JP2003234436A - Matrix board and resin molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a map board in which an improvement has been made in the flow of a molding resin through a slit hole between one surface of a board on which semiconductor chips are mounted in a matrix shape and the other surface of the board to which the semiconductor chips are wiring connected. <P>SOLUTION: The slit hole 3 is provided such that is intersects as area of the board where the chips are mounted. The semiconductor chips 2 are wiring connected to the board through the slit hole 3. A through hole 5 is provided on unnecessary part 4 of the board which is to be cut for removal after resin molding. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matrix substrate in which semiconductor chips are mounted in a matrix on one surface of the substrate and terminal connecting portions are formed on the other surface, and a resin molding method using the matrix substrate. .

[0002]

2. Description of the Related Art A BOC is an example of a semiconductor package.
When resin-molding a (Board / On / Chip) type package, semiconductor chips are mounted in a matrix on one surface of a substrate (resin substrate or the like) and the other is formed in order to improve productivity and keep molding quality constant. The molded product having the terminal connection portion formed on its surface is carried into a molding die and clamped, and one surface on which the semiconductor chip is mounted is collectively resin-molded. After the resin molding, a semiconductor device is manufactured by dicing a molded product into individual pieces for each semiconductor chip by a dicing device.

FIG. 3 illustrates a BOC type semiconductor package. Semiconductor chips 52 are mounted in a matrix on one surface of a resin substrate 51 which is a molded product. Wire bonding is performed from the slit hole 53 provided in the central portion of each semiconductor chip 52 to the other surface, and the electrode portion of the semiconductor chip 52 and the terminal connection surface are electrically connected by the bonding wire 54. Connection pads are formed on the other surface of the resin substrate 51, and connection terminals 55 such as solder balls are formed after resin molding.
Are connected.

As shown in FIG. 4, the resin substrate 51 is carried in and clamped in, for example, a molding die in which a cavity recess 57 is formed in a lower die 56, and a mold resin 58 is filled in the cavity recess 57 to mold the resin. To be done. A plurality of semiconductor chips 52 mounted on one surface of the resin substrate 51 are collectively resin-molded, and each semiconductor chip 52 is
The molding resin 58 is also filled in the wiring portion through the slit hole 53 between the resin substrate 51 and the resin substrate 51. In this case, the molding resin 58 is used as shown in FIG.
To the cavity recess 60 on the upper die 59 side, the slit hole 5
3 and the semiconductor chip 52 are filled through a gap 53a formed between them. After resin molding, the molded product (resin substrate 51) is diced for each semiconductor chip 52 and cut into individual pieces to manufacture a semiconductor device. 3 and 4, C indicates a dicer cut line.

[0005]

In the resin mold area of the resin substrate 51, one surface on which the semiconductor chip 52 is mounted (the cavity recess 57 side of the lower mold 56) can secure a sufficient resin path, but The surface (the cavity concave portion 60 side of the upper mold 59) has a narrow resin path and a small thickness, and moreover, one surface side is filled with the other surface side, so that the molding resin 55 is easily hardened midway due to the filling time difference. Flowability tends to deteriorate. In addition, the bonding wire 54 is provided in the slit hole 53.
However, the wire flow easily occurs due to the penetration of the mold resin 55, which has been accelerated in curing. Particularly, from the cavity recess 57 on the lower mold 56 side to the cavity recess 60 on the upper mold 59 side.
Since the resin path through which the mold resin 58 flows is narrowed to the gap 53a, depending on the semiconductor chips 52 arranged in a matrix, there is a possibility that wire flow may occur or an unfilled portion of the mold resin 58 may occur. It was

The object of the present invention is to solve the above-mentioned problems of the prior art, and to mount a semiconductor chip on one surface of the substrate in a matrix form and to connect the semiconductor chip to the other surface through a slit hole. It is an object of the present invention to provide a matrix substrate in which the flowability of the matrix substrate is improved and a resin molding method in which the molding quality of the matrix substrate is improved.

[0007]

In order to solve the above problems, the present invention has the following constitution. That is, in a matrix substrate in which semiconductor chips are mounted in a matrix on one surface of the substrate and terminal connection portions are formed on the other surface, the semiconductor chips are crossed with the chip mounting area of the substrate on which the semiconductor chips are mounted. Is provided with a slit hole for wiring connection with the substrate, and a through hole is provided in an unnecessary portion of the substrate that is cut and removed after resin molding. Further, the slit hole is formed so as to extend outward from the chip mounting area, and a gap is formed between the slit hole and the semiconductor chip. Further, the through hole is formed so as to communicate the cavity recesses formed in the upper mold and the lower mold.

Further, semiconductor chips are mounted in a matrix on one surface of the substrate, and the matrix substrate having terminal connection portions formed on the other surface is carried into a mold and clamped to accommodate the semiconductor chips. The mold resin is filled into the cavity concave portion on the other side through the slit hole formed from the cavity concave portion on the one side and the through hole formed in the unnecessary portion of the substrate that is cut and removed after resin molding. The semiconductor chip and the wiring portion formed through the slit hole are collectively resin-molded. Further, the cavity concave portion formed on the other surface facing the slit hole of the substrate is formed so as to communicate between the respective semiconductor chips across the cutting line of the matrix substrate, and corresponds to the respective semiconductor chips. It is characterized in that the molding resin is collectively filled through the formed slit holes and through holes.

[0009]

Preferred embodiments of the matrix substrate and the resin molding method according to the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, a matrix substrate for a BOC type semiconductor package and a resin molding method using the matrix substrate will be described.
1 is a top view showing a state where a BOC type resin substrate is clamped by a molding die, and FIG. 2 is a cross-sectional explanatory view of the molding die of FIG.

First, the schematic structure of the matrix substrate 1 will be described with reference to FIGS. In FIG.
1 is a molded product, and a BOC type matrix substrate (resin substrate or the like) is used. The matrix substrate 1 has semiconductor chips 2 mounted in a matrix on one surface thereof, and has a terminal connection surface formed on the other surface thereof. Semiconductor chips 2 are mounted in a matrix on one surface of the matrix substrate 1.

Denoted at 3 is a slit hole for each semiconductor chip 2.
Is formed so as to intersect with the chip mounting area on which is mounted. The semiconductor chip 2 and the matrix substrate 1 are connected by wire bonding through the slit holes 3. The slit holes 3 are formed so as to extend outward from the chip mounting area. Further, in FIG. 1, a through hole 5 is provided in an unnecessary portion 4 of the matrix substrate 1 (a portion surrounded by a dicer cut line C that is cut and removed after resin molding). The through hole 5 is formed so as to communicate with the cavity recesses 14 and 13 of the upper mold 11 and the lower mold 12 (see FIG. 2). Dicer cut line C
Shows a cutting line by which the matrix substrate 1 is singulated by a dicing device after resin molding.

In FIG. 2, each semiconductor chip 2 is wire-bonded to the other surface through a slit hole 3 provided at the center of the semiconductor chip 2 so that the electrode portion of the semiconductor chip 2 and the terminal connection surface are separated from each other. It is electrically connected by a bonding wire 7. Connection pads are formed on the other surface of the matrix substrate 1, and connection terminals 8 such as solder balls shown by broken lines are connected after the resin molding.
The bonding wire 7, which is a wiring portion between the semiconductor chip 2 and the matrix substrate 1, is also resin-molded. At this time, the molding resin 9 is applied to the matrix substrate 1 and the gaps 3 a formed between the semiconductor chip 2 and the matrix substrate 1.
Is filled through the through hole 5 provided in the unnecessary portion 4.

Next, a schematic structure of the molding die is shown in FIG.
Will be described with reference to. Reference numeral 10 denotes a molding die, which has an upper die 11 and a lower die 12. The molding target 1 and the molding resin (resin tablet, etc.) are carried into the molding die 10, and the molding die 10 clamps them and collectively molds one surface on which the semiconductor chip 2 is mounted with the resin. . A cavity recess 13 for housing the semiconductor chip 2 is formed on the lower die 12 side of the molding die 10, and a cavity recess 14 for housing the wiring portion corresponding to the slit hole 3 is formed on the upper die 11 side. .

The lower die 12 is provided with support pins 15 for supporting the matrix substrate 1. Support pin 15
Is a fixed pin 15a fitted in the bottom of the lower mold 12, and the tip side of the support pin 15 is the cavity recess 13
Is projected on. The support pins 15 are adapted to abut against and support the substrate surface with the matrix substrate 1 mounted on the lower die 12. When the support pin 15 is the fixed pin 15a, it is provided so as to support the unnecessary portion 4 (the area surrounded by the dicer cut line C) of the matrix substrate 1 which is cut and removed after the resin molding. A tapered surface may be formed on the outer peripheral surface of the fixed pin type support pin 15 on the front end side so that the outer diameter becomes smaller toward the front end. With this tapered surface, the molded product can be released smoothly after the resin molding.

When the support pin 7 is the movable pin 15b, the support pin 7 can be provided within the range where it does not interfere with the semiconductor chip 2 without being restricted by the above restrictions. When the support pin 15 is the movable pin 15b, it is necessary to move from the support position in contact with the substrate to the retracted position flush with the cavity recess 13 until the cavity recess 13 is completely filled with the mold resin 9. .

Further, the lower mold 12 is provided with a pot (not shown), and a plunger is provided in the pot so as to be vertically movable. A mold resin (resin tablet or the like) is loaded in the pot, and the mold resin is pressure-fed to the cavity recess 13 by the plunger. As shown in FIG. 1, the mold resin 9 is filled from the cavity recess 13 on the lower mold 12 side into the cavity recess 14 on the upper mold 11 side through the gap 3a of the slit hole 3 and the through hole 5. It is desirable to provide the mold gate so that the injection direction of the mold resin is the longitudinal direction of the cavity recess 14. In FIG. 1, it is preferable to provide a gate on the lower mold 12 side and an air vent on the upper mold 11 side. Further, as shown in FIG. 2, the cavity recesses 14 may not be provided at one location on one chip, and the cavity recesses 14 may be connected to each other.

In FIG. 2, a release film 16 may be stretched on the clamp surface of the upper mold 11 to protect the terminal connection surface. The release film 16 has heat resistance to withstand the heating temperature of the molding die 10, is easily peeled off from the die surface, and has flexibility and extensibility, such as PTFE and E.
TFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride and the like are preferably used. The release film 16 is suction-held by sucking air from a suction hole (not shown) formed on the parting surface of the upper mold 11. The release film 16 may be either a long one wound between reels, which is continuously supplied to the molding die 10 and wound up, or one which is cut into strips in advance. Is also good.

Explaining the resin molding method here, the matrix substrate (resin substrate or the like) 1 on which the semiconductor chip 2 is mounted on one surface and the molding resin (resin tablet or the like) are carried into the molding die 10 and clamped. . Then, while the flatness of the substrate is maintained by supporting one surface of the matrix substrate 1 carried into the molding die 10 by the support pins 15 provided in the cavity concave portion 13, the plunger is operated and the molding resin 9 is removed. The cavity recess 13 is filled through the runner gate 17 of the lower die 12 and one surface on which the semiconductor chip 2 is mounted is collectively resin-molded. Further, the cavity recess 13 on the lower die 12 side is filled into the cavity recess 14 on the upper die 11 side through the gap 3 a of the slit hole 3 and the through hole 5. The resin-molded molded product is taken out from the molding die 10 and then cut into individual pieces for each semiconductor chip 2 along the dicer cutting line C by a dicing device.

The cavity recess 14 formed on the other surface (on the side of the upper mold 11) of the matrix substrate 1 facing the slit hole 3 is located between the semiconductor chips 2 across the dicer cut line C of the matrix substrate 1. May be formed to communicate with each other. In this case, the mold resin 9 is collectively filled through the gap 3a of the slit hole 3 and the through hole 5 formed corresponding to each semiconductor chip 2.

If the matrix substrate 1 is used, a slit hole 3 for connecting the semiconductor chip 2 and the substrate by wiring is provided so as to intersect the chip mounting area of the substrate on which the semiconductor chip 2 is mounted, and cut after resin molding. Since the through hole 5 is provided in the unnecessary portion 4 of the substrate to be removed, the gap 3a of the slit hole 3 and the through hole 5 can be used as a resin path during resin molding, so that the mold resin 9 can be applied to both surfaces of the substrate. It is possible to improve the flowability, particularly the flowability of the resin to the wiring portion. In addition, the matrix substrate 1 is carried into the molding die 10 and clamped, and from the cavity concave portion 13 on one side of the substrate in which the semiconductor chip 2 is accommodated to the cavity 3a of the slit hole 3 and the cavity on the other side of the substrate through the through hole 5. Since the recess 14 is filled with the molding resin 9 and the semiconductor chip 2 and the wiring portion are collectively resin-molded, the flowability of the molding resin to both surfaces of the substrate is good, and particularly to the narrow wiring portion formed in the slit hole 3. Since the filling can be done smoothly, the molding quality can be improved.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and whether or not the mold die 10 is provided with the release film 16 is arbitrary. However, the cavity recess for housing the semiconductor chip 2 may be formed in either the upper mold 11 or the lower mold 12, and it is needless to say that many modifications can be made without departing from the spirit of the invention.

[0022]

When the matrix substrate according to the present invention is used, a slit hole for wiring the semiconductor chip and the substrate is provided so as to intersect the chip mounting area of the substrate on which the semiconductor chip is mounted. Since the through hole is provided in the unnecessary portion of the substrate to be cut and removed, the gap of the slit hole and the through hole can be used as the resin path during resin molding. The flowability of the mold resin to the part can be improved. Further, according to the resin molding method of the present invention, the matrix substrate is carried into a molding die and clamped, and the cavity of one side of the substrate in which the semiconductor chip is accommodated is recessed from the cavity concave portion and the through hole of the substrate. Fill the cavity recess on the other side with mold resin,
Since the semiconductor chip and the wiring part are collectively resin-molded, the flowability of the molding resin to both sides of the substrate is good, and especially the narrow wiring part formed in the slit hole can be smoothly filled, improving the molding quality. You can

[Brief description of drawings]

FIG. 1 is a top view showing a state where a BOC type matrix substrate is clamped by a molding die.

FIG. 2 is a cross-sectional explanatory view of the molding die of FIG.

FIG. 3 is a top view showing a state where a conventional BOC type matrix substrate is clamped by a molding die.

4 is a cross-sectional explanatory view of the molding die of FIG.

[Explanation of symbols]

1 Matrix substrate 2 semiconductor chips 3 slit holes 3a gap 4 unnecessary parts 5 through holes 7 Bonding wire 8 connection terminals 9 Mold resin 10 Mold dies 11 Upper mold 12 Lower mold 13, 14 Cavity recess 15 Support pin 15a Fixed pin 15b movable pin 16 release film 17 Lanna Gate

Claims (5)

[Claims] 1. A matrix substrate in which a plurality of semiconductor chips are mounted in a matrix on one surface of a substrate and terminal connection portions are formed on the other surface, in a chip mounting area of the substrate on which the semiconductor chips are mounted. A matrix substrate, wherein slit holes are provided so as to intersect with each other to connect the semiconductor chip and the substrate by wiring, and through holes are provided in unnecessary portions of the substrate that are cut and removed after resin molding. 2. The matrix substrate according to claim 1, wherein the slit hole is formed to extend outward from a chip mounting area, and a gap is formed between the slit hole and the semiconductor chip. 3. The matrix substrate according to claim 1, wherein the through hole is formed so as to communicate the cavity recesses formed in the upper mold and the lower mold. 4. A matrix substrate having a plurality of semiconductor chips mounted in a matrix on one surface of a substrate and having terminal connection portions formed on the other surface thereof is carried into a molding die and clamped to accommodate the semiconductor chips. Mold resin is injected into the cavity recess on the other side through slit holes formed from the cavity recess on the one side that intersects the chip mounting area of the substrate and through holes formed in unnecessary parts of the substrate that are cut and removed after resin molding. A resin molding method, comprising: filling and resin-molding a wiring portion formed through a semiconductor chip and a slit hole in a lump. 5. A cavity recess formed on the other surface of the substrate facing the slit hole of the substrate is formed so as to communicate between the semiconductor chips across the cutting line of the matrix substrate. The resin molding method according to claim 4, wherein the molding resin is collectively filled through the slit hole and the through hole formed corresponding to the above.