JP2005134373A - Connection device using spiral contactor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection device which uses a spiral contactor which protects a deformation of the spiral contactor and a dust infiltration into the spiral contactor. <P>SOLUTION: An external connecting part 1a of an electronic component 1 and a first spiral contactor 40A prepared in a adapter board 30 are contacted via a small hole 21 prepared in a protective sheet 20, when the electronic component 1 is mounted on a loading part 11A. Deformation and dust infiltration of the spiral contactor are protected, since the protective sheet 20, mounted on an upper part of the relaying substrate 30, protects the adapter board 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a connection device using a spiral contactor that is electrically connected to a BGA, an LGA, or the like, and more particularly, a connection device using a spiral contactor that can prevent deformation of the spiral contactor and entry of dust. About.

  Conventionally, an electronic component such as a semiconductor having a plurality of contacts such as BGA (Ball Grid Array) and LGA (Land Grid Array) on the upper or lower surface of a package has been developed. ing. In order to test the performance of such an electronic component, a dedicated jig for connecting the contact to a contact pad provided on an external circuit board is required. It exists as technical literature.

  Patent Document 1 describes a semiconductor inspection apparatus, which electrically connects a semiconductor, which is a component to be inspected, to an external circuit board or the like. The semiconductor inspection apparatus has a socket for holding a semiconductor, and the semiconductor is detachable from the socket. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor. An insulating substrate is provided on the bottom surface of the socket, and the insulating substrate has a large number of recesses facing the spherical contacts, and the recesses are convex in a direction toward the spherical contacts. A spiral contact that protrudes from the surface is disposed.

In the semiconductor inspection apparatus, when the cover provided on the socket side is closed, the inner surface of the cover presses the semiconductor in a direction approaching the insulating substrate, so that the spiral contact is in the recess by the outer surface of the spherical contact. It is pushed into. At this time, since the spiral contact contacts the outer surface of the spherical contact while being spirally wound, the individual spherical contacts and the individual contact pads are electrically connected via the spiral contacts. It has become so. Moreover, by opening the cover, the semiconductor is pushed back by the elasticity of the spiral contact and can be taken out from the socket.
JP 2001-015236 A

  However, in the semiconductor inspection apparatus disclosed in Patent Document 1, when the cover is left open, the spiral contact provided on the insulating substrate in the socket is kept exposed to the outside.

  At this time, if any object is inadvertently dropped into the socket, an unreasonable force acts to deform the spiral contact, causing a contact failure between the spiral contact and the BGA or LGA. There's a problem.

  In addition, when the cover is opened, dust is likely to enter the socket, and it is difficult to easily remove dust when it is entangled with the spiral contact. If the dust is forcibly removed using a tool such as tweezers, for example, there is a possibility that the spiral contact may be deformed by an unreasonable force as described above.

  The present invention is for solving the above-described conventional problems, and a connection device using a spiral contact that can prevent the deformation of the spiral contact and the entry of dust and reduce the occurrence of defects such as contact failure. The purpose is to provide.

The present invention includes a substrate provided with a plurality of through-holes and spiral contacts provided in the individual through-holes, and a plurality of external connection portions provided in an electronic component include the plurality of spiral contacts. In a connection device using a spiral contactor connected via
A protective sheet is provided between the electronic component and the substrate so as to oppose the substrate, and each spiral contact and each external connection portion are directly or indirectly provided on the protective sheet. A relay means for connection is provided.

  In the present invention, since the protective sheet can protect the substrate, deformation of the spiral contact provided on the substrate and entry of dust can be prevented.

  For example, the spiral contact according to claim 1, wherein the relay means is a hole formed in the protective sheet.

  Alternatively, the relay means includes a flat surface provided on one surface side of the protective sheet so as to face the spiral contact, and a convex body provided on the other surface side so as to face the external connection portion. Is a connecting member formed integrally.

  In the above means, even if the protective sheet is provided on the upper part of the substrate, it is possible to electrically connect the external connection portion provided on the electronic component and the spiral contact provided on the substrate.

  In addition, the spiral contactor includes a first spiral contactor formed at a position facing the external connection part, and a second spiral formed facing a position not having the external connection part of the electronic component. It is preferable that the contact member has a contact and the second spiral contact supports the protective sheet.

  In this case, it is preferable that the height dimension of the second spiral contactor is formed higher than the height dimension of the first spiral contactor.

  Furthermore, it is preferable that the protective sheet is supported so as to be movable in a vertical direction intersecting the substrate.

  In the above configuration, the second spiral contactor can elastically support the protective sheet, and when the electronic component is mounted, the protective sheet is moved and provided on the first spiral contactor and the electronic component. It is possible to contact the external connection portion with an appropriate contact pressure. Therefore, the contact state between the first spiral contact and the external connection portion can be made favorable.

The present invention also provides a socket provided with a loading portion on which an electronic component having a plurality of external connection portions is mounted, and a spiral provided in the loading portion and in electrical contact with the external connection portion. A connection device using a spiral contactor provided with a substrate provided with a plurality of contacts,
A pair of moving members are provided on the upper side of the substrate and facing the plurality of spiral contacts, each having a plurality of semicircular semi-small holes and relatively moving in the loading portion. ,
In an initial state before the electronic component is mounted on the loading unit, the semi-small holes of one moving member and the semi-small holes of the other moving member are alternately arranged to completely expose the spiral contactor. Is prevented,
When the electronic component is mounted on the loading portion, the moving member is moved in a direction opposite to each other, so that the semi-small hole of the one moving member and the semi-small hole of the other moving member Are integrally combined to form a plurality of small holes, so that the spiral contactor and the external connection portion can be connected through the small holes.

  In the above invention, the small hole is not formed in the initial state before mounting the electronic component, and the small hole is formed at the same time when the electronic component is mounted. For this reason, it is possible to reliably perform the protection of the spiral contact and the connection operation at the time of connection. Further, since the exposure degree of the spiral contact can be lowered in the initial state, it is possible to effectively prevent the dust from adhering to the spiral contact.

  As the moving member, for example, the moving member includes a plurality of strip-shaped protective portions arranged with a predetermined space in a direction orthogonal to the moving direction of the moving member, and the movement to the edge of the protective portion. And a semi-small hole arranged at a predetermined pitch along the direction, and the protection portion of the one moving member can be configured to be movably disposed in the space of the other moving member.

  Further, a cover for pressing the electronic component in a direction approaching the substrate is rotatably supported on the socket, and the cover is closed when the electronic component is mounted on the loading portion. The electronic member may be moved in a direction approaching the substrate, and the spiral contactor may be connected to the external connection portion through the small hole.

  In the above means, the electrical connection between the spiral contact and the external connection portion of the electronic component can be reliably performed.

  It is preferable that a first urging member for urging the pair of moving members in a moving direction approaching each other is provided.

  With the above means, the spiral contact can be protected even in the initial state in which no electronic component is mounted.

  Furthermore, it is preferable that a second urging member for supporting the pair of moving members movably is provided.

  In the above means, the external connection portion of the electronic component can be reliably separated from the spiral contact and the moving member can be lifted, so that the connection device can be reliably returned to the initial state or the mounted state.

  In the present invention, since the spiral contact is not actively exposed to the outside, an excessive external force is unlikely to act on the spiral contact. Therefore, deformation of the spiral contact can be prevented.

  Further, the protective sheet can prevent dust from entering. Moreover, dust accumulated on the protective sheet can be easily removed.

FIG. 1 is a perspective view showing an appearance of a connection device using a spiral contact according to the present invention.
A connection device (inspection device) 10 using a spiral contact shown in FIG. 1 is intended for inspection of an electronic component 1 such as a semiconductor provided with a plurality of external connection portions 1a made of BAG, LGA or the like on the connection surface. It is.

  As shown in FIG. 1, the connection device 10 includes a socket 11 and a cover 12 that is rotatably supported via a hinge 13 provided at one edge of the socket 11. The socket 11 and the cover 12 are formed of an insulating resin material or the like. A locked portion 14 is formed on the other edge portion of the socket 11, and a lock portion 15 is formed on the edge portion of the cover 12.

  At the center of the socket 11, a loading portion 11A formed in a concave shape in the Z2 direction is provided, and an electronic component 1 such as a semiconductor is mounted in the loading portion 11A.

  2 is a plan view showing the entire protective sheet, FIG. 3 is an enlarged plan view showing a part of the protective sheet (part A in FIG. 2), and FIGS. 4A and 4B are first views of the connection device of the present invention. FIG. 4A is a cross-sectional view before mounting the electronic component, and FIG. 4B is a cross-sectional view after mounting the electronic component.

  As shown in FIG. 2, the protective sheet 20 that appears at the top of the loading section 11A is shown. The protective sheet 20 is formed of a thin insulating film such as polyimide or PET, or a substrate, for example. The protective sheet 20 has a plurality of small holes (relay means) 21 facing the plurality of external connection portions 1 a arranged on the connection surface of the electronic component 1. In the case shown in FIG. 2, the small holes 21 arranged in two rows inside the protective sheet 20 form a quadrangle, and the small holes 21 arranged in the other two rows are parallel to each other on the outside of the square. Are lined up.

  The arrangement of the small holes 21 matches the arrangement of the external connection portions 1 a provided on the connection surface (lower surface) of the electronic component 1. That is, in the electronic component 1 in this case, the external connection portions 1a arranged in two rows on the inner side of the connection surface are arranged in a square shape, and the external connection portions 1a arranged in two rows on the outer side thereof extend along each side of the square. Are arranged in parallel.

  However, the arrangement of the small holes 21 can be variously changed according to the arrangement of the external connection portions 1a formed on the connection surface of the electronic component 1, and is not limited to the arrangement shown in FIG.

  As shown in FIG. 3, when a part of the small hole 21 is enlarged, the spiral contact 40 provided under the protective sheet 20 can be visually recognized from the small hole 21.

  As shown in FIG. 4, the protective sheet 20 is provided on the top of the loading unit 11A. A connection board 50 provided with a plurality of land connection parts 51 is provided at the lowermost part of the loading part 11 </ b> A, and a relay board 30 is provided between the protective sheet 20 and the connection board 50.

  The spiral contact 40 is provided on the relay substrate 30. The relay substrate 30 is formed of glass epoxy, PWB, or the like, and a plurality of through holes 31 penetrating the relay substrate 30 in the thickness direction are regularly formed in a matrix. The pitch dimensions of the through holes 31 in the vertical and horizontal directions (X and Y directions) are the same as the vertical and horizontal pitch dimensions of the external connection portion 1 a of the electronic component 1. The through hole 31 has a diameter larger than the diameter of the external connection portion 1 a of the electronic component 1.

  As shown in FIG. 4A, ring-shaped upper connection portions 32 a and lower connection portions 32 b are formed at upper and lower opening edges of each through hole 31, and a cylindrical shape is formed on the inner surface of the through hole 31. A connecting portion 32c having a shape is formed. The upper connecting portion 32a, the lower connecting portion 32b, and the connecting portion 32c are formed by, for example, copper plating, and the upper connecting portion 32a and the lower connecting portion 32b are electrically connected via the connecting portion 32c. .

  Spiral contacts 40 are provided in the upper connection portions 32a of the individual through holes 31, respectively. As shown in FIG. 3, the spiral contactor 40 has a ring-shaped base portion 41 on the outer peripheral side, and has a contact portion 42 that spirally extends from the base portion 41 toward the center of the through hole 31. Yes. The contact portion 42 is formed such that the tip portion 43 protrudes from the base portion 41 in a three-dimensional manner.

  Of the spiral contacts 40 provided in the upper connection portion 32a of the through hole 31, the first spiral contact that faces the small hole 21 and has a height dimension (natural length) H1 in the Z1 direction in the drawing is H1. The second spiral contactor 40B has a height dimension (natural length) in the Z1 direction shown in FIG. 40A that faces the portion other than the small hole 21 (connection surface of the electronic component 1) and is H2. The first spiral contact 40A is formed to have a lower height than the second spiral contact 40B (H1 <H2). The protective sheet 20 is elastically supported by a second spiral contact 40B having a height dimension H2 provided on the upper side of the relay substrate 30.

  As shown in FIG. 3, in the portion having the small hole 21, the first spiral contact 40 </ b> A can be visually recognized through the small hole 21 from the outside of the protective sheet 20. On the other hand, as shown in FIG. 4A, since the protective sheet 20 covers the second spiral contact 40B provided in the lower portion in the portion not having the small hole 21, the spiral contact 40 is visually recognized from the outside. It is impossible to do. Therefore. If dust does not pass through the small hole 21, it cannot enter the inside, and it is possible to make it difficult for the dust to adhere to the first and second spiral contacts 40A, 40B.

  Further, the protective sheet 20 can prevent intrusion of other objects. Therefore, for example, even when tweezers or the like is inserted into the loading portion 11A, an accident in which the tip of the tweezers or the like contacts and deforms the first and second spiral contacts 40A and 40B. Occurrence can be prevented.

  The lower connection portion 32b is also provided with a spiral contact 40 that protrudes in the Z2 direction as shown above.

  In the connection substrate 50, a plurality of land connection portions 51 are regularly formed in a matrix along the vertical and horizontal pitch dimensions, and each land connection portion 51 has a pattern line (not shown) extending to the outside. Is formed. As shown in FIGS. 4A and 4B, the land connection portion 51 is formed at a position facing both the small hole 21 formed in the protective sheet 20 and the individual external connection portion 1 a formed in the electronic component 1. Has been.

  4A, the relay board 30 is mounted on a connection board 50, and individual spiral contacts 40 provided on the lower side of the relay board 30 are connected to individual land connection portions of the connection board 50. 51 is in a conductive state. The relay board 30 is elastically supported on the connection board 50 by the biasing force f of the plurality of spiral contacts 40 provided on the lower side.

  As shown in FIG. 4B, when the electronic component 1 is mounted in the loading portion 11A of the socket 11 and the cover 12 is closed, first, the contact surface, which is the lower surface of the electronic component 1, places the protective sheet 20 in the Z2 direction shown in the figure. Press. At this time, the protective sheet 20 is pressed against the connection surface of the electronic component 1 by the urging force of the second spiral contact 40B having a height dimension H2 on the upper side that elastically supports the protective sheet 20 while being connected to the connection surface of the electronic component 1. Is moved in the direction Z2 shown in the figure.

  When the lock portion 15 is locked to the locked portion 14, the facing distance between the protective sheet 20 and the relay substrate 30 becomes equal to or less than the height dimension H1, and the first spiral contact with the height dimension H1. Since the distal end portion 43 of the child 40A comes into contact with the external connection portion 1a, the external connection portion 1a and the land connection portion 51 can be connected via the relay substrate 30.

  That is, the plurality of small holes 21 provided in the protection sheet 20 allow contact between the external connection portion 1a on the electronic component 1 side and the first spiral contact 40A on the relay substrate 30 side, and the external connection portion 1a. And the land connecting portion 51 function as a relay means for direct connection.

  Therefore, signals are input to the plurality of external connection portions 1a of the electronic component 1 loaded in the loading portion 11A via pattern lines (not shown) provided on the connection substrate 50, or from the external connection portion 1a. A signal can be output.

  FIGS. 5A and 5B are sectional views similar to FIGS. 4A and 4B as a second embodiment of the present invention, FIG. 5A is a sectional view before mounting an electronic component, and FIG. 5B is a state after mounting the electronic component. It is sectional drawing.

  The connection device shown in the second embodiment has substantially the same configuration as the connection device shown in the first embodiment. However, the connecting device shown in the second embodiment is different in that the relay means is constituted by a connecting member provided on the protective sheet 20.

  That is, a plurality of land connection portions 51 are arranged in a matrix on the connection substrate 50. On the connection board 50, there is provided a relay board 30 in which first and second spiral contacts 40A, 40B are arranged in a matrix on both upper and lower surfaces, and the relay board 30 is provided on the lower side thereof. The spiral contactor 40 is elastically supported. And when the spiral contact 40 provided in the said lower side contacts the said land connection part 51, both are electrically connected. Further, the first spiral contact 40A provided on the upper side of the relay substrate 30 faces the relay means provided on the protective sheet 20, and the other second spiral contact 40B holds the protective sheet 20 on. It is elastically supported.

  As shown in FIGS. 5A and 5B, the relay means has a flat surface 22 a provided on the lower surface side that is one surface of the protective sheet 20 so as to face the spiral contact 40, and the other surface of the protective sheet 20. The connecting member 22 is integrally formed with a convex body 22b provided to face the external connection portion 1a from the upper surface side which is a surface.

  In addition, the said connection member 22 is formed in the same position as the small hole 21 provided in the protection sheet 20 in the said 1st Embodiment. However, the arrangement of the connecting members 22 can be variously changed according to the arrangement of the external connection portions 1a formed on the connection surface of the electronic component 1, and is not limited to the arrangement shown in FIG.

  In the connection device shown in the second embodiment, the protective sheet 20 provided with a plurality of connecting members 22 almost completely covers the surface of the relay substrate 30 having the first and second spiral contacts 40A, 40B. It is a configuration. Therefore, even if any object enters the loading unit 11A, the object does not directly contact the first and second spiral contacts 40A and 40B. Therefore, deformation of the first and second spiral contacts 40A and 40B can be prevented.

  Further, since the protective sheet 20 is not configured to have the small holes 21, it is possible to more effectively prevent dust from entering the protective sheet 20 than in the first embodiment. It is possible to more effectively prevent the problem of being entangled with the first and second spiral contacts 40A and 40B. Moreover, the dust that has entered the loading portion 11A can be kept on the protective sheet 20, and the dust can be easily removed by a simple cleaning operation such as lightly blowing air or the like. Therefore. Since there is no need to allow tweezers or the like to enter during cleaning, and no excessive force is applied to the first and second spiral contacts 40A and 40B, the first and second spiral contacts 40A, Deformation of 40B can be prevented. Therefore, it is possible to eliminate or reduce contact failure between the first spiral contactor 40A and the external connection portion 1a.

  In addition, since the individual second spiral contacts 40B can support the protective sheet 20 with an equal urging force, the contact pressure when the first spiral contacts 40A contact the external connection portion 1a is set appropriately. It can be Also in this respect, the contact state between the first spiral contactor 40A and the external connection portion 1a can be made favorable.

  As shown in FIG. 5B, when the electronic component 1 is mounted in the loading portion 11 </ b> A of the socket 11, each external connection portion 1 a provided on the contact surface on the lower surface of the electronic component 1 is attached to the protective sheet 20. The protective sheet 20 is pushed in the Z2 direction shown in the drawing while contacting the tip of each connecting member 22 provided. At this time, the protective sheet 20 approaches the connection substrate 50 against the second spiral contact 40B having a height dimension H2 provided on the upper side of the relay substrate 30 that elastically supports the protective sheet 20. It is moved in the Z2 direction.

  When the facing distance between the protective sheet 20 and the relay substrate 30 is narrowed until the height dimension H1 is reached, the flat surface 22a of the connecting member 22 is formed on the first spiral contactor 40A having the height dimension H1. It contacts the tip portion 43. At this time, the external connection portion 1 a and the land connection portion 51 are connected via the connecting member 22 of the relay board 30.

  That is, the plurality of connecting members 22 provided on the protective sheet 20 bring the external connection portion 1a on the electronic component 1 side and the first spiral contact 40A on the relay substrate 30 side into contact with each external connection portion 1a. It functions as a relay means for indirectly connecting each land connection part 51 via the relay board 30.

  In the first and second embodiments, the positioning of the protective sheet 20 and the relay board 30 in the loading unit 11A is not particularly shown. However, for example, the connection board 50 protrudes in the Z1 direction in the figure at an arbitrary position. A plurality of positioning pins are provided, and positioning holes corresponding to the positioning pins are formed on the relay board 30 and the protective sheet 20, respectively, so that a spiral contact on the land connection portion 51 and the lower side of the relay board 30 is provided. 40, and the positioning of the first spiral contact 40A on the upper side of the relay substrate 30 and the relay means (the small hole 21 or the connecting member 22) of the protective sheet 20 can be easily performed.

  Further, when the positioning of each member is performed by such positioning pins and positioning holes, the protective sheet 20 can be freely moved in the illustrated vertical direction (Z direction) perpendicular to the relay substrate 30. It can be easily replaced. Therefore, by installing the protective sheet 20 corresponding to the arrangement of the external connection portions 1a of the electronic component 1 in the loading portion 11A, it is possible to provide a connection device that can connect various electronic components 1.

  6 and 7 show a spiral contact connecting device according to a third embodiment of the present invention, FIG. 6A is a plan view showing an initial state before mounting an electronic component, and FIG. 6B is a mounting state of the electronic component. 7A is a cross-sectional view taken along the line AA in FIG. 6A, FIG. 7B is a cross-sectional view taken along the line BB in FIG. 6B, and FIG. 7C is a spiral contact with the external connection portion of the electronic component. It is sectional drawing similar to FIG. 6B which shows the connection state which the child contacted.

  As shown in FIGS. 6 and 7, the connection device 10 according to the third embodiment rotates through a socket 11 and a hinge 13 provided on one edge (the left end in the drawing) of the socket 11. And a freely supported cover 12. The socket 11 and the cover 12 are formed of an insulating resin material or the like. A locked portion 14 is formed at the other edge (right end in the figure) of the socket 11, and a lock portion 15 is formed at the edge of the cover 12. A pressing convex portion 12 a is formed on the inner surface of the cover 12 so as to protrude.

  The socket 11 is provided with a loading portion 11A that is recessed in the Z2 direction in the figure by four wall surfaces that surround four sides, and an electronic component 1 such as a semiconductor can be mounted in the loading portion 11A. It is like that. A relay substrate 30 is provided at the bottom of the loading portion 11A of the socket 11 on the Z2 side. The relay substrate 30 may have the same configuration as that shown in the first and second embodiments. That is, as shown in FIG. 7A, a plurality of through holes 31 are arranged in a matrix on the relay substrate 30, and spiral contacts 40 are provided above the individual through holes 31. Further, the same spiral contact may be provided below each through-hole 31, or as shown in FIG. 7A, a convex projecting in the Z2 direction shown in the figure instead of the spiral contact. A configuration in which the bumps 34 are formed may be used.

  The spiral contact 40 has a ring-shaped base portion on the outer peripheral side as described above, and has a spiral contact portion 42 extending from the base portion toward the center of the through hole 31. And the contact part 42 of the said spiral contactor 40 is formed in the three-dimensional shape which protrudes in convex shape as it goes to the front-end | tip part from the said base part.

  As shown in FIG. 7A, a connection board 50 is provided below the relay board 30. 7B and 7C, the configuration of the through hole 31 and the connection substrate 50 is omitted.

  On the surface of the connection substrate 50, land connection parts 51 are arranged in a matrix facing the spiral contacts or convex bumps 34 provided on the lower surface of the relay substrate 30.

  When what is provided on the lower surface of the relay substrate 30 is a spiral contact, the spiral contact is connected to the land connection portion 51 by being pressed. On the other hand, in the case of the convex bump 34 as shown in FIG. 7A, it is connected to the land connection portion 51 via soldering or a conductive adhesive.

  As shown in FIGS. 6 and 7, openings 11a and 11b that open in a rectangular shape with the X direction shown in the drawing as a long side are formed on both walls facing the Y direction among the four wall surfaces forming the loading portion 11A. Is formed. The openings 11a and 11b are provided with a pair of moving members 61 and 62 that move relatively in the Y direction in the figure.

  As shown in FIGS. 7A to 7C, the moving members 61 and 62 protrude from the openings 11a and 11b and are pressed portions 61A and 62A formed by convex curved surfaces, and the pressed portions 61A and 62A. And a plurality of protection parts 61a, 61b, 61c and protection parts 62a, 62b, 62c extending in the Y direction.

  The protective portions 61a, 61b, 61c on the moving member 61 side are formed in a strip shape (or also called a rectangular shape) having a long side in the Y direction and a short side in the X direction, and the protective portions 61a, 61b. And 61c are provided so as to be arranged with a predetermined space in the X direction orthogonal to the moving direction (Y direction). Similarly, the protective portions 62a, 62b, 62c on the moving member 62 side are also formed in a strip shape (also referred to as a rectangular shape) having a long side in the Y direction and a short side in the X direction, and each protective portion 62a, 62b and 62c are provided so as to be lined up with a predetermined space in the X direction.

  In the moving member 61, the inner edge portions of the protection portions 61a and 61c provided at both ends in the X direction and both edge portions (both edge portions extending in the Y direction) of the protection portion 61b provided in the center are provided. A plurality of semi-small holes 63a having a semicircular shape are formed with a predetermined pitch dimension in the longitudinal direction (Y direction in the drawing). Similarly, a plurality of semi-small holes 63b are formed in the longitudinal direction on the moving member 62, on the inner edges of the protection parts 62a and 62c, and on both edges (both edges extending in the Y direction) of the protection part 62b. It is formed with a predetermined pitch dimension (in the Y direction in the drawing). The predetermined pitch dimension is set to the vertical and horizontal pitch dimensions of the plurality of external connection portions 1a provided in a matrix on the lower surface of the electronic component 1.

  7A and 7B, the protection portions 61a, 61b, and 61c and the protection portions 62a, 62b, and 62c are alternately arranged in the X direction. That is, the protection part 62b on the other moving member 62 side is arranged in the space between the protection part 61a and the protection part 61b on the one moving member 61 side, and the protection part 61b and the protection part 61c on the one moving member 61 side are arranged. A protective part 62c on the other moving member 62 side is disposed in the space between the two. At the same time, the protective part 61a on the one moving member 61 side is arranged in the space between the protective part 62a on the other moving member 62 side and the protective part 62b, and the protective part 62b on the other moving member 62 side, The protective part 62b on the one moving member 62 side is arranged in the space between the protective parts 62c.

  As shown in FIG. 7A, the inner wall in the Y direction of the socket 11 is provided with first urging members S1 and S1 formed of leaf springs or the like, and the moving member 61 and the moving member 62 are mutually connected. It is energized in the approaching direction.

  The relay board 30 is provided at a position below the protection parts 61a, 61b, 61c and the protection parts 62a, 62b, 62c. Second urging members S <b> 2 and S <b> 2 are provided at a position lateral to the relay substrate 30 and at the bottom of the socket 11. The moving members 61 and 62 are elastically supported by the second urging members S2 and S2 so as to be movable in the Z1 direction shown in the drawing.

  The operation of the connecting device using the spiral contact shown in the third embodiment will be described.

  As shown in FIGS. 6A and 7A, in the initial state where the electronic component 1 is not mounted on the loading portion 11A, the moving member 61 and the moving member 62 are driven by the urging force of the first urging members S1 and S1. And are set so as to be closest to each other. In this state, the pressed parts 61A and 62A are projected from the openings 11a and 11b toward the loading part 11A, and the opposing distance between the pressed part 61A and the pressed part 62A is an electronic component. 1 or less in the width direction in the Y direction.

  In the initial state, the plurality of semi-small holes 63a formed in one of the protective portions 61a, 61b, 61c and the plurality of semi-small holes 63b formed in the other protective portions 62a, 62b, 62c are alternately arranged. The positions are shifted in the Y direction in the figure at a pitch corresponding to a half cycle so as to be arranged. For this reason, the whole of the plurality of spiral contacts 40 arranged in a matrix on the relay substrate 30 is formed by the semi-small holes 63a formed in the protection portions 61a, 61b, 61c and the protection portions 62a, 62b, 62c. Direct exposure through 63b can be prevented.

  Next, as shown in FIG. 7B, when the electronic component 1 is mounted on the loading portion 11A, both side portions in the Y direction of the electronic component 1 press the pressed portions 61A and 62A in both directions, so that the moving member 61 and 62 are relatively moved in directions away from each other while resisting the urging force of the first urging members S1 and S1. The moving members 61 and 62 are moved until the facing distance between the pressed portion 61A and the pressed portion 62A matches the width dimension of the electronic component 1 in the Y direction.

  As shown in FIG. 6B, when the facing distance between the pressed portion 61A and the pressed portion 62A matches the width dimension in the Y direction of the electronic component 1, the pitch misalignment for the half cycle is eliminated. It has come to be. Therefore, the one protection part 61a, 61b, 61c and the other protection part 62a, 62b, 62c are relatively moved, and the one small protection part 61a, 61b, 61c formed on the one protection part 61a, 61b, 61c. The plurality of small holes 63 are formed in a matrix by integrally combining the holes 63a and the semi-small holes 63b formed in the other protective portions 62a, 62b, and 62c. At this time, as shown in FIGS. 6B and 7B, the plurality of small holes 63 formed in the matrix form face the plurality of spiral contacts 40 arranged in the matrix form on the surface of the relay substrate 30. It is set as follows.

  Here, when the cover 12 is rotated in the closing direction and the lock portion 15 on the cover 12 side is locked to the locked portion 14 of the socket 11, the pressing convex portion 12 a of the cover 12 becomes the upper surface of the electronic component 1. Is pressed in the Z1 direction. The electronic component 1 is moved in the Z1 direction in the figure. At this time, since the bottom surface of the electronic component 1 presses the moving members 61 and 62 in the Z1 direction in the figure, the electronic component 1 and the moving members 61 and 62 are moved. The second urging members S2, S2 are lowered together in the Z1 direction while resisting the urging force of the second urging members S2, S2.

  At this time, as shown in FIG. 7C, the spiral contact 40 disposed on the relay substrate 30 enters the small hole 63 formed by the moving members 61 and 62. Therefore, the tip of the contact portion 42 that forms each spiral contact 40 is brought into contact with each external connection portion 1 a formed on the bottom surface of the electronic component 1. Thereby, it becomes possible to electrically connect each external connection portion 1 a and each land connection portion 51 formed on the connection substrate 50.

  When the lock between the lock portion 15 and the locked portion 14 is released and the cover 12 is opened, the electronic component 1 and the moving members 61 and 62 are moved by the urging force of the second urging members S2 and S2. It is lifted in the Z1 direction. Therefore, it returns to the mounting state shown in FIG. 7B in which the electrical connection between the external connection portion 1a of the electronic component 1 and the spiral contact 40 on the relay substrate 30 is released.

  When the electronic component 1 is further removed from the loading portion 11A, the urging force of the first urging members S1 and S1 moves the moving member 61 and the moving member 62 relative to each other in a direction approaching each other. The initial state shown in FIG. 7A is restored.

  As described above, in the third embodiment of the present invention, in the initial state shown in FIGS. 6A and 7A, the semi-small holes provided in the protection portions 61a, 61b, 61c on the moving member 61 side. 63a and the semi-small holes 63b provided in the protection portions 62a, 62b, 62c on the moving member 62 side are displaced in the Y direction, so that the spiral contact 40 on the relay substrate 30 is completely exposed. Functions as a protective cover to prevent Therefore, the spiral contact 40 on the relay substrate 30 can be protected.

  When the mounting state shown in FIGS. 6B and 7B is reached, the small hole 63 in which the semi-small hole 63a and the semi-small hole 63b function as relay means can be formed. Therefore, the spiral contact 40 and the external connection part 1a on the electronic component 1 side can be directly connected via the small hole 63.

  In the third embodiment, the moving members 61 and 62 are biased toward each other in the initial state and are separated from each other in the mounted state. However, the present invention is not limited to this, and it may be biased in the direction of separating from each other in the initial state, and may come close to each other in the mounted state.

The perspective view which shows the external appearance of the connection apparatus using the spiral contactor of this invention, A plan view showing the entire protective sheet, FIG. 2 is an enlarged plan view showing a part of the protective sheet (part A in FIG. 2); FIG. 3 is a cross-sectional view taken along line B-B of FIG. 3 as the first embodiment of the connection device of the present invention, and a cross-sectional view before mounting an electronic component; FIG. 3 is a cross-sectional view taken along line BB in FIG. 3 as a first embodiment of the connection device of the present invention, and a cross-sectional view after mounting electronic components; FIG. 4C is a cross-sectional view similar to FIG. 4A as a second embodiment of the present invention, and a cross-sectional view before mounting electronic components; 4B is a cross-sectional view similar to FIG. 4B as a second embodiment of the present invention, FIG. 5B is a cross-sectional view after mounting electronic components, FIG. 5 is a plan view showing an initial state of the spiral contactor connecting device according to the third embodiment of the present invention before electronic components are mounted; FIG. 5 is a plan view showing a connection state of the spiral contactor as the third embodiment of the present invention after the electronic component is mounted; Sectional drawing in the AA of FIG. 6A, Sectional drawing in the BB line of FIG. 6B, FIG. 6B is a cross-sectional view showing the connection state in which the external connection portion of the electronic component is in contact with the spiral contact,

Explanation of symbols

1 Electronic Component 1a External Connection Unit 10 Electronic Component Connection Device (Inspection Device)
11 Socket 11A Loading part 11a, 11b Opening part 20 Protection sheet 21 Hole (relay means)
22 Connecting member (relay means)
22a Flat surface 22b Convex body 30 Relay substrate 31 Through hole 34 Convex bump 40 Spiral contact 40A First spiral contact 40B Second spiral contact 50 Connection substrate 51 Land connection portions 61, 62 Moving members 61a, 61b , 61c, 62a, 62b, 62c Protection part 63 Small hole (relay means)
63a, 63b Semi small hole S1 1st urging member S2 2nd urging member

Claims (11)

A substrate having a plurality of through holes and a spiral contact provided in each through hole, and a plurality of external connection portions provided in the electronic component are connected via the plurality of spiral contacts. In a connecting device using a spiral contact
A protective sheet is provided between the electronic component and the substrate, and this protective sheet is provided with a relay means for directly or indirectly connecting individual spiral contacts and individual external connection portions. A connecting device using a spiral contact, characterized in that   The connecting device using a spiral contact according to claim 1, wherein the relay means is a hole formed in the protective sheet.   In the relay means, a flat surface provided on one surface side of the protective sheet so as to face the spiral contactor and a convex body provided on the other surface side so as to face the external connection portion are integrated. The connecting device using a spiral contact according to claim 1, wherein the connecting device is a connecting member formed of   The spiral contact has a first spiral contact formed at a position facing the external connection portion, and a second spiral contact formed at a position not having the external connection portion of the electronic component. The connecting device using a spiral contact according to any one of claims 1 to 3, wherein the second spiral contact supports the protective sheet.   The connecting device using a spiral contact according to claim 4, wherein a height dimension of the second spiral contact is formed higher than a height dimension of the first spiral contact.   The connection device using a spiral contact according to claim 1, wherein the protective sheet is supported so as to be movable in a vertical direction intersecting the substrate. There are provided a plurality of sockets provided with a loading unit on which electronic components having a plurality of external connection units are mounted, and a plurality of spiral contacts provided in the loading unit and in contact with the external connection unit for electrical connection. A connecting device using a spiral contactor provided with a substrate,
A pair of moving members are provided on the upper side of the substrate and facing the plurality of spiral contacts, each having a plurality of semicircular semi-small holes and relatively moving in the loading portion. ,
In an initial state before the electronic component is mounted on the loading unit, the semi-small holes of one moving member and the semi-small holes of the other moving member are alternately arranged to completely expose the spiral contactor. Is prevented,
When the electronic component is mounted on the loading portion, the moving member is moved in a direction opposite to each other, so that the semi-small hole of the one moving member and the semi-small hole of the other moving member Are combined together to form a plurality of small holes, whereby the spiral contact and the external connection portion can be connected via the small holes. The connected device that was.   The moving member includes a plurality of strip-shaped protective portions arranged with a predetermined space in a direction perpendicular to the moving direction of the moving member, and a predetermined pitch along the moving direction at an edge of the protective portion. The connection using the spiral contact according to claim 7, wherein the protective portion of the one moving member is movably disposed in the space of the other moving member. apparatus.   In the socket, a cover that presses the electronic component in a direction approaching the substrate is rotatably supported, and when the cover is closed from a mounting state in which the electronic component is mounted on the loading unit, The connection device using a spiral contact according to claim 7 or 8, wherein the electronic member is moved in a direction approaching the substrate, and the spiral contact is connected to the external connection portion through the small hole.   The connection device using a spiral contact according to claim 7, wherein a first biasing member that biases the pair of moving members in a moving direction approaching each other is provided.   The connection device using a spiral contact according to claim 7, wherein a second urging member that movably supports the pair of moving members is provided.

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