JP2004240881A - Protection structure of IC data carrier - Google Patents

Abstract

Provided is a protection structure for an IC data carrier which can prevent adverse effects due to heat even when attached to an article heated to a high temperature.
A protection structure for an IC data carrier, wherein the IC data carrier is protected by an inorganic heat resistant material. As the protective structure, the exterior 12 of the IC data carrier 10, the case 3 accommodating the IC carrier 2, the attachment portion 31 of the article accommodating the IC carrier 5, and the case 6 accommodating the case 6 accommodating the IC carrier 5 are attached. There is a mounting part 51.
[Selection] Fig. 2

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a protection structure for an IC data carrier.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is an IC carrier in which an IC data carrier storing unique information on various articles such as a magnetic card, an IC card, a barcode, an RFID (Radio Frequency Identification), and the like is made of resin. A system that uses the IC carrier to identify, collate, manage, and convey the articles is used in various fields such as physical distribution, factory automation (FA), and medical care.
[0003]
In recent years, using a non-contact automatic identification system that can read information stored in an IC data carrier held in an IC carrier in a non-contact manner, a product assembly / transport line system, an inspection line, a product management, and a product It is widely used for inventory and order management, work information management, tool management, and the like. More specifically, for example, in the case of container logistics management for container cargo transportation, an IC tag and an IC tag case that make it possible to easily recognize a container tag and a tag case even at night using a non-contact automatic identification system. There is. (For example, see Patent Document 1).
[0004]
As an IC carrier, there is an IC carrier (IC card) in which an antenna substrate having an IC data carrier and an antenna circuit mounted on a substrate is sandwiched between at least a pair of films. (For example, see Patent Document 2).
[0005]
Further, there is introduced an IC carrier that holds an IC data carrier and a wiring sheet in a facing state and makes contact between the IC data carrier and the socket via the wiring sheet. (For example, see Patent Document 3).
[0006]
[Patent Document 1]
JP-A-2002-132153
[Patent Document 2]
JP-A-2002-157561
[Patent Document 3]
JP-A-9-63731
[Problems to be solved by the invention]
The exterior of a conventional IC carrier or an IC carrier case accommodating the IC carrier is formed of resin from the viewpoint of weight reduction and productivity. Therefore, it is good to attach the IC carrier or the IC carrier case accommodating the IC carrier to an article to which high temperature is not applied. However, if the IC carrier is attached to an article to which high temperature is applied, the IC data carrier may be adversely affected by heat. .
[0007]
Specifically, for example, in a shrink-fit type tool holder, a temperature of 100 ° C. or more may be applied when a tool is attached by shrink fitting. At this time, if an IC carrier or an IC carrier case accommodating the IC carrier is attached to the tool holder, the high temperature causes the temperature applied to the exterior of the IC carrier and the resin forming the IC carrier case to rise. , And the shape of the exterior and the IC carrier case may be deformed. When this deformation occurs, the IC carrier or the IC carrier case may come off from the tool holder or adversely affect the operation of the IC data carrier.
[0008]
Further, for example, when an IC carrier or an IC carrier case accommodating the IC carrier is attached to a mold used for an injection molding machine or casting, the mold is subjected to vibration in addition to being subjected to high temperature. Therefore, there is a possibility that the shape of the exterior or the IC carrier case is further easily deformed.
[0009]
SUMMARY OF THE INVENTION An object of the present invention is to solve such a conventional problem, and even when attached to an article to which a temperature of 100 ° C. or more may be applied, the article is adversely affected by heat. It is an object of the present invention to provide a protection structure for an IC data carrier that can prevent such a situation.
[0010]
[Means for Solving the Problems]
In order to achieve this object, the present invention provides a protection structure for an IC data carrier in which the IC data carrier is protected by an inorganic heat-resistant material.
[0011]
According to the protection structure for an IC data carrier having this configuration, the IC data carrier can be protected by an inorganic heat-resistant material.
[0012]
As the inorganic heat-resistant material, a material having a heat-resistant temperature of 100 ° C. or higher can be used.
[0013]
Further, among the inorganic heat-resistant materials, it is more preferable to use a material having a low thermal conductivity. By protecting the IC data carrier with an inorganic heat-resistant material having low thermal conductivity, in addition to the above advantages, the IC data carrier can be protected from high temperatures. As the inorganic heat resistant material having a low thermal conductivity, it is more preferable to use a material having a thermal conductivity of 20 W / (m · K) or less.
[0014]
Examples of the inorganic heat-resistant material having low thermal conductivity include one or more of chromium and / or nickel such as ceramic zirconia, silicon nitride, stainless steel, heat-resistant steel, high-speed steel, and superalloy. Are included.
[0015]
Further, since ceramics and materials containing chromium and / or nickel have non-magnetic properties, it is possible to prevent the influence of electromagnetic waves from the IC data carrier.
[0016]
Further, as the protection structure of the IC data carrier according to the present invention, a structure in which the exterior of the IC data carrier is made of the inorganic heat-resistant material may be mentioned.
[0017]
According to the protection structure for an IC data carrier having this configuration, the IC data carrier is protected by the exterior made of an inorganic heat-resistant material. In this case, since the exterior itself has heat resistance, it is possible to prevent the exterior from being deformed by high temperature. Therefore, it is possible to prevent the IC data carrier (that is, the IC carrier) held by the exterior from being detached from the attachment portion of the article, and it is possible to securely attach the IC carrier to the article. Also, for example, even if an IC data carrier to which heat resistance is not imparted is applied to an article to which an IC carrier holding the exterior is attached, even if a high temperature is applied, the exterior is made of an inorganic material having a low thermal conductivity. By being made of a heat-resistant material, the IC data carrier is protected from high temperatures by the exterior. Therefore, it is possible to prevent the IC data carrier from being adversely affected by heat.
[0018]
Further, as the protection structure of the IC data carrier according to the present invention, a case in which the case for accommodating the IC data carrier held by the outer package is made of the inorganic heat-resistant material is mentioned.
[0019]
According to the protection structure of the IC data carrier having this configuration, the IC data carrier is protected by the case made of the inorganic heat-resistant material. In this case, since the case itself has heat resistance, it is possible to prevent the case from being deformed by high temperature. Therefore, it is possible to prevent the case from being detached from the attachment portion of the article, and it is possible to securely attach the IC carrier held by the case to the article. Also, for example, even if a high temperature is applied to an article to which an IC carrier not provided with heat resistance is attached, by forming the case from an inorganic heat resistant material having a low thermal conductivity, The IC carrier is protected from high temperatures by the case. Therefore, it is possible to prevent the IC data carrier from being adversely affected by heat.
[0020]
When this case is applied, it is a matter of course that the exterior may be made of an inorganic heat-resistant material.
[0021]
Further, as the protection structure for an IC data carrier according to the present invention, an article provided with an attachment portion to which an IC data carrier held by an exterior is attached, at least a portion of the attachment portion where the exterior comes into contact with the inorganic material. Made of the above heat-resistant material.
[0022]
According to the protection structure of the IC data carrier having this configuration, at least a portion of the mounting portion of the article that comes into contact with the exterior has heat resistance, so that the exterior of the IC carrier attached to the mounting portion is heat-resistant. Can be prevented from being deformed by high temperature. Therefore, the IC carrier can be securely attached to the article. Also, for example, even if a high temperature is applied to an article to which an IC carrier to which heat resistance is not applied is attached, a portion where the exterior comes into contact is formed of an inorganic heat resistant material having a low thermal conductivity. By doing so, the IC carrier is protected from high temperatures by the mounting portion of the article. Therefore, it is possible to prevent the IC data carrier from being adversely affected by heat.
[0023]
When this article is applied, it is a matter of course that the exterior may be made of an inorganic heat-resistant material.
[0024]
Further, as a protection structure for an IC data carrier according to the present invention, a part provided with an attachment portion to which a case accommodating an IC data carrier held by an exterior is attached, at least a portion of the attachment portion where the case contacts. Is formed of the above-mentioned inorganic heat-resistant material.
[0025]
According to the protection structure for an IC data carrier having this configuration, at least a portion of the mounting portion of the article that comes into contact with the case has heat resistance. Deformation can be prevented. Therefore, the case can be securely attached to the article. Also, for example, even if a high temperature is applied to an article to which an unheat-resistant case is attached, the case is protected from the high temperature by the attachment portion. Therefore, it is possible to prevent the IC data carrier from being adversely affected by heat.
[0026]
When this article is applied, it goes without saying that the exterior and the case, or the exterior or the case may be made of an inorganic heat-resistant material.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, a protection structure for an IC data carrier according to a preferred embodiment of the present invention will be described with reference to the drawings. The embodiments described below are examples for describing the present invention, and the present invention is not limited to only these embodiments. Therefore, the present invention can be implemented in various modes without departing from the gist thereof.
(Embodiment 1)
In the first embodiment, as a protection structure for an IC data carrier, a case in which an exterior for holding the IC data carrier is formed of an inorganic heat-resistant material having low thermal conductivity will be described.
[0028]
1 is a side view of an IC carrier according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the IC carrier shown in FIG. 1, and FIG. 3 is a state where the IC carrier shown in FIG. 1 is mounted on a tool holder. FIG.
[0029]
As shown in FIGS. 1 to 3, an IC carrier 1 according to the first embodiment includes, for example, an IC data carrier 10 including a power supply circuit, a reception circuit, a transmission circuit, a memory, a logic circuit for a read / write operation with respect to a memory, and the like. And a coil 11 for generating an induced current with respect to the IC data carrier 10 is held by an exterior 12.
[0030]
The exterior 12 is formed from an inorganic heat-resistant material having a low thermal conductivity. In the first embodiment, zirconia is used as an inorganic heat-resistant material having a low thermal conductivity. This zirconia has a heat-resistant temperature of about 800 ° C. and a thermal conductivity of about 3 W / m · K. The exterior 12 can be manufactured, for example, by molding.
[0031]
The IC carrier 1 is mounted on a mounting portion 101 of a tool holder 100 as shown in FIG.
[0032]
Next, a tool (not shown) is shrink-fitted into the tool holder 100 on which the IC carrier 1 according to the first embodiment is mounted. In this shrink fitting, the tool holder 100 is heated at about 300 ° C. to 500 ° C. for about 3 to 10 minutes. After the shrink fitting, the IC carrier 1 was visually observed. As a result, no deformation occurred in the exterior 12, and the original shape was maintained. Further, the IC carrier 1 was able to perform normal reading by the non-contact automatic identification system.
[0033]
Next, as a comparison, an IC carrier was manufactured under the same conditions as the IC carrier 1 according to the first embodiment, except that the exterior 12 was formed of a resin (glass fiber reinforced polyamide) (Comparative Example 1). After attaching the IC carrier according to Comparative Example 1 to the attachment portion 101 of the tool holder 100 described above, a tool was attached to the tool holder 100 by shrink fitting under the same conditions as in the first embodiment. After shrink fitting, the exterior of the IC carrier according to Comparative Example 1 was slightly deformed when visually observed.
[0034]
As described above, the IC carrier 1 according to the first embodiment has the case 12 attached to the shrink-fit type tool holder because the exterior 12 is made of the above-described inorganic heat-resistant material having a low thermal conductivity. Even so, it was proved that the exterior 12 was prevented from being deformed by the heating. In addition, since the IC data carrier 10 and the coil 11 are protected from high temperatures by the exterior 12, it has been proved that the IC carrier 1 is prevented from being adversely affected by heat.
[0035]
In the first embodiment, the case where zirconia is used as a material forming the exterior 12 has been described. However, the present invention is not limited to this, and the exterior may be formed of an inorganic heat-resistant material. In particular, when heat resistance is given to the IC data carrier itself, there is no problem in the performance of the IC data carrier even if the exterior is formed from an inorganic heat resistant material having high thermal conductivity.
[0036]
Further, when a material containing ceramic, chromium and / or nickel is used as a material for forming the exterior 12, the exterior 12 has a non-magnetic property, so that electromagnetic waves from an IC carrier are applied to the article. The influence can be prevented.
[0037]
The heat-resistant temperature of the inorganic heat-resistant material varies depending on the conditions (temperature, heating time, etc.) under which the article on which the IC carrier 1 is mounted is heated, but is preferably, for example, 100 ° C. or higher.
[0038]
Further, the thermal conductivity of the inorganic heat-resistant material varies depending on the conditions (temperature, heating time, etc.) under which the article to which the IC carrier 1 is mounted is heated, but is, for example, 20 W / (m · K) or less. It is desirable.
[0039]
In the first embodiment, the tool holder is described as an example of the article to which the IC carrier 1 is attached. However, the present invention is not limited to this, and the article may be, for example, a mold used for an injection molding machine or casting. Whether tools, workpiece mounting jigs, knife tools and indexable end mill cutters, various machine tools, pallets, logistics containers, various luggage, gates at doorways, various buildings, various cards, etc. can be exposed to high temperatures. Regardless, the selection can be made as desired.
(Embodiment 2)
Next, an IC carrier case according to a second embodiment of the present invention will be described with reference to the drawings. In the second embodiment, as a protection structure for an IC data carrier, an IC carrier case accommodating an IC data carrier (that is, an IC carrier) held by an exterior is formed of an inorganic heat-resistant material having low thermal conductivity. The case will be described.
[0040]
FIG. 4 is a plan view showing a state where the IC carrier case according to the second embodiment is mounted on a mold of an injection molding machine, and FIG. 5 is a cross-sectional view taken along line VV of FIG. In FIG. 5, hatching for showing a cross section is omitted in the mold portion in order to avoid complexity.
[0041]
As shown in FIG. 4 and FIG. 5, the IC carrier case 3 according to the second embodiment has an opening at the upper part in FIG. 5, and a housing 21 for housing the IC carrier 2 is provided therein. Is formed. The accommodation portion 21 has a groove 23 in which a retaining ring 22 for fixing the IC carrier 2 accommodated therein is provided. A male screw 24 is formed on the outer peripheral surface of the IC carrier case 3. The male screw 24 is configured to be screwed into a female screw 112 formed on a mounting portion 111 of the mold 110 described later in detail. I have.
[0042]
Reference numeral 25 denotes a jig used to screw the male screw 24 of the IC carrier case 3 into the female screw 112 of the mounting portion 111 of the mold 110 when the IC carrier case 3 is mounted on the mounting portion 111 of the mold 110. (Not shown) is a groove to be engaged. Reference numeral 26 denotes a groove for inserting a removal jig (not shown) when removing the retaining ring 22.
[0043]
The IC carrier case 3 is formed of an inorganic heat-resistant material having a low thermal conductivity. In the second embodiment, SUS304 was used as an inorganic heat-resistant material having a low thermal conductivity. This SUS304 has a heat-resistant temperature of about 600 ° C. and a thermal conductivity of about 14.5 W / m · K. The IC carrier case 3 can be manufactured by, for example, cutting or the like.
[0044]
The IC carrier case 3 is mounted on the mounting portion 111 of the mold 110 as shown in FIG. Specifically, in order to screw the male screw 24 formed in the IC carrier case 3 into the female screw 112 formed in the mounting portion 111, a jig (not shown) is engaged with the groove 25 to rotate the IC carrier case 3. This is mounted on the mounting portion 111 of the mold 110.
[0045]
Next, injection molding is performed using a mold 110 to which the IC carrier case 3 according to the second embodiment is attached. At this time, the mold 110 is continuously heated at about 50C to 100C. After the completion of the injection molding, the IC carrier case 3 was visually observed. As a result, the IC carrier case 3 was not deformed and maintained its original shape. The IC carrier 2 was able to perform normal reading by the non-contact automatic identification system.
[0046]
Next, for comparison, an IC carrier case was manufactured under the same conditions as those of the IC carrier case 3 according to the second embodiment, except that the IC carrier case was formed of a resin (polycarbonate) (Comparative Example 2). After the IC carrier case according to Comparative Example 2 was mounted on the mounting portion 111 of the mold 110 described above, injection molding was performed using the mold 110 under the same conditions as in the second embodiment. After the completion of the injection molding, the IC carrier case 3 was visually observed, and it was found that the IC carrier case was slightly deformed.
[0047]
As described above, since the IC carrier case 3 according to the second embodiment is made of the above-described inorganic heat-resistant material having a low thermal conductivity, the IC carrier case 3 is mounted on the injection molding die 110. It was also proved that the IC carrier case 3 was prevented from being deformed by the heating and the vibration. Further, since the IC carrier 2 is protected from high temperatures by the IC carrier case 3, it has been proved that the IC carrier 2 is prevented from being adversely affected by heat.
[0048]
In the second embodiment, the case where SUS304 is used as a material for forming the IC carrier case 3 has been described. However, the present invention is not limited to this, and the IC carrier case may be formed of an inorganic heat-resistant material. Good. In particular, when the IC carrier 2 itself is provided with heat resistance, even if the IC carrier case is formed from an inorganic heat resistant material having a high thermal conductivity, the IC data carrier provided on the IC carrier 2 can be used. There is no problem in performance.
[0049]
The heat-resistant temperature of the inorganic heat-resistant material varies depending on the conditions (temperature, heating time, etc.) under which the article to which the IC carrier case 3 is to be mounted is heated.
[0050]
Further, the thermal conductivity of the inorganic heat-resistant material varies depending on the conditions (temperature, heating time, etc.) under which the article to which the IC carrier case 3 is attached is heated. Desirably.
[0051]
Further, in the second embodiment, a case has been described in which an injection mold is used as an example of an article to which the IC carrier case 3 is attached. However, the present invention is not limited to this. Used dies, tool holders, tools and workpiece mounting jigs, various tooling tools such as blade cartridges and indexable end mill cutters, pallets, logistics containers, various types of luggage, gates at entrances and gates, various buildings, various cards, etc. , Whether or not high temperatures are applied.
[0052]
In the second embodiment, the case where the entire IC carrier case is formed of an inorganic heat-resistant material has been described. However, the present invention is not limited to this case. The portion that comes into contact with the mounting portion 111) of the mold 110 may be made of an inorganic heat-resistant material.
(Embodiment 3)
Next, an article according to a third embodiment of the present invention will be described with reference to the drawings. In the third embodiment, as the protection structure of the IC data carrier, the mounting portion of the article to which the IC data carrier held by the exterior (that is, the IC carrier) is mounted is formed of an inorganic heat resistant material having low thermal conductivity. A case and a case where an attachment portion of an article to which an IC carrier case containing an IC carrier is attached is formed of an inorganic heat resistant material having low thermal conductivity will be described.
[0053]
FIG. 6 is a cross-sectional view of the article according to the third embodiment in the vicinity of a mounting portion to which an IC carrier is mounted. In FIG. 6, hatching for showing the cross section of only the attachment portion of the article is shown to avoid complexity.
[0054]
In the third embodiment, the same members as those described in the above-described embodiments are denoted by the same reference numerals, and detailed description thereof will be omitted. In the third embodiment, a case where a mold for injection molding is used as an article will be described.
[0055]
The mold 120 as an article according to the third embodiment has a mounting portion 31 to which the IC carrier 5 is mounted on the surface thereof. The mounting part 31 has an opening at the upper part in FIG. 6, and a housing part 32 for housing the IC carrier 5 is formed therein. The accommodation portion 32 has a groove 23 in which the retaining ring 22 for fixing the IC carrier 5 accommodated therein is formed.
[0056]
The mounting portion 31 is formed of an inorganic heat-resistant material having a low thermal conductivity. In the third embodiment, zirconia is used as the inorganic heat-resistant material having a low thermal conductivity as in the first embodiment.
[0057]
Next, injection molding was performed using the mold 120 to which the IC carrier case 3 according to the third embodiment was attached. At this time, the mold 120 is continuously heated at about 50C to 100C. After the completion of the injection molding, the IC carrier 5 was visually observed. As a result, no deformation occurred on the exterior of the IC carrier 5, and the original shape was maintained. Further, the IC carrier 5 was able to perform normal reading by the non-contact automatic identification system.
[0058]
Next, as a comparison, a mold for injection molding was manufactured under the same conditions as the mold 120 according to the third embodiment, except that the mounting portion was formed of resin (polycarbonate) (Comparative Example 3). After mounting the IC carrier 5 on the mounting portion of the mold according to Comparative Example 3, injection molding was performed using this mold under the same conditions as in the third embodiment. After completion of the injection molding, the IC carrier 5 was visually observed, and it was found that the mounting portion was slightly deformed.
[0059]
As described above, in the mold 120 according to the third embodiment, since the mounting portion 31 is made of the above-described inorganic heat-resistant material having a low thermal conductivity, the mounting portion 31 may be deformed by the heating. Proven to be prevented. Further, since the IC carrier 5 is protected from the high temperature by the mounting portion 31, it has been proved that the IC carrier 5 is prevented from being adversely affected by heat.
[0060]
In the third embodiment, the case where zirconia is used as a material for forming the mounting portion 31 of the mold 120 has been described. However, the present invention is not limited to this. What is necessary is just to be formed. In particular, when heat resistance is given to the IC carrier 5 itself, even if the mounting portion 31 is formed from an inorganic heat resistant material having high thermal conductivity, the mounting of the IC data carrier provided on the IC carrier 5 can be prevented. There is no problem in performance.
[0061]
The heat-resistant temperature of the inorganic heat-resistant material varies depending on the conditions under which the mold 120 is heated (temperature, heating time, and the like), but is preferably, for example, 100 ° C. or higher.
[0062]
Further, the thermal conductivity of the inorganic heat-resistant material varies depending on the conditions (temperature, heating time, and the like) in which the mold 120 is heated, but is preferably, for example, 20 W / (m · K) or less.
[0063]
Furthermore, in the third embodiment, the case has been described in which the entire mounting portion of the mold is formed of an inorganic heat-resistant material. However, the present invention is not limited to this. The portion may be made of an inorganic heat-resistant material.
[0064]
Further, for example, as shown in FIG. 7, a support portion 42 for supporting the bottom surface of the IC carrier 5 is provided below the side wall of the mounting portion 41 of the mold 130, and a space is provided between the bottom surface of the IC carrier 5 and the mold 130. May be formed. Here, air is inorganic, has excellent heat resistance, and has low thermal conductivity, so that it is not deformed by the heating. Further, since the IC carrier 5 is protected from high temperatures by air, the IC carrier 5 is also prevented from being adversely affected by heat.
[0065]
Further, in the third embodiment, the mold 120 (130) to which the IC carrier 5 is attached has been described. However, the present invention is not limited to this. For example, as shown in FIG. May be formed of an inorganic heat-resistant material as described above. Also in this case, similarly to FIG. 7, the space may be formed between the bottom surface of the IC carrier case 6 and the mold 140.
[0066]
Further, in the third embodiment, a case has been described in which a mold for injection molding is taken as an example of an article. However, the present invention is not limited to this. Whether high temperature can be applied to various machine tools such as holders, tools and workpiece mounting jigs, blade cartridges and indexable end mill cutters, pallets, logistics containers, various luggage, gates at doorways, various buildings, various cards, etc. Irrespective of whether they are selected.
[0067]
【The invention's effect】
As described above, according to the protection structure for an IC data carrier according to the present invention, the IC data carrier can be protected by the inorganic heat-resistant material. As a result, even when an IC carrier provided with an IC data carrier or an IC carrier housed in a case is attached to an article to which a high temperature is applied, these can be securely fixed and maintained on the article. .
[Brief description of the drawings]
FIG. 1 is a side view of an IC carrier according to a first embodiment of the present invention.
FIG. 2 is a sectional view of the IC carrier shown in FIG.
FIG. 3 is a front view showing a state where the IC carrier shown in FIG. 1 is mounted on a tool holder.
FIG. 4 is a plan view showing a state where the IC carrier case according to the second embodiment of the present invention is attached to a mold of an injection molding machine.
FIG. 5 is a sectional view taken along line VV in FIG. 4;
FIG. 6 is a cross-sectional view of the article according to the third embodiment of the present invention in the vicinity of a mounting portion to which an IC carrier is mounted.
FIG. 7 is a cross-sectional view of an article according to another embodiment of the present invention, showing the vicinity of a mounting portion to which an IC carrier is mounted.
FIG. 8 is a cross-sectional view showing the vicinity of a mounting portion of an article according to another embodiment of the present invention to which an IC carrier case is mounted.
[Explanation of symbols]
1, 2, 5 IC carriers
3,6 IC carrier case
10 IC data carrier
12 Exterior
31, 41, 51, 101, 111 mounting part
100 Tool holder
110, 120, 130, 140 Mold

Claims (8)

An IC data carrier protection structure in which an IC data carrier is protected by an inorganic heat-resistant material. The protection structure for an IC data carrier according to claim 1, wherein the heat-resistant material has low thermal conductivity. 3. The protection structure for an IC data carrier according to claim 1, wherein the heat-resistant material has a heat-resistant temperature of 100 ° C. or higher. 4. The protection structure for an IC data carrier according to claim 2, wherein the thermal conductivity is 20 W / (m · K) or less. The protection structure for an IC data carrier according to any one of claims 1 to 4, wherein an exterior of the IC data carrier is made of the inorganic heat-resistant material. The protection structure for an IC data carrier according to any one of claims 1 to 5, wherein a case accommodating the IC data carrier held by an exterior is made of the inorganic heat-resistant material. 7. An article having an attachment portion to which an IC data carrier held by an exterior is attached, wherein at least a portion of the attachment portion where the exterior is in contact is made of the inorganic heat-resistant material. A protection structure for an IC data carrier according to any one of the preceding claims. An article provided with a mounting portion to which a case accommodating an IC data carrier held by an exterior is mounted, wherein at least a portion of the mounting portion in contact with the case is made of the inorganic heat-resistant material. The protection structure for an IC data carrier according to any one of claims 1 to 6.

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