JP2004146714A - Carrying mechanism for workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying mechanism for workpieces whereby such carrying operations as the replacements of the two workpieces can be performed rapidly without any elevating mechanism. <P>SOLUTION: The carrying mechanism for carrying workpieces W while holding them thereby has three rotational shafts 50, 52, 54, a base member 68 attached to one of the three rotational shafts, guide rails 70A, 70B attached to the base member, moving objects 72A, 72B for moving along the rails, holding members 74A, 74B coupled to the moving objects, arms 78A, 78B coupled to the other respective rotational shafts, and motional-direction converting mechanisms 76A, 76B for converting the rotational motions of the arms into the linear motions of the moving objects. Thereby, the rotational motions of the rotational shafts are so converted into the linear motions of the respective holding members as to move the holding members linearly. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mechanism for transporting an object to be processed such as a semiconductor wafer.
[0002]
[Prior art]
Generally, in order to manufacture a semiconductor integrated circuit, various processes such as film formation, etching, oxidation, and diffusion are performed on a wafer. Then, in order to improve throughput and yield by miniaturization and high integration of the semiconductor integrated circuit, a plurality of processing apparatuses performing the same processing or a plurality of processing chambers performing different processing are connected through a common transfer chamber. So-called clustered processing systems are already known, which are interconnected to allow continuous processing of various processes without exposing the wafer to the atmosphere.
[0003]
In this type of processing system, for example, a semiconductor wafer is taken out from a cassette container installed at an introduction port of an object to be processed provided in a preceding stage of the processing system by using a transfer mechanism, and the semiconductor wafer is taken out into a transfer chamber on the introduction side of the processing system. After the wafer is positioned by an orienter for positioning, the wafer is carried into a load lock chamber capable of being evacuated, and the wafer is further processed by a plurality of vacuum processing chambers. With the use of another transfer mechanism, the wafer is loaded into a common transfer chamber in a vacuum atmosphere connected to the vacuum transfer chamber. ing. Then, the processed wafer is stored in the original cassette container through the original path, for example.
[0004]
By the way, as described above, this type of processing system has a single or a plurality of transfer mechanisms inside, and the transfer and transfer of wafers are automatically performed by these transfer mechanisms.
This transfer mechanism is composed of, for example, an articulated arm that can move horizontally, bend, extend, rotate, and move up and down. The pick provided at the tip of this arm directly holds the wafer and horizontally moves it to the transfer position to move the wafer to a predetermined position. To the position.
[0005]
The following is known as the above-mentioned conventional transport mechanism.
Japanese Patent Application Laid-Open No. 3-19252 (Patent Document 1) discloses that a rotary arm is converted into direct motion using a pivot arm connected to a rotating shaft, and a pick is attached to a tip of the pivot arm that moves linearly along a slide rail. There is disclosed a transfer mechanism provided so that the semiconductor wafer is held and transferred by the pick.
Japanese Patent Application Laid-Open No. 4-129885 (Patent Literature 2) discloses that two multi-joint arm mechanisms of a so-called frog-leg type are provided rotatably, which advance and retreat in directions opposite to each other by 180 degrees. There is disclosed a transfer mechanism in which a pick for holding is provided to transfer two wafers.
Japanese Patent Application Laid-Open No. 6-338554 (Patent Document 3) discloses that two rotating shafts which are arranged side by side and have different axis structures are provided with articulated arms which bend independently of each other. A transfer mechanism for transferring a wafer is disclosed. In this case, the two picks are attached to the arms at different heights to avoid interference with each other.
[0006]
[Patent Document 1]
JP-A-3-19252 (pages 4-5, FIGS. 1-4).
[Patent Document 2]
Japanese Patent Application Laid-Open No. HEI 4-129885 (page 2, FIG. 1).
[Patent Document 3]
JP-A-6-338554 (pages 2-3, FIGS. 1-3).
[0007]
[Problems to be solved by the invention]
Incidentally, the transfer mechanism disclosed in Patent Document 1 has a problem that it takes a long time to replace a wafer because there is only one pick for holding the wafer.
Further, the transfer mechanism disclosed in Patent Document 2 has a structure in which the two picks advance and retreat in directions different from each other by 180 degrees. Therefore, a processed wafer is taken out and carried out, and an unprocessed wafer is taken there. In order to load a wafer, it is necessary to turn the entire transfer mechanism by 180 degrees. Therefore, the throughput is improved as compared with the transfer mechanism disclosed in Patent Document 1. However, even in this case, a considerable amount of time is required for replacing the wafer. There was a problem that it took time.
[0008]
Further, in the transfer mechanism disclosed in Patent Document 3, since the two picks have different horizontal level positions, the transfer mechanism itself is moved up and down in order to exchange wafers at the same horizontal level position. There has been a problem that an elevating mechanism must be provided, and the apparatus itself has to be complicated.
The present invention has been devised in view of the above problems and effectively solving the problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer mechanism and a processing system for a target object, which can quickly perform a transfer operation such as replacement of two target objects without providing a lifting mechanism.
[0009]
[Means for Solving the Problems]
The invention according to claim 1 is a transport mechanism for holding and transporting an object to be processed, wherein the first to third rotatable rotary shafts are attached to the third rotary shaft. A base member, first and second guide rails attached to the base member, a first moving body that moves along the first guide rail, and the first moving body for holding the object to be processed. A first holding member connected to the first moving body, a first arm connected to the first rotating shaft, and a linear movement of the first moving body for rotating the first arm. A first movement direction converting mechanism for converting the first moving direction, a second moving body moving along the second guide rail, and a second moving body connected to the second moving body for holding the object to be processed. 2 holding member, a second arm connected to the second rotation shaft, and the second arm. A conveying mechanism of the object to be processed, characterized in that it comprises a second motion direction conversion mechanism for converting the rotational motion of the arm into linear motion of the second moving body.
[0010]
As described above, the first and second guide rails are provided on the pivotable base member, and the first and second moving bodies that move along these guide rails hold the object to be processed. The first and second holding members are provided, respectively, and the rotation of the first and second rotating shafts is converted into a linear movement to linearly move the holding members. The transport operation can be performed quickly.
[0011]
In this case, for example, as defined in claim 2, the tip of the first and second holding members has first and second picks for directly holding the object to be processed, respectively, One of the first and second holding members is provided with a step for positioning the first and second picks at substantially the same horizontal level as one another.
Further, for example, as defined in claim 3, the first guide rail is provided on an upper surface of the base member, and the second guide rail is provided on a lower surface.
Further, for example, as defined in claim 4, the first and second guide rails are provided on one of an upper surface and a lower surface of the base member, and the first and second guide rails are mutually connected. Located at different height positions.
[0012]
Further, as defined in claim 5, the first and second guide rails are oriented in directions different from each other by a predetermined angle.
In addition, for example, the first and second guide rails are arranged so as to intersect with each other. According to this, the moving distance of the holding member that holds the workpiece can be increased without increasing the minimum turning radius of the transport mechanism.
Further, for example, as defined in claim 7, the first movement direction conversion mechanism includes a first auxiliary guide rail provided on the first moving body and a first auxiliary guide rail provided along the first auxiliary guide rail. A first auxiliary moving body movably provided and rotatably attached to a tip of the first arm; and the second movement direction converting mechanism is provided on the second moving body. A second auxiliary guide rail, and a second auxiliary movable body provided movably along the second auxiliary guide rail and rotatably attached to the tip of the second arm.
Further, for example, as defined in claim 8, the first to third rotation shafts have a three-axis coaxial structure.
[0013]
Further, for example, as defined in claim 9, the first to third rotating shafts are provided with a different shaft structure in which the first and second rotating shafts are arranged in parallel with the third rotating shaft. I have. According to a tenth aspect of the present invention, in a transport mechanism for holding and transporting an object to be processed, first and second rotatable rotation shafts, and a base member attached to the second rotation shaft. A guide rail attached to the base member, a moving body that moves along the guide rail, a holding member connected to the moving body to hold the processing target, and the first rotation An arm connected to a shaft, and a movement direction conversion mechanism for converting a rotational movement of the arm into a linear movement of the moving body, wherein the movement direction conversion mechanism is provided on the moving body, and the guide rail and An auxiliary guide rail provided substantially orthogonally; and an auxiliary moving body movably provided along the auxiliary guide rail and rotatably attached to a tip of the arm. It is a transport mechanism of the physical body.
Therefore, when the holding member that holds the object to be processed starts or stops moving forward and backward, the speed of the holding member can be reduced, and when the holding member moves forward and backward, the speed is increased. Can be. As a result, the object can be transported safely and reliably without lowering the transport throughput.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a transfer mechanism for a workpiece according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a configuration diagram illustrating an example of a processing system provided with a transfer mechanism for a target object of the present invention, FIG. 2 is a perspective view illustrating a transfer mechanism of the target object of the present invention, and FIG. 3 is a transfer mechanism illustrated in FIG. FIG. 4 is a bottom view of the transport mechanism shown in FIG. 2, FIG. 5 is a schematic sectional view showing a bearing structure of the transport mechanism, and FIG. 6 is an operation explanatory view showing the operation of the transport mechanism.
[0015]
First, the processing system will be described.
As shown in FIG. 1, this processing system 2 has a plurality of, for example, four processing chambers 4A, 4B, 4C, and 4D, a substantially hexagonally-shaped common transfer chamber 6 that can be evacuated, and a load lock function. It mainly has first and second load lock chambers 8A and 8B that can be evacuated, and an elongated introduction-side transfer chamber 10.
Specifically, each of the processing chambers 4A to 4D is joined to four sides of the common transfer chamber 6 having a substantially hexagonal shape, and the first and second load lock chambers 8A and 8B are connected to the other two sides. Each is joined. The introduction-side transfer chamber 10 is commonly connected to the first and second load lock chambers 8A and 8B.
[0016]
The space between the common transfer chamber 6 and the four processing chambers 4A to 4D and the space between the common transfer chamber 6 and the first and second load lock chambers 8A and 8B can be opened and closed in an airtight manner. A gate valve G is interposed and joined to form a cluster tool, and can be communicated with the common transfer chamber 6 as needed. A gate valve G, which can be opened and closed in a gas-tight manner, is also interposed between the first and second load lock chambers 8A and 8B and the introduction-side transfer chamber 10.
[0017]
In the four processing chambers 4A to 4D, susceptors 12A to 12D on which semiconductor wafers as processing objects are placed are provided, respectively, and susceptors 12A to 12D are of the same type or different types with respect to the semiconductor wafer W as the processing object. Is performed. In the common transfer chamber 6, a second transfer mechanism 14 is provided at a position where the two load lock chambers 8A and 8B and the four processing chambers 4A to 4D can be accessed. This has two picks 14A and 14B, and the picks 14A and 14B hold the wafers so that two wafers can be handled at a time. The detailed structure of the second transport mechanism 14 will be described later.
[0018]
The introduction-side transfer chamber 10 is formed of a horizontally elongated box. One or a plurality of, in the illustrated example, three loading chambers for introducing a semiconductor wafer to be processed is provided on one side of the horizontally long box. An opening 16 is provided, and an opening / closing door 21 that can be opened and closed is provided at each carry-in entrance 16. In addition, introduction ports 18A, 18B, and 18C are provided corresponding to each of the carry-in ports 16, and one cassette container 20 can be placed on each of the introduction ports 18A, 18B, and 18C. Each cassette container 20 is capable of accommodating a plurality of, for example, 25 wafers W mounted thereon at equal pitches in multiple stages.
[0019]
In the introduction-side transfer chamber 10, a first transfer mechanism 22, which is an introduction-side transfer mechanism for transferring the wafer W along its longitudinal direction, is provided. The first transport mechanism 22 is slidably supported on a guide rail 24 provided to extend in the introduction-side transport chamber 10 along the length direction. The guide rail 24 incorporates, for example, a linear motor having an encoder as a moving mechanism. By driving the linear motor, the first transport mechanism 22 moves along the guide rail 24.
[0020]
Further, the first transport mechanism 22 has two articulated arms 32 and 34 arranged in two upper and lower stages. Bifurcated picks 22A and 22B are attached to the tips of the articulated arms 32 and 34, respectively, and the wafers W are directly held on the picks 22A and 22B, respectively. Therefore, each of the articulated arms 32 and 34 can freely bend and extend and move up and down in the radial direction from the center, and the bending and elongating operation of each of the articulated arms 32 and 34 can be individually controlled. The rotating shafts of the articulated arms 32 and 34 are coaxially and rotatably connected to the base 36, respectively, so that they can be integrally rotated, for example, in a turning direction with respect to the base 36. Here, the articulated arms 32 and 34 may not be two but only one.
[0021]
An orienter 26 for aligning a wafer is provided at the other end of the introduction-side transfer chamber 10, and the two load-lock chambers 8A and 8B are provided in the middle of the introduction-side transfer chamber 10 in the longitudinal direction. It is provided through the gate valve G which can be opened and closed.
The orienter 26 has a turntable 28, and rotates with the wafer W placed thereon. An optical sensor 30 for detecting the peripheral portion of the wafer W is provided on the outer periphery of the turntable 28, so that the positioning notch of the wafer W, for example, the position direction of the notch or the orientation flat or the position of the center of the wafer W The shift amount can be detected.
[0022]
In the first and second load lock chambers 8A and 8B, mounting tables 38A and 38B each having a diameter smaller than the wafer diameter are provided for temporarily mounting the wafer W. The control of the entire operation of the processing system 2, for example, the operation control of each of the transport mechanisms 14, 22 and the orienter 26, is performed by a control unit 40 including, for example, a microcomputer.
[0023]
Next, the second transfer mechanism 14 provided in the common transfer chamber 6 will be described with reference to FIGS.
First, as shown in FIG. 5, the second transfer mechanism 14 is operated by three rotating shafts 50, 52, and 54 provided in a mounting hole formed in the bottom plate 6A of the common transfer chamber 6 in an airtight state. These three rotation shafts 50, 52, 54 are formed in a three-axis coaxial structure so that each rotation center is the same as disclosed in, for example, JP-A-11-198070. The innermost rotating shaft (first rotating shaft) 50, the intermediate rotating shaft (third rotating shaft) 52, and the outermost rotating shaft (second rotating shaft) 54 are sequentially coaxially formed outward from the center. Is done. Bearings 56 are interposed between the coaxially adjacent rotary shafts 50, 52, 54 and between the outermost peripheral rotary shaft 52 and the mounting hole section screen of the bottom plate 6A, respectively. Each of 52 and 54 is individually rotatable.
[0024]
The lower portions of the rotating shafts 50, 52, 54 are hermetically surrounded by a casing 60 attached to the bottom plate 6A via a sealing member 58 such as an O-ring. Drive motors 62, 64, 66, such as step motors, each comprising a rotor and a stator, are provided between the lower portions of the rotary shafts 50, 52, 54 and the inner wall of the casing 60, respectively. The rotation shafts 50, 52, 54 can be rotated forward and backward.
[0025]
Returning to FIGS. 2 to 4, the second transfer mechanism 14 has the two picks 14A and 14B for directly holding the wafer as described above. Specifically, first, the second transport mechanism 14 has a plate-shaped base member 68 formed in a substantially V-shape, and the base member 68 is rotated by an intermediate rotating shaft so as to be horizontal. (Third rotating shaft) 52 is attached and fixed, and is rotatable (see FIG. 5). Here, the term "first to third rotation axes" does not indicate the arrangement position of the rotation axes, but is simply used to formally distinguish the three rotation axes. The V-shaped base member 68 has, for example, an opening angle of about 60 degrees. This opening angle is the same as the opening direction of the processing chambers 4A to 4D adjacent to each other with respect to the rotation center of the second transfer mechanism 14 and the mounting direction of the first and second load lock chambers 8A and 8B. It is set as follows.
[0026]
As shown in FIG. 3, a first guide rail 70A is linearly provided on one side of the upper surface of the base member 68, and the first guide rail 70A is provided along the rail. The first moving body 72A is movably fitted so as not to come off.
An L-shaped first holding member 74A, which is formed in an L-shape and whose leading end is substantially parallel to the first guide rail 70A, is attached and fixed to the upper surface side of the first moving body 72A. Have been. The one pick 14A is attached to the tip of the first holding member 74A.
[0027]
A first movement direction changing mechanism 76A is provided on the base side of the first holding member 74A. A first arm 78A is attached to the innermost rotation shaft (first rotation shaft) 50 by connecting the base side thereof, and the tip of the first arm 78A is connected to the first arm 78A. The first arm 78A is connected to the movement direction conversion mechanism 76A to convert the rotational movement of the first arm 78A into the linear movement of the first moving body 72A. Specifically, the first movement direction conversion mechanism 76A includes a short first auxiliary guide rail 80A attached to the base end of the first holding member 74A, that is, the first moving body 72A side. It comprises a first auxiliary moving body 82A which is fitted so as not to be movably detached along the first auxiliary guide rail 80A, and the tip of the first arm 78A is provided with the first auxiliary moving body 82A. It is rotatably attached to the upper part of the auxiliary moving body 82A via a rotating shaft 84A. In this case, the first auxiliary guide rail 80A is disposed so as to be substantially perpendicular to the lower first guide rail 70A in plan view.
[0028]
With this configuration, the first inner moving shaft 50 is rotated to rotate the first arm 78A in the forward / reverse direction, whereby the first auxiliary moving body of the first motion direction conversion mechanism 76A is rotated. 82A slides on the first auxiliary guide rail 80A, and at this time, the lower first moving body 72A slides along the first guide rail 70A, so that the tip of the first holding member 74A. Is moved forward and backward along the first guide rail 70A.
Here, the other pick 14B is also attached to the lower surface side (rear surface side) of the base member 68 in exactly the same configuration.
[0029]
As shown in FIG. 4, a second guide rail 70B is linearly provided on the other side of the lower surface (back surface) of the base member 68, and the second guide rail 70B is provided with this rail. The second moving body 72B is fitted so as not to come off so as to be able to move along.
The second movable body 72B has an upper surface (lower surface in FIG. 2) formed in an L-shape on the upper surface side thereof, and has a front end side substantially parallel to the second guide rail 70B. Is attached and fixed. The other pick 14B is attached to the tip of the second holding member 74B.
[0030]
A second movement direction changing mechanism 76B is provided on the base side of the second holding member 74B. A second arm 78B is attached to the outermost peripheral rotation shaft (second rotation shaft) 54 by connecting its base to the outermost rotation shaft (second rotation shaft). The second arm 78B is connected to the direction changing mechanism 76B to convert the rotational movement of the second arm 78B into the linear movement of the second moving body 72B. Specifically, the second movement direction conversion mechanism 76B includes a short second auxiliary guide rail 80B attached to the base end of the second holding portion 74B, that is, the second moving body 72B. A second auxiliary moving body 82B is provided so as to be fitted so as not to be movable along the second auxiliary guide rail 80B, and the distal end of the second arm 78B is connected to the second auxiliary moving body 82B. It is rotatably attached to the upper part (the lower part in FIG. 2) of the auxiliary moving body 82B via a rotating shaft 84B. In this case, the second auxiliary guide rail 80B is disposed so as to be substantially perpendicular to the lower second guide rail 70B in plan view.
[0031]
With such a configuration, the second outer moving body 82B of the second motion direction conversion mechanism 76B is rotated by rotating the outermost peripheral rotation shaft 54 and rotating the second arm 78B in the forward and reverse directions. Slides on the second auxiliary guide rail 80B, and at this time, the lower second moving body 72B slides along the second guide rail 70B. The provided pick 14B moves forward and backward along the second guide rail 70B.
[0032]
Here, the second holding member 74B is different from the first holding member 74A, and in the middle of the second holding member 74B in the longitudinal direction, the second holding member 74B is cut into two parts so that the heights of the two members are changed up and down. A differently connected step 86 is provided so that both picks 14A, 14B are at substantially the same horizontal level as one another. Note that the step portion 86 may be provided on the first holding member 74A instead of the second holding member 74B. As can be seen from FIGS. 3 and 4, the first and second guide rails 70A and 70B are arranged to intersect if they are assumed to be on the same plane. Therefore, it is possible to increase the moving distance of the holding member that holds the workpiece without increasing the minimum turning radius of the transport mechanism.
[0033]
Next, the operation of the present embodiment configured as described above will be described.
First, as shown in FIG. 1, an unprocessed semiconductor wafer W is loaded from a cassette container 20 installed in any one of the three introduction ports 18A to 18C by using the first transfer mechanism 22. Is taken out, and the wafer W is transferred to the orienter 26 where the wafer W is aligned.
The wafer W after the alignment is held by the first transfer mechanism 22 again, and is carried into one of the first and second load lock chambers 8A and 8B. The wafer W in the load lock chamber is taken into the common transfer chamber 6 that has been pre-evacuated using the second transfer mechanism 14 according to the present invention provided in the common transfer chamber 6, and the wafer W W is carried into a predetermined processing chamber of the four processing chambers 4A to 4D, and a predetermined processing is performed on the wafer W. When the wafer W is loaded into the processing chamber, generally, the processed wafer that has been loaded into the processing chamber and has been processed is replaced with an unprocessed wafer. In this manner, the wafer W is sequentially transferred to another processing chamber as needed using the second transfer mechanism 14, and a predetermined process is performed each time. Then, the wafer W on which all processing is completed is returned to the original cassette container 20 via one of the two load lock chambers 8A and 8B.
[0034]
Next, the operation of the second transport mechanism 14 will be described in detail with reference to FIGS.
When a specific pick of the second transport mechanism 14 is oriented so as to face a specific direction, for example, a specific processing chamber or a load lock chamber, the base member 68 is rotated by rotating the intermediate rotary shaft 52. To turn a specific pick, for example, the pick 14A, in that direction (see FIG. 6A). At this time, in order to keep the picks 14A, 14B stationary in directions other than the turning directions, the innermost rotation shaft 50 and the outermost rotation shaft 54 are also rotated in synchronization with the intermediate rotation shaft 52. Rotate in the direction.
[0035]
To move the first pick 14A forward and backward in this state, the first arm 78A is turned in the forward and reverse directions by rotating the innermost peripheral rotation shaft 50 in the forward and reverse directions, whereby the first motion conversion mechanism 76A is rotated. The first auxiliary moving body 82A slides on the first auxiliary guide rail 80A. At this time, the first moving body 72A slides along the first guide rail 70A. The pick 14A provided at the tip of the member 74A moves forward and backward along the first guide rail 70A. In this manner, the wafer W can be carried in and out of each of the processing chambers 4A to 4D and the first and second load lock chambers 8A and 8B (see FIGS. 6B and 6C). )reference).
[0036]
Further, by rotating the outermost peripheral rotation shaft 54 forward and backward with respect to the other pick 14B, the pick 14B can be moved forward and backward in the same manner as described above. Therefore, when replacing the wafer W in the processing chamber, the processed wafer is received by one empty pick, for example, the pick 14A, and then the base member 68 is turned by 60 degrees and held by the other pick 14B. It operates to carry the unprocessed wafer into the processing chamber.
Here, since both picks 14A and 14B are set at substantially the same horizontal level, it is possible to carry in / out the wafer W without providing an elevating mechanism for elevating the entire second transfer mechanism 14. . Here, the substantially same horizontal level means that a difference in height that can be absorbed by a lifter pin (not shown) for transferring a wafer W provided in a processing chamber or the like is included in the same horizontal level. .
[0037]
Further, when the wafer is replaced, the base member 68 only needs to be turned by about 60 degrees, so that the turning angle is smaller than in the case of the conventional mechanism, and the replacement operation can be performed promptly. Further, the opening angle of the picks 14A, 14B, that is, the reciprocating direction is directed to the installation direction of two adjacent processing chambers, respectively. Then, both processing chambers can be simultaneously accessed.
The opening angle of the picks 14A and 14B is not limited to 60 degrees, and may be set to any opening angle of 0 to 180 degrees. Set to avoid interference.
[0038]
Further, adjusting means for adjusting the mounting position of the first and second guide rails 70A, 70B with respect to the base member 68 may be provided to adjust the opening angle of the picks 14A, 14B. The opening angle of both picks 14A and 14B can be adjusted according to the number of planes of the common transfer chamber 6 to be attached.
Further, particles are hardly generated on the sliding surfaces of the first and second guide rails 70A and 70B and the first and second auxiliary guide rails 80A and 80B. For example, it is preferable to form a coating such as a fluororesin. preferable.
[0039]
In the above-described embodiment, the base member 68 of the intermediate rotation shaft 52 is attached, the first arm 78A is attached to the innermost rotation shaft 50, and the second arm 78B is attached to the outermost rotation shaft 54. However, the present invention is not limited to this, and may be configured as shown in FIG. 7, for example. FIG. 7 is a configuration diagram showing a modified example of a state of attachment of each rotation shaft to the first and second arms and the base member. That is, the base member 68 may be attached to the outermost rotating shaft 54, the first arm 78A may be attached to the innermost rotating shaft 50, and the second arm 78B may be attached to the intermediate rotating shaft 52.
[0040]
In this case, the first guide rail 70A is attached via a first leg 90A that stands up from one side of the base member 68. The second guide rail 70B is attached via a second leg 90B that stands upright from the other side of the base member 68. Here, the height (length) of the second leg is different from the height (length) of the first leg, and the first and second guide rails 70A and 70B interfere with each other. Not to be. The configuration of the other parts is the same as that described with reference to FIGS. Here, the first rotating shaft is the innermost rotating shaft 50, the second rotating shaft is the outermost rotating shaft 54, and the third rotating shaft is the intermediate rotating shaft 52.
[0041]
In this case, since the rotating shaft to which the base member 68 to which the largest rotating torque is applied is attached is the outermost rotating shaft 54 having the largest diameter among the three rotating shafts 50, 52, 54, FIG. The stability of the rotation operation can be improved as compared with the transfer mechanism having the structure shown in FIG. In this case, instead of attaching the second guide rail 70B to the second leg 90B, it may be attached to the base member 68.
Further, in each of the above embodiments, the case where the three rotating shafts 50, 52, and 54 have a three-axis coaxial structure has been described as an example. However, the present invention is not limited to this. For example, as shown in FIG. The present invention may be applied to a shaft structure.
FIG. 8 is a schematic sectional view showing an example of a different shaft structure. That is, as shown in FIG. 8, a support member 90 is provided on the bottom plate 6A of the common transfer chamber 6, and the bottom plate 6A and the support member 90 form a large-diameter rotary shaft 92 having a hollow inside with the largest diameter. It is provided rotatably via a bearing 94.
[0042]
Then, the two rotating shafts 96 and 98 are provided so as to be rotatable via bearings 100 and 102 in parallel so as to be inserted into the large-diameter rotating shaft 92. As a result, the two rotating shafts 96 and 98 are arranged side by side in a different shaft structure.
The lower portion of each of the rotating shafts 92, 96, 98 is air-tightly covered by the casing 60 provided via the seal member 58. In the illustrated example, the description of the drive motor is omitted.
In this case, the large-diameter rotary shaft 92 serves as a third rotary shaft, and the base member 68 (see FIG. 7) is attached thereto. Then, the two rotating shafts 96 and 98 become, for example, first and second rotating shafts, and the first arm 78A and the second arm 78B are attached to them, respectively.
[0043]
Further, in each of the above embodiments, the entire second transport mechanism 14 has a structure that cannot be moved in the horizontal direction. However, the second transport mechanism 14 is provided with a horizontal moving mechanism, and the entire second transport mechanism 14 is moved horizontally ( (The X-axis direction).
Further, the second transfer mechanism 14 described above is provided in the common transfer chamber 6 that can be evacuated, but is not limited thereto, and may be provided in a transfer chamber in an atmospheric pressure atmosphere, or The introduction side transfer chamber 10 may be provided with the horizontal movement mechanism described above.
In addition, although a semiconductor wafer has been described as an example of an object to be processed, the present invention is not limited to this, and the present invention can be applied to a glass substrate, an LCD substrate, and the like.
[0044]
【The invention's effect】
As described above, according to the object transfer mechanism of the present invention, the following excellent operational effects can be exhibited.
First and second guide rails are provided on a rotatable base member, and first and second holding members are held on first and second moving bodies that move along these guide rails. Are provided, and the rotational movement of the first and second rotating shafts is converted into a linear movement to linearly move the respective holding members, so that a transfer operation such as an exchange operation of the object to be processed can be performed quickly. Can be done.
[Brief description of the drawings]
FIG. 1 is a configuration diagram illustrating an example of a processing system provided with a transfer mechanism for a target object according to the present invention.
FIG. 2 is a perspective view illustrating a transfer mechanism of the object to be processed according to the present invention.
FIG. 3 is a top view of the transport mechanism shown in FIG. 2;
FIG. 4 is a bottom view of the transport mechanism shown in FIG. 2;
FIG. 5 is a schematic cross-sectional view illustrating a bearing structure of the transport mechanism.
FIG. 6 is an operation explanatory view showing the operation of the transport mechanism.
FIG. 7 is a configuration diagram showing a modified example of a mounting state of each rotation shaft, first and second arms, and a base member.
FIG. 8 is a schematic sectional view showing an example of a different shaft structure.
[Explanation of symbols]
2 Processing system
4A-4D processing room
6 common transfer room (transfer room)
8A, 8B Load lock room
10 Introducing transfer room (transfer room)
14 Second transport mechanism
14A, 14B Pick
22 First transport mechanism
50, 52, 54 Rotation axis
68 Base member
70A First guide rail
70B Second guide rail
72A first moving object
72B Second moving object
74A first holding member
74B Second holding member
76A First motion direction conversion mechanism
76B Second motion direction conversion mechanism
78A First arm
78B Second arm
80A first auxiliary rail
80B 2nd auxiliary rail
82A first auxiliary moving body
82B second auxiliary moving body
86 steps
90A first leg
90B 2nd leg
W Semiconductor wafer (workpiece)

Claims (10)

In a transport mechanism for holding and transporting the workpiece,
First to third rotatable rotation shafts,
A base member attached to the third rotation shaft;
First and second guide rails attached to the base member;
A first moving body that moves along the first guide rail;
A first holding member connected to the first moving body to hold the processing target;
A first arm connected to the first rotation shaft;
A first movement direction conversion mechanism that converts a rotational movement of the first arm into a linear movement of the first moving body;
A second moving body that moves along the second guide rail;
A second holding member connected to the second moving body to hold the processing target;
A second arm connected to the second rotation shaft;
A second movement direction conversion mechanism that converts a rotational movement of the second arm into a linear movement of the second moving body;
A transport mechanism for a workpiece, comprising: The distal ends of the first and second holding members have first and second picks respectively for directly holding the object to be processed, and one of the first and second holding members has 2. The transport mechanism according to claim 1, wherein a step is formed for positioning the first and second picks at substantially the same horizontal level. 3. The transfer mechanism according to claim 1, wherein the first guide rail is provided on an upper surface of the base member, and the second guide rail is provided on a lower surface. 4. The first and second guide rails are provided on one of an upper surface and a lower surface of the base member, and the first and second guide rails are arranged at different heights. 3. The transporting mechanism for an object to be processed according to claim 1, wherein: 5. The transport mechanism according to claim 1, wherein the first and second guide rails are oriented in directions different from each other by a predetermined angle. 6. The transport mechanism according to claim 5, wherein the first and second guide rails are arranged so as to intersect each other. The first movement direction conversion mechanism includes:
A first auxiliary guide rail provided on the first moving body,
A first auxiliary moving body that is provided movably along the first auxiliary guide rail and that is rotatably attached to a tip of the first arm;
The second movement direction conversion mechanism includes:
A second auxiliary guide rail provided on the second moving body,
7. A second auxiliary moving body which is provided movably along the second auxiliary guide rail and is rotatably attached to a tip of the second arm. A transport mechanism for an object to be processed according to any one of the above. The transport mechanism for a workpiece according to any one of claims 1 to 7, wherein the first to third rotation shafts have a three-axis coaxial structure. 8. The apparatus according to claim 1, wherein the first to third rotating shafts are provided with a different shaft structure in which first and second rotating shafts are arranged in parallel with a third rotating shaft. A transport mechanism for an object to be processed according to any one of the above. In a transport mechanism for holding and transporting the workpiece,
First and second rotatable rotation shafts;
A base member attached to the second rotating shaft;
A guide rail attached to the base member,
A moving body that moves along the guide rail;
A holding member connected to the moving body to hold the object to be processed,
An arm connected to the first rotation shaft;
A movement direction conversion mechanism that converts the rotational movement of the arm into a linear movement of the moving body,
The movement direction conversion mechanism,
An auxiliary guide rail provided on the moving body, and provided substantially orthogonal to the guide rail;
An object transfer mechanism, comprising: an auxiliary moving body movably provided along the auxiliary guide rail and rotatably attached to a tip of the arm.

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