JP2003234286A - Liquid treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid treatment device capable of preventing a phenomenon or so called a loading effect, wherein the production amount of resolution products or the concentration of a developing solution becomes different locally and an etching speed or the like is changed, and capable of uniformly developing a photo mask such as a reticle or the like. <P>SOLUTION: The liquid treatment device is equipped with a nozzle head 61 having a liquid treatment surface 62 capable of being moved relatively in parallel to a plate type glass substrate G with a given interval, a developing solution supplying nozzle 63 provided on the liquid treatment surface 62 to supply the developing solution onto the surface of the glass substrate G so as to form the shape of a belt, a suction nozzle 64 provided on the liquid treatment surface 62 in parallel to the developing solution supplying nozzle 63 to such the developing solution supplied from the developing solution supplying nozzle 63 and form the flow of the developing solution on the surface of the glass substrate G, and side rinse nozzles 65 provided on the liquid treatment surface 62 of the nozzle head 61 at a position opposed to the developing solution supplying nozzle 63 through the suction nozzle 64 to supply a rinse solution on the surface of the glass substrate G. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing apparatus for supplying a processing liquid to a glass substrate for a photomask such as a reticle and processing the same.

[0002]

2. Description of the Related Art Generally, in a semiconductor device manufacturing process, for example, a resist solution is applied to the surface of a semiconductor wafer, a glass substrate for LCD or the like (hereinafter referred to as a wafer),
A photolithography technique is used in which a circuit pattern is reduced using an exposure device such as a stepper to expose a resist film, and a developing solution is applied to the exposed wafer surface to perform a development process.

In the above exposure process, an exposure device such as a stepper (reduction projection exposure device) is used, for example, a photomask such as a reticle is irradiated with light, and an original drawing of a circuit pattern drawn on the photomask is used. Are reduced and transferred onto the wafer.

By the way, in the photomask manufacturing process as well, the photolithography technique is used similarly to the wafer and the like, and a series of process steps such as a resist coating step, an exposure processing step and a development processing step are performed. Since the photomask is an original drawing for projecting a circuit pattern on a wafer or the like, the pattern dimensions such as the line width are required to have higher accuracy.

Here, in the photomask developing method, a glass substrate for a photomask is adsorbed and held on a spin chuck and rotated at a low speed, and a developing solution is sprayed onto the glass substrate using a spray nozzle. There is a method called spray development in which development processing is performed.

There is also a method called paddle development in which the developing solution supplied from the scan nozzle is poured onto the glass substrate while the glass substrate and the scan nozzle are moved relative to each other, and the developing process is performed in a stationary state.

[0007]

However, in the spray development, the dissolution product generated by reacting with the developing solution flows to the sides and corners of the glass substrate due to the centrifugal force due to the rotation, so that the development is performed in this part. The reaction with the liquid is suppressed,
There is a problem in that the pattern dimensions such as line width are not uniform.

Further, in the paddle development, the dissolved product does not flow to a specific place, and the problem such as spray development does not occur, but the dissolved product is caused by the difference in the geometric structure of the pattern and the pattern density. There is a problem in that the circuit pattern becomes non-uniform due to a phenomenon called a loading effect in which the generation amount and the concentration of the developer are locally different and the etching rate and the like change.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a liquid processing apparatus capable of uniformly developing a photomask (substrate to be processed) such as a reticle.

[0010]

In order to achieve the above object, a liquid processing apparatus of the present invention has a liquid processing surface which is movable in parallel with a plate-shaped substrate to be processed with a certain gap. A nozzle head, a treatment liquid supply means provided on the liquid treatment surface and supplying a treatment liquid in a belt shape to the surface of the substrate to be treated, and a treatment liquid supply means provided on the liquid treatment surface in parallel with the treatment liquid supply means,
A treatment liquid suction means for sucking the treatment liquid supplied from the treatment liquid supply means and for forming a flow of the treatment liquid on the surface of the substrate to be processed is provided (claim 1).

In the liquid processing apparatus of the present invention, the processing liquid suction means is preferably formed at least on the front side in the relative movement direction of the processing liquid supply means, and before and after the processing liquid supply means in the relative movement direction. Formed or
It is further preferable that the treatment liquid supply means is formed so as to surround the periphery of the treatment liquid supply means (claims 2, 3 and 4). In this case, it is preferable that the processing liquid suction means is formed longer than the length of the processing liquid supply means in the longitudinal direction (claim 5). Further, it is preferable that the suction port of the processing liquid suction means is formed so as to face the processing liquid supply means side (claim 6). The processing liquid supply means includes a plurality of processing liquid supply holes provided at equal intervals in the longitudinal direction of the processing liquid supply means, a slit communicating with a lower portion of the processing liquid supply hole, and a slit communicating with a lower portion of the slit. It is preferable to provide a widening tapered processing liquid supply port and a rectification buffer rod provided in the processing liquid supply port (claim 7). Further, it is preferable that the treatment liquid supply means includes a treatment liquid temperature adjusting means capable of adjusting the temperature of the treatment liquid (claim 8).

Further, in the liquid processing apparatus of the present invention, the cleaning liquid is supplied to the surface of the substrate to be processed, which is provided on the liquid processing surface of the nozzle head so as to face the processing liquid supply means with the processing liquid suction means interposed therebetween. It is preferable that the cleaning liquid supply means is provided (Claim 9). In this case, a stepped portion parallel to the processing liquid suction means and having a low processing liquid suction means side is formed between the processing liquid suction means and the cleaning liquid supply means on the liquid processing surface, or the processed substrate side It is preferable to form a convex portion that is parallel to the processing liquid suction means that bulges toward (claims 10 and 11). Further, it is preferable that the cleaning liquid supply means includes cleaning liquid temperature adjusting means capable of adjusting the temperature of the cleaning liquid (claim 12).

Further, in the liquid processing apparatus according to the present invention, the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means and the processing liquid flow rate supplied by the processing liquid supply means are detected. Processing liquid flow rate detection means, suction amount adjustment means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, and suction amount detection means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means. A control means for controlling the processing liquid flow rate adjusting means and the suction amount adjusting means based on the detection information of the processing liquid flow rate detecting means and the suction amount detecting means and the information stored in advance, Alternatively, a processing liquid flow rate adjusting unit capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply unit, and a processing liquid flow rate detecting unit detecting the flow rate of the processing liquid supplied by the processing liquid supply unit,
Suction amount adjusting means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, suction amount detecting means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means, and the cleaning liquid supply means Cleaning liquid flow rate adjusting means capable of adjusting the flow rate of the cleaning liquid, cleaning liquid flow rate detecting means for detecting the flow rate of the cleaning liquid supplied by the cleaning liquid supplying means, detection of the processing liquid flow rate detecting means, the suction amount detecting means and the cleaning liquid flow rate detecting means It is preferable to include control means for controlling the processing liquid flow rate adjusting means, the suction amount adjusting means and the cleaning liquid flow rate adjusting means based on the information and the information stored in advance (claims 13 and 14). In this case, the flow rate of the processing liquid sucked by the processing liquid suction means in the control means becomes a predetermined value at which the processing liquid does not flow out from the liquid processing surface and the air is not sucked into the processing liquid suction means. As described above, it is preferable to form the suction flow rate adjusting means in a controllable manner (claim 15).
The control means includes an interval detecting means for detecting the distance between the liquid processing surface of the nozzle head and the surface of the substrate to be processed, and an elevating means for elevating the nozzle head. It is preferable to control the elevating means based on a signal and information stored in advance (claim 16).

According to the first, second, third, and fourth aspects of the invention, since the flow of the processing liquid having a constant width can be positively formed on the surface of the substrate to be processed, the substrate to be processed is subjected to the development process. The dissolved product formed on the surface can be removed and fresh developer can be supplied. In this case, since the treatment liquid suction means is formed longer than the length of the treatment liquid supply means in the longitudinal direction, the treatment liquid is prevented from seeping out from the both ends of the liquid treatment apparatus onto the target substrate before or after the treatment. It can be prevented (Claim 5).

According to the sixth aspect of the invention, since the suction port of the processing liquid suction means is formed to face the processing liquid supply means side, the processing liquid can be smoothly sucked.

According to the seventh aspect of the present invention, the treatment liquid supply means has a plurality of treatment liquid supply holes provided at equal intervals in the longitudinal direction of the treatment liquid supply means, and the treatment liquid supply holes are provided below the treatment liquid supply holes. Since the slits are in communication with each other, the processing liquid supply port having an expanding taper shape that communicates with the lower part of the slit, and the rectification buffer rod provided in the processing liquid supply port are provided, the processing liquid supply hole supplies the processing liquid through the processing liquid supply hole. The unevenness (unevenness of discharge, unevenness of application) can be prevented, and the processing liquid can be uniformly supplied (discharged and applied) to the substrate to be processed by the rectifying buffer rod, so that the processing liquid supply means and the processing liquid suction means are evenly arranged. It is possible to form a stream of different processing liquids.

According to the eighth aspect of the present invention, the treatment liquid supply means is provided with a treatment liquid temperature adjusting means capable of adjusting the temperature of the treatment liquid, so that the viscosity of the treatment liquid and the treatment speed (reaction speed) can be improved. ) Etc. can be made constant.

According to the present invention, the cleaning liquid is provided on the surface of the substrate to be processed, which is provided on the liquid processing surface of the nozzle head so as to face the processing liquid supply means with the processing liquid suction means interposed therebetween. Since the cleaning liquid supply unit for supplying the cleaning liquid is provided, the processing liquid suction unit sucks the cleaning liquid supplied by the cleaning liquid supply unit to prevent the processing liquid from spreading from the processing liquid suction unit to the cleaning liquid supply unit side. The width of the processing liquid on the substrate can be made constant. Moreover, particles and the like on the substrate to be processed can be removed. In this case, a stepped portion that is parallel to the processing liquid suction means and has a low processing liquid suction means side is formed between the processing liquid suction means and the cleaning liquid supply means on the liquid processing surface, or is directed toward the processed substrate side. Since the convex portion parallel to the rising processing liquid suction means is formed, the width of the processing liquid can be more reliably made constant (claims 10 and 11). Further, since the cleaning liquid supply means includes the cleaning liquid temperature adjusting means capable of adjusting the temperature of the cleaning liquid, the temperature of the substrate to be processed and the processing liquid can be kept constant, and the viscosity of the processing liquid and the processing speed (reaction speed) Etc. can be made constant (claim 12).

According to the thirteenth aspect of the present invention, the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means and the processing liquid flow rate supplied by the processing liquid supply means are detected. Processing liquid flow rate detecting means, suction amount adjusting means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, suction amount detecting means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means, and processing. Based on the detection information of the liquid flow rate detection means and the suction amount detection means, and the information stored in advance,
Since the control means for controlling the processing liquid flow rate adjusting means and the suction amount adjusting means is provided, the flow of the processing liquid can be controlled to a flow rate capable of removing the dissolution product generated on the surface of the substrate to be processed. Therefore, uniform liquid treatment can be performed.

According to the fourteenth aspect of the present invention, the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means, and the processing liquid flow rate supplied by the processing liquid supply means are detected. Processing liquid flow rate detecting means, suction amount adjusting means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, suction amount detecting means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means, and cleaning liquid A cleaning liquid flow rate adjusting unit capable of adjusting the flow rate of the cleaning liquid supplied by the supply unit, a cleaning liquid flow rate detecting unit detecting the flow rate of the cleaning liquid supplied by the cleaning liquid supply unit, a processing liquid flow rate detecting unit, a suction amount detecting unit and a cleaning liquid flow rate detecting unit. The width of the processing liquid is ensured because the processing liquid is provided with the control means for controlling the processing liquid flow rate adjusting means, the suction amount adjusting means and the cleaning liquid flow rate adjusting means based on the detection information of the means and the information stored in advance. It can be kept constant.

Further, the control means is such that the flow rate of the processing liquid sucked by the processing liquid suction means does not cause the processing liquid to flow out from the liquid processing surface.
Moreover, since the suction flow rate adjusting means is controlled so as to have a predetermined value that does not suck air into the processing liquid suction means, the processing liquid can be effectively used and a uniform processing liquid flow is formed.
A uniform liquid treatment can be performed (Claim 15).

Further, it comprises an interval detecting means for detecting the distance between the liquid processing surface of the nozzle head and the surface of the substrate to be processed, and an elevating means for elevating the nozzle head, and the control means is a detection signal of the interval detecting means. Since the elevating means is controlled on the basis of the information stored in advance, the gap between the liquid processing surface of the nozzle head and the substrate to be processed can be surely made constant, and more uniform liquid processing can be performed. It is possible (claim 16).

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, the liquid processing apparatus of the present invention is applied to a substrate to be processed for a photomask,
For example, a case where the present invention is applied to a development processing apparatus that performs development processing on a glass substrate G for a reticle will be described.

As shown in FIG. 1, the development processing apparatus carries in the glass substrate G on which the resist solution has been applied and the circuit pattern has been exposed to the inside of the apparatus or the glass substrate G on which the development processing has been completed to the outside of the apparatus. A delivery section 1 to be carried out, a processing section 3 to develop the glass substrate G carried in from the delivery section 1,
The transfer unit 1 and the processing unit 3 mainly include a transfer unit 2 that transfers the glass substrate G.

In the transfer section 1, a plurality of, for example, three support pins (not shown) capable of vertically moving up and down while supporting the edge of the glass substrate G are provided inside the mask stage 4 and inserted from the outside. Transfer means such as a transfer arm (not shown)
The glass substrate G can be transferred between the glass substrate G and the mask stage 4 described later.

Further, the delivery section 1 is provided with a laser displacement meter 101 for measuring a distance by utilizing a thickness detecting means such as reflection of laser light. In this case, the laser displacement meter 10
As shown in FIG. 15A, 1 is obtained by measuring the distance from the upper side of the glass substrate G to the applied Cr layer 102 and the distance from the lower side of the glass substrate G to the back surface of the glass substrate G. The distance between the lower side of the glass substrate G and the back surface of the glass substrate G and the distance to the Cr layer 102 are measured and compared, as shown in FIG. The thickness can be detected and stored in the CPU 100. Thus, the thickness of the glass substrate G having an error of about 100 μm is accurately detected, and the displacement information between the liquid processing surface 62 of the liquid processing apparatus 6 and the surface of the glass substrate G, which will be described later, is more accurately detected. be able to.

The mask stage 4 is, as shown in FIG.
The glass substrate G is provided in a substantially square shape larger than the glass substrate G, and a slight gap is provided between the glass substrate G and the mask stage 4 so that the exposed portion of the glass substrate G placed (held) does not touch the mask stage 4. A pair of mounting portions 41 capable of mounting (holding) two sides of the substrate G are provided. In addition, each mounting portion 41 is formed with a locking portion 42 that locks the edge portion of the glass substrate G in order to prevent the glass substrate G from shifting in the horizontal direction.

On the upper surface side of the mask stage 4, as shown in FIG.
Pressure sensor 43 for detecting the pressing force applied to the glass substrate G
(Pressure detection means) is provided. Pressure sensor 43
Is raised by the suction of the developing solution suction nozzle 64, which will be described later, based on the pressure when the glass substrate G is placed and sandwiched between the holding plate 52 of the nozzle stage 5 (see FIG. 5). Can be detected by a drop in pressure. Further, the pressure sensor 43 is electrically connected to the CPU 100, and when the pressure detected by the pressure sensor 43 becomes equal to or lower than a predetermined value, the CPU 100 closes on-off valves V1, V2, V3, V4 described later, Stop the development process and activate the alarm, or
The flow rate of the rinse liquid supplied (discharged) from a side rinse nozzle 65 (cleaning liquid supply means) described later is controllable by adjusting the opening / closing valve V4.

As shown in FIG. 3, the transport unit 2 includes a transport mechanism 121 capable of horizontally moving the mask stage 4 between the delivery unit 1 and the lower portion of the processing unit 3 in the X direction, and the processing unit 3. The mask stage 4 conveyed downward is provided with an elevating mechanism 126 (see FIG. 4) capable of moving in the vertical direction.

The transfer mechanism 121 is, for example, a ball screw mechanism 122 provided so as to extend in the X direction from the transfer section 1 to the lower side of the processing section 3, and a mask stage guide rail provided parallel to both sides of the ball screw mechanism 122. 12
3 and a transfer mounting table 124 (see FIG. 4) provided with an elevating mechanism 126 (described later) on the upper portion thereof. Can be moved in any direction.
In this case, if the nozzle (not shown) that moves with the mask stage 4 and downflows clean air to the ball screw mechanism 122 and allows it to flow to the exhaust port is attached, particles adhere to the glass substrate G. This is preferable because it can be prevented.

Further, as shown in FIG. 4, the elevating mechanism 126 is provided above the carrying table 124, and the mask stage 4 is moved in the vertical direction in the figure by driving an air cylinder or the like to move the mask. Stage 4 to nozzle stage 5
It is formed so that it can be raised and lowered.

A pressing force adjusting mechanism such as a spring 127 is provided between the elevating part 126a of the elevating mechanism 126 and the lower surface of the mask stage 4, and the glass substrate G is pressed to the pressing plate 52 of the nozzle stage 5 (see FIG. 5). The pressing force applied to the glass substrate G is made constant so that a constant gap can be always provided between the liquid processing device 6 and the glass substrate G described later. Note that, instead of the spring 127, for example, a pressure adjusting air cylinder or the like may be used.

Further, instead of providing a pressing force adjusting mechanism,
The glass substrate G is provided above the elevating part 126a of the elevating mechanism 126.
A plurality of expandable and contractible support pins, for example, three support pins may be provided to support the lower part of the. In this case, a drive device for height adjustment is provided on each of the support pins, and based on the data obtained by the distance detecting means such as a laser displacement meter capable of detecting the distance between the liquid processing device 6 and the glass substrate G. The height of the glass substrate G can be finely adjusted by moving the support pins up and down.

As shown in FIG. 5, the processing section 3 includes a nozzle stage 5 for developing the glass substrate G, a liquid processing apparatus 6 for supplying (discharging, applying) a developing solution to the glass substrate G, and
This liquid processing device 6 is used for the glass substrate G on the nozzle stage 5.
Relative to the scanning mechanism 7, a rinse nozzle 8 for cleaning the glass substrate G after the development processing, a drain pan 9 for discharging the processing liquid used in the development processing, and the glass substrate G after the rinse processing. Air blow nozzle 10 for drying
It is mainly composed of and.

The nozzle stage 5 is, as shown in FIG.
A substantially square fitting portion 51 capable of fitting the mask stage 4 in the center, and a holding plate 52 which is provided above the two sides of the fitting portion 51 extending in the X direction and which holds the upper end portion of the glass substrate G.
With the spring 127 (pressing force adjusting mechanism) described above, the glass substrate G is pressed against the pressing plate 52, and a developing solution is supplied with a constant gap between the liquid processing device 6 and the glass substrate G. Then, the developing process can be performed (see FIG. 6).

As shown in FIG. 5, the scanning mechanism 7 includes two guide rails 71 for liquid processing nozzles which are provided in parallel with each other in the X direction in the drawing and which support both ends in the longitudinal direction of the liquid processing apparatus 6.
And the liquid processing apparatus 6 are fitted to each other, and a scan that can move in the X direction on the liquid processing nozzle guide rail 71 between the nozzle standby position 72 (the position where the liquid processing apparatus 6 is shown in the figure) and the glass substrate G. It is composed of a base portion 76, a ball screw mechanism 73 formed so as to be driven by a driving means such as a motor 75, and a scan arm 74 connected to one end of the scan base portion 76 and transmitting the driving force of the ball screw mechanism 73. ing.

Further, the scan base section 76 is based on a distance detecting means capable of detecting the distance between the liquid processing apparatus 6 and the glass substrate G, for example, a laser displacement meter 78 (see FIG. 5) and a detection signal of the laser displacement meter 78. In addition, the liquid processing apparatus 6 is provided with an elevating mechanism 77 (elevating means) (not shown) configured to elevate and lower, for example, a motor and a ball screw mechanism. Therefore, a constant gap, for example, a gap of 1 mm to 50 μm can be accurately formed between the liquid processing apparatus 6 and the glass substrate G.

Further, the scanning mechanism 7 is electrically connected to the CPU 100 which is a control means described later, and CP
The scan signal and the liquid processing apparatus 6 can be controlled by a control signal from U100.

As shown in FIG. 5, the rinse nozzle 8 is suspended from the upper end of a base portion 81 provided outside the drain pan 9 at the tip of an arm portion 82 extending in the horizontal Y direction to the vicinity of the center of the nozzle stage 5. The rinse liquid such as pure water can be supplied (discharged / dropped) near the center of the nozzle stage 5. Also, the base portion 81
Has an elevating means such as an air cylinder (not shown), and during the rinsing process, the rinsing liquid is supplied (discharged / dropped) by descending to a height at which the glass substrate G on the nozzle stage 5 is not impacted and developed. During processing, the nozzle stage 5
It is configured so that it can stand by rising to a height at which it does not interfere with the liquid processing apparatus 6 moving above.

The rinse nozzle 8 is formed so as to be movable by a driving force from a power source such as a motor, by providing a rinse nozzle guide rail (not shown) and a ball screw mechanism at the lower portion of the base portion 81. Alternatively, the glass substrate G may be scanned to perform the rinsing process.

As shown in FIG. 7A, the drain pan 9 is formed in a box shape surrounding the transfer section 1 and the processing section 3, and processes the developer and rinse liquid overflowing from the nozzle stage 5. A liquid discharge conduit 92 having a liquid discharge port 91 for collecting liquid (waste liquid), a liquid processing nozzle guide rail 71 of the scanning mechanism 7, and a ball screw mechanism 73 are provided below the ball screw mechanism 73. And an exhaust pipe line 94 having an exhaust port 93. The bottom surface 95 of the drain pan 9 has a drainage port 91 as shown in FIG.
Is formed so as to be the lowest, and the processing liquid (waste liquid) is formed so as to smoothly flow to the drainage port 91. The waste liquid that has flowed to the drainage port 91 is recovered via a drainage conduit 92 in a recovery tank (not shown) provided below the drain pan 9.

As shown in FIG. 5, the air blow nozzle 10 is provided between the delivery section 1 and the processing section 3, and transfers the mask stage 4 on which the glass substrate G is placed to the transfer mechanism 12.
By moving air from the slit-shaped air blow discharge port 10a to both surfaces of the rinsed glass substrate G while moving by 1, the liquid remaining on the glass substrate G can be blown off and dried. Is configured. In this case, the generated mist is prevented from rising by downflow by a fan or the like (not shown) provided on the upper part of the apparatus, and a duct (not shown) for local exhaust is provided on the side surface of the developer processing apparatus, where It is preferable to have a structure capable of suction.

An air blow nozzle scan arm capable of moving the air blow nozzle 10 horizontally above the glass substrate G is provided, and instead of moving the mask stage 4, the air blow nozzle 10 is moved horizontally to move the glass substrate G.
It is also possible to spray air on the substrate to dry it.

Next, the liquid processing apparatus 6 according to the present invention will be described in detail with reference to FIGS. 8 to 14.

First Embodiment In the first embodiment of the present invention, as shown in FIG. 8, the liquid processing apparatus 6 is formed to have a length equal to or longer than the width of the pattern forming region of the glass substrate G. At the same time, a liquid processing surface 62 that can be moved (scanned) relatively in parallel with the glass substrate G from one end to the other end with a certain gap, for example, 50 μm to 3 mm, more preferably 50 μm to 500 μm, from the glass substrate surface. Nozzle head 6 having a substantially rectangular parallelepiped shape
1 and a developing solution supply nozzle 63 which is provided on the solution processing surface 62 and supplies (discharges and coats) the developing solution in a strip shape on the glass substrate G.
(Processing liquid supply means) and the liquid processing surface 62 are provided in parallel with the developing liquid supply nozzle 63, and by sucking the developing liquid discharged (supplied) in a strip shape from the developing liquid supply nozzle 63, in the suction direction. On the other hand, a developer suction nozzle 64 (hereinafter referred to as a suction nozzle 64) that forms a strip-shaped flow of the developer on the surface of the glass substrate G (treatment liquid suction means), and a suction nozzle 6
A side rinse nozzle 65 (cleaning liquid supplying means) which is provided at a position facing the developing solution supplying nozzle 63 with 4 interposed therebetween and which supplies (discharges and applies) a rinsing liquid (cleaning liquid) such as pure water to the surface of the glass substrate G. It has and.

In this case, it is preferable to form the liquid treatment surface 62 as smooth as possible, specifically, a smooth surface having a surface accuracy of 30 μm or less. If formed in this way, the flow of the developing solution becomes smooth, and a more uniform developing process can be performed.

The development processing using these is performed while the nozzle head is scanningly moved at, for example, 1 mm / sec.

The developing solution supply nozzle 63, the developing solution suction nozzle 64, and the side rinse nozzle 65 can be formed independently.

As shown in FIG. 8, the developing solution supply nozzle 63 has a container 1 for temporarily containing the developing solution for removing bubbles.
1 inside the nozzle head 61, a developer supply line 13 for supplying the developer from a developer tank 12 (developer supply source) in which the developer is stored, and a bubble of the developer in the accommodating portion 11. It is connected to the bubble removing pipe line 14 (see FIG. 9) for removing bubbles.

Further, in the developing solution supply pipe 13, a temperature adjusting mechanism 15 (processing solution temperature adjusting means) for adjusting the temperature of the developing solution, a pressure feeding means (not shown) such as a pump for feeding the developing solution, and the developing solution supply are provided. A developing solution flow meter 130 (processing solution flow rate detecting means) for detecting the flow rate of the developing solution in the pipeline is provided, and for example, an opening / closing valve V1 (processing solution) whose opening / closing is controlled by compressed air. The flow rate of the developing solution can be adjusted by the flow rate adjusting means).

The temperature adjusting mechanism 15 is, as shown in FIG.
The double tube structure is provided at the connecting portion between the developing solution supply pipe 13 and the nozzle head 61, and the developing solution supply pipe 13 is formed so as to pass through the temperature control conduit 16. The temperature adjusting pipe 16 is a temperature adjusting pipe for circulating a liquid, for example, pure water, whose temperature is regulated by a heater 17 or the like with respect to the developing liquid flowing from the upper side to the lower side in the developing liquid supply pipe 13 by means of a circulation means such as a circulation pump 18. It is configured to circulate in the passage 16 from below to above. With this configuration, the temperature of the developing solution can be adjusted, so that the viscosity of the developing solution and the etching rate (processing rate, reaction rate) can be made constant, and a more uniform developing process can be performed. be able to.

As shown in FIG. 9, the defoaming pipe line 14 is connected to the accommodating portion 11 from the upper part of the nozzle head 61, and the defoaming means (not shown) removes the defoaming means so that the developing solution does not contain air bubbles. It is configured to be able to.

As shown in FIGS. 10 and 11, the developing solution supply nozzle 63 has a plurality of supply holes 20 (processing solution supply holes) provided at equal intervals, for example, at a pitch of 1 mm in the longitudinal direction of the developing solution supply nozzle 63. ), And a slit 21 having a width of, for example, 1 mm, which is communicated with the lower part of the supply hole 20 and is provided in the longitudinal direction of the developer supply nozzle 63, and a developer which is communicated with the lower part of the slit 21 is supplied (discharged and applied) to the glass substrate G. ) Expanding taper type developer supply port 22 (processing liquid supply port)
And a straightening buffer rod, for example, a cylindrical quartz rod 23, which is provided in the developer supply port 22 in the longitudinal direction, reduces the impact at the time of discharging the developer, and uniformly discharges the developer. There is. Here, the case where the rectifying buffer rod is formed of the quartz rod 23 has been described, but the rectifying buffer rod may be formed of ceramics other than quartz as long as it is a hydrophilic member.

By constructing the developing solution supply nozzle 63 in this way, the developing solution flowing out of the supply hole 20 merges at the slit 21 and then flows along the wall surface of the developing solution supply port 22, while the quartz rod It can be diffused on the surface of 23. Therefore, the slit 21 can prevent uneven discharge of the developing solution due to the supply hole, and the quartz rod 23 can uniformly supply (discharge or apply) the developing solution to the glass substrate G. The developing solution supply nozzle and a suction nozzle described later can be used. Between 64 and 64, a uniform developing solution flow can be formed while constantly supplying a new developing solution, and uniform developing treatment can be performed while removing the dissolved products.

As shown in FIG. 12A, the slit 21 is a slit 21 having a tapered cross section.
12A, and as shown in FIG. 12B, the boundary with the developer supply port 22 may be a slit 21b formed in a smooth streamline shape. Further, as shown in FIG. 12C, the developing solution supply port 22 serves as a developing solution supply port 22a whose center is eccentric to the front side in the moving direction of the developing solution supply nozzle 63 from directly below the slit 21. Good. According to this structure, the developing solution supplied by the developing solution supply nozzle 63 can be more uniformly supplied (discharged / coated).

In the above description, the developing solution supply nozzle 6
Although the case where the slit 21 is formed in 3 has been described,
The developing solution supply nozzle 63 does not necessarily have to be formed in this way, and as shown in FIG. 12D, the developing solution supply nozzle 63 supplies the developing solution directly to the surface of the glass substrate G from a plurality of supply holes 20 (processing solution supply holes). Of course, it is possible to form so as to obtain.

The suction nozzle 64, as shown in FIG.
Slit-shaped suction ports 35 for sucking the processing liquid (waste liquid) used for the development processing such as the developing solution and the rinsing solution are provided in parallel on both sides in the moving direction of the liquid processing surface 62 of the developing solution supply nozzle 63. . Here, the length of the suction port 35 in the longitudinal direction is
In order to prevent the developing solution from seeping out from both ends of the developing solution supply nozzle 63, it is preferable that the developing solution supply port 22 is formed longer than the length of the developing solution supply port 22 in the longitudinal direction. If the width of the slit of the suction port 35 is too wide, the developing state deteriorates near the suction port 35. Therefore, the slit of the suction port 35 can be sucked as much as possible without leaking the supplied developing solution to the side rinse nozzle 65 side. It is preferable that the width is narrow. Further, the suction nozzle 64 smoothly sucks the developing solution supplied from the developing solution supply nozzle 63 and used for the developing process to form a uniform developing solution flow. Therefore, as shown in FIG. 35 is the developer supply port 22
It is preferable to form so as to face the side.

In the above description, the suction nozzle 64 is
The case where the slit-shaped suction port 35 is provided has been described, but the configuration of the suction nozzle 64 is not limited to this, and for example, FIG.
As shown in FIGS. 6 (a) and 6 (b), it is possible to provide a plurality of suction holes 35a parallel to the developer supply port 22 and linearly at equal intervals. In this case, it is preferable that the suction holes 35a are provided in a zigzag pattern with the developer supply port 22 interposed therebetween. With this configuration, the developer can be flowed not only in the form of a strip but also obliquely, so that the dissolution products can be removed more reliably.

As shown in FIG. 16C, a plurality of suction holes 35a are provided in the suction nozzle 64 on the front side in the scanning direction, and a slit-shaped suction port 35 is provided in the suction nozzle 64 on the rear side in the scanning direction. May be. According to this structure, the suction holes 3 are provided on the front side of the liquid processing apparatus 6 in the scanning direction.
The developer can be surely removed by flowing the developer obliquely by 5a, and the developer can be reliably sucked by the suction port 35 on the rear side in the scanning direction to prevent unsucked developer. .

The suction nozzle 64 is, as shown in FIG. 8, a pressure reducing mechanism such as an ejector capable of adjusting the amount of waste liquid such as developer and rinse liquid sucked by the suction port 35 via the suction pipe line 30. 31, a suction flow meter 150 (suction amount detecting means) capable of detecting the suction amount of each of the suction ports 35 on the front side and the rear side in the moving direction of the liquid processing apparatus 6, and the suction conduit 3
Open / close 0 to adjust the suction amount, for example, open / close valves V2 and V3 (suction amount adjusting means) such as an air operation valve whose opening / closing is controlled by compressed air, and sucked waste liquid is separated into gas and liquid and collected. A trap tank 32
It is connected to a suction unit 200 including a pressure sensor 33 that can detect the pressure of the trap tank 32, and a waste liquid tank 34 that collects the waste liquid collected in the trap tank 32. In this case, the suction pipe line 30 is connected to the suction nozzle 64.
If suction is performed from the upper end of the sheet, the flow of the developing solution becomes peculiar in the vicinity of the suction port 35 immediately below that portion, and the developing process may become uneven. Therefore, the suction pipeline 30 is formed in the pattern formation region of the glass substrate G. It is preferable to provide it at the upper end of the position away from the above, or at both ends of the suction nozzle 64.

The suction unit 200 is provided with the ejector 3
1. Instead of using the trap tank 32 and the pressure sensor 33, it is also possible to use a suction means, such as a suction pump, that can adjust the suction amount of the waste liquid sucked by the suction port.

As shown in FIG. 11, the side rinse nozzles 65 sandwich the suction nozzle 64 and the developer supply nozzle 63.
The rinse liquid is provided in parallel to the position opposite to the slit-shaped rinse liquid supply port 36 and can supply a rinse liquid such as pure water between the liquid processing surface 62 and the glass substrate G. Further, the rinse liquid supply port 36 prevents the glass substrate G from being lifted up by the suction force of the suction nozzle 64, so that the rinse liquid is vertically applied to the surface of the glass substrate G so that the pressing force of the rinse liquid acts on the surface of the glass substrate G. The rinse liquid can be supplied in any direction. When the substrate is lifted, the pressure sensor 43 detects that the pressing force of the glass substrate G is reduced and sends the detection signal to the CPU 100. If the detected value is within the allowable value, the CPU 100
Adjusts an on-off valve V4, which will be described later, based on the detected value, increases the flow rate of the rinse liquid supplied (discharged) by the side rinse nozzle 65, and controls the pressure so as to prevent floating.

As shown in FIG. 8, the side rinse nozzle 65 is connected to a rinse liquid supply source, for example, a rinse liquid supply tank 38 via a rinse liquid supply pipe 37,
Similar to the developer supply pipeline 13, the rinse solution supply pipeline 37 includes a pumping means such as a pump (not shown) for pumping the rinse solution and a rinse solution for detecting the flow rate of the rinse solution in the rinse solution supply pipeline 37. A flow meter 140 (cleaning liquid flow rate detecting means) and an opening / closing valve V4 (cleaning liquid flow rate adjusting means) such as an air operation valve which is controlled to open and close by compressed air or the like are provided. Further, at least in the rinse liquid supply conduit 37 communicating with the side rinse nozzle 36a on the front side in the relative movement direction (scanning direction) between the liquid processing device 6 and the glass substrate G, a temperature adjusting mechanism 39 for adjusting the temperature of the rinse liquid is provided. (Cleaning liquid temperature adjusting means) is provided.

With this structure, the suction nozzle 64 sucks a part of the rinse liquid supplied by the side rinse nozzle 65 and prevents the developer from spreading from the suction nozzle 64 to the side rinse nozzle 65 side. Therefore, the width of the developing solution on the glass substrate G can be made constant, and the development time can be made constant to perform uniform development processing. Further, the side rinse nozzle 36a on the front side in the scanning direction can perform pre-wetting to improve wettability before supplying the developing solution, and at the same time, can prevent bubbles from occurring and remove particles. Further, the side rinse nozzle 36b on the rear side in the scanning direction can quickly wash the developing solution adhering to the surface of the glass substrate G to stop the development.

The side rinse nozzle 65 may be provided separately from the nozzle head 61.

Further, the liquid processing apparatus 6 is electrically connected to the CPU 100 (control means), and the developer flow meter 13 is provided.
0, the rinsing liquid flow meter 140, the suction flow meter 150, the pressure sensor 33, the laser displacement meter 78 (interval detecting means), and the like, and the valve V based on the information stored in advance.
1, V2, V3, V4, the distance (distance) between the liquid processing surface 62 and the glass substrate G, the scanning speed of the liquid processing apparatus 6 and the like can be controlled.

The development processing method using the liquid processing apparatus 6 having the above structure will be described below.

First, the glass substrate G carried in from the delivery section 1 by a transfer arm or the like (not shown) is measured by the laser displacement meter 10
The thickness of the glass substrate G is detected by 1 and the information is C
After storing in the PU 100, the mounting portion 4 of the mask stage 4
1 and is transported to below the nozzle stage 5 by the transport mechanism 121. Then, it is conveyed to the fitting portion 51 of the nozzle stage 5 by the elevating mechanism 126.

In the nozzle stage 5, the pressing plate 52 presses the upper surfaces of the two end portions of the glass substrate G so that a precise gap is accurately formed between the glass substrate G and the liquid processing surface 62 of the liquid processing apparatus 6. Then, the glass substrate G is fixed.

When the glass substrate G is fixed to the nozzle stage 5, the scan mechanism 7 is controlled by the control signal from the CPU 100.
Is a glass substrate G obtained by the laser displacement meter 101.
The liquid processing device 6 is moved from the nozzle standby position 72 to the scan start position so that the liquid processing device 6 has a predetermined height (gap) that does not interfere with the surface of the substrate based on the thickness data. When the scanning start position is reached, the glass substrate G is scanned while being supplied (discharged and applied) with a rinse liquid whose temperature has been adjusted in advance to a predetermined temperature, and the rinse liquid is applied to the entire surface of the glass substrate G (pre-wetting step). ). Accordingly, it is possible to prevent air from entering between the liquid processing apparatus 6 and the glass substrate G, and to adjust the glass substrate G to the processing temperature before supplying (discharging or coating) the developing solution.

When the pre-wet process is completed, the liquid processing apparatus 6 scans based on the thickness data of the glass substrate G detected by the laser displacement meter 101, and the distance between the glass substrate G and the liquid processing surface 62 is laser-scanned. It returns to the scan start position while being detected by the displacement gauges 78a and 78b. The detected displacement information is stored in the CPU 100.

In the above description, the displacement information is detected after the pre-wet process is completed. However, the method of detecting the displacement information is not limited to this, and the laser displacement meter 78 may be provided on the rear side in the traveling direction of the liquid processing apparatus 6. It is also possible to provide the same and perform it at the same time as the pre-wetting step.

When the liquid processing device 6 returns to the scan start position, the CPU 100 controls the scan speed of the liquid processing device 6 to a speed at which the developing time can be secured, and the opening degrees of the opening / closing valves V1, V2, V3, V4 are set. By controlling, supply (ejection, coating) and suction of the developing solution and the rinsing solution (pure water) are performed so that a developing solution flow having a constant width can be formed between the solution processing surface 62 and the glass substrate G. Start.

At this time, as shown in FIG. 17, when the suction flow rate is larger than the upper limit value of the suction flow rate, bubble entrainment occurs in which air is sucked onto the liquid processing surface, which obstructs the flow of the developing solution and performs the developing process. Can't do it. On the other hand, when the suction flow rate is less than the lower limit value of the suction flow rate, the developer flows out of the liquid processing surface 62 (bleeds or overflows), resulting in waste. Therefore, the CPU
Reference numeral 100 controls the on-off valves V2 and V3 so that the suction flow rate becomes a predetermined value such that the developing solution does not flow out from the liquid processing surface 62 and air is not sucked (bubble clogging) to the suction nozzle 64. For example, in the CPU 100, the data shown in FIG. 17 (gap between the liquid processing surface 62 and the glass substrate G is 0.1 m
m, rinsing liquid flow rate of 2.0 L / min) is stored in advance, the on-off valves V2 and V3 are adjusted according to the flow rate of the developing solution, and the suction flow rate is at least the suction flow rate upper limit value and the suction flow rate lower limit value. The value is within the optimum balance range (the shaded area in FIG. 17) between and, more preferably, the suction flow rate is controlled to be the optimum value.

Further, the CPU 100 applies a predetermined pressing force to the glass substrate G based on the pressure value detected by the pressure sensor 43 in order to prevent the glass substrate G from being sucked by the suction of the suction nozzle 64. Adjust the flow rate (supply amount) of the rinse liquid. By adjusting the flow rate (supply amount) of the rinse liquid in this manner, the liquid treatment device 6
The distance between the liquid-treated surface and the surface of the glass substrate G can be accurately controlled to perform more uniform development processing.

In order to prevent the developing solution from spreading over a predetermined width, the CPU 100 starts supplying (discharging, applying) and sucking the rinsing solution slightly earlier than supplying (discharging, applying) the developing solution. May be controlled as follows.

The supply (ejection, application) and suction of the developing solution and the rinsing solution by the solution processing device 6 are intermittently executed from the start to the end of the scan. At this time, the gap between the glass substrate G and the liquid processing surface 62 is detected by a gap detecting means such as a laser displacement meter (not shown), and the detection signal is sent to the CPU 100, and in the CPU 100, the detection signal and the information stored in advance. Based on this, the liquid processing device 6 is moved up and down by the elevating mechanism 77 so that the developer does not seep out from the position of the suction nozzle 64 to the side rinse nozzle 65 side and the flow velocity of the developer can be maintained at a high speed. To adjust.

When the developing process is completed, the rinse nozzle 8 descends to a position where the glass substrate G is not impacted when the rinse liquid is supplied, and a rinse liquid such as pure water is supplied (discharged) onto the glass substrate G. Perform rinse treatment. In this case, the rinse solution can be discharged (supplied) from the side rinse nozzle 65 to perform the rinse process without using the rinse nozzle while moving the developer supply nozzle 63 to the nozzle standby position 72 in the opposite direction.

When the rinsing process is completed, the mask stage 4 is moved to the fitting part 5 of the nozzle stage by the elevating mechanism 126.
After descending from 1, the sheet is conveyed by the conveying mechanism 121 to the delivery section. At this time, operate the air blow nozzle 10,
The mask stage 4 is moved while blowing air on both surfaces of the glass substrate G, and the rinse liquid on the glass substrate G is blown off and dried. The mist generated at this time is
The air is discharged by the downflow of the apparatus, and a local exhaust duct (not shown) is provided on the side surface of the drain pan 9 for suction.

When the mask stage 4 is transported to the delivery section 1, the glass substrate G is unloaded by the transport means inserted from the outside of the apparatus, for example, the transport arm, and the processing is completed.

During the development processing, the developer flow rate meter 13
0, the rinse liquid flow meter 140 and the suction flow meter 150, and the CPU 10 based on the information stored in advance.
It is also possible that 0 controls the on-off valves V1, V2, V3 and V4.

Second Embodiment In the second embodiment of the present invention, as shown in FIG. 13A, the suction nozzle 64a is formed so as to surround the developing solution supply nozzle 63.

With this structure, it is possible to prevent the developing solution from seeping out from both ends of the developing solution supply nozzle 63,
It is possible to reliably form a flow of the developer having a constant width.

Further, as shown in FIG. 13B, the suction nozzle 64b is formed only on the front side in the moving direction of the developing solution supply nozzle 63 in which the amount of dissolved products is large and the concentration of the developing solution is remarkably lowered. It is also possible to omit the side rinse nozzle 65. In this case, the developing solution on the glass substrate G is rinsed by the rinsing nozzle 8 after a lapse of time that can secure the developing time.

Since the other parts of the second embodiment are the same as those of the first embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Third Embodiment In the third embodiment of the present invention, a step portion 66 between the suction nozzle 64 and the side rinse nozzle 65 on the liquid processing surface 62 is parallel to the suction nozzle 64 and the suction nozzle 64 side is low.
Are formed {see FIG. 14 (a)}.

With this structure, the gap between the developing solution supply nozzle 63 and the suction nozzle 64 is reduced to keep the flow of the developing solution at a high speed, and the space between the suction nozzle 64 and the side rinse nozzle 65 is increased. Since the gap can be increased and the supply amount of the rinse liquid can be increased, the flow of the developer can be surely maintained within a constant width, and uniform development processing can be performed.

Further, as shown in FIG. 14B, the suction nozzle 64 and the side rinse nozzle 6 on the liquid processing surface 62.
It is also possible to form a convex portion 67 parallel to the suction nozzle 64 protruding toward the glass substrate G side between the convex portions 67 and 5.

Since the other parts of the third embodiment are the same as those of the first embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

In the first to third embodiments described above, the case where the liquid processing apparatus 6 of the present invention is applied to the development processing of the glass substrate G for the reticle has been described.
Not limited to this, it is of course possible to apply to development processing of wafers, LCDs and the like.

[0091]

As described above, according to the present invention, since it is configured as described above, the following effects can be obtained.

1) According to the invention described in claims 1, 2, 3, and 4, the flow of the processing liquid having a constant width can be positively formed on the surface of the substrate to be processed, so that the processing to be processed is performed by the developing process. The dissolved product generated on the surface of the substrate can be removed, a fresh developer can be supplied, and the substrate to be processed can be uniformly processed.

2) According to the invention described in claim 5, since the treatment liquid suction means is formed longer than the length of the treatment liquid supply means in the longitudinal direction, the treatment liquid is fed from both ends of the liquid treatment apparatus before treatment or It is possible to prevent bleeding onto the substrate to be processed after processing, and it is possible to perform uniform processing with a constant processing time.

3) According to the invention described in claim 6, since the suction port of the treatment liquid suction means is formed so as to face the treatment liquid supply means side, the treatment liquid can be smoothly sucked, and the treatment liquid can be uniformly sucked. The substrate to be processed can be uniformly processed by positively forming a different flow of the processing liquid.

4) According to the invention described in claim 7, the treatment liquid supply means comprises a plurality of treatment liquid supply holes provided at equal intervals in the longitudinal direction of the treatment liquid supply means, and the treatment liquid supply holes are provided below the treatment liquid supply holes. Since the slits are communicated with each other, the processing liquid supply port having an expanded taper shape that communicates with the lower portion of the slit, and the rectifying buffer rod provided in the processing liquid supply port are provided, the processing liquid supply hole supplies the processing liquid through the processing liquid supply hole. Prevents unevenness (unevenness of discharge, unevenness of application), uniformly supplies (discharges and applies) the processing liquid to the substrate to be processed by the rectifying buffer rod, and performs uniform processing between the processing liquid supply means and the processing liquid suction means A liquid flow can be formed, and the substrate to be processed can be uniformly processed.

5) According to the invention of claim 8, the treatment liquid supply means is provided with a treatment liquid temperature adjusting means capable of adjusting the temperature of the treatment liquid, so that the treatment liquid viscosity and the treatment speed (reaction speed) It is possible to uniformly process the substrate to be processed by keeping the above values constant.

6) According to the invention described in claim 9, the cleaning liquid is provided on the surface of the substrate to be processed, which is provided on the liquid processing surface of the nozzle head so as to face the processing liquid supply means with the processing liquid suction means interposed therebetween. Since the cleaning liquid supply unit for supplying the cleaning liquid is provided, the processing liquid suction unit sucks the cleaning liquid supplied by the cleaning liquid supply unit to prevent the processing liquid from spreading from the processing liquid suction unit to the cleaning liquid supply unit side. The width of the processing liquid on the substrate can be made constant, and the processing time can be made constant to perform uniform processing.

7) According to the invention described in claims 10 and 11, a step portion between the processing liquid suction means and the cleaning liquid supply means on the liquid processing surface is parallel to the processing liquid suction means and has a low processing liquid suction means side. Or a convex portion parallel to the processing liquid suction means that rises toward the substrate to be processed is formed, so that the width of the processing liquid can be more reliably kept constant and the processing time can be kept constant. Uniform processing can be performed.

8) According to the twelfth aspect of the present invention, since the cleaning liquid supply means includes the cleaning liquid temperature adjusting means capable of adjusting the temperature of the cleaning liquid, the temperature of the substrate to be processed or the processing liquid can be kept constant. Thus, the viscosity of the processing liquid, the processing speed (reaction speed), and the like can be more surely made constant, and the substrate to be processed can be uniformly processed.

9) According to the thirteenth aspect of the present invention, the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means and the processing liquid flow rate supplied by the processing liquid supply means are detected. Processing liquid flow rate detecting means, and suction amount adjusting means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means,
Based on the suction amount detecting means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means, the detection information of the processing liquid flow rate detecting means and the suction amount detecting means, and the information stored in advance, the processing liquid flow rate adjusting means. And a control means for controlling the suction amount adjusting means, so that the flow of the processing liquid can be controlled at a flow rate at which the dissolution product generated on the surface of the substrate to be processed can be removed. Uniform processing can be performed.

10) According to the invention described in claim 14, the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means, and the processing liquid flow rate supplied by the processing liquid supply means are detected. Processing liquid flow rate detecting means, suction amount adjusting means capable of adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, suction amount detecting means for detecting the flow rate of the processing liquid sucked by the processing liquid suction means, and cleaning liquid A cleaning liquid flow rate adjusting unit capable of adjusting the flow rate of the cleaning liquid supplied by the supply unit, a cleaning liquid flow rate detecting unit detecting the flow rate of the cleaning liquid supplied by the cleaning liquid supply unit, a processing liquid flow rate detecting unit, a suction amount detecting unit and a cleaning liquid flow rate detecting unit. The width of the processing liquid is ensured because the processing liquid is provided with the control means for controlling the processing liquid flow rate adjusting means, the suction amount adjusting means and the cleaning liquid flow rate adjusting means based on the detection information of the means and the information stored in advance. Set constant, it is possible to make uniform the development time.

11) According to a fifteenth aspect of the invention, the control means is such that the flow rate of the processing liquid sucked by the processing liquid suction means is
Since the suction flow rate adjusting means is controlled so that the processing liquid does not flow out from the liquid processing surface and the air is not sucked into the processing liquid suction means, the processing liquid can be effectively used and uniform treatment can be performed. A liquid flow can be formed and a uniform liquid treatment can be performed.

12) According to the sixteenth aspect of the present invention, there is provided an interval detecting means for detecting the distance between the liquid processing surface of the nozzle head and the surface of the substrate to be processed, and an elevating means for elevating the nozzle head. The control means controls the elevating means on the basis of the detection signal of the interval detection means and the information stored in advance, so that the gap between the liquid processing surface of the nozzle head and the substrate to be processed is surely made constant. Therefore, the substrate to be processed can be processed more uniformly.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a development processing apparatus to which the liquid processing apparatus of the present invention is applied.

FIG. 2 is a schematic perspective view showing a mask stage.

FIG. 3 is a schematic plan view showing a transport unit.

FIG. 4 is a schematic front view showing a lifting mechanism.

FIG. 5 is a schematic plan view showing a processing section including the liquid processing apparatus of the present invention.

FIG. 6 is a schematic perspective view showing a state of a substrate to be processed on a nozzle stage.

FIG. 7 is a schematic plan view showing the configuration of a drain pan of the development processing apparatus (a) and a schematic sectional view taken along line I-I thereof (b).
Is.

FIG. 8 is a schematic cross-sectional view showing the configuration of the liquid processing apparatus of the present invention.

FIG. 9 is a schematic perspective view showing the liquid processing apparatus of the present invention.

FIG. 10 is a schematic cross-sectional view (a) showing a main part of a processing liquid supply means in the present invention and a schematic cross-sectional view (b) taken along line II-II thereof.

FIG. 11 is a schematic cross-sectional view (a) showing a configuration of a processing liquid supply means in the present invention and a schematic plan view (b) showing a liquid processing surface in the present invention.

FIG. 12 is a schematic sectional view showing a main part of another processing liquid supply means according to the present invention.

FIG. 13 is a schematic plan view showing a liquid processing surface of a liquid processing apparatus according to a second embodiment of the present invention.

FIG. 14 is a schematic cross-sectional view showing the configuration of the liquid processing apparatus according to the third embodiment of the present invention.

FIG. 15 is a schematic sectional view showing a thickness detecting means in the present invention.

FIG. 16 is a schematic plan view showing a different configuration of the processing liquid suction means in the present invention.

FIG. 17 is a graph showing the relationship between the flow rate of the processing liquid supply unit and the suction flow rate of the processing liquid suction unit.

[Explanation of symbols]

G glass substrate (substrate to be processed) V1 open / close valve (processing liquid flow rate adjusting means) V2, V3 open / close valve (suction amount adjusting means) V4 open / close valve (cleaning liquid flow rate adjusting means) 6 liquid treatment equipment 15 Temperature control mechanism (processing liquid temperature control means) 20 Supply hole (Treatment liquid supply hole) 21 slits 22 Developer supply port (processing liquid supply port) 23 Quartz rod (rectifying buffer rod) 35 Suction port 39 Temperature control mechanism (cleaning liquid temperature control means) 61 nozzle head 62 Liquid processing surface 63 developer supply nozzle (processing liquid supply means) 64 developer suction nozzle (processing liquid suction means) 64a, 64b Developer suction nozzle (treatment liquid suction means) 65 Side rinse nozzle (cleaning liquid supply means) 66 steps 67 convex 77 Lifting mechanism (lifting means) 100 CPU (control means) 130 developer flow meter (processing liquid flow rate detection means) 140 Rinse liquid flow meter (cleaning liquid flow rate detection means) 150 Suction flow meter (suction amount detection means)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G03F 7/30 501 H01L 21/30 564Z (72) Inventor Kotaro Oishi 5-3-6 Akasaka, Minato-ku, Tokyo No. TBS Broadcast Center Tokyo Electron Co., Ltd. (72) Inventor Ken Nishiya 5-3-6 Akasaka, Minato-ku, Tokyo TBS Broadcast Center Tokyo Electron Co., Ltd. F-term (reference) 2H025 AA18 AB14 AB16 DA20 EA04 2H096 AA25 AA28 CA13 GA22 4F041 AA02 AA06 AB01 BA05 BA13 BA35 BA48 BA54 BA57 CA02 CA17 CA23 4F042 AA02 AA07 AB00 BA08 BA12 BA13 BA19 CA01 CB08 CB24 DD33 DD39 DD47 DF07 DF15 5F046 JA01 JA24 JA27 LA03 LA13 LA19

Claims (16)

[Claims] 1. A nozzle head having a liquid processing surface which can be moved in parallel with a plate-shaped substrate to be processed with a certain gap therebetween, and a nozzle head which is provided on the liquid processing surface and has a band shape on the surface of the substrate to be processed. A processing liquid supply means for supplying a processing liquid and a processing liquid supply means provided on the liquid processing surface in parallel with the processing liquid supply means for sucking the processing liquid supplied from the processing liquid supply means and processing the surface of the substrate to be processed. And a treatment liquid suction means for forming a flow of the liquid. 2. The liquid processing apparatus according to claim 1, wherein the processing liquid suction means is formed at least on the front side in the relative movement direction of the processing liquid supply means. 3. The liquid processing apparatus according to claim 1, wherein the processing liquid suction means is formed before and after a relative movement direction of the processing liquid supply means. 4. The liquid processing apparatus according to claim 1, wherein the processing liquid suction means is formed so as to surround the processing liquid supply means. 5. The liquid processing apparatus according to claim 1, wherein the processing liquid suction means is formed longer than the length of the processing liquid supply means in the longitudinal direction. . 6. The liquid processing apparatus according to any one of claims 1 to 4, wherein the suction port of the processing liquid suction means is formed to face the processing liquid supply means side. apparatus. 7. The liquid processing apparatus according to claim 1, wherein the processing liquid supply unit has a plurality of processing liquid supply holes provided at equal intervals in a longitudinal direction of the processing liquid supply unit. A slit communicating with a lower portion of the treatment liquid supply hole, a treatment liquid supply port having an expanding taper shape communicating with a lower portion of the slit, and a rectification buffer rod provided in the treatment liquid supply port are provided. Liquid processing equipment. 8. The liquid processing apparatus according to claim 1, wherein the processing liquid supply means includes processing liquid temperature adjusting means capable of adjusting the temperature of the processing liquid. Processing equipment. 9. The liquid processing apparatus according to claim 1, wherein the liquid processing surface of the nozzle head is provided at a position facing the processing liquid supply means with the processing liquid suction means sandwiched therebetween. A liquid processing apparatus comprising: a cleaning liquid supply means for supplying a cleaning liquid to the surface of a processing substrate. 10. The liquid processing apparatus according to claim 9, wherein a step portion between the processing liquid suction means and the cleaning liquid supply means on the liquid processing surface is parallel to the processing liquid suction means and has a low processing liquid suction means side. A liquid processing apparatus, wherein a liquid is formed. 11. The liquid processing apparatus according to claim 9, wherein, between the processing liquid suction means and the cleaning liquid supply means on the liquid processing surface, it is parallel to the processing liquid suction means protruding toward the substrate to be processed. A liquid processing apparatus, wherein a convex portion is formed. 12. The liquid processing apparatus according to claim 10 or 11, wherein the cleaning liquid supply means includes cleaning liquid temperature adjusting means capable of adjusting the temperature of the cleaning liquid. 13. The liquid processing apparatus according to claim 1, wherein the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means, and the processing liquid supply means. Processing liquid flow rate detecting means for detecting the flow rate of the processing liquid to be supplied, suction amount adjusting means for adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, and flow rate of the processing liquid sucked by the processing liquid suction means Control for controlling the processing liquid flow rate adjusting means and the suction amount adjusting means on the basis of the suction amount detecting means for detecting the processing liquid, the detection information of the processing liquid flow rate detecting means and the suction amount detecting means, and information stored in advance. A liquid processing apparatus comprising: 14. The liquid processing apparatus according to claim 9, wherein the processing liquid flow rate adjusting means capable of adjusting the flow rate of the processing liquid supplied by the processing liquid supply means, and the processing liquid supply means. Processing liquid flow rate detecting means for detecting the flow rate of the processing liquid to be supplied, suction amount adjusting means for adjusting the flow rate of the processing liquid sucked by the processing liquid suction means, and flow rate of the processing liquid sucked by the processing liquid suction means Suction amount detecting means for detecting the flow rate, cleaning liquid flow rate adjusting means capable of adjusting the flow rate of the cleaning liquid supplied by the cleaning liquid supply means, cleaning liquid flow rate detecting means for detecting the flow rate of the cleaning liquid supplied by the cleaning liquid supply means, and the processing described above. Based on the detection information of the liquid flow rate detecting means, the suction amount detecting means, and the cleaning liquid flow rate detecting means, and the information stored in advance, the processing liquid flow rate adjusting means, the suction amount adjusting means, and the cleaning liquid flow rate adjusting means. Liquid processing apparatus characterized by comprising a control means for controlling the means. 15. The liquid processing apparatus according to claim 13 or 14, wherein the control means causes the processing liquid to be sucked by the processing liquid suction means so that the processing liquid does not flow out from the liquid processing surface, and
A liquid processing apparatus, wherein the suction flow rate adjusting means is controllably formed so as to have a predetermined value that does not suck air into the processing liquid suction means. 16. The liquid processing apparatus according to claim 13, wherein an interval detecting unit that detects a distance between the liquid processing surface of the nozzle head and the surface of the substrate to be processed, and the nozzle head can be moved up and down. A liquid processing apparatus, wherein the control means controls the elevating means based on a detection signal from the interval detecting means and information stored in advance.