JP2005283885A - Substrate for liquid crystal display panel and its cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for a liquid crystal display panel whose variance in a cracking direction can be suppressed when cut to a specified size while corrosion of an electric wire is prevented and its cutting method. <P>SOLUTION: On the substrate 1 for the liquid crystal display panel where the electric wire 5 connected to a switching element 2 is formed, flattening films 4b and 4c for cutting are formed on cutting lines 3b and 3c for cutting of the substrate 1 for the liquid crystal display panel so as to have a specified width and to be crossed on the electric wire 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a liquid crystal display panel in which a flattening film that covers a switching element or the like and flattenes the surface is formed like a glass for a liquid crystal display panel, and an electric wiring connected to the switching element is formed. The present invention relates to a substrate for cutting and its cutting method.

  Conventionally, in a liquid crystal display device, a substrate for a liquid crystal display panel and a counter substrate are arranged to face each other with a liquid crystal layer interposed therebetween, and a plurality of pixel electrodes arranged in a matrix form and these pixel electrodes are arranged to face each other. A counter electrode as a common electrode is provided, and liquid crystal as a display medium is interposed between the two electrodes. When displaying in the display area, a potential is selectively written to the pixel electrode, and the liquid crystal optically modulated by the potential difference between the pixel electrode and the counter electrode is visually recognized as a display pattern. Become.

On the pixel electrode of such a liquid crystal display device, a planarizing film (interlayer insulating film) that covers the switching element and planarizes the surface is formed, and a transparent electrode is formed on the planarizing film. The planarizing film at this time has a role for maintaining a uniform potential between the pixel electrode and the counter electrode and a role for realizing a high aperture ratio. In a transflective liquid crystal display device having both a reflective display area and a transmissive display area, a flattening film for flattening the unevenness of the reflective layer is formed on the reflective layer having the unevenness for reflecting external light. The transparent electrode is laminated thereon. In the liquid crystal display substrate in which the electrical wiring is arranged in a matrix, the electrical wiring is drawn to the outside (frame area) of the substrate and connected to the short ring for the purpose of preventing static electricity defects and electrical inspection. Yes. This short ring is cut in the step of cutting out the substrate for the liquid crystal display panel.
JP-A-11-179694

  By the way, in a method for manufacturing a substrate for a liquid crystal display panel in which electrical wiring is arranged in a matrix, a pair of mother glass substrates (a substrate for a liquid crystal display panel and a counter substrate) on which electrical wiring is formed are bonded together. After forming a panel, it is cut into a predetermined size (one screen or several screens) (also called “scribe”, “divided” or “cleavage”), or for a pair of liquid crystal display panels on which electrical wiring is formed. After the substrate and the counter substrate are cut out to a predetermined size, they are bonded together to form a panel. It is also performed when the short ring is cut. However, when the cutting is performed in this cutting process, the electric wiring has a problem of being corroded by moisture or the like. Measures to prevent this include forming a protective layer on top of the electrical wiring layer, but this protective layer does not take into account the direction of the cutting direction, so when cutting along the cutting line There has been a problem in that the crack direction of the substrate varies, that is, cracks occur other than the cutting line during cutting.

  In addition, as a method for cutting a substrate for a liquid crystal display panel, there is a method of cutting after applying a cutting tape to a substrate for a liquid crystal display panel as in Patent Document 1, which is a manufacturing process of a substrate. In addition, it has the complexity of having to specially prepare a tape.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a liquid crystal display panel substrate capable of suppressing variations in cracking direction when cutting out a liquid crystal display panel substrate to a predetermined size while preventing the problems of conventional electrical wiring corrosion. And a cutting method thereof.

  The substrate for a liquid crystal display panel according to claim 1 of the present invention is a substrate for a liquid crystal display panel in which electrical wiring connected to a switching element is formed, and the flattening film for cutting is a substrate for a liquid crystal display panel. It is formed with a predetermined width on a cutting line for cutting, and is arranged so as to intersect on the electric wiring. According to a fourth aspect of the present invention, there is provided a method for cutting a substrate for a liquid crystal display panel, the method for cutting a substrate for a liquid crystal display panel in which electrical wiring connected to a switching element is formed. Is formed with a predetermined width also on a cutting line for cutting out the substrate for the liquid crystal display panel, and a flattening film for cutting is arranged so as to intersect on the electric wiring, thereby flattening for cutting. A cutting line for cutting a substrate for a liquid crystal display panel is cut through the insulating film. Here, in a transflective liquid crystal display device having both a reflective display region and a transmissive display region, a flattening film for flattening the unevenness of the reflective layer is formed on the reflective layer having the unevenness for reflecting external light. Although it is formed, such a flattening film may be used regardless of its type. However, as the flattening film for cutting, a flattening film that covers the switching element and flattens the surface is preferable because it is performed in a process close to the order of forming the electric wiring.

  According to these inventions, the flattening film for cutting out is formed with a predetermined width on the cutting line for cutting out the substrate for the liquid crystal display panel, so that in the step of cutting out the substrate for the liquid crystal display panel, Even if the drawn electrical wiring is cut, the cutting flattening film plays a role of preventing corrosion and can suppress variation in the cracking direction during cutting.

  A substrate for a liquid crystal display panel according to a third aspect of the present invention is based on the premise of the first aspect, wherein the flattening film for cutting is not formed at a predetermined interval in a perforation shape. Is provided.

  According to the present invention, the cut-out flattening film is formed in a perforated pattern at predetermined intervals, so that a cut is formed when cutting in advance. It becomes easy to cut along the line, and variation in the cracking direction can be suppressed during cutting.

  In the substrate cutting method for a liquid crystal display panel according to claim 5 of the present invention, on the premise of the invention according to claim 4, the flattening film for cutting covers the switching element to flatten the surface. It is characterized in that it is formed when the flattening film is formed.

  According to the present invention, the flattening film for cutting is formed at a time in the process of forming the flattening film that covers the switching elements and the like to flatten the surface.

  According to the substrate for a liquid crystal display panel and the cutting method thereof of the present invention, the flattening film for cutting is also formed with a predetermined width on the cutting line for cutting the substrate for the liquid crystal display panel. In the process of cutting out a substrate for a liquid crystal display panel, even if the electrical wiring drawn out is cut, the flattening film for cutting plays a role in preventing corrosion and also suppresses variation in crack direction during cutting. it can. In addition, by forming a pattern on the flattening film for cutting at a predetermined interval in the form of perforations, it becomes easy to cut along the cutting line at the time of cutting, and it becomes possible to reduce cutting defects.

  According to the method for cutting a substrate for a liquid crystal display panel according to claim 5 of the present invention, the flattening film for cutting is formed at a time in the process of forming the flattening film that covers the switching elements and flattens the surface. Since the film is formed, it is not necessary to attach a cutting tape specially for cutting after manufacturing as in the prior art.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  In this embodiment, the present invention is applied to an active matrix type liquid crystal display substrate, that is, a substrate for a liquid crystal display panel, and a TFT (Thin Film Transistor) in which an electric wiring pattern is formed on the substrate for a liquid crystal display panel It is. This liquid crystal display device has a configuration in which an array substrate for a liquid crystal display panel and a counter substrate are disposed to face each other with a liquid crystal layer interposed therebetween.

  As shown in FIGS. 1 and 2, the array substrate 1 for a liquid crystal display panel is provided with a plurality of gate lines and data lines for supplying signals to the TFTs so as to be orthogonal to each other. A plurality of pixel electrodes controlled by TFTs provided corresponding to the intersections with the data lines are arranged in a matrix. An array substrate 1 for a liquid crystal display panel is made of a transparent resin whose surface is flattened so as to eliminate a step caused by the switching element 2 on the surface facing the counter substrate C such as a glass substrate. A film (interlayer insulating film) 4a is formed, and a transparent electrode is formed on the planarizing film 4a.

  On the other hand, the counter substrate (color filter substrate) C facing the array substrate 1 for the liquid crystal display panel includes a color filter, a counter electrode made of a transparent conductive material such as ITO, and an alignment film (not shown). Arranged in this order. A retardation plate and a polarizing plate are disposed on the main surface opposite to the liquid crystal layer of the array substrate 1 for a liquid crystal display panel, and on the other hand, a retardation plate and a polarizing plate are also provided on the counter substrate (color filter substrate) C. Is arranged.

  In the array substrate 1 for the liquid crystal display panel, the area of the TFT substrate 1 is larger than the area of the color filter substrate C, and when the array substrate 1 for the liquid crystal display panel and the color filter substrate C are bonded together, A region where a part of the array substrate 1 protrudes is provided (reference numeral 7 in FIG. 2). The electrical wiring 5 formed in the protruding region 7 of the TFT substrate 2 is connected to the short ring 6 in order to prevent electrostatic breakdown in the manufacturing process. Before the liquid crystal substrate 1 is mounted, the short ring 6 is cut by cutting the TFT substrate 1 along the cutting line 3 c and separating the cut and removal 7 including the short ring 6. The cutting lines 3b and 3c are lines that are cut with a diamond needle or the like.

  In order to manufacture the substrate 1 for the liquid crystal display panel, a switching element 2 such as a TFT is formed on an insulating substrate such as a glass substrate, and the surface is flattened so as to eliminate a step caused by the switching element 2. After the planarization film (interlayer insulating film) 4a made of transparent resin is formed, a transparent electrode is formed on the planarization film 4a (FIG. 1). When the flattening film (interlayer insulating film) 4a is formed, the flattening film (cutting film) is also formed on the cutting line 3b in the cutting process of the substrate 1 for the liquid crystal display panel and also at the position to be the cutting line 3b. Flattening film) 4b is formed (FIG. 2). Further, when the cutting line is at a position where the short ring 6 is cut, the electric wiring 5 is also drawn out to the partially protruding region 7, but above the drawn electric wiring 5 and above the cutting line 3c. The flattening film (cutting flattening film) 4c is also formed at this position (FIG. 3). Thus, the flattening film 4c for cutting is not formed so as to cover all of the electric wiring 5, but only on the cutting lines 3b and 3c in the cutting process of the substrate 1 for the liquid crystal display panel with a predetermined width. Form. The cut-out planarizing films 4b and 4c are also formed in the perforated pattern 8 at a predetermined interval (a region that is not patterned) where the flattening films 4b and 4c are not formed. It is also possible to form a film over the entire area on the cutting lines 3b and 3c. In either case, the planarizing films 4b and 4c for cutting were formed by photolithography. As a result, since the electrical wiring 5 is arranged in an XY matrix, the electrical wiring 5 comes to intersect with the cutting flattening films 4b and 4c, and is arranged below the cutting flattening films 4b and 4c. The Rukoto. Note that when the region 8 in which the planarizing films 4b and 4c are not formed is formed into a perforated pattern, at least the planarizing films 4b and 4c are formed on the electric wiring 5.

  Then, in the step of cutting out the substrate 1 for a liquid crystal display panel, it is cut out to a predetermined size (one screen or several screens). In the cutting process, a pair of mother glass substrates (the liquid crystal display panel substrate 1 and the counter substrate C) on which the electrical wiring 5 is formed are bonded together to form a panel, and then a predetermined size (one screen or several screens). Or the substrate 1 for the liquid crystal display panel on which the electric wiring 5 is formed and the counter substrate C are cut out to a predetermined size and then bonded together to form a panel. It is also performed when the short ring 6 is cut.

  First, when the short ring 6 is cut, as shown in FIG. 2, it is cut out along the cutting line 3c. However, even if the electric wiring 5 is cut off at the cutting position, the flattening film 4c for cutting is formed thereon. Therefore, it is possible to suppress the variation in the cracking direction that breaks off from the cutting line 3c during cutting. The cut state at this time is shown in FIG. Next, when the pair of mother glass substrates 1 and C on which the electrical wiring 5 is formed are cut out to a predetermined size, as shown in FIG. 3, the cutting is performed along the cutting line 3b. Even when cut, since the flattening film 4b for cutting is coated thereon, it plays a role of preventing corrosion and can suppress variation in the cracking direction of the cutting line 3c during cutting. The cut state at this time is shown in FIG.

  Here, in the case where the portions 8 where the flattening films 4b and 4c for cutting are not formed in a perforation at a predetermined interval are provided, the flattening films 4b and 4c for cutting are patterned by photolithography. Since regions and non-patterned regions are alternately provided, and the non-patterned region 8 is cut in advance in the cutting lines 3b and 3c, it is cut out in that direction, and variation in the cracking direction of the substrate 1 when cutting, That is, a situation where cracks other than the cutting lines 3b and 3c occur during cutting is prevented. Therefore, it becomes easy to cut along the cutting lines 3b, 3c at the time of cutting, and cutting defects can be reduced. On the other hand, when the film is formed over the entire area on the cutting lines 3b and 3c without a predetermined interval, there is an advantage that the film can be formed easily so as to protect all of the electric wiring 5.

  In a transflective liquid crystal display device having both a reflective display area and a transmissive display area, a flattening film and a transparent film for flattening the unevenness of the reflective layer on the reflective layer having an unevenness for reflecting external light It is set as the structure which laminated | stacked the electrode in this order. The flattening films 4b and 4c for cutting formed on the electric wiring 5 of the present embodiment are formed on the electric wiring 5 when the flattening film for flattening the unevenness of the reflective layer is formed. It is also possible to form a film.

  As described above, according to the present invention, if the substrate for a liquid crystal display panel forms a flattening film, the cutting line 3b is used by utilizing the flattening film manufacturing process regardless of the type of the flattening film. , 3c.

It is a principal part schematic sectional drawing which shows an example of the board | substrate for liquid crystal display panels to which this invention is applied. It is a plane schematic diagram of the board | substrate for liquid crystal display panels which are one Embodiment of this invention. It is a plane schematic diagram of the board | substrate for liquid crystal display panels which are one Embodiment of this invention. It is sectional drawing which shows the state which cut | disconnected the cutting line of the cutting-out process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate for liquid crystal display panel 2 Switching element 3b, 3c Cutting line 4a of substrate for liquid crystal display panel Flattening film (interlayer insulating film) arranged in display area
4b, 4c Flattening film 5 for cutting 5 Electrical wiring 6 Short ring 8 Perforated substrate C (color filter substrate) where the perforated flattening film is not formed

Claims (5)

  In the substrate for the liquid crystal display panel in which the electrical wiring connected to the switching element is formed, the planarizing film for cutting is formed with a predetermined width on the cutting line for cutting out the substrate for the liquid crystal display panel, A substrate for a liquid crystal display panel, wherein the substrate is arranged so as to intersect on the electric wiring.   2. The substrate for a liquid crystal display panel according to claim 1, wherein the flattening film for cutting is a flattening film that covers a switching element to flatten the surface.   2. The substrate for a liquid crystal display panel according to claim 1, wherein the cut-out planarizing film is provided with portions that are not formed in a perforated pattern at a predetermined interval.   In a method for cutting a substrate for a liquid crystal display panel in which electrical wiring connected to a switching element is formed, a predetermined width is also provided on a cutting line for cutting out the substrate for the liquid crystal display panel by a flattening film for cutting out the substrate for the liquid crystal display panel The flattening film for cutting is arranged so as to intersect on the electric wiring, and the cutting line for cutting the substrate for the liquid crystal display panel is cut through the flattening film for cutting. A method of cutting a substrate for a liquid crystal display panel.   5. The substrate for a liquid crystal display panel according to claim 4, wherein the flattening film for cutting is formed when a flattening film is formed to cover the switching element and flatten the surface. Cutting method.

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