may be a dedicated line, in which case the production control information and the inspection result information can be quickly fed back to the first factory in a safer environment.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a first embodiment of a semiconductor product production system of the present invention.

FIG. 2 is an explanatory diagram showing a second embodiment of a semiconductor product production system of the present invention.

FIG. 3 is an explanatory diagram showing a third embodiment of a semiconductor product production system of the present invention.

FIG. 4 is an explanatory diagram showing an example of a conventional semiconductor product production process.

[Explanation of symbols]

1st factory 2nd factory 3 Internet communication network 11,21 Factory server 12,22 Server for sending and receiving 13 Board acceptance inspection process 14 Epitaxial growth process 15 Channel formation process 16 electrode formation process 23 Wafer division (chip formation) process 24 Die bond process 25 Wire bond process 26 Sealing process 27 Characteristic inspection process 28 Finished product process

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masamichi Harada             22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka             Inside the company (72) Inventor Tomohiko Yoshida             22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka             Inside the company F term (reference) 3C100 AA03 AA29 AA32 BB03 BB04                       BB33 CC02 CC04 CC08 EE06

Claims (9)

[Claims] 1. A semi-finished product obtained by performing a plurality of assembling steps and a characteristic inspection step, and carrying out at least a part of the plurality of assembling steps in a first factory is one or a plurality of semi-finished products. A semiconductor product production system that is shipped to a second factory and is produced by performing the remaining assembly process and characteristic inspection process in the second factory. No. 1 Factory and No. 2
It is composed of a communication line used for data transfer between factories, and production management information and inspection result information obtained by the characteristic inspection process carried out in the second factory are transmitted to the first factory through the communication line. A production system for semiconductor products, which is transmitted, and the production conditions of the assembly process performed in the first factory are changed based on the production management information and the inspection result information. 2. The first factory and the second factory are connected to a communication line by a transmission / reception server computer provided in each of the first factory and the second factory, and these transmission / reception server computers send a transmission request. 2. The semiconductor product production system according to claim 1, wherein the production system is set so that only predetermined process control data and inspection result data are exchanged. 3. The semiconductor product production system according to claim 1, wherein the production management information is transmitted from the second factory to the first factory when a transmission request is issued from the first factory. 4. The inspection result information includes data relating to the characteristics of the semiconductor product, and a plurality of assembling steps are performed so that the change of the production condition causes the characteristics of the semiconductor product to have a predetermined value based on the inspection result information. 2. The production system for a semiconductor product according to claim 1, wherein the parameter of the assembly process that affects the characteristics of the semiconductor product among the processes is changed. 5. A plurality of the second factories are provided, and the change of the production condition is based on the production management information, and at least a part of the semi-finished products scheduled to be shipped to the second factories with lower yield is higher in yield. To be shipped to the second factory,
2. The semiconductor product production system according to claim 1, wherein the quantity of semi-finished products shipped from the first factory to the second factory is changed. 6. The production management information is created in association with each assembling process carried out at the second factory, the model name of the semiconductor product, the symbol for identifying the semiconductor product, the quantity, the process name, and the process completion date and time. The semiconductor product production system according to claim 1, 3 or 5, which includes at least. 7. The production system for a semiconductor product according to claim 1, 2, 3, 4, 5, or 6, wherein the semiconductor product is a semiconductor element. 8. The assembly process that affects the characteristics of the semiconductor product is a process of epitaxially growing a semiconductor crystal or a process of diffusing impurities into the semiconductor crystal. Alternatively, the production system of the semiconductor product described in 7. 9. The semiconductor product production system according to claim 1, wherein the communication line is an Internet communication network or a dedicated line.