JP2004319729A - Electronic component package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost glass-sealed type electronic component package wherein a shielding conductor film and a grounding conductor film, which face each other sandwiching sealing glass for sealing a printed circuit and a cover, are electrically connected to each other without an increase in the number of manufacturing steps. <P>SOLUTION: In this electronic component package having an insulator-made printed board 1 and an insulator-made cover 4 covering the upper surface of the printed board 1 and having sealing glass 5 arranged between the printed board 1 and the cover 4, a shielding conductor film 6 is formed at least on a part of the surface of the cover 4 and an grounding conductor film 7 is formed on the side of the printed board 1. The part of the shielding conductor film 6 and the grounding conductor film 7 are arranged to face each other and electrically connected to each other by one or a plurality of metal bumps 8 penetrating through the sealing glass 5 sealing the printed board 1 and the cover 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement of a package for sealing various electronic components in an electromagnetically shielded state, and particularly, when connecting and sealing a ceramic lid to a ceramic package base, the electrical connection of both is simultaneously performed. The present invention relates to a novel electronic component package that can be realized.
[0002]
[Prior art]
Conventionally, a package of a type in which various electronic components are sealed while mounted on a wiring pattern is a printed circuit board including electronic components in a state where the electronic components are mounted on a wiring pattern on a printed circuit board which also serves as a package structural member. It has a structure in which the upper space is sealed with a lid. Among them, the package sealing method using glass is superior to the sealing method using a resin adhesive or solder in terms of airtightness, bonding strength, and cost, and has been frequently used in recent years to reduce the size and cost of packages. In particular, it has been widely used as a sealing method for electronic components and the like that require airtightness.
[0003]
For example, FIG. 6 is a vertical cross-sectional view showing a configuration of a package proposed in Japanese Patent Application Laid-Open No. 2000-58692, showing a ceramic flat printed board 61 on which electronic components 62 are mounted on a wiring pattern on the upper surface. Then, a box-shaped ceramic lid 63 having a concave portion on the lower surface is covered thereon, and the two joints are joined via a glass 64. Since the printed board 61 and the lid 63 are connected and fixed by a glass 64 which is a non-conductive substance, an inner wall of the lid is used to electrically connect the printed board 61 and the lid 63 to perform electromagnetic shielding. Alternatively, a shielding conductor film 65 is formed on at least a part of the outer wall and a grounding conductor film 66 is also formed on the printed circuit board side, and the printed circuit board and the lid are opposed to each other with an exposed portion of glass sealing the lid therebetween. A part of the shield conductor film 65 and the ground conductor film 66 are electrically connected by a conductive adhesive 67.
[0004]
[Patent Document] JP-A-2000-58692.
[0005]
[Problems to be solved by the invention]
In order to electrically connect between the shield conductor film 65 provided on the lid 63 side and the ground conductor film 66 provided on the printed board 61 side, a coating step and a curing step of a conductive adhesive 67 are newly provided. The complexity of the manufacturing process due to the need for high cost and high capital investment, and the adoption of the glass sealing method for packages containing components that require EMI countermeasures such as quartz products hinders cost reduction Had become a factor.
[0006]
The present invention has been made in order to solve the above problems, and covers a printed circuit board also serving as a package structural member and a space on a printed circuit board including electronic components mounted on the printed circuit board with a lid. In a package for an electronic component in which the joints are firmly fixed with glass, a part of the shield conductor film and the conductor film for grounding that are opposed to each other with the glass sealing the printed circuit board and the lid interposed therebetween without increasing the number of processes It is an object of the present invention to provide an inexpensive package that can electrically connect the devices.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention is directed to a printed circuit board made of an insulating material having a wiring pattern on an upper surface, and a printed circuit board including electronic components mounted on the printed circuit board. A cover made of an insulating material to surround, and a package for an electronic component having a structure in which the printed circuit board and the cover are glass-sealed, wherein a conductive film for shielding is formed on at least a part of the surface of the cover and printed. A grounding conductor film is also formed on the substrate side, and one or more of the shielding conductor film and the grounding conductor film, which are disposed to face each other through glass that seals the printed circuit board and the lid, are provided. The present invention provides an electronic component package electrically connected by the metal bumps.
[0008]
According to a second aspect of the present invention, there is provided an electronic component package according to the first aspect, wherein the shield conductive film is formed over an inner wall of the lid and a connection end surface of the lid.
[0009]
According to a third aspect of the present invention, there is provided an electronic component package according to the first aspect, wherein the shield conductive film is formed over an outer wall of the lid and a connection end face of the lid.
[0010]
According to a fourth aspect of the present invention, there is provided an electronic component package according to any one of the first to third aspects, wherein the printed circuit board has a flat plate shape, and the lid has a concave portion on a lower surface. I do.
[0011]
According to a fifth aspect of the present invention, there is provided an electronic component package according to any one of the first to third aspects, wherein the printed board has a concave portion on an upper surface, and the lid has a flat plate shape. I do.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail based on the illustrated embodiments of the present invention.
[0013]
FIG. 1A is a top view of a package according to an embodiment of the present invention in a state where a cover 4 is omitted, and FIG. 1B is a cross-sectional view taken along line AA.
In the figure, 1 is a ceramic printed board, 2 is a wiring pattern, 3 is an electronic component, 4 is a ceramic lid, 4a is a concave portion, 5 is glass, 6 is a shielding conductive film, and 7 is a grounding conductor. Reference numeral 8 denotes a gold bump, 9 denotes a gold stud bump, 10 denotes an external terminal electrode for grounding, and 11 denotes an internal conductor. The wiring pattern 2, the shielding conductor film 6, the grounding conductor film 7, and the grounding external terminal electrode 10 are formed by firing tungsten or molybdenum, plating nickel thereon, and further plating gold on the nickel plating. It was done.
As shown in FIG. 1, a flat printed board 1 has an electronic component 3 bonded face-down to a wiring pattern 2 provided on the upper surface thereof. The lid 4 surrounds the upper surface of the printed circuit board 1 with a concave portion 4a that is provided on the lower surface and opens downward, and is hermetically sealed with glass 5. The cover 4 is provided with a shield conductive film 6 over substantially the entire inner surface of the recess 4a and the lowermost surface of the cover 4, that is, a predetermined position on the connection end face of the cover 4. The shield conductor film 6 disposed on the connection end surface of the lid 4 and the ground conductor film 7 formed at a predetermined position on the upper surface of the printed circuit board 1 are electrically connected via the gold bumps 8 provided in the glass 5. Connected. Further, the grounding conductor film 7 is connected to a grounding external terminal electrode 10 via an internal conductor 11.
[0014]
FIGS. 2A and 2B are views showing an example of a process of forming the gold bumps 28 and the gold stud bumps 29 and a process of mounting the electronic component 23. The printed board is printed by an external bump forming device (not shown). After a predetermined gold stud bump 29 is formed on the wiring pattern 22 formed on the upper surface 21 and one or more gold bumps 28 are formed on the grounding conductor film 27, the electronic component 23 is attached to the gold stud bump 29. Flip chip mounting. That is, since the gold bump is formed on the grounding conductor film in the process of forming the gold stud bump for the electronic component, there is no need to perform a special process for the grounding gold bump. There is.
[0015]
FIGS. 2C to 2D are views showing an example of a sealing step and a step of connecting the gold bumps 28, wherein glass adhered to a connection end face of a lid 24 provided with a shielding conductor film 26. The lid 24 is heated until the whole 25 shows a state of fluidity from a solid state, that is, a sol state, and at the same time, the printed board 21 on which the electronic components 23 are mounted is preheated. At this time, the lid 24 is held in a state of being attracted to the ultrasonic head 20 of the external device, and when the lid 24 and the printed circuit board 21 reach a desired surface temperature, the ultrasonic head 20 closes the lid. 24 is placed at a predetermined position on the printed circuit board 21. Further, the gold bump 28 pushes away the sol-shaped glass 25 by thermocompression bonding using ultrasonic waves together with the ultrasonic head 20, and the gold bump 28 and the shielding conductor film 26 are metal-bonded to each other. The conductor film 26 and the ground conductor film 27 are electrically connected. Thereafter, the glass 25 surrounding the gold bumps 28 is solidified by cooling, whereby hermetic sealing is performed.
[0016]
FIG. 3 is a longitudinal sectional view showing the configuration of a package according to a second embodiment of the present invention, in which a conductor film for shielding is formed on the outer surface of the lid instead of the inner wall of the lid having a concave portion on the lower surface. This is the characteristic. That is, the conductive film 36 for shielding formed over substantially the entire outer surface of the lid 34 and a predetermined position on the connection end surface of the lid and the conductive film 37 for grounding formed on the printed circuit board 31 are electrically connected by the gold bumps 38. It is configured to be connected and hermetically sealed with glass 35.
[0017]
FIG. 4 is a longitudinal sectional view showing a configuration of a package according to a third embodiment of the present invention. A printed board 41 has a concave portion 41a having an opening at an upper side for accommodating an electronic component 43 on an upper surface thereof. An annular grounding conductor film 47 is formed on the upper surface of the side wall of the portion 41a, and the plate-like lid 44 is provided with a shielding conductor film 46 on substantially the entire lower surface thereof, and the grounding conductor film 47 and the shielding conductor film are provided. 46 are electrically connected with gold bumps 48 and hermetically sealed with glass 45.
[0018]
FIG. 5 is a longitudinal sectional view showing a configuration of a package according to a fourth embodiment of the present invention. A printed board 51 has a recess 51a having an opening at an upper side for accommodating an electronic component 53 on an upper surface thereof. An annular grounding conductor film 57 is formed on the upper surface of the side wall of the portion 51a, and the flat lid 54 is provided with a shielding conductor film 56 over substantially the entire upper surface and a predetermined position of the connection end face of the lid 54, The grounding conductor film 57 and the shielding conductor film 56 are electrically connected by gold bumps 58 and hermetically sealed with glass 55.
[0019]
With this configuration, it is possible to provide an electromagnetic shield in an electronic component package having a glass-sealed structure. In the above embodiment, a gold bump is used. However, it is obvious that a bump using a material other than gold may be used.
[0020]
【The invention's effect】
In any one of the first to fifth aspects of the present invention, it is possible to provide an electromagnetic shield in an electronic component package having a glass-sealed structure, which has an effect that the size and cost of the package can be reduced.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an electronic component package according to an embodiment of the present invention.
(A) Top view in a state where a lid was omitted.
(B) Vertical sectional view. 2 shows a cross section taken along line XX of FIG.
FIG. 2 is an explanatory longitudinal sectional view of a manufacturing process according to one embodiment of the present invention.
(A) Gold bump and gold stud bump formation process figure.
(B) The mounting process figure of an electronic component.
(C)-(d) The sealing process and the connection process drawing of the gold bump 28.
FIG. 3 is a vertical cross-sectional configuration diagram of an electronic component package according to a second embodiment of the present invention.
FIG. 4 is a vertical sectional configuration view of an electronic component package according to a third embodiment of the present invention.
FIG. 5 is a vertical cross-sectional configuration diagram of an electronic component package according to a fourth embodiment of the present invention.
FIG. 6 is a longitudinal sectional view of a conventional electronic component package.
[Explanation of symbols]
1. Printed circuit board 2. 2. Wiring pattern Electronic components 4. Lid 4a. Recess 5. Glass 6. 6. Conductive film for shielding 7. Conductive film for grounding Gold bump 9. Gold stud bump 10. 10. External terminal electrode for grounding Internal conductor 20. Ultrasonic head 21. Printed circuit board 22. Wiring pattern 23. Electronic components 24. Lid 25. Glass 26. Conductive film for shield 27. Grounding conductor film 28. Gold bump 29. Gold stud bump 31. Printed circuit board 34. Lid 35. Glass 36. 37. Shielding conductor film Grounding conductor film 38. Gold bump 41. Printed circuit board 41a. Recess 43. Electronic components 44. Lid 45. Glass 46. Conductive film for shield 47. Grounding conductor film 48. Gold bump 51. Printed circuit board 51a. Recess 53. Electronic components 54. Lid 55. Glass 56. Conductive film for shield 57. Grounding conductor film 58. Gold bump 61. Printed circuit board 62. Electronic components 63. Lid 64. Glass 65. Conductive film for shield 66. Grounding conductor film 67. Conductive adhesive

Claims (5)

A printed circuit board made of an insulating material having a wiring pattern on an upper surface thereof; and a lid made of an insulating material surrounding the upper surface of the printed circuit board including electronic components mounted on the printed circuit board. In an electronic component package having a glass-sealed structure, a conductive film for shielding is formed on at least a part of the surface of the lid, and a conductive film for grounding is also formed on the printed circuit board side to seal the printed circuit board and the lid. A package for an electronic component, wherein a part of the shield conductive film, which is disposed to face through the glass to be stopped, and the ground conductive film are electrically connected by one or a plurality of metal bumps. 2. The electronic component package according to claim 1, wherein the shield conductor film is formed over an inner wall of the lid and a connection end surface of the lid. 2. The electronic component package according to claim 1, wherein the shielding conductor film is formed over an outer wall of the lid and a connection end surface of the lid. The electronic component package according to any one of claims 1 to 3, wherein the printed board has a flat plate shape, and the lid has a concave portion on a lower surface. The electronic component package according to any one of claims 1 to 3, wherein the printed board has a concave portion on an upper surface, and the lid has a flat plate shape.

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