JP2005317353A - Modular jack connector - Google Patents

Abstract

A modular jack connector having good electrical characteristics such as near-end crosstalk attenuation is realized even in a frequency band of 100 MHz or higher.
In a printed circuit board 29 used for a modular jack connector, conductor patterns L3 and L5 are formed on the surface of the printed circuit board 29, and conductor patterns L4 and L6 are formed on the back surface of the printed circuit board 29. The conductor patterns L3 and L5 and L4 and L6 formed on the front surface and the back surface are respectively provided with parallel portions L9 and L10 having substantially the same length and the same interval.
[Selection] Figure 4

Description

  The present invention relates to a modular jack connector suitable for a wiring system using twisted wires.

  In recent years, introduction of LAN (Local Area Network) has been very active in offices and the like. Many of the information wiring systems constituting LANs in offices and the like are performed using 4-pair unshielded twisted wires (hereinafter referred to as 4-pair UTP cables) that are relatively easy to install and change.

  FIG. 8 shows a typical wiring system diagram of an information wiring system that supervises a data system and a telephone system using the 4-pair UTP cable.

  An information wiring system 80 shown in FIG. 8 has an IDF 82 (Intermediate Distribution Panel) installed on each floor of a building centered on an MDF 81 (Main Distribution Frame), and each floor has a required number of outlet boxes 83 centered on the IDF 82. Furthermore, wiring is made to each terminal device 85 via a next-stage outlet box 84 connected therebelow.

  9 and 10 show the modular connector type patch panel 90 and the outlet box 100. FIG. As shown in these drawings, a plurality of modular jacks or modular jack connectors are arranged side by side on the modular connector type patch panel 90 and the outlet box 100.

  As shown in FIG. 11, the modular jack 110 includes a hollow housing 112 having an opening 111 for inserting a modular plug (not shown), and eight conductors incorporated in the housing 112. The pin 113 is configured.

  FIG. 12 shows a cross-sectional view of the modular jack 110. As shown in FIG. 12 (a), the conductor pin 120 of the modular jack has a shape bent convexly from the inside of the housing 112 toward the opening 111, and the convex bent portion 121, A protrusion 122 that contacts the conductor of the modular plug and a leg 123 that extends through the housing 112 to the outside of the housing 112 are provided.

  As shown in FIG. 12B, the conductor pins 120 are arranged such that all the bent portions 121 are located at the same distance from the opening 111. When the direction through which the leg portion 123 of the conductor pin 120 penetrates is the downward direction, the eight conductor pins 113 face the housing 112 from the opening portion 111 and are first to eighth in the arrangement order from the conductor pin corresponding to the right end. No. 1 and No. 2, No. 3 and No. 6, No. 4 and No. 5, and No. 7 and No. 8 conductor pins are respectively paired conductors. The distance from the opening 111 of the housing of the leg portion 123 of the conductor pin is different between the odd-numbered conductor pin and the even-numbered conductor pin, and the odd-numbered pin and the even-numbered pin are arranged in two rows in the front and rear. (This arrangement is hereinafter referred to as a staggered arrangement).

  In addition, a 4-pair UTP cable is connected to a modular plug (not shown), and the twisted wires of each pair are modular jacks 1 and 2, 3 and 6, 4 and 5, and 7, respectively. Conductor wires connected to the eighth conductor pin are twisted at different pitches.

FIG. 13 shows a modular jack connector 130. The modular jack connector 130 is obtained by mounting a modular jack 110 and a so-called 110 type press contact terminal array 132 on a printed circuit board 131.
JP 2003-338347 A

  Such an information wiring system is usually constructed to have a long life cycle. This is because, after laying the wiring in advance with the preceding wiring, even if the performance of the communication equipment is improved and the communication device is replaced, the information wiring system is not replaced. This is because the cost due to the change of the wiring layout due to the change of the terminal arrangement or the like is suppressed. As described above, since the information wiring system using the preceding wiring needs to cope with the upgrade of the communication device in advance, the required electrical characteristics are very high.

  There are ISO / IEC11801, ANSI / TIA / EIA-568B, and the like as international standards for determining electrical characteristics related to this information wiring system. In these standards, standards for designing an information wiring system are defined, and the performance level in an information wiring system using a pair of unshielded wires is also defined. Among them, there is a so-called Cat6 (Category6) defined in ANSI / TIA / EIA-568B as particularly demanding electrical characteristics. In Cat6, the near-end crosstalk attenuation at 100 MHz is 54 dB or more. 46 dB or more is required as near end crosstalk attenuation at 250 MHz.

  However, it has been very difficult to satisfy the required amount of crosstalk attenuation with the conventional modular jack connector as described above.

  That is, considering the electromagnetic coupling of mutual capacitance and mutual inductance in the modular jack, the near-end and far-end crosstalk attenuation amounts between the No. 1 and No. 2 conductor pins and the No. 3 and No. 6 conductor pins are closest. Since the connection between No. 2 and No. 3 has a strong influence, it deteriorates. Furthermore, considering the electromagnetic coupling between the No. 3 and 6 conductor pins and the No. 4 and 5 conductor pins, the No. 3 and 6 conductor pins are wide open so as to sandwich the No. 4 and 5 conductor pins. There are two pairs of the closest pins, the third and fourth conductor pins and the fifth and sixth conductor pins. For this reason, the near-end and far-end crosstalk attenuation between the third and sixth conductor pins and the fourth and fifth conductors deteriorates the most in all combinations of the pair of conductors. Such deterioration of near-end and far-end crosstalk attenuation becomes particularly significant in a frequency region of 100 MHz or higher.

  In order to solve this problem, it is necessary to reduce the coupling between the conductors or cancel the coupling by a component other than the modular jack.

  For example, in the modular jack described in Japanese Patent Application Laid-Open No. 2003-338347, the bent portions of the third and sixth conductor pins are positioned in front of the bent portions of the other conductor pins (in the direction of the opening of the modular jack). There is described a modular jack connector that suppresses electromagnetic coupling with other conductor pins by positioning the leg portions of the third and sixth conductor pins in front of the other conductor pins. However, this method has a problem that the manufacturing cost increases because the conventional modular jack parts cannot be used as they are.

  Accordingly, an object of the present invention is to realize a modular jack connector having good electrical characteristics such as near-end crosstalk attenuation even in a frequency band of 100 MHz or higher.

  In order to achieve the above object, a modular jack connector according to the present invention includes hollow housings having openings, and are incorporated in rows inside the housings, and each extends through the housing to the outside of the housing. A modular jack connector comprising eight conductor pins, a printed circuit board connected to a portion of the conductor pins extending to the outside of the housing, and eight pressure contact terminal pins connected to the printed circuit board. The printed circuit board is formed with eight conductor patterns for connecting the conductor pins and the pressure contact terminal pins, and among the conductor patterns, the conductor pins located at the third and fifth positions from one end of the conductor pin row; The conductor pattern to be connected is formed on one surface of the printed circuit board and has a parallel part in a part thereof. The conductor pattern connected to the fourth and sixth conductor pins from one end of the conductor pin row is formed on the other surface of the printed circuit board and has a parallel portion in a part thereof. The two parallel portions have the same length and the same interval.

  It is desirable that the conductor pattern has a single path from the conductor pin to the press contact terminal.

  Also, it is desirable that a conductor pattern connected to the fifth conductor pin is formed between the first and third conductor pins from the one end of the conductor pin row and between the second and fourth pins.

  Further, it is desirable that a conductor pattern connected to the third conductor pin is formed between the fourth conductor pin and the sixth conductor pin from one end of the conductor pin row.

  Furthermore, the conductor pins may have a staggered arrangement.

  According to the present invention, by providing two parallel conductor patterns on a printed circuit board, high near-end crosstalk attenuation, far-end crosstalk attenuation, and reflection attenuation can be realized in a frequency band of 100 MHz or higher.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the modular jack 9 used in the modular jack connector of the present invention includes a hollow housing 10 having an opening 11 for inserting a modular plug (not shown), and an inside of the housing 10. The first to eighth conductor pins P1 to P8 are provided.

  The conductor pins P <b> 1 to P <b> 8 of the modular jack 9 are bent in a convex shape from the inside of the housing 10 toward the opening portion 11, and the bent portion 12 and the protruding portion 13 that contacts the conductor of the modular plug. And a leg portion 14 penetrating the housing 10 and extending to the outside of the housing 10. The conductor pins P1 to P8 are arranged at equal intervals of 1.016 mm, and the tips of the bent portions 12 are located at an equal distance from the opening portion 11. Furthermore, the conductor pins P1 to P8 are arranged in a staggered arrangement as viewed from the top of the housing 10, that is, the distance from the opening 11 of the housing to the leg 14 is an odd number of the conductor pins P1, P3, P5, P7 and even-numbered conductor pins P2, P4, P6, and P8 are provided differently.

  FIG. 2 shows the modular jack connector of the present invention. The modular jack connector 20 according to the present invention includes a printed circuit board 29, a modular jack 9 mounted on the printed circuit board 29, and a press contact terminal array 30. The leg portions 14 of the conductor pins of the modular jack 9 are electrically connected to the printed circuit board 29 by soldering or the like.

  As shown in FIG. 3, the press contact terminal array 30 includes eight press contact terminal pins 31 each having a blade portion 32 for inserting a TP cable and a lead portion 33 for soldering to a printed circuit board 29. It is. The lead portion 32 of the press contact terminal pin is bonded and electrically connected to the printed circuit board 29 by soldering or the like. Here, a so-called 110 type is used as the press contact terminal array 30, but the present invention is not limited to this.

  As described above, the modular jack connector 20 of the present embodiment uses the same modular jack and pressure contact terminal array used in the conventional modular jack connector.

  Next, the conductor pattern of the printed circuit board 29 that is a feature of the present invention will be described.

  The printed circuit board 29 according to the present invention has a conductor pattern as shown in FIG. 4A shows a conductor pattern on the surface (front surface) to which the modular jack of the printed circuit board 29 is fixed, and FIG. 4B shows a conductor pattern on the other surface (back surface) of the printed circuit board 29. 4B shows a conductor pattern when the back surface is seen through the printed board 29 from the front surface side.

  The printed circuit board 29 is formed with through holes 41 to 48 for connecting the conductor pins P1 to P8 and through holes 51 to 58 for connecting the press contact terminals 21 to 28. The through holes 41 to 48 are arranged in a staggered arrangement for inserting the leg portions 14 of the conductor pins 1 to 8, and are connected to the conductor pins P1, P3, P5, and P7 and the conductor pins P2, P4, P6, and P8. The through-holes formed are in two rows.

  Furthermore, conductor patterns L1 to L8 that electrically connect the through holes 41 to 48 and the through holes 51 to 58 are formed on the printed circuit board 29.

  In the present invention, the conductor patterns L3 and L5 are formed on the front surface of the printed circuit board 29, and the conductor patterns L4 and L6 are formed on the back surface of the printed circuit board 29. The conductor patterns L3 and L5 and L4 and L6 formed on the front and back surfaces of the printed circuit board 29 are provided with parallel portions L9 and L10, respectively. The two parallel portions L9 and L10 are formed to have substantially the same length and the same interval.

  Normally, there is a problem such as near-end crosstalk even in the adjacent conductor pin of the pressure contact terminal, but since the pressure contact terminal is several times longer than the adjacent distance of the conductor pin, it is larger than the crosstalk in the modular jack. Degradation does not occur. Therefore, the main cause of the near-end crosstalk and the far-end crosstalk is the coupling between the conductor pins in the modular jacks arranged at intervals of 1.016 mm. However, in the conventional modular jack having the staggered pin arrangement, it is difficult to sufficiently reduce the near-end crosstalk and the far-end crosstalk between adjacent conductor pins.

  In contrast, according to the present invention, the third and fifth parallel conductor patterns L9 are formed on one surface of the printed circuit board 29, and the fourth and sixth parallel conductor patterns L10 are formed on the other surface of the printed circuit board 29. In addition, by setting these two parallel conductor patterns L9 and L10 to the same length at substantially the same interval, it is possible to reduce the coupling caused by the pin arrangement in the modular jack. This is a parallel conductor pattern L9, L10 adjacent to Nos. 3-5 and 4-6, which is a combination opposite to the connection between Nos. 3-4 and 6-5 which is the largest coupling occurring in the modular jack. It is because the coupling | bonding which generate | occur | produces in a modular jack can be canceled by providing.

  Therefore, according to the present invention, since the coupling between No. 3 and No. 6 and No. 4 and No. 5 with the largest coupling and the largest degradation of the crosstalk attenuation can be suppressed, a high near-end crosstalk attenuation and a far-end crosstalk can be suppressed. Attenuation can be realized.

  Here, when there is a coupling that cannot be canceled out only by the parallel conductor pattern, it can be corrected by arbitrarily adding an impedance control pattern in addition to the parallel conductor patterns L9 and L10. As this impedance control pattern, there is a conductor pattern 49 formed in a comb shape as shown in FIG.

  In order to cancel the electromagnetic coupling of the internal pins of the modular jack, a large mutual capacitance is required. Therefore, the comb-shaped conductor pattern 49 is suitable for efficiently increasing the mutual capacitance in a small area. By adding the comb-shaped conductor pattern 49 and adjusting the number of the arrangement, mutual capacitance and mutual inductance can be balanced so as to cancel electrostatic coupling and electromagnetic coupling in the modular jack.

  However, if the number of the comb-shaped conductor patterns 49 is excessive, it is difficult to balance the mutual inductance. Therefore, it is desirable to reduce the number of the comb-shaped conductor patterns 49 as much as possible. That is, if the number of comb-shaped conductor patterns 49 increases, the mutual capacitance can be increased efficiently, but on the other hand, the amount of mutual inductance increases unintentionally due to the increase in the length of the pattern. This is because it is extremely difficult to suppress the near-end crosstalk attenuation at the frequency.

  Next, measurement results of electrical characteristics of the modular jack connector of the present embodiment are shown in FIGS. FIG. 5 shows the near end crosstalk attenuation, FIG. 6 shows the measurement results of the paired near end crosstalk attenuation, and FIG. 7 shows the far end crosstalk attenuation.

  In FIG. 5, 50 represents the near-end crosstalk attenuation required by Cat 6, 51 represents 36/45 (represents the connection between No. 3 and No. 4, No. 5 and so on), and 52 represents 36. / 12, 53 represents 36/78, 54 represents 45/12, 55 represents 45/78, and 56 represents 12/78 near-end crosstalk attenuation.

  In FIG. 6, 60 represents the near-end crosstalk attenuation required by Cat 6, 61 is No. 3 and No. 6, 62 is No. 4 and No. 5, 63 is No. 1 and No. 2, and 64 is No. 7 and No. 8. This represents the near-end crosstalk attenuation.

  In FIG. 7, 700 represents the far-end crosstalk attenuation required by Cat6, 701 is 36/45, 702 is 45/36, 703 is 36/12, 704 is 12/36, and 705 is 36/78. , 706 represents 78/36, 707 represents 45/12, 708 represents 12/45, 709 represents 45/78, 710 represents 78/45, 711 represents 12/78, and 712 represents 78/12 far-end crosstalk attenuation. .

  In FIGS. 5 to 7, since the measured value of the crosstalk attenuation is minus, the smaller the value of the crosstalk attenuation, the better the characteristics.

  As shown in FIGS. 5 to 7, the modular jack connector according to the present invention has a reference value required for Cat 6 in any of near end crosstalk attenuation, paired near end crosstalk attenuation, and far end crosstalk attenuation. Meet.

  Thus, according to the present invention, it is possible to realize a modular jack that satisfies the near-end crosstalk attenuation, the paired near-end crosstalk attenuation, and the far-end crosstalk attenuation required by Cat6 over a wide frequency band up to 250 MHz.

  Here, in the present invention, the conductor patterns L1 to L8 from the conductor pins 1 to 8 to the press contact terminal pins 41 to 48 are each formed so that there is one path. That is, in the frequency region below 100 MHz, the influence of the mutual capacitance and the mutual inductance on the near-end and far-end crosstalk characteristics of the connector are comparable, whereas in the frequency region above 100 MHz, the near-end and far-end effects are similar. This is because the influence of the mutual inductance on the end crosstalk characteristic becomes very large with respect to the influence of the mutual capacitance. Generally, it is possible to balance the mutual capacitance by providing a loop portion or the like in the conductor patterns L1 to L8. However, in the frequency region of 100 MHz or more, by providing a loop portion in a part of the conductor pattern, Parameters that must be adjusted for inductance, such as the spacing and length of the loop conductor pattern, and the coupling between the loop conductor pattern and other conductor patterns, etc., make it very important to balance mutual inductance. It becomes difficult. Therefore, in order to improve the near-end and far-end crosstalk characteristics in a frequency band of 100 MHz or higher, it is desirable that the conductor patterns L1 to L8 have only one type of path.

  In the modular jack connector according to the present invention, it is desirable to use a printed board having a thickness of 0.4 mm or more. That is, if the thickness of the printed circuit board is 0.4 mm or more, it is not necessary to consider the influence of the mutual capacitance and mutual inductance between the conductor patterns formed on the front and back surfaces of the printed circuit board. This is because it is necessary to consider the effects of mutual capacitance and mutual inductance. Here, when the frequency region is 100 MHz or less, the thickness of the printed circuit board may be 0.4 mm or less, and the mutual capacitance may be balanced by the conductor pattern formed on the front surface and the back surface of the printed circuit board. In the frequency range of 100 MHz or more where the influence of the mutual inductance on the attenuation is large, it is necessary to consider the mutual inductance between the conductor patterns formed on the front and back surfaces of the printed circuit board. It becomes difficult to. Furthermore, when the printed circuit board is thinned, the problem of mechanical strength also arises.

  Therefore, in the present invention, it is desirable to use a printed circuit board having a thickness of 0.4 mm or more in which electromagnetic coupling between conductor patterns formed on the front surface and the back surface of the printed circuit board can be ignored.

  In the present invention, the conductor pattern L5 passes between the first through hole 41 and the fifth through hole 45 and between the second through hole 42 and the fourth through hole 44. Is formed. According to such a configuration, the following two effects are achieved.

  The first is that the conductor pattern L5 is formed so as to go around the third through hole 43, and a mutual capacitance is added between the conductor portion provided in the through hole 43 and L5. The mutual capacitance and the mutual inductance can be balanced without increasing the added amount of the comb pattern.

  The second is more than equivalent to the coupling between L5 and the first through hole 41 which occurs as a side effect of the first effect by passing between the second through hole 42 and the fourth through hole 44. By causing the coupling to occur between L5 and the second through hole 42, an unnecessary increase in coupling can be suppressed.

  In the present invention, the conductor pattern L3 is formed so as to pass between the fourth through hole 44 and the sixth through hole 46. This makes it possible to form L9, which is a portion parallel to L5, with the length of L3 as the shortest path, to suppress an increase in mutual inductance due to an increase in the length of the conductor pattern, and to reduce the printed circuit board 29. The distance between L3 and L6 and the distance between L4 and L5 divided on both sides can be arranged without increasing more than necessary. Here, as the distance between the paired conductors, that is, the distance between L3 and L6 and between L4 and L5 increases, it becomes more difficult to maintain the impedance between L3 and L6 and the impedance between L4 and L5 at 100Ω, which increases the return loss. Connected.

  In this embodiment, the parallel conductor patterns L9 and L10 are formed on the front surface and the back surface of the printed circuit board. However, using three or more layers of printed circuit boards, the printed circuit board is parallel to one surface other than the front surface and the back surface. A conductor pattern can also be formed. That is, the same effect can be obtained if a dielectric is sandwiched between the conductor patterns L3 and L5 and the conductor patterns L4 and L6, and each conductor pattern has the same length and the same interval.

  Further, the front and back of the board can be exchanged by switching the even-numbered pins and the odd-numbered pins of the modular jack pins.

  Further, it is possible to make the pitch of the pins of the modular jack coming out for soldering to the printed circuit board larger than 1.016 mm, for example, 1.27 mm.

It is a figure which shows the modular jack suitable for the connector which concerns on this invention. It is a figure which shows the connector of one Embodiment of this invention. It is a figure which shows the press-contact terminal array suitable for the connector which concerns on this invention. It is a figure which shows the conductor pattern of the printed circuit board which concerns on this invention. It is a figure which shows the characteristic of the near end crosstalk attenuation amount of the connector of one Embodiment of this invention. It is a figure which shows the characteristic of the near-end crosstalk attenuation amount of the connector of one Embodiment of this invention. It is a figure which shows the characteristic of the far end crosstalk attenuation of the connector of one Embodiment of this invention. It is a figure showing the conventional information wiring system. It is a figure which shows the patch panel used for an information wiring system. It is a figure which shows the outlet box used for an information wiring system. It is a figure which shows the conventional modular jack. It is sectional drawing of the conventional modular jack. It is a perspective view of the conventional modular jack connector.

Explanation of symbols

P1 to P8 No. 1 to No. 8 conductor pin 9 Modular jack 10 Housing 20 Modular jack connector 21 to 28 Press contact terminal 29 Printed circuit board 30 Press contact terminal array 31 Press contact terminal pins 41 to 48, 51 to 58 Through hole L1 to L8 Conductor pattern L9 , L10 Parallel conductor pattern

Claims (6)

A hollow housing having an opening, eight conductor pins that are incorporated in a row inside the housing and extend through the housing to the outside of the housing, and the conductor pins extending to the outside of the housing. A modular jack connector comprising a printed circuit board connected to the protruding portion and eight pressure contact terminal pins connected to the printed circuit board,
The printed circuit board is formed with eight conductor patterns that connect the conductor pins and the press contact terminal pins,
Of these conductor patterns, the conductor pattern connected to the third and fifth conductor pins from one end of the conductor pin row is formed on one surface of the printed circuit board and a part of the first parallel portion The conductor pattern connected to the fourth and sixth conductor pins from one end of the conductor pin row is formed on the other surface of the printed circuit board, and a second parallel portion is formed on a part thereof. Have
The modular jack connector, wherein the first and second parallel portions have the same length and the same interval.   2. The modular jack connector according to claim 1, wherein the conductor pattern has a single path from the conductor pin to the press contact terminal.   The conductor pattern connected to the 5th conductor pin is formed between the 1st and 3rd conductor pin from the one end of the said conductor pin row | line | column, and the 2nd pin and the 4th pin. 2. The modular jack connector according to 2.   4. The modular jack according to claim 1, wherein a conductor pattern connected to the third conductor pin is formed between the fourth conductor pin and the sixth conductor pin from one end of the conductor pin row. connector.   The modular jack connector according to claim 1, wherein a thickness of the printed circuit board is 0.4 mm or more.   6. The modular jack connector according to claim 1, wherein the conductor pins are in a staggered arrangement.

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