JP2003304139A - Package for surface acoustic wave branching filter and method for manufacturing the same package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a surface acoustic wave branching filter capable of reducing the influence of inter-electronic component interference, and reducing the formation areas of phase matching circuit electrodes. <P>SOLUTION: In a package 1 for a surface acoustic wave branching filter where a surface acoustic wave filter F is mounted on a dial touch layer 3, phase matching circuit electrodes 34 and 35 are formed at the lower part of the dial touch layer 3 and at the upper part of a bottom layer 10 so as not to be overlapped with a land electrode 10a of the bottom layer 10 in the lamination direction. Thus, the phase matching circuit electrodes 34 and 35 can hardly interrupt with any other electronic component, and the performance of the surface acoustic wave branching filter can be improved. Furthermore, the phase matching circuit electrodes 34 and 35 are formed as spiral patterns. Thus, it is possible to narrow the line interval t of the phase matching circuit electrodes 34 and 35 without weakening any magnetic field generated in the surrounding of the phase matching circuit electrodes 34 and 35, and to reduce a surface acoustic wave branching filter package 1. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a duplexer used in mobile communication equipment such as a mobile phone,
In particular, the present invention relates to a surface acoustic wave demultiplexer package that carries a surface acoustic wave filter (SAW filter).

[0002]

2. Description of the Related Art Mobile communication devices such as mobile phones, which have become widespread in recent years, generally have a structure in which transmission and reception are shared by a single antenna. The mobile communication device having such a configuration has a built-in demultiplexer (duplexer) that demultiplexes each signal by utilizing the difference between the frequencies of the transmission signal and the reception signal. The demultiplexer is provided with a filter that distinguishes the frequency of the transmission signal from the frequency of the reception signal. Various types of filters have been proposed for the filters arranged in the demultiplexer, and in recent years, in particular, a surface acoustic wave filter (SAW filter) having frequency characteristics with a narrow bandwidth has attracted attention. There is.

As shown in FIG. 12, a surface acoustic wave demultiplexer A'on which this surface acoustic wave filter is arranged has a surface acoustic wave filter F and a surface acoustic wave carrying the surface acoustic wave filter F as shown in FIG. It is composed of a duplexer package P.

A general surface acoustic wave demultiplexer package P includes a wave transmitting / receiving electrode, a ground electrode, and a common electrode connected to an antenna so that an insulating portion q made of a glass ceramic material is interposed. Bottom layer a, a phase matching circuit layer b provided with a phase matching circuit electrode for matching the phase of the surface acoustic wave filter F, and a surface acoustic wave filter F.
There are formed a die attach layer c having a die attach electrode for mounting and a bonding pad layer e having a bonding pad electrode electrically connected to the surface acoustic wave filter F via a wire d.

Further, a cap i is provided on the upper surface of the surface acoustic wave demultiplexer package P for isolating the cavity g from the external environment. In order to irremovably adhere the body P of the surface acoustic wave demultiplexer package and the cap i to each other, the uppermost surface of the package P for the surface acoustic wave demultiplexer is metalized to form a seal ring layer h. The Au-Sn alloy or solder (not shown) attached to i is adhered to the upper surface of the seal ring layer h. Further, among the above-mentioned layers, conductive vias j (or conductive through holes) that electrically connect electrodes formed in each layer are formed between predetermined layers. Furthermore, each electrode of the bottom layer a is overcoated glass (OC
G) Coated with u.

The surface acoustic wave demultiplexer package P having the above structure is manufactured by the following manufacturing method. First, a bottom layer including land electrodes and the like on the upper surfaces of a plurality of thin sheets made of glass ceramic material,
A phase matching circuit layer that matches the phase of the surface acoustic wave filter F, a die attach layer that mounts the surface acoustic wave filter F, and a bonding pad layer that is electrically connected to the filter F are formed by patterning. In general, each pattern sheet in which each layer is patterned is pressure-bonded and laminated, and the laminated body is fired to obtain a surface acoustic wave demultiplexer package P. If conductive vias j and the like are required, each layer is formed at a predetermined position when patterning.

By the way, as shown in FIG. 14, the duplexer prevents and reduces mutual interference between the surface acoustic wave filters F and F having two different pass frequency bands. , The phase matching circuit electrode b1 is formed,
It is necessary that the impedance of the other filter F be infinite and the reflection coefficient be approximately 1.

As shown in FIG. 13, a meandering pattern is adopted for the phase matching circuit electrode b1 provided on the phase matching circuit layer b. According to this meander pattern, the input / output electrodes bx and by can be formed on the same plane of the sheet, and the package P
This is because the overall height can be reduced.

[0009]

By the way, as the mobile communication equipment is further miniaturized, the influence of the interference between the electronic parts arranged inside is further increased and the sound quality is deteriorated. The problem of. This also applies to the above-mentioned surface acoustic wave demultiplexer, and as the size of the phase matching circuit electrodes formed in the meander pattern becomes narrower as the size is reduced, as shown in FIG. 11B. To
Since the current directions of the adjacent electrodes are opposite to each other, the magnetic fields generated around the electrodes act in a weakening direction. In such a case, it is necessary to lengthen the line length of the phase matching circuit electrode in order to obtain desired characteristics, and as a result, the formation area of the phase matching circuit electrode increases. Therefore, according to such a configuration, there is a limit in reducing the size of the surface acoustic wave demultiplexer. Furthermore, due to the miniaturization of the surface acoustic wave demultiplexer body, the phase matching circuit electrode and the surface acoustic wave filter, as well as the phase matching circuit electrode and the transmitting / receiving electrode, etc., will come close to each other, so that interference that occurs between them will occur. Noise may be generated due to the influence of.

Therefore, the present invention provides a surface acoustic wave demultiplexer package and a method of manufacturing the same, which can reduce the formation area of the phase matching circuit electrodes and can reduce the influence of interference between electronic components. With the goal.

[0011]

According to the present invention, a phase matching circuit is built-in, a die attach layer having a die attach electrode is formed on an upper surface, and a land electrode having at least a transmitting electrode and a receiving electrode, and A base layer having a bottom surface provided with a ground electrode formed on the lower surface, on the die attach layer,
In a surface acoustic wave demultiplexer package in which a single or a plurality of surface acoustic wave filters are mounted, the phase matching circuit electrode provided in the phase matching circuit layer of the phase matching circuit is a spiral pattern. A characteristic surface acoustic wave demultiplexer package.

As described above, by forming the phase matching circuit electrodes in the spiral pattern, the current directions of the adjacent electrodes are the same, so that the magnetic fields generated around the electrodes do not weaken each other. Therefore, even if the line spacing is formed narrower than the conventional configuration, it is possible to reduce the electrode forming area without degrading the performance of the duplexer.

The phase matching circuit layer of the phase matching circuit is
You may make it comprised by the several partial phase matching spiral layer laminated | stacked on the top and bottom, and mutually connected.
With such a configuration, it is possible to form the phase matching circuit layer without complicating it, and it is possible to prevent the phase matching circuit layer from expanding in the horizontal direction.

Furthermore, the base layer includes a bottom layer, a first insulating layer formed on the upper surface of the bottom layer, a first partial phase matching spiral layer formed on the upper surface of the first insulating layer, and 1
A second insulating layer formed on the upper surface of the partial phase matching spiral layer, and a second insulating layer formed on the upper surface of the second insulating layer and connected to the first partial phase matching spiral layer via a conductive through hole or a conductive via. A two-part phase matching spiral layer and a third part formed on the upper surface of the second part phase matching spiral layer
An insulating layer and a die attach layer formed on the upper surface of the third insulating layer, and the land electrode of the bottom layer is
A configuration is proposed in which the first partial phase matching circuit electrode of the first partial phase matching spiral layer and the second partial phase matching circuit electrode of the second partial phase matching spiral layer are formed so as not to overlap in the stacking direction. . With this configuration, the phase matching circuit electrode (partial phase matching circuit electrode)
The influence of interference between the surface acoustic wave filter and the surface acoustic wave filter can be reduced, and the phase matching circuit layer can be prevented from expanding in the horizontal direction.

Further, according to the present invention, a bottom layer pattern sheet in which a bottom layer including a land electrode having at least a wave-transmitting electrode and a wave-receiving electrode and a ground electrode is formed on a plurality of thin sheets made of a ceramic material. And a phase matching circuit layer pattern sheet in which a phase matching circuit layer including a phase matching circuit electrode having a spiral pattern is formed on the thin sheet, and a die attach layer including a die attach electrode for mounting a surface acoustic wave filter. The die attach layer pattern sheet on which is formed, in order from the bottom layer to the bottom layer pattern sheet, the phase matching circuit layer pattern sheet, the die attach layer pattern sheet, the land electrode of the bottom layer pattern sheet and the phase matching circuit layer pattern sheet phase. Make sure that the matching circuit electrodes are pressed and laminated in sequence so that they do not overlap in the stacking direction. DOO is formed, it is a manufacturing method of the surface acoustic wave absorber package and firing the laminate including the substrate pattern sheet at least.

As described above, the phase matching circuit layer pattern sheet is positioned between the bottom layer pattern sheet and the die attach layer pattern sheet, and substantially in the center of the base layer pattern sheet, that is, the land electrode and the phase matching circuit. The pattern sheets are pressure-bonded to each other so that they do not overlap with each other in the stacking direction, and then fired to minimize the effect of interference between the phase matching circuit electrodes and surface acoustic wave filters. It becomes possible to do. Therefore, it is possible to preferably manufacture the surface acoustic wave demultiplexer package including the high-performance phase matching circuit electrode.

Here, when the above-mentioned base layer pattern sheets are laminated by pressure bonding, the phase matching circuit electrodes of the phase matching circuit layer are pressed by the upper and lower sheets, so that the phase matching circuit electrodes are oriented in the sheet surface direction. The area of the conductive portion may be expanded by rolling and the line spacing may be narrowed accordingly. In this way, if the line spacing changes before and after the crimping and stacking process, the optimum phase matching characteristic will be lost and the quality of the product will deteriorate.

Therefore, a protective layer made of the same material as the ceramic material of the thin film sheet is formed on the non-conductive portion of the phase matching circuit layer pattern sheet before pressure-bonding and laminating a plurality of pattern sheets having predetermined electrodes formed thereon. A method of manufacturing a package for a surface acoustic wave demultiplexer is proposed. In this way, the protective layer is formed on the non-conductive portion of the phase matching circuit layer pattern sheet, and the ceramic material is pre-filled between the electrodes, so that the conductive sheet is pressed against the upper and lower sheets. It is possible to avoid an increase in the formation area of the portion and a narrowing of the line spacing accompanying this. Furthermore, since the protective layer is made of the same material as the ceramic material of the thin sheet, the interlayer adhesion does not decrease during firing. Therefore, it can be suitably integrally molded without problems such as peeling.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a surface acoustic wave demultiplexer package 1 according to the present invention will be described with reference to the accompanying drawings. As shown in FIGS. 1 and 2, the surface acoustic wave demultiplexer A
Is composed of a surface acoustic wave filter F and a surface acoustic wave demultiplexer package 1 carrying the surface acoustic wave filter F.

As shown in FIG. 2, the surface acoustic wave demultiplexer package 1 according to the present invention includes a plurality of insulating layers 15a made of a glass ceramic material containing aluminum oxide, borosilicate glass, and a binder as main components. ~ 15e
And a plurality of conductive layers formed with an electrode pattern (strip pattern) formed of a predetermined electrode (strip line) laminated such that the insulating layers 15a to 15e are interposed.

The plurality of conductive layers having the predetermined electrodes include a base layer 12, a bonding pad layer 4 having a bonding pad electrode 4a electrically connected to the surface acoustic wave filter F via a wire 6, and a cap 9. Au-fixing
And a seal ring layer 8 that enhances the adhesive strength of a Sn alloy (not shown). Further, the base layer 12 has the phase matching circuit layer 2 therein and has a die attach electrode 3 on the upper surface.
The die attach layer 3 having a (see FIG. 5) and the bottom layer 10 having the land electrode 10a (see FIG. 6) and the ground electrode 10b (see FIG. 6) on the lower surface. by the way,
Each electrode of the bottom layer 10 is an overcoat glass (OC
G) Coated with 65.

Next, the above layers will be sequentially described. A seal ring layer 8 (see FIG. 3) is formed (metallized) on the uppermost layer of the body 1 of the surface acoustic wave demultiplexer package 1. Here, a cap 9 for shutting off a cavity 7 and an external environment, which will be described later, is brazed and fixed to the uppermost position of the body 1 of the surface acoustic wave demultiplexer package. Since the material has a property that sufficient adhesive strength cannot be obtained, the seal ring layer 8 is formed to secure a desired adhesive strength. For the cap 9, a metal material or a ceramic material of the same material as the insulating layers 15a to 15e of the body 1 of the surface acoustic wave demultiplexer package 1 is preferably used.

A fifth insulating layer 15e is formed under the seal ring layer 8. Then, the fifth insulating layer 15
The bonding pad layer 4 is formed below the e layer and at substantially the same height as the upper surface of the surface acoustic wave filter F described later. The bonding pad layer 4 includes a bonding pad electrode 4a (see FIG. 4) for electrically connecting to the surface acoustic wave filter F via the wire 6. Further, a plurality of terminals for exchanging electric signals with the base layer 12 described later are provided via the conductive vias 5. As a means for electrically connecting desired layers to each other, a structure having conductive through holes may be used instead of the structure having the conductive vias 5.

Here, the surface acoustic wave filter F includes the base layer 1
It is mounted on the upper surface of the cavity 2 in the cavity 7 surrounded by the seal ring layer 8 and the bonding pad layer 4. In the present embodiment, the surface acoustic wave filter F is a single one-chip type, but instead of such a configuration, it comprises a surface acoustic wave filter for transmission and a surface acoustic wave filter for reception. It may have a configuration.

Next, the base layer 12 will be described. The base layer 12 is formed under the fourth insulating layer 15d formed under the bonding pad layer 4. The base layer 12 includes a die attach layer 3 and a third insulating layer 1 in order from the top.
5 c, the phase matching circuit layer 2, the first insulating layer 15 a, and the bottom layer 10.

The surface acoustic wave filter F is placed at the center of the die attach layer 3 located on the uppermost layer of the base layer 12, and the die attach electrode 3a for electrically connecting to the filter F (see FIG. 5). ) Is formed. On the other hand, the base layer 1
In the bottom layer 10 located at the lowermost layer of 2, the transmitting electrodes 31,
Receiving electrode 32 and common electrode 33 connected to the antenna
A land electrode 10a composed of and a ground electrode 10b are provided (see FIG. 6).

Next, the phase matching circuit layer 2 which is the main part of the present invention will be described. In the present embodiment example, the phase matching circuit layer 2 is composed of a first partial phase matching spiral layer 2a and a second partial phase matching spiral layer 2b. These partial phase matching spiral layers 2a and 2b are located at the central position of the base layer 12, that is, below the die attach layer 3,
In addition, the first partial phase matching spiral layer 2a is formed below the third insulating layer 15c and is formed above the bottom layer 10, and the second partial phase matching spiral layer 2a is formed below the first partial phase matching spiral layer 2a. The insulating layer 15b is formed, and the second partial phase matching spiral layer 2b is formed below the second insulating layer 15b and above the first insulating layer 15a. Here, the land electrode 10a is formed so as not to overlap with the first partial phase matching circuit electrode 34 provided in the partial phase matching spiral layer 2a in the stacking direction. Further, the land electrode 10a is arranged so as not to overlap with the second partial phase matching circuit electrode 35 provided in the second partial phase matching spiral layer 2b in the stacking direction. Therefore, the interference between the phase matching circuit layer 2 and other electronic components such as the surface acoustic wave filter F is minimized.

The first partial phase matching circuit electrode 34 and the second partial phase matching circuit electrode 35 are formed in a spiral pattern as shown in FIGS. With such a configuration, since the current directions of the adjacent electrodes are the same (see FIG. 11A), the magnetic fields generated around the electrodes do not weaken each other, and the line spacing can be narrowed. . In addition, there is little possibility of performance deterioration due to interference between the electrodes. The electrodes are composed of strip lines.

Here, FIG. 8A shows the relationship between the line spacing t (see FIG. 7B) of the phase matching circuit electrodes 34 and 35 (spiral pattern) of the present invention and the line length of the electrodes, and FIG. 13 is an experimental result showing the relationship between the line spacing t ′ (see FIG. 13) of the phase matching circuit electrode b1 (meaner pattern) and the line length. Each experiment was performed with the phase matching circuit electrodes 34, 35, b1.
The line width z is kept constant, the line intervals t and t ′ are changed stepwise, and the line length satisfying the predetermined phase displacement condition in that case is confirmed. The line width z is always 100 μm, and the phase displacement condition is a frequency of 836.5M.
The condition was such that the phase of the circuit passing signal of Hz was displaced by 90 degrees. By the way, the line width z means the electrode width, and the line length is the substantial line length from the input electrodes 43, bx to the output electrodes 41, by.

As shown in FIGS. 8A and 8B, in the phase matching circuit electrodes 34 and 35 (spiral pattern) according to the present invention, the line length is substantially constant even when the line interval t is set narrow. is there. On the other hand, in the phase matching circuit electrode b1 (meaner pattern) having the conventional configuration, the line spacing t '
It can be seen that the line length remarkably increases when is set to be narrow. From this, by making the phase matching circuit electrodes 34 and 35 a spiral pattern, extension of the line length,
Also, it becomes possible to narrow the line spacing without deteriorating the phase matching performance. Therefore, with this structure, the electrode formation area can be reduced.

Incidentally, in the present invention, as shown in FIGS. 7A and 7B, the partial phase matching circuit electrodes 34 and 35 are formed on the partial phase matching spiral layers 2a and 2b, respectively. In this way, by having a two-layer structure,
It is possible to form the input / output electrodes 41 and 43 in the phase matching circuit without complicating them. That is, the output electrode 41 is formed near the outer edge of the upper first partial phase matching spiral layer 2a, and the input electrode 43 is formed near the outer edge of the lower second partial phase matching spiral layer 2b. Partial phase matching spiral layers 2a, 2b
Has a configuration in which the connection terminals 42a and 42b located at the center of the layer can be suitably connected by electrically connecting them. The partial phase matching spiral layers 2a and 2b
May have a single-layer structure.

Further, in the first partial phase matching circuit electrode 34, the output electrode 41 is connected to the surface acoustic wave filter F on the receiving electrode 32 side, and the connecting terminal 42a is the connecting terminal of the second partial phase matching circuit electrode 35. 42b is connected to each of the conductive vias 5. In the second partial phase matching circuit electrode 35, the input electrode 43 is connected to the common electrode 33 side, and the connection terminal 42b is connected to the connection terminal 42a by the conductive vias 5, respectively.

Next, a preferred method for manufacturing the above-mentioned surface acoustic wave demultiplexer package 1 according to the present invention will be described. The surface acoustic wave demultiplexer package 1 described above includes a plurality of thin sheets (thickness: 30) made of the above ceramic material.
To 500 μm), predetermined electrodes are formed by screen printing, which is a known technique, and these pattern sheets are laminated by pressure bonding and fired at 800 to 860 ° C.

Here, as shown in FIG. 9, as the plurality of pattern sheets, a land electrode 10a having a wave transmitting electrode 31, a wave receiving electrode 32, and a common electrode 33 connected to an antenna, and a ground electrode, respectively. Phase matching circuit layer 2 provided with bottom layer pattern sheet 51 on which bottom layer 10 with 10b and partial phase matching circuit electrodes 34, 35 are provided.
Phase matching circuit layer pattern sheets 52, 5 on which are formed
3, a base layer pattern sheet 12a including a die attach layer pattern sheet 54 on which the die attach electrode 3a for mounting the surface acoustic wave filter F is formed, a bonding pad layer pattern sheet 55 on which the bonding pad electrode 4a is formed, and a seal. There is a seal ring layer pattern sheet 56 on which the ring layer 8 is formed.

Then, each of the above-mentioned pattern sheets is arranged from the lower layer to the bottom layer pattern sheet 51, the phase matching circuit layer pattern sheets 52 and 53, and the die attach layer pattern sheet 5.
4, the bonding pad layer pattern sheet 55, and the seal ring layer pattern sheet 56 are sequentially pressure-bonded and laminated in this order, and the laminate is fired, whereby the surface acoustic wave demultiplexer package 1 is preferably manufactured. . Further, when laminating, the phase matching circuit electrodes 34 and 35 and the land electrode 10a are laminated so as not to overlap in the laminating direction. The base layer pattern sheet 12a becomes the above-mentioned base layer 12 by firing.

Here, the above-mentioned base layer pattern sheet 12a.
Phase-matching circuit electrodes 34, 3
Since No. 5 is pressed by the upper and lower sheets, each electrode may be rolled in the sheet surface direction to expand the conductive area, and the line spacing t of the electrodes may be narrowed accordingly. in this way,
If the line spacing t changes before and after the crimping and stacking process, the optimum phase matching characteristic is lost, and the quality of the product deteriorates.

Therefore, as shown in FIG. 10, a thin sheet is formed on the non-conductive portion 48 of the phase matching circuit layer pattern sheets 52 and 53 before the plurality of pattern sheets on which predetermined electrodes are formed are pressure-bonded and laminated. A method of manufacturing the surface acoustic wave demultiplexer package 1 in which the protective layer 50 is formed of the same material as the above ceramic material is proposed. As described above, the protective layer 50 is formed on the non-conductive portion 48 of the phase matching circuit layer pattern sheets 52 and 53, and the ceramic material is preliminarily filled between the electrodes. It is possible to avoid an increase in the area where the electrodes are formed and a reduction in the line spacing t due to this. Further, since the protective layer 50 is made of the same material as the thin sheet ceramic material, the interlayer adhesion does not decrease during firing. Therefore, there is no problem such as peeling, and it is possible to suitably perform integral molding.

The present invention is not limited to the above-mentioned embodiment, but can be variously modified.

[0039]

As described above, according to the present invention, the phase matching circuit electrode provided in the phase matching circuit layer of the phase matching circuit is a surface acoustic wave demultiplexer package having a spiral pattern. The current directions are the same, and the magnetic fields generated at the electrodes do not weaken each other. Therefore, the line length of the phase matching circuit electrode does not become long even if the line spacing of the phase matching circuit electrode becomes narrower with the miniaturization, and the phase matching performance does not deteriorate. Therefore, there is an excellent effect that the electrode forming area can be reduced.

Furthermore, for the surface acoustic wave demultiplexer, the phase-matching circuit layers of the phase-matching circuit are composed of a plurality of partial phase-matching spiral layers which are stacked one on top of the other through an insulating layer and which are mutually connected. When packaged,
The phase matching circuit can be formed without complicating it, the phase matching circuit layer can be prevented from expanding in the horizontal direction, and the surface acoustic wave demultiplexer package can be downsized. Become.

The base layer includes a bottom layer, a first insulating layer formed on the upper surface of the bottom layer, a first partial phase matching spiral layer formed on the upper surface of the first insulating layer, and the first insulating layer. A second insulating layer formed on the upper surface of the partial phase matching spiral layer;
A second partial phase matching spiral layer formed on the upper surface of the second insulating layer and connected to the first partial phase matching spiral layer through a conductive through hole or a conductive via; and a second partial phase matching spiral layer. The land electrode of the bottom layer is composed of a third insulating layer formed on the upper surface and a die attach layer formed on the upper surface of the third insulating layer, and the land electrode of the bottom layer is the first partial phase of the first partial phase matching spiral layer. Matching circuit electrode,
When the second partial phase matching circuit electrode of the second partial phase matching spiral layer is formed so as not to overlap in the stacking direction, the interference between the phase matching circuit layer and the surface acoustic wave filter or the like. Can be reduced, and the phase matching circuit layer can be prevented from expanding in the horizontal direction.

In the present invention, the land electrode of the bottom layer pattern sheet and the phase matching circuit electrode of the phase matching circuit layer pattern sheet are arranged in this order from the bottom layer to the bottom layer pattern sheet, the phase matching circuit layer pattern sheet, and the die attach layer pattern sheet. Is a method for manufacturing a surface acoustic wave demultiplexer package in which a base layer pattern sheet is formed by sequentially press-bonding so as not to overlap in the stacking direction, and a laminate including at least the base layer pattern sheet is fired. It is possible to preferably obtain the surface acoustic wave demultiplexer package in which the influence of the interference between the layer and the surface acoustic wave filter or the like is minimized.

Furthermore, in such a case, before laminating a plurality of pattern sheets on which a predetermined pattern is formed by pressure bonding, the same material as the ceramic material of the thin film sheet is formed on the non-conductive portion of the phase matching circuit layer pattern sheet. In the case where the protective layer is formed, it is possible to avoid an increase in the formation area of the conductive portion due to being pressed by the sheets on the upper and lower surfaces and a narrowing of the line spacing due to the increase.
Further, since the protective layer is made of the same material as the ceramic material of the thin sheet, there is an effect that it can be surely integrally formed during firing.

[Brief description of drawings]

FIG. 1 is a top view of a surface acoustic wave demultiplexer A. FIG.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a top view of a seal ring layer 8.

FIG. 4 is a top view of a bonding pad layer 4.

5 is a top view of a die attach layer 3. FIG.

FIG. 6 is a top view of the bottom layer 10.

FIG. 7A shows a first partial phase matching spiral layer 2a.
2B is a top view of the second partial phase matching spiral layer 2b. FIG.

FIG. 8A shows a phase matching circuit electrode 3 according to the present invention.
4B is an experimental result showing the relationship between the line spacing t and the line length in Nos. 4 and 35.
2 is an experimental result showing the relationship between the line spacing t ′ and the line length in No. 1;

FIG. 9 is an explanatory diagram of a method for manufacturing the surface acoustic wave demultiplexer package 1.

FIG. 10 is an enlarged vertical sectional view of phase matching circuit layer pattern sheets 52 and 53 on which a protective layer 50 is formed.

11A is a conceptual diagram showing a current direction in a spiral pattern, and FIG. 11B is a conceptual diagram showing a current direction in a meander pattern.

FIG. 12 is a vertical sectional view of a surface acoustic wave demultiplexer A ′ having a conventional configuration.

FIG. 13 is a top view of a conventional phase matching circuit electrode b1.

FIG. 14 is a configuration diagram showing a conventional surface acoustic wave demultiplexer A ′.

[Explanation of symbols]

F surface acoustic wave filter 1 Package for surface acoustic wave demultiplexer 2 Phase matching circuit layer 2a First partial phase matching spiral layer 2b Second partial phase matching spiral layer 3 Die attach layer 3a Die attach electrode 5 Conductive via 10 Bottom layer 10a Land electrode 10b ground electrode 12 base layers 12a Base layer pattern sheet 15a to 15b First to fifth insulating layers 31 Transmitting electrode 32 Receiving electrode 34 First Partial Phase Matching Circuit Electrode 35 Second Partial Phase Matching Circuit Electrode 48 Non-conductive part 50 Protective layer 51 Bottom layer pattern sheet 52,53 Phase matching circuit layer pattern sheet 54 Die attach layer pattern sheet

Claims (5)

[Claims] 1. A bottom layer having a phase matching circuit therein, a die attach layer having a die attach electrode formed on an upper surface thereof, a land electrode having at least a wave transmitting electrode and a wave receiving electrode, and a ground electrode. In a package for a surface acoustic wave demultiplexer in which a single or a plurality of surface acoustic wave filters are mounted on the die attach layer of a base layer formed on the lower surface of the base matching layer, the phase matching circuit of the phase matching circuit. A package for a surface acoustic wave demultiplexer, wherein the phase matching circuit electrode provided in the layer has a spiral pattern. 2. The elastic surface according to claim 1, wherein the phase-matching circuit layers of the phase-matching circuit are composed of a plurality of partial phase-matching spiral layers which are stacked one above the other and connected to each other. Package for wave demultiplexer. 3. A base layer, a bottom layer, a first insulating layer formed on the upper surface of the bottom layer, a first partial phase matching spiral layer formed on the upper surface of the first insulating layer, and the first insulating layer. A second insulating layer formed on the upper surface of the partial phase matching spiral layer;
A second partial phase matching spiral layer formed on the upper surface of the insulating layer and connected to the first partial phase matching spiral layer via a conductive through hole or a conductive via, and formed on the upper surface of the second partial phase matching spiral layer. And a die attach layer formed on the upper surface of the third insulating layer, and the land electrode of the bottom layer is a first partial phase matching circuit electrode of the first partial phase matching spiral layer. 3. The package for a surface acoustic wave demultiplexer according to claim 2, wherein the second partial phase matching circuit electrode of the second partial phase matching spiral layer is formed so as not to overlap in the stacking direction. 4. A bottom layer pattern sheet in which a bottom layer including a land electrode having at least a wave-transmitting electrode and a wave-receiving electrode and a ground electrode is formed on a plurality of thin sheets made of a ceramic material, and the thin layer. On the sheet, a phase matching circuit layer pattern sheet having a phase matching circuit electrode formed of a spiral pattern was formed, and a die attach layer having a die attach electrode for mounting a surface acoustic wave filter was formed. The die-attach layer pattern sheet and the bottom layer pattern sheet, the phase matching circuit layer pattern sheet, and the die attach layer pattern sheet in this order from the lower layer to the land electrode of the bottom layer pattern sheet and the phase matching circuit electrode of the phase matching circuit layer pattern sheet. So that they do not overlap in the stacking direction. Method of manufacturing a surface acoustic wave absorber package and firing at least containing laminate substrate pattern sheet. 5. A protective layer made of the same material as the ceramic material of the thin film sheet is formed on the non-conductive portion of the phase matching circuit layer pattern sheet before pressure-bonding and laminating a plurality of pattern sheets having predetermined electrodes formed thereon. The method for manufacturing a package for a surface acoustic wave demultiplexer according to claim 4, wherein.