JP2004083606A - Curable resin composition - Google Patents
Curable resin composition Download PDFInfo
- Publication number
- JP2004083606A JP2004083606A JP2002234227A JP2002234227A JP2004083606A JP 2004083606 A JP2004083606 A JP 2004083606A JP 2002234227 A JP2002234227 A JP 2002234227A JP 2002234227 A JP2002234227 A JP 2002234227A JP 2004083606 A JP2004083606 A JP 2004083606A
- Authority
- JP
- Japan
- Prior art keywords
- group
- curable composition
- silicon
- monomer unit
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229920000642 polymer Polymers 0.000 claims abstract description 50
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 37
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims abstract description 20
- 229920001577 copolymer Polymers 0.000 claims abstract description 17
- -1 alkyl methacrylate Chemical compound 0.000 claims description 125
- 239000000178 monomer Substances 0.000 claims description 65
- 239000000203 mixture Substances 0.000 claims description 47
- 239000003054 catalyst Substances 0.000 claims description 37
- 150000001875 compounds Chemical class 0.000 claims description 37
- 125000000524 functional group Chemical group 0.000 claims description 37
- 229910052710 silicon Inorganic materials 0.000 claims description 31
- 239000010703 silicon Substances 0.000 claims description 29
- 239000002184 metal Chemical class 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 230000001133 acceleration Effects 0.000 claims description 12
- 230000002378 acidificating effect Effects 0.000 claims description 9
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 8
- 230000000379 polymerizing effect Effects 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 150000001735 carboxylic acids Chemical class 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims 2
- 239000012974 tin catalyst Substances 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 27
- 238000003860 storage Methods 0.000 abstract description 20
- 238000000034 method Methods 0.000 description 57
- 229920001451 polypropylene glycol Polymers 0.000 description 30
- 239000003822 epoxy resin Substances 0.000 description 22
- 229920000647 polyepoxide Polymers 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 19
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 18
- 125000004432 carbon atom Chemical group C* 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 229920002050 silicone resin Polymers 0.000 description 11
- 150000001412 amines Chemical class 0.000 description 10
- 239000000565 sealant Substances 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 239000002253 acid Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229920000058 polyacrylate Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229910052726 zirconium Inorganic materials 0.000 description 7
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 6
- 239000012986 chain transfer agent Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000007524 organic acids Chemical class 0.000 description 5
- 125000005702 oxyalkylene group Chemical group 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000005370 alkoxysilyl group Chemical group 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- CBOIHMRHGLHBPB-UHFFFAOYSA-N hydroxymethyl Chemical compound O[CH2] CBOIHMRHGLHBPB-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 150000003755 zirconium compounds Chemical class 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 239000006261 foam material Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical compound [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 125000000963 oxybis(methylene) group Chemical group [H]C([H])(*)OC([H])([H])* 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002627 poly(phosphazenes) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 description 1
- QUEWJUQWKGAHON-UHFFFAOYSA-N (2-phenylphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1C1=CC=CC=C1 QUEWJUQWKGAHON-UHFFFAOYSA-N 0.000 description 1
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- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
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- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
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- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- UROKUKHYYXBCQE-UHFFFAOYSA-L dibutyl(diphenoxy)stannane Chemical compound C=1C=CC=CC=1O[Sn](CCCC)(CCCC)OC1=CC=CC=C1 UROKUKHYYXBCQE-UHFFFAOYSA-L 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- DIEUSOPNGAEVNO-UHFFFAOYSA-L dibutyltin(2+);3-oxobutanoate Chemical compound CC(=O)CC([O-])=O.CC(=O)CC([O-])=O.CCCC[Sn+2]CCCC DIEUSOPNGAEVNO-UHFFFAOYSA-L 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
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- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
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- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 150000002736 metal compounds Chemical class 0.000 description 1
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- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
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- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
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- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- ATZHWSYYKQKSSY-UHFFFAOYSA-N tetradecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C(C)=C ATZHWSYYKQKSSY-UHFFFAOYSA-N 0.000 description 1
- XZHNPVKXBNDGJD-UHFFFAOYSA-N tetradecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C=C XZHNPVKXBNDGJD-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- KEROTHRUZYBWCY-UHFFFAOYSA-N tridecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C(C)=C KEROTHRUZYBWCY-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XOALFFJGWSCQEO-UHFFFAOYSA-N tridecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCOC(=O)C=C XOALFFJGWSCQEO-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- KRLHYNPADOCLAJ-UHFFFAOYSA-N undecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C(C)=C KRLHYNPADOCLAJ-UHFFFAOYSA-N 0.000 description 1
- RRLMGCBZYFFRED-UHFFFAOYSA-N undecyl prop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C=C RRLMGCBZYFFRED-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、硬化性樹脂組成物に関する。その目的とするところは、速硬化性、貯蔵安定性、高耐候性、接着性に優れた新規のアクリル・変成シリコーン系樹脂組成物の提供である。
【0002】
【従来の技術】
1分子中に少なくとも1個の反応性ケイ素基(水酸基または加水分解性基の結合したケイ素原子を含むケイ素原子含有基であって、シロキサン結合を形成し得る基)、特にメチルジメトキシシリル基を有するポリオキシアルキレン系重合体をベースにした室温硬化性樹脂組成物は、例えば建築物のシーラント、接着剤等に利用でき、安価で優れた性能を有している。さらに上記ポリオキシアルキレン系重合体に反応性ケイ素基を有するアクリル系共重合体を配合した、所謂アクリル・変成シリコーン系樹脂組成物も高耐候性シーリング材用ベースポリマー、1液常温硬化型接着剤ベースポリマーとして広く市販されている。
【0003】
このアクリル・変成シリコーン系樹脂組成物は、メチルジメトキシシリル基を有するオキシアルキレン系重合体に比べて、初期タックに優れ、各種被着体に対する接着性、耐候性に優れた特徴を有し、接着機能及び貯蔵安定性に優れた接着剤、シーリング材として広く使用されているものの、内部硬化性及び硬化速度の点において解決すべき技術的課題が残されていると記載されている(特開平10−251552号公報)。
【0004】
アクリル系共重合体の反応性ケイ素含有官能基として、トリメトキシシリル基を有する成分を用いる例が特開平01−2362458号公報等に提案されているが、硬化速度の極端な上昇によりポットライフの調整が難しい他、ポリカーボネート等特定の接着基材への接着性が劣る傾向が見られた。
【0005】
また、ポリオキシプロピレン系重合体の反応性ケイ素含有官能基として、トリメトキシシリル基を有する成分を用いる例が内部硬化性が優れ、且つ非常に硬化速度が速い特性を有しているとされているが、ポットライフ調整や貯蔵安定性の確保が難しく、また接着機能も市販のメチルジメトキシシリル型ポリオキシプロピレン系重合体に比べて劣ることから、工業的価値が認められず、市販されるに至っていない。
【0006】
特開平10−251552号公報では、貯蔵安定性に優れ、しかも内部硬化性が優れ、且つ、非常に硬化速度が速い特性や優れた接着機能を備えたアクリル・変成シリコーン系樹脂組成物として、樹脂成分が(A)反応性ケイ素含有官能基がトリメトキシシリル基で主鎖が実質的にポリオキシプロピレン系重合体、(B)反応性ケイ素含有官能基がメチルジメトキシシリル基で主鎖が実質的にポリオキシプロピレン系重合体、並びに、(C)分子内にアルコキシシリル基を含有し、アルキル基の炭素数が1〜20であるアクリル酸エステル及びメタクリル酸エステルからなる群より選ばれた少なくとも1種を主成分として重合させることにより得られる反応性ケイ素基を有するアクリル系共重合体からなるアクリル・変成シリコーン樹脂組成物が提案されている。
【0007】
しかし、この方法を用いると、異なる反応性ケイ素含有官能基を有する2種類のポリオキシプロピレン系重合体と、さらに、反応性ケイ素含有官能基を有するアクリル系重合体を別々に製造管理しなければならないとの問題がある。特に、トリメトキシシリル基含有ポリオキシプロピレン系重合体は、市販するに至っておらず、原料入手面、合成反応面や貯蔵安定性等の課題があるものと推定される。
【0008】
原料入手、合成反応が容易で、かつ、速硬化性、貯蔵安定性、高耐候性、接着性に優れ、さらに、近年の社会的な要請が強い環境対応型のアクリル・変成シリコーン系樹脂組成物が得られれば産業上の利用価値は非常に高い。
【0009】
【発明が解決しようとする課題】
本発明は、原料入手、合成反応が容易で、速硬化性、貯蔵安定性、高耐候性、接着性に優れた産業上実用化の可能性が高い新規のアクリル・変成シリコーン系樹脂組成物を提案することにある。さらに、併せて社会的要請が高い環境対応型硬化性組成物を開発することにある。
【0010】
【課題を解決する為の手段】
本発明者は、鋭意研究を重ねた結果、ケイ素含有官能基を有するポリオキシアルキレン系重合体(A)、ケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)を含む硬化性組成物において、ケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)のケイ素含有官能基のうち、少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基であることを特徴とする硬化性組成物を用いることにより、従来のアクリル・変成シリコーン系硬化性樹脂組成物の有する優れた接着性、高耐候性、貯蔵安定性を損なうことなく、優れた硬化速度を有することを見出した。
【0011】
また、本発明のアクリル・変成シリコーン系硬化性樹脂組成物を用いると、従来から使用されている有機スズ系触媒のみならず、これまで実用的な硬化速度が得られなかった有機スズ系化合物以外の硬化促進触媒でも使用可能であることを見出した。
【0012】
即ち、本発明は、シロキサン結合を形成することによって架橋しうるケイ素含有官能基を有するポリオキシアルキレン系重合体(A)、シロキサン結合を形成することによって架橋しうるケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)を含む硬化性組成物において、ケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)のケイ素含有官能基のうち、少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基である硬化性組成物に関する。
【0013】
さらに、上記のシロキサン結合を形成することによって架橋しうるケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)が、一分子中の少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基である、および/または、シロキサン結合を形成することによって架橋しうるケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(B)が、一分子中の少なくとも一部がジアルコキシシリル基である化合物と、少なくとも一部がトリアルコキシシリル基である化合物の混合物である。
【0014】
また、本発明は(A)1分子中に少なくとも1個のジメトキシシリル基を含有し、数平均分子量が6,000以上であるオキシアルキレン系重合体、(B)1分子中に少なくとも平均0.2個のトリメトキシシリル基と少なくとも平均0.2個のジメトキシシリル基を含有する(メタ)アクリル酸エステル等を重合したアクリル共重合体、(C)硬化促進触媒からなるアクリル・変成シリコーン系硬化性組成物に係る。
【0015】
更に本発明によれば、(C)の硬化促進触媒として非有機スズ触媒、たとえば、有機カルボン酸、有機カルボン酸金属塩、アミン化合物、酸性リン酸エステル、3B族または4A族金属を使用しても、実質的な硬化速度が得られる。
【0016】
本発明を用いれば、硬化速度が改善され、かつ、接着性、貯蔵安定性に優れたアクリル・変成シリコーン系硬化性組成物が得ることができる。
【0017】
【発明の実施の形態】
本発明の(A)成分における重合主鎖を構成するポリオキシアルキレン系重合体としては、一般式
−(−R−O−)n−
(式中、Rは炭素数1〜4の2価のアルキレン基)で表わされるものが使用できる。
【0018】
繰り返し単位の具体例としては−CH2O−、−CH2CH2O−、−CH2CH(CH3)O−、−CH2CH(C2H5)O−、−CH2C(CH3)2O−、−CH2CH2CH2CH2O−等が挙げられる。オキシアルキレン重合体の主鎖骨格は1種だけの繰り返し単位からなっていてもよく、2種以上の繰り返し単位からなっていてもよい。更に、主鎖骨格中にオキシアルキレン系重合体の特性を大きく損なわない範囲でウレタン結合成分等の他の成分を含んでいてもよい。ウレタン結合成分としては、トルエン(トリレン)ジイソシアネート、ジフェニルメタンジイソシアネート、キシリレンジイソシアネートなどの芳香族系ポリイソシアネートあるいはイソフォロンジイソシアネート、ヘキサメチレンジイソシアネートなどの脂肪族系ポリイソシアネートと上記式の繰り返し単位を有するポリオールとの反応から得られるものが挙げられるが、これらに限定されるものではない。入手容易の点からポリオキシプロピレン系重合体が好ましい。このポリオキシプロピレン系重合体は、直鎖状であっても分枝状であってもよく、あるいは、これらの混合物であってもよい。また、他の単量体単位等が含まれていてもよいが、上記式に表わされる単量体単位が、重合体中に50重量%以上、好ましくは80重量%以上存在することが好ましい。
【0019】
本発明の(A)成分である反応性ケイ素基含有ポリオキシアルキレン系重合体は、官能基を有するポリオキシアルキレン系重合体に反応性ケイ素基を導入することによって得るのが好ましい。
【0020】
本発明の(A)成分である反応性ケイ素基含有ポリオキシアルキレン系重合体の分子構造は、使用用途や目的とする特性により相違し、特開昭63−112642号公報記載の方法や特開平11−000644号公報記載の方法等が使用できる。
【0021】
分子量や分子量分布等の特性は、重合法や条件により選択される。接着剤やコーティングなど低粘度であることが重要である使用用途の場合は、高分子量で、かつ、分子量分布が狭い、すなわち、GPC(ゲル浸透クロマトグラフィー)によるMw/Mnが小さいほうが分子設計上有利な場合が多いが、オキシアルキレンの通常の重合法(苛性アルカリを用いるアニオン重合法)やこの重合体を原料とした鎖延長反応方法によって得ることは極めて困難であり、特殊な重合法であるセシウム金属触媒、特開昭61−197631号公報、特開昭61−215622号公報、特開昭61−215623号公報、特開昭61−218632号公報に例示されるポルフィリン/アルミ錯体触媒、特公昭46−27250号公報及び特公昭59−15336号公報等に例示される複合金属シアン化錯体触媒、特開平10−273512号公報に例示されるポリフォスファゼン塩からなる触媒を用いた方法等により得ることができる。実用上、複合金属シアン化錯体触媒を用いる方法が好ましい。なお、反応性ケイ素基含有ポリオキシアルキレン系重合体の分子量分布は、対応する反応性ケイ素基導入前の重合体の分子量分布に依存するため、導入前の重合体の分子量分布はできるだけ狭いことが好ましい。
【0022】
反応性ケイ素基の導入は公知の方法で行なえばよい。すなわち、例えば、以下の方法が挙げられる。例えば複合金属シアン化錯体触媒を用いて得られるポリオキシアルキレン系重合体の場合は特開平3−72527号公報等に、ポリフォスファゼン塩と活性水素を触媒として得られるポリオキシアルキレン系重合体の場合は特開平11−60723号公報等に方法が記載されている。
【0023】
(1)末端に水酸基等の官能基を有するポリオキシアルキレン系重合体と、この官能基に対して反応性を示す活性基及び不飽和基を有する有機化合物を反応させるか、もしくは不飽和基含有エポキシ化合物との共重合により、不飽和基含有ポリオキシアルキレン系重合体を得る。次いで、得られた反応生成物に反応性ケイ素基を有するヒドロシランをヒドロシリル化により反応させる。
【0024】
(2)(1)法と同様にして得られた不飽和基含有ポリオキシアルキレン系重合体にメルカプト基及び反応性ケイ素基を有する化合物を反応させる。
【0025】
(3)末端に水酸基、エポキシ基やイソシアネート基等の官能基(以下、Y官能基という)を有するポリオキシアルキレン系重合体に、このY官能基に対して反応性を示す官能基(以下、Y′官能基という)及び反応性ケイ素基を有する化合物を反応させる。
【0026】
このY′官能基を有するケイ素化合物としては、γ−(2−アミノエチル)アミノプロピルトリメトキシシラン、γ−(2−アミノエチル)アミノプロピルメチルジメトキシシラン、γ−アミノプロピルトリエトキシシランなどのようなアミノ基含有シラン類;γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルメチルジメトキシシランなどのようなメルカプト基含有シラン類;γ−グリシドキシプロピルトリメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシランなどのようなエポキシシラン類;ビニルトリエトキシシラン、γ−メタクリロイルオキシプロピルトリメトキシシラン、γ−アクリロイルオキシプロピルメチルジメトキシシランなどのようなビニル型不飽和基含有シラン類;γ−クロロプロピルトリメトキシシランなどのような塩素原子含有シラン類;γ−イソシアネートプロピルトリエトキシシラン、γ−イソシアネートプロピルメチルジメトキシシラン、γ−イソシアネートプロピルトリメトキシシランなどのようなイソシアネート含有シラン類;メチルジメトキシシラン、トリメトキシシラン、メチルジエトキシシラン、トリエトキシシランなどのようなハイドロシラン類などが具体的に例示されうるが、これらに限定されるものではない。
【0027】
これらの製造方法として、特開平3−47825号公報、特開平3−157424号公報、特開平11−100427号公報、特開2000−143757号公報、特開2000−169544号公報、特開2000−169545号公報、米国特許US6197912号公報、国際公開WO200037533号公報、国際公開WO9955755号公報、国際公開WO200112693号公報、ドイツ特許DE19923300号公報、カナダ特許CA2303698号公報、米国特許US6121354号公報、ドイツ特許DE19849817号公報、米国特許US6001946号公報等に示された製造方法を使用することが可能である。
【0028】
本発明の(A)成分であるポリオキシアルキレン系重合体に含有する反応性ケイ素基としては、上記製造方法により導入可能な反応性ケイ素基から、必要特性に合わせて自由に選択可能であるが、原料入手性の面から、メチルジメトキシシリル基、トリメトキシシリル基、メチルジエトキシシリル基、トリエトキシシリル基およびメチルジイソプロペニルオキシシリル基、トリイソプロペニルオキシシリル基からなる群から選ばれる反応性ケイ素基が好ましく、中でも、硬化速度と貯蔵安定性のバランスの面から、メチルジメトキシシリル基、トリメトキシシリル基、トリエトキシシリル基が好ましく、メチルジメトキシシリル基が特に好ましい。硬化速度と貯蔵安定性等の特性を両立させる等の目的から、2種以上の反応性ケイ素基を使用することが可能であり、たとえば、メチルジメトキシシリル基とトリメトキシシリル基、トリメトキシシリル基とトリエトキシシリル基、メチルジメトキシシリル基とトリエトキシシリル基との組み合わせが有効である。これらの組み合わせでは、一分子中に異なる反応性ケイ素基を含有させる方法、異なる反応性ケイ素基を併用させる方法、または、その両方が可能である。
【0029】
本発明の(A)成分であるポリオキシアルキレン系重合体に含有する反応性ケイ素基数は、一分子あたり平均0.3個以上10個未満が好ましく、0.5個以上5個未満がさらに好ましい。一分子あたり平均0.3個未満では、十分に硬化することができず、平均10個以上では硬化後の物性が極端にもろくなってしまう。
【0030】
本発明の(A)成分であるポリオキシアルキレン系重合体が、数平均分子量(Mn)が6,000以上であることが、硬化物の伸びや接着剥離強度等の面から好ましく、10,000以上であることがさらに好ましい。分子量が6,000未満の場合、硬化物がもろくなる傾向にある。
【0031】
分子量分布Mw/Mn(重量平均分子量と数平均分子量との比)が1.6以下である場合には、粘度と物性のバランスの面から有利である。Mw/Mnが1.6を超えるとこの効果が減少し、粘度が高くなる傾向がある。Mw/Mnは小さい方が効果が顕著であり、好ましくは1.5以下である。
【0032】
次に、B成分であるシロキサン結合を形成することによって架橋しうるケイ素含有官能基を有し、分子鎖がアクリル酸アルキルエステル単量体単位及び/又はメタクリル酸アルキルエステル単量体単位からなる共重合体(以下、アクリル系共重合体(B)とする)について説明する。
【0033】
アクリル系共重合体(B)は、炭素数が1〜20のアルキル基を有するアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキルエステル単量体単位とからなる重合体であり、シロキサン結合を形成することによって架橋しうる反応性ケイ素基含有アクリル重合体である。
【0034】
本発明に用いるアクリル系共重合体(B)に用いられるアクリル酸アルキルエステル単量体単位としては、従来公知のものが広く使用でき、例えばアクリル酸メチル、アクリル酸エチル、アクリル酸n−プロピル、アクリル酸n−ブチル、アクリル酸イソブチル、アクリル酸tert−ブチル、アクリル酸n−ヘキシル、アクリル酸2−エチルヘキシル、アクリル酸デシル、アクリル酸ウンデシル、アクリル酸ラウリル、アクリル酸トリデシル、アクリル酸ミリスチル、アクリル酸セチル、アクリル酸ステアリル、アクリル酸ベヘニル、アクリル酸ビフェニル等を挙げることができる。またメタクリル酸エステル単量体単位としては、従来公知のものが広く使用でき、例えばメタクリル酸メチル、メタクリル酸エチル、メタクリル酸n−プロピル、メタクリル酸n−ブチル、メタクリル酸イソブチル、メタクリル酸tert−ブチル、メタクリル酸n−ヘキシル、メタクリル酸2−エチルヘキシル、メタクリル酸デシル、メタクリル酸ウンデシル、メタクリル酸ラウリル、メタクリル酸トリデシル、メタクリル酸ミリスチル、メタクリル酸セチル、メタクリル酸ステアリル、メタクリル酸ベヘニル、メタクリル酸ビフェニル等を挙げることができる。
【0035】
共重合体(B)の分子鎖は、実質的に1種または2種以上のアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキル単量体単位からなるが、ここでいう実質的に上記の単量体単位からなるとは、共重合体(B)中に存在するのアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキル単量体単位の割合が50%をこえることを意味し、好ましくは70%以上である。
【0036】
また、これら単量体の組み合わせの中では、相溶性、安定性の点から、分子鎖が実質的に(a)炭素数1〜8のアルキル基を有するアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキルエステル単量体単位と(b)炭素数9以上のアルキル基を有するアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキルエステル単量体単位からなる共重合体が好ましい。この共重合体における単量体単位(a)である炭素数1〜8のアルキル基を有するアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキルエステル単位は、一般式(1):
CH2=C(R5)COOR6 (1)
(式中R5は水素原子またはメチル基、R6は炭素数1から8のアルキル基を示す)で表される。
【0037】
前記一般式(1)のR6としては、例えばメチル基、エチル基、プロピル基、n−ブチル基、t−ブチル基、2ーエチルヘキシル基などの炭素数1〜8、好ましくは1〜4、さらに好ましくは1〜2のアルキル基を挙げることができる。なお一般式(1)で表されるモノマーは1種類でもよく、2種以上用いてもよい。
【0038】
また、単量体単位(b)である炭素数9以上のアルキル基を有するアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキルエステル単位は、一般式(2):
CH2=C(R5)COOR7 (2)
(式中R5は前記に同じ。R7は炭素数9以上のアルキル基を示す)で表される。
【0039】
前記一般式(2)のR7としては、たとえばノニル基、ラウリル基、トリデシル基、セチル基、ステアリル基、炭素数22のアルキル基、ビフェニル基などの炭素数9以上、通常は9〜30、好ましくは10〜20の長鎖アルキル基が挙げられる。なお一般式(2)で示されるモノマーは1種類でもよく、例えば炭素数12と13との混合物のように、2種以上混合した基であってもよい。
【0040】
アクリル系共重合体(B)の分子鎖は実質的に(a)および(b)の単量体単位からなるが、ここでいう実質的に(a)および(b)の単量体単位からなるとは、アクリル系共重合体(B)中に存在する(a)および(b)の単量体単位の割合が50%をこえることを意味し、好ましくは70%以上である。(a)および(b)の単量体単位の割合が50%未満になると(A)成分であるポリオキシアルキレン系重合体と(B)成分であるアクリル系共重合体の相溶性が低下し、白濁する傾向が生じるとともに接着特性も低下しがちになる。
【0041】
また(a)の単量体単位と(b)の単量体単位の割合は、重量比で95:5〜40:60が好ましく、90:10〜60:40がさらに好ましい。前記割合が95:5より大きくなると相溶性が低下し、40:60より小さくなるとコスト的に不利になりがちになる。
【0042】
アクリル系共重合体(B)にはアクリル酸アルキルエステル単量体単位および/またはメタクリル酸アルキル単量体単位の外に、これらと共重合性を有する単量体単位が含有されていてもよい。たとえばアクリル酸、メタクリル酸等のアクリル酸;アクリルアミド、メタクリルアミド、N−メチロールアクリルアミド、N−メチロールメタクリルアミド等のアミド基、グリシジルアクリレート、グリシジルメタクリレート等のエポキシ基、ジエチルアミノエチルアクリレート、ジエチルアミノエチルメタクリレート、アミノエチルビニルエーテル等のアミノ基を含む単量体;ポリオキシエチレンアクリレート、ポリオキシエチレンメタアクリレート等は、湿分硬化性、内部硬化性の点で共重合効果が期待できる。その他、アクリロニトリル、スチレン、α−メチルスチレン、アルキルビニルエーテル、塩化ビニル、酢酸ビニル、プロピオン酸ビニル、エチレン等に起因する単量体単位などがあげられる。
【0043】
アクリル系共重合体(B)の単量体組成は、用途、目的により選択するのが当業者の間では一般的であるが、例えば、強度を必要とする目的、用途では、軟化点が比較的高いものが望ましく、0℃以上、より好ましくは20℃以上の軟化点を有するものがよい。
【0044】
また、粘度、作業性等を重視する目的、用途では逆に軟化点が比較的低いものが望ましく、20℃以下、より好ましくは0℃以下、さらに好ましくは−20℃以下の軟化点を有するものがよい。
【0045】
アクリル系共重合体(B)成分の分子量には特に制限はないが、GPCにおけるポリスチレン換算での数平均分子量が500から100,000であるものが重合時の難易度の点から好ましい。さらには1,000〜30,000のものが強度、粘度のバランスより好ましく、1,000〜20,000のものが、作業性等取り扱いの容易さと接着性などの点から好ましい。
【0046】
アクリル系共重合体(B)は、通常のビニル重合の方法によって得ることができる。たとえば、ラジカル反応による溶液重合法や塊重合法などによって重合させることで得ることができるが、特にこれらの方法に限定されるものではない。反応は、通常前記単量体およびラジカル開始剤や連鎖移動剤、溶剤などを加えて50〜150℃で反応させることにより行われる。
【0047】
前記ラジカル開始剤の例としては、アゾビスイソブチロニトリル、ベンゾイルパーオキサイドなど、連鎖移動剤の例としては、n−ドデシルメルカプタン、t−ドデシルメルカプタン、ラウリルメルカプタンなどのメルカプタン類や含ハロゲン化合物などがあげられる。溶剤としては、たとえばエーテル類、炭化水素類、エステル類のごとき非反応性の溶剤を使用するのが好ましい。
【0048】
アクリル系共重合体(B)に反応性ケイ素基を導入する方法には種々の方法があるが、たとえば、(手法1)重合性不飽和結合と反応性ケイ素基を有する化合物を、単量体(a)および(b)とともに共重合させる方法、(手法2)重合性不飽和結合と反応性官能基(以下、Y基という)を有する化合物(たとえばアクリル酸、ヒドロキシエチルメタクリレートなど)を単量体(a)および(b)とともに共重合させ、そののち生成した共重合体を反応性ケイ素基およびY基と反応しうる官能基(以下、Y′基という)を有する化合物と反応させる方法、(手法3)連鎖移動剤として反応性ケイ素基を含有するメルカプタンの存在下、単量体(a)および(b)を共重合させる方法、(手法4)反応性ケイ素基を含有するアゾビスニトリル化合物やジスルフィド化合物を開始剤として単量体(a)および(b)を共重合させる方法、(手法5)リビングラジカル重合法によって単量体(a)および(b)を重合させ、分子末端に反応性ケイ素基を導入する方法、などが挙げられるが、特にこれらに限定されるものではない。また、(手法1)〜(手法5)の方法を各々任意に組み合わせることも可能である。例えば、(手法1)と(手法3)の組み合わせとして、連鎖移動剤として反応性ケイ素基を含有するメルカプタンの存在下、重合性不飽和結合と反応性ケイ素基を有する化合物を、単量体(a)および(b)ともに共重合させる方法をとることも可能である。
【0049】
(手法1)記載の重合性不飽和結合と反応性ケイ素基を有する化合物は、一般式(3):
CH2=C(R5)COOR8−[Si(R3 2−b)(Xb)O]mSi(R4 3−a)Xa (3)
(式中R5は前記に同じ。R8は炭素数1〜6の2価のアルキレン基を示す。R3,R4,X,a,b,mは前記と同じ。)または一般式(4):
CH2=C(R5)−[Si(R3 2−b)(Xb)O]mSi(R4 3−a)Xa (4)
(式中R3,R4,R5,X,a,b,mは前記と同じ。)で表される。
【0050】
前記一般式(3)のR8としては、例えばメチレン基、エチレン基、プロピレン基などの炭素数1〜6、好ましくは1〜4のアルキレン基を挙げることができる。
【0051】
また、式(3)または(4)における加水分解性基Xの具体例としては、たとえばハロゲン原子、水素原子、アルコキシ基、アシルオキシ基、ケトキシメート基、アミノ基、アミド基、アミノオキシ基、メルカプト基、アルケニルオキシ基等があげられる。これらのうちでも加水分解性の緩やかさの点からメトキシ基、エトキシ基等のアルコキシ基が好ましい。なお一般式(3)または(4)で表されるモノマーは1種類でもよく、2種以上用いてもよい。
【0052】
一般式(3)または(4)で表される、重合性不飽和結合と反応性ケイ素基を有する化合物としては、たとえば、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジメトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン等のγ−メタクリロキシプロピル(アルキル)ポリアルコキシシラン、γ−アクリロキシプロピルトリメトキシシラン、γ−アクリロキシプロピルメチルジメトキシシラン、γ−アクリロキシプロピルトリエトキシシラン等のγ−アクリロキシプロピルアルキルポリアルコキシシラン、ビニルトリメトキシシラン、ビニルメチルジメトキシシラン、ビニルトリエトキシシラン等のビニルアルキルポリアルコキシシランなどがあげられる。
【0053】
(手法2)記載のY基およびY′基の例としては、種々の基の組み合わせがあるが、例えば、Y基としてアミノ基、水酸基、カルボン酸基を、Y′基としてイソシアネート基をあげることができる。また別の一例として、特開昭54−36395号公報や特開平01−272654号公報、特開平02−214759号公報に記載されているように、Y基としてはアリル基、Y′基としては水素化ケイ素基(H−Si)をあげることができる。この場合、VIII族遷移金属の存在下で、ヒドロシリル化反応によりY基とY′基とが結合しうる。
【0054】
(手法3)記載の連鎖移動剤として使用する反応性ケイ素基を含有するメルカプタンとしては、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルメチルジメトキシシラン、γ−メルカプトプロピルトリエトキシシラン等をあげることができる。また、特開昭59−78222号公報に記載されているように、単量体(a)および(b)を、2官能ラジカル重合性化合物および連鎖移動剤としてアルコキシシリル基を含有するメルカプタンの存在下で共重合させる方法も可能である。
【0055】
(手法4)記載の、反応性ケイ素基を含有するアゾビスニトリル化合物やジスルフィド化合物としては、特開昭60−23405号公報、特開昭62−70405号公報等に記載されている、アルコキシシリル基を含有するアゾビスニトリル化合物やアルコキシシリル基を含有するジスルフィド化合物を例としてあげることができる。
【0056】
(手法5)記載の方法としては、特開平09−272714号公報などに記載されている方法をあげることができる。
【0057】
その他に、特開昭59−168014号公報、特開昭60−228516号公報などに記載されている、反応性ケイ素基をもつメルカプタンと反応性ケイ素基をもつラジカル重合開始剤を併用する方法もあげることができる。
【0058】
本発明において、アクリル系重合体(B)が含有する反応性ケイ素のうち、少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基であることが重要である。アクリル系重合体(B)が含有する反応性ケイ素がジアルコキシシリル基のみの場合、(A)成分である反応性ケイ素基を有するポリオキシアルキレン系重合体とアクリル系重合体(B)、硬化促進触媒(C)を主成分とする硬化性組成物の貯蔵安定性や接着性は良好であるが、硬化速度が遅くなる傾向があり、好ましくない。アクリル系重合体(B)が含有する反応性ケイ素がトリアルコキシシリル基のみの場合、(A)成分、(B)成分、(C)成分を主成分とする硬化性組成物の硬化速度は向上するが、トリアルコキシシリル基が高活性なため、貯蔵安定性が低下し、また、プラスチックス、たとえば、ポリカーボネート等への接着性が低下する傾向があり、好ましくない。
【0059】
アクリル系共重合体(B)中に、ジアルコキシシリル基とトリアルコキシシリル基を含有させる方法としては、(1)アクリル系共重合体(B)として、一分子中の少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基であるアクリル系共重合体(B)を用いる、(2)アクリル共重合体(B)として、一分子中の少なくとも一部がジアルコキシシリル基である化合物と、少なくとも一部がトリアルコキシシリル基である化合物とを混合して用いる方法が可能である。また、(1)と(2)を合わせた方法、たとえば、一分子中の少なくとも一部がジアルコキシシリル基であり、かつ、少なくとも一部がトリアルコキシシリル基であるアクリル系共重合体と、一分子中の少なくとも一部がジアルコキシシリル基である化合物、または、少なくとも一部がトリアルコキシシリル基である化合物とを混合して用いる方法が可能である。
【0060】
(2)の方法を用いる場合、2種以上のアクリル系共重合体を別々に重合した後、混合する方法と、ジアルコキシシリル基を含有するアクリル系共重合体を重合した後、続いて、トリアルコキシシリル基を含有するアクリル系共重合体を重合する方法、または、その逆の順番で実施する方法があり、製造装置等の条件により、選択することが可能である。
【0061】
本発明のアクリル系共重合体(B)に含有されるジアルコキシシリル基としては、上記製造方法により導入可能な反応性ケイ素基から、必要特性に合わせて自由に選択可能であるが、原料入手性の面から、メチルジメトキシシリル基、メチルジエトキシシリル基、メチルジイソプロペニルオキシシリル基からなる群から選ばれる反応性ケイ素基が好ましく、メチルジメトキシシリル基が特に好ましい。
【0062】
本発明のアクリル系共重合体(B)に含有されるトリアルコキシシリル基としては、上記製造方法により導入可能な反応性ケイ素基から、必要特性に合わせて自由に選択可能であるが、原料入手性の面から、トリメトキシシリル基、トリエトキシシリル基、トリイソプロペニルオキシシリル基からなる群から選ばれる反応性ケイ素基が好ましく、中でも、硬化速度と貯蔵安定性のバランスの面から、トリメトキシシリル基、トリエトキシシリル基が好ましく、トリメトキシシリル基が特に好ましい。
【0063】
アクリル系共重合体(B)に含有される反応性ケイ素基の数は、アクリル系共重合体(B)の一分子あたり、少なくとも平均0.2個以上のトリアルコキシシリル基と、少なくとも平均0.2個以上のジアルコキシシリル基を含有することが硬化物特性の観点から必要であり、0.3個以上のトリアルコキシシリル基と、少なくとも平均0.3個以上のジアルコキシシリル基を含有することがさらに望ましい。
【0064】
また、一分子中に含まれる反応性ケイ素基の数の合計は、平均0.4個以上10個未満が好ましく、平均0.5個以上5個未満がより好ましい。一分子中に含まれる反応性ケイ素基の数の合計が平均0.4個未満の場合、架橋に入らないアクリル系共重合体成分が多くなり、ブリード等の原因となり、好ましくない。平均10個以上の場合、高価な反応性ケイ素基含有化合物を大量に使用するため、高価となってしまう上、硬化性が極端に低下してしまう。
【0065】
さらに、本発明の、(A)成分である反応性ケイ素基を有するポリオキシアルキレン系重合体とアクリル系重合体(B)、硬化促進触媒(C)を主成分とする硬化性組成物において、硬化物物性、硬化速度、貯蔵安定性、接着性を両立した硬化性組成物を得るためには、ポリオキシプロピレン系重合体(A)、アクリル系共重合体(B)に含有される反応性ケイ素基の種類、数を選択することが重要である。硬化速度、貯蔵安定性等の面から、反応性ケイ素基として、ジメトキシシリル基とトリメトキシシリル基を用いる場合は、全体の反応性ケイ素基のうち、トリメトキシシリル基の割合がモルパーセント換算で、5パーセント以上50パーセント未満であることが好ましく、10パーセント以上40パーセント未満であることがさらに好ましい。トリメトキシシリル基の割合が5パーセント以下の場合、硬化速度等改善効果が見られず、50パーセント以上では貯蔵安定性の確保が困難となる。
【0066】
本発明の組成物におけるポリオキシプロピレン系重合体(A)とアクリル系共重合体(B)との使用割合は、アクリル系共重合体(B)の量がポリオキシプロピレン系重合体(A)100重量部に対して3〜300重量部の範囲から選択可能であるが、硬化速度の改善効果の点から好ましくは5〜150重量部の範囲、更に好ましくは15〜100重量部の範囲が硬化速度と貯蔵安定性、接着性、耐候性の点から好ましい。通常、目的とする用途、性能に応じて選択され、また、従来の硬化性組成物において、アクリル系共重合体の分子量、反応性ケイ素基含量等により、最適選択範囲が変化することは、当業者の間では良く知られている。
【0067】
次に、(C)成分である、硬化促進触媒について説明する。
【0068】
本発明に用いる(C)成分である、硬化促進触媒として、通常使用される反応性ケイ素基の反応を促進するシラノール縮合用触媒が用いられる。この様な硬化促進剤の具体例としては、スズ化合物、特に有機スズ化合物が代表的な硬化促進触媒である。
【0069】
有機スズ化合物を具体的に例示すれば、ジブチル錫ジラウレート、ジブチル錫ビス(アルキルマレエート)などのジブチル錫ジカルボキシレート類、ジブチル錫ジメトキシド、ジブチル錫ジフェノキシドなどのジアルキル錫のアルコキシド誘導体類、ジブチル錫ジアセチルアセトナート、ジブチル錫アセトアセテートなどのジアルキル錫の分子内配位性誘導体類、ジブチル錫オキシドとエステル化合物による反応混合物、ジブチル錫オキシドとシリケート化合物による反応混合物、およびこれらジアルキル錫オキシド誘導体のオキシ誘導体などの4価ジアルキル錫オキシドの誘導体があげられるがこれらに限定されるものではない。
【0070】
また、本発明においては、硬化促進触媒(C)として、有機スズ化合物以外の硬化促進触媒を用いることが可能である。
【0071】
本発明に用いることができる有機スズ化合物以外の硬化促進触媒としては、特に、制限はないが、非有機スズ化合物と、有機酸、有機酸とアミンとの併用や有機酸塩、3B族、4A族金属を含有する有機金属化合物などの非スズ系化合物が例示される。
【0072】
非有機スズ化合物を具体的に例示すれば、オクチル酸錫、オレイン酸錫、ステアリン酸錫、フェルザチック酸錫などの2価錫カルボン酸塩類があげられる。これら2価錫カルボン酸塩類とアミンの併用系は、活性が高くなるため、使用量を減少できる観点でより好ましい。
【0073】
非スズ系化合物の硬化促進触媒として、有機酸類、例えば有機カルボン酸、有機スルホン酸、酸性リン酸エステル類等があげられる。
【0074】
有機カルボン酸として、酢酸、シュウ酸、酪酸、酒石酸、マレイン酸、オクチル酸、オレイン酸等の脂肪族カルボン酸、フタル酸、トリメリット酸等の芳香族カルボン酸があげられるが、活性の点から、脂肪族カルボン酸が好ましい。
【0075】
有機スルホン酸として、トルエンスルホン酸、スチレンスルホン酸等があげられる。
【0076】
酸性リン酸エステルとは、−O−P(=O)OH 部分を含むリン酸エステルのことであり、以下に示すような酸性リン酸エステルが含まれる。有機酸性リン酸エステル化合物が相溶性、硬化触媒活性の点で好ましい。
【0077】
有機酸性リン酸エステル化合物は、(R−O)d−P(=O)(−OH)3−d (式中dは1または2、Rは有機残基を示す)で表される。
【0078】
以下に、具体的に例示する。
(CH3O)2−P(=O)(−OH)、(CH3O)−P(=O)(−OH)2、(C2H5O)2−P(=O)(−OH)、(C2H5O)−P(=O)(−OH)2、(C3H7O)2−P(=O)(−OH)、(C3H7O)−P(=O)(−OH)2、(C4H9O)2−P(=O)(−OH)、(C4H9O)−P(=O)(−OH)2、(C8H17O)2−P(=O)(−OH)、(C8H17O)−P(=O)(−OH)2、(C10H21O)2−P(=O)(−OH)、(C10H21O)−P(=O)(−OH)2、(C13H27O)2−P(=O)(−OH)、(C13H27O)−P(=O)(−OH)2、(C16H33O)2−P(=O)(−OH)、(C16H33O)−P(=O)(−OH)2、(HO−C6H12O)2−P(=O)(−OH)、(HO−C6H12O)−P(=O)(−OH)2、(HO−C8H16O)−P(=O)(−OH)、(HO−C8H16O)−P(=O)(−OH)2、{(CH2OH)(CHOH)O}2−P(=O)(−OH)、{(CH2OH)(CHOH)O}−P(=O)(−OH)2、{(CH2OH)(CHOH)C2H4O}2−P(=O)(−OH)、{(CH2OH)(CHOH)C2H4O}−P(=O)(−OH)2などがあげられるが、上記例示物質に限定されるものではない。
【0079】
これら有機酸類とアミンの併用系は、活性が高くなるため、使用量を減少できる観点でより好ましい。有機酸とアミン併用系のなかでは、酸性リン酸エステルとアミン、有機カルボン酸とアミン、特に有機酸性リン酸エステルとアミン、脂肪族カルボン酸とアミンの併用系が活性がより高く、速硬化性の観点で好ましい。
【0080】
アミン化合物としては、ブチルアミン、オクチルアミン、ラウリルアミン、ジブチルアミン、モノエタノールアミン、ジエタノールアミン、トリエタノールアミン、ジエチレントリアミン、トリエチレンテトラミン、オレイルアミン、シクロヘキシルアミン、ベンジルアミン、ジエチルアミノプロピルアミン、キシリレンジアミン、トリエチレンジアミン、グアニジン、ジフェニルグアニジン、2,4,6−トリス(ジメチルアミノメチル)フェノール、モルホリン、N−メチルモルホリン、2−エチル−4−メチルイミダゾール、1,8−ジアザビシクロ(5,4,0)ウンデセン−7(DBU)等があげられる。
【0081】
スズ以外のカルボン酸金属塩としては、オクチル酸やオレイン酸、ナフテン酸、ステアリン酸などをカルボン酸成分とするカルボン酸カルシウム、カルボン酸ジルコニウム、カルボン酸鉄、カルボン酸バナジウム、カルボン酸ビスマス、ビスマス−トリス(2−エチルヘキソエート)、ビスマス−トリス(ネオデカノエート)等のビスマス塩、カルボン酸鉛、カルボン酸チタニウム、カルボン酸ニッケルなどのカルボン酸金属塩類があげられる。前記アミン類との併用は、カルボン酸スズと同様、活性が高くなるため、使用量を減少できる観点でより好ましい。
【0082】
有機非スズの金属系化合物として、3B族、4A族金属を含有する有機金属化合物があげられ、有機チタネート化合物、有機アルミニウム化合物、有機ジルコニウム化合物、有機ホウ素化合物等が活性の点から好ましいが、これらに限定されるものではない。
【0083】
前記有機チタネート化合物としては、テトライソプロピルチタネート、テトラブチルチタネート、テトラメチルチタネート、テトラ(2−エチルヘキシルチタネート)、トリエタノールアミンチタネートなどのチタンアルコキシド類、チタンテトラアセチルアセトナート、チタンエチルアセトアセテート、オクチレングリコレート、チタンラクテートなどのチタンキレート類等のキレート化合物などがあげられる。
【0084】
前記有機アルミニウム化合物としては、アルミニウムイソプロピレート、モノsec−ブトキシアルミニウムジイソプロピレート、アルミニウムsec−ブチレートなどのアルミニウムアルコキシド類、アルミニウムトリスアセチルアセトナート、アルミニウムトリスエチルアセトアセテート、ジイソプロポキシアルミニウムエチルアセトアセテートなどのアルミニウムキレート類等があげられる。
【0085】
前記ジルコニウム化合物としては、ジルコニウムテトライソプロポキサイド、ジルコニウムテトラ−nプロピレート、ジルコニウムノルマルブチレートなどのジルコニウムアルコキシド類、ジルコニウムテトラアセチルアセトナート、ジルコニウムモノアセチルアセトナート、ジルコニウムビスアセチルアセトナート、ジルコニウムアセチルアセトナートビスエチルアセトアセテート、ジルコニウムアセテートなどのジルコニウムキレート類などがあげられる。
【0086】
これら有機チタネート化合物、有機アルミニウム化合物、有機ジルコニウム化合物、有機ホウ素化合物等は、そうぞれ併用も可能であるが、特に、前記アミン化合物、又は、酸性リン酸エステル化合物との併用により、活性を高めることが可能であることから触媒の使用量を低減できる観点で好ましく、高温での硬化性と常温での可使時間の調整の観点でより望ましい。
【0087】
これらの硬化促進触媒(C)の使用量は、通常、目的とする用途、性能に応じて選択すればよいが、ポリオキシプロピレン系重合体(A)と、アクリル系共重合体(B)の合計100重量部に対し、0.01〜20重量部が好ましく、さらにはコストの点から0.1〜10重量部がより好ましく、クリープ特性等力学特性と硬化性のバランスから0.25〜5重量部が最適である。
【0088】
本発明の組成物は一般的な可塑剤を使用しうる。具体例としては、ジブチルフタレート、ジヘプチルフタレート、ジ(2−エチルヘキシル)フタレート、ブチルベンジルフタレート、ブチルフタリルブチルグリコレートなどのフタル酸エステル類;ジオクチルアジペート、ジオクチルセバケートなどの非芳香族2塩基酸エステル類;トリクレジルホスフェート、トリブチルホスフェートなどのリン酸エステル類などが挙げられる。中でもフタル酸エステル系可塑剤が性能、経済性の点で最も好ましい。しかし、フタル酸エステル系とりわけ汎用的なジ(2−エチルヘキシル)フタレートは安全衛生上の課題から使用が近年忌避される傾向にある。性能だけでなく安全衛生上の理由から低分子量タイプに替えて高分子量タイプの可塑剤を使用しうる。高分子量タイプの可塑剤としては、たとえば2塩基酸と多価アルコールとのポリエステル類などのポリエステル系可塑剤、液状のアクリル樹脂系可塑剤;ポリプロピレングリコールやその誘導体などのポリエーテル類;ポリ−α−メチルスチレン、ポリスチレンなどのポリスチレン類などが挙げられる。具体的には、旭硝子(株)製のエクセノール5030(分子量約5100のポリエーテルポリオール)、両末端にアリルエーテル基を有し、分子量5200、Mw/Mn=1.6のオキシプロピレン系重合体、SGO(ジョンソンポリマー)等が例示される。
【0089】
本発明の組成物には、必要に応じて、充填剤、その他の添加剤などを加えて使用してもよい。
【0090】
前記充填剤としては、たとえば重質炭酸カルシウム、軽質炭酸カルシウム、膠質炭酸カルシウム、カオリン、タルク、シリカ、酸化チタン、ケイ酸アルミニウム、酸化マグネシウム、酸化亜鉛、カーボンブラックなどがあげられる。充填剤を用いる場合、その使用量はアクリル変成シリコーン系樹脂(A+B成分)100重量部に対して5〜300重量部の範囲が好ましく、機械的物性と粘度のバランスから10〜150重量部の範囲がより好ましい。
【0091】
前記その他の添加剤としては、たとえば水添ヒマシ油、有機ベントナイトなどのタレ防止剤、着色剤、老化防止剤、接着付与剤などが挙げられる。
【0092】
また、本発明の硬化性組成物には、接着性、貯蔵安定性の改良のため、N−(β−アミノエチル)−γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、ビニルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、N−(β−アミノエチル)−γ−アミノプロピルトリメトキシシラン等のシランカップリング剤を配合することができる。
【0093】
更に、本発明の硬化性組成物には、必要に応じてエポキシ樹脂とその硬化剤、粘性改良剤、その他添加剤等を適宜配合し得る。
【0094】
エポキシ樹脂としては、従来公知のものを広く使用でき、例えばビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、テトラブロモビスフェノールAのグリシジルエーテル等の難燃型エポキシ樹脂、ノボラック型エポキシ樹脂、水添ビスフェノールA型エポキシ樹脂、ビスフェノールAプロピレンオキシド付加物のグリシジルエーテル型エポキシ樹脂、ジグリシジル−ρ−オキシ安息香酸ジグリシジルエステル、テトラヒドロフタル酸ジグリシジルエステル、ヘキサヒドロフタル酸ジグリシジルエステル等のフタル酸ジグリシジルエステル系エポキシ樹脂、m−アミノフェノール系エポキシ樹脂、ジアミノジフェニルメタン系エポキシ樹脂、ウレタン変性エポキシ樹脂、各種脂環式エポキシ樹脂、N,N−ジグリシジルアニリン、N,N−ジグリシジル−ο−トルイジン、トリグリシジルイソシアヌレート、ポリアルキレングリコールジグリシジルエーテル、グリセリン等の多価アルコールのグリシジルエーテル、ヒダントイン型エポキシ樹脂、石油樹脂等の不飽和重合体のエポキシ化物等を挙げることができる。これらのエポキシ樹脂の中でも、分子中にエポキシ基を少なくとも2個含有するものが、硬化に際し反応性が高く、また硬化物が3次元的網目を作り易い等の点から好ましい。更に好ましいエポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ノボラック型エポキシ樹脂及びフタル酸ジグリシジルエステル系エポキシ樹脂が例示される。
【0095】
エポキシ樹脂の硬化剤としては、従来公知のエポキシ樹脂硬化剤を広く使用でき、例えばトリエチレンテトラミン、テトラエチレンペンタミン、ジエチルアミノプロピルアミン、N−アミノエチルピペラジン、m−フェニレンジアミン、p−フェニレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン、イソホロンジアミン、2,4,6−トリス(ジメチルアミノメチル)フェノール等のアミン類、第3級アミン塩類、ポリアミド樹脂類、ケチミン類、アルジミン類、エナミン類等の潜伏性硬化剤、イミダゾール類、ジシアンジアミド類、三弗化硼素錯化合物類、無水フタル酸、ヘキサヒドロ無水フタル酸、テトラヒドロ無水フタル酸、エンドメチレンテトラヒドロ無水フタル酸、ドデシニル無水コハク酸、無水ピロメリット酸、無水クロレン酸等の無水カルボン酸類、アルコール類、フェノール類、カルボン酸類等を挙げることができる。
【0096】
粘性改良剤としては、ジベンジリデンソルビトール、トリベンジリデンソルビトール等のゲル化剤、アマイドワックス等の脂肪酸アミド化物を例示できる。
【0097】
その他の添加剤としては、例えば顔料、各種の老化防止剤、紫外線吸収剤等が挙げられる。
【0098】
このようにして得られる本発明の組成物は、接着剤、粘着剤、塗料、塗膜防水剤、シーラント組成物、型取り用材料、注型ゴム材料、発泡材料などとして有用に使用することができる。なかでも、シーラント、接着剤への応用は特に有用である。
【0099】
本発明の硬化性組成物は、弾性シーリング剤、特に建築用シーリング材、サイディングボード用シーリング材、又は、グレージング用シーリング材として特に有用であり、建造物、船舶、自動車、道路などの密封剤として使用し得る。更に、単独又はプライマーの助けをかりて、ガラス、磁器、木材、金属、樹脂成形物などの広範囲の基質に密着し得るので、種々のタイプの密封組成物及び接着組成物としても使用可能である。接着剤としては、1液接着剤、2液接着剤、オープンタイム後に接着するコンタクト接着剤、粘着剤などに使用でき、更に、塗料、塗膜防水剤、食品包装材料、注型ゴム材料、型取り用材料、発泡材料としても有用である。
【0100】
本発明の硬化性組成物を用いた接着剤は、弾性を有し、鋼鈑、SUS、銅、アルミ等の金属、および、そのエポキシ、アクリル、シリコン、フッ素等の塗装処理をしたもの、ポリカーボネート、アクリル、ABS、発泡スチレン、発泡ウレタン、FRP等のプラスチック材料、木材、ガラス、コンクリート、モルタル、ケイカル板、磁器タイル材料等無機材料等各種基材への接着性が優れるため、上記接着方法は幅広い用途で有効に用いることができ、たとえば、自動車、電気機器中のプラスチック部品や金属部品の接着や、ハニカムパネルの作製、コンクリート等パネル基材上へのタイルやパネル基材の接着、建築や自動車内で使用される発泡材料とボード材料との間の接着等への応用が可能である。
【0101】
また、本発明の硬化性組成物は、耐候性にすぐれるため、上記接着剤としての使用とシール材としての使用とを兼用する用途や、接着剤塗布面の一部が基材表面または光照射面に出るため、耐候性が必要な用途等にも使用することが可能であり、たとえば、特開平6−0101319号公報記載のような目地シールを用いないタイルやパネルの接着工法やガラスやアクリル、カーボネート等の透明な基材の接着に用いることが可能である。
【0102】
【実施例】
合成例1
Mnが3000のポリオキシプロピレントリオールを開始剤として、亜鉛ヘキサシアノコバルテート−グライム錯体触媒の存在下、プロピレンオキシドを反応して得られた、Mnが19000でMw/Mnが1.4のポリオキシプロピレントリオールに、ナトリウムメトキサイドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリプロピレンオキシドの末端をナトリウムアルコキシドに変換した。次に塩化アリルを反応させて、未反応の塩化アリルを除去し、精製して、末端にアリル基を有するポリプロピレンオキシドを得た。この反応物に対して、ヒドロシリル化合物であるメチルジメトキシシランを白金触媒の存在下反応させ、末端にメチルジメトキシシリル基を有するポリプロピレンオキシドを得た。得られた末端にメチルジメトキシシリル基を有するポリプロピレンオキシドの23℃における粘度は28Pa・sであった。
【0103】
合成例2
Mnが2000のポリオキシプロピレングリコール900gとMnが3000のポリオキシプロピレントリオール100gに、ナトリウムメトキサイドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリプロピレンオキシドの末端をナトリウムアルコキシドに変換した後、ジクロロメタンを添加して高分子量し、その後、次に塩化アリルを反応させて、未反応の塩化アリルを除去し、精製して、Mnが約12000で、Mw/Mnが2.3であり、末端にアリル基を有するポリプロピレンオキシドを得た。この反応物に対して、ヒドロシリル化合物であるメチルジメトキシシランを白金触媒の存在下反応させ、末端にメチルジメトキシシリル基を有するポリプロピレンオキシドを得た。得られた末端にメチルジメトキシシリル基を有するポリプロピレンオキシドの23℃における粘度は22Pa・sであった。
【0104】
合成例3〜10
特開昭63−112642号公報に記載の合成例に従い、(B)成分である反応性ケイ素基含有アクリル系共重合体を製造した。表−1に示す溶剤を110℃に加熱し、表−1に示すモノマー混合物に重合開始剤として開始剤を溶解した溶液を6時間かけて滴下したのち、2時間、後重合を行い、合成例3〜10のアクリル樹脂溶液をえた。
【0105】
【表1】
【0106】
合成例11
Mnが2000のポリオキシプロピレングリコールを開始剤として、亜鉛ヘキサシアノコバルテート−グライム錯体触媒の存在下、プロピレンオキシドを反応して得られた、Mnが11000でMw/Mnが1.1のポリオキシプロピレントリオールに、ナトリウムメトキサイドのメタノール溶液を添加し、加熱減圧下メタノールを留去してポリプロピレンオキシドの末端をナトリウムアルコキシドに変換した。次に塩化アリルを反応させて、未反応の塩化アリルを除去し、精製して、末端にアリル基を有するポリプロピレンオキシドを得た。この反応物に対して、ヒドロシリル化合物であるメチルジメトキシシランを白金触媒の存在下反応させ、末端にメチルジメトキシシリル基を有するポリプロピレンオキシドを得た。得られた末端にメチルジメトキシシリル基を有するポリプロピレンオキシドの23℃における粘度は8Pa・sであった。
【0107】
実施例1
合成例3で作製したアクリル樹脂溶液に、合成例1で作製した反応性ケイ素基含有ポリオキシアルキレン系重合体を分割して加え、所定の重量部(固形分濃度比)になるように均一に混合した後、ロータリーエバポレーターでキシレンを留去したアクリル・変成シリコーン樹脂組成物を用いて、表−2記載の評価を実施した。
【0108】
比較例1〜2
実施例1と同様の操作により得たアクリル・変成シリコーン樹脂組成物を用いて、表−2記載の評価を実施した。
【0109】
【表2】
【0110】
サンプル作製直後と窒素置換容器中で50℃30日した後のサンプルの粘度を、B型粘度計を用いて23℃にて測定し、その比率から粘度上昇率を求めた。タックフリータイムは、指先に樹脂がつかなくなる時間を表記した。
【0111】
実施例2〜5
実施例1と同様の操作により得たアクリル・変成シリコーン樹脂組成物を用いて、表−3記載の評価を実施した。
【0112】
比較例3〜6
実施例1と同様の操作により得たアクリル・変成シリコーン樹脂組成物を用いて、表−3記載の評価を実施した。
【0113】
【表3】
【0114】
表面皮張時間は、表面に皮張りが生じる時間をスパテュラで確認し表記した。せん断接着強さは、ポリカーボネートを基材にしてサンプルを作製し、23℃で3日、50℃で4日硬化させた後、50mm/minで引張試験を行なった。
【0115】
【発明の効果】
(B)成分であるアクリル系共重合体の反応性ケイ素としてジメトキシシリル基とトリメトキシシリル基を含有する実施例1は貯蔵安定性、硬化速度とも良好であるのに対し、ジメトキシシリル基のみ含有する比較例1では硬化速度が遅く、また、トリメトキシシリル基のみ含有する比較例2では貯蔵安定性が劣っている。また、実施例2〜5は、ジメトキシシリル基のみ含有する比較例3に比べ速硬化性を有し、かつ、トリメトキシシリル基のみ含有する比較例4、5に比べ、良好な接着性を有している。また、シリル基の含有量のすくない比較例6では、硬化性は良好なものの、接着性が不十分であった。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a curable resin composition. An object of the present invention is to provide a novel acrylic / modified silicone resin composition excellent in fast curing property, storage stability, high weather resistance and adhesiveness.
[0002]
[Prior art]
One molecule has at least one reactive silicon group (a silicon atom-containing group containing a silicon atom bonded to a hydroxyl group or a hydrolyzable group and capable of forming a siloxane bond), particularly a methyldimethoxysilyl group A room-temperature-curable resin composition based on a polyoxyalkylene polymer can be used, for example, as a sealant or adhesive for a building, and has excellent performance at low cost. Further, a so-called acrylic / modified silicone resin composition in which an acrylic copolymer having a reactive silicon group is blended with the above polyoxyalkylene polymer, is also a base polymer for a highly weather-resistant sealing material, a one-part cold curing adhesive. It is widely marketed as a base polymer.
[0003]
This acrylic / modified silicone resin composition has characteristics of excellent initial tack, excellent adhesion to various adherends, and excellent weather resistance, as compared to an oxyalkylene polymer having a methyldimethoxysilyl group. Although it is widely used as an adhesive and a sealing material excellent in function and storage stability, it is described that technical problems to be solved in terms of internal curability and curing speed remain (Japanese Patent Application Laid-Open No. 251552).
[0004]
An example using a component having a trimethoxysilyl group as a reactive silicon-containing functional group of an acrylic copolymer has been proposed in Japanese Patent Application Laid-Open No. H01-2362458. In addition to difficulty in adjustment, there was a tendency that adhesion to a specific adhesive substrate such as polycarbonate was poor.
[0005]
Further, examples of using a component having a trimethoxysilyl group as a reactive silicon-containing functional group of a polyoxypropylene-based polymer have excellent internal curability, and have a property that a curing speed is very fast. However, it is difficult to adjust pot life and ensure storage stability, and the adhesive function is inferior to commercially available methyldimethoxysilyl-type polyoxypropylene polymers. Not reached.
[0006]
Japanese Patent Application Laid-Open No. 10-251552 discloses an acrylic / modified silicone resin composition having excellent storage stability, excellent internal curability, and very high curing speed and excellent adhesive function. The component is (A) the reactive silicon-containing functional group is a trimethoxysilyl group and the main chain is substantially a polyoxypropylene polymer, and (B) the reactive silicon-containing functional group is a methyldimethoxysilyl group and the main chain is substantially And (C) at least one selected from the group consisting of acrylates and methacrylates containing an alkoxysilyl group in the molecule and having an alkyl group having 1 to 20 carbon atoms. Acrylic-modified silicone resin composition comprising an acrylic copolymer having a reactive silicon group obtained by polymerizing a seed as a main component There has been proposed.
[0007]
However, if this method is used, two kinds of polyoxypropylene polymers having different reactive silicon-containing functional groups and an acrylic polymer having reactive silicon-containing functional groups must be separately manufactured and controlled. There is a problem that must not be. In particular, the trimethoxysilyl group-containing polyoxypropylene-based polymer has not yet been commercialized, and is presumed to have problems in terms of raw material availability, synthesis reaction, storage stability, and the like.
[0008]
Environmentally friendly acrylic / modified silicone resin composition that is easy to obtain raw materials, easy to synthesize, and has excellent fast-curing, storage stability, high weather resistance, and adhesiveness. If it can be obtained, the industrial utility value is very high.
[0009]
[Problems to be solved by the invention]
The present invention provides a novel acrylic / modified silicone-based resin composition which is easy to obtain raw materials, easily synthesized, has rapid curing properties, storage stability, high weather resistance, and excellent adhesiveness, and has high possibility of industrial practical use. It is to propose. Another object of the present invention is to develop an environment-friendly curable composition that has high social demands.
[0010]
[Means for solving the problem]
As a result of intensive studies, the present inventor has found that a polyoxyalkylene polymer (A) having a silicon-containing functional group, a silicon-containing functional group, and a molecular chain having an alkyl acrylate monomer unit and / or In a curable composition containing a copolymer (B) consisting of a methacrylic acid alkyl ester monomer unit, the curable composition has a silicon-containing functional group and has a molecular chain of an acrylic acid alkyl ester monomer unit and / or a methacrylic acid alkyl ester. Curability characterized in that at least a part of the silicon-containing functional groups of the copolymer (B) comprising monomer units is a dialkoxysilyl group and at least a part is a trialkoxysilyl group. The use of the composition impairs the excellent adhesiveness, high weather resistance, and storage stability of the conventional acrylic / modified silicone curable resin composition. Without was found to have excellent cure rate.
[0011]
Further, when the acrylic / modified silicone-based curable resin composition of the present invention is used, not only the conventionally used organotin-based catalyst, but also other than the organotin-based compound for which a practical curing speed has not been obtained until now. It has been found that a curing acceleration catalyst can be used.
[0012]
That is, the present invention provides a polyoxyalkylene polymer (A) having a silicon-containing functional group that can be crosslinked by forming a siloxane bond, a silicon-containing functional group that can be crosslinked by forming a siloxane bond, In a curable composition containing a copolymer (B) having a molecular chain comprising an acrylic acid alkyl ester monomer unit and / or a methacrylic acid alkyl ester monomer unit, the curable composition has a silicon-containing functional group, and the molecular chain is acrylic. At least a part of the silicon-containing functional group of the copolymer (B) comprising an acid alkyl ester monomer unit and / or a methacrylic acid alkyl ester monomer unit is a dialkoxysilyl group, and at least a part thereof Is a trialkoxysilyl group.
[0013]
Further, a copolymer having a silicon-containing functional group capable of being crosslinked by forming the siloxane bond and having a molecular chain of an alkyl acrylate monomer unit and / or a methacrylic acid alkyl ester monomer unit ( B) is a silicon-containing functional group at least part of which is a dialkoxysilyl group and at least part of which is a trialkoxysilyl group, and / or which can be crosslinked by forming a siloxane bond. Wherein the copolymer (B) having a molecular chain of an acrylic acid alkyl ester monomer unit and / or a methacrylic acid alkyl ester monomer unit, wherein at least a part in one molecule is a dialkoxysilyl group It is a mixture of a compound and a compound at least a part of which is a trialkoxysilyl group.
[0014]
The present invention also relates to (A) an oxyalkylene polymer having at least one dimethoxysilyl group in one molecule and having a number average molecular weight of 6,000 or more; Acrylic copolymer obtained by polymerizing (meth) acrylic acid ester or the like containing two trimethoxysilyl groups and at least 0.2 dimethoxysilyl groups on average, and (C) an acrylic / modified silicone curing comprising a curing acceleration catalyst The present invention relates to the acidic composition.
[0015]
Further, according to the present invention, a non-organotin catalyst such as an organic carboxylic acid, a metal salt of an organic carboxylic acid, an amine compound, an acidic phosphoric acid ester, a Group 3B or Group 4A metal is used as the curing-promoting catalyst of (C). In addition, a substantial curing speed is obtained.
[0016]
By using the present invention, it is possible to obtain an acrylic / modified silicone-based curable composition having an improved curing rate and excellent adhesiveness and storage stability.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
The polyoxyalkylene polymer constituting the polymerization main chain in the component (A) of the present invention is represented by a general formula:
-(-RO-)n−
Wherein R is a divalent alkylene group having 1 to 4 carbon atoms.
[0018]
Specific examples of the repeating unit include -CH2O-, -CH2CH2O-, -CH2CH (CH3) O-, -CH2CH (C2H5) O-, -CH2C (CH3)2O-, -CH2CH2CH2CH2O- and the like. The main chain skeleton of the oxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units. Further, other components such as a urethane bond component may be contained in the main chain skeleton within a range that does not significantly impair the properties of the oxyalkylene polymer. Examples of the urethane binding component include aromatic polyisocyanates such as toluene (tolylene) diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate or aliphatic polyisocyanates such as isophorone diisocyanate and hexamethylene diisocyanate, and a polyol having a repeating unit of the above formula. However, the present invention is not limited thereto. A polyoxypropylene-based polymer is preferred from the viewpoint of easy availability. The polyoxypropylene-based polymer may be linear or branched, or may be a mixture thereof. Further, other monomer units may be contained, but it is preferred that the monomer units represented by the above formula be present in the polymer in an amount of 50% by weight or more, preferably 80% by weight or more.
[0019]
The reactive silicon group-containing polyoxyalkylene polymer as the component (A) of the present invention is preferably obtained by introducing a reactive silicon group into a polyoxyalkylene polymer having a functional group.
[0020]
The molecular structure of the reactive silicon group-containing polyoxyalkylene polymer as the component (A) of the present invention varies depending on the intended use and intended properties. The method described in JP-A-11-000644 can be used.
[0021]
Characteristics such as molecular weight and molecular weight distribution are selected depending on the polymerization method and conditions. In applications where low viscosity is important, such as adhesives and coatings, the higher the molecular weight and the narrower the molecular weight distribution, that is, the smaller the Mw / Mn by GPC (gel permeation chromatography), the smaller the molecular design. Although it is often advantageous, it is very difficult to obtain by an ordinary polymerization method of oxyalkylene (anionic polymerization method using caustic alkali) or a chain extension reaction method using this polymer as a raw material, and it is a special polymerization method. Cesium metal catalysts, porphyrin / aluminum complex catalysts exemplified in JP-A-61-197631, JP-A-61-215622, JP-A-61-215623, and JP-A-61-218632, Double metal cyanide complex catalysts exemplified in JP-B-46-27250 and JP-B-59-15336, etc. It can be obtained by a method or the like using a catalyst comprising polyphosphazene salt exemplified in -273,512 JP. Practically, a method using a double metal cyanide complex catalyst is preferable. Since the molecular weight distribution of the reactive silicon group-containing polyoxyalkylene polymer depends on the molecular weight distribution of the corresponding polymer before the introduction of the reactive silicon group, the molecular weight distribution of the polymer before the introduction may be as narrow as possible. preferable.
[0022]
The introduction of the reactive silicon group may be performed by a known method. That is, for example, the following method is used. For example, in the case of a polyoxyalkylene polymer obtained using a double metal cyanide complex catalyst, JP-A-3-72527 discloses a polyoxyalkylene polymer obtained using a polyphosphazene salt and active hydrogen as a catalyst. In such a case, a method is described in JP-A-11-60723 or the like.
[0023]
(1) A polyoxyalkylene polymer having a functional group such as a hydroxyl group at the terminal is reacted with an organic compound having an active group and an unsaturated group having reactivity with the functional group, or containing an unsaturated group. By copolymerization with an epoxy compound, an unsaturated group-containing polyoxyalkylene polymer is obtained. Next, the obtained reaction product is reacted with hydrosilane having a reactive silicon group by hydrosilylation.
[0024]
(2) A compound having a mercapto group and a reactive silicon group is reacted with the unsaturated group-containing polyoxyalkylene polymer obtained in the same manner as in the method (1).
[0025]
(3) A polyoxyalkylene polymer having a functional group such as a hydroxyl group, an epoxy group, or an isocyanate group (hereinafter, referred to as a Y functional group) at a terminal thereof has a functional group having reactivity with the Y functional group (hereinafter, referred to as Y functional group) Y ′ functional group) and a compound having a reactive silicon group.
[0026]
Examples of the silicon compound having the Y 'functional group include γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) aminopropylmethyldimethoxysilane, and γ-aminopropyltriethoxysilane. Amino group-containing silanes; mercapto group-containing silanes such as γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, and the like; γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxy Epoxysilanes such as cyclohexyl) ethyltrimethoxysilane; vinyl-type unsaturated group-containing silanes such as vinyltriethoxysilane, γ-methacryloyloxypropyltrimethoxysilane, γ-acryloyloxypropylmethyldimethoxysilane; γ -Ku Chlorine atom-containing silanes such as ropropyltrimethoxysilane; isocyanate-containing silanes such as γ-isocyanatopropyltriethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropyltrimethoxysilane; methyldimethoxysilane Specific examples include, but are not limited to, hydrosilanes such as trimethoxysilane, methyldiethoxysilane, and triethoxysilane.
[0027]
These production methods are described in JP-A-3-47825, JP-A-3-157424, JP-A-11-100427, JP-A-2000-143775, JP-A-2000-169544, and JP-A-2000-149454. No. 169545, U.S. Pat. No. 6,197,912, International Publication No. It is possible to use the manufacturing method disclosed in the official gazette, US Pat.
[0028]
The reactive silicon group contained in the polyoxyalkylene polymer which is the component (A) of the present invention can be freely selected from reactive silicon groups which can be introduced by the above-mentioned production method according to required characteristics. A reaction selected from the group consisting of a methyldimethoxysilyl group, a trimethoxysilyl group, a methyldiethoxysilyl group, a triethoxysilyl group, and a methyldiisopropenyloxysilyl group and a triisopropenyloxysilyl group, from the viewpoint of availability of raw materials. In particular, a methyldimethoxysilyl group, a trimethoxysilyl group, and a triethoxysilyl group are preferable, and a methyldimethoxysilyl group is particularly preferable, from the viewpoint of the balance between the curing speed and the storage stability. It is possible to use two or more types of reactive silicon groups for the purpose of, for example, satisfying properties such as curing speed and storage stability, for example, a methyldimethoxysilyl group, a trimethoxysilyl group, and a trimethoxysilyl group. And a triethoxysilyl group, and a combination of a methyldimethoxysilyl group and a triethoxysilyl group are effective. In these combinations, a method in which different reactive silicon groups are contained in one molecule, a method in which different reactive silicon groups are used in combination, or both are possible.
[0029]
The number of reactive silicon groups contained in the polyoxyalkylene polymer as the component (A) of the present invention is preferably, on average, from 0.3 to less than 10, more preferably from 0.5 to less than 5 per molecule. . If the average is less than 0.3 per molecule, curing cannot be sufficiently performed, and if the average is 10 or more, physical properties after curing become extremely brittle.
[0030]
It is preferable that the polyoxyalkylene polymer as the component (A) of the present invention has a number average molecular weight (Mn) of 6,000 or more from the viewpoint of elongation of the cured product, adhesive peel strength and the like, and 10,000. More preferably, it is the above. When the molecular weight is less than 6,000, the cured product tends to become brittle.
[0031]
When the molecular weight distribution Mw / Mn (the ratio between the weight average molecular weight and the number average molecular weight) is 1.6 or less, it is advantageous in terms of balance between viscosity and physical properties. When Mw / Mn exceeds 1.6, this effect tends to decrease and the viscosity tends to increase. The effect is remarkable when Mw / Mn is smaller, and preferably 1.5 or less.
[0032]
Next, it has a silicon-containing functional group which can be crosslinked by forming a siloxane bond which is the component B, and has a molecular chain comprising an alkyl acrylate monomer unit and / or a methacrylic acid alkyl ester monomer unit. The polymer (hereinafter, referred to as an acrylic copolymer (B)) will be described.
[0033]
The acrylic copolymer (B) is a polymer comprising an alkyl acrylate monomer unit and / or a methacrylic acid alkyl ester monomer unit having an alkyl group having 1 to 20 carbon atoms, and a siloxane bond. Is a reactive silicon group-containing acrylic polymer that can be crosslinked by forming
[0034]
As the acrylate alkyl ester monomer unit used for the acrylic copolymer (B) used in the present invention, conventionally known acrylate monomer units can be widely used. For example, methyl acrylate, ethyl acrylate, n-propyl acrylate, N-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, decyl acrylate, undecyl acrylate, lauryl acrylate, tridecyl acrylate, myristyl acrylate, acrylic acid Cetyl, stearyl acrylate, behenyl acrylate, biphenyl acrylate and the like can be mentioned. As the methacrylate ester monomer unit, conventionally known ones can be widely used, for example, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate N-hexyl methacrylate, 2-ethylhexyl methacrylate, decyl methacrylate, undecyl methacrylate, lauryl methacrylate, tridecyl methacrylate, myristyl methacrylate, cetyl methacrylate, stearyl methacrylate, behenyl methacrylate, biphenyl methacrylate, and the like. Can be mentioned.
[0035]
The molecular chain of the copolymer (B) consists essentially of one or more alkyl acrylate monomer units and / or alkyl methacrylate monomer units. The term “consisting of the monomer unit” means that the ratio of the alkyl acrylate monomer unit and / or the alkyl methacrylate monomer unit present in the copolymer (B) exceeds 50%, It is preferably at least 70%.
[0036]
Among the combinations of these monomers, from the viewpoint of compatibility and stability, the molecular chain is substantially (a) an alkyl acrylate monomer unit having an alkyl group having 1 to 8 carbon atoms and / or Alternatively, a copolymer comprising a methacrylic acid alkyl ester monomer unit and (b) an acrylic acid alkyl ester monomer unit having an alkyl group having 9 or more carbon atoms and / or a methacrylic acid alkyl ester monomer unit is preferable. The alkyl acrylate monomer unit and / or methacrylic acid alkyl ester unit having an alkyl group having 1 to 8 carbon atoms, which is the monomer unit (a) in the copolymer, is represented by the general formula (1):
CH2= C (R5) COOR6(1)
(Where R5Is a hydrogen atom or a methyl group, R6Represents an alkyl group having 1 to 8 carbon atoms).
[0037]
R of the general formula (1)6As an alkyl group having 1 to 8, preferably 1 to 4, and more preferably 1 to 2 carbon atoms such as a methyl group, an ethyl group, a propyl group, an n-butyl group, a t-butyl group and a 2-ethylhexyl group. Can be mentioned. The monomer represented by the general formula (1) may be one type, or two or more types.
[0038]
The acrylic acid alkyl ester monomer unit having an alkyl group having 9 or more carbon atoms, which is the monomer unit (b), and / or the methacrylic acid alkyl ester unit has a general formula (2):
CH2= C (R5) COOR7(2)
(Where R5Is the same as above. R7Represents an alkyl group having 9 or more carbon atoms).
[0039]
R in the general formula (2)7Examples thereof include long-chain alkyl having 9 or more carbon atoms, such as a nonyl group, a lauryl group, a tridecyl group, a cetyl group, a stearyl group, an alkyl group having 22 carbon atoms, and a biphenyl group, usually 9 to 30, and preferably 10 to 20. Groups. The monomer represented by the general formula (2) may be one type, and may be a group in which two or more types are mixed, for example, a mixture having 12 and 13 carbon atoms.
[0040]
The molecular chain of the acrylic copolymer (B) is substantially composed of the monomer units (a) and (b), but is substantially composed of the monomer units of (a) and (b). To mean that the ratio of the monomer units (a) and (b) present in the acrylic copolymer (B) exceeds 50%, preferably 70% or more. When the proportion of the monomer units of (a) and (b) is less than 50%, the compatibility between the polyoxyalkylene polymer (A) and the acrylic copolymer (B) decreases. , Cloudiness tends to occur and the adhesive properties tend to decrease.
[0041]
The ratio of the monomer unit of (a) to the monomer unit of (b) is preferably from 95: 5 to 40:60, more preferably from 90:10 to 60:40 by weight ratio. If the ratio is greater than 95: 5, the compatibility is reduced, and if the ratio is less than 40:60, cost tends to be disadvantageous.
[0042]
The acrylic copolymer (B) may contain, in addition to the alkyl acrylate monomer unit and / or the alkyl methacrylate monomer unit, a monomer unit copolymerizable therewith. . For example, acrylic acid such as acrylic acid and methacrylic acid; amide group such as acrylamide, methacrylamide, N-methylol acrylamide and N-methylol methacrylamide; epoxy group such as glycidyl acrylate and glycidyl methacrylate; diethylaminoethyl acrylate, diethylaminoethyl methacrylate; Monomers containing an amino group such as ethyl vinyl ether; polyoxyethylene acrylate, polyoxyethylene methacrylate, and the like can be expected to have a copolymerization effect in terms of moisture curability and internal curability. Other examples include monomer units derived from acrylonitrile, styrene, α-methylstyrene, alkyl vinyl ether, vinyl chloride, vinyl acetate, vinyl propionate, ethylene, and the like.
[0043]
It is common among those skilled in the art that the monomer composition of the acrylic copolymer (B) is selected according to the application and purpose. For example, for the purpose and application requiring strength, the softening point is compared. A material having a softening point of 0 ° C. or higher, more preferably 20 ° C. or higher is desirable.
[0044]
On the other hand, for purposes of emphasizing viscosity, workability, etc., those having a relatively low softening point are desirable in the application, and those having a softening point of 20 ° C or less, more preferably 0 ° C or less, and still more preferably -20 ° C or less. Is good.
[0045]
The molecular weight of the acrylic copolymer (B) component is not particularly limited, but those having a number average molecular weight of 500 to 100,000 in terms of polystyrene by GPC are preferable from the viewpoint of difficulty during polymerization. Further, those having a molecular weight of 1,000 to 30,000 are more preferable than the balance of strength and viscosity, and those having a molecular weight of 1,000 to 20,000 are more preferable in view of easiness of handling such as workability and adhesiveness.
[0046]
The acrylic copolymer (B) can be obtained by a usual vinyl polymerization method. For example, it can be obtained by polymerizing by a solution polymerization method or a bulk polymerization method by a radical reaction, but is not particularly limited to these methods. The reaction is usually performed by adding the above-mentioned monomer, a radical initiator, a chain transfer agent, a solvent, and the like, and reacting at 50 to 150 ° C.
[0047]
Examples of the radical initiator include azobisisobutyronitrile and benzoyl peroxide.Examples of the chain transfer agent include n-dodecyl mercaptan, t-dodecyl mercaptan, mercaptans such as lauryl mercaptan, and halogen-containing compounds. Is raised. As the solvent, it is preferable to use a non-reactive solvent such as ethers, hydrocarbons and esters.
[0048]
There are various methods for introducing a reactive silicon group into the acrylic copolymer (B). For example, (method 1) a compound having a polymerizable unsaturated bond and a reactive silicon group A method of copolymerizing with (a) and (b), (method 2) a compound having a polymerizable unsaturated bond and a reactive functional group (hereinafter, referred to as Y group) (for example, acrylic acid, hydroxyethyl methacrylate, etc.) A method of copolymerizing with the compounds (a) and (b), and then reacting the resulting copolymer with a compound having a functional group capable of reacting with a reactive silicon group and a Y group (hereinafter referred to as a Y ′ group); (Method 3) A method of copolymerizing monomers (a) and (b) in the presence of a mercaptan containing a reactive silicon group as a chain transfer agent, (Method 4) Azobisnitrile containing a reactive silicon group Conversion Of monomers (a) and (b) using a product or a disulfide compound as an initiator, (method 5) monomers (a) and (b) are polymerized by living radical polymerization, Examples include a method of introducing a reactive silicon group, but the method is not particularly limited thereto. Further, it is also possible to arbitrarily combine the methods (method 1) to (method 5). For example, as a combination of (method 1) and (method 3), a compound having a polymerizable unsaturated bond and a reactive silicon group in the presence of a mercaptan containing a reactive silicon group as a chain transfer agent is converted into a monomer ( It is also possible to employ a method of copolymerizing both a) and (b).
[0049]
The compound having a polymerizable unsaturated bond and a reactive silicon group described in (Method 1) is represented by the general formula (3):
CH2= C (R5) COOR8− [Si (R3 2-b) (Xb) O]mSi (R4 3-a) Xa(3)
(Where R5Is the same as above. R8Represents a divalent alkylene group having 1 to 6 carbon atoms. R3, R4, X, a, b, and m are the same as described above. ) Or general formula (4):
CH2= C (R5)-[Si (R3 2-b) (Xb) O]mSi (R4 3-a) Xa(4)
(Where R3, R4, R5, X, a, b, and m are the same as described above. ).
[0050]
R of the general formula (3)8Examples thereof include an alkylene group having 1 to 6 carbon atoms, preferably 1 to 4 carbon atoms, such as a methylene group, an ethylene group, and a propylene group.
[0051]
Specific examples of the hydrolyzable group X in the formula (3) or (4) include, for example, a halogen atom, a hydrogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an aminooxy group, a mercapto group And alkenyloxy groups. Among these, an alkoxy group such as a methoxy group and an ethoxy group is preferred from the viewpoint of mild hydrolyticity. The monomer represented by the general formula (3) or (4) may be one type, or two or more types.
[0052]
Examples of the compound having a polymerizable unsaturated bond and a reactive silicon group represented by the general formula (3) or (4) include γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-methacryloxypropyl (alkyl) polyalkoxysilanes such as γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, γ-acryloxypropylmethyldimethoxysilane, γ-acryloxypropyltriethoxysilane, etc. and vinylalkylpolyalkoxysilanes such as γ-acryloxypropylalkylpolyalkoxysilane, vinyltrimethoxysilane, vinylmethyldimethoxysilane, and vinyltriethoxysilane.
[0053]
Examples of the groups Y and Y 'described in (Method 2) include various combinations of groups. For example, an amino group, a hydroxyl group, and a carboxylic acid group can be used as the Y group, and an isocyanate group can be used as the Y' group. Can be. As another example, as described in JP-A-54-36395, JP-A-01-272654, and JP-A-02-214759, an allyl group as a Y group and a group And silicon hydride groups (H-Si). In this case, in the presence of a Group VIII transition metal, the Y group and the Y ′ group can be bonded by a hydrosilylation reaction.
[0054]
(Method 3) Examples of the mercaptan containing a reactive silicon group used as the chain transfer agent described in (Technique 3) include γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropyltriethoxysilane, and the like. Can be. Further, as described in JP-A-59-78222, monomers (a) and (b) are prepared by using a bifunctional radical polymerizable compound and a mercaptan containing an alkoxysilyl group as a chain transfer agent. A method of copolymerizing under the following is also possible.
[0055]
Examples of the azobisnitrile compound or disulfide compound containing a reactive silicon group described in (Method 4) include alkoxysilyl compounds described in JP-A-60-23405 and JP-A-62-70405. Examples thereof include an azobisnitrile compound containing a group and a disulfide compound containing an alkoxysilyl group.
[0056]
Examples of the method described in (Method 5) include a method described in JP-A-09-272714.
[0057]
In addition, JP-A-59-168014, JP-A-60-228516, and the like, a method of using a radical polymerization initiator having a reactive silicon group and a mercaptan having a reactive silicon group in combination. I can give it.
[0058]
In the present invention, it is important that at least a part of the reactive silicon contained in the acrylic polymer (B) is a dialkoxysilyl group and at least a part is a trialkoxysilyl group. When the reactive silicon contained in the acrylic polymer (B) is only a dialkoxysilyl group, the polyoxyalkylene polymer having a reactive silicon group as the component (A) and the acrylic polymer (B) are cured. Although the curable composition containing the accelerated catalyst (C) as a main component has good storage stability and adhesiveness, the curing rate tends to be slow, which is not preferable. When the reactive silicon contained in the acrylic polymer (B) is only a trialkoxysilyl group, the curing rate of the curable composition containing the component (A), the component (B), and the component (C) as a main component is improved. However, since the trialkoxysilyl group is highly active, storage stability is reduced, and adhesion to plastics, for example, polycarbonate and the like tends to be reduced, which is not preferable.
[0059]
The method for incorporating a dialkoxysilyl group and a trialkoxysilyl group into the acrylic copolymer (B) is as follows. (1) As the acrylic copolymer (B), at least a part of one molecule is a dialkoxysilyl group. An acrylic copolymer (B) which is a silyl group and at least a part of which is a trialkoxysilyl group is used. (2) As the acrylic copolymer (B), at least a part in one molecule is a dialkoxy group A method using a mixture of a compound that is a silyl group and a compound that is at least partially a trialkoxysilyl group is possible. Also, a method combining (1) and (2), for example, an acrylic copolymer in which at least a part of one molecule is a dialkoxysilyl group and at least a part is a trialkoxysilyl group, A method in which a compound in which at least a part of one molecule is a dialkoxysilyl group or a compound in which at least a part is a trialkoxysilyl group is used in combination is possible.
[0060]
In the case of using the method (2), a method of separately polymerizing two or more acrylic copolymers and then mixing them, and a method of polymerizing an acrylic copolymer containing a dialkoxysilyl group, There is a method of polymerizing an acrylic copolymer containing a trialkoxysilyl group, or a method of conducting the polymerization in the reverse order, and the method can be selected according to the conditions of the production apparatus and the like.
[0061]
The dialkoxysilyl group contained in the acrylic copolymer (B) of the present invention can be freely selected from reactive silicon groups that can be introduced by the above-mentioned production method according to the required properties. In terms of properties, a reactive silicon group selected from the group consisting of a methyldimethoxysilyl group, a methyldiethoxysilyl group, and a methyldiisopropenyloxysilyl group is preferable, and a methyldimethoxysilyl group is particularly preferable.
[0062]
The trialkoxysilyl group contained in the acrylic copolymer (B) of the present invention can be freely selected from reactive silicon groups that can be introduced by the above-mentioned production method according to the required properties. From the viewpoint of properties, a reactive silicon group selected from the group consisting of a trimethoxysilyl group, a triethoxysilyl group, and a triisopropenyloxysilyl group is preferable. A silyl group and a triethoxysilyl group are preferred, and a trimethoxysilyl group is particularly preferred.
[0063]
The number of reactive silicon groups contained in the acrylic copolymer (B) is such that at least 0.2 or more average trialkoxysilyl groups per molecule of the acrylic copolymer (B) and at least 0 average It is necessary to contain two or more dialkoxysilyl groups from the viewpoint of the properties of the cured product, and to contain 0.3 or more trialkoxysilyl groups and at least 0.3 or more dialkoxysilyl groups on average. It is even more desirable to
[0064]
Further, the total number of reactive silicon groups contained in one molecule is preferably 0.4 or more and less than 10 on average, and more preferably 0.5 or more and less than 5 on average. If the total number of reactive silicon groups contained in one molecule is less than 0.4 on average, the amount of the acrylic copolymer component that does not enter into the crosslink increases, causing bleeding and the like, which is not preferable. When the average is 10 or more, a large amount of an expensive reactive silicon group-containing compound is used, so that the cost is high and the curability is extremely reduced.
[0065]
Further, in the curable composition of the present invention, the component (A) being a polyoxyalkylene-based polymer having a reactive silicon group, an acrylic polymer (B), and a curing acceleration catalyst (C) as main components, In order to obtain a curable composition having both the properties of a cured product, curing speed, storage stability, and adhesiveness, the reactivity contained in the polyoxypropylene polymer (A) and the acrylic copolymer (B) is required. It is important to select the type and number of silicon groups. In the case of using a dimethoxysilyl group and a trimethoxysilyl group as reactive silicon groups from the viewpoints of curing speed, storage stability, etc., the proportion of trimethoxysilyl groups in the total reactive silicon groups is calculated in terms of mole percent. It is preferably 5% or more and less than 50%, more preferably 10% or more and less than 40%. When the proportion of the trimethoxysilyl group is 5% or less, no effect of improving the curing speed or the like is obtained, and when it is 50% or more, it becomes difficult to secure storage stability.
[0066]
The proportion of the polyoxypropylene polymer (A) and the acrylic copolymer (B) used in the composition of the present invention is such that the amount of the acrylic copolymer (B) is such that the polyoxypropylene polymer (A) is used. The amount can be selected from the range of 3 to 300 parts by weight with respect to 100 parts by weight, but preferably from 5 to 150 parts by weight, and more preferably from 15 to 100 parts by weight, in view of the effect of improving the curing speed. It is preferable from the viewpoints of speed, storage stability, adhesion, and weather resistance. Usually, it is selected according to the intended use and performance, and in the conventional curable composition, the optimal selection range changes depending on the molecular weight of the acrylic copolymer, the content of the reactive silicon group, and the like. It is well known among traders.
[0067]
Next, the curing acceleration catalyst, which is the component (C), will be described.
[0068]
As the curing-promoting catalyst, which is the component (C) used in the present invention, a commonly used silanol condensation catalyst that promotes the reaction of a reactive silicon group is used. As a specific example of such a curing accelerator, a tin compound, particularly an organotin compound is a typical curing acceleration catalyst.
[0069]
Specific examples of the organotin compound include dibutyltin dicarboxylates such as dibutyltin dilaurate and dibutyltin bis (alkyl maleate); alkoxide derivatives of dialkyltin such as dibutyltin dimethoxide and dibutyltin diphenoxide; and dibutyltin. Intramolecular coordinating derivatives of dialkyltin such as tin diacetylacetonate and dibutyltin acetoacetate, reaction mixtures of dibutyltin oxide and ester compounds, reaction mixtures of dibutyltin oxide and silicate compounds, and oxy of these dialkyltin oxide derivatives Derivatives of tetravalent dialkyltin oxide such as derivatives are exemplified, but not limited thereto.
[0070]
Further, in the present invention, a curing acceleration catalyst other than the organotin compound can be used as the curing acceleration catalyst (C).
[0071]
The curing accelerating catalyst other than the organotin compound that can be used in the present invention is not particularly limited, but a nonorganotin compound, an organic acid, a combination of an organic acid and an amine, an organic acid salt, a 3B group, a 4A Non-tin compounds such as organometallic compounds containing group metal are exemplified.
[0072]
Specific examples of the non-organic tin compound include divalent tin carboxylate salts such as tin octylate, tin oleate, tin stearate and tin ferzatic acid. The combined use of these divalent tin carboxylate salts and amines is more preferable from the viewpoint that the activity can be increased and the amount used can be reduced.
[0073]
Examples of catalysts for accelerating the curing of non-tin compounds include organic acids, such as organic carboxylic acids, organic sulfonic acids, and acidic phosphoric esters.
[0074]
Examples of the organic carboxylic acid include aliphatic carboxylic acids such as acetic acid, oxalic acid, butyric acid, tartaric acid, maleic acid, octylic acid, and oleic acid, and phthalic acids and aromatic carboxylic acids such as trimellitic acid. And aliphatic carboxylic acids are preferred.
[0075]
Examples of the organic sulfonic acid include toluenesulfonic acid and styrenesulfonic acid.
[0076]
The acidic phosphoric acid ester is a phosphoric acid ester containing a -OP (= O) OH} moiety, and includes acidic phosphoric acid esters as shown below. Organic acid phosphate compounds are preferred in terms of compatibility and curing catalyst activity.
[0077]
The organic acid phosphate compound is represented by (RO)d-P (= O) (-OH)3-dD (wherein d represents 1 or 2, and R represents an organic residue).
[0078]
The following is a specific example.
(CH3O)2-P (= O) (-OH), (CH3O) -P (= O) (-OH)2, (C2H5O)2-P (= O) (-OH), (C2H5O) -P (= O) (-OH)2, (C3H7O)2-P (= O) (-OH), (C3H7O) -P (= O) (-OH)2, (C4H9O)2-P (= O) (-OH), (C4H9O) -P (= O) (-OH)2, (C8H17O)2-P (= O) (-OH), (C8H17O) -P (= O) (-OH)2, (C10H21O)2-P (= O) (-OH), (C10H21O) -P (= O) (-OH)2, (CThirteenH27O)2-P (= O) (-OH), (CThirteenH27O) -P (= O) (-OH)2, (C16H33O)2-P (= O) (-OH), (C16H33O) -P (= O) (-OH)2, (HO-C6H12O)2-P (= O) (-OH), (HO-C6H12O) -P (= O) (-OH)2, (HO-C8H16O) -P (= O) (-OH), (HO-C8H16O) -P (= O) (-OH)2, {(CH2OH) (CHOH) O}2-P (= O) (-OH), {(CH2OH) (CHOH) O-P (= O) (-OH)2, {(CH2OH) (CHOH) C2H4O}2-P (= O) (-OH), {(CH2OH) (CHOH) C2H4O} -P (= O) (-OH)2And the like, but are not limited to the above exemplified substances.
[0079]
The combined use of these organic acids and amines is more preferable from the viewpoint that the activity can be increased and the amount used can be reduced. Among the organic acid and amine combination systems, acidic phosphoric acid ester and amine, organic carboxylic acid and amine, particularly organic acidic phosphoric acid ester and amine, and aliphatic carboxylic acid and amine combined system have higher activity and quick curing. It is preferable from the viewpoint of
[0080]
As amine compounds, butylamine, octylamine, laurylamine, dibutylamine, monoethanolamine, diethanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, diethylaminopropylamine, xylylenediamine, triethylenediamine Guanidine, diphenylguanidine, 2,4,6-tris (dimethylaminomethyl) phenol, morpholine, N-methylmorpholine, 2-ethyl-4-methylimidazole, 1,8-diazabicyclo (5,4,0) undecene- 7 (DBU).
[0081]
Examples of the carboxylate metal salt other than tin include carboxylate, zirconium carboxylate, iron carboxylate, vanadium carboxylate, bismuth carboxylate, and bismuth carboxylate having carboxylic acid components such as octylic acid, oleic acid, naphthenic acid, and stearic acid. Bismuth salts such as tris (2-ethylhexoate) and bismuth-tris (neodecanoate); and metal carboxylate salts such as lead carboxylate, titanium carboxylate and nickel carboxylate. The combined use with the amines is more preferable, since the activity becomes high similarly to the tin carboxylate, so that the use amount can be reduced.
[0082]
Examples of the organic non-tin metal-based compound include an organic metal compound containing a 3B group or 4A group metal, and an organic titanate compound, an organic aluminum compound, an organic zirconium compound, an organic boron compound and the like are preferable from the viewpoint of activity. However, the present invention is not limited to this.
[0083]
Examples of the organic titanate compound include titanium alkoxides such as tetraisopropyl titanate, tetrabutyl titanate, tetramethyl titanate, tetra (2-ethylhexyl titanate) and triethanolamine titanate, titanium tetraacetylacetonate, titanium ethyl acetoacetate, and octylene. Chelate compounds such as titanium chelates such as glycolate and titanium lactate, and the like.
[0084]
Examples of the organoaluminum compound include aluminum isopropylate, aluminum sec-butoxyaluminum diisopropylate, aluminum alkoxides such as aluminum sec-butyrate, aluminum trisacetylacetonate, aluminum trisethylacetoacetate, diisopropoxyaluminum ethylacetoacetate, and the like. Aluminum chelates and the like.
[0085]
As the zirconium compound, zirconium tetraisopropoxide, zirconium tetra-n propylate, zirconium alkoxides such as zirconium normal butyrate, zirconium tetraacetylacetonate, zirconium monoacetylacetonate, zirconium bisacetylacetonate, zirconium acetylacetonate Zirconium chelates such as bisethylacetoacetate and zirconium acetate;
[0086]
These organic titanate compounds, organic aluminum compounds, organic zirconium compounds, organic boron compounds, and the like can be used in combination, but in particular, the amine compound, or the activity is enhanced by the combined use with an acidic phosphate compound. It is preferable from the viewpoint that the amount of the catalyst used can be reduced because it is possible, and more preferable from the viewpoint of adjusting the curability at a high temperature and the pot life at normal temperature.
[0087]
The amount of use of these curing accelerating catalysts (C) may be usually selected according to the intended use and performance, but the amount of the polyoxypropylene-based polymer (A) and the acrylic copolymer (B) can be selected. The total amount is preferably from 0.01 to 20 parts by weight, more preferably from 0.1 to 10 parts by weight from the viewpoint of cost, and from 0.25 to 5 from the balance between mechanical properties such as creep properties and curability. The parts by weight are optimal.
[0088]
The compositions of the present invention may use common plasticizers. Specific examples include phthalic acid esters such as dibutyl phthalate, diheptyl phthalate, di (2-ethylhexyl) phthalate, butyl benzyl phthalate, and butyl phthalyl butyl glycolate; non-aromatic two bases such as dioctyl adipate and dioctyl sebacate Acid esters; phosphate esters such as tricresyl phosphate and tributyl phosphate; and the like. Of these, phthalate plasticizers are most preferred in terms of performance and economy. However, the use of phthalate esters, especially general-purpose di (2-ethylhexyl) phthalate, tends to be avoided in recent years due to safety and health issues. A high molecular weight type plasticizer may be used in place of the low molecular weight type for reasons of safety as well as performance. Examples of the high molecular weight type plasticizer include polyester plasticizers such as polyesters of dibasic acid and polyhydric alcohol, liquid acrylic resin plasticizers; polyethers such as polypropylene glycol and derivatives thereof; poly-α. -Polystyrenes such as methylstyrene and polystyrene. Specifically, Exenol 5030 (polyether polyol having a molecular weight of about 5100) manufactured by Asahi Glass Co., Ltd., an oxypropylene-based polymer having an allyl ether group at both terminals, a molecular weight of 5200, and Mw / Mn = 1.6, SGO (Johnson polymer) and the like are exemplified.
[0089]
The composition of the present invention may be used by adding a filler, other additives, and the like, if necessary.
[0090]
Examples of the filler include heavy calcium carbonate, light calcium carbonate, colloidal calcium carbonate, kaolin, talc, silica, titanium oxide, aluminum silicate, magnesium oxide, zinc oxide, and carbon black. When a filler is used, its amount is preferably in the range of 5 to 300 parts by weight based on 100 parts by weight of the acrylic-modified silicone resin (A + B component), and in the range of 10 to 150 parts by weight in view of the balance between mechanical properties and viscosity. Is more preferred.
[0091]
Examples of the other additives include an anti-sagging agent such as hydrogenated castor oil and organic bentonite, a coloring agent, an antioxidant, and an adhesion-imparting agent.
[0092]
The curable composition of the present invention has N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ- A silane coupling agent such as aminopropyltriethoxysilane, vinyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane can be blended.
[0093]
Further, the curable composition of the present invention may optionally contain an epoxy resin and a curing agent for the epoxy resin, a viscosity improver, and other additives as necessary.
[0094]
As the epoxy resin, conventionally known epoxy resins can be widely used, for example, flame-retardant epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, glycidyl ether of tetrabromobisphenol A, novolak type epoxy resin, hydrogenated bisphenol A type epoxy resin, glycidyl ether type epoxy resin of bisphenol A propylene oxide adduct, diglycidyl-ρ-oxybenzoic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, etc. Epoxy resin, m-aminophenol epoxy resin, diaminodiphenylmethane epoxy resin, urethane-modified epoxy resin, various alicyclic epoxy resins, N, N-diglycidylani Epoxidized products of unsaturated polymers such as glycidyl ethers of polyhydric alcohols such as N, N-diglycidyl-o-toluidine, triglycidyl isocyanurate, polyalkylene glycol diglycidyl ether, glycerin, hydantoin type epoxy resins and petroleum resins And the like. Among these epoxy resins, those containing at least two epoxy groups in the molecule are preferable because they have high reactivity upon curing and the cured product easily forms a three-dimensional network. More preferred epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, novolak epoxy resin, and diglycidyl phthalate epoxy resin.
[0095]
As the epoxy resin curing agent, conventionally known epoxy resin curing agents can be widely used, for example, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-aminoethylpiperazine, m-phenylenediamine, p-phenylenediamine, Amines such as diaminodiphenylmethane, diaminodiphenylsulfone, isophoronediamine, 2,4,6-tris (dimethylaminomethyl) phenol, tertiary amine salts, polyamide resins, ketimines, aldimines, enamines, etc. Curing agents, imidazoles, dicyandiamides, boron trifluoride complex compounds, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecinyl succinic anhydride, pyromellitic anhydride DOO acid, carboxylic acid anhydrides such as anhydrous Kuroren acid, alcohols, phenols, may be mentioned carboxylic acids and the like.
[0096]
Examples of the viscosity improver include gelling agents such as dibenzylidene sorbitol and tribenzylidene sorbitol, and fatty acid amidates such as amide wax.
[0097]
Other additives include, for example, pigments, various antioxidants, and ultraviolet absorbers.
[0098]
The composition of the present invention thus obtained can be usefully used as an adhesive, a pressure-sensitive adhesive, a paint, a coating film waterproofing agent, a sealant composition, a molding material, a cast rubber material, a foam material, and the like. it can. Among them, application to sealants and adhesives is particularly useful.
[0099]
The curable composition of the present invention is particularly useful as an elastic sealant, especially a sealant for construction, a sealant for siding boards, or a sealant for glazing, as a sealant for buildings, ships, automobiles, roads and the like. Can be used. Furthermore, since it can adhere to a wide range of substrates such as glass, porcelain, wood, metal, and resin moldings alone or with the aid of a primer, it can be used as various types of sealing compositions and adhesive compositions. . As the adhesive, it can be used for one-part adhesives, two-part adhesives, contact adhesives that adhere after open time, adhesives, etc., as well as paints, waterproof coatings, food packaging materials, cast rubber materials, molds It is also useful as a material for taking and foaming material.
[0100]
The adhesive using the curable composition of the present invention has elasticity, a metal such as steel plate, SUS, copper, aluminum, and its epoxy, acrylic, silicon, fluorine and the like, a polycarbonate, and a polycarbonate. Adhesion to various base materials such as plastics such as acrylic, ABS, foamed styrene, urethane foam, and FRP, and inorganic materials such as wood, glass, concrete, mortar, calcical board, and porcelain tile materials. It can be effectively used in a wide range of applications, such as bonding plastic parts and metal parts in automobiles and electrical equipment, manufacturing honeycomb panels, bonding tiles and panel base materials on concrete and other panel base materials, building and building The present invention can be applied to, for example, adhesion between a foam material and a board material used in an automobile.
[0101]
Further, since the curable composition of the present invention has excellent weather resistance, it can be used both as an adhesive and as a sealant, or a part of the adhesive-coated surface can be a substrate surface or light. Since it comes out on the irradiation surface, it can be used for applications requiring weather resistance, etc., for example, a method of bonding tiles and panels without using joint seals as described in JP-A-6-0101319, glass and the like. It can be used for bonding a transparent substrate such as acryl and carbonate.
[0102]
【Example】
Synthesis Example 1
Polyoxypropylene having Mn of 19000 and Mw / Mn of 1.4 obtained by reacting propylene oxide with polyoxypropylene triol having Mn of 3000 as an initiator in the presence of a zinc hexacyanocobaltate-glyme complex catalyst. A methanol solution of sodium methoxide was added to the triol, and methanol was distilled off under reduced pressure with heating to convert the terminal of the polypropylene oxide into a sodium alkoxide. Next, allyl chloride was reacted to remove unreacted allyl chloride, and purified to obtain a polypropylene oxide having an allyl group at a terminal. This reaction product was reacted with methyldimethoxysilane, which is a hydrosilyl compound, in the presence of a platinum catalyst to obtain a polypropylene oxide having a methyldimethoxysilyl group at a terminal. The viscosity of the obtained polypropylene oxide having a methyldimethoxysilyl group at 23 ° C. was 28 Pa · s.
[0103]
Synthesis Example 2
A methanol solution of sodium methoxide was added to 900 g of polyoxypropylene glycol having Mn of 2000 and 100 g of polyoxypropylene triol having Mn of 3000, and methanol was distilled off under reduced pressure under heating to convert the terminal of polypropylene oxide into sodium alkoxide. Thereafter, dichloromethane is added to obtain a high molecular weight, and then allyl chloride is reacted to remove unreacted allyl chloride and purified to obtain Mn of about 12000 and Mw / Mn of 2.3. Thus, a polypropylene oxide having an allyl group at a terminal was obtained. This reaction product was reacted with methyldimethoxysilane, which is a hydrosilyl compound, in the presence of a platinum catalyst to obtain a polypropylene oxide having a methyldimethoxysilyl group at a terminal. The viscosity of the obtained polypropylene oxide having a methyldimethoxysilyl group at 23 ° C. was 22 Pa · s.
[0104]
Synthesis Examples 3 to 10
According to the synthesis example described in JP-A-63-112842, a reactive silicon group-containing acrylic copolymer as the component (B) was produced. The solvent shown in Table 1 was heated to 110 ° C., and a solution obtained by dissolving the initiator as a polymerization initiator in the monomer mixture shown in Table 1 was added dropwise over 6 hours, and post-polymerization was carried out for 2 hours. 3 to 10 acrylic resin solutions were obtained.
[0105]
[Table 1]
[0106]
Synthesis Example 11
Polyoxypropylene having Mn of 11,000 and Mw / Mn of 1.1 obtained by reacting propylene oxide with polyoxypropylene glycol having Mn of 2000 as an initiator in the presence of a zinc hexacyanocobaltate-glyme complex catalyst. A methanol solution of sodium methoxide was added to the triol, and methanol was distilled off under reduced pressure with heating to convert the terminal of the polypropylene oxide into a sodium alkoxide. Next, allyl chloride was reacted to remove unreacted allyl chloride, and purified to obtain a polypropylene oxide having an allyl group at a terminal. This reaction product was reacted with methyldimethoxysilane, which is a hydrosilyl compound, in the presence of a platinum catalyst to obtain a polypropylene oxide having a methyldimethoxysilyl group at a terminal. The viscosity of the obtained polypropylene oxide having a methyldimethoxysilyl group at 23 ° C. was 8 Pa · s.
[0107]
Example 1
To the acrylic resin solution prepared in Synthesis Example 3, the reactive silicon group-containing polyoxyalkylene polymer prepared in Synthesis Example 1 is divided and added, and the mixture is uniformly mixed so as to have a predetermined weight part (solid content concentration ratio). After mixing, the evaluation shown in Table 2 was performed using an acrylic / modified silicone resin composition from which xylene was distilled off using a rotary evaporator.
[0108]
Comparative Examples 1-2
Using the acrylic / modified silicone resin composition obtained by the same operation as in Example 1, the evaluation shown in Table 2 was performed.
[0109]
[Table 2]
[0110]
The viscosity of the sample was measured at 23 ° C. using a B-type viscometer immediately after the sample was prepared and after 30 days at 50 ° C. in a nitrogen purge container, and the rate of increase in viscosity was determined from the ratio. The tack free time is the time when the resin does not stick to the fingertip.
[0111]
Examples 2 to 5
Using the acrylic / modified silicone resin composition obtained by the same operation as in Example 1, the evaluation shown in Table 3 was performed.
[0112]
Comparative Examples 3 to 6
Using the acrylic / modified silicone resin composition obtained by the same operation as in Example 1, the evaluation shown in Table 3 was performed.
[0113]
[Table 3]
[0114]
The surface skinning time was indicated by confirming the time when skinning occurred on the surface with a spatula. For the shear adhesive strength, a sample was prepared using a polycarbonate as a base material, cured at 23 ° C. for 3 days and at 50 ° C. for 4 days, and then subjected to a tensile test at 50 mm / min.
[0115]
【The invention's effect】
In Example 1, which contains dimethoxysilyl group and trimethoxysilyl group as reactive silicon of the acrylic copolymer as the component (B), the storage stability and the curing speed are good, whereas only dimethoxysilyl group is contained. In Comparative Example 1, the curing rate was low, and in Comparative Example 2 containing only a trimethoxysilyl group, the storage stability was poor. Further, Examples 2 to 5 have faster curing properties than Comparative Example 3 containing only dimethoxysilyl groups, and have better adhesiveness than Comparative Examples 4 and 5 containing only trimethoxysilyl groups. are doing. In Comparative Example 6, in which the content of the silyl group was small, the curability was good, but the adhesiveness was insufficient.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002234227A JP4141198B2 (en) | 2001-08-14 | 2002-08-09 | Curable resin composition |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001245881 | 2001-08-14 | ||
| JP2002198036 | 2002-07-05 | ||
| JP2002234227A JP4141198B2 (en) | 2001-08-14 | 2002-08-09 | Curable resin composition |
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| Publication Number | Publication Date |
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| JP2004083606A true JP2004083606A (en) | 2004-03-18 |
| JP4141198B2 JP4141198B2 (en) | 2008-08-27 |
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| JP2005290244A (en) * | 2004-04-01 | 2005-10-20 | Cemedine Co Ltd | Curable composition |
| WO2005097898A1 (en) * | 2004-04-01 | 2005-10-20 | Kaneka Corporation | Curable composition |
| WO2005108492A1 (en) * | 2004-05-07 | 2005-11-17 | Kaneka Corporation | Curable composition |
| JP2005325314A (en) * | 2004-05-17 | 2005-11-24 | Kaneka Corp | Curable composition |
| JP2006161010A (en) * | 2004-12-10 | 2006-06-22 | Asahi Glass Co Ltd | Curable composition |
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