JP2004227907A

JP2004227907A - Connector for integrated circuit and assembly of connector and circuit board

Info

Publication number: JP2004227907A
Application number: JP2003013886A
Authority: JP
Inventors: Shinobu Takeuchi; 忍竹内
Original assignee: MOLDEC KK
Current assignee: MOLDEC KK
Priority date: 2003-01-22
Filing date: 2003-01-22
Publication date: 2004-08-12

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector and an assembly of the connector and a circuit board capable of attaining satisfactory input/output signals even when a pitch between terminals of an integrated circuit is narrow, and to improve the coplanarity of each terminal while eliminating waste in a process of manufacturing the terminals. <P>SOLUTION: The connector 1, which is a CPU socket, comprises a terminal 7 made of a gold-plated beryllium copper wire as a wire material. The terminal 7 has a connecting portion 11, a holding portion 12 and a fixing portion 13. The connecting portion 11 of the terminal 7 is subjected to bending. The holding portion 12 and the fixing portion 13, while remaining straight, are press-fitted into a holding hole 8 formed in an inner case 4. Subsequently, the fixing portion 13 is subjected to bending. As the terminal 7 is made of the wire material, it is possible to secure a great distance between terminals, to reduce capacitance between terminals, and to thereby attain satisfactory input/output signals. The coplanarity of each terminal is also improved because the bending of the terminal 7 is performed after press-fitting. As the terminal 7 is made of the wire material, an unwanted portion formed when cutting a metal plate is not formed as in a conventional process. Costs of materials are thereby reduced. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術の分野】
本発明は、ＣＰＵソケット等の集積回路用コネクタ及びコネクタと回路基板との組立体に関する。
【０００２】
【従来の技術】
平板状の端子部から複数のピンが下方に突出する集積回路を回路基板に着脱自在に装着するコネクタとしては、下記特許文献１に開示されているようなものが知られている。このような従来のコネクタは、回路基板に固定される絶縁性の内部ケースと、内部ケースに係合されその表面を前後方向に摺動自在の外部ケースと、外部ケースを前後方向に摺動させる操作レバーとを備えている。また、内部ケースにはＣＰＵのピンに応じて設けられた端子が内蔵されている。この端子は、金属板をプレス金型にて所定形状に切り取り、その後所定形状に折り曲げて特許文献１の図９に示すような形状にしている。
【０００３】
近年においては、ＣＰＵの高性能化に伴い、ピンの数が増え、さらに各ピンのピッチが狭くなる傾向にある。このようにピンのピッチが狭くなると、それに応じて各端子間の距離も狭くなる。このような状況において、従来の金属板を加工した端子においては、端子そのものの表面積が大きいため各端子間の静電容量が大きくなり、端子間のクロストークや信号の位相のずれ、あるいは信号の波形のダレが生じ、信号の立ち上がりが鈍くなる等の不具合が生じるおそれがある。
【０００４】
また、従来のコネクタは、端子をプレス金型により金属板から所定形状に切り取るものであるため、端子とならない部分が無駄になってしまう。また、端子が金属板から切り取られる際には複数の端子がキャリアにより連結されて切り取られるが、このキャリアは端子を内部ケースに装着した後は端子から切り離されて廃棄されるものである。このように、従来のコネクタにおいては、金属板から端子を切り取る際に端子としては使用できない部分が多くあったため、コスト的にも不利であった。
【０００５】
さらに、従来の端子は、キャリアにより連結された状態で金メッキ等のメッキ加工を行っているが、各端子がキャリアにより所定の間隔があけられた状態でメッキ槽に入れなければならないため、単位時間当たりに加工することができる端子の数が少なくなり、全体としてメッキ工程に多くの時間を必要としていた。
【０００６】
一方、コネクタのうち、回路基板に表面実装されるものとしては、例えば下記特許文献２に示すようないわゆるボールグリッドアレイ（ＢＧＡ）方式のコネクタが知られていた。ＢＧＡ方式のコネクタは、コネクタの端子に取り付けられた球状の半田（半田ボール）を回路基板のランド部に当接させ、半田ボールを加熱溶融して端子とランド部とを接続するものである。
【０００７】
このようなＢＧＡコネクタは、半田ボールが回路基板のランド部に当接した状態でなければ加熱溶融した際に端子とランド部とが接続されない場合がある。従って、多数の端子を備えたコネクタにおいては、半田ボールの先端部の揃い具合を示す平面度（コプラナリティ）を向上させる必要がある。しかしながら、近年のＣＰＵの能力向上に伴うピン数の増加により、コネクタのコプラナリティを向上させることが困難となってきている。
【０００８】
【特許文献１】
特開平１０−１２３４２号公報（第６頁、第９図）
【特許文献２】
特開平１０−１６２９０９号公報（フロントページ）
【０００９】
【発明が解決しようとする課題】
本発明は、コネクタ及びコネクタと回路基板との組立体の改良を目的とし、さらに詳しくは、集積回路の高性能化に伴い各端子間のピッチが狭くなった場合であっても入出力される信号を良好なものとすることができるコネクタ及び回路基板との組立体を提供することを目的とする。また、本発明は、端子の製造の際の無駄をなくし、さらに各端子のコプラナリティを向上させることができるコネクタ及び回路基板との組立体を提供することを目的とする。
【００１０】
【課題を解決するための手段】
前記目的を達成するために、本発明の第１乃至第３の態様の集積回路用コネクタは、以下のような共通の構成を備えている。まず、平板状の端子部から複数のピンが下方に突出された集積回路を回路基板に着脱自在に装着するコネクタであって、回路基板に固定される内部ケースと、前記内部ケースに対して前後方向に摺動自在に設けられる外部ケースと、前記外部ケースを摺動させる摺動手段とを有している。また、前記内部ケースには前記ピンに接続されると共に前記回路基板に設けられたランドに半田付けされる端子が設けられ、前記外部ケースは前記ピンが挿通される挿通孔を有し、前記内部ケースは前記ピンを収納する収納部と前記端子を保持する保持孔とを有し、前記端子は線材を加工することにより形成され、前記保持孔に保持される保持部と、前記保持部から前記内部ケースの表面側に突出し前記収納部に収納される接続部と、前記保持部から前記内部ケースの裏面側に突出し前記ランドに半田付けされる固着部とを有している。また、前記外部ケースが前記摺動手段により後方に移動された状態で前記ピンが前記挿通孔に挿通されたときは前記ピンは前記収納部の後方で前記ピンとは接触しない位置で保持され、前記ピンが前記挿通孔に挿通された状態で前記外部ケースが前方に移動されたときは前記ピンは前記収納部の前方で前記接触部と接触する。
【００１１】
そして、本発明の第１の態様の集積回路用コネクタの前記端子は、前記接触部が前記内部ケースの収納部の前方で前記ピンと接触するように予め屈曲され、前記保持部が直線の状態で前記保持孔に圧入された後、前記内部ケースの裏面側に突出した部分が前記ランドと大略平行に屈曲されて前記固着部が形成されてなることを特徴とする。
【００１２】
また、本発明の第２の態様の集積回路用コネクタの前記端子は、直線の状態で前記内部ケースの表裏から突出するように前記保持部が前記保持孔にインサート成形又は圧入された後、前記内部ケースの表面側に突出した部分が前記収納部の前方で前記ピンと接触するように屈曲されて前記接続部が形成され、前記内部ケースの裏面側に突出した部分が前記ランドと大略平行に屈曲されて前記固着部が形成されてなることを特徴とする。このとき、前記接続部と前記固着部とは、どちらが先に形成されてもよく、同時に形成されてもよい。
【００１３】
また、本発明の第３の態様の集積回路用コネクタの前記端子は、前記接触部が前記内部ケースの収納部の前方で前記ピンと接触するように予め屈曲され、前記保持部が直線の状態で前記保持孔に遊嵌された後、前記内部ケースの裏面側に突出した部分が前記ランドと大略平行に屈曲されて前記固着部が形成されると共に前記接触部と前記固着部とにより前記内部ケースを挟持してなることを特徴とする。
【００１４】
本発明の第１乃至第３の態様の集積回路用コネクタは、前記端子が線材から形成されているため、当該線材の直径が従来の金属板を用いた端子の厚さと大略同一のものを用いた場合、前記内部ケースに装着されたときは各端子間の静電容量が従来の金属板を用いた端子に比べて小さくなる。従って、各端子を介して入出力される信号を良好なものとすることができるため、クロック周波数の高い集積回路に好適なものとなる。
【００１５】
また、前記端子が線材で形成されており、材料となる長尺の線材を所定長さに切るだけで各端子の材料を確保することができるため、金属板を加工したときのように材料を無駄にすることがない。さらに、前記端子の材料となる線材にメッキ加工を行う場合には、従来のようにキャリアに連結された状態ではなく線材の状態でメッキ加工を行うことができるので、短時間に多数の端子をメッキ加工することが可能となる。また、予めメッキされた線材を用いることにより、端子の加工にあたってメッキ工程を設ける必要がない。
【００１６】
また、前記固着部は前記内部ケースに装着された後に所定の形状に屈曲されるため、仮に前記内部ケースにひずみが生じている場合であっても、端子を曲げ加工する際にそのひずみを吸収するように前記内部ケースから突出する端子の高さを揃えることができる。従って、本発明においては容易に各端子のコプラナリティを向上させることができる。
【００１７】
また、前記第１及び第２の態様の集積回路用コネクタにおいて、前記端子の保持部に前記保持孔に保持された際に前記保持孔に係合される粗面部を設けたときは、前記端子と前記内部ケースとの結合状態が強固なものとなるため、集積回路用コネクタを回路基板にリフロー半田付けする際に前記端子が不用意に移動する等の不都合を防止することができる。
【００１８】
また、本発明の集積回路用コネクタにおいては、前記端子の接続部は前記内部ケースの収納部内の前方位置で前記端子の保持部から上方に突出すると共に水平方向に屈曲され後方に向けて延設される第１側辺と、前記収納部の後方位置にある前記第１側辺の先端から下方に略Ｕ字状に屈曲される延長部と、前記延長部の先端から水平方向に屈曲され前方に向けて延設される第２側辺とを有し、前記第１側辺と前記第２側辺とは前記収納部の前方部分では前記ピンの外径よりも幅狭であり、前記収納部の後方部分では前記ピンの外径よりも幅広に形成されていることが好ましい。
【００１９】
前記端子の接続部を上記形状に屈曲させることにより、前記ピンが前記外部ケースにより前記内部ケースの収納部の前方に移動されたときは前記第１側辺と前記第２側辺とにより前記ピンが挟持される。これにより、前記ピンと前記接続部とが２点で接触するため、前記ピンと前記接続部とが確実に接続される。また、前記ピンと前記接触部とが接触しているときは、前記第１側辺と前記第２側辺とが広げられるが、前記接続部には略Ｕ字状の延長部が設けられているため、前記接続部の弾性限界が向上し、前記ピンが前記接続部に接続された際の前記接続部の負担が軽減される。
【００２０】
また、本発明の集積回路用コネクタにおいては、前記内部ケースは、前記収納部内に突出し前記端子の接続部を下方から支持する支持部を備えていることが好ましい。前記支持部により前記端子の接続部が下方より支持されるため、前記ピンによって前記接続部が上方から押し下げられた場合であっても前記接続部の挫屈が防止される。
【００２１】
また、本発明の集積回路用コネクタにおいては、前記端子の接続部は、隣接する端子の水平方向に屈曲された箇所の高さ位置をずらして配設されていることが好ましい。前記端子が前記内部ケースに装着されると、前記端子の接続部が同一平面上に並ぶため、前記接続部同士が接近した状態となる。そこで、隣接する端子の接続部の高さ位置をずらして隣接する各接続部の間隔を広げることにより、各端子間の静電容量を小さくすることができる。
【００２２】
また、本発明の集積回路用コネクタにおいては、前記内部ケースは前記回路基板の所定位置に装着された際に前記回路基板に掛止される掛止部を有し、前記端子の固着部は前記内部ケースが前記回路基板に掛止された際に前記ランドに付勢されるように前記内部ケースの裏面と前記回路基板との間隙よりも突出していることが好ましい。前記端子の固着部を前記端子の弾性によって前記ランドに付勢することにより、前記固着部のコプラナリティに左右されることなく前記ランドに確実に当接させることができるため、両者の半田付けを確実に行うことができる。
【００２３】
また、前記端子の固着部に平面視で前記ランドの幅方向に屈曲された屈曲部を設けたときは、前記固着部と前記ランドとの接触面積を増やすことができるため、両者の半田による接続が良好なものとなる。
【００２４】
また、本発明の第１乃至第３の態様のコネクタと回路基板との組立体は、平板状の端子部から複数のピンが下方に突出された集積回路を回路基板に着脱自在に装着するコネクタと回路基板との組立体であって、以下のような共通の構成を備えている。まず、前記コネクタは、回路基板に固定される内部ケースと、前記内部ケースに対して前後方向に摺動自在に設けられる外部ケースと、前記外部ケースを摺動させる摺動手段とを有し、前記内部ケースには前記ピンに接続されると共に前記回路基板に設けられたランドに半田付けされる端子が設けられている。また、前記回路基板は表面を覆い前記ランドの一部を露出させる露出部を有するレジスト膜を備え、前記露出部にクリーム半田が充填される。また、前記外部ケースは前記ピンが挿通される挿通孔を有し、前記内部ケースは前記ピンを収納する収納部と前記端子を保持する保持孔とを有する。また、前記端子は線材を加工することにより形成され、前記保持孔に保持される保持部と、前記保持部から前記内部ケースの表面側に突出し前記収納部に収納される接続部と、前記保持部から前記内部ケースの裏面側に突出し前記ランドに半田付けされる固着部とを有する。
【００２５】
そして、第１の態様のコネクタと回路基板との組立体は、前記端子の前記接触部が前記内部ケースの収納部の前方で前記ピンと接触するように予め屈曲され、前記保持部が直線の状態で前記保持孔に圧入され、前記固着部が前記内部ケースの裏面から突出された状態で前記露出部に収納され前記ランドと大略平行になるように屈曲され、クリーム半田が充填された前記露出部に前記固着部が収納され、リフロー半田付けにより前記固着部と前記ランドとが接続されることを特徴とする。
【００２６】
また、第２の態様のコネクタと回路基板との組立体は、前記端子の接触部が前記内部ケースの収納部の前方で前記ピンと接触するように予め屈曲され、前記保持部が直線の状態で前記保持孔に遊嵌された後、前記内部ケースの裏面側に突出した部分を前記ランドと大略平行に屈曲して前記固着部を形成すると共に前記接触部と前記固着部とにより前記内部ケースを挟持してなり、クリーム半田が充填された前記露出部に前記固着部が収納され、リフロー半田付けにより前記固着部と前記ランドとが接続されることを特徴とする。このとき、前記接続部と前記固着部とは、どちらが先に形成されてもよく、同時に形成されてもよい。
【００２７】
また、第３の態様のコネクタと回路基板との組立体は、前記端子が前記保持孔よりも小径の線材により形成され、前記端子の接触部が前記内部ケースの収納部の前方で前記ピンと接触するように予め屈曲され、前記保持部が直線の状態で前記保持孔に遊嵌され、前記固着部を前記内部ケースの裏面から突出された状態で前記ランドと大略平行になるように屈曲されて前記接触部と前記固着部とにより前記内部ケースを挟持してなり、クリーム半田が充填された前記露出部に前記固着部が収納され、リフロー半田付けにより前記固着部と前記ランドとが接続されることを特徴とする。
【００２８】
本発明の第１乃至第３の態様のコネクタと回路基板との組立体によれば、前記端子の固着部は、回路基板の表面に設けられたレジスト膜に形成されている露出部に収納される形状に形成されているので、前記固着部と前記ランドとの間には前記レジスト膜は介在しない。従って、前記固着部を直接前記ランドに当接させることができるため、前記固着部と前記ランドとを確実に半田付けすることができる。
【００２９】
【発明の実施の形態】
次に、本発明のコネクタの実施形態の一例について、図１乃至図２０を参照して説明する。図１は第１の実施形態のコネクタを示す説明図、図２は図１のＩＩ−ＩＩ部分の一部破断拡大図、図３は端子の接続部とＣＰＵのピンとの関係を示す説明図、図４は端子を折り曲げ加工する際の工程を示す説明図、図５は内部ケースに装着された端子を曲げ加工する際の工程を示す説明図、図６は回路基板にコネクタを表面実装する際の工程を示す説明図、図７は第１の実施形態の変形例を示す説明図、図８は第１の実施形態の変形例における端子を示す説明図、図９は図８のＩＸ−ＩＸ線断面図、図１０乃至１２は第１の実施形態の他の変形例を示す説明図である。
【００３０】
また、図１３は第２の実施形態のコネクタの端子とＣＰＵのピンとの関係を示す説明図、図１４は第２の実施形態における端子を内部ケースにインサート成形する工程を示す説明図、図１５は第２の実施形態の端子の接続部を形成する工程を示す説明図、図１６は端子の接続部の変形例を示す説明図、図１７は第２の実施形態の変形例を示す説明図、図１８は第３の実施形態のコネクタを示す説明図、図１９は第３の実施形態のコネクタの製造工程を示す説明図、図２０は端子の固着部の変形例を示す説明図である。
【００３１】
まず、第１の実施形態のコネクタ及びコネクタと回路基板との組立体について説明する。第１の実施形態のコネクタ１は、図１に示すように、回路部２ａと、矩形板状の端子部２ｂと、端子部２ｂの下方に突出するピン２ｃとを備えたＣＰＵ２を回路基板３に着脱自在に装着するＣＰＵソケットである。コネクタ１は、それぞれ絶縁体により形成されている内部ケース４及び外部ケース５と、内部ケース４にインサート成形されて固定されＣＰＵ２のピン２ｃに接続されると共に回路基板のランド１４（図３参照）にリフロー半田付けされる端子７と、外部ケース５を内部ケース４に対して前後方向に摺動させる操作レバー６とを備えている。
【００３２】
内部ケース４は合成樹脂製であり、図２に示すように、複数の端子７が格子状に装着されている。また、図３ａに示すように、後述する端子７の保持部１２が圧入される保持孔８と、後述する端子７の接続部１１とＣＰＵ２のピン２ｃが収納される収納凹部９を備えている。また、収納凹部９には、端子７の位置決めを行う位置決め突起９ａが設けられている。
【００３３】
外部ケース５は合成樹脂製であり、内部ケース４に対して前後方向（図２において上下方向）に摺動自在に取り付けられており、ＣＰＵ２のピン２ｃが挿入される挿通孔１０を備えている。この外部ケース５は、操作レバー６の回動により内部ケース４に対して前後方向に摺動される。操作レバー６を図１に示すように起立させたときは、外部ケース５は後方（図２において上方）に移動される。また、操作レバー６を前方に回動させたときは、外部ケース５は前方（図２において下方）に移動される。
【００３４】
次に、第１の実施形態のコネクタ１の端子７について図３を参照して説明する。図３ａは内部ケース４及び端子７の一部拡大平面図、図３ｂは図３ａのｂ−ｂ線断面図、図３ｃは図３ａのｃ−ｃ線断面図である。また、図３ａの左上部分は端子７を除いた収納凹部９の状態を示し、右上部分は収納凹部９に端子が装着された状態を示し、左下部分は外部ケース５が後方位置にある状態でＣＰＵ２のピン２ｃが外部ケース５の挿通孔１０に挿通された際のピン２ｃと端子７との関係を示し、右下部分は操作レバー６により外部ケース５が前方位置に移動された際のピン２ｃと端子７との関係を示すものである。
【００３５】
端子７は、表面に金メッキが施された直径０．１ｍｍのベリリウム銅線を曲げ加工することにより形成されている。この端子７は、図３ｂ及びｃに示すように、ＣＰＵ２のピン２ｃと接続する接続部１１と、内部ケース４の保持孔８に保持される保持部１２と、後述する回路基板３の表面に設けられたランド１４に半田付けされる固着部１３とを備えている。
【００３６】
保持部１２は、後述するように内部ケース４に設けられた保持孔８に圧入されて保持されている。また、保持部１２の表面には、後述するプレス１６ａにより表面に凹凸が設けられた粗面部１２ａとなっている。
【００３７】
接続部１１は、図３ａ乃至ｃに示すように収納凹部９の前方（図３ａにおいて下方）に位置する保持部１２から収納凹部９内で上方に向けて突出し、水平方向に屈曲され前方位置から後方に向けて斜め右方向に広がるように延設される第１側辺１１ａと、収納凹部９の後方位置で第１側辺１１ａの後端部から下方に向けて略Ｕ字状に屈曲されて延長された延長部１１ｂと、延長部１１ｂから前方に向けて斜め右方向に狭まるように延設される第２側辺１１ｃとを有している。この接続部１１における延長部１１ｂは、図３ａ及びｃに示すように、位置決め突起９ａにより収納凹部９内に位置決めされている。また、保持部１２から上方に突出する部分は、ピン２ｃと当接しないように図３ｂにおいて右側に湾曲している。
【００３８】
また、第１側辺１１ａと第２側辺１１ｃとは、図３ａに示すように、前方部分ではそれぞれの間隔がピン２ｃの直径よりも狭くなっており、後方部分ではそれぞれの間隔がピン２ｃの直径よりも広くなっている。従って、図３ａの左下の図で示すように、収納凹部９の後方部分にピン２ｃが挿入されたときは、ピン２ｃと第１側辺１１ａ及び第２側辺１１ｃとは接触しない。また、図３ｃに示すように、ピン２ｃの先端部は収納凹部９よりも浅くなっているため、ピン２ｃと延長部１１ｂとも接触しない。
【００３９】
この状態からピン２ｃが収納凹部９の前方部分に移動されると、ピン２ｃは第１側辺１１ａ及び第２側辺１１ｃに挟持される。これにより、ピン２ｃと接続部１１とが電気的に接続される。
【００４０】
回路基板３は、図３ｂ，ｃ及び図６ａに示すように、合成樹脂製の基板の表面にランド１４及び絶縁性のレジスト膜１５が設けられている。このレジスト膜１５は、ランド１４が表面に露出する露出部１４ａを除いて回路基板３の表面を覆っている。この露出部１４ａは、端子７の固着部１３よりも若干広くなるように形成されてる。尚、図３ｂ及びｃにおいては、端子７の状態を見やすくするため位置決め突起９ａの一部を省略している。
【００４１】
次に、第１の実施形態のコネクタ１を製造する工程について図４及び図５を参照して説明する。まず、端子７の原材料には、予め金メッキが施されたベリリウム銅線７ａを使用する。そして、端子７に必要な長さに切断した後、プレス１６ａによって図４ｂに示すような形状に曲げ加工を行う。その際、保持部１２となる箇所にプレス１６ａにより凹凸を付けて粗面部１２ａとしている。
【００４２】
次に、図４ｂに示すように、プレス１６ｂによって図４ｃに示すような形状に曲げ加工を行う。この状態では、固着部１３及び保持部１２は直線状であり、接続部１１も側面視で直線状となっている。次に、図４ｄに示すように、プレス１６ｃにより接続部１１を固着部１３及び保持部１２と直角になるように折り曲げ、さらに図４ｅに示すように延長部１１ｂを下方に直角に折り曲げる。以上の工程により、接続部１１が所定形状に形成され、固着部１３及び保持部１２が直線状の端子７が形成される。
【００４３】
次に、図５ａに示すように、端子７の固着部１３及び保持部１２を内部ケース４の保持孔８に圧入する。その際、保持孔８は上方がテーパ状に形成されているので、固着部１３の先端部が円滑に導入される（図３ｂ，ｃ参照）。次に、図５ｂに示すように、端子７の固着部１３をプレス１７により折り曲げる。これにより、図５ｃに示すように、固着部１３は回路基板３と略平行となるように形成される。このように端子７が所定の形状に加工された後、内部ケース４と外部ケース５と操作レバー６とを組み合わせてコネクタ１を完成させる。
【００４４】
次に、コネクタ１を回路基板３にリフロー半田付けする工程について図６を参照して説明する。まず、図６ａに示す回路基板３の表面にクリーム半田１９を塗布する。このとき、図６ｂに示すようにマスク板２０によりランド１４の露出部１４ａのみにクリーム半田１９を塗布する。次に、図６ｃに示すようにマスク板２０を回路基板３から離反させる。そして、図６ｄに示すようにコネクタ１を回路基板３の所定位置に載置する。
【００４５】
回路基板３の表面に設けられているレジスト膜１５には、端子７の固着部１３よりも広くなるように開口する露出部１４ａが設けられており、端子７の固着部１３はこの露出部１４ａ内に載置される。このとき、露出部１４ａ内に充填されたクリーム半田１９により端子７の固着部１３とランド１４とが接続される。この状態で、コネクタ１が載置された回路基板３を図示しないリフロー炉によって加熱することによりクリーム半田１９を溶融させ、コネクタ１と回路基板３とをリフロー半田付けする。
【００４６】
以上のように、第１の実施形態のコネクタ１は、端子７の保持部１２が直径０．１ｍｍのベリリウム銅線により形成されているため、各保持部１２間の距離を大きくとることが可能となる。このため、各端子７間の静電容量を少なくすることができるので、各端子７で入出力される信号のクロストークや位相のずれ、或いは波形のダレを少なくすることができ、信号の立ち上がりを急峻なものとすることができる。これにより、第１の実施形態のコネクタ１は、クロック周波数の高いＣＰＵ２に好適なものとなる。
【００４７】
また、第１の実施形態のコネクタ１は、端子７が従来のように金属板を切り取って曲げ加工したものではなく、細い線材を曲げ加工したものであるため、従来の端子に比べて幅方向の面積を狭くすることができる。従って、各端子７間のピッチを狭くすることができるので、今後のＣＰＵ２のピン２ｃの狭ピッチ化にも対応することができる。また、端子７が線材により形成されているため、メッキを行う際にも従来のようにキャリアに連結しなくてもよいので、短時間に多数の端子をメッキすることができる。また、第１の実施形態では、端子７に予めメッキされた線材を用いるため、端子７の加工にあたってメッキ工程を設ける必要がない。
【００４８】
また、第１の実施形態のコネクタ１は、端子７を内部ケース４に圧入した後に端子７の加工を行っている。このため、内部ケース４にひずみが生じている場合であっても、そのひずみに関係なく端子７の加工時に固着部１３の高さを揃えることができる。これにより、各端子７の固着部１３の平面度（コプラナリティ）を向上させることができるため、固着部１３と回路基板３のランド１４とを確実に半田付けすることができる。
【００４９】
また、従来のコネクタは、端子が金属板を打ち抜き加工することにより形成されているため、端子以外の部分の金属板が無駄になるが、第１の実施形態のコネクタ１においては、端子７はベリリウム銅線を所定の長さに切るだけでよいので、材料の無駄がなく、材料コストを低減させることが可能となる。また、従来のコネクタに比べて端子の重量も少なくすることができるので、コネクタの軽量化も図ることができる。
【００５０】
さらに、コネクタの軽量化を図ることができるため、コネクタを一度回路基板の表面側にリフロー半田付けした後に回路基板の裏面側にも電子部品をリフロー半田付けする場合、回路基板を裏返してリフローすることもあるが、コネクタが軽量なので回路基板から外れるという不具合が生じにくくなる。
【００５１】
尚、上記第１の実施形態においては、端子７を形成する線材として直径が０．１ｍｍのベリリウム銅線を用いているが、その太さと材質はこれに限定することなく、公知の他の材質のものを用いてもよい。また、保持部１２が線材であるため、各保持部１２間の間隔が広くなるので、内部ケース４に各保持部１２を囲む導電性部材をインサート成形等により設け、当該導電性部材を接地することにより各保持部１２をシールドすることも可能となる。
【００５２】
次に、第１の実施形態における変形例であるコネクタについて図７乃至図１２を参照して説明する。第１の変形例のコネクタ２１は、図７に示すように、ＣＰＵソケットであり、上記第１の実施形態とは収納凹部９の形状及び端子７の形状が異なると共に、内部ケース４の裏面に回路基板３に掛止される掛止部４ａが設けられている点が異なっている。その他の点については、上記第１の実施形態と同様であるので、同一の構成には上記と同様の符号を付して詳細な説明は省略する。
【００５３】
第１の変形例における端子７は、図８に示すように、内部ケース４に保持されている保持部１２から第１側辺１１ａが収納凹部９の後方（図８において右斜め上）に向けて広がるように延設されると共に、下方に向けて略Ｕ字状に折返された延長部１１ｂを有し、さらに第２側辺が延長部１１ｂから収納凹部９の前方に向けて狭まるように延設されており、接続部１１の先端部は内部ケース４に設けられた挿入穴４ｂに挿入されて保持されている。
【００５４】
また、端子７の固着部１３は、図９に示すように内部ケース４の裏面から斜め下方に曲折されている。この固着部１３は、図９に示すように、コネクタ２１を回路基板３に表面実装する際の回路基板３の表面（図９において一点鎖線で示す）よりも下方に突出するように曲折されている。
【００５５】
内部ケース４の収納凹部９は、図８に示すように、延長部１１ｂを裏面から支持する支持部９ｂが延長部１１ｂの形状に合わせてＵ字状に形成されている。また、端子７の先端部が挿入される挿入穴４ｂの周囲は、端子７の先端部を挿入しやすいようにテーパ状に加工されている。また、内部ケース４の裏面からは図７に示すように下方に向けて掛止部４ａが突出している。そして、回路基板３に表面実装される際に回路基板３に設けられた図示しない掛止孔に掛止部４ａが挿入され、内部ケース４を回路基板３に掛止する。
【００５６】
第１の変形例のコネクタ２１は、上記構成となっているため、コネクタ２１を回路基板３に表面実装する際には、クリーム半田１９が充填されたランド１４の露出部１４ａに（図６ｃ参照）端子７の固着部１３が当接する。固着部１３は、内部ケース４の裏面と回路基板３との間の間隙よりも突出するように形成されているため、固着部１３とランド１４とが確実に接続される。この状態からさらに内部ケース４を回路基板３に押し付けると、内部ケース４に設けられた掛止部４ａが回路基板３の図示しない掛止孔に掛止される。これにより、端子７の固着部１３が回路基板３によって屈曲されてランド１４に押し付けられるので、さらに固着部１３とランド１４との接続が確実になる。そして、図示しないリフロー炉においてリフロー半田付けすることにより確実に固着部１３とランド１４とを半田付けすることができる。
【００５７】
このように、第１の変形例のコネクタ１は、端子７の固着部１３が内部ケース４の裏面と回路基板３との間隔よりも突出しているため、コネクタ１を回路基板３に装着した際には固着部１３の弾性によって確実に固着部１３とランド１４とが接続される。従って、ＣＰＵ２の多ピン化が進んだ場合であっても、各端子７間や回路基板３のコプラナリティに左右されることなく確実に固着部１３とランド１４とを半田付けすることができる。尚、上記変形例においては、掛止部４ａを２カ所に設けているが、これに限らず、内部ケース４の四隅に設けてもよい。
【００５８】
次に、第１の実施形態における他の変形例について図１０を参照して説明する。本変形例は、図１０に示すように、接続部１１の第１側辺１１ａが保持部１２から上方に湾曲すると共に収納凹部９の後方（図１０において右斜め上）に向けて延設され、その後下方に向けて略Ｕ字状に折返されて延長部１１ｂが形成され、さらに第２側辺１１ｃが収納凹部９の前方に向けて上方に湾曲しながら曲折され、接続部１１の先端部が内部ケース４に設けられた挿入穴４ｂに挿入されている。また、本変形例においては、内部ケース４の収納凹部９は、端子７の形状に合わせて２カ所に切り欠き部４ｃが設けられ、その切り欠き部４ｃの底面が支持部９ｂとなっている。
【００５９】
本変形例においては、接続部１１の全体が円弧状に曲折されているため、応力の集中が生じにくくなっている。また、収納凹部９に設けられた切り欠き部４ｃ及び支持部９ｂによって端子７の接続部１１が保持されているため、ＣＰＵ２のピン２ｃと接続部１１との接続を確実なものとすることができる。また、接続部１１がピン２ｃにより下方に押し下げられた場合であっても、延長部１１ｂは前方に突出するように折り曲げられ、その下方部分が支持部９ｂに当接するので、接続部１１は支持部９ｂにより保持される。
【００６０】
また、他の変形例として、図１０に示す内部ケース４と図１１に示す端子７とを組み合わせてもよい。図１１に示す端子７は、接続部１１の第１側辺１１ａが一旦収納凹部９の後方（図１１において右斜め上）に向けて延設され、その後大きく収納凹部９の前方に向けて折返されて延長部１１ｂが形成され、さらに第２側辺１１ｃが収納凹部９の後方に向けて再度折返されると共に、端子７の先端部が内部ケース４の挿入穴４ｂに挿入されるようになっている。端子７の接続部１１をこのような形状とすることにより、ＣＰＵ２のピン２ｃと端子７の接続部１１との接触箇所を３カ所又は４カ所とすることができる。これにより、ＣＰＵ２のピンと接続部１１との接続をより確実なものとすることができる。
【００６１】
また、第１の実施形態の他の変形例としては、端子７の接続部１１を、図１２に示すように、第１側辺１１ａと延長部１１ｂと第２側辺１１ｃとを螺旋状のものとしてもよい。この場合、端子７の先端部は、収納凹部９の後方部分（図１２において右斜め上）に設けられた挿入穴４ｂに挿入される。このように、接続部１１を螺旋状とすることにより、接続部１１の長さを短くすることができるので、端子７の材料コストの低減を図ることができる。
【００６２】
次に、本発明の第２の実施形態のコネクタについて、図１３乃至１５を参照して説明する。ここで、図１３ａ及びｂは外部ケース５が後方位置にあるときにＣＰＵ２のピン２ｃが外部ケース５の挿通孔１０に挿入された状態を示す。また、図１３ｃ及びｄは外部ケース５が前方位置にあるときのＣＰＵ２のピン２ｃと端子７の接続部１１との関係を示す。
【００６３】
第２の実施形態における端子７は、表面に金メッキが施された直径０．２ｍｍのベリリウム銅線を曲げ加工することにより形成されている。第２の実施形態における保持部１２は、図１３ａに示すように収納凹部９の後方部分（図１３ａでは上方）に設けられている。また、接続部１１は第１側辺１１ａが保持部１２から前方に向けて狭まるように延設され、第２側辺１１ｃが収納凹部９の前方から後方に向けて広がるように延設されている。また、第１側辺１１ａと第２側辺１１ｃとは、収納凹部９の前方においてピン２ｃの軌道を跨ぐ連結辺１１ｄにより一連に形成されている。また、第２の実施形態においては、第１側辺１１ａと第２側辺１１ｃと連結辺１１ｄとにそれぞれ内方に突出する凸部１１ｅが設けられている。
【００６４】
また、収納凹部９には、接続部１１の裏面側に突出する支持部９ｂが設けられている。この支持部９ｂにより、ＣＰＵ２のピン２ｃが外部ケース５の挿通孔１０に挿入された際に接続部１１に当接した場合であっても、接続部１１が支持部９ｂにより支持されているため接続部１１がピン２ｃによって屈曲されるおそれがない。
【００６５】
第２の実施形態のコネクタにおいては、外部ケース５が操作レバー６により後方に移動された状態でＣＰＵ２のピン２ｃが外部ケース５の挿通孔１０に挿通されたときは、図１３ａ及びｂに示すように収納凹部９の後方部分にピン２ｃが挿入される。この状態では、ピン２ｃと接続部１１とは接触しない。次に、外部ケース５が操作レバー６により前方に移動されたときは、図１３ｃ及びｄに示すように、ピン２ｃが収納凹部９の前方に移動される。このとき、ピン２ｃは第１側辺１１ａ、第２側辺１１ｃ及び連結辺１１ｄにそれぞれ設けられた凸部１１ｅに当接するため、ピン２ｃは接続部１１に３点で接触する。これにより、ピン２ｃと端子７とが確実に電気的に接続される。
【００６６】
次に、第２の実施形態のコネクタを製造する工程について図１４を参照して説明する。まず、端子７の原材料となる金メッキがなされたベリリウム銅線７ａを図１４ａ及びｂに示すように端子７として必要な長さに切りそろえ、直線状の端子７とする。次に、図１４ｃに示すように射出成形用の金型２２内に切断された端子７を配列させる。この状態で金型２２内に合成樹脂を射出して硬化させる。これにより、図１４ｄに示すように直線状の端子７がインサート成形された内部ケース４を形成する。
【００６７】
次に、金型２２より取り出された端子７と内部ケース４との結合体を所定位置で保持し、曲げ加工用の治具（図示せず、以下に同じ。）によって端子７の曲げ加工を行う。具体的には、図１５ａ乃至ｄに示すように、治具によって徐々に端子７を曲げていき、接続部１１の形状を形成する。第１の実施形態においては、この端子７の曲げ加工を内部ケース４に配列されている列毎に行い、所定の列の加工が終了すると治具を次の列に移させて曲げ加工を行っている。次に、固着部１３も同様に１列ずつ治具により側面視で略Ｌ字状に加工を行う。このように端子７が所定の形状に加工された後、内部ケース４と外部ケース５と操作レバー６とを組み合わせてコネクタを完成させる。
【００６８】
第２の実施形態のコネクタにおいては、端子７と内部ケース４とをインサート成形した後に端子７の加工を行っている。このため、内部ケース４にひずみが生じている場合であっても、そのひずみに関係なく端子７の加工時に固着部１３の高さを揃えることができ、端子７のコプラナリティを向上させることができる。
【００６９】
次に、第２の実施形態におけるコネクタの変形例について図１６を参照して説明する。端子７の接続部１１の形状としては、図１６ａ乃至ｅに示すような形状とすることができる。まず、図１６ａにおいては、保持部１２が収納凹部９の前方（図１６ａにおいて下方）に位置しており、接続部１１はその前方位置から後方に向かって略８の字状に曲げ加工されている。そして、図１６ａにおける上方部分がピン２ｃと接触部１１とが接触しない後方位置となり、下方部分がピン２ｃと接触部１１とが接触する前方位置となっている。尚、本変形例においては収納凹部９に支持部９ｂは設けられていない。
【００７０】
次に、図１６ｂにおいては、収納凹部９の形状が上記実施形態と異なっており、接続部１１の後方部分が収納される部分の幅が広く、接続部１１の前方部分が収納される部分の幅が狭くなるように形成されている。また、本変形例においては、保持部１２が収納凹部９の後方（図１６ｂにおいて上方）に位置しており、接続部１１はその後方位置から前方に向かって略８の字状に曲げ加工されている。また、後方部分における接続部１１の裏面には支持部９ｂが形成されている。
【００７１】
次に、図１６ｃにおいては、収納凹部９は接続部１１の後方部分が収納される部分の幅が広く、前方部分が収納される部分の幅が狭くなるように形成され、支持部９ｂが設けられている。本変形例においては、保持部１２が収納凹部９の後方（図１６ｃにおいて上方）に位置しており、接続部１１はその後方位置から前方に向けて斜めに延設されると共に斜め後方に折返されて略Ｖ字状に形成されている。また、接続部１１の先端部は収納凹部９から外部に突出している。本変形例においては、ＣＰＵ２のピン２ｃが後方位置であるときは、接続部１１の先端部は図１６ｃにおいて若干上方に位置しており、ＣＰＵ２のピン２ｃが前方位置に移動されてピン２ｃに当接したときは、接続部１１はピン２ｃによって図１６ｃにおいて下方に付勢され、ピン２ｃが２点で接触部１１と当接する。また、このときピン２ｃが収納凹部９の内壁部に当接するようにしている。また、接続部１１の形状は、図１６ｄのようにしてもよく、図１６ｅのようにしてもよい。
【００７２】
次に、第２の実施形態における他の変形例について図１７を参照して説明する。本変形例は、図１７に示すように、隣接する接続部１１の高さ位置を交互に変更させ、隣接する接続部１１間の距離を離すようにしている。この接続部１１の形状は、図１３ａに示すものと同様である。接続部１１は、ＣＰＵ２のピン２ｃを挟持して接続を行うものであり、内部ケース４の幅方向に広がるように形成しなければならないため、隣接する接続部１１との距離が短くなる（図２参照）。本発明における接続部１１は、線材で形成されているため従来の板材によるものと異なり接続部１１間の静電容量は小さいが、本変形例においては、さらに図１７に示すように互いの高さ位置を交互に異ならせるようにすることにより、各接続部１１間の距離を大きく取ることができるため、各接続部１１同士の静電容量を小さくすることができる。
【００７３】
このように、第２の実施形態においては、端子７の接続部１１の形状を種々変更することができるが、このような接続部１１の形状の変更は、端子７の曲げ加工の仕方により変更することができる。従って、端子７の形状の変更に伴って金型の変更をする必要がないため、容易に端子７の形状の変更を行うことができる。
【００７４】
尚、上記第２の実施形態において、支持部９ｂを有するものと有しないものとについて説明したが、支持部９ｂを有するものについて支持部９ｂを設けないようにすることも可能であり、支持部９ｂを有していないものについて支持部９ｂを設けてもよい。また、上記第２の実施形態では、端子７を内部ケース４にインサート成形する場合について説明したが、これに限らず、内部ケース４に予め保持孔８を設け（図３参照）、当該保持孔８に直線の状態の固着部１３及び保持部１２を圧入してもよい。
【００７５】
次に、本発明の第３の実施形態の集積回路用コネクタ及び集積回路装着用組立体について図１８及び図１９を参照して説明する。尚、図１８においては左斜め下が内部ケース４の後方となっている。
【００７６】
第３の実施形態の集積回路用コネクタは、図１８に示すように、端子７の径が内部ケース４に設けられている保持孔８よりも小径となっている。そして、図１９ｆに示すように、端子７を内部ケース４に装着する際に固着部１３を折り曲げて接続部１１と固着部１３とにより内部ケース４を挟持し、端子７を内部ケース４に保持している。
【００７７】
また、内部ケース４の前方部分（図１８において右斜め上）には、接続部１１の延長部１１ｂを収納する第２収納凹部９ｃが設けられている。この第２収納凹部９ｃの幅は、延長部１１ｂの幅よりも狭くなっており、図１９ａに示すように接続部１１のみが形成された端子７を内部ケース４に装着する際に延長部１１ｂが幅方向に押し縮められる。これにより、延長部１１ｂがその弾性によって第２収納凹部９ｃに押し付けられて端子７が内部ケース４に保持されている。その他の構成は、図８に示す第１の変形例と同様であるので、同一の構成については同一の符号を付して詳細な説明は省略する。
【００７８】
次に、第３の実施形態のコネクタの製造方法について図１９を参照して説明する。まず、直線状の線材を曲げ加工して接続部１１を形成する。このとき、図１９ａに示すように保持部１２と固着部１３とは直線の状態となっている。この状態で内部ケース４に設けられた保持孔８に固着部１３及び保持部１２を挿入する。このとき、保持孔８は保持部１２よりも大径に形成されているので、固着部１３及び保持部１２とを容易に保持孔８に挿入することができる。
【００７９】
そして、図１９ｂに示すように、接続部１１の延長部１１ｂを第２収納凹部９ｃにはめ込んで端子７を内部ケース４に装着する。また、平面視でＬ字状の貫通孔２３ａを備えた金型２３を下方から上昇させ、貫通孔２３ａの狭い箇所（図１９ｂにおいて上方部分）に挿入する。この状態から、図１９ｃに示すようにプレス２４によって固着部１３の先端部をＬ字状に折り曲げる。そして、金型２３を幅方向にずらしてＬ字状に折り曲げた固着部１３の先端を金型２３の貫通孔２３ａの広い部分（図１９ｄにおいて下方部分）に移動させ、金型２３を下降させる。
【００８０】
次に、図１９ｅに示すようにプレス２５を固着部１３の前後に配置し、図１９ｆに示すようにプレス２５により固着部１３を折り曲げる。このとき、接続部１１と固着部１３とにより内部ケース４を厚さ方向に挟持するように折り曲げ、端子７を内部ケース４に位置決め固定する。その後は、内部ケース４に外部ケース５及び操作レバー６を組み付け、回路基板３にリフロー半田付けすることによりコネクタと回路基板との組立体を形成する。
【００８１】
このように、第３の実施形態のコネクタによれば、端子７の保持部１２の径が内部ケース４の保持孔８の径よりも小径となっているため、端子７を内部ケース４に装着する工程が容易となる。また、端子７は接続部１１と固着部１３とにより内部ケース４に挟持されているので、端子７が内部ケース４に位置決め固定されるため、固着部１３の先端部におけるコプラナリティを確保することができる。
【００８２】
次に、第１乃至第３の実施形態における固着部１３の変形例について図２０を参照して説明する。図２０ａ及びｂにおいて、１５は回路基板３の表面に設けられたレジスト膜、１４はランド、１４ａは露出部であり、それぞれ端子７の固着部１３がランド１４の露出部１４ａに載置された状態を示す。
【００８３】
まず、図２０ａに示す変形例は、固着部１３をランド１４の幅方向に屈曲させた屈曲部１３ａを設けている。次に、図２０ｂに示す変形例は、固着部１３を略円状に屈曲させた屈曲部１３ａを設けている。このように、固着部１３に屈曲部１３ａを設けることにより、固着部１３とランド１４との接触面積を大きく取ることができるため、固着部１３とランド１４との半田付けをより確実に行うことができる。
【００８４】
また、図２０ａ及びｂに示すように、固着部１３はランド１４の露出部１４ａよりも小さく形成されているため、固着部１３とランド１４との間にレジスト膜１５が介在しない。このため、固着部１３とランド１４とを容易かつ確実に半田付けすることができる。
【図面の簡単な説明】
【図１】第１の実施形態のコネクタを示す説明図。
【図２】図１のＩＩ−ＩＩ部分の一部破断拡大図。
【図３】端子の接続部とＣＰＵのピンとの関係を示す説明図。
【図４】端子を折り曲げ加工する際の工程を示す説明図。
【図５】内部ケースに装着された端子を曲げ加工する際の工程を示す説明図。
【図６】回路基板にコネクタを表面実装する際の工程を示す説明図。
【図７】第１の実施形態の変形例を示す説明図。
【図８】第１の実施形態の変形例における端子を示す説明図。
【図９】図８のＩＸ−ＩＸ線断面図。
【図１０】第１の実施形態の他の変形例を示す説明図。
【図１１】第１の実施形態の他の変形例を示す説明図。
【図１２】第１の実施形態の他の変形例を示す説明図。
【図１３】第２の実施形態のコネクタの端子とＣＰＵのピンとの関係を示す説明図。
【図１４】第２の実施形態における端子を内部ケースにインサート成形する工程を示す説明図。
【図１５】第２の実施形態の端子の接続部を形成する工程を示す説明図。
【図１６】端子の接続部の変形例を示す説明図。
【図１７】第２の実施形態の変形例を示す説明図。
【図１８】第３の実施形態のコネクタを示す説明図。
【図１９】第３の実施形態のコネクタの製造工程を示す説明図。
【図２０】端子の固着部の変形例を示す説明図。
【符号の説明】
１…集積回路用コネクタ、２…ＣＰＵ（集積回路）、２ｂ…端子部、２ｃ…ピン、３…回路基板、４…内部ケース、５…外部ケース、６…操作レバー（摺動手段）、７…端子、１１…接続部、１２…保持部、１３…固着部。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a connector for an integrated circuit such as a CPU socket and an assembly of the connector and a circuit board.
[0002]
[Prior art]
As a connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion on a circuit board, a connector disclosed in Patent Document 1 below is known. Such a conventional connector includes an insulating inner case fixed to a circuit board, an outer case engaged with the inner case, the surface of which is slidable in the front-rear direction, and the outer case slid in the front-rear direction. And an operation lever. Further, terminals provided according to the pins of the CPU are built in the inner case. These terminals are formed by cutting a metal plate into a predetermined shape with a press die and then bending the metal plate into a predetermined shape as shown in FIG.
[0003]
In recent years, as the performance of CPUs has become higher, the number of pins has increased, and the pitch of each pin has tended to be narrower. As described above, when the pitch of the pins is reduced, the distance between the terminals is correspondingly reduced. In such a situation, in a conventional terminal processed from a metal plate, since the surface area of the terminal itself is large, the capacitance between the terminals becomes large, and crosstalk between terminals, a phase shift of a signal, or a signal There is a possibility that the waveform may be sagged and the rising of the signal may become slow.
[0004]
Further, in the conventional connector, the terminal is cut out of the metal plate by a press die into a predetermined shape, so that a portion that does not become a terminal is wasted. Further, when the terminal is cut from the metal plate, a plurality of terminals are connected and cut by a carrier. After the terminal is mounted on the inner case, the carrier is cut off from the terminal and discarded. As described above, in the conventional connector, when a terminal is cut from a metal plate, there are many portions that cannot be used as a terminal, which is disadvantageous in terms of cost.
[0005]
Further, conventional terminals are plated by gold plating or the like in a state where they are connected by a carrier, but since each terminal has to be put in a plating tank with a predetermined interval provided by the carrier, a unit time is required. The number of terminals that can be processed per contact is reduced, and the plating process as a whole requires much time.
[0006]
On the other hand, among connectors, a so-called ball grid array (BGA) type connector as disclosed in, for example, Japanese Patent Application Laid-Open Publication No. HEI 11-163556 has been known as a surface mountable circuit board. In the BGA type connector, a spherical solder (solder ball) attached to a terminal of the connector is brought into contact with a land portion of a circuit board, and the terminal is connected to the land portion by heating and melting the solder ball.
[0007]
In such a BGA connector, if the solder ball is not in contact with the land portion of the circuit board, the terminal and the land portion may not be connected when heated and melted. Therefore, in a connector having a large number of terminals, it is necessary to improve the flatness (coplanarity) indicating the degree of uniformity of the tips of the solder balls. However, it has become difficult to improve the coplanarity of the connector due to the increase in the number of pins accompanying the recent improvement in the performance of CPUs.
[0008]
[Patent Document 1]
JP-A-10-12342 (page 6, FIG. 9)
[Patent Document 2]
JP-A-10-162909 (front page)
[0009]
[Problems to be solved by the invention]
The present invention has an object of improving a connector and an assembly of the connector and a circuit board, and more specifically, inputs and outputs even when a pitch between terminals is narrowed due to an increase in performance of an integrated circuit. An object of the present invention is to provide an assembly with a connector and a circuit board which can improve a signal. Another object of the present invention is to provide an assembly with a connector and a circuit board, which can eliminate waste at the time of manufacturing terminals and can further improve coplanarity of each terminal.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the integrated circuit connectors according to the first to third aspects of the present invention have the following common configuration. First, there is provided a connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion on a circuit board, the inner case being fixed to the circuit board, and the front and rear with respect to the inner case. It has an outer case slidably provided in the direction and sliding means for sliding the outer case. Further, the inner case is provided with terminals connected to the pins and soldered to lands provided on the circuit board, and the outer case has an insertion hole through which the pins are inserted. The case has a storage portion for storing the pin and a holding hole for holding the terminal, the terminal is formed by processing a wire material, and a holding portion held in the holding hole, A connection portion projecting to the front surface side of the inner case and housed in the housing portion; and a fixing portion projecting from the holding portion to the back surface side of the inner case and soldered to the land. Further, when the pin is inserted through the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, When the outer case is moved forward with the pin inserted through the insertion hole, the pin contacts the contact portion in front of the storage section.
[0011]
The terminal of the integrated circuit connector according to the first aspect of the present invention is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and the holding portion is linear. After being press-fitted into the holding hole, a portion protruding to the back surface side of the inner case is bent substantially in parallel with the land to form the fixing portion.
[0012]
Further, after the terminal of the integrated circuit connector according to the second aspect of the present invention is insert-molded or press-fitted into the holding hole so that the terminal protrudes from the front and back of the inner case in a straight line state, A portion protruding to the front side of the inner case is bent so as to contact the pin in front of the storage portion to form the connection portion, and a portion protruding to the back side of the inner case is bent substantially parallel to the land. In this case, the fixing portion is formed. At this time, either the connection part or the fixing part may be formed first, or may be formed simultaneously.
[0013]
The terminal of the integrated circuit connector according to the third aspect of the present invention is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and the holding portion is in a straight line. After being loosely fitted in the holding hole, a portion projecting to the back side of the inner case is bent substantially in parallel with the land to form the fixing portion, and the inner case is formed by the contact portion and the fixing portion. Characterized by being sandwiched.
[0014]
In the integrated circuit connector according to the first to third aspects of the present invention, since the terminal is formed of a wire, the diameter of the wire is substantially the same as the thickness of a terminal using a conventional metal plate. In such a case, when mounted on the inner case, the capacitance between the terminals becomes smaller than that of a terminal using a conventional metal plate. Therefore, a signal input and output through each terminal can be made favorable, which is suitable for an integrated circuit having a high clock frequency.
[0015]
Further, since the terminal is formed of a wire, the material of each terminal can be secured only by cutting a long wire as a material to a predetermined length, so that the material is used as when a metal plate is processed. There is no waste. Further, in the case of performing plating on a wire used as a material of the terminal, plating can be performed in a wire state instead of a state of being connected to a carrier as in the related art. Plating can be performed. Also, by using a pre-plated wire, there is no need to provide a plating step in processing the terminal.
[0016]
Further, since the fixing portion is bent into a predetermined shape after being attached to the inner case, even if the inner case is distorted, the distortion is absorbed when the terminal is bent. The height of the terminals protruding from the inner case can be made uniform. Therefore, in the present invention, the coplanarity of each terminal can be easily improved.
[0017]
Further, in the integrated circuit connector according to the first and second aspects, when the holding portion of the terminal is provided with a rough surface portion which is engaged with the holding hole when held in the holding hole, The connection state between the terminal and the inner case becomes strong, so that it is possible to prevent inconvenience such as inadvertent movement of the terminal when reflow soldering the integrated circuit connector to the circuit board.
[0018]
Further, in the integrated circuit connector of the present invention, the connection portion of the terminal projects upward from the holding portion of the terminal at a front position in the storage portion of the inner case and is bent in the horizontal direction and extends rearward. A first side edge, an extension portion bent downward in a substantially U-shape from a tip of the first side edge located at a rear position of the storage portion, and a front portion bent horizontally from the tip of the extension portion and forward. The first side and the second side are narrower than the outer diameter of the pin at a front portion of the storage portion, and the first side and the second side are narrower than an outer diameter of the pin. It is preferable that the rear portion of the portion is formed wider than the outer diameter of the pin.
[0019]
By bending the connection part of the terminal into the above shape, when the pin is moved forward of the storage part of the inner case by the outer case, the pin is formed by the first side and the second side. Is pinched. Thus, the pin and the connection portion come into contact at two points, so that the pin and the connection portion are securely connected. When the pin is in contact with the contact portion, the first side and the second side are widened, but the connection portion is provided with a substantially U-shaped extension. Therefore, the elastic limit of the connecting portion is improved, and the load on the connecting portion when the pin is connected to the connecting portion is reduced.
[0020]
Further, in the integrated circuit connector according to the present invention, it is preferable that the inner case includes a support portion projecting into the storage portion and supporting a connection portion of the terminal from below. Since the connecting part of the terminal is supported from below by the support part, buckling of the connecting part is prevented even when the connecting part is pushed down from above by the pin.
[0021]
Further, in the integrated circuit connector according to the present invention, it is preferable that the connection portions of the terminals are arranged so that the height positions of the horizontally bent portions of the adjacent terminals are shifted. When the terminals are mounted on the inner case, the connection portions of the terminals are arranged on the same plane, so that the connection portions come close to each other. Therefore, the capacitance between the terminals can be reduced by shifting the height position of the connection portions of the adjacent terminals to widen the interval between the adjacent connection portions.
[0022]
Further, in the integrated circuit connector of the present invention, the inner case has a hook portion which is hooked to the circuit board when the inner case is mounted at a predetermined position on the circuit board, and the fixing portion of the terminal is It is preferable that the inner case protrudes beyond a gap between the back surface of the inner case and the circuit board so as to be urged by the land when the inner case is hooked on the circuit board. By urging the fixed portion of the terminal to the land by the elasticity of the terminal, it is possible to reliably contact the land without being influenced by the coplanarity of the fixed portion. Can be done.
[0023]
Further, when a bent portion which is bent in the width direction of the land in a plan view is provided in the fixed portion of the terminal, the contact area between the fixed portion and the land can be increased, so that the connection of both by soldering Is good.
[0024]
The assembly of the connector and the circuit board according to the first to third aspects of the present invention is a connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion to a circuit board. And a circuit board, which have the following common configuration. First, the connector has an inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding unit for sliding the outer case, The inner case has terminals connected to the pins and soldered to lands provided on the circuit board. The circuit board includes a resist film having an exposed portion that covers a surface and exposes a part of the land, and the exposed portion is filled with cream solder. The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion for storing the pin and a holding hole for holding the terminal. Further, the terminal is formed by processing a wire material, and a holding portion held in the holding hole, a connecting portion projecting from the holding portion to the surface side of the inner case and housed in the housing portion, A fixing portion protruding from the portion to the rear surface side of the inner case and soldering to the land.
[0025]
Then, the assembly of the connector and the circuit board of the first aspect is bent in advance so that the contact portion of the terminal contacts the pin in front of the storage portion of the inner case, and the holding portion is in a linear state. The exposed portion which is press-fitted into the holding hole, is accommodated in the exposed portion in a state where the fixing portion protrudes from the back surface of the inner case, is bent so as to be substantially parallel to the land, and is filled with cream solder. The fixing portion is housed in the fixing portion, and the fixing portion and the land are connected by reflow soldering.
[0026]
The assembly of the connector and the circuit board according to the second aspect is bent in advance so that the contact portion of the terminal contacts the pin in front of the storage portion of the inner case, and the holding portion is linear. After being loosely fitted in the holding hole, the portion protruding to the back side of the inner case is bent substantially in parallel with the land to form the fixed portion, and the inner case is formed by the contact portion and the fixed portion. The fixed portion is housed in the exposed portion which is sandwiched and filled with cream solder, and the fixed portion and the land are connected by reflow soldering. At this time, either the connection part or the fixing part may be formed first, or may be formed simultaneously.
[0027]
Further, in the assembly of the connector and the circuit board according to the third aspect, the terminal is formed of a wire having a smaller diameter than the holding hole, and a contact portion of the terminal contacts the pin in front of a storage portion of the inner case. The holding portion is loosely fitted in the holding hole in a linear state, and the fixing portion is bent so as to be substantially parallel to the land while protruding from the back surface of the inner case. The contact portion and the fixing portion sandwich the inner case, the fixing portion is housed in the exposed portion filled with cream solder, and the fixing portion and the land are connected by reflow soldering. It is characterized by the following.
[0028]
According to the assembly of the connector and the circuit board according to the first to third aspects of the present invention, the fixed portion of the terminal is accommodated in an exposed portion formed on a resist film provided on the surface of the circuit board. Therefore, the resist film does not intervene between the fixing portion and the land. Therefore, since the fixed portion can be directly brought into contact with the land, the fixed portion and the land can be securely soldered.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an example of an embodiment of the connector of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory view showing a connector according to a first embodiment, FIG. 2 is an enlarged view showing a partly cutaway part II-II of FIG. 1, FIG. FIG. 4 is an explanatory view showing a process for bending a terminal, FIG. 5 is an explanatory view showing a process for bending a terminal mounted on an inner case, and FIG. 6 is a diagram showing a case where a connector is surface-mounted on a circuit board. 7, FIG. 7 is an explanatory view showing a modification of the first embodiment, FIG. 8 is an explanatory view showing terminals in a modification of the first embodiment, and FIG. 9 is IX-IX of FIG. 10 to 12 are explanatory views showing another modified example of the first embodiment.
[0030]
FIG. 13 is an explanatory view showing the relationship between the terminal of the connector and the pin of the CPU according to the second embodiment. FIG. 14 is an explanatory view showing the step of insert-molding the terminal in the inner case according to the second embodiment. FIG. 16 is an explanatory diagram showing a step of forming a terminal connecting portion of the second embodiment, FIG. 16 is an explanatory diagram showing a modification of the terminal connecting portion, and FIG. 17 is an explanatory diagram showing a modification of the second embodiment. FIG. 18 is an explanatory view showing the connector of the third embodiment, FIG. 19 is an explanatory view showing a manufacturing process of the connector of the third embodiment, and FIG. 20 is an explanatory view showing a modification of the terminal fixing portion. .
[0031]
First, a connector of the first embodiment and an assembly of the connector and the circuit board will be described. As shown in FIG. 1, the connector 1 of the first embodiment includes a CPU 2 having a circuit portion 2a, a rectangular plate-shaped terminal portion 2b, and a pin 2c projecting below the terminal portion 2b. This is a CPU socket that is removably mounted on the CPU socket. The connector 1 has an inner case 4 and an outer case 5 each formed of an insulator, and is insert-molded and fixed to the inner case 4 to be connected to the pin 2c of the CPU 2 and to a land 14 of a circuit board (see FIG. 3). And an operating lever 6 for sliding the outer case 5 in the front-rear direction with respect to the inner case 4.
[0032]
The inner case 4 is made of a synthetic resin, and has a plurality of terminals 7 mounted in a lattice as shown in FIG. As shown in FIG. 3A, a holding hole 8 into which a holding portion 12 of a terminal 7 described later is press-fitted, and a storage recess 9 in which a connection portion 11 of the terminal 7 described later and a pin 2c of the CPU 2 are stored. . The housing recess 9 is provided with a positioning protrusion 9 a for positioning the terminal 7.
[0033]
The outer case 5 is made of synthetic resin, is slidably attached to the inner case 4 in the front-rear direction (vertical direction in FIG. 2), and has an insertion hole 10 into which the pin 2c of the CPU 2 is inserted. . The outer case 5 is slid in the front-rear direction with respect to the inner case 4 by the rotation of the operation lever 6. When the operating lever 6 is raised as shown in FIG. 1, the outer case 5 is moved rearward (upward in FIG. 2). When the operating lever 6 is rotated forward, the outer case 5 is moved forward (downward in FIG. 2).
[0034]
Next, the terminal 7 of the connector 1 according to the first embodiment will be described with reference to FIG. 3a is a partially enlarged plan view of the inner case 4 and the terminal 7, FIG. 3b is a sectional view taken along line bb of FIG. 3a, and FIG. 3c is a sectional view taken along line cc of FIG. 3a. 3A shows the state of the storage recess 9 excluding the terminal 7, the upper right part shows the state where the terminal is mounted in the storage recess 9, and the lower left part shows the state where the outer case 5 is at the rear position. The lower right part shows the pin when the external case 5 is moved to the front position by the operation lever 6 when the pin 2c of the CPU 2 is inserted into the insertion hole 10 of the external case 5. 2 shows the relationship between 2c and the terminal 7.
[0035]
The terminal 7 is formed by bending a beryllium copper wire having a diameter of 0.1 mm and having a gold plated surface. As shown in FIGS. 3B and 3C, the terminal 7 has a connecting portion 11 connected to the pin 2c of the CPU 2, a holding portion 12 held in the holding hole 8 of the inner case 4, and a surface of the circuit board 3 described later. And a fixing portion 13 to be soldered to the land 14 provided.
[0036]
The holding portion 12 is pressed and held in a holding hole 8 provided in the inner case 4 as described later. Further, the surface of the holding portion 12 is a rough surface portion 12a having an uneven surface provided by a press 16a described later.
[0037]
As shown in FIGS. 3A to 3C, the connecting portion 11 projects upward from the holding portion 12 located in front of the storage recess 9 (downward in FIG. 3A) within the storage recess 9, and is bent in the horizontal direction from the front position. A first side edge 11a extending so as to extend diagonally rightward toward the rear, and a substantially U-shaped bend downward from a rear end of the first side edge 11a at a position rearward of the storage recess 9; And a second side 11c extending from the extension 11b so as to narrow diagonally rightward toward the front. As shown in FIGS. 3A and 3C, the extension portion 11b of the connection portion 11 is positioned in the storage recess 9 by the positioning protrusion 9a. In addition, a portion projecting upward from the holding portion 12 is curved to the right in FIG. 3B so as not to come into contact with the pin 2c.
[0038]
As shown in FIG. 3A, the distance between the first side 11a and the second side 11c is smaller than the diameter of the pin 2c in the front part, and the distance between the pins 2c in the rear part. Is wider than the diameter. Accordingly, when the pin 2c is inserted into the rear part of the storage recess 9, as shown in the lower left diagram of FIG. 3A, the pin 2c does not contact the first side 11a and the second side 11c. In addition, as shown in FIG. 3C, since the tip of the pin 2c is shallower than the storage recess 9, the pin 2c does not contact the extension 11b.
[0039]
When the pin 2c is moved to the front portion of the storage recess 9 from this state, the pin 2c is sandwiched between the first side 11a and the second side 11c. Thereby, the pin 2c and the connection portion 11 are electrically connected.
[0040]
As shown in FIGS. 3B, 3C and 6A, the circuit board 3 is provided with a land 14 and an insulating resist film 15 on the surface of a synthetic resin substrate. The resist film 15 covers the surface of the circuit board 3 except for the exposed portions 14a where the lands 14 are exposed on the surface. The exposed portion 14a is formed to be slightly wider than the fixing portion 13 of the terminal 7. 3B and 3C, a part of the positioning projection 9a is omitted to make the state of the terminal 7 easily visible.
[0041]
Next, a process of manufacturing the connector 1 according to the first embodiment will be described with reference to FIGS. First, a beryllium copper wire 7a, which has been subjected to gold plating in advance, is used as a raw material of the terminal 7. Then, after the terminal 7 is cut to a required length, it is bent into a shape as shown in FIG. 4B by the press 16a. At this time, a portion to be the holding portion 12 is provided with irregularities by a press 16a to form a rough surface portion 12a.
[0042]
Next, as shown in FIG. 4B, bending is performed by a press 16b into a shape as shown in FIG. 4C. In this state, the fixing portion 13 and the holding portion 12 are linear, and the connecting portion 11 is also linear in side view. Next, as shown in FIG. 4D, the connecting portion 11 is bent by a press 16c so as to be at right angles to the fixing portion 13 and the holding portion 12, and further, as shown in FIG. 4E, the extending portion 11b is bent downward at right angles. Through the above steps, the connection portion 11 is formed in a predetermined shape, and the terminal 7 in which the fixing portion 13 and the holding portion 12 are linear is formed.
[0043]
Next, as shown in FIG. 5A, the fixing portion 13 and the holding portion 12 of the terminal 7 are pressed into the holding hole 8 of the inner case 4. At this time, since the upper portion of the holding hole 8 is formed in a tapered shape, the tip of the fixing portion 13 is smoothly introduced (see FIGS. 3B and 3C). Next, as shown in FIG. 5B, the fixing portion 13 of the terminal 7 is bent by the press 17. Thereby, as shown in FIG. 5C, the fixing portion 13 is formed so as to be substantially parallel to the circuit board 3. After the terminal 7 is processed into a predetermined shape in this way, the connector 1 is completed by combining the inner case 4, the outer case 5, and the operation lever 6.
[0044]
Next, a process of reflow soldering the connector 1 to the circuit board 3 will be described with reference to FIG. First, cream solder 19 is applied to the surface of the circuit board 3 shown in FIG. At this time, as shown in FIG. 6B, the cream solder 19 is applied only to the exposed portions 14a of the lands 14 by the mask plate 20. Next, the mask plate 20 is separated from the circuit board 3 as shown in FIG. Then, the connector 1 is placed at a predetermined position on the circuit board 3 as shown in FIG. 6D.
[0045]
The resist film 15 provided on the surface of the circuit board 3 is provided with an exposed portion 14a which is opened so as to be wider than the fixing portion 13 of the terminal 7, and the fixing portion 13 of the terminal 7 has the exposed portion 14a. To be placed inside. At this time, the fixing portion 13 of the terminal 7 and the land 14 are connected by the cream solder 19 filled in the exposed portion 14a. In this state, the circuit board 3 on which the connector 1 is mounted is heated by a reflow furnace (not shown) to melt the cream solder 19 and reflow solder the connector 1 and the circuit board 3.
[0046]
As described above, in the connector 1 of the first embodiment, since the holding portions 12 of the terminals 7 are formed of a beryllium copper wire having a diameter of 0.1 mm, the distance between the holding portions 12 can be increased. It becomes. Therefore, the capacitance between the terminals 7 can be reduced, so that the crosstalk and the phase shift of the signals input and output at the terminals 7 or the sagging of the waveform can be reduced, and the rise of the signal can be reduced. Can be made steep. Thereby, the connector 1 of the first embodiment is suitable for the CPU 2 having a high clock frequency.
[0047]
In the connector 1 according to the first embodiment, the terminal 7 is not formed by cutting and bending a metal plate as in the conventional case but by bending a thin wire. Can be reduced in area. Therefore, the pitch between the terminals 7 can be narrowed, so that the pitch of the pins 2c of the CPU 2 can be narrowed in the future. Further, since the terminals 7 are formed of a wire, it is not necessary to connect the terminals 7 to the carrier as in the prior art when plating, so that a large number of terminals can be plated in a short time. Further, in the first embodiment, since a wire that has been plated in advance for the terminal 7 is used, there is no need to provide a plating step when processing the terminal 7.
[0048]
In the connector 1 according to the first embodiment, the terminal 7 is processed after the terminal 7 is press-fitted into the inner case 4. For this reason, even when the internal case 4 is distorted, the heights of the fixing portions 13 can be made uniform during the processing of the terminal 7 irrespective of the distortion. Thereby, the flatness (coplanarity) of the fixing portion 13 of each terminal 7 can be improved, so that the fixing portion 13 and the land 14 of the circuit board 3 can be securely soldered.
[0049]
Further, in the conventional connector, since the terminals are formed by stamping a metal plate, a portion of the metal plate other than the terminals is wasted, but in the connector 1 of the first embodiment, the terminals 7 are not used. Since it is only necessary to cut the beryllium copper wire to a predetermined length, there is no waste of material, and the material cost can be reduced. Further, since the weight of the terminal can be reduced as compared with the conventional connector, the weight of the connector can be reduced.
[0050]
Further, since the connector can be reduced in weight, when the connector is once reflow-soldered to the front side of the circuit board and then the electronic components are also reflow-soldered to the back side of the circuit board, the circuit board is turned over and reflowed. In some cases, however, since the connector is lightweight, the problem of detachment from the circuit board hardly occurs.
[0051]
In the first embodiment, a beryllium copper wire having a diameter of 0.1 mm is used as a wire for forming the terminal 7, but the thickness and the material are not limited thereto, and other known materials may be used. May be used. In addition, since the holding portions 12 are wires, the spacing between the holding portions 12 is widened. Therefore, a conductive member surrounding the holding portions 12 is provided in the inner case 4 by insert molding or the like, and the conductive members are grounded. Thereby, it is also possible to shield each holding part 12.
[0052]
Next, a modified example of the connector according to the first embodiment will be described with reference to FIGS. As shown in FIG. 7, the connector 21 of the first modification is a CPU socket. The shape of the storage recess 9 and the shape of the terminal 7 are different from those of the first embodiment, and the connector 21 is provided on the back surface of the inner case 4. The difference is that a hook 4a that is hooked to the circuit board 3 is provided. The other points are the same as those in the first embodiment, and the same components are denoted by the same reference numerals as those described above, and detailed description will be omitted.
[0053]
As shown in FIG. 8, the terminal 7 in the first modification has the first side 11 a facing the rear of the storage recess 9 (obliquely rightward upward in FIG. 8) from the holding portion 12 held in the inner case 4. It has an extension 11b which is extended so as to spread out, and is bent downward in a substantially U-shape, and further the second side is narrowed from the extension 11b toward the front of the storage recess 9. The distal end of the connection portion 11 is inserted and held in an insertion hole 4 b provided in the inner case 4.
[0054]
The fixing portion 13 of the terminal 7 is bent obliquely downward from the back surface of the inner case 4 as shown in FIG. As shown in FIG. 9, the fixing portion 13 is bent so as to project below the surface of the circuit board 3 when the connector 21 is surface-mounted on the circuit board 3 (indicated by a dashed line in FIG. 9). I have.
[0055]
As shown in FIG. 8, the storage recess 9 of the inner case 4 has a U-shaped support portion 9b that supports the extension portion 11b from the back surface according to the shape of the extension portion 11b. The periphery of the insertion hole 4b into which the tip of the terminal 7 is inserted is tapered so that the tip of the terminal 7 can be easily inserted. A hook 4a protrudes downward from the rear surface of the inner case 4, as shown in FIG. When the semiconductor device is surface-mounted on the circuit board 3, the hook 4 a is inserted into a hook hole (not shown) provided in the circuit board 3, and the inner case 4 is hooked on the circuit board 3.
[0056]
Since the connector 21 of the first modified example has the above-described configuration, when the connector 21 is surface-mounted on the circuit board 3, the connector 21 is placed on the exposed portion 14a of the land 14 filled with the cream solder 19 (see FIG. 6C). ) The fixing portion 13 of the terminal 7 contacts. Since the fixing portion 13 is formed so as to protrude beyond the gap between the back surface of the inner case 4 and the circuit board 3, the fixing portion 13 and the land 14 are securely connected. When the inner case 4 is further pressed against the circuit board 3 from this state, the hooks 4 a provided on the inner case 4 are hooked into hook holes (not shown) of the circuit board 3. As a result, the fixing portion 13 of the terminal 7 is bent by the circuit board 3 and pressed against the land 14, so that the connection between the fixing portion 13 and the land 14 is further ensured. The fixed portion 13 and the land 14 can be reliably soldered by reflow soldering in a reflow furnace (not shown).
[0057]
As described above, in the connector 1 of the first modified example, since the fixing portion 13 of the terminal 7 protrudes beyond the gap between the back surface of the inner case 4 and the circuit board 3, the connector 1 is mounted on the circuit board 3. The fixed portion 13 is securely connected to the land 14 by the elasticity of the fixed portion 13. Therefore, even if the number of pins of the CPU 2 is increased, the fixing portion 13 and the land 14 can be securely soldered without being influenced by the coplanarity of the terminals 7 or the circuit board 3. In the above-described modification, the hooks 4 a are provided at two places. However, the present invention is not limited to this.
[0058]
Next, another modified example of the first embodiment will be described with reference to FIG. In this modification, as shown in FIG. 10, the first side 11a of the connecting portion 11 is curved upward from the holding portion 12 and extends toward the rear of the storage recess 9 (obliquely right upper in FIG. 10). Then, it is folded downward in a substantially U-shape to form an extended portion 11b, and the second side 11c is bent upward while bending upward toward the front of the storage recess 9, and the distal end of the connecting portion 11 is bent. Are inserted into insertion holes 4b provided in the inner case 4. Further, in the present modified example, the storage recess 9 of the inner case 4 is provided with two notches 4c in accordance with the shape of the terminal 7, and the bottom surface of the notch 4c is a support portion 9b. .
[0059]
In the present modification, the entire connection portion 11 is bent in an arc shape, so that stress concentration hardly occurs. Further, since the connection portion 11 of the terminal 7 is held by the cutout portion 4c and the support portion 9b provided in the storage recess 9, the connection between the pin 2c of the CPU 2 and the connection portion 11 can be ensured. it can. Even when the connecting portion 11 is pushed down by the pin 2c, the extending portion 11b is bent so as to protrude forward, and the lower portion thereof contacts the supporting portion 9b. It is held by the part 9b.
[0060]
As another modified example, the inner case 4 shown in FIG. 10 and the terminal 7 shown in FIG. 11 may be combined. In the terminal 7 shown in FIG. 11, the first side 11 a of the connection portion 11 is temporarily extended toward the rear of the storage recess 9 (obliquely to the upper right in FIG. 11), and then folded largely toward the front of the storage recess 9. As a result, the extension 11b is formed, and the second side 11c is folded back toward the rear of the storage recess 9 again, and the tip of the terminal 7 is inserted into the insertion hole 4b of the inner case 4. ing. By forming the connection portion 11 of the terminal 7 in such a shape, the contact portion between the pin 2c of the CPU 2 and the connection portion 11 of the terminal 7 can be three or four. Thereby, the connection between the pin of the CPU 2 and the connection portion 11 can be made more reliable.
[0061]
Further, as another modified example of the first embodiment, as shown in FIG. 12, the connection portion 11 of the terminal 7 is formed by connecting the first side 11a, the extension 11b, and the second side 11c to a spiral shape. It may be something. In this case, the tip of the terminal 7 is inserted into the insertion hole 4b provided in the rear part (the upper right in FIG. 12) of the storage recess 9. As described above, by making the connection portion 11 spiral, the length of the connection portion 11 can be shortened, so that the material cost of the terminal 7 can be reduced.
[0062]
Next, a connector according to a second embodiment of the present invention will be described with reference to FIGS. 13A and 13B show a state in which the pin 2c of the CPU 2 is inserted into the insertion hole 10 of the outer case 5 when the outer case 5 is at the rear position. FIGS. 13C and 13D show the relationship between the pin 2c of the CPU 2 and the connection portion 11 of the terminal 7 when the outer case 5 is at the front position.
[0063]
The terminal 7 in the second embodiment is formed by bending a beryllium copper wire having a diameter of 0.2 mm and having a gold plated surface. The holding portion 12 in the second embodiment is provided at a rear portion (upward in FIG. 13A) of the storage recess 9 as shown in FIG. 13A. The connecting portion 11 is extended so that the first side 11a narrows forward from the holding portion 12 and extends so that the second side 11c extends rearward from the front of the storage recess 9. I have. Further, the first side 11a and the second side 11c are formed in series by a connecting side 11d which straddles the track of the pin 2c in front of the storage recess 9. In the second embodiment, the first side 11a, the second side 11c, and the connection side 11d are provided with protrusions 11e that protrude inward.
[0064]
Further, the storage recess 9 is provided with a support portion 9 b protruding on the back surface side of the connection portion 11. The connecting portion 11 is supported by the supporting portion 9b by the supporting portion 9b even when the pin 2c of the CPU 2 comes into contact with the connecting portion 11 when the pin 2c is inserted into the insertion hole 10 of the outer case 5. There is no possibility that the connecting portion 11 is bent by the pin 2c.
[0065]
In the connector according to the second embodiment, when the pin 2c of the CPU 2 is inserted into the insertion hole 10 of the external case 5 in a state where the external case 5 is moved rearward by the operation lever 6, it is shown in FIGS. Pin 2c is inserted into the rear portion of storage recess 9 as described above. In this state, the pin 2c does not contact the connection portion 11. Next, when the outer case 5 is moved forward by the operation lever 6, the pin 2c is moved forward of the storage recess 9 as shown in FIGS. At this time, since the pin 2c comes into contact with the protrusions 11e provided on the first side 11a, the second side 11c, and the connection side 11d, the pin 2c contacts the connection part 11 at three points. Thereby, the pin 2c and the terminal 7 are reliably electrically connected.
[0066]
Next, a process of manufacturing the connector of the second embodiment will be described with reference to FIG. First, a gold-plated beryllium copper wire 7a, which is a raw material of the terminal 7, is cut into a required length as the terminal 7 as shown in FIGS. Next, as shown in FIG. 14c, the cut terminals 7 are arranged in a mold 22 for injection molding. In this state, the synthetic resin is injected into the mold 22 and cured. This forms the inner case 4 in which the linear terminals 7 are insert-molded as shown in FIG. 14d.
[0067]
Next, the combined body of the terminal 7 and the inner case 4 taken out of the mold 22 is held at a predetermined position, and the terminal 7 is bent by a bending jig (not shown, the same applies hereinafter). Do. Specifically, as shown in FIGS. 15A to 15D, the terminal 7 is gradually bent by a jig to form the shape of the connection portion 11. In the first embodiment, the terminal 7 is bent for each row arranged in the inner case 4, and when the processing of the predetermined row is completed, the jig is moved to the next row to perform the bending. ing. Next, the fixing portion 13 is similarly processed into a substantially L-shape in a side view by a jig one row at a time. After the terminal 7 is processed into a predetermined shape in this manner, the connector is completed by combining the inner case 4, the outer case 5, and the operation lever 6.
[0068]
In the connector of the second embodiment, the terminal 7 is processed after insert molding the terminal 7 and the inner case 4. For this reason, even when the inner case 4 is distorted, the height of the fixing portion 13 can be made uniform during the processing of the terminal 7 regardless of the distortion, and the coplanarity of the terminal 7 can be improved. .
[0069]
Next, a modification of the connector according to the second embodiment will be described with reference to FIG. The shape of the connection portion 11 of the terminal 7 can be a shape as shown in FIGS. First, in FIG. 16A, the holding portion 12 is located in front of (in FIG. 16A, below) the storage recess 9, and the connection portion 11 is bent from the front position to the rear in a substantially 8-shaped shape. I have. The upper portion in FIG. 16A is a rear position where the pin 2c does not contact the contact portion 11, and the lower portion is a front position where the pin 2c contacts the contact portion 11. Note that, in the present modified example, the supporting portion 9b is not provided in the storage concave portion 9.
[0070]
Next, in FIG. 16b, the shape of the storage recess 9 is different from that of the above-described embodiment, the width of the portion where the rear part of the connection part 11 is stored is wide, and the shape of the part where the front part of the connection part 11 is stored. The width is formed to be narrow. In this modification, the holding portion 12 is located behind the storage recess 9 (upward in FIG. 16B), and the connection portion 11 is bent from the rear position to the front in a substantially figure-eight shape. ing. Further, a support portion 9b is formed on the back surface of the connection portion 11 in the rear portion.
[0071]
Next, in FIG. 16C, the storage recess 9 is formed such that the width of the portion where the rear portion of the connection portion 11 is stored and the width of the portion where the front portion is stored is narrow, and the support portion 9b is provided. Have been. In this modification, the holding portion 12 is located behind the storage recess 9 (upward in FIG. 16C), and the connection portion 11 extends obliquely forward from the rear position and turns back obliquely. It is formed in a substantially V-shape. The distal end of the connection portion 11 projects outside from the storage recess 9. In this modification, when the pin 2c of the CPU 2 is at the rear position, the distal end of the connection portion 11 is located slightly above in FIG. 16c, and the pin 2c of the CPU 2 is moved to the front position and is moved to the pin 2c. When contacted, the connecting portion 11 is urged downward in FIG. 16c by the pin 2c, and the pin 2c contacts the contact portion 11 at two points. At this time, the pin 2c is configured to contact the inner wall of the storage recess 9. Further, the shape of the connection portion 11 may be as shown in FIG. 16D or may be as shown in FIG. 16E.
[0072]
Next, another modified example of the second embodiment will be described with reference to FIG. In the present modification, as shown in FIG. 17, the height positions of the adjacent connecting portions 11 are alternately changed so that the distance between the adjacent connecting portions 11 is increased. The shape of the connecting portion 11 is the same as that shown in FIG. 13A. The connection portion 11 is for making a connection by pinching the pin 2c of the CPU 2 and must be formed so as to spread in the width direction of the inner case 4, so that the distance between the adjacent connection portion 11 is reduced (FIG. 2). Since the connecting portion 11 in the present invention is formed of a wire, unlike the conventional plate material, the capacitance between the connecting portions 11 is small. However, in the present modified example, as shown in FIG. Since the distance between the connecting portions 11 can be increased by alternately changing the positions, the capacitance between the connecting portions 11 can be reduced.
[0073]
As described above, in the second embodiment, the shape of the connection portion 11 of the terminal 7 can be variously changed. However, such a change in the shape of the connection portion 11 is changed by a method of bending the terminal 7. can do. Accordingly, it is not necessary to change the mold in accordance with the change in the shape of the terminal 7, so that the shape of the terminal 7 can be easily changed.
[0074]
Although the second embodiment has been described with and without the support portion 9b, the support portion 9b may not be provided with the support portion 9b. Supporting portions 9b may be provided for those having no 9b. Further, in the second embodiment, the case where the terminal 7 is insert-molded in the inner case 4 has been described. However, the present invention is not limited to this, and the holding hole 8 is provided in the inner case 4 in advance (see FIG. 3). The fixing portion 13 and the holding portion 12 in a straight line state may be press-fitted into 8.
[0075]
Next, an integrated circuit connector and an integrated circuit mounting assembly according to a third embodiment of the present invention will be described with reference to FIGS. In FIG. 18, the lower left portion is the rear of the inner case 4.
[0076]
In the integrated circuit connector according to the third embodiment, the diameter of the terminal 7 is smaller than the diameter of the holding hole 8 provided in the inner case 4 as shown in FIG. Then, as shown in FIG. 19F, when attaching the terminal 7 to the inner case 4, the fixing portion 13 is bent so that the inner case 4 is sandwiched between the connecting portion 11 and the fixing portion 13, and the terminal 7 is held in the inner case 4. are doing.
[0077]
Further, a second storage recess 9c for storing the extension 11b of the connection portion 11 is provided at a front portion (obliquely upper right in FIG. 18) of the inner case 4. The width of the second storage recess 9c is smaller than the width of the extension 11b. When the terminal 7 having only the connection portion 11 is mounted on the inner case 4 as shown in FIG. Is compressed in the width direction. Thereby, the extension portion 11 b is pressed against the second storage recess 9 c by its elasticity, and the terminal 7 is held by the inner case 4. Other configurations are the same as those of the first modified example shown in FIG. 8, and thus the same configurations are denoted by the same reference numerals and detailed description thereof will be omitted.
[0078]
Next, a method of manufacturing the connector according to the third embodiment will be described with reference to FIG. First, the connecting portion 11 is formed by bending a linear wire. At this time, as shown in FIG. 19A, the holding portion 12 and the fixing portion 13 are in a straight line. In this state, the fixing portion 13 and the holding portion 12 are inserted into the holding holes 8 provided in the inner case 4. At this time, since the holding hole 8 is formed to be larger in diameter than the holding portion 12, the fixing portion 13 and the holding portion 12 can be easily inserted into the holding hole 8.
[0079]
Then, as shown in FIG. 19B, the extension portion 11b of the connection portion 11 is fitted into the second storage recess 9c, and the terminal 7 is mounted on the inner case 4. Further, the mold 23 having the L-shaped through-hole 23a in a plan view is lifted from below and inserted into a narrow portion (the upper part in FIG. 19B) of the through-hole 23a. From this state, the distal end of the fixing portion 13 is bent into an L shape by the press 24 as shown in FIG. 19C. Then, the tip of the fixing portion 13 formed by shifting the mold 23 in the width direction and bending it into an L shape is moved to a wide portion (a lower portion in FIG. 19D) of the through hole 23a of the mold 23, and the mold 23 is lowered. .
[0080]
Next, as shown in FIG. 19e, the press 25 is disposed before and after the fixing portion 13, and the fixing portion 13 is bent by the press 25 as shown in FIG. 19f. At this time, the inner case 4 is bent by the connecting portion 11 and the fixing portion 13 so as to be sandwiched in the thickness direction, and the terminal 7 is positioned and fixed to the inner case 4. Thereafter, the outer case 5 and the operation lever 6 are assembled to the inner case 4 and reflow soldered to the circuit board 3 to form an assembly of the connector and the circuit board.
[0081]
As described above, according to the connector of the third embodiment, since the diameter of the holding portion 12 of the terminal 7 is smaller than the diameter of the holding hole 8 of the inner case 4, the terminal 7 is attached to the inner case 4. The step of performing is easy. Further, since the terminal 7 is sandwiched between the inner case 4 by the connecting portion 11 and the fixing portion 13, the terminal 7 is positioned and fixed to the inner case 4, so that coplanarity at the distal end portion of the fixing portion 13 can be ensured. it can.
[0082]
Next, a modified example of the fixing portion 13 in the first to third embodiments will be described with reference to FIG. 20a and 20b, reference numeral 15 denotes a resist film provided on the surface of the circuit board 3, reference numeral 14 denotes a land, reference numeral 14a denotes an exposed portion, and the fixing portion 13 of the terminal 7 is placed on the exposed portion 14a of the land 14. Indicates the status.
[0083]
First, in the modification shown in FIG. 20A, a bent portion 13a in which the fixing portion 13 is bent in the width direction of the land 14 is provided. Next, a modification shown in FIG. 20B is provided with a bent portion 13a in which the fixing portion 13 is bent in a substantially circular shape. In this manner, by providing the bent portion 13a in the fixing portion 13, a large contact area between the fixing portion 13 and the land 14 can be obtained, so that the soldering between the fixing portion 13 and the land 14 can be performed more reliably. Can be.
[0084]
Further, as shown in FIGS. 20A and 20B, since the fixing portion 13 is formed smaller than the exposed portion 14a of the land 14, the resist film 15 does not intervene between the fixing portion 13 and the land 14. For this reason, the fixing part 13 and the land 14 can be easily and reliably soldered.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a connector according to a first embodiment.
FIG. 2 is a partially broken enlarged view of a II-II portion in FIG.
FIG. 3 is an explanatory diagram illustrating a relationship between a terminal connection portion and a CPU pin.
FIG. 4 is an explanatory view showing a step in bending a terminal.
FIG. 5 is an explanatory view showing a step in bending a terminal mounted on the inner case.
FIG. 6 is an explanatory view showing a process when a connector is surface-mounted on a circuit board.
FIG. 7 is an explanatory diagram showing a modification of the first embodiment.
FIG. 8 is an explanatory view showing terminals in a modification of the first embodiment.
FIG. 9 is a sectional view taken along line IX-IX of FIG. 8;
FIG. 10 is an explanatory diagram showing another modified example of the first embodiment.
FIG. 11 is an explanatory view showing another modification of the first embodiment.
FIG. 12 is an explanatory view showing another modification of the first embodiment.
FIG. 13 is an explanatory diagram illustrating a relationship between a terminal of a connector and a pin of a CPU according to the second embodiment;
FIG. 14 is an explanatory view showing a step of insert-molding the terminal in the inner case according to the second embodiment.
FIG. 15 is an explanatory view showing a step of forming a terminal connection portion according to the second embodiment.
FIG. 16 is an explanatory view showing a modified example of a terminal connecting portion.
FIG. 17 is an explanatory view showing a modification of the second embodiment.
FIG. 18 is an explanatory view showing a connector according to a third embodiment.
FIG. 19 is an explanatory diagram illustrating a manufacturing process of the connector according to the third embodiment.
FIG. 20 is an explanatory view showing a modified example of a terminal fixing portion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Connector for integrated circuits, 2 ... CPU (integrated circuit), 2b ... Terminal part, 2 ... Pin, 3 ... Circuit board, 4 ... Inner case, 5 ... Outer case, 6 ... Operation lever (sliding means), 7 ... terminals, 11 ... connection parts, 12 ... holding parts, 13 ... fixing parts.

Claims

A connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion on a circuit board,
An inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding unit for sliding the outer case; Terminals connected to the pins and soldered to lands provided on the circuit board are provided,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire material, a holding portion held in the holding hole, a connection portion projecting from the holding portion to the surface side of the inner case and housed in the housing portion, A fixing portion protruding from the back side of the inner case and being soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and after the holding portion is pressed into the holding hole in a linear state, the back surface of the inner case is A connector for an integrated circuit, characterized in that a portion protruding from the base is bent substantially parallel to the land to form the fixing portion.

A connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion on a circuit board,
An inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding unit for sliding the outer case; Terminals connected to the pins and soldered to lands provided on the circuit board are provided,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire material, a holding portion held in the holding hole, a connection portion projecting from the holding portion to the surface side of the inner case and housed in the housing portion, A fixing portion protruding from the back side of the inner case and being soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is insert-molded or press-fitted into the holding hole so that the terminal protrudes from the front and back of the inner case in a straight line. The connection portion is formed by being bent so as to contact the pin, and a portion protruding to the back surface side of the inner case is bent substantially in parallel with the land to form the fixing portion. Integrated circuit connector.

A connector for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion on a circuit board,
An inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding unit for sliding the outer case; Terminals connected to the pins and soldered to lands provided on the circuit board are provided,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire having a diameter smaller than that of the holding hole, and a holding portion held in the holding hole and a connection projecting from the holding portion to a surface side of the inner case and housed in the housing portion. And a fixing portion that projects from the holding portion to the back side of the inner case and is soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and after the holding portion is loosely fitted in the holding hole in a linear state, the back surface of the inner case is A connector for an integrated circuit, wherein a portion protruding to the side is bent substantially in parallel with the land to form the fixed portion, and the inner case is sandwiched between the contact portion and the fixed portion.

3. The integrated circuit connector according to claim 1, wherein the holding portion of the terminal is provided with a rough surface portion that is engaged with the holding hole when held in the holding hole. 4.

A first side edge that projects upward from a holding portion of the terminal at a front position in a storage portion of the inner case and is bent in a horizontal direction and extends rearward; An extension portion bent downward in a substantially U-shape from the tip of the first side edge at the rear position, and a second side edge bent horizontally and extended forward from the tip of the extension portion. The first side and the second side are narrower than the outer diameter of the pin at the front part of the storage part, and are smaller than the outer diameter of the pin at the rear part of the storage part. The integrated circuit connector according to any one of claims 1 to 4, wherein the connector is formed wide.

The integrated circuit connector according to any one of claims 1 to 5, wherein the inner case includes a support portion that protrudes into the storage portion and supports the connection portion of the terminal from below.

7. The integrated circuit connector according to claim 5, wherein the connection portions of the terminals are arranged so that the height positions of the horizontally bent portions of the adjacent terminals are shifted. 8.

The inner case has a hook portion that is hooked to the circuit board when the inner case is mounted at a predetermined position on the circuit board,
The fixing portion of the terminal is characterized by projecting beyond a gap between the back surface of the inner case and the circuit board so as to be urged by the land when the inner case is hooked on the circuit board. The integrated circuit connector according to claim 1.

9. The integrated circuit connector according to claim 1, wherein the terminal fixing portion is provided with a bent portion bent in a width direction of the land in a plan view. 10.

An assembly of a connector and a circuit board for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion to a circuit board,
The connector has an inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding means for sliding the outer case. The case is provided with terminals that are connected to the pins and soldered to lands provided on the circuit board,
The circuit board includes a resist film having an exposed portion that covers the surface and exposes a part of the land, and the exposed portion is filled with cream solder,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire material, a holding portion held in the holding hole, a connection portion projecting from the holding portion to the surface side of the inner case and housed in the housing portion, A fixing portion protruding from the back side of the inner case and being soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and after the holding portion is pressed into the holding hole in a linear state, the back surface of the inner case is The bent portion is bent substantially parallel to the land to form the fixing portion,
An assembly of a connector and a circuit board, wherein the fixed portion is housed in the exposed portion filled with cream solder, and the fixed portion and the land are connected by reflow soldering.

An assembly of a connector and a circuit board for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion to a circuit board,
The connector has an inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding means for sliding the outer case. The case is provided with terminals that are connected to the pins and soldered to lands provided on the circuit board,
The circuit board includes a resist film having an exposed portion that covers the surface and exposes a part of the land, and the exposed portion is filled with cream solder,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire material, a holding portion held in the holding hole, a connection portion projecting from the holding portion to the surface side of the inner case and housed in the housing portion, A fixing portion protruding from the back side of the inner case and being soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is insert-molded or press-fitted into the holding hole so that the holding portion protrudes from the front and back of the inner case in a straight line state, and then the portion protruding toward the surface side of the inner case is positioned in front of the storage portion. The connecting portion is formed by bending so as to be in contact with the pin, and the portion protruding on the back surface side of the inner case is bent substantially parallel to the land to form the fixing portion,
An assembly of a connector and a circuit board, wherein the fixed portion is housed in the exposed portion filled with cream solder, and the fixed portion and the land are connected by reflow soldering.

An assembly of a connector and a circuit board for detachably mounting an integrated circuit having a plurality of pins projecting downward from a flat terminal portion to a circuit board,
The connector has an inner case fixed to a circuit board, an outer case slidably provided in the front-rear direction with respect to the inner case, and a sliding means for sliding the outer case. The case is provided with terminals that are connected to the pins and soldered to lands provided on the circuit board,
The circuit board includes a resist film having an exposed portion that covers the surface and exposes a part of the land, and the exposed portion is filled with cream solder,
The outer case has an insertion hole through which the pin is inserted, and the inner case has a storage portion that stores the pin and a holding hole that holds the terminal,
The terminal is formed by processing a wire having a diameter smaller than that of the holding hole, and a holding portion held in the holding hole and a connection projecting from the holding portion to a surface side of the inner case and housed in the housing portion. And a fixing portion that projects from the holding portion to the back side of the inner case and is soldered to the land,
When the pin is inserted into the insertion hole in a state where the outer case has been moved rearward by the sliding means, the pin is held at a position behind the storage portion and not in contact with the pin, and the pin is When the outer case is moved forward while being inserted into the insertion hole, the pin contacts the contact portion in front of the storage portion,
The terminal is bent in advance so that the contact portion contacts the pin in front of the storage portion of the inner case, and after the holding portion is loosely fitted in the holding hole in a linear state, the back surface of the inner case is A portion protruding to the side is bent substantially in parallel with the land to form the fixed portion, and the inner case is sandwiched by the contact portion and the fixed portion,
An assembly of a connector and a circuit board, wherein the fixed portion is housed in the exposed portion filled with cream solder, and the fixed portion and the land are connected by reflow soldering.