JP2003116144A - Solid-state image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image pickup device for constructing a camera at a low cost and simplifying the design of the camera. SOLUTION: A plurality of light receiving elements PD having a color separation filter in the same color are arranged two-dimensionally adjacent to each other for an image pickup section of a solid-state image pickup device 10, a plurality of apertures AP for limiting light made incident to the corresponding light receiving elements PD are formed on light receiving faces of a plurality of the light receiving elements PD, and a vertical transfer electrode VEL for extracting the signal from the light receiving elements is placed by circumventing a plurality of the apertures AP. Further, the light receiving elements PD are placed so that the distance among the adjacent light receiving elements PD is nearly the same.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device, and more particularly to an interline transfer type solid-state image pickup device for picking up an image of a subject.

[0002]

2. Description of the Related Art In recent years, CCDs (Charge
2. Description of the Related Art Digital cameras such as digital still cameras and digital video cameras, which capture an image of a subject using a solid-state imaging device including a solid-state imaging device such as a Coupled Device, are in widespread use.

By the way, in this type of digital camera,
In order to generate a high-resolution image signal from an image signal obtained by a solid-state image sensor, there is one that uses a signal of a high frequency component of a luminance signal (hereinafter referred to as “YH signal”).

However, when sampling an image signal showing a subject image through the solid-state image pickup device, frequency interference called "folding" occurs in the achromatic color luminance component which is the main component of the YH signal, and this causes interference. In some cases, a false signal (a false signal that is not in the image on the space) is generated.
The generation of this false signal will be described below.

As an example, as shown in FIG. 7A, the light receiving elements PD formed of photodiodes are arranged in a square lattice at a predetermined array pitch (in the figure, horizontal array pitch = 2.P.
h, a vertical array pitch = 2 · Pv) and a solid-state image pickup element in which an image pickup section is configured to sample at a predetermined sampling frequency fs with respect to the frequency component of the subject image, as an example, FIG. As shown in, the frequency components of the subject image occur as sidebands on the left and right of the sampling frequency fs. Note that the frequency component of the subject image indicates the fineness of the subject image.For example, when a wall or sky having a single color is photographed, the frequency becomes low and a change in color such as a striped pattern occurs. The frequency becomes higher when shooting intense objects.

On the other hand, the sampling frequency fs corresponds to the reciprocal of the arrangement pitch between the light receiving elements PD. Therefore, the larger the array pitch, the smaller the sampling frequency fs, and the frequency component of the subject image and the sampling frequency fs.
There is a high possibility that the sideband of s will overlap. Then, frequency interference (folding) occurs due to the frequency components and the sidebands overlapping. Since the frequency band in which this frequency interference has occurred (the shaded area of the grid in FIG. 7B) is a non-reproduction band in which an image cannot be reproduced, a false signal is generated due to the occurrence of frequency interference.

In order to suppress the generation of this spurious signal, conventionally, an optical low pass filter (Low Pass Filter) formed of a birefringent plate at the tip of a lens of a digital camera is conventionally used.
r) was worn.

That is, when there is a frequency component of the subject image as shown in FIG. 7B as an example, an optical low-pass filter is attached to the tip of the lens of the camera to allow the quartz plate to pass therethrough, and the image separation results in the optical conversion. The spatial frequency component of the subject is attenuated at the image stage. This suppresses the generation of false signals.

Here, in order to suppress the generation of false signals, the thickness of the birefringent plate in the optical low-pass filter mounted on the camera must be increased as the arrangement pitch between the light receiving elements PD increases.

[0010]

However, in the technique using the above optical low-pass filter, the optical low-pass filter is expensive, so that the cost of the camera becomes high, and the birefringent plate forming the optical low-pass filter is used. The design of the camera becomes complicated due to the restriction on the spatial distance between the lens that forms the subject image and
There was a problem.

The present invention has been made in order to solve the above problems, and provides a solid-state image pickup device capable of constructing a camera to be applied at low cost and simplifying the design of the camera. The purpose is to do.

[0012]

In order to achieve the above object, the solid-state image pickup device according to claim 1 is provided with a plurality of light receiving elements which are two-dimensionally arranged adjacent to each other and have color separation filters of the same color. A plurality of openings formed respectively on the light-receiving surfaces of the plurality of light-receiving elements and for limiting light incident on the corresponding light-receiving elements, and arranged so as to bypass the plurality of openings, and the light-receiving elements And an electrode for taking out a signal from the.

According to another aspect of the solid-state imaging device of the present invention, a plurality of light receiving elements having color separation filters of the same color are two-dimensionally arranged adjacent to each other, and a plurality of openings for limiting light incident on the corresponding light receiving elements. Are formed on the light receiving surfaces of the plurality of light receiving elements, and electrodes for taking out signals from the light receiving elements are arranged so as to bypass the plurality of openings.
The light receiving element includes a photoelectric conversion element such as a photodiode or a phototransistor.

That is, the conventional solid-state image pickup device has one pixel per pixel.
While one light receiving element is assigned to each color, in the solid-state imaging device according to the present invention, a plurality of light receiving elements are assigned to one color per pixel and arranged two-dimensionally. Therefore, when the conventional solid-state imaging device and the solid-state imaging device according to the present invention are compared on the assumption that they have the same resolution,
The arrangement pitch between the light receiving elements is smaller in the present invention. As a result, the sampling frequency of the solid-state imaging device of the present invention can be made higher than that of the conventional solid-state imaging device, and the frequency interference described above can be suppressed. This
A more specific description will be given with reference to the drawings.

FIG. 1A shows an arrangement example of the light receiving elements of the solid-state imaging device according to the present invention when the resolution is the same as that of the conventional solid-state imaging device shown in FIG. 7A. . In addition, in the figure, four light receiving elements are assigned to one color of one pixel, and each of the light receiving elements has a horizontal arrangement pitch and a vertical arrangement pitch which are ½ of those shown in FIG. 7A.
The case where they are arranged in a square lattice so that

As described above, the sampling frequency of the solid-state image pickup device corresponds to the reciprocal of the array pitch between the light receiving elements. Therefore, the sampling frequency fs of the solid-state imaging device according to the present invention, in which the array pitch between the light receiving elements is shortened as compared with the conventional solid-state imaging device, shifts to the high frequency side as shown in FIG. 1B as an example. Will be done.

As a result, the area of the overlapping region of the frequency components of the subject image and the sidebands of the sampling frequency fs can be reduced or the region can be eliminated, and the occurrence of frequency interference can be reduced or avoided. You can Therefore, it is possible to reduce the thickness of the birefringent plate of the optical low-pass filter, which has been conventionally used to prevent the occurrence of folding back, or to eliminate the use of the optical low-pass filter.

As described above, according to the solid-state image pickup device of the first aspect, the plurality of light-receiving elements having the color separation filters of the same color are two-dimensionally arranged adjacent to each other, so that an optical low-pass filter is formed. Thin the birefringent plate,
The optical low-pass filter can be disused, the applicable camera can be configured at low cost, and
The design of the camera can be simplified.

The solid-state image pickup device of the present invention is defined in claim 2.
As in the invention described above, it is preferable that the plurality of light receiving elements are arranged such that the distances between adjacent light receiving elements are substantially uniform (including uniform). Hereinafter, this will be specifically described with reference to the drawings.

FIG. 2A shows an arrangement example of the light receiving elements in the conventional solid-state image pickup device in which one light receiving element is assigned for each color of one pixel, and FIG. 2B shows the arrangement pitch of the light receiving elements (claims). 2 corresponds to the “distance” of the invention described in 2) is non-uniform, an example of the arrangement of the light receiving elements of the solid-state imaging device according to the present invention is shown in FIG. An example of the arrangement of the light receiving elements of the solid-state imaging device according to the present invention in each case is shown.

In this case, the arrangement pitch Ps of the adjacent light receiving elements in FIG. 2B is different from one half of the arrangement pitch Pm of the adjacent light receiving elements in FIG. 2A, and FIG. The arrangement pitch Ps of the adjacent light receiving elements in) is ½ of the arrangement pitch Pm.

On the other hand, in FIG. 3, FIG. 2 (A) and FIG.
FIGS. 2B and 2C show an example of the output level with respect to the incident light when focusing on only the horizontal direction of the light receiving element array shown in FIG. In addition, here, light in which a black and white vertical striped image, which is a spatial frequency component having a frequency higher than the sampling frequency corresponding to the light receiving element array illustrated in FIG. 2A, is carried as a subject image is incident. The case is shown.

As shown in FIG. 3, the conventional light receiving element array (one light receiving element / one pixel one color) shown in FIG. 2 (A) cannot output a level corresponding to the incident light. (B)
The level corresponding to the incident light cannot be output even with the light receiving element array shown in (4 light receiving elements / one pixel, one color, array pitch uneven). On the other hand, in the light receiving element array (4 light receiving elements / 1 color of one pixel, array pitch uniform) shown in FIG. 2C, a level corresponding to the incident light can be output.

That is, by making the distance (arrangement pitch) between adjacent light receiving elements substantially uniform, the sampling frequency can be shifted to a higher frequency side as compared with the case where the light receiving elements are not substantially uniform, and frequency interference is caused. Can be further suppressed.

Further, the solid-state image pickup device of the present invention comprises:
As in the invention described above, it is preferable to provide a channel stopper between adjacent light receiving elements that receive light of different colors. As a result, when light of different colors (for example, three primary colors of red, green, and blue) is received by a plurality of light receiving elements, it is possible to prevent mutual influence between the colors of signals output from the respective light receiving elements. It is possible to perform high quality imaging.

Furthermore, the solid-state image pickup device of the present invention comprises:
According to the invention described in claim 5, the number of light receiving elements having the color separation filters of the same color is four, and the signals from all the light receiving elements are read out by four-field reading. It is possible to adopt a form in which the opening shape of the opening is a quadrangle or more polygon and the plurality of light receiving elements are two-dimensionally arranged so that adjacent light receiving elements are displaced in the vertical direction and the horizontal direction.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In addition, here
Honeycomb CCD proposed by the applicant of the present invention
One mode in which the present invention is applied to will be described. Therefore, first, a conventional honeycomb CCD will be described.

FIG. 4 shows an example of the structure of an image pickup section in a conventional honeycomb CCD. As shown in the figure, in this solid-state image pickup device, one color is assigned to each pixel, and adjacent light receiving elements PD are two-dimensionally arranged by being vertically and horizontally displaced. And the opening A formed on the front surface of the light receiving element PD.
A vertical transfer electrode VEL which is arranged so as to bypass P and which takes out a signal (charge) from the light receiving element PD and transfers it in the vertical direction, and a vertical transfer electrode V which is located at the bottom in the vertical direction.
A horizontal transfer electrode H, which is arranged on the lower side in the vertical direction of EL, and which transfers the signal transferred from the vertical transfer electrode VEL to the outside.
And EL. In the example shown in the figure, the opening AP is formed in an octagonal honeycomb shape.

Here, the vertical transfer drive signals V1, V2, ... Are respectively provided to the vertical transfer electrode groups constituted by a plurality of vertical transfer electrodes VEL arranged in a straight line in the horizontal direction.
., V8 can be applied simultaneously. In the example shown in the figure, the vertical transfer drive signal V3 is 2
The vertical transfer drive signal V4 is applied to the vertical transfer electrode group of the stage.
However, the vertical transfer drive signal V5 is vertical to the third vertical transfer electrode group, the vertical transfer drive signal V6 is vertical to the fourth vertical transfer electrode group, and the vertical transfer drive signal V6 is vertical to the fifth vertical transfer electrode group. The transfer drive signal V7, the vertical transfer drive signal V8 for the sixth stage vertical transfer electrode group, the vertical transfer drive signal V1 for the seventh stage vertical transfer electrode group, and the eighth stage vertical transfer electrode group. On the other hand, the vertical transfer drive signal V2 is configured to be applied respectively.

On the other hand, each light receiving element PD is configured to be electrically connected to one adjacent vertical transfer electrode VEL via a transfer gate TG. In the example shown in the figure, each light receiving element PD has a vertical transfer electrode VE adjacent to the lower right side.
It is configured to be connected to L via a transfer gate TG.

Further, in the image pickup portion of this solid-state image pickup device, as shown in the figure, the vertically adjacent region of one light receiving element region has a four-electrode structure, and the horizontal adjacent region has a two-electrode structure.

In the figure, the opening AP formed on the front surface of the light receiving element PD marked with "R" is covered with a color separation filter which transmits red light, and "G" is marked. The opening AP formed in the front surface of the light receiving element PD is covered with a color separation filter that transmits green light.
The opening AP formed in the front surface of the light receiving element PD in which "B" is written is covered with a color separation filter which transmits blue light. That is, the light receiving element PD in which "R" is written receives red light, the light receiving element PD in which "G" is written green light, and the light receiving element PD in which "B" is written receives blue light. It is supposed to be.

Here, the operation of extracting the signal from each light receiving element PD at the time of image pickup of this solid-state image pickup device will be described.

First, the light receiving element P via the transfer gate TG.
A predetermined high voltage is applied to the vertical transfer electrode group (vertical transfer electrode VEL indicated by hatching in the figure) including the vertical transfer electrode VEL connected to D and sandwiched between these vertical transfer electrode groups. A predetermined low voltage lower than the above high voltage is applied to the selected vertical transfer electrode group (outer vertical transfer electrodes VEL in the same figure). That is, the vertical transfer drive signal V2,
V4, V6, and V8 are set to the high voltage, and the vertical transfer drive signals V1, V3, V5, and V7 are set to the low voltage.
Then, a potential well is formed below the vertical transfer electrode VEL connected to the light receiving element PD via the transfer gate TG, and the charges accumulated in the light receiving element PD connected to the vertical transfer electrode VEL are suddenly formed there. Pour in.

Next, the voltage is lower than the above high voltage with respect to the vertical transfer electrode group adjacent to the vertical transfer electrode group vertically below the vertical transfer electrode group including the vertical transfer electrode VEL connected to the light receiving element PD via the transfer gate TG. And a medium voltage higher than the low voltage is applied. That is, the vertical transfer drive signals V1 and V
3, V5, and V7 are the above-mentioned intermediate voltages. Then, a potential well is also formed below the vertical transfer electrode VEL to which the medium voltage is applied, and charges are generated from the potential well below the vertical transfer electrode VEL connected to the light receiving element PD via the transfer gate TG. It flows in.

Next, the applied voltage to the vertical transfer electrode group including the vertical transfer electrode VEL connected to the light receiving element PD via the transfer gate TG is set to the low voltage. That is, the vertical transfer drive signals V2, V4, V6, and V8 are set to the low voltage. As a result, all the charges accumulated under the vertical transfer electrode VEL connected to the light receiving element PD via the transfer gate TG are under the vertical transfer electrode VEL adjacent to the vertical lower side of the vertical transfer electrode VEL. Move to the formed potential well.

After that, by repeating the above operation, the charges accumulated in each light receiving element PD are sequentially transferred to the vertical transfer electrodes VEL adjacent vertically downward in a so-called bucket relay method, whereby the horizontal transfer electrodes are transferred. It can be read in one field via HEL.

Next, an example of a mode in which the present invention is applied to the above honeycomb CCD will be described.

FIG. 5 shows a configuration example of the solid-state imaging device 10 according to the present embodiment of the present invention. As shown in the figure, this solid-state imaging device 10 is formed in front of a plurality of light receiving elements PD, which are two-dimensionally arranged by allocating a plurality (here four) for one color of one pixel. The vertical transfer electrode VEL is arranged so as to bypass the opening AP, and takes out a signal from the light receiving element PD and transfers it in the vertical direction, and is arranged vertically below the vertical transfer electrode VEL located at the bottom in the vertical direction. And the vertical transfer electrode VE
A vertical transfer drive signal V1 for reading the signal (charge) accumulated in each light receiving element PD by the image pickup unit including the horizontal transfer electrode HEL that transfers the signal transferred from L to the outside, The read control unit 12 is controlled by V2, ..., V8. In the example shown in the figure, the opening AP is formed in an octagonal honeycomb shape.

In the figure, the opening AP formed in the front surface of the light receiving element PD in which "R" such as "R1" and "R2" is written is covered with a color separation filter which transmits red light. The opening AP formed in the front surface of the light receiving element PD in which “G” such as “G3” or “G4” is written is covered with a color separation filter that transmits green light, and “B1”,
The opening AP formed in the front surface of the light receiving element PD in which “B” such as “B2” is written is covered with a color separation filter which transmits blue light. That is, the light receiving element PD in which "R" is written emits red light and the light receiving element P in which "G" is written.
D is for receiving green light, and the light receiving element PD with'B 'is for receiving blue light.

In the present embodiment, a plurality of light receiving elements PD assigned to each one pixel and one color are used as a light receiving element group, and each light receiving element group has the same array pitch (as in the conventional honeycomb CCD shown in FIG. 4). Horizontal arrangement pitch = Ph, vertical arrangement pitch = Pv), and adjacent light receiving element groups are two-dimensionally arranged with being shifted in the vertical direction and the horizontal direction. That is,
The plurality of light receiving elements PD included in each light receiving element group are apparently arranged as a plurality of divided light receiving elements PD in the conventional honeycomb CCD shown in FIG.

Here, in the solid-state image pickup device 10, the light receiving elements P are arranged so that the arrangement pitch between the respective light receiving elements PD is substantially uniform.
D is arranged. As a result, as described above, the sampling frequency can be increased as compared with the case where the arrangement pitch is not made substantially uniform, and as a result, frequency interference can be suppressed.

Further, the solid-state imaging device 1 according to the present embodiment
In the image pickup unit of 0, the vertical transfer electrodes VEL are arranged in a zigzag pattern in both the horizontal and vertical directions so as to bypass the light receiving element group.

Here, the vertical transfer drive signals V1, V2, V2, V2, V2,
, V8 can be applied at the same time. In addition, in the example shown in FIG.
A vertical transfer drive signal V8 is applied to the vertical transfer electrode group of the tier.
However, the vertical transfer drive signal V1 is vertical to the second vertical transfer electrode group, the vertical transfer drive signal V2 is vertical to the third vertical transfer electrode group, and the vertical transfer drive signal V2 is vertical to the fourth vertical transfer electrode group. A transfer drive signal V3, a vertical transfer drive signal V4 for the fifth stage vertical transfer electrode group, a vertical transfer drive signal V5 for the sixth stage vertical transfer electrode group, and a seventh stage vertical transfer electrode group. With respect to the vertical transfer drive signal V6, the vertical transfer drive signal V7 can be applied to the vertical transfer electrode group of the eighth stage, and the vertical transfer drive signal V8 can be applied to the vertical transfer electrode group of the ninth stage. Is configured.

On the other hand, each light receiving element PD is configured to be electrically connected to one adjacent vertical transfer electrode VEL via a transfer gate TG. In the example shown in the figure, each light receiving element PD is connected to one of the two vertical transfer electrodes VEL provided adjacent to the light receiving element PD by a transfer gate T.
It is configured to be connected via G. Also, 1
Only one light receiving element PD is connected to one vertical transfer electrode VEL via a transfer gate TG.

Further, this solid-state image pickup device 10 has one pixel 1
The vertically adjacent area of the area corresponding to the color (the area of one light receiving element group) has a four-electrode structure, and the horizontal adjacent area has a two-electrode structure.

The light receiving element PD of the solid-state imaging device 10 is the light receiving element of the present invention, the opening AP is the opening of the present invention, the vertical transfer electrode VEL is the electrode of the present invention, and the read control unit 12 is the reading of the present invention. Means correspond to each.

Next, as an operation of the solid-state image pickup device 10, an operation of extracting a signal from each light receiving element PD, which is executed by the readout control section 12 at the time of photographing, will be described.
Here, a case where the solid-state imaging device 10 is applied to a digital still camera and a still image is captured by the solid-state imaging device 10 will be described as an example.

First, a predetermined high voltage is applied to the corresponding vertical transfer electrodes VEL by the vertical transfer drive signals V1 and V5, and the vertical transfer electrodes VEL arranged vertically above and below these vertical transfer electrodes VEL are applied. On the other hand, a predetermined low voltage lower than the above high voltage is applied by the vertical transfer drive signals V8 and V2 and the vertical transfer drive signals V4 and V6. Then, a potential well is formed below the vertical transfer electrode VEL to which the high voltage is applied, and the light receiving element PD ('B1', 'R1', which is connected to the vertical transfer electrode VEL via the transfer gate TG is formed therein. The charges accumulated in each of the light receiving elements PD of “R5” and “B5” flow in at a stretch.

Next, the vertical transfer electrode VEL adjacent to the vertical transfer electrode VEL to which the high voltage is applied is vertically below.
To the vertical transfer electrode VEL adjacent to the vertical transfer electrode VEL adjacent to the vertical transfer electrode VEL in the vertical direction while applying a medium voltage lower than the high voltage and higher than the low voltage by the vertical transfer drive signals V2 and V6. Vertical transfer drive signal V
The above low voltage is applied by 3 and V7. Then, a potential well is also formed under the vertical transfer electrode VEL to which the intermediate voltage is applied, and electric charges flow into the potential well below the vertical transfer electrode VEL to which the high voltage is applied.

Next, the voltage applied by the vertical transfer drive signals V1 and V5 is set to the low voltage. As a result, all the charges stored under the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V1 and V5 are all stored in the vertical transfer electrodes VEL.
To the potential well formed below the vertical transfer electrode VEL adjacent to the lower side in the vertical direction.

Next, the voltages applied by the vertical transfer drive signals V3 and V7 are set to the above-mentioned medium voltage, and the applied voltages by the vertical transfer drive signals V4 and V8 are set to the low voltage.
Then, a potential well is formed below the vertical transfer electrode VEL corresponding to the vertical transfer drive signals V3 and V7,
Charges flow into the potential wells below the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V2 and V6.

Further, the voltage applied by the vertical transfer drive signals V2 and V6 is set to the above low voltage. As a result, all the charges accumulated under the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V2 and V6 are all stored in the vertical transfer electrodes VEL.
To the potential well formed below the vertical transfer electrode VEL adjacent to the lower side in the vertical direction.

After that, similarly, by applying the middle voltage and the low voltage to the vertical transfer electrodes VEL by the vertical transfer drive signal successively in the downward direction in the vertical direction, the charge (' B1 ',' R1 ',' R
The charges accumulated in the light receiving elements PD of 5'and'B5 'are transferred and read out via the horizontal transfer electrode HEL (first field).

Next, the light receiving elements PD ('B2', 'R2', 'R' connected to the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V2 and V6 through the transfer gate TG.
The charge stored in each of the light receiving elements 6'and 6'B6 'is read out by the bucket relay method by controlling the applied voltage to the vertical transfer electrode VEL as in the above (second field).

Next, the light is accumulated in the light receiving elements PD (the light receiving elements PD of'G3 'and'G7') connected to the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V3 and V7 via the transfer gate TG. The charges thus read are read out in the bucket relay method by controlling the applied voltage to the vertical transfer electrodes VEL as in the above (third field).

Finally, the light is accumulated in the light receiving elements PD (the respective light receiving elements PD of'G4 'and'G8') connected to the vertical transfer electrodes VEL corresponding to the vertical transfer drive signals V4 and V8 via the transfer gate TG. The charges thus read are read out in a bucket brigade method by controlling the applied voltage to the vertical transfer electrodes VEL as in the above (fourth field).

Thus, in the solid-state image pickup device 10,
The charges corresponding to all the pixels can be read out in four fields, and the pixel value for each color of each pixel can be obtained by adding the output levels indicated by the read charges for each color of the same pixel. .

When the solid-state image pickup device 10 is applied to a digital video camera and a moving image (movie image) is picked up by the solid-state image pickup device 10, as an example, light receiving elements corresponding to the vertical transfer drive signals V3 and V6. PD
The RGB signals may be obtained at the same time by reading the charges of (the light receiving elements PD of “G3”, “R6”, and “B6”).

As described in detail above, in the solid-state image pickup device 10 according to this embodiment, a plurality of (four in this embodiment) light receiving elements PD having color separation filters of the same color are adjacent to each other. Since the two-dimensional arrangement, it is possible to reduce the thickness of the birefringent plate that constitutes the optical low-pass filter, or to eliminate the use of the optical low-pass filter, it is possible to configure the camera to be applied at low cost, The design of the camera can be simplified.

Further, the solid-state image pickup device 1 according to the present embodiment
At 0, the array pitch (distance) between adjacent light receiving elements PD
Since the plurality of light receiving elements PD are arranged so as to be substantially uniform, the sampling frequency can be shifted to a higher frequency side as compared with the case where they are not substantially uniform, and frequency interference is further suppressed. be able to.

In the present embodiment, the solid-state image pickup device having no channel stopper has been described, but the present invention is not limited to this, and it goes without saying that a mode having a channel stopper may be adopted. Yes.

FIG. 6 shows an arrangement example of channel stoppers for the solid-state image pickup device 10 (see also FIG. 5) of the present invention in the present embodiment. In the example shown in the figure, adjacent light receiving elements PD (for example,
A channel stopper CS is driven between the light receiving element PD of'R2 'and the light receiving element PD of'B5' which are adjacent to each other. As a result, it is possible to prevent mutual influence of the signals output from the respective light receiving elements PD between the respective colors, and it is possible to perform high quality imaging.

In the present embodiment, a case has been described in which a plurality of light receiving elements PD forming one pixel and one color are arranged so as not to be mixed with light receiving elements PD forming other pixels. However, the present invention is not limited to this. However, the present invention is not limited to this, and a configuration in which a plurality of light receiving elements PD forming one pixel and one color are arranged in a mixed manner with light receiving elements PD forming other pixels, for example,
It is also possible to adopt a mode in which the light receiving elements PD constituting each pixel are arranged in the same color arrangement relationship as the conventional honeycomb CCD shown in FIG. Also in this case, the same effect as that of the present embodiment can be obtained. Even in this case, a channel between adjacent light receiving elements PD that receive light of different colors
Driving the stopper is advantageous in terms of image quality.

In the present embodiment, the case where the present invention is applied to the honeycomb CCD by the present applicant has been described. However, the present invention is not limited to this, and, for example, a CCD in which light receiving elements are arranged in a square shape. Can also be applied to. Also in this case, the same effect as that of the present embodiment can be obtained.

In the present embodiment, each light receiving element PD
The case where the operation of extracting the signal from is performed by controlling the application of the three-level voltage of the low voltage, the medium voltage, and the high voltage has been described, but the present invention is not limited to this, and for example, Needless to say, it is also possible to adopt a mode in which the application of two levels of voltage, a low voltage and a high voltage, is controlled. Also in this case, the same effect as that of the present embodiment can be obtained.

Furthermore, it goes without saying that the shape and arrangement of the electrodes shown in the present embodiment are also examples, and other shapes and arrangements can be adopted.

[0068]

According to the solid-state image pickup device of the present invention, a plurality of light receiving elements having color separation filters of the same color are two-dimensionally arranged adjacent to each other. It is possible to reduce the thickness and eliminate the use of the optical low-pass filter, and it is possible to configure an applicable camera at low cost and simplify the design of the camera. .

[Brief description of drawings]

FIG. 1A is a schematic plan view showing an arrangement example of a light receiving element of the present invention, and FIG. 1B is a graph used for explaining the effect of the present invention.

FIG. 2 is a diagram for explaining the effect of the present invention, (A)
[Fig. 6] is a schematic plan view showing an example of arrangement of light receiving elements in a conventional solid-state imaging device, and (B) and (C) are schematic plan views showing examples of arrangement of light-receiving elements in the solid-state imaging device of the present invention.

FIG. 3 is an explanatory diagram showing a relationship between incident light and an output level in each arrangement state of the light receiving elements shown in FIG.

FIG. 4 is a schematic plan view showing a configuration example of an image pickup section in a conventional honeycomb CCD.

FIG. 5 is a schematic plan view showing a configuration example of the solid-state imaging device of the present invention according to the embodiment.

FIG. 6 is a schematic plan view showing an arrangement example of channel stoppers.

FIG. 7 is a diagram for explaining a problem of the conventional technique.

[Explanation of symbols]

10 Solid-state imaging device 12 Read control unit (reading means) AP opening CS channel stopper PD light receiving element TG transfer gate VEL Vertical transfer electrode (electrode) HEL Horizontal transfer electrode

Continued front page    F-term (reference) 4M118 AA10 AB01 BA10 BA13 CA02                       CA20 CA22 DA13 DB05 DB11                       FA01 FA06 FA26 FA32 GC08                       GC14 GC20                 5C024 CX37 GX21 GX22 GY02 GY04                       GY06 GY13 JX21                 5C065 BB13 CC08 DD02 EE06 EE14                 5F049 MA01 NA04 NA18 NB05 PA15                       SZ06 WA09

Claims (5)

[Claims] 1. The two-dimensionally arranged adjacent to each other,
A plurality of light receiving elements having color separation filters of the same color; a plurality of openings formed on the light receiving surfaces of the plurality of light receiving elements and limiting light entering the corresponding light receiving elements; and the plurality of openings A solid-state imaging device comprising: an electrode that is arranged so as to circumnavigate the light source and that takes out a signal from the light receiving element. 2. The solid-state imaging device according to claim 1, wherein the plurality of light receiving elements are arranged so that the distances between adjacent light receiving elements are substantially uniform. 3. The solid-state image pickup device according to claim 1, wherein a channel stopper is provided between adjacent light receiving elements that receive light of different colors. 4. The number of light-receiving elements having the color separation filters of the same color is four, and read-out means for reading out signals from all the light-receiving elements by four-field reading is further provided. The solid-state imaging device according to claim 1. 5. The method according to claim 1, wherein the opening shape of the opening is a polygon having a shape of a quadrangle or more, and the plurality of light receiving elements are two-dimensionally arranged so that adjacent light receiving elements are displaced vertically and horizontally. The solid-state imaging device according to claim 1.