JP2003099746A - Noncontact communication medium - Google Patents
Noncontact communication mediumInfo
- Publication number
- JP2003099746A JP2003099746A JP2001291669A JP2001291669A JP2003099746A JP 2003099746 A JP2003099746 A JP 2003099746A JP 2001291669 A JP2001291669 A JP 2001291669A JP 2001291669 A JP2001291669 A JP 2001291669A JP 2003099746 A JP2003099746 A JP 2003099746A
- Authority
- JP
- Japan
- Prior art keywords
- communication medium
- elastic body
- contact communication
- module
- medium according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 title claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 2
- 239000004745 nonwoven fabric Substances 0.000 claims description 2
- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 13
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 abstract description 7
- 239000003990 capacitor Substances 0.000 abstract description 4
- 239000004642 Polyimide Substances 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触でデータの
読み出しや書き込みを行う非接触通信媒体に関するもの
であり、より具体的には、送受信アンテナコイルとＩＣ
モジュールから構成されるＩＣタグやＩＣカードの曲げ
耐性の改善に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactless communication medium for reading and writing data in a contactless manner, and more specifically, to a transmitting / receiving antenna coil and an IC.
The present invention relates to improvement of bending resistance of IC tags and IC cards composed of modules.
【０００２】[0002]
【従来の技術】従来、この種の非接触通信媒体は、厚み
０.６８〜０.８４ｍｍ、外形８６×５４ｍｍのＰＶＣ
（ポリ塩化ビニル）やＰＥＴ（ポリエチレンテレフタレ
ート）等のプラスチック材料とホットメルト或いは熱硬
化型接着剤等を組み合わせたカード状基材や粘着剤を塗
布した合成紙等の紙基材の貼り合わせによりＩＣモジュ
ールを内包することにより構成され、ある程度の強度と
曲げ耐性を有する媒体として使用されてきていた。2. Description of the Related Art Conventionally, a non-contact communication medium of this type is a PVC having a thickness of 0.68 to 0.84 mm and an outer diameter of 86 × 54 mm.
An IC is formed by laminating a card-like base material that combines a plastic material such as (polyvinyl chloride) or PET (polyethylene terephthalate) with a hot melt or thermosetting adhesive, or a paper base material such as a synthetic paper coated with an adhesive. It is constructed by enclosing a module and has been used as a medium having some strength and bending resistance.
【０００３】今日、非接触通信媒体の用途多様化に伴
い、商品タグとしての市場の要望が増加し、ＩＣモジュ
ール自体の形状の多様化や最終形状の小型化、更には使
用条件に合わせての曲げ耐性の向上等、顧客要求も多様
になってきている。しかしながら、上記の従来技術で
は、必ずしもこれら新しい要求に対し、応じきれていな
いのが実状である。Nowadays, as the applications of contactless communication media are diversified, the market demand as a product tag is increased, the shape of the IC module itself is diversified, the final shape is miniaturized, and moreover, according to the usage conditions. Customer requirements are becoming more diverse, such as improved bending resistance. However, the above-mentioned conventional technology does not always meet these new requirements.
【０００４】特に、厚みが１ｍｍ以上のＩＣモジュール
は、成形後の媒体が曲面に貼り付けて使用されるような
用途が増えており、このような場合に関しては、上記従
来のような硬質の材料による構成では剛性が強すぎるた
め、無理に貼り付けようとすれば破断に至ってしまう。In particular, IC modules having a thickness of 1 mm or more are increasingly used in which a molded medium is attached to a curved surface for use. In such a case, a hard material such as the conventional one is used. Since the structure described in (1) has too high rigidity, if it is forcibly attached, it will break.
【０００５】又、これを克服するために紙基材を用いた
場合には、ＩＣチップやチップコンデンサー等、チップ
形状の複数の表面実装部品で構成されるＩＣモジュール
の形状を平滑成形することが極めて困難である上、曲げ
のくり返しによって容易に破断してしまう。更に小型化
を求められた場合には、周囲の少なくとも２ｍｍ以上の
接着面が必要となる等、数々の問題が有り、上記従来の
構成では、所望の形状に貼り付けることが極めて困難で
あった。When a paper base material is used to overcome this problem, the shape of an IC module composed of a plurality of chip-shaped surface-mounted components such as an IC chip and a chip capacitor can be smoothly molded. It is extremely difficult and is easily broken by repeated bending. When further miniaturization is required, there are various problems such as the need for an adhesive surface of at least 2 mm or more around, and it has been extremely difficult to attach the desired shape with the above conventional configuration. .
【０００６】[0006]
【発明が解決しようとする課題】従って、本発明は、上
述した従来の技術の問題点を克服し、小型で、曲げ耐性
の優れた非接触通信媒体を提供することにある。SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide a non-contact communication medium which is small in size and excellent in bending resistance, overcoming the above-mentioned problems of the prior art.
【０００７】[0007]
【課題を解決するための手段】本発明の非接触通信媒体
は、ＩＣモジュールの周囲をショア硬さ８０以下の弾性
体により包囲することにより、曲げ応力に対し内面と外
面の曲率差を弾性体に吸収させるようにして柔軟な曲げ
耐性を持たせようとするものである。According to the non-contact communication medium of the present invention, by surrounding the IC module with an elastic body having a Shore hardness of 80 or less, the elastic body is provided with a curvature difference between the inner surface and the outer surface against bending stress. It is intended to have a flexible bending resistance by being absorbed by.
【０００８】即ち、本発明は、送受信アンテナコイル
と、ＩＣチップからなるＩＣモジュールとを具備する非
接触通信媒体において、前記ＩＣモジュールを封止成形
する基材の少なくとも一部に、ショア硬さ８０以下の弾
性体を具備したことを特徴とする非接触通信媒体であ
る。That is, according to the present invention, in a non-contact communication medium including a transmitting / receiving antenna coil and an IC module composed of an IC chip, at least a part of a base material for encapsulating and molding the IC module has a Shore hardness of 80. A non-contact communication medium including the following elastic body.
【０００９】又、本発明は、上記の非接触通信媒体にお
いて、前記弾性体によって前記ＩＣモジュールの周囲を
包囲したことを特徴とする非接触通信媒体である。Further, the present invention is the non-contact communication medium as described above, wherein the elastic body surrounds the periphery of the IC module.
【００１０】そして又、本発明は、上記の非接触通信媒
体において、前記弾性体を少なくとも前記ＩＣモジュー
ルの長辺の側面に配置したことを特徴とする非接触通信
媒体である。Further, the present invention is the non-contact communication medium as described above, wherein the elastic body is arranged at least on a side surface of a long side of the IC module.
【００１１】更に又、本発明は、上記の非接触通信媒体
において、前記弾性体が合成ゴムであることを特徴とす
る非接触通信媒体である。Furthermore, the present invention is the above non-contact communication medium, wherein the elastic body is synthetic rubber.
【００１２】更に又、本発明は、上記の非接触通信媒体
において、前記弾性体が織布であることを特徴とする非
接触通信媒体である。Furthermore, the present invention is the non-contact communication medium as described above, wherein the elastic body is a woven fabric.
【００１３】更に又、本発明は、上記の非接触通信媒体
において、前記弾性体が不織布であることを特徴とする
非接触通信媒体である。Furthermore, the present invention is the non-contact communication medium as described above, wherein the elastic body is a non-woven fabric.
【００１４】更に又、本発明は、上記の非接触通信媒体
において、前記弾性体がフェルトであることを特徴とす
る非接触通信媒体である。Furthermore, the present invention is the non-contact communication medium as described above, wherein the elastic body is a felt.
【００１５】[0015]
【発明の実施の形態】以下に図面を参照しながら、本発
明の実施の形態について詳述する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.
【００１６】図１により、柔軟な曲げ耐性を有する非接
触通信媒体として、ＩＣタグに本発明を適用した場合の
実施の形態を説明する。An embodiment in which the present invention is applied to an IC tag as a non-contact communication medium having flexible bending resistance will be described with reference to FIG.
【００１７】まず、図１（ａ）に示すように、ポリイミ
ド基板１の上にエポキシ樹脂等の封止樹脂３により封止
されたＩＣベアチップ２とチップコンデンサ４が搭載さ
れてＩＣモジュール部を形成し、同時に送受信用アンテ
ナコイル５が用意されて機能部が構成される。First, as shown in FIG. 1A, an IC bare chip 2 and a chip capacitor 4 sealed with a sealing resin 3 such as an epoxy resin are mounted on a polyimide substrate 1 to form an IC module section. At the same time, the transmitting / receiving antenna coil 5 is prepared to configure a functional unit.
【００１８】次に、図１（ｂ）、図１（ｃ）に示すよう
に、ＰＥＴ−Ｇフィルム６上に上記の機能部を載置、固
定し、１次成形体Ｍを完成させる。この１次成形体Ｍの
寸法は、厚さ１ｍｍ、長さ５０ｍｍ、幅１０ｍｍであ
る。ここで、上記の機能部は、薄いＰＥＴ−Ｇフィルム
で挟み込んでも、又、ＰＥＴ−Ｇフィルムに機能部と略
等しいサイズの凹溝を形成し、その中に上記の機能部を
埋設して１次成形体としても良い。尚、ＩＣベアチップ
２側のアンテナ端子とアンテナコイル５の接続端子とは
ここで接合される。Next, as shown in FIGS. 1 (b) and 1 (c), the above-mentioned functional portion is placed and fixed on the PET-G film 6 to complete the primary molded body M. The dimensions of the primary molded body M are 1 mm in thickness, 50 mm in length, and 10 mm in width. Here, even if the functional part is sandwiched by a thin PET-G film, a concave groove having substantially the same size as the functional part is formed in the PET-G film, and the functional part is embedded in the groove. It may be a next molded body. The antenna terminal on the IC bare chip 2 side and the connection terminal of the antenna coil 5 are joined here.
【００１９】さらに、図１（ｄ）に示すように、図１
（ｂ）、図１（ｃ）の１次成形体Ｍと略等しいサイズの
穴が穿たれたショア硬さ８０以下のフェルト等の弾性体
７を用意し、この弾性体７の穴に、１次成形体Ｍを嵌め
込んで１次成形体Ｍの周囲を弾性体７で取り囲むように
した後、表裏両面からホットメルト付きの０.２５ｍｍ
厚のＰＥＴ−Ｇフィルム８，８ａを熱圧着して積層す
る。Further, as shown in FIG.
(B), an elastic body 7 such as a felt having a Shore hardness of 80 or less in which a hole having a size substantially equal to that of the primary molded body M of FIG. After the secondary molded body M was fitted and the periphery of the primary molded body M was surrounded by the elastic body 7, 0.25 mm with hot melt from both front and back surfaces.
The thick PET-G films 8 and 8a are thermocompression-bonded and laminated.
【００２０】図１（ｄ）によって、図１（ｅ）、図１
（ｆ）に示すような２次成形体、即ち、柔軟な曲げ耐性
を有する非接触ＩＣタグＴの完成体が得られる。その寸
法は、厚さ２ｍｍ、長さ６０ｍｍ、幅１２ｍｍである。According to FIG. 1D, FIG. 1E and FIG.
A secondary molded body as shown in (f), that is, a completed non-contact IC tag T having flexible bending resistance is obtained. Its dimensions are a thickness of 2 mm, a length of 60 mm and a width of 12 mm.
【００２１】上記によって得られた、本発明による非接
触ＩＣタグＴに関し、繰り返し曲げ試験並びに捻り試験
を実施した結果、破断等の問題はなく、φ１００ｍｍの
円筒に巻き付けても全く問題がないことが確認された。The non-contact IC tag T according to the present invention obtained as described above was subjected to repeated bending tests and twisting tests, and as a result, there was no problem such as breakage, and there was no problem even if it was wound around a cylinder of φ100 mm. confirmed.
【００２２】[0022]
【発明の効果】以上説明したように、本発明によれば、
従来構造品における不都合、とりわけ曲げ耐性の問題を
著しく改善できる。又、要求寸法の小型化に関しても十
分満足できるレベルが確保される。尚、上記実施の形態
では弾性体としてフェルトを用いたＩＣタグに関する例
を示したが、ショア硬度８０以下の弾性体であれば如何
なる材料を使用しても良く、又、ＩＣタグに限らず薄板
形態で曲げ耐性を問題とする如何なる非接触通信媒体に
対しても本発明は適用可能であることは言うまでもな
い。As described above, according to the present invention,
Inconveniences in conventional structural products, especially the problem of bending resistance, can be significantly improved. In addition, a sufficiently satisfactory level can be ensured with respect to the required size reduction. In the above embodiment, an example of an IC tag using felt as an elastic body is shown, but any material may be used as long as it is an elastic body having a Shore hardness of 80 or less, and the thin plate is not limited to the IC tag. It goes without saying that the present invention is applicable to any non-contact communication medium in which bending resistance is a problem in form.
【図１】本発明を非接触ＩＣタグに適用した実施の形態
の説明図。FIG. 1 is an explanatory diagram of an embodiment in which the present invention is applied to a non-contact IC tag.
１ ポリイミド基板 ２ ＩＣベアチップ ３ 封止樹脂 ４ チップコンデンサ ５ （送受信用）アンテナコイル ６ ＰＥＴ−Ｇフィルム ７ 弾性体 ８，８ａ ＰＥＴ−Ｇフィルム Ｍ １次成形体 Ｔ 非接触ＩＣタグ 1 Polyimide substrate 2 IC bare chip 3 Sealing resin 4 chip capacitors 5 (for transmitting and receiving) antenna coil 6 PET-G film 7 elastic body 8.8a PET-G film M primary compact T non-contact IC tag
Claims (7)
らなるＩＣモジュールとを具備する非接触通信媒体にお
いて、前記ＩＣモジュールを封止成形する基材の少なく
とも一部に、ショア硬さ８０以下の弾性体を具備したこ
とを特徴とする非接触通信媒体。1. A non-contact communication medium comprising a transmission / reception antenna coil and an IC module composed of an IC chip, wherein at least a part of a base material for sealingly molding the IC module has an elastic body having a Shore hardness of 80 or less. A non-contact communication medium comprising:
て、前記弾性体によって前記ＩＣモジュールの周囲を包
囲したことを特徴とする非接触通信媒体。2. The non-contact communication medium according to claim 1, wherein the elastic body surrounds the periphery of the IC module.
おいて、前記弾性体を少なくとも前記ＩＣモジュールの
長辺の側面に配置したことを特徴とする非接触通信媒
体。3. The non-contact communication medium according to claim 1, wherein the elastic body is arranged at least on a side surface of a long side of the IC module.
通信媒体において、前記弾性体が合成ゴムであることを
特徴とする非接触通信媒体。4. The non-contact communication medium according to claim 1, wherein the elastic body is synthetic rubber.
通信媒体において、前記弾性体が織布であることを特徴
とする非接触通信媒体。5. The non-contact communication medium according to claim 1, wherein the elastic body is a woven cloth.
通信媒体において、前記弾性体が不織布であることを特
徴とする非接触通信媒体。6. The non-contact communication medium according to claim 1, wherein the elastic body is a non-woven fabric.
通信媒体において、前記弾性体がフェルトであることを
特徴とする非接触通信媒体。7. The non-contact communication medium according to claim 1, wherein the elastic body is a felt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001291669A JP2003099746A (en) | 2001-09-25 | 2001-09-25 | Noncontact communication medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001291669A JP2003099746A (en) | 2001-09-25 | 2001-09-25 | Noncontact communication medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003099746A true JP2003099746A (en) | 2003-04-04 |
Family
ID=19113771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001291669A Pending JP2003099746A (en) | 2001-09-25 | 2001-09-25 | Noncontact communication medium |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003099746A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007110254A1 (en) * | 2006-03-29 | 2007-10-04 | International Business Machines Corporation | Rfid tag application method and adapted tag |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999017252A1 (en) * | 1997-09-26 | 1999-04-08 | Gemplus S.C.A. | Electronic device with disposable chip and method for making same |
| JP2000036024A (en) * | 1998-07-17 | 2000-02-02 | Mitsubishi Plastics Ind Ltd | Laminated sheet for non-contact type IC card |
-
2001
- 2001-09-25 JP JP2001291669A patent/JP2003099746A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999017252A1 (en) * | 1997-09-26 | 1999-04-08 | Gemplus S.C.A. | Electronic device with disposable chip and method for making same |
| JP2000036024A (en) * | 1998-07-17 | 2000-02-02 | Mitsubishi Plastics Ind Ltd | Laminated sheet for non-contact type IC card |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007110254A1 (en) * | 2006-03-29 | 2007-10-04 | International Business Machines Corporation | Rfid tag application method and adapted tag |
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