JP2004214522A - Module that incorporates components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module that incorporates components in which the mounting density of components can be enhanced through a simple arrangement regardless of the shape of respective components or the forming position of wire connecting pads. <P>SOLUTION: The module that incorporates components comprises first components 32<SB>j</SB>having first wire connecting pads 35<SB>j</SB>formed on one surface, an interposer substrate 31<SB>j</SB>having second wire connecting pads 34 formed on one surface and openings 49 shaped to correspond with the forming region of the first wire connecting pads 35<SB>j</SB>in the first component 32<SB>j</SB>and mounting the first component 32<SB>j</SB>on the other surface under a state where the first wire connecting pads 35<SB>j</SB>are located in a region on the other side of the opening 49, second components having third wire connecting pads 35<SB>j+1</SB>formed on one surface and mounted on one surface of the interposer substrate 31<SB>j</SB>, and connecting wires 45 for electrically connecting the first wire connecting pads 35<SB>j</SB>and the second wire connecting pads 34. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component built-in module, and more particularly, to a component built-in module incorporating a plurality of components.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a plurality of large-scale integrated circuits (chips including LSI and VLSI (hereinafter, also referred to as “LSI chips”) are stacked and mounted inside in order to support high-density mounting of components such as electronic components. Attention has been paid to a chip stack type component built-in module, such as the component built-in module 80 shown in general in FIGS. (For example, see Non-Patent Document 1).
[0003]
In the component built-in module 80, on the + Z direction side surface of the printed wiring board 81 to a desired wiring pattern is formed, the LSI chip ₈₂₁ and the LSI chip ₈₂₂ are sequentially stacked via the adhesive layer (not shown) ing. Then, the LSI chip ₈₂₁ in the + Z direction side surface and the LSI chip ₈₂₂ in the + Z direction side of the wire connection pads 93 formed on the surface and the printed wiring board 81 in the + Z direction side surface of the formed wire connection pad 92 are electrically connected by a wiring wire 91. Such lead wires 91, through the printed wiring board 81 from outside, operating power and signals to the input and output terminals of the LSI chip ₈₂₁ and the LSI chip ₈₂₂ is adapted to be supplied.
[0004]
Further, the component built-in module 80, the sealing member 87 of resin or the like formed on the + Z direction side surface of the printed wiring board 81, the LSI chip ₈₂₁ and the LSI chip ₈₂₂ is adapted to be sealed . On the surface of the printed wiring board 81 on the −Z direction side, a large number of solder balls 89 that are electrically connected to the wiring pattern on the printed wiring board 81 are formed. It is designed to be attached to.
[0005]
Although FIGS. 10A and 10B show an example in which two LSI chips are stacked, a component built-in module in which three or more LSIs are stacked has been put to practical use.
[0006]
[Non-patent document 1]
JPO Research Division, "Patent Application Technology Trend Survey on Packaging Technology in the IT Age-System-in-Package Technology", April 26, 2002 [0007]
[Problems to be solved by the invention]
The above-described conventional component built-in module is extremely excellent in that it is simple in configuration, easy to realize, and improves the mounting density of components such as LSIs. However, in order to perform wiring by wiring wires between the wire connection pads of the component and the wire connection pads of the printed wiring board using the wire bonding method, a work area for the wiring work before molding by the sealing member. It was necessary to secure. For this reason, components cannot be arranged in the work area. That is, components could not be arranged in the region opposite to the substrate side with respect to the wiring wires.
[0008]
For this reason, a plurality of components to be laminated have various restrictions including a mutual positional relationship at the time of lamination, and the plurality of components cannot be freely laminated. For example, when a plurality of components having exactly the same shape are laminated, a planar portion is sequentially formed by an area from a formation region of a wire connection pad formed on each component to an end of the component in a direction in which a wiring wire extends. It was necessary to shift the layers. For this reason, when laminating a plurality of components having exactly the same shape, the mounting area becomes large.
[0009]
In addition, as described above, in order to stack a plurality of components having exactly the same shape, not only a case where the components are sequentially shifted in a plane but also a case where the size of the plurality of components to be stacked becomes smaller in the stacking order. However, in order to reduce the mounting area, it is essential that the formation region of the wire connection pad formed on the component is near the outer edge of the component.
[0010]
By the way, along with recent advances in wire bonding technology, an LSI chip having a wire connection pad also formed at the center of the surface (hereinafter, appropriately referred to as a “center pad LSI chip”) is being put to practical use. . When stacking a plurality of such center pad LSI chips, the above-described conventional component built-in module technology cannot meet the demand for increasing the component mounting density.
[0011]
The present invention has been made in view of the above circumstances, and has a simple configuration and can improve the component mounting density with a simple configuration regardless of the shape of each of a plurality of components and the formation position of a wire connection pad. The purpose is to provide a module.
[0012]
[Means for Solving the Problems]
The component built-in module of the present invention is a component built-in module in which a plurality of components are built, a first component having a first wire connection pad formed on one surface; and a second component formed on the one surface. A wire connection pad is formed, and an opening having a shape corresponding to a formation area of the first wire connection pad in the first component is formed, and the opening is formed in a region on the other side of the opening. An interposer substrate for mounting the first component on the other surface in a state where the first wire connection pad is located; a third wire connection pad formed on the one surface; A second component mounted on the one surface of the substrate; and a wiring wire for electrically connecting the first wire connection pad and the second wire connection pad. Is a component built-in module to be.
[0013]
In this component built-in module, the first component is mounted on the other side of the interposer substrate. The first wire connection pad formed on the one side surface of the first component and the second wire connection pad formed on one side of the interposer substrate are connected to the first wire connection pad. Are electrically connected by wiring wires that are routed through openings formed in the interposer substrate in accordance with the shape of the formation region of. As a result, regardless of the shape of each of the first component and the second component and the position where the wire connection pad is formed on one surface of the first component, the second component is provided in the region on one side of the first component. Parts can be placed.
[0014]
Therefore, according to the component built-in module of the present invention, the mounting density of the components can be improved with a simple configuration regardless of the mutual relationship between the shapes of the components sequentially arranged and the formation position of the wire connection pads in the components. .
[0015]
In the component built-in module according to the present invention, the heat dissipation conductor pattern may be formed on the other surface of the interposer substrate. In such a case, heat can be dissipated through the heat dissipating conductor pattern, so that a rise in the temperature of components during operation can be suppressed. Therefore, the reliability of operation of the component built-in module can be improved.
[0016]
Here, the interposer substrate may have a structure in which at least one heat dissipation through hole that is thermally connected to the heat dissipation conductor pattern is formed. In such a case, it is possible to efficiently conduct the heat generated in the component to the heat dissipation conductor pattern through the heat dissipation through-hole, so that the temperature rise of the component during operation can be efficiently suppressed. it can. Therefore, the reliability of the operation of the component built-in module can be efficiently improved.
[0017]
Further, in the component built-in module of the present invention, a fourth wire connection pad disposed outside a mounting area of the second component is provided on the one surface of the interposer substrate, A conductive path for electrically connecting the pad and the fourth wire connection pad may be formed. In such a case, by wiring the wire connection terminal outside the interposer substrate and the fourth wire connection pad, the fourth wire connection pad is provided between the outside of the interposer substrate and the first component. , An electric signal path and a power supply path via the conductive path, the second wire connection pad, and the wiring wire can be formed. The electric signal path and the power supply path between the outside of the interposer board and the second component are formed by wiring the wire connection terminals and the third wire connection pads outside the interposer board. Can be.
[0018]
Here, the interposer substrate has a configuration in which a conductive through-hole that is a part of a conductive path that electrically connects the heat dissipation pattern and at least one of the fourth wire connection pads is formed. be able to. In such a case, for example, the characteristic impedance of the signal pattern formed on the interposer substrate can be matched by setting the heat dissipation conductor pattern to an AC ground level. Further, the heat dissipation conductor pattern can function as an electromagnetic shield layer, and the effect of electromagnetic crosstalk between one side region and the other side region of the heat dissipation conductor pattern can be reduced.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0020]
1 and 2 show the configuration of the component built-in module 10 of the present embodiment. Here, FIG. 1A is a perspective view showing the appearance of the component built-in module 10, and FIG. 1B is a diagram showing the internal structure of the component built-in module 10 by removing a part of a sealing member 17 described later. It is a perspective view which shows schematically. FIG. 2 is a sectional view of the component built-in module 10. In FIG. 1 (B), LSI chip ₃₂ 1 to be described _later, and 32 _2, 32 3, 32 _4, adhesive layer _{13 1,} 13 2, 13 ₃ and to be able to visually and easily distinguish to are designated by the same hatch and hatch that is used to indicate a cross section of the adhesive layer _{13 1,} 13 2, 13 _3.
[0021]
As shown comprehensively in FIGS. 1 and 2, in the component built-in module 10 of the present embodiment, a desired wiring pattern is formed, and a wire connection pad 22 is formed outside the component mounting region on the + Z direction side surface. Printed circuit board 11, sub-modules 12 ₁ , 12 ₂ , 12 ₃ sequentially arranged along the + Z direction on a component mounting area on the + Z side surface of printed circuit board 11, and an LSI chip such as a dynamic RAM chip. and a 32 _4.
[0022]
As shown in FIG. 3, the submodule 12 _j (j = 1, 2, 3) includes an interposer substrate 31 _j and, for example, a dimic RAM chip mounted on the surface of the interposer substrate 31 _{j on} the −Z side. and a LSI chip 32 _j equal. Here, the same as the LSI chip 32 _j and the LSI chip 32 _4, as shown in FIG. 4, the + Z direction side surface Y-axis direction a plurality of wires connecting pad 35 _j in central is formed An LSI chip having a shape is used. Although FIG. 4 shows an example in which the wire connection pads _35j are arranged in two rows, they may be arranged in one row.
[0023]
Returning to Figure 3, the interposer substrate 31 _j is a flat substrate, in its central portion, an opening 49 having a shape corresponding to the shape of the forming region of the wire connecting pad 35 _j in the LSI chip 32 _j is formed . Then, the LSI chip 32 _j is mounted on the interposer substrate 31 _j via the adhesive layer 46 such that the wire connection pad 35 _j is located in the region on the −Z side end of the opening 49. Here, as the adhesive layer 46, for example, an epoxy adhesive or the like can be used.
[0024]
On the surface of the interposer substrate _{31j on} the + Z direction side, a conductor pattern 33 having a power supply path and an electric signal path (hereinafter, collectively referred to as "electric signal paths") is formed. A wire connection pad 34 is formed on a predetermined position of the conductor pattern 33 near the opening 49, and a wire connection pad 23 is formed on a predetermined position of the conductor pattern 33 near the Y-axis direction end. ing. A wiring wire 45 is provided between each of the wire connection pads 35 _j and the corresponding wire connection pad 34. Thus, the pad 35 _j each wire connection to the corresponding wire connecting pad 34 and hence the corresponding wire connection pads 23 are electrically connected. Here, as the wiring wire 45, for example, a wire of gold, aluminum, or the like can be used, and in particular, the use of a gold wire is thin, strong against bending, and conductivity stability is guaranteed. preferable.
[0025]
Further, in the -Z direction side surface of the interposer substrate 31 _j, heat radiation conductor pattern 36 of copper or the like is formed over almost the entire surface. Here, the heat dissipation conductor pattern 36 may be a solid pattern or a mesh pattern. The heat generated by the LSI chip _32j is efficiently _radiated by the heat dissipation conductor pattern 36.
[0026]
The interposer substrate 31 _j, further comprising: a heat radiation conductor pattern 36 and the through-hole connected radiator 37 and the conductive through hole 38 is formed. Here, the heat dissipation through hole 37 is not connected to the conductor pattern 33, but heat generated in the LSI chip _{32j + 1} mounted on the + Z direction side surface of the submodule _12j is dissipated. The heat is transmitted to the heat-radiating conductor pattern 36 through the heat-radiating conductor pattern 37.
[0027]
On the other hand, the conductive through-hole 38 is connected to the conductor pattern 33 described above, and is electrically connected to one or more of the wire connection pads 23 via the conductor pattern 33. The conductive through-hole 38 is finally electrically grounded via the wiring wires 21 and the printed wiring board 11 described later. For this reason, the heat dissipation conductor pattern 36 functions as a shield plate that electromagnetically shields the region on the + Z direction side and the region on the −Z direction side. In addition, since the heat dissipation conductor pattern 36 on the −Z side surface of the interposer substrate 31 _j is grounded, the characteristic impedance of the conductor pattern 33 on the + Z side surface of the interposer substrate 31 _j is matched. The conductive through hole 38 also functions as a transmission path of the heat generated in the LSI chip _{32j + 1} to the heat radiating conductor pattern 36, similarly to the heat radiating through hole 37 described above.
[0028]
Returning to Figures 1 and 2, the component built-in module 10, the sub-module 12 ₁ is fixed to the printed wiring board 11 via the adhesive layer 15, the sub-module 12 ₁ submodule 12 ₂ via the adhesive layer 13 ₁ Fixed. The sub module 12 ₃ is fixed to the sub-module 12 ₁ through the adhesive layer 13 _2. Then, LSI chips 32 ₄ is fixed to the sub-module 12 ₃ via the adhesive layer 13 _3. Here, as the adhesive layer 15, for example, an epoxy-based adhesive or the like can be used. As the adhesive layer _{13 1,} 13 2, 13 _3, for example, may be used an epoxy adhesive or the like.
[0029]
The sub module 12 _1, the sub-module 12 _2, respectively submodule 12 ₃ wire connection pads 35 formed on the wire connection pads 23 and the LSI chip 32 ₄ formed _4, the printed wiring board 11 + Z direction The corresponding wire connection pad 22 formed on the side surface is electrically connected by the wiring wire 21. Here, as the wiring wire 21, a wire such as gold or aluminum can be used. In particular, it is preferable to use a gold wire because it is thin, resistant to bending and stable in conductivity.
[0030]
The above-described sub-modules 12 ₁ , 12 ₂ , 12 ₃ , the adhesive layers 13 ₁ , 13 ₂ , 13 ₃ , the adhesive layer 15, the wiring wires 21, and the wire connection pads 22 are formed on the + Z direction side of the printed wiring board 11. Sealed by a sealing member 17. Here, as a material of the sealing member 17, an epoxy resin, a silicone resin, or the like can be used.
[0031]
A conductor pattern 18 is formed on the surface of the printed wiring board 11 on the −Z direction side, and a solder ball 19 is arranged on a predetermined position of the conductor pattern 18. The component built-in module 10 is mounted on a motherboard (not shown) via these solder balls 19.
[0032]
Although illustration is omitted except for the wire connection pad 22 on the + Z direction side surface and the conductor pattern 18 on the −Z direction side surface, a predetermined conductor pattern is formed on both surfaces and an inner layer of the printed wiring board 11. ing. In the printed wiring board 11, via holes for interlayer connection are formed.
[0033]
Next, a manufacturing process of the above-described component built-in module 10 will be described with reference to FIGS.
[0034]
First, the manufacture of the sub-modules 12 ₁ , 12 ₂ and 12 ₃ will be described.
When the submodule 12 _j (j = 1, 2, 3) is manufactured, for example, a copper conductor pattern 41 is formed on both sides in a solid state, and the insulating layer 42 is made of a copper-clad glass epoxy substrate made of a glass epoxy material, and the starting material 40A is used. (See FIG. 5A). In addition, a copper-clad glass polyimide substrate can be used as a starting material.
[0035]
A conductor pattern 33 is formed on the + Z direction side surface and a heat dissipation conductor pattern 36 is formed on the −Z direction side surface by applying a well-known subtractive pattern forming method to the starting material 40A. Further, by applying a well-known through-hole forming method, the heat-radiating through-hole 37 and the conductive through-hole 38 are formed. Further, the wire connection pads 23 and 34 are formed by applying a known wire connection pad formation method (see FIG. 5B).
[0036]
Subsequently, the opening 49 is formed by punching or the like (see FIG. 5C). After the opening 49 is formed by punching or the like, the conductor pattern 33, the heat dissipation through hole 37, the conduction through hole 38, and the wire connection pads 23 and 34 may be formed. Thus, the interposer substrate _31j is manufactured.
[0037]
Next, as -Z direction side end wire connecting pad 35 _j in the region of the opening 49 is located, the LSI chip 32 _j in the -Z direction side surface of the interposer substrate 31 _j via the adhesive layer 46 Attach (see FIG. 6A). Subsequently, the wiring wire 45 is wired between each of the wire connection pads 35 _j and the corresponding wire connection pad 34 by using a known wire bonding method. As a result, the pad 35 _j each wire connection to the corresponding wire connecting pad 34 is electrically connected (see FIG. 6 (B)). Thus, the submodule _12j is manufactured.
[0038]
On the other hand, in parallel with the preparation of the sub-module 12 _j, by a conventional method, the printed wiring board 11 in which a predetermined conductive pattern and via holes including a wire connection pads 22 and the conductor pattern 18 is formed it is created ( FIG. 7A). The printed wiring board 11 may have a conductor pattern formed only on both sides, or may have a conductor pattern formed on both sides and an inner layer.
[0039]
Then, through the adhesive layer 15, attaching the sub-module 12 ₁ to the component mounting region in the + Z direction side surface of the printed wiring board 11. Subsequently, using known wire bonding method, and each of the sub-module 12 ₁ of the wire connection pads 23 and the wiring between the corresponding printed circuit board 11 the wire connection pads 22 formed on the wiring wire 21 (See FIG. 7B). As a result, the respective sub modules 12 ₁ of the wire connection pads 23, and the corresponding wire connection pads 22 are electrically connected.
[0040]
Then, through the adhesive layer 13 _1, to mount the sub-module 12 ₂ submodules 12 ₁ + Z direction side. Subsequently, using known wire bonding method, and each sub-module 12 ₂ of the wire connection pads 23 and the wiring between the corresponding printed circuit board 11 the wire connection pads 22 formed on the wiring wire 21 (See FIG. 7C). As a result, the respective sub modules 12 _{and second} wire connection pads 23, and the corresponding wire connection pads 22 are electrically connected.
[0041]
Then, through the adhesive layer 13 _2, mounting the sub-module 12 ₃ to submodule 12 ₂ + Z direction side. Subsequently, using known wire bonding method, and each sub-module 12 ₃ of the wire connection pads 23 and the wiring between the corresponding printed circuit board 11 the wire connection pads 22 formed on the wiring wire 21 (See FIG. 8A). As a result, the respective sub modules 12 _{and second} wire connection pads 23, and the corresponding wire connection pads 22 are electrically connected.
[0042]
Then, through the adhesive layer 13 _3, to mount the LSI chip 32 ₄ in the + Z direction side of the sub-module 12 _3. Subsequently, using known wire bonding method, and each LSI chip 32 ₄ wire connection pads 35 _j, the corresponding wiring lead wire 21 between the wire connection pads 22 formed on the printed wiring board 11 (See FIG. 8B). Consequently, each and LSI chip 32 ₄ wire connection pads 35 _4, and the corresponding wire connection pads 22 are electrically connected.
[0043]
Next, the sub-modules 12 ₁ , 12 ₂ , 12 ₃ , the adhesive layers 13 ₁ , 13 ₂ , 13 ₃ , the adhesive layer 15, the wiring wires 21, and the wire connections are formed by performing potting or transfer molding using a mold. A sealing member 17 for sealing the pad 22 is formed on the + Z direction side of the printed wiring board 11 (see FIG. 9A). Thereafter, the solder balls 19 are formed on the formation regions of the solder balls 19 on the surface of the printed wiring board 11 on the −Z direction side (see FIG. 9B). Thus, the component built-in module 10 of the present embodiment is manufactured.
[0044]
As described above, the component built-in module 10 of the present embodiment, mounting the LSI chip 32 _j, which is the first component in the -Z direction side of the interposer substrate ₃₁ j (j = _1~3). The wire connection pad 35 _j formed on the + Z direction side surface of the LSI chip 32 _j1 and the wire connection pad 34 formed on the + Z direction side surface of the interposer substrate 31 _j are connected to the wire connection pad 35 _j. It is electrically connected by lead wire 45 which is routed via an opening 49 formed in the interposer substrate 31 _j in accordance with the shape of the forming region of. Further, an LSI chip 32 _{j + 1} as a second component is mounted on the + Z direction side of the interposer substrate 31 _j . As a result, regardless of the shape of each of the first component and the second component and the position where the wire connection pad is formed on one surface of the first component, the second component is provided in the region on one side of the first component. Parts can be placed.
[0045]
Therefore, according to the component built-in module of the present invention, the mounting density of the components can be improved with a simple configuration regardless of the mutual relationship between the shapes of the components sequentially arranged and the formation position of the wire connection pads in the components. .
[0046]
Further, a plurality of the component built-in module 10 of the present embodiment, the heat radiation conductor pattern 36 in the -Z direction side surface of the interposer substrate 31 _j is formed, the interposer substrate 31 _j is connected to the radiating conductor patterns 36 Are formed. Therefore, the heat generated in the component _32j can be efficiently conducted to the heat dissipation conductor pattern 36 through the heat dissipation through hole 37. Therefore, the temperature rise of the component _32j during operation can be efficiently suppressed, and the reliability of operation of the component built-in module can be efficiently improved.
[0047]
Further, in the component built-in module 10 of the present embodiment, the heat dissipation conductor pattern 36 is grounded via the conduction through hole 38. Therefore, it is possible to match the characteristic impedance of the signal patterns formed on the interposer substrate 31 _j. Further, the heat dissipation conductor pattern 36 can function as an electromagnetic shield layer, and the effect of electromagnetic crosstalk between submodules can be reduced.
[0048]
The present invention is not limited to the above embodiment, and various modifications are possible.
[0049]
For example, in the above embodiments, module 12 and _three wire connection pads 23 respectively, after the wire between the corresponding wire connecting pad 22 in lead wires 21, LSI chip 32 ₄ in the + Z direction side of the module 12 ₃ Was attached. Then, each of the LSI chip 32 ₄ wire connection pads 35 ₄ formed on and wiring between corresponding wire connecting pad 22 in lead wires 21. In contrast, after mounting the module 12 ₃ Module 12 ₂ + Z direction side, immediately mounted LSI chip 32 ₄ to the module 12 ₃ + Z direction side, then module 12 ₃ of the wire connection pads 23 and LSI and the chip 32 ₄ wire connection pads 35 ₄ formed respectively, it is also possible to interconnect between the corresponding wire connecting pad 22 in lead wires 21.
[0050]
In the above-described embodiment, the interposer substrates 31 ₁ , 31 ₂ , and 31 ₃ of the sub-modules 12 ₁ , 12 ₂ , and 12 ₃ have the same shape. In contrast, as the interposer substrate that is arranged on the -Z direction side, Y-axis direction (wiring wire 21 of the wiring direction) increasing the length of the interposer substrate 31 ₁ on the + Z direction side surface of the printed wiring board 11 , 31 ₂ , and 31 ₃ are sequentially stacked, a work area for wiring the wiring wires 21 is secured in the + Z direction side area of the wire connection pad 23 on which the interposer substrates 31 ₁ , 31 ₂ , and 31 ₃ are formed. You may make it. In such a case, after sequentially laminating the sub-module _{12 1,} 12 2, 12 ₃ and LSI 32 ₄ on the + Z direction side surface of the printed wiring board 11, the sub-module _{12 1,} 12 2, 12 ₃ of the wire connection pads and 23 and LSI chip 32 ₄ wire connection pads 35 ₄ formed respectively, it is also possible to interconnect between the corresponding wire connecting pad 22 in lead wires 21.
[0051]
In the above-described embodiment, the submodules 12 ₁ , 12 ₂ , and 12 ₃ are individually assembled, and then the sub modules 12 ₁ , 12 ₂ , and 12 ₃ are sequentially stacked. On the other hand, the sub-modules 12 ₁ , 12 ₂ , and 12 ₃ are not independently assembled, and the LSI chip 32 ₁ , the interposer substrate 31 ₁ , the LSI chip 32 ₂ , the interposer substrate 31 ₂ , the LSI chip 32 ₃ , and the interposer substrate 31 _3, and the LSI chip 32 ₄ may be sequentially via adhesive layers laminated. In such a case, each time the interposer substrates 31 _j (j = 1 to 3) are stacked, each of the wire connection pads 35 _j formed on the LSI chip 32 _j and the wires formed on the corresponding interposer substrate 31 _j as well as wiring lead wire 45 between the connecting pad 34, the wire connection pads 23 formed on the interposer substrate 31 _j, between the corresponding wire connecting pad 22 to be wired by the wiring wire 21 Become.
[0052]
Further, in the above embodiment, the case where four components are stacked and arranged has been described, but the number of components to be stacked and arranged is arbitrary. Further, the components to be laminated may be the same type of components or different types of components.
[0053]
Further, in the above embodiment, the plurality of built-in components have all the wire connection pads formed at the center of the surface of the component in the wiring direction of the wiring wires. On the other hand, other than the central part of the surface of the component in the wiring direction of the wiring wire, a component on which a wire connection pad is formed can be laminated.
[0054]
Furthermore, the present invention can be applied even if a wire connection pad is formed at an arbitrary position on the surface in the −Z direction on each of the plurality of components.
[0055]
Further, in the above embodiment, a plurality of built-in components have the same shape. On the other hand, each of the plurality of components sequentially arranged can be made to have an arbitrary size.
[0056]
【The invention's effect】
As described above in detail, according to the component built-in module of the present invention, it is possible to improve the component mounting density with a simple configuration, regardless of the shape of each of the components and the formation position of the wire connection pad. A remarkable effect that a component built-in module that can be provided can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing a configuration of a component built-in module according to an embodiment of the present invention.
FIG. 2 is a cross-sectional configuration diagram for explaining a configuration of the component built-in module of FIG. 1;
FIG. 3 is a cross-sectional view for explaining a configuration of a submodule that is a component of the component built-in module of FIG.
FIG. 4 is a perspective view for explaining a configuration of components built in the component built-in module of FIG. 1;
FIG. 5 is a view (No. 1) for describing a manufacturing step of the module with a built-in component in FIG. 1;
FIG. 6 is a view (No. 2) for explaining the manufacturing process of the component built-in module of FIG. 1;
FIG. 7 is a view (No. 3) for explaining the manufacturing step of the module with a built-in component in FIG. 1;
FIG. 8 is a view (No. 4) for explaining the manufacturing step of the module with a built-in component in FIG. 1;
FIG. 9 is a view (No. 5) for explaining the manufacturing step of the module with a built-in component in FIG. 1;
FIG. 10 is a perspective view schematically showing a configuration of a conventional component built-in module.
[Explanation of symbols]
10 ... component built-in module, 11 ... printed circuit _board, 12 1, ₁₂ 2, 12 3 _{... submodule} 13 1, ₁₃ 2, 13 3 _... adhesive layer, 15 ... adhesive layer, 21 ... lead wire, 22 ... wire connection use pads, 23 ... wire connecting pad (fourth wire connection _pads), 31 1, ₃₁ 2, 31 3 _... interposer _substrate, 32 _1, 32 _2, 32 3, ₃₂ 4 ... LSI chip (part), 33 ... conductor pattern, 34 ... wire connection pad (second wire connection pad), 35 ₁ , 35 ₂ , 35 ₃ , 35 ₄ ... wire connection pad (first wire connection pad, third wire connection) 36) heat dissipation pattern, 37 ... heat dissipation through hole, 38 ... conductive through hole.

Claims (5)

In a component built-in module with multiple built-in components,
A first component having a first wire connection pad formed on one surface;
A second wire connection pad is formed on the one surface, and an opening having a shape corresponding to a formation region of the first wire connection pad in the first component is formed. An interposer substrate on which the first component is mounted on the other surface in a state where the first wire connection pad is located in the other region of the interposer;
A second component having at least one third wire connection pad formed on the one surface and mounted on the one surface of the interposer substrate;
A component built-in module, comprising: a wiring wire for electrically connecting the first wire connection pad and the second wire connection pad. 2. The component built-in module according to claim 1, wherein a heat radiation conductor pattern is formed on the other surface of the interposer substrate. The component built-in module according to claim 2, wherein the interposer substrate has at least one heat dissipation through hole that is thermally connected to the heat dissipation conductor pattern. On the one surface of the interposer substrate, a fourth wire connection pad disposed outside a mounting area of the second component, and the second wire connection pad and the fourth wire connection The component built-in module according to any one of claims 1 to 3, wherein a conductive path for electrically connecting the module to the pad is formed. The interposer substrate is provided with a conductive through hole that is a part of a conductive path that electrically connects the heat radiation pattern and at least one of the fourth wire connection pads. The component built-in module according to claim 4.

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