JP2004193386A - Device for holding electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To hold electronic parts mounted on a wiring board to reduce any load to a lead terminal against an impact. <P>SOLUTION: This holding device is provided with a holding member 9 constituted of a ceiling section 13 and opposite both side face sections 14 and 15 made of metallic plate materials with its cross-section shaped like almost a U character so as to be assembled into a wiring board 2 when fitting projecting sections 19 and 20 formed on both the side face sections 14 and 15 are fit into a fitting hole 7. An electronic component 8 whose main body section 10 is supported by a lead terminal 11 in a one-end holding status, and mounted on the wiring board 2 is fit into an internal holding space section 16 while a side face 10b is butted to a stopper projecting section 19 so as to be positioned and held by the holding member 9. Thus, it is possible to reduce any load to a lead terminal 11 even when any impact is added. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component holding device for holding a relatively large and heavy electronic component such as an electrolytic capacitor, a diode, or a resistance element used by being mounted on a wiring board.
[0002]
[Prior art]
In an electronic device or the like, as shown in FIG. 5, an electronic component 54 is provided on a second main surface 51b of a wiring board 51 having a predetermined conductor pattern 52, a land 53 and the like formed on at least a first main surface 51a. Is mounted on a wiring board device 50 which is surface-mounted. In the wiring board device 50, the electronic component 54 having the lead terminal 55 protruding from the side surface of the main body portion 54a is inserted into the terminal hole 56 facing the second main surface 51b and the first main surface 51a. Solder 57 is applied to the tip of the lead terminal 55 penetrated through, and is electrically and mechanically fixed to the land 53 and mounted.
[0003]
[Problems to be solved by the invention]
By the way, in the conventional wiring board device 50, as described above, the electronic component 54 is bent in an L-shape from the main body 54 a and protrudes and is soldered to the wiring board 51 by the lead terminal 55. 54a is supported in a cantilever state floating from the second main surface 51b. Therefore, in the wiring board device 50, in the case of a relatively large and heavy electronic component 54 such as an electrolytic capacitor, the load on the lead terminal 55 becomes extremely large due to shock, vibration, or the like, so that the solder 57 is peeled off or the lead is removed. There is a problem that the terminal 55 is easily damaged or the like.
[0004]
Therefore, in the wiring board device 50, when the electronic component 54 is mounted on the wiring board 51, the adhesive 58 is filled between the electronic component 54 and the second main surface 51b as shown in FIG. A countermeasure such as fixing the component 54 has been taken. However, the wiring board device 50 has a problem that the operation of filling the narrow gap between the electronic component 54 and the second main surface 51b with the adhesive 58 is troublesome. Also, in the wiring board device 50, when the filling amount of the adhesive 58 is too large, a flow may occur, and when the filling amount is small, the electronic component 54 cannot be firmly fixed. There is a problem that the management of the filling amount of is troublesome.
[0005]
Therefore, the present invention provides an electronic component holding device having a simple structure that holds an electronic component mounted on a wiring board so that a load on a lead terminal is reduced even when an impact or the like is applied. The purpose is to provide.
[0006]
[Means for Solving the Problems]
The electronic component holding device according to the present invention that achieves the above-described object includes an electronic component having a lead terminal that is bent and protruded in a substantially L shape from the side surface of the main body, and the tip of the lead terminal is attached to the wiring board. By being inserted into the formed terminal holes and subjected to soldering, it is attached to a wiring board device mounted on the wiring board via the lead terminals. The electronic component holding device is formed in a substantially U-shaped cross section including a ceiling portion and two side portions facing each other by a metal plate material, and is fitted into the internal space from the opened first side opening portion side. And a holding member for holding the main body by the ceiling and the side surfaces. The holding device for an electronic component is assembled on the wiring board by fitting the holding member into a fitting hole formed in the wiring board with a fitting convex piece formed integrally with the lower end edge of the side surface, and The fitting side surface of the electronic component fitted into the internal space is locked by a stopper convex portion integrally formed facing the second side opening portion facing the first side opening portion from the portion or the side portion. I do.
[0007]
The electronic component holding device is formed such that the distal end of each fitting convex portion formed on each of the both side surfaces of the holding member is bent in the horizontal direction at the thickness position of the wiring board so as to be substantially L-shaped, The fitting hole formed in the wiring board is formed with a long hole shape enough to penetrate the fitting protrusion, and the holding member is formed after the fitting protrusion penetrates the corresponding fitting hole. By being moved along the longitudinal direction, the opening edge of the fitting hole is sandwiched between the lower end edge of the side surface portion and the horizontal bent portion of the fitting projection, and is assembled to the wiring board.
[0008]
The electronic component holding device is configured such that each of the fitting projections formed on both side surfaces of the holding member has a small interval or a large interval with respect to the facing interval of each fitting hole at the thickness position of the wiring board. A curved convex portion is formed. In the electronic component holding device, each of the fitting projections that penetrate the facing fitting hole in a state where the holding member is expanded or narrowed returns to a natural state and is locked to the opening edge of the fitting hole. By doing so, it is assembled to the wiring board. In the electronic component holding device, the holding member may be configured such that a tip end of each of the fitting protrusions fitted into the corresponding fitting hole is soldered to a dummy land formed around the fitting hole on the main surface of the wiring board. Attached and fixed.
[0009]
Also, in the electronic component holding device, a tongue-shaped guide convex portion that plays a guiding action when the electronic component is fitted into the internal space is cut and raised on the ceiling portion on the first side opening side of the holding member. Is done.
[0010]
In the electronic component holding device, a pressing protrusion for pressing the ceiling surface of the electronic component fitted into the internal space against the main surface of the wiring board is integrally formed on the inner surface of the ceiling portion of the holding member.
[0011]
According to the electronic component holding device of the present invention configured as described above, since the main body is held by the holding member assembled to the wiring board, it is a relatively large and heavy electronic component. In addition, even when an impact or the like is applied, the load on the lead terminals is reduced. Therefore, according to the electronic component holding device, the occurrence of breakage of the lead terminals and peeling of the solder can be prevented, and the reliability can be improved.
[0012]
According to the electronic component holding device, the holding member is assembled to the wiring board by an extremely simple operation of penetrating the fitting convex piece into the corresponding fitting hole. According to the electronic component holding device, the distal end portion of the fitting projection is soldered to the wiring board simultaneously with, for example, the soldering process of the lead terminal, so that a strong assembling is performed.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to a wiring board device 1 shown in the drawings. As shown in FIGS. 1 and 2, the wiring board device 1 has an appropriate conductor pattern 3, land 4 or dummy land 5 formed on the lower first main surface 2a and terminal holes 6 (6A, 6B). ) And the electronic component 8 is mounted on the upper second main surface 2b of the wiring board 2 in which the fitting holes 7 (7A, 7B) are formed, while being held by the holding member 9 as described in detail later. Have been. The land 4 is formed around the terminal hole 6 and the dummy land 5 is formed around the fitting hole 7 in the wiring board 2. In the following description, terms such as "up and down" and "left and right" are used with reference to FIG.
[0014]
The electronic component 8 is a relatively large and heavy component such as, for example, an electrolytic capacitor. Although the details are omitted, a pair of lead terminals 11 (from the left side surface 10 a of the main body 10 in which the capacitor element is sealed with insulating resin). 11A, 11B) are projected. The electronic component 8 folds the lead terminals 11 at right angles so that the base end protrudes horizontally from the one side surface 10a of the main body 10 and the front ends 11a and 11b protrude downward from the outer periphery. It is bent to give an overall L-shape.
[0015]
As shown by the arrow in FIG. 2, the electronic member 8 is assembled to the wiring board 2 with the tip portions 11a and 11b of the lead terminals 11 penetrating through the opposing terminal holes 6 from the second main surface 2b side. In the electronic member 8, as shown in FIG. 1, tips 11 a and 11 b of each lead terminal 11 protruding toward the first main surface 2 a are electrically and mechanically connected to the land 4 by solder 12. .
[0016]
As will be described later, the outer periphery of the main body 10 is held by the holding member 9 temporarily assembled on the second main surface 2b side of the wiring board 2 as described later. The holding member 9 is formed of a sheet metal material, and as shown in FIGS. 1 to 3, opposes a ceiling 13 and is formed by being bent at right angles along both side edges in the width direction of the ceiling 13. The first side surface portion 14 and the second side surface portion 15 have a substantially downward U-shape. The holding member 9 is configured such that an inner space 16 formed by the ceiling portion 13 and the side surface portions 14 and 15 and having open left and right side surfaces and a bottom surface holds the outer peripheral portion of the electronic component 8 as described later. I do.
[0017]
The holding member 9 is formed in a rectangular shape in which the ceiling 13 is slightly shorter in the left-right direction and the length in the front-rear direction is substantially equal to the electronic component 8. The holding member 9 is formed such that the height of both side portions 14 and 15 is substantially equal to the thickness of the electronic component 8. With this configuration, the holding member 9 holds the electronic component 8 in the holding space 16 in a state where a part of the length of the electronic component 8 in the length direction is protruded as shown in FIGS.
[0018]
The holding member 9 has a pair of slits 18A and 18B formed in the width direction from the left edge of the ceiling portion 13 as shown in FIGS. 17. The guide projection 17 is gradually bent upward from the base end toward the tip. The guide convex portion 17 has a guide function when the electronic component 8 is fitted into the holding space 16 as described later.
[0019]
As shown in FIGS. 1 to 3, the holding member 9 is integrally formed with a stopper projection 19 on the right side edge of the ceiling 13 so as to face the guide projection 17. The stopper projection 19 has a slightly wider projection integrally formed on the right edge of the ceiling 13 and a pair of slits 20A and 20B formed in the width direction along the base end of the projection. It is formed by a rectangular piece composed of a tongue piece part left off by the slits 20A and 20B. The stopper convex portion 19 is formed by bending an approximately right angle downward so that the distal end portion of the rectangular piece, which has an opening and has a bending characteristic, faces the holding space portion 16.
[0020]
When the holding member 9 is assembled to the wiring board 2 as described later, the stopper convex portion 19 adjusts the horizontal distance between the terminal hole 6 of the wiring board 2 and the side surface 10 b on the fitting side of the electronic component 8 and the other side surface. The distance from the lead terminal 11 protruding from 10a is substantially equal to the distance. The stopper convex portion 19 abuts the side surface 10b on the fitting side of the electronic component 8 fitted to the holding space 16 to position the electronic component 8. Note that the stopper convex portion 19 is not limited to the above-described structure, and may be formed by bending a convex portion protruding from the ceiling portion 13. In addition, the stopper convex portion 19 may be formed on the right side edge of the both side surface portions 14 and 15.
[0021]
As shown in FIGS. 1 to 3, the holding member 9 has a pair of pressing protrusions 21 (21 A, 21 B) on the inner surface of the ceiling portion 13 that protrude into the holding space 16 and are separated in the width direction. Is formed. Each pressing convex portion 21 is formed of a hemispherical convex portion formed by extrusion on the ceiling portion 13, and the electronic component 8 fitted in the holding space portion 16 is connected to the second main surface 2 b of the wiring board 2 as described later. Press As in the case of the ceiling portion 13, the holding member 9 may be formed by extruding pressing projections on the inner surfaces of both side portions 14 and 15, respectively.
[0022]
As shown in FIGS. 1 to 3, fitting protrusions 22 and 23 are integrally formed on lower end edges 14 a and 15 a of both side portions 14 and 15, respectively, of the holding member 9. The fitting protrusions 22 and 23 project downward from the side surface portions 14 and 15 respectively, and are bent in the horizontal direction at positions corresponding to the thickness of the wiring board 2 from the lower edges 14a and 15a. Parts 22a and 23a are formed. The fitting protrusions 22 and 23 correspond to the fitting holes 7A and 7B of the wiring board 2 described above, respectively, and have a size enough for the fitting protrusions 22a and 23a to pass through the fitting holes 7A and 7B. Is formed. The fitting protrusions 22 and 23 are formed such that the distance between the engagement protrusions 22 a and 23 a and the lower edges 14 a and 15 a of the side surface portions 14 and 15 is substantially equal to the thickness of the wiring board 2.
[0023]
In the wiring board device 1 including the above-described components, the holding member 9 is assembled to the wiring board 2 prior to the assembling step of the electronic component 8. The holding member 9 is fitted into the fitting holes 7A and 7B where the fitting projections 22 and 23 face the wiring board 2 from the second main surface 2b side as shown by arrows in FIG. The entire holding member 9 is moved to the left in a state where the engagement projections 22a and 23a of the fitting projections 22 and 23 project toward the first main surface 2b. In the holding member 9, the fitting protrusions 22 and 23 move in the fitting holes 7A and 7B, and the respective opening edges are engaged with the lower edges 14a and 15a of the side surface portions 14 and 15 as shown in FIG. It is assembled to the wiring board 2 by being sandwiched between the portions 22a and 23a.
[0024]
In the wiring board device 1, the electronic component 8 is fitted to the holding member 9 from the left opening into the holding space 16. As described above, the electronic component 8 is positioned with the side face 10 b on the fitting side of the main body 10 abutting against the stopper projection 19, and in this state, the tips 11 a and 11 b of the lead terminals 11 are inserted into the terminal holes 6. Corresponding position. In the electronic component 8, each lead terminal 11 is penetrated through the terminal hole 6 that opposes the respective tip portions 11 a and 11 b. The electronic component 8 is held in the holding space 16 by the main body 10 being pressed against the second main surface 2 b of the wiring board 2 by the pressing projection 18 and the side surfaces being held by the side surface portions 14 and 15. It is held by the member 9.
[0025]
In the wiring board device 1, after assembling other electronic components and the like on the wiring board 2, the wiring board 2 is supplied to a solder tank and subjected to a soldering process. As described above, the electronic components 8 are electrically and mechanically connected to the lands 4 by the solders 12 at the tips 11a and 11b of the lead terminals 11. As shown in FIG. 1, the holding protrusions 22 a and 23 a of the fitting protrusions 22 and 23 of the holding member 9 are mechanically fixed to the dummy lands 5 by the solder 12.
[0026]
In the wiring board device 1, the electronic component 8 is firmly held on the outer periphery of the main body 10 by the holding member 9 firmly fixed to the wiring board 2 by the above-described configuration. Therefore, in the wiring board device 1, even when an impact or the like is applied, the load on the lead terminals 11 of the electronic component 8 is reduced. In the wiring board device 1, this prevents problems such as breakage of the lead terminals 11 and peeling of the solder 12, thereby improving reliability.
[0027]
The holding member 30 shown in FIG. 4 has the same basic configuration as the holding member 9 described above, and the corresponding portions are denoted by the same reference numerals and description thereof will be omitted. The holding member 30 is characterized by a pair of pressing convex pieces 31 (31A, 31B) formed on the ceiling part 13 and fitting convex parts 32, 33 formed on lower end edges 14a, 15a of both side parts 14, 15, respectively. Have. Each of the pressing convex pieces 31 is formed of a rectangular piece left behind by a U-shaped notch groove 34 (34A, 34B) formed on the ceiling 13 so as to be spaced apart in the width direction. Each pressing convex piece 31 is bent in a substantially rectangular shape so that the free end side protrudes into the holding space 16. Therefore, each pressing projection 31 presses and holds the ceiling surface of the electronic component 8 fitted in the holding space 16.
[0028]
The fitting projections 32 and 33 are formed of rectangular pieces integrally protruding from the lower edges 14 a and 15 a of the side surfaces 14 and 15, and are opposed to each other at a position corresponding to the thickness of the wiring board 2 from the lower edges 14 a and 15 a. The engaging projections 32a and 33a are formed inwardly and curved in an arc shape. The mating protrusions 32 and 33 have a base portion facing distance substantially equal to the facing distance of the fitting holes 7A and 7B, and the facing distance of the fitting protrusions 32a and 33a is curved. It is narrower than the interval. The fitting projections 32, 33 may be configured such that the engagement projections 32a, 33a are curved outward.
[0029]
The holding member 30 configured as described above is fitted into the fitting holes 7A and 7B where the fitting projections 32 and 33 face the wiring board 2 from the second main surface 2b side. As described above, the holding member 30 has the engagement protrusions 32a, 33a narrower than the facing distance of the fitting holes 7A, 7B, but the engagement protrusions 32a, 33a formed in an arc shape are directed outward. And pass through the fitting holes 7A and 7B. In the holding member 30, the engaging projections 32a, 33a return to a natural state in a state where the engaging projections 32a, 33a pass through the fitting holes 7A, 7B, but the elastic force that has been somewhat accumulated is fitted. By acting on the opening walls of the holes 7A and 7B, it is assembled to the wiring board 2.
[0030]
In addition, as for the holding member, the fitting protrusions formed on both side surface portions 14 and 15 are not limited to the above-described structure. The fitting protrusion is, for example, a rectangular piece integrally protruding from lower end edges 14a, 15a of both side surface parts 14, 15 and bends a tip part penetrating through fitting holes 7A, 7B to be bent with respect to wiring board 2. You may try to stop it. Further, the holding member may be configured such that the distal end portion of the fitting convex portion penetrating through the fitting holes 7A and 7B is simply fixed by the solder 12.
[0031]
【The invention's effect】
As described above in detail, the electronic component holding device according to the present invention has a simple U-shaped cross section including a ceiling portion and both side portions facing each other by a metal plate material. A holding member that is assembled to the wiring board by a simple process of fitting the mating projections into the fitting holes and soldering, and the main body is formed by a lead terminal fitted into a holding space formed inside the holding member; An electronic component whose part is supported in a cantilevered state is positioned and held by a stopper projection. According to the electronic component holding device, even when an impact or the like is applied, the main component is held by the holding member, so that the load of the electronic component due to the impact on the lead terminal is reduced, and the lead terminal is damaged or the solder is separated. Are prevented from occurring, and the reliability is improved.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a main part of a wiring board device provided with a holding device according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of a main part of the wiring board device.
FIG. 3 is a perspective view of a holding member.
FIG. 4 is a perspective view of another holding member.
FIG. 5 is a longitudinal sectional view of a main part of a conventional wiring board device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wiring board device 2 Wiring board 3 Conductor pattern 4 Land 5 Dummy land 6 Terminal hole 7 Fitting hole 8 Electronic component 9 Holding member 10 Main body 11 Lead terminal 12 Solder 13 Ceiling 14 Side surface 15 Side surface 16 Holding space 17 Guide convex portion 18 Slit 19 Stopper convex portion 20 Slit 21 Press convex portion 22 Fitting convex portion 23 Fitting convex portion 30 Holding member 31 Pressing convex piece 32 Fitting convex portion 33 Fitting convex portion

Claims (6)

An electronic component having a lead terminal bent and projected in a substantially L-shape from the side surface of the main body is inserted into a terminal hole formed in the wiring board and soldered. In an electronic component holding device attached to a wiring board device mounted on the wiring board via the lead terminals,
The main body portion of the electronic component, which is formed in a substantially U-shaped cross section including a ceiling portion and two side portions facing each other by a metal plate material and fitted into the internal space from the open first side opening portion, is mounted on the ceiling. Comprising a holding member to be held by the portion and the side portions,
The holding member is mounted on the wiring board by fitting a fitting convex piece integrally formed on a lower end edge of the side face part into a fitting hole formed in the wiring board, and the ceiling part or A side surface on the fitting side of the electronic component fitted into the internal space by a stopper projection integrally formed facing the second side opening facing the first side opening from the side surface. An electronic component holding device characterized by being locked. The distal end of each of the fitting projections formed on both side surfaces of the holding member is bent in the horizontal direction at a thickness position of the wiring board to be formed in a substantially L-shape. The formed fitting hole is formed with a long hole shape sufficient to penetrate the fitting convex piece portion,
The holding member is moved along the longitudinal direction after penetrating the fitting convex portion into the facing fitting hole, so that the opening edge of the fitting hole and the lower end edge of the side surface portion. 2. The electronic component holding device according to claim 1, wherein the electronic component holding device is sandwiched between the fitting protrusion and the horizontal bent portion and assembled to the wiring board. 3. The fitting protrusions formed on both side surfaces of the holding member have curved protrusions at a thickness position of the wiring board so as to have a small interval or a large interval with respect to a facing interval of the fitting holes. To form
The holding member is expanded or narrowed, and each of the fitting protrusions penetrated through the fitting hole facing each other returns to a natural state and is locked by an opening edge of the fitting hole. The electronic component holding device according to claim 1, wherein the electronic component holding device is assembled to a wiring board. The holding member is fixed by soldering a tip end of each of the fitting convex pieces fitted into the fitting holes facing each other to a dummy land formed around the fitting hole on the wiring board. The electronic component holding device according to claim 1, wherein the electronic component is held. In the holding member, a tongue-shaped guide convex portion that plays a guiding action when the electronic component is fitted into the internal space is cut and formed on the ceiling portion on the first side opening portion side. The electronic component holding device according to any one of claims 1 to 4, wherein In the holding member, a pressing protrusion for pressing a ceiling surface of the electronic component fitted into the internal space against a main surface of the wiring board is integrally formed on an inner surface of the ceiling portion. The electronic component holding device according to any one of claims 1 to 5, wherein

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