JP2005057073A - Light emitting device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which is detachable and in which a p-type electrode and an n-type electrode can be seen very easily.
A light emitting element, a metal pedestal on which the light emitting element is placed, a metal lid having a window part for emitting light from the light emitting element, and the pedestal The present invention relates to a coin-type light emitting device having an insulating packing 30 for insulating the lid 50 and a connecting tool 40. The n-type electrode of the light emitting element 10 and the pedestal 20 are electrically connected using a wire 60, the p-type electrode of the light emitting element 10 and the connecting tool 40 are electrically connected using a wire 60, and the connecting tool 40 and the lid 50 are electrically connected, and an n-type electrode is taken from the base 20 of the coin-type light emitting device, and a p-type electrode is taken from the lid 50.
[Selection] Figure 1

Description

  The present invention relates to a detachable light emitting device that can be used for an automobile headlight, an automobile stop lamp, an illumination light source, a traffic signal lamp, and the like. In particular, the present invention relates to a light-emitting device that can be used outdoors and has high reliability.

A light-emitting device using a light-emitting element emits light with a small color, high power efficiency, and vivid colors. In addition, since the light-emitting element is a semiconductor element, there is no worry about a broken ball. Further, it has excellent initial driving characteristics and is strong against vibration and repeated on / off lighting. Because of such excellent characteristics, semiconductor light emitting devices are used as various light sources. In recent years, nitride semiconductors (In _x Ga _y Al _1-xy N, 0 ≦ x ≦ 1, 0 ≦ not only light emitting elements emitting red light and green light but also blue light can be emitted with high luminance). Light emitting devices utilizing y ≦ 1) have been developed.

  In general, a light-emitting device has a long life unlike a halogen lamp, and therefore it is not necessary to attach / detach the light-emitting device once it is attached to a predetermined place.

  However, automobile headlights, stop lamps, and the like need to be attached and detached during repairs, and contact-type parts such as connectors and connections are often used during assembly. Further, it is desired that general consumers can attach and remove the light emitting device to and from the lighting fixture very easily.

  In the conventional light emitting device, the p-type electrode and the n-type electrode are close to the same plane side, and it is necessary to confirm which electrode is the same.

  In view of the above, an object of the present invention is to provide a light emitting device that is detachable and in which the p-type electrode and the n-type electrode can be visually recognized very easily.

  In order to solve the above-mentioned problems, the present inventor has intensively studied, and as a result, the present invention has been completed.

  The present invention relates to a light emitting element, a base on which the light emitting element is placed, a lid having a window, an insulating packing that insulates the base from the lid, and the light emitting element and the lid are electrically connected. A first connecting electrode, and one electrode of the light emitting element is electrically connected to the pedestal, and another electrode of the light emitting element is connected to the base via the connecting tool. The present invention relates to a light emitting device that is electrically connected to a lid. Thereby, a base and a cover body turn into a different electrode. When a current is supplied to the pedestal and the lid, the light emitting element emits light, and the emitted light is transmitted through the window portion of the lid and emits light to the outside.

  The present invention includes a step of installing an insulating packing on a pedestal, a step of installing a connecting tool on the insulating packing, a step of mounting a light emitting element on the pedestal, and electrically connecting the light emitting element and the pedestal. A step of electrically connecting the light emitting element and the connector, and a step of installing a lid on the pedestal and electrically connecting the lid and the connector. The present invention relates to a device manufacturing method. The light-emitting element has different types of electrodes, one electrode is electrically connected to the pedestal, and the other electrode is electrically connected to the lid through a connecting tool. The order of attaching the above steps may be different. However, the step of electrically connecting the light-emitting element and the pedestal and the step of electrically connecting the light-emitting element and the connecting tool may be substantially electrically connected, It is not necessary to require a separate electrical connection step through a wire or the like.

  Since the present invention is configured as described above, the following effects can be obtained.

  The present invention relates to a light emitting element, a base on which the light emitting element is placed, a lid having a window, an insulating packing that insulates the base from the lid, and the light emitting element and the lid are electrically connected. A first connecting electrode, and one electrode of the light emitting element is electrically connected to the pedestal, and another electrode of the light emitting element is connected to the base via the connecting tool. The present invention relates to a light emitting device that is electrically connected to a lid. Thereby, a detachable small and thin light emitting device can be provided. Further, since different electrodes are provided on the pedestal and the lid, it is very easy to visually recognize which electrode it is.

  The present invention includes a step of installing an insulating packing on a pedestal, a step of installing a connecting tool on the insulating packing, a step of mounting a light emitting element on the pedestal, and electrically connecting the light emitting element and the pedestal. A step of electrically connecting the light emitting element and the connector, and a step of installing a lid on the pedestal and electrically connecting the lid and the connector. The present invention relates to a device manufacturing method. Thereby, a light-emitting device can be manufactured easily. It should be noted that the order of each step is not limited, and the insulating packing may be installed on the pedestal after the connecting tool is installed on the insulating packing, and after the light emitting element is placed on the pedestal, the insulating packing and connecting Tools may be installed.

  Hereinafter, a light-emitting device and a manufacturing method thereof according to the present invention will be described with reference to embodiments and examples. However, the present invention is not limited to this embodiment and example.

  FIG. 1 is a cross-sectional view illustrating a light emitting device. FIG. 2 is a plan view showing the light emitting device.

  The light emitting device includes a light emitting element 10, a base 20 on which the light emitting element 10 is placed, a lid 50 having a window 51, an insulating packing 30 that insulates the base 20 and the lid 50, and a light emitting element. 10 and a connecting member 40 for electrically connecting the lid 50 to each other. The pedestal 20 and the lid 50 are different electrodes.

  The light emitting element 10 is placed on the pedestal 20. For this mounting, a method of die-bonding the light-emitting element 10 directly to the pedestal 20 by face-up using a die bond resin or the like can be employed. When the pn type semiconductor light emitting element 10 is used, for example, the n type electrode of the semiconductor light emitting element 10 and the pedestal 20 are electrically connected by a wire 60 or the like, and the p type electrode of the semiconductor light emitting element 10 and the lid 50 are used. It is possible to electrically connect the connecting tool 40 connected to the base plate 40 with a wire 60 or the like, the pedestal 20 can be an n-type electrode, and the lid 50 can be a p-type electrode. However, the p-type and n-type can be changed as appropriate.

  An insulating ring-shaped insulating packing 30 is installed on the outer periphery of the pedestal 20. This is because the inside of the light emitting device on which the light emitting element 10 is mounted has a hollow structure and is preferably sealed. Moreover, since the base 20 and the lid 50 are different electrodes, it is necessary to interpose an insulating member so as not to be short-circuited.

  The connecting tool 40 electrically connects the electrode of the light emitting element 10 and the lid 50. Various shapes of the connecting tool 40 can be adopted. For example, the connecting device 40 may be formed into a ring shape having a protruding portion 41 so as to fit into the shape of the insulating packing 30, or may be formed into a rectangle or a fan shape provided with one or more protruding portions 41 fixed by the insulating packing 30. can do. The protrusion 41 provided on the connecting tool 40 is electrically connected to the lid 50.

  The lid 50 has a translucent window 51 that emits light from the light emitting element 10 to the outside. The lid 50 has a shape that fits into the shape of the base 20. The lid 50 is electrically connected to the protrusion 41 of the connecting tool 40. The outer peripheral portion of the lid 50 is caulked to the base 20 via the insulating packing 30. This is for fixing the base 20 and hermetically sealing the inside of the light emitting device. At this time, the insulating packing 30 functions as a buffer material, and improves the airtightness of the light emitting device. Moreover, the adhesiveness with the base 20, the insulating packing 30, the connecting tool 40, and the cover body 50 is also improved. However, the light-emitting device is preferably hermetically sealed, but may have a configuration without hermetic sealing.

  The inside of the light emitting device is filled with an inert gas such as nitrogen, helium, TMG gas (trimethylgallium gas), or TMI gas (trimethylindium gas).

  The shape and size of the light emitting device are not particularly limited, and various shapes and sizes are adopted. Moreover, you may change suitably according to the number and the magnitude | size of a light emitting element. The shape of the light emitting device includes a coin shape, an elliptical shape, a rectangular parallelepiped, and the like. Further, when the light emitting device is standardized with a predetermined shape and size, the light emitting device may conform to the standard.

  By adopting the above configuration, a detachable small and thin light emitting device can be provided. Hereinafter, each component will be described in detail.

<Light emitting element>
The light-emitting element 10 is not particularly limited, and a light-emitting element that emits red, green, or blue light can be used. Further, not only these light emitting elements that emit visible light but also light emitting elements that emit light in the ultraviolet region from the short wavelength region of visible light, for example, light emitting devices that emit light in the ultraviolet region near 360 nm can be used. However, when a phosphor is used for the light emitting device, a semiconductor light emitting element having a light emitting layer capable of emitting a light emission wavelength capable of exciting the phosphor is preferable. Examples of such a semiconductor light emitting device include various semiconductors such as ZnSe and GaN. Nitride semiconductors capable of emitting a short wavelength that can excite phosphors efficiently (In _X Al _Y Ga _1- XYN, Preferred examples include 0 ≦ X, 0 ≦ Y, and X + Y ≦ 1).

  When a nitride semiconductor is used, materials such as sapphire, spinel, SiC, Si, ZnO, and GaN are preferably used for the semiconductor substrate. In order to form a nitride semiconductor with good crystallinity with high productivity, it is preferable to use a sapphire substrate.

  In the light emitting device, in order to emit white light, the emission wavelength of the light emitting element is preferably 400 nm or more and 530 nm or less, considering the complementary color relationship with the emission wavelength from the phosphor or the deterioration of the translucent resin, and 420 nm or more. 490 nm or less is more preferable. In order to further improve the excitation and emission efficiency of the light emitting element and the phosphor, 450 nm or more and 475 nm or less are more preferable.

  The light emitting element 10 can use a power system of □ 0.35 mm square or □ 1.00 mm square. Also, a □ 2.00 mm square or a □ 3.00 mm square that is □ 1.00 mm square or more can be used. The heat generated from the light emitting element 10 is transmitted to the base 20 and released to the outside.

  The light emitting element 10 may be mounted in either face-down mounting or face-up mounting. In the case of face-down mounting, mounting can be performed via a submount or the like, and the dissimilar electrodes can be formed by the base 20 and the lid 50.

<Pedestal>
The pedestal 20 mounts the light emitting element 10 and functions as one electrode. One of the p-type electrode and the n-type electrode of the pn-type light emitting element 10 is electrically connected to the base 20. Which is the p-type electrode is appropriately changed according to the standard.

  The inside of the light emitting device is preferably hermetically sealed. This is because since the light emitting element 10 is used, it is necessary to protect the light emitting element 10 from moisture and dust. In particular, since the light emitting element 10 generates heat as it is driven, moisture accumulated in the light emitting device evaporates or the light emitting element 10 deteriorates. In addition, moisture may adhere to the inner surface of the window 51 with heating and cooling.

  The base 20 uses a metal material. Since the base 20 acts as an electrode, a metal having high electrical conductivity is used. Further, the pedestal 20 uses a metal having high thermal conductivity in order to dissipate heat generated in the light emitting element 10. For example, Cu, Ag, Au, Kovar, etc. can be used, and those subjected to plating treatment can also be used. Moreover, hermetic sealing can be performed more easily by using a metal material. Furthermore, since the light emitted from the light emitting element 10 is reflected through the pedestal 20 and emitted to the outside, the light extraction efficiency can be improved.

  The pedestal 20 can also be provided with a recess in a portion where the light emitting element 1 is placed. It is preferable to provide a reflective surface for the bottom surface portion and the side surface portion of the recess so that the light from the light emitting element 10 can be reflected and emitted to the outside. Alternatively, the material of the pedestal 20 can be formed of a metal having a high reflectance in the main light emission wavelength region of the light emitting element 10.

  The pedestal 20 is electrically connected from the electrode of the light emitting element 10 via the wire 60.

  The base 20 is appropriately changed according to the shape of the light emitting device. For example, in the case of a coin-type light emitting device, the pedestal 20 has a thin disk shape.

  In order to fix the insulating packing 30, the base 20 is provided with a flange on the outside from the base 20, and the insulating packing 30 is fitted to the flange. Moreover, the removal | extraction after the part which provided the collar on the outer side from the base 20 can be prevented can be prevented.

<Insulation packing>
The insulating packing 30 is for preventing a short circuit between the base 20 and the lid 50. Further, the base 20 and the lid 50 are hermetically sealed through the insulating packing 30 in order to hermetically seal the inside of the light emitting device. Further, the thermal expansion of the metal parts of the base 20 and the lid 50 due to the heat generated when the light emitting device is driven is relaxed by the insulating packing 30 so that the light emitting device is not broken or damaged. Furthermore, the insulating packing 30 has a role as a cushioning member between the lid 50 and the pedestal 20, and the lid 50 and the pedestal 20 can be caulked and firmly fixed.

  The material of the insulating packing 30 is not particularly limited as long as it has an insulating property and a function as a buffer material, and an inorganic material such as a heat-resistant resin (for example, a polyamide-based thermoplastic resin) or ceramic is used. Can do.

  The insulating packing 30 has a shape that fits into the shape of the pedestal 20, for example, a ring shape. In the case where the pedestal 20 has a disk shape, a circular ring-shaped insulating packing 30 is used. The insulating packing 30 can be fixed with a flange on the outer periphery of the base 20. Further, the lid 50 is caulked inward by utilizing the unevenness of the brim to enhance the airtightness.

<Connector>
The connecting tool 40 is provided to establish electrical connection between the light emitting element 10 and the lid 50. The shape, size, number and the like of the connecting tool 40 are not particularly limited. The connecting tool 40 is electrically connected to the electrode of the light emitting element 10 via the wire 60 while being fixed to the insulating packing 30. The connecting tool 40 may be ring-shaped and attached to the insulating packing 30. Further, the connecting tool 40 can be bent into a flat L-shape, and a plurality of connecting tools 40 can be prepared and attached to the insulating packing 30. Further, the connecting tool 40 can be bent into a flat corrugated shape, and a plurality of connecting tools 40 can be prepared and attached to the insulating packing 30. A flange is provided on the outer periphery of the connecting tool 40, and the flange fits into the insulating packing 30 to fix the connecting tool 40 to the insulating packing 30.

  When the connecting tool 40 is bent in an L shape, the projecting portion 41 is in contact with the metal lid 50. At this time, since the insulating packing 30 is installed between the connecting tool 40 and the pedestal 20, the insulating packing 30 serves as a buffer material, and the adhesion between the connecting tool 40 and the lid 50 can be improved. Thereby, electrical connection with the connecting tool 40 and the cover body 50 can be taken reliably.

  The connecting member 40 is made of metal and preferably has high electrical conductivity. Moreover, it is preferable that the connecting tool 40 uses a metal with a high reflectance. Since the insulating packing 30 has a lower reflectance than that of metal, the connecting tool 40 is provided so as to cover the insulating packing 30.

  The connecting tool 40 may have a structure that functions as a reflector. For example, it is preferable that the upper end of the opening has a wide-mouthed truncated cone shape or a mortar shape. Thereby, it is possible to improve the light extraction efficiency.

  The shape of the connecting tool 40 is not particularly limited, but a ring shape, a rectangle, a bent plate, or the like can be used. Moreover, even if the shape of the connecting tool 40 is a ring shape or the like, it is possible to make a shape that makes it easy to attach to the insulating packing 30 by cutting the outer peripheral portion.

<Cover body>
The lid 50 is provided with a translucent window 51. The window 51 is preferably placed directly above the light emitting element 10 is placed. The lid 50 is made of metal and serves as a different electrode from the pedestal 20.

  The shape of the lid 50 is not particularly limited, and is a shape that fits into the shape of the pedestal 20. For example, when the light emitting device is a coin type, the pedestal 20 has a disk shape and a cup shape that fits the pedestal 20.

  When the shape of the lid 50 is a cup shape and a part of the upper surface and a part of the side surface are formed of a metal material, a light-emitting device that is resistant to vibration can be provided. In other words, with respect to the vibration in the vertical direction, the side surface of the lid 50 that is electrically connected to the electrode of the power supply unit slides in the vertical direction, so that the electrode of the power supply unit and the side surface of the lid 50 may be in non-contact. Absent. On the other hand, with respect to the vibration in the lateral direction, the upper surface of the lid 50 and the bottom surface of the pedestal 20 that are electrically connected to the electrodes of the power supply section slide in the lateral direction. The bottom surface of 20 is not in non-contact.

  The window 51 transmits light from the light emitting element 10. The window 51 uses an inorganic material such as silica, glass, a translucent resin, or the like. The window 51 may have a lens structure or a dome shape in addition to a flat plate shape. By providing the lens structure, it is possible to enhance the light condensing property and to control the directivity.

  A phosphor layer can be deposited on the inner surface of the window 51. Further, the window portion 51 can contain a phosphor. As a result, the wavelength of the phosphor excited by the light emitted from the light emitting element 10 can be converted to provide a light emitting device having a predetermined color tone. The phosphor can be mixed in the window portion 51 or attached to the window portion 51. When making it adhere to the window part 51, it is preferable to use the silica etc. which are resin strong against an ultraviolet-ray, or an inorganic substance.

  The lid 50 and the pedestal 20 on which the insulating packing 30 is installed can take a means for fitting and caulking the lid 50 having a size that fits the pedestal 20. Further, like a bolt and a nut, the insulating packing 30 and the lid body 50 can be provided with a thread and a thread groove, and a means for joining the lid body 50 and the base 20 by screwing can be used. At this time, it is necessary to perform screwing until the lid 50 and the connecting tool 40 installed on the insulating packing 30 are electrically connected. Furthermore, a means for fixing the lid 50 and the pedestal 20 having the insulating packing 30 by thermal contraction can be used.

<Others>
The wire 60 is provided to establish electrical connection between the electrode of the light emitting element 10 and the pedestal 20, and the electrode of the light emitting element 10 and the connecting tool 40. In order to efficiently extract light from the light emitting element 10 to the outside, it is preferable to use a highly reflective metal. Moreover, the metal which does not corrode easily is used.

  The light-emitting element 10 can be covered with a sealing resin in order to prevent the entry of moisture and the like and to improve the light extraction efficiency. As the sealing resin, a resin having excellent translucency and heat resistance is used.

  The phosphor can be mixed in the sealing resin, or can be fixed inside the window 51 or attached to the surface. In addition to the phosphor, a filler such as a diffusing agent or a pigment can be mixed in the sealing resin.

  The inside of the light emitting device is hermetically sealed with an inert gas such as nitrogen or helium.

  As will be described in the following embodiment, the light-emitting element 10 can be mounted face-down on a submount, and the submount can be mounted on the base 20. For the submount, a zener diode or the like can be used.

<Method for manufacturing light emitting device>
Hereinafter, a method for manufacturing a light emitting device according to the present invention will be outlined.

(First embodiment)
The light emitting element 10 is placed on the base 20. The light emitting element 10 is mounted face up. The light emitting element 10 is die-bonded using an Au—Sn eutectic layer, a die bonding resin, or the like. After the light emitting element 10 is installed on the pedestal 20, the light emitting element 10 and the pedestal 20 are electrically connected using the wire 60.

  The insulating packing 30 is installed on the pedestal 20. An insulating packing 30 having a shape that fits into the flange of the pedestal 20 is attached to the pedestal 20.

  The connecting tool 40 is installed on the insulating packing 30. It attaches to the connection tool 40 to the insulating packing 30 which has the shape fitted to the collar of the connection tool 40.

  The light emitting element 10 and the connecting tool 40 are electrically connected. The wire 60 is used for electrical connection. The wire 60 is electrically connected so as not to cause a short circuit with the pedestal 20 or the lid 50 serving as a different electrode.

  A lid 50 is installed on the base 20. The lid 50 is fixed to the base 20 via the insulating packing 30. As a means for fixing the lid 50, a caulking means, a screw fastening means, a means for pushing the lid 50 into the insulating packing 30 and fitting it, and the like can be used. The lid 50 is attached to the base 20 in an inert gas such as nitrogen or helium. Thus, the inside of the light emitting device is filled with nitrogen, helium, etc. and hermetically sealed.

(Second Embodiment)
The insulating packing 30 and the connecting tool 40 are installed on the pedestal 20.

  Next, the light emitting element 10 is die-bonded to the base 20. At this time, the light emitting element 10 may be either face-up mounting or face-down mounting.

  Next, one electrode of the light emitting element 10 and the pedestal 20, and the other electrode of the light emitting element 10 and the connecting tool 40 are electrically connected using the wire 20. However, in the case of mounting face down, one electrode of the light emitting element 10 and the base 20 can be directly electrically connected via bumps or the like without using the wire 20.

  Finally, the lid 50 is installed on the base 20 on which the light emitting element 10 is provided. The lid 50 is fixed to the base 20 via the insulating packing 30. As a means for fixing the lid 50, a caulking means, a screw fastening means, a means for pushing the lid 50 into the insulating packing 30 and fitting it, and the like can be used.

  However, the order of the step of placing the light emitting element 10 on the pedestal 20, the step of installing the insulating packing 30 on the pedestal 20, and the step of installing the connecting tool 40 on the insulating packing 30 is not limited. For example, after attaching the connecting tool 40 to the insulating packing 30, the insulating packing 30 can be attached to the base 20, and then the light emitting element 10 can be attached to the base 20. Moreover, after attaching the light emitting element 10 to the base 20, the order which attaches the insulating packing 30 which attached the connecting tool 40 to the base 20 can be taken. The electrical connection between the light emitting element 10 and the pedestal 20 may be after any process.

  Through the above manufacturing method, a light-emitting device can be provided.

<Different embodiments>
FIG. 4 is a cross-sectional view showing light emitting devices according to different embodiments. FIG. 5 is a plan view showing a light emitting device according to a different embodiment. If it has the same function as above, the description is omitted.

  The light emitting device includes a light emitting element 10, a pedestal 20, an insulating packing 30, a connecting tool 40, and a lid 50. The light emitting device is a coin-type light emitting device.

  The light emitting element 10 is the same as described above.

  A method of mounting the light emitting element 10 face-down on a submount (not shown) and placing the submount on the base 20 can also be adopted. When the pn type semiconductor light emitting element 10 is used, for example, the p type electrode of the semiconductor light emitting element 10 and the submount n type semiconductor, the n type electrode of the semiconductor light emitting element 10 and the submount n type semiconductor are connected to Au. Face-down mounting is performed using ultrasonic mounting means such as bumps. This submount is bonded to the base 20. The p-type semiconductor of the submount and the pedestal 20 are electrically connected by a wire 60 or the like, and the n-type semiconductor of the submount and the connecting tool 40 connected to the lid 50 are electrically connected by the wire 60 or the like. Thereby, the base 20 can be made into a p-type electrode, and the cover body 50 can be made into an n-type electrode. However, the p-type and n-type can be changed as appropriate.

  The pedestal 20 has a disk shape. A portion where the light emitting element 10 is placed is projected.

  The insulating packing 30 has a ring shape having a cavity of a size that fits into the shape of the protruding portion of the portion where the light emitting element 10 is placed. The insulating packing 30 has a shape that fits into the flange of the pedestal 20 and is fixed to the pedestal 20.

  The connecting tool 40 is formed into a corrugated flat plate. The protrusion 41 of the connecting tool 40 is in contact with the lid 50. This connecting tool 40 is also ring-shaped. Since the connecting tool 40 has a higher reflectance than the insulating packing 30, the connecting tool 40 is placed so as to cover the insulating packing 30. In order for the light emitted from the light emitting element 10 to irradiate the connecting tool 40, a tapered reflecting surface is formed on the connecting tool 40. The connecting tool 40 is provided so that the outer peripheral portion of the window portion 51 is disposed on the tapered extension line.

  The lid 50 is attached to the pedestal 20 via the insulating packing 30.

<Example 1>
The light emitting device according to the present invention will be described. However, the present invention is not limited to this. 1 and 2 show the light-emitting device of Example 1. FIG.

  The light emitting device of Example 1 was manufactured as follows.

  The pn-type light emitting element 10 was die-bonded to the base 20 using an Au—Sn eutectic layer. An insulating packing 30 was attached to the pedestal 20. The insulating packing 30 was fixed to the pedestal 20 by a fitting method using the insulating packing 30 having a convex portion provided on the pedestal 20 and having a concave portion fitted to the convex portion. Next, the connecting tool 40 was attached to the insulating packing 30. The connecting tool 40 is provided with a convex portion, and the connecting tool 40 is fixed to the insulating packing 30 by a fitting method using the insulating packing 30 having a concave portion fitted to the convex portion. Next, the n-type electrode of the light emitting element 10 and the pedestal 20, and the p-type electrode of the light emitting element 10 and the connecting tool 40 were electrically connected using the wire 60. Finally, the lid 50 is fitted to a position in contact with the connecting tool 40 in a nitrogen atmosphere, and is fixed to the pedestal 20 via the insulating packing 30. The fixing is caulking the outer periphery of the lid 50 inward. Thereby, a coin-type light emitting device was manufactured.

  The pedestal 20 is made of Cu, and an Ag plating layer is provided on the surface thereof. The pedestal 20 has a disk shape, and the light emitting element 10 is placed at the center of the disk shape. The insulating packing 30 has a ring shape that fits into the pedestal 20. The insulating packing 30 was made of PFA (fluororesin). The connecting tool 40 has a ring shape that fits into the shape of the insulating packing 30. The connecting tool 40 is made of Kovar and has a Ni / Ag layer on its surface in order to reflect light from the light emitting element 10. The wire 60 uses Au having a high reflectance. The lid 50 is provided with a window 51 at the center. The light emitting element 10 is placed directly under the window 51. The lid 50 is made of Cu, and the surface thereof is an Ag plating layer. The lid 50 is sized to fit into the insulating packing 30, and the outer periphery of the lid 50 is caulked inside. The inside of the light emitting device is filled with nitrogen.

  This light-emitting device is attached to a power supply unit (not shown), and light is emitted by energization. The power source has a cup shape, and a terminal is provided on the bottom surface of the cup that contacts the pedestal 20, and a terminal is provided on the side surface of the cup that contacts the side surface of the lid 50. By attaching a light-emitting device to this cup-shaped power supply unit, it can be made detachable.

<Example 2>
3 and 4 show the light-emitting device of Example 2. FIG. A description of the same configuration as that of the first embodiment is omitted.

  The insulating packing 30 is attached to the pedestal 20. The convex part of the base 20 and the concave part of the insulating packing 30 are fitted. In order to hermetically seal, an adhesive is used for the gap between the insulating packing 30 and the base 20. Next, the connecting tool 40 is attached to the insulating packing 30. The convex part of the connecting tool 40 and the concave part of the insulating packing 30 are fitted. Next, the submount is bonded to the base 20 using a die bond resin. Next, the light emitting element 10 is mounted face-down on the upper surface of the submount. The n-type electrode of the light-emitting element 10 and the p-type electrode of the submount, and the p-type electrode of the light-emitting element 10 and the n-type electrode of the submount are electrically connected. The p-type electrode of the submount and the pedestal 20, and the n-type electrode of the submount and the connecting tool 40 are electrically connected using a wire 60. Finally, the lid 50 is fitted to a position in contact with the connecting tool 40 in a nitrogen atmosphere, and is fixed to the pedestal 20 via the insulating packing 30. In order to hermetically seal, an adhesive is used for the gap between the insulating packing 30 and the lid 50. The fixing is caulking the outer periphery of the lid 50 inward. Thereby, a light emitting device can be provided.

<Example 3>
The light emitting device according to the present invention will be described. A description of the same configuration as that of the first embodiment is omitted.

  The light emitting device of Example 3 can be manufactured as follows.

  First, the insulating packing 30 and the connecting tool 40 are fixed to the base 20. The outer peripheral portion of the insulating packing 30 has a thread groove that is screwed into a screw shape provided on the inner side surface portion of the lid 50. In this attachment, the pedestal 20 is provided with a convex portion, and the insulating packing 30 having a concave portion fitted to the convex portion is used to fix the insulating packing 30 to the pedestal 20 by a fitting method. The connecting tool 40 is provided with a convex portion, and the connecting tool 40 is fixed to the insulating packing 30 by a fitting method using the insulating packing 30 having a concave portion fitted to the convex portion. However, the insulating packing 30 to which the connecting tool 40 is attached in advance can be attached and fixed to the base 20.

  The pedestal 20 is made of Kovar and has a Ni / Ag layer on the surface. The pedestal 20 has a disk shape, and the light emitting element 10 is placed on the center of the disk shape. The insulating packing 30 has a ring shape that fits into the pedestal 20. The insulating packing 30 uses 12-nylon. The connecting tool 40 has a ring shape that fits into the shape of the insulating packing 30. The connecting tool 40 is made of Kovar and has a Ni / Ag layer on its surface in order to reflect light from the light emitting element 10. The wire 60 uses Au having a high reflectance. The lid 50 is provided with a window 51 at the center. The light emitting element 10 is placed directly under the window 51. The lid 50 is made of Kovar and has a Ni / Ag layer on the surface. The lid 50 is sized to fit into the insulating packing 30, and the outer periphery of the lid 50 is caulked inside. The inside of the light emitting device is filled with nitrogen. However, the pedestal 20 and the insulating packing 30 and the insulating packing 30 and the connecting tool 40 are screwed to each other and may be fixed to each other by screwing. Thereby, fixation, replacement of parts, etc. can be performed easily.

  Next, the light emitting element 10 is die-bonded to the base 20.

  Next, the n-type electrode of the light-emitting element 10 and the pedestal 20, and the p-type electrode of the light-emitting element 10 and the connector 40 are electrically connected using the wire 60. However, when face-down mounting using the submount substrate, the electrode portion provided on the submount substrate and the pedestal 20 and / or the connecting tool 40 can be electrically connected using the wire 60 or the like.

  Finally, the lid 50 that is screwed into the thread groove of the insulating packing 30 is screwed in the nitrogen atmosphere, and the base 20 and the lid 50 are fixed. At this time, at least the screw 50 is fixed to the position where the lid 50 and the connector 40 are in electrical contact. By making the lid 50 screw-in, the lid 50 can be easily replaced. For example, by preparing a lid 50 having a phosphor sheet affixed to the window 51 of the lid 50 and a lid 50 having no phosphor sheet, and replacing the lid 50, various colors are obtained. Can be provided.

  The light-emitting device of the present invention can be used for automobile headlights, automobile stop lamps, illumination light sources, traffic signal lights, and the like.

It is sectional drawing which shows a light-emitting device. It is a top view which shows a light-emitting device. It is a schematic perspective view which shows each component of a light-emitting device. It is sectional drawing which shows the light-emitting device which concerns on different embodiment. It is a top view which shows the light-emitting device which concerns on different embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting element 20 Base 30 Insulation packing 40 Connecting tool 41 Protrusion part 50 Cover body 51 Window part 60 Wire

Claims (2)

A light emitting element;
A pedestal on which the light emitting element is placed;
A lid having a window,
Insulating packing for insulating the pedestal and the lid;
A connector for electrically connecting the light emitting element and the lid;
Have
One electrode of the light emitting element is electrically connected to the pedestal,
The other electrode of the light emitting element is a light emitting device electrically connected to the lid through the connecting tool. Installing an insulating packing on the pedestal;
Installing a connecting tool on the insulating packing;
Placing the light emitting element on the pedestal;
Electrically connecting the light emitting element and the pedestal;
Electrically connecting the light emitting element and the connector;
Installing a lid on the pedestal and electrically connecting the lid and the connector;
A method for manufacturing a light emitting device.

Images