JP2003168097A - Conductive connection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive connecting portion which can obtain good electrical conduction and good adhesion, for example, a conductive mounting portion between a substrate on which an IC chip is mounted and another electric circuit. The present invention provides a conductive connection portion in which an electrical connection is not interrupted even when an external force is concentrated on the conductive connection portion. The problem can be solved by a conductive connection part of an electric circuit formed on a base material, the conductive connection part having a shape such as a comb shape or a lattice shape in which a conductive part and a non-conductive part are mixed. .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive connecting portion, and more particularly to an RF-ID (Ra) such as a thin information transmission / reception recording medium such as a non-contact IC tag.
dioFrequency IDentificati
on) media, paper computers, disposable electrical appliances and other conductive connections.

[0002]

2. Description of the Related Art The inventor of the present invention has previously proposed a method in which conductive connecting portions are brought into contact with each other through an adhesive portion formed in a pattern to connect them (Japanese Patent Application No. 2001-260009). Next, the structure of the antenna circuit body is divided into an IC chip mounting interposer and an antenna holder by FIGS. 5 to 7, and the IC chip mounting interposer and the antenna holder are formed in advance, and the antenna circuit is formed by using these. A method of connecting the conductive connection portions when forming the body (electrical circuit) will be described.

FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connection portion 3 is continuous
(B). Thereafter, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C), and at least the IC
An adhesive agent is applied in a pattern on the conductive connection section 3 (scheduled joining site) on which the chip 5 is mounted to form the adhesive section 6 (d).

FIG. 6 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. Conductive connection portion 9 located at the end of the terminal and serving as a terminal portion
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. 1
Reference numeral 1 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are overlapped with each other so that the conductive connecting portions 3 and 9 face each other via the adhesive portion 6 having the pattern formed, and the conductive connecting portions 3 and 9 are formed in the pattern. The RF-ID medium C shown in FIG. 7 can be obtained by bonding the IC chip mounting interposer A and the antenna holder B by bonding them through the adhesive portion 6 and achieving electrical conduction.

[0006]

However, according to this method, it is necessary to devise the pattern of the adhesive to be applied and to accurately control the coating amount of the adhesive to be applied. If the appropriate coating amount of the adhesive or the adhesive is not adopted, adhesion between the conductive connecting portions is good, but conduction between the conductive connecting portions is insufficient, or conversely, conduction between the conductive connecting portions is good, but conductive There is a problem that adhesion between the connecting portions is insufficient, and it is difficult to obtain satisfactory results for both. The object of the present invention is to solve the conventional problems, devise the pattern of the adhesive to be applied, or to control the coating amount of the adhesive to be applied with good accuracy and to achieve good adhesion between the conductive connecting portions and The purpose of the present invention is to provide a conductive connection portion that can obtain continuity.

[0007]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventor has found that by using a conductive connecting part having a specific shape as the conductive connecting part, The inventors have found that good adhesion and conduction can be obtained, and completed the present invention.

That is, the conductive connecting portion according to claim 1 of the present invention is a conductive connecting portion of an electric circuit formed on a base material, and has a shape in which a conductive portion and a non-conductive portion are mixed. Is characterized by.

According to a second aspect of the present invention, in the electrically conductive connection portion according to the first aspect, the shape is selected from a comb type and a lattice type.

In the present invention, a conductive connecting portion having a concavo-convex shape such as a comb shape or a lattice shape, in which a conductive portion and a non-conductive portion are mixed, is used. For example, the conductive connection portions of the IC chip mounting interposer A and the antenna holder B are each made into a conductive connection portion having an uneven shape such as a comb shape or a lattice shape, and both conductive connection portions face each other with an adhesive. When they are overlapped with each other and pressed and heated, the adhesive agent which has been present in the convex portion flows and moves to the concave portion. As a result, the convex portions are in direct contact with each other without an adhesive and good electrical continuity is obtained, and a large amount of the adhesive including the migrated adhesive is present in the concave portion, which is good. Good adhesion is obtained.

[0011]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1 to 3, the antenna circuit body (electric circuit) is divided into an IC chip mounting interposer and an antenna holder, and the IC chip mounting interposer and the antenna holder are formed in advance. A method of connecting the conductive connection portions when forming a circuit body (electric circuit) will be described.

FIG. 1 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connecting portions 3A having a comb shape are continuous (B). After this, I
The IC chip 5 is arranged so as to straddle the conductive portion 2 for mounting the C chip.
Is mounted to form an IC chip mounting interposer A (C), and an adhesive is applied on at least the conductive connection portion 3A (scheduled joining site) on which the IC chip 5 is mounted to form an adhesive portion 6A. (D). The conductive connection portion 3A includes a plurality of conductive portions 12 and a plurality of non-conductive portions 13 between the conductive portions 12.
Are mixed. The conductive portion 12 is formed on the base material by a printing method using a conductive paste, or is formed by etching a metal foil to form a convex portion. On the other hand, the non-conductive portion 13 is a portion where the conductive portion 12 is not formed,
It is a recess.

FIG. 2 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. A conductive pattern 10 including a conductive connection portion 3A having a comb shape similar to that of the conductive connection portion 3A, which is a terminal portion and is located at an end portion of (2) (planned joining portion) (b),
As a result, the antenna holder B is formed. The conductive connection portion 9A is provided so that the comb shape is orthogonal to and corresponds to the conductive connection portion 3A of the IC chip mounting interposer A. Reference numeral 11 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are respectively connected to the conductive connection portions 3A and 9A.
A is superposed so as to face each other via the adhesive portion 6A, the conductive connecting portions 3A and 9A are adhered via the adhesive portion 6A, and electrical conduction is achieved, and the IC chip mounting interposer A and the antenna holder B are attached. By joining and, the RF-ID medium C shown in FIG. 3 is obtained. That is,
When the conductive connection portions 3A and 9A of the IC chip mounting interposer A and the antenna holder B are overlapped so as to face each other via the adhesive portion 6A, and pressed and heated, the conductive portion 12 (projection portion) is interposed. The adhesive that has flowed flows to the non-conductive portion 13 (recess). As a result, a large number of contacts directly contact the conductive portions 12 (convex portions) without interposing an adhesive to obtain good electrical conduction, and a large number of non-conductive portions 13 (concave portions) have been transferred. Since a large amount of adhesive including the adhesive comes to intervene, good adhesion can be obtained.

In the above embodiment, the conductive connecting portion 3
Although the examples of the conductive connection portion of the present invention having a comb shape are shown for both A and 9A, the conductive connection portion of the present invention may have a lattice shape, a net shape, or the like, and both may have the same shape. It may be a conductive connection portion of the present invention having a different shape, at least one may be a conductive connection portion having a shape in which the conductive portion and the non-conductive portion of the present invention are mixed, the other is the conductive portion of the present invention. It does not matter if it is a conductive connecting portion having a conventional shape instead of the connecting portion.

A length of 20 mm × 5 formed on a paper substrate,
The line width of the conductive part 12 with a line distance of 0.6 mm is 0.05 mm.
-0.30 mm was changed and bonded to copper foil (before etching) with an adhesive (chemitite TNP0300, Toshiba Chemical Co., thickness 20 μm) (0.4 MP
a, 150 ° C., 10 minutes), and a direct current electric resistance was measured by applying a tester to the wire pattern and the copper foil. Table 1 shows the relationship between the line width and the DC electric resistance.

[0017]

[Table 1]

From Table 1, the line width of the conductive portion 12 is 0.05 mm.
If it is above, it can be seen that the direct current electric resistance is low and it is practical.

Therefore, the line width of the conductive portion 12 is fixed to 0.1 mm, and the line width of the conductive portion 12 laid out in a length of 20 mm × line width of 10 mm is 0.00 (line width) (width of the non-conductive portion 13).
What changed from 5 mm to 0.60 mm was pasted with a copper foil (before etching) and an adhesive (Chemite TNP0300, manufactured by Toshiba Chemical Co., thickness 20 μm) (0.4
Adhesive strength was measured by MPa, 200 ° C., 10 seconds) and T peel (peel condition width 10 mm, speed 300 mm).
/ Min). Table 2 shows the relationship between the distance between the lines and the adhesive strength.

[0020]

[Table 2]

From Table 2, it can be seen that when the distance between the lines is 0.05 mm or more, the adhesive strength is large and the practicality is obtained.

FIGS. 4 (a) to 4 (b) are explanatory views schematically showing conductive connecting portions having other shapes according to the present invention. Figure 4 (a)
Indicates a conductive connecting portion having a lattice type shape. The conductive connection portion 14 has a shape in which a plurality of conductive portions 15 and a plurality of non-conductive portions 16 are mixed between the conductive portions 15. Figure 4
(B) shows a conductive connection portion having another lattice type shape. The conductive connection part 17 includes a plurality of conductive parts 15 and a conductive part 1.
5 has a shape in which a plurality of non-conductive portions 16 are mixed.

The method of conducting the conductive connection between the IC chip mounting interposer and the opposite conductive connecting portion of the conductive connecting portion of the antenna holder is not particularly limited. For example, after the conductive connecting portions are aligned with each other, thermocompression bonding or pressing is performed. It can be performed by a known method such as crimping with a wire, a method using light, an electromagnetic wave, an electron beam or the like, a method combining these methods, a method of sandwiching with an ultrasonic welding tool and conducting conductive connection with ultrasonic waves, etc. .

In this embodiment, an example is shown in which the adhesive portion 6A formed in a pattern is formed on the conductive connection portion 3A of the IC chip mounting interposer A. However, the adhesive portion layer 6A is provided at a corresponding portion on the antenna holder B side. It may be formed on (the part to be joined), or IC chip mounting interposer A
It may be formed on both the side and the antenna holder B side.

The adhesive portion 6A may be formed on the entire surface on the IC chip mounting interposer A side, or may be formed on the entire surface on the antenna holder B side. Also, the adhesive portion 6
A may be formed in a pattern shape such as a line, a dot, a lattice shape, or a comb shape.

The material of the base material 1 or base material 7 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of inorganic or organic fibers such as glass fiber, alumina fiber, polyester fiber and polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna holder may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be carried out by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, but may be formed on the back side as well as on the inner layer as long as the connection which finally functions as an antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The adhesive used in the present invention is not particularly limited as long as it can firmly and conductively bond the IC chip mounting interposer and the antenna holder to each other. Specifically, for example, a hot melt adhesive, Adhesives, thermoplastic resin adhesives or thermosetting resin adhesives, adhesives that are cured by ultraviolet rays, electron beams, etc., natural rubber adhesives, synthetic rubber adhesives, etc., or adhesives composed of combinations thereof, etc. Can be mentioned. Further, a conductive adhesive in which silver, aluminum or the like is mixed with these adhesives to impart conductivity can also be used. As adhesives, tackifiers (rosin and rosin derivatives, polyterbene resins, terpene phenol resins, petroleum resins) on natural and synthetic rubbers, softeners (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylates), aging Rubber based on known additives such as inhibitors, acrylic based on copolymerization of multiple acrylic acid esters having different glass transition temperatures and other functional monomers, silicone based on silicone rubber and resin, poly Ethers and polyurethane adhesives can be preferably used. These adhesives and pressure-sensitive adhesives are, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot-melt type that is solidified by cooling after heating and melting application, after applying a liquid oligomer or monomer, etc. Some of them can be cured by irradiation with radiation such as rays, but any of them can be used.

The adhesive used in the present invention may optionally contain
Insulating powders such as silica, alumina, glass, talc and various rubbers, or known additives such as release agents, surface treatment agents, fillers, pigments and dyes can be added.

The conductive connecting portion between the IC chip mounting interposer and the antenna holder may be formed by an arbitrary method that is easy to design and manufacture, and has a processing tolerance that does not require the precision of the conductive portion for mounting the IC chip. High structure is enough.

In the above embodiment, the RF-type used in a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the connection between the conductive connection portions of the ID medium has been described, the present invention can be applied to the connection between other conductive connection portions, and specifically, for example, between the conductive connection portions such as a paper computer and a disposable electric product. It can also be applied to a connection or the like to be adhered via an adhesive portion and to achieve electrical conduction.

The above description of the embodiments is for explaining the present invention, and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0036]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) An antenna portion was printed on a release paper (SP-8K AO, manufactured by Lintec Co., Ltd.) using a conductive ink (LS415C-K, manufactured by Asahi Chemical Laboratory), and 150
After heating at ℃ for 30 minutes, tack paper (copy tack, manufactured by Toppan Forms Co., Ltd.) is attached using a rubber roller (2 kg / cm ² , 40 ° C.), the antenna part is transferred to the tack paper side, and the paper substrate is used. An antenna was prepared on the above, and an antenna holder shown in FIG. 2 was prepared. The shape of the conductive connection portion was a comb shape with a line distance of 0.3 mm and a line width of 0.3 mm. On the other hand, the IC is mounted on the conductive portion (land portion) for mounting the IC chip printed on NIP (non-impact printer) compatible paper (230 ° C., 0.4 MPa, 2 seconds), and the adhesive is applied to the conductive connecting portion. The IC chip mounting interposer shown in FIG. 1 was manufactured. The antenna holder and the IC chip mounting interposer thus manufactured are overlapped with each other so that the conductive connecting portions face each other via the adhesive portion, and are bonded and electrically connected to each other, and the IC chip mounting interposer and the antenna are mounted. The RF-ID medium C shown in FIG. 3 was produced by joining it with a holder.
85 ℃, 85% RH with this attached to NIP
Although it was left in the environment of No. 2, the communication condition did not change and the good condition was maintained. Further, even when the RF-ID medium C shown in FIG. 3 was manufactured by using the IC chip mounting interposer shown in FIG. 1 manufactured by the copper foil etching method, the same good condition was maintained.

(Example 2) An electrically conductive ink (N-5845-1, manufactured by Shoei Chemical Industry Co., Ltd.) was used to print an antenna portion on a peeled polyamide film, and after heating at 180 ° C for 30 minutes, both sides were printed. Tape (No.500, manufactured by Nitto Denko Corporation)
Using a rubber roller for bonding (2 kg / cm ² , 4
(0 ° C.), the antenna part was transferred to the double-sided tape side to produce an antenna on a paper base material, and the antenna holder shown in FIG. 2 was produced. The shape of the conductive connection portion is 0.3 mm between lines and has a line width of 0.
It had a comb shape of 3 mm. On the other hand, NIP
(Non-impact printer) Mount the IC on the conductive part (land part) for mounting the IC chip printed on compatible paper (230
(° C., 0.4 MPa, 2 seconds), an adhesive was applied to the conductive connection portion to produce the IC chip mounting interposer shown in FIG. The antenna holder and the IC chip mounting interposer thus manufactured are overlapped with each other so that the conductive connecting portions face each other via the adhesive portion, and are bonded and electrically connected to each other, and the IC chip mounting interposer and the antenna are mounted. By connecting with the holder, R shown in Fig. 3
F-ID media C was produced. This was left in an environment of 85 ° C. and 85% RH while being attached to NIP.
There was no change in communication status and good condition was maintained.

[0038]

The conductive connecting portion according to claim 1 of the present invention is
Since it is a conductive connection portion of an electric circuit formed on a base material and has a shape in which a conductive portion and a non-conductive portion are mixed, for example, the IC chip mounting interposer A and the antenna holder B are respectively provided. When the conductive connection parts having an uneven shape such as a comb shape or a grid shape are overlapped with each other via an adhesive and pressed or heated, the adhesive that has been present in the many convex parts flows out and many As a result, even if the pattern of the adhesive to be applied is not devised or the amount of adhesive to be applied is not accurately controlled, the protrusions do not intervene in the adhesive at many contact parts. Without direct contact, good electrical continuity can be obtained, and a large amount of adhesive, including adhesive that has migrated, will intervene in many recesses, so good adhesion can be obtained and conductive connection can be obtained. Electricity even if external force is concentrated A marked effect that the connection is not interrupted.

The conductive connecting portion according to claim 2 of the present invention is the same as the conductive connecting portion according to claim 1, since the shape of the conductive connecting portion according to claim 1 is selected from comb type and lattice type. In addition to the same effect, the structure is simple and easy to manufacture at low cost, and better electrical continuity is obtained, and further better adhesion is obtained.

[Brief description of drawings]

1A to 1D are explanatory views showing a process of forming an IC chip mounting interposer having a conductive connecting portion of the present invention.

2A to 2B are explanatory views showing a process of forming an antenna holder provided with a conductive connecting portion of the present invention.

FIG. 3 is an explanatory diagram showing an RF-ID medium.

FIG. 4 is an explanatory view showing the shape of another conductive connection portion of the present invention.

5 (a) to (d) are I equipped with a conventional conductive connecting portion.
It is explanatory drawing which shows the formation process of a C-chip mounting interposer.

6A to 6B are explanatory views showing a process of forming an antenna holder having a conventional conductive connecting portion.

FIG. 7 is an explanatory diagram showing a conventional RF-ID medium.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3, 3A conductive connection 4 Conductive pattern 5 IC chip 6,6A Adhesive part 7 Base material 8 Antenna conductive part 9, 9A conductive connection 10 Conductive pattern 11 Insulation part 12, 15 Conductive part 13, 16 Non-conductive part A IC chip mounting interposer B Antenna holder C RF-ID media

Claims (2)

[Claims] 1. A conductive connecting portion of an electric circuit formed on a base material, which has a shape in which a conductive portion and a non-conductive portion are mixed. 2. The conductive connecting portion according to claim 1, wherein the shape is selected from a comb type and a lattice type.