JP2006012955A - Electronic component - Google Patents

Abstract

An object of the present invention is to provide an electronic component that is manufactured in a low-cost manufacturing process and does not require fine adjustment, and at the same time has excellent impact resistance, durability, and flexibility. To do.
The present invention relates to a multilayer capacitor having a dielectric base with an internal electrode embedded therein, a pair of lead terminals provided on the multilayer capacitor, a part of the lead terminals, and a multilayer type. An electronic component 1 having an exterior material 5 that covers a capacitor 6, wherein the internal electrode 7 is formed of a material containing Ag and Pd, and the exterior material 5 is either a substantially rectangular parallelepiped, a substantially cube, or a substantially rectangular column. The lead terminals 8 protrude from the bottom surface 9 and the side corners of the exterior material 5.
[Selection] Figure 1

Description

  The present invention relates to an electronic component suitably used for an electronic device such as a modem, a power supply circuit, a liquid crystal power supply, a DC-DC converter, and a power line communication device.

  Many electronic components are mounted in electronic devices such as modems and power supply circuits. For example, a capacitor is often used for noise removal or DC component cut.

  Here, electronic devices are required to be reduced in size and cost, and accordingly, electronic components are also required to be significantly reduced in size and cost. Furthermore, surface mounting electronic components are often required in order to reduce mounting cost and mounting area by automatic mounting. On the other hand, conflicting specifications such as high performance, reduction of characteristic variation, and improvement of durability have been demanded together with downsizing. Furthermore, since a high capacity is required, a multilayer capacitor is increasingly used.

  In order to satisfy these requirements, various electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2).

  In particular, as described in the above (Patent Documents 1 and 2), in an electronic component, in order to cope with a high withstand voltage, it is covered with an exterior material such as a resin to increase the withstand voltage and improve durability, heat resistance, and moisture resistance Etc. were done.

  However, when a multilayer capacitor is sealed with an exterior material resin, a configuration is adopted in which two exterior materials formed by a method such as transfer molding are bonded together and the lead terminals are projected from the bonded surface. There were many things. However, in such a form, the number of manufacturing steps is increased and the cost is often increased. In addition, since the terminal portion and the lead terminal protrude from the middle portion of the side surface of the exterior material, costs such as fine adjustment may be required.

  In order to cope with the above, an electronic component manufactured by placing a lead capacitor connected to a multilayer capacitor in advance in a mold, pouring molten resin into the mold and sealing it as an exterior material Has been proposed.

  FIG. 35 and FIG. 36 are side views of an electronic component according to the prior art, and the shape is a result of taking the manufacturing method as described above, and has an advantage that it can be manufactured at low cost.

Reference numeral 100 is an electronic component, and 101 is a multilayer capacitor. 102 is an internal electrode of the multilayer capacitor 101, 103 is an external electrode, 104 is a lead terminal, and 105 is an exterior material. When the lead terminal 104 and the external electrode 103 are connected, a terminal portion provided in the multilayer capacitor 101 as an intermediary may be formed.
JP 2001-110691 A JP 2002-43170 A

However, in the conventional electronic component as shown in FIG. 35, when the molten resin is poured, the temperature becomes very high, so that the internal electrode 102 of the multilayer capacitor 101 is melted or damaged. was there. This is because even when the electronic component 100 is automatically mounted by reflow or the like, the temperature is similarly high, so that melting and damage of the internal electrode 102 has also been a problem. For this reason, it has been required to use the internal electrode 102 capable of taking measures against high temperatures.

  In addition, in the conventional electronic component shown in FIG. 35, unlike the case of sealing with an exterior material by a transfer molding method or the like, the lead terminal 104 extends from the side surface of the exterior material 105 or the protruding portion on the side surface to the outside. Since it does not protrude, there is a problem that the lead terminal 104 has poor impact resistance, durability, flexibility and the like.

  For this reason, there existed problems, such as low reliability at the time of manufacture, transportation, mounting, and mounting, and there was a problem that it was a practically insufficient electronic component.

  The present invention relates to a multilayer capacitor having a dielectric substrate with an internal electrode embedded therein, a pair of lead terminals provided in the multilayer capacitor, and an electronic component having an exterior material covering a part of the lead terminals and the multilayer capacitor. The internal electrode is formed of a material containing Ag and Pd, the exterior material is a substantially rectangular parallelepiped, a substantially cubic shape, or a substantially rectangular pillar, and the lead terminal is a corner between the bottom surface and the side surface of the exterior material. It is set as the structure which protrudes from.

  The present invention can realize an electronic component with improved pressure resistance, impact resistance, durability, and moisture resistance by sealing a multilayer capacitor with an exterior material.

  In addition, by forming the internal electrode of the multilayer capacitor with a material mainly composed of Ag and Pd, it is resistant to high temperatures and is resistant to high temperatures when pouring molten resin for sealing exterior materials and high temperatures during reflow. As a result, melting and damage are eliminated, and low-cost exterior packaging and automatic mounting are realized.

  Further, the impact resistance of the lead terminal can be improved by forming a portion where the thickness of the lead terminal is increased at the portion protruding to the outside. Furthermore, the impact resistance, durability, and flexibility can be improved by changing the thickness of the lead terminal projecting to the outside, providing a deflection absorbing portion, and the like.

  Further, the impact resistance and durability of the lead terminal can be improved by installing a reinforcing material.

  Furthermore, by providing chamfers and slanted parts at the corners of the exterior material, it becomes possible to improve the deflection resistance of the lead terminals protruding from the corners in addition to the impact resistance and durability of the exterior material. .

  These can be realized while maintaining the conventional low-cost manufacturing process, and at the same time, it is compatible with measures such as high-temperature countermeasures and durability, and as a result, this electronic component is incorporated. It is also possible to reduce the cost and life of electronic devices.

According to the first aspect of the present invention, there is provided a multilayer capacitor having a dielectric substrate in which internal electrodes are embedded, a pair of lead terminals provided in the multilayer capacitor, a part of the lead terminals, and the multilayer capacitor. An internal component is formed of a material containing Ag and Pd, the exterior material is either a substantially rectangular parallelepiped, a substantially cubic, or a substantially rectangular pillar, and the lead terminal is an exterior This is an electronic component that protrudes from the corners of the bottom and side surfaces of the material. The heat resistance of the multilayer capacitor is increased, and the cost is reduced by the exterior material forming process by pouring molten resin. A high-reliability electronic component can be realized that can cope with high temperatures during formation and reflow during mounting.

  The invention according to claim 2 of the present invention is the electronic component according to claim 1, wherein the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. Thus, the impact resistance of the lead terminal can be improved while being manufactured at a low cost.

  The invention according to claim 3 of the present invention is characterized in that the lead terminal protruding outside the exterior material has a portion where the thickness outside the exterior material is thinner than the thickness inside the exterior material. 1 is an electronic component that can be manufactured at a low cost, and can improve the elasticity of the lead terminal and improve the bending resistance.

  The invention according to claim 4 of the present invention is the electronic component according to any one of claims 1 to 3, wherein the protruding lead terminal increases in thickness toward the tip. The impact resistance of the lead terminal can be improved while being manufactured at a low cost.

  The invention according to claim 5 of the present invention is the electronic component according to any one of claims 1 to 4, wherein the protruding lead terminal is thinned toward the tip. Flexibility can be improved by improving the elasticity of the lead terminal.

  The invention according to claim 6 of the present invention is the electronic component according to any one of claims 1 to 5, wherein the lead terminal protruding outside the exterior material has the thickest thickness at the protruding portion. Thus, the impact resistance of the lead terminal can be improved while being manufactured at a low cost.

  According to a seventh aspect of the present invention, in the lead terminal projecting outside the exterior material, the tip end portion of the terminal portion has the greatest thickness. The impact resistance of the lead terminal can be improved while being manufactured at low cost.

  The invention according to claim 8 of the present invention is characterized in that the lead terminal protrudes from a position close to the bottom surface of the exterior material and the position where the bottom surface and the side surface of the exterior material intersect. It is an electronic component of any one of -7, Comprising: Although low-cost manufacture is possible, a clearance gap can be produced between a lead terminal and an exterior material, and a bending resistance can be improved.

  The invention according to claim 9 of the present invention is characterized in that the lead terminal protrudes from a side surface of the exterior material, which is close to a position where the bottom surface and the side surface of the exterior material intersect. The electronic component according to any one of 8 to 8, wherein low-cost manufacturing is possible, but a gap is formed between the lead terminal and the exterior material, so that the bending resistance can be improved.

  The invention according to claim 10 of the present invention is characterized in that a reinforcing material is provided on at least one of the exterior material or the lead terminal protruding outside the exterior material. The electronic component according to any one of the above, wherein the impact resistance of the lead terminal and the exterior material can be improved.

  An eleventh aspect of the present invention is the electronic component according to the tenth aspect, wherein the reinforcing material enhances the impact resistance of the lead terminal protruding from the exterior material. The impact resistance of the exterior material can be improved.

The invention according to claim 12 of the present invention is characterized in that the reinforcing material is provided at the intersection of the exterior material and the lead terminal protruding from the exterior material. It is a component that improves the strength at the most stressed part, thereby improving the impact resistance and, as a result, improving the moisture resistance.

  The invention according to claim 13 of the present invention is characterized in that the reinforcing material is a reinforcing material bonded to at least one of the exterior material or the lead terminal protruding from the exterior material. The electronic component according to 1, wherein the effect of the reinforcing material can be enhanced.

  The invention according to claim 14 of the present invention is the electronic component according to any one of claims 10 to 12, wherein the reinforcing material is a convex-type reinforcing material protruding from the exterior material. The reinforcing material can be easily formed.

  According to the fifteenth aspect of the present invention, in addition to or instead of the reinforcing material, at least one of both the exterior material and the lead terminal projecting from the exterior material is a bottom surface of the projecting lead terminal. 15. The electronic component according to claim 10, further comprising a bottom surface reinforcing material formed so as to cover the portion, wherein the lead terminal and the exterior material are supported by the support on the bottom surface side. The impact resistance can be improved.

  According to a sixteenth aspect of the present invention, in the electronic component according to the fifteenth aspect, the bottom reinforcing material is formed from the entire bottom surface of the exterior material to a part of the protruding lead terminal. Thus, the work process for integrating the reinforcing material can be reduced.

  The invention according to claim 17 of the present invention is characterized in that the bottom reinforcing material is formed by applying a paste resin to the bottom surface of the exterior material. An electronic component that facilitates the formation of a bottom reinforcement.

  The invention according to claim 18 of the present invention is characterized in that the reinforcing material is provided on any part of the non-mounting surface of the lead terminal protruding from the exterior material. The electronic component according to the item 1, which can improve the impact resistance of the lead terminal.

  The invention according to claim 19 of the present invention is characterized in that the reinforcing material is formed along the peripheral edge portion of the non-mounting surface of the lead terminal protruding from the exterior material. The impact resistance of the lead terminal can be further improved.

  The invention according to claim 20 of the present invention is characterized in that the reinforcing material is a non-mounting surface of the lead terminal protruding from the exterior material, and is formed along substantially the center in the longitudinal direction of the lead terminal. The electronic component according to any one of claims 10 to 18, wherein the impact resistance of the lead terminal can be ensured while facilitating formation of the reinforcing material.

  According to a twenty-first aspect of the present invention, the reinforcing material is a non-mounting surface of the lead terminal that protrudes from the exterior material, and is provided at the tip of the lead terminal. The electronic component according to any one of the above, wherein the tip portion that is most stressed on the lead terminal is reinforced with a small amount of reinforcing material, and the tip portion is heavy to enhance the mounting strength.

  According to a twenty-second aspect of the present invention, in any one of the first to twenty-first aspects, a flexure absorbing portion is provided at any position of the lead terminal protruding outside the exterior material. It is possible to surely enhance the bending resistance while the electronic component described is an electronic component manufactured at a low cost.

  The invention according to claim 23 of the present invention is characterized in that the deflection absorbing portion is an arcuate curved surface portion provided at any position of the projecting lead terminal. Although it is a component and an electronic component manufactured at a low cost, it is possible to surely enhance the bending resistance.

  The invention according to claim 24 of the present invention is the electronic component according to claim 22, wherein the deflection absorbing portion is a bent portion provided at any position of the protruding lead terminal. Thus, it is possible to reliably enhance the bending resistance while being an electronic component manufactured at a low cost.

  According to a twenty-fifth aspect of the present invention, in the electronic component according to the twenty-fourth aspect, the bent portion has a substantially U-shaped cross-sectional shape. Even though it is an electronic component, it is possible to reliably enhance the bending resistance.

  According to a twenty-sixth aspect of the present invention, in the electronic component according to the twenty-second aspect, the deflection absorbing portion is a wavy surface provided at any position of the protruding lead terminal. Thus, it is possible to reliably enhance the bending resistance while being an electronic component manufactured at a low cost.

  According to a twenty-seventh aspect of the present invention, in the electronic component according to any one of the twenty-second to twenty-sixth aspects, the plurality of deflection absorbing portions are provided on the protruding lead terminals. It is possible to further improve the flexibility.

  The invention according to claim 28 of the present invention is characterized in that, as the deflection absorbing portion, any two or more of a curved surface portion, a bent portion, or a wavy surface are combined and provided on the protruding lead terminal. 28. The electronic component according to any one of claims 22 to 27, wherein the enhancement of the bending resistance can be further improved.

  The invention according to claim 29 of the present invention is characterized in that the flexure absorbing portion is provided at a position where the protruding lead terminal is close to the protruding root portion protruding from the exterior material. It is an electronic component of any one of -28, Comprising: The balance of mounting strength and bending resistance can be aimed at most appropriately.

  The invention according to claim 30 of the present invention is the electronic component according to any one of claims 22 to 28, wherein the deflection absorbing portion is provided at a tip portion of the protruding lead terminal. It can maximize the resistance to bending.

  The invention described in claim 31 of the present invention is characterized in that the main surface of the lead terminal protruding from the exterior material and the bottom surface of the exterior material are non-parallel to each other. 1. The electronic component according to 1, wherein the lead terminal itself can be made elastic to improve the bending resistance.

  The invention according to claim 32 of the present invention is an exterior material, and an inclined portion is provided at a corner portion where the lead terminal protrudes, according to any one of claims 1 to 31. This is an electronic component that can strengthen the weakest part of the exterior material, prevent damage, and improve moisture resistance.

The invention according to Claim 33 of the present invention is the electronic component according to Claim 32, characterized in that the lead terminal protrudes from a corner where the inclined portion and the bottom surface of the exterior material intersect. While improving the impact resistance and moisture resistance of the material, a gap is formed between the lead terminal and the exterior material, so that the bending resistance can be secured.

  The invention according to claim 34 of the present invention is the electronic component according to any one of claims 32 to 33, characterized in that the inclined portion has a substantially rectangular shape, and the inclined portion can be easily formed. Is possible.

  The invention according to claim 35 of the present invention is the electronic component according to any one of claims 32 to 34, wherein the inclined portion is substantially arc-planar, and the strength at the inclined portion is Can be further improved.

  According to a thirty-sixth aspect of the present invention, in any one of the thirty-second to thirty-fifth aspects, the corner portion of the exterior material is chamfered at a portion other than the corner portion at which the lead terminal protrudes. It is an electronic component of description, Comprising: The intensity | strength of an exterior material can be improved.

  According to a thirty-seventh aspect of the present invention, the lead terminal protruding from the corner where the inclined portion and the bottom surface of the exterior material intersect extends once downward from the bottom surface of the exterior material and is bent into a substantially L shape. 37. The electronic component according to any one of claims 32 to 36, wherein the distance between the lead terminal and the bottom surface of the exterior material can be further increased to greatly improve the bending resistance. Is.

  The invention according to Claim 38 of the present invention is an exterior material, and a recess is provided at a corner from which the lead terminal protrudes. In the electronic component, a space can be provided between the lead terminal and the exterior material, and the flex resistance of the lead terminal can be improved.

  Invention of Claim 39 of this invention is an exterior material, Comprising: The convex part is provided in the corner | angular part which the lead terminal protrudes, It is any one of Claims 1-31 characterized by the above-mentioned. In this electronic component, it is possible to create a space between the lead terminal and the bottom surface of the exterior material, and to improve the deflection resistance of the lead terminal.

  The invention according to claim 40 of the present invention is characterized in that the convex portion is a bottom surface and is provided at a predetermined distance from the bottom surface and the corners of the side surface of the exterior material. In the electronic component described above, it is possible to realize the bending resistance capable of dealing with three-dimensional vibration including the horizontal direction.

  The invention according to claim 41 of the present invention is characterized in that the lead terminal protrudes from either the tip or the side of the convex portion. In this case, a space is formed between the lead terminal and the bottom surface of the exterior material, and the flex resistance of the lead terminal can be improved.

  The invention according to claim 42 of the present invention is characterized in that an external electrode for electrically connecting the multilayer capacitor and the pair of lead terminals is formed between the multilayer capacitor and the pair of lead terminals. The electronic component according to any one of claims 1 to 41, wherein the connection between the lead terminal and the multilayer capacitor can be ensured.

  The invention according to claim 43 of the present invention is the electronic component according to claim 42, characterized in that, in the external electrode, the multilayer capacitor and the lead terminal are connected by solder containing tin as a main component. Thus, it is possible to increase heat resistance and cope with high temperatures, and can cope with high temperatures during exterior material formation and reflow.

  The invention according to claim 44 of the present invention is the electronic component according to any one of claims 1 to 43, wherein the lead terminal is formed of a material mainly composed of copper. The heat resistance of the lead terminal can be improved.

  In the invention according to claim 45 of the present invention, the external electrode is formed of a material containing copper as a main component, the multilayer capacitor and the pair of lead terminals are connected via the external electrode, and the melting point is 240 ° C. or higher. 43. The electronic component according to any one of claims 1 to 42, wherein the lead terminal is formed of a material mainly composed of copper, wherein the lead terminal is formed at a high temperature during exterior material formation or reflow. Can be realized.

  The invention according to claim 46 of the present invention is the electronic component according to any one of claims 1 to 43, characterized in that the lead terminal is formed of 42 alloy, and the solder wettability is improved. It is possible to improve the mounting reliability.

  The invention according to claim 47 of the present invention is the electronic component according to any one of claims 1 to 46, wherein a plurality of multilayer capacitors are sealed inside the exterior material. A composite electronic component can be easily realized.

  The invention according to claim 48 of the present invention is a multilayer capacitor, wherein a plurality of pairs of lead terminals are connected to the multilayer capacitor comprising a single substrate. In any one of the electronic components, a composite electronic component can be easily realized, and further, it is possible to save the trouble of mounting.

  In this specification, a multilayer capacitor is described as an embodiment, but the present invention is not limited to this, and various elements such as a normal single plate capacitor, a resistor, an inductor, and a filter that are not a multilayer capacitor are used. But the same is true.

  In addition, the lead terminal may be directly connected to the multilayer capacitor, or may be provided with a terminal portion once paired with the multilayer capacitor and connected to this terminal portion.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 18, 19, 20. 21, FIG. 22, FIG. 23, FIG. 24, FIG. 25, FIG. 26, FIG. 27, FIG. 28, FIG. 29, FIG. 15, FIG. 16, FIG. 17, FIG. 33, and FIG. 34 are top views of electronic components according to the embodiment of the present invention.

  1 is an electronic component, 3 is an external electrode, 5 is an exterior material, 6 is a multilayer capacitor, 7 is an internal electrode, 8 is a lead terminal, 9 is a bottom surface, 10 is a reinforcing material, 11 is a convex reinforcing material, 12 is A bottom reinforcing material, 13 is a reinforcing material, 15 is a curved surface portion, 16 is a bent portion, 17 is a corrugated surface, 20 is an inclined portion, 21 is a chamfer, 22 is a recessed portion, and 23 is a convex portion.

  First, in the structure of the electronic component 1, the features and effects of the structure shown in each figure will be briefly described.

In FIG. 1, a pair of external electrodes 3 are connected to both ends of a multilayer capacitor 6 in which a laminated sheet composed of a plurality of dielectric substrates and internal electrodes 7 are laminated, and a pair of leads is connected via the external electrodes 3. A structure in which a terminal 8 is connected and a part of the multilayer capacitor 6 and the lead terminal 8 is sealed (molded) by an exterior material 5 is shown. Further, at this time, the internal electrode 7 is made of a material mainly composed of Ag and Pd, and is resistant to high temperatures, and has an effect of being resistant to high temperatures applied during sealing with the exterior material 5 and high temperatures applied during mounting reflow. is there. Furthermore, the lead terminal 8 protrudes from the corner | angular part of the bottom face 9 and side surface of the exterior material 5 which is a substantially rectangular parallelepiped, a substantially cube, or a substantially square pillar. With this structure, the multilayer capacitor to which the lead terminal 8 is connected is turned upside down, and the lead terminal 8 is hooked and placed in the mold, and the molten resin is poured into the mold and solidified. Since the manufacturing process is sufficient, the electronic component 1 can be realized at a very low cost.

  FIG. 2 shows a structure in which the lead terminal 8 has a portion outside the exterior material that is thicker than the thickness inside the exterior material 5. In FIG. 2, a structure having a large thickness as a whole is shown in the outside protruding from the exterior material 5, but the thickness may be thick only partially. With this structure, the impact resistance of the lead terminal 8 is increased.

  FIG. 3 shows a case where there is a portion where the thickness of the lead terminal is thinner than the thickness of the lead terminal 8 inside the exterior material 5 outside the exterior material 5, contrary to FIG. 2. With this structure, the elasticity of the lead terminal is increased and the deflection resistance is improved.

  FIG. 4 shows a structure in which the lead terminal 8 protruding to the outside of the exterior material 5 becomes thinner as it goes to the tip. With this structure, the elasticity of the lead terminal 8 is improved as in FIG. 3, and the bending resistance is improved.

  FIG. 5 shows a structure in which the lead terminal 8 protruding to the exterior of the exterior material 5 increases in thickness as it goes to the tip. With this structure, it is strong against stress such as external impact that is likely to be applied to the tip of the lead terminal 8, and the impact resistance such as prevention of bending of the lead terminal 8 is improved.

  FIG. 6 shows a structure in which the thickness of the lead terminal 8 protruding to the outside of the exterior material 5 is the thickest. With this structure, it is possible to prevent the lead terminal 8 from being broken by an impact applied to the base of the lead terminal 8, and to prevent impact resistance and durability.

  FIG. 7 shows a structure in which the thickness of the lead terminal 8 protruding outside the exterior material 5 is the thickest. With this structure, the stress applied to the tip of the lead terminal 8 can be prevented and the impact resistance can be improved.

  FIG. 8 shows a structure in which the lead terminal 8 protrudes from a position near the corner between the bottom surface 9 and the side surface of the exterior material 5 on the bottom surface of the exterior material 5. With this structure, a gap is generated between the lead terminal 8 and the exterior material 5, and the deflection resistance can be improved.

  FIG. 9 shows a structure in which the lead terminal 8 is a side surface of the exterior material 5 and protrudes from a position close to a corner between the bottom surface 9 and the side surface of the exterior material 5. With this structure, a gap is generated between the lead terminal 8 and the exterior material 5, and the deflection resistance can be improved.

  FIG. 10 shows a structure in which a reinforcing material 10 is formed on a part of either the exterior material 5 or the lead terminal 8. In FIG. 10, it is provided at a crossing portion between the exterior material 5 and the protruding portion of the lead terminal 8, but it may be provided at a portion other than this. With this structure, the impact resistance of the lead terminal 8 and the exterior material 5 is improved.

  FIG. 11 shows a structure in which the convex reinforcing material 11 formed integrally with the exterior material 5 is used for the reinforcing material 10. With this structure, the reinforcing member 10 can be easily formed.

  FIG. 12 shows a structure in which the bottom surface reinforcing material 12 is formed. The bottom reinforcing member 12 can prevent breakage or the like due to an impact applied to the lead terminal 8 and improve impact resistance.

  FIG. 13 also shows the structure in which the bottom surface reinforcing material 12 is formed, and the impact resistance can be further improved by covering the entire bottom surface of the exterior material 5.

  FIG. 14 shows a structure in which the lead terminal 8 is matched to this shape by forming the bottom surface reinforcing material 12. With this structure, even when the bottom surface reinforcing material 12 is provided, there is no gap between the mounting surface of the lead terminal 8 and the mounting substrate, and there is no need for solder build-up, and the mounting strength is improved. .

  FIG. 15 shows a structure in which the reinforcing material 13 is provided on the non-mounting surface of the lead terminal 8 at substantially the center in the longitudinal direction. With this structure, bending of the lead terminals 8 can be prevented, and stress resistance and durability can be improved.

  FIG. 16 shows a structure in which the reinforcing material 13 is formed on the non-mounting surface of the lead terminal 8 at the peripheral edge thereof. With this structure, bending of the lead terminals 8 can be prevented, and stress resistance and durability can be improved.

  FIG. 17 shows a structure in which the reinforcing material 13 is formed at the tip of the lead terminal 8 on the non-mounting surface. With this structure, bending of the lead terminals 8 can be prevented, and stress resistance and durability can be improved.

  FIG. 18 shows a structure in which a curved surface portion 15 is formed as an example of a deflection absorbing portion in the lead terminal 8. With this structure, the bending resistance of the lead terminal 8 is improved.

  FIG. 19 shows a structure in which a bent portion 16 is formed in a part of the lead terminal 8 as an example of a deflection absorbing portion in the lead terminal 9. With this structure, a relaxation absorption force is generated in the lead terminal 8 and the flex resistance is improved.

  FIG. 20 shows a structure in which a wavy surface 17 is formed on the lead terminal 8 as an example of a flexure absorbing portion. Similarly to the above, the relaxation absorption force in the lead terminal 8 is generated, and the flex resistance is improved.

  FIG. 21 shows a structure in which the lead terminal 8 is formed by combining the curved surface portion 15 and the bent portion 16. With this structure, the improvement of the bending resistance is further increased. In addition, even if the combination is other than this, there may be various combinations such as a combination of the corrugated surface 17 and the bent portion 16.

  FIG. 22 shows a structure in which the flexure absorbing portion is provided at the base of the lead terminal 8 protruding outside the exterior material 5. With this structure, it is possible to improve the bending resistance against vibration or the like in a portion close to the exterior material 5.

  FIG. 23 shows a structure in which the deflection absorbing portion is provided at the tip of the lead terminal 8 projecting outside the exterior material 5. With this structure, the area of the imaginary range in which deflection is absorbed is widened, and it is possible to cope with large vibrations.

FIG. 24 shows a structure in which the lead terminal 8 protruding outside the exterior material 5 is non-parallel to the bottom surface 9 of the exterior material 5. With this structure, the lead terminal 8 has elasticity, and it is possible to improve the flexibility resistance after mounting.

  FIG. 25 shows a structure in which inclined portions 20 are provided at corners from which the lead terminals 8 protrude. With this structure, it is possible to avoid the influence on the protrusion, which is the weakest part of the exterior material 5, and to improve the impact resistance.

  FIG. 26 shows a structure in which the lead terminal 8 protrudes from a corner where the inclined portion 20 and the bottom surface of the exterior material 5 intersect. With this structure, the impact resistance to the exterior material can be improved, the degree of freedom between the exterior material 5 and the lead terminal 8 can be increased, and the flex resistance can be improved.

  FIG. 27 shows a structure in which the inclined portion 20 is substantially arcuate. Since the surface of the inclined portion 20 is an arc surface, there is a merit that it becomes stronger against an impact on the weakest protruding portion of the exterior material 5.

  FIG. 28 shows a structure in which a chamfer 21 is formed at a corner portion of the exterior material 5 other than the protruding portion of the lead terminal 8. With this structure, the impact resistance and durability of the exterior material 5 are improved.

  FIG. 29 shows a structure in which a recessed portion 22 is provided on the protruding portion of the lead terminal 8 in the exterior material 5. Due to this dent 22, a space is created between the outer packaging material 5 and the lead terminal 8, a relaxation absorption force of the lead terminal 8 is produced, and the bending resistance is improved.

  FIG. 30 shows a structure in which a convex portion 23 is formed on the bottom surface of the exterior material 5 and the lead terminal 8 protrudes from the convex portion 23. With this structure, a space is generated between the lead terminal 8 and the bottom surface 9 of the exterior material 5, and the flex resistance is improved.

  FIG. 31 shows a structure in which the lead terminal protrudes from the tip of the convex portion 23, extends below the bottom surface 9, and is bent into an approximately L shape. With this structure, the amount of space between the bottom surface 9 of the exterior member 5 and the lead terminal 8 becomes very large, and the improvement of the bending resistance is greatly enhanced.

  FIG. 32 shows a structure in which the lead terminal 8 protrudes from any part other than the tip, such as the side surface of the protrusion 23, and improves the structural strength of the protrusion 23 and the protrusion of the lead terminal 8. However, it also improves the bending resistance.

  FIG. 33 shows a structure in which a plurality of multilayer capacitors 6 are sealed inside the outer packaging material 5. With this structure, a composite electronic component can be easily formed and further mounted on a composite line. It is possible to save the trouble of.

  FIG. 34 shows a structure in which a plurality of pairs of lead terminals 8 are connected to a multilayer capacitor 6 as a single substrate, whereby a composite electronic component can be easily formed.

  Next, the detail of each part is demonstrated.

  Reference numeral 1 denotes an electronic component in which the multilayer capacitor 6 is molded. However, the electronic component 1 is not limited to the multilayer capacitor 6, and may be any of a resistor, an inductor, a filter, an IC, and other electronic elements. Is.

  Next, the multilayer capacitor 6 will be described.

  The multilayer capacitor 6 is formed by laminating a substrate made of a dielectric material with a plurality of sheets to form the internal electrode 7, so that it has the same size and higher capacity than a single plate capacitor or the like. Can do.

  Further, in order to electrically connect the multilayer capacitor 6 to the lead terminal 8, a pair of external electrodes 3 are provided.

  The dielectric base is a base made of a dielectric, and a dielectric material such as titanium oxide or barium titanate is preferably used. Alternatively, alumina or the like is also used. Using such a material, it is appropriately formed in a necessary shape and size.

  The internal electrode 7 is an electrode embedded in the dielectric substrate, and examples of the constituent material of the internal electrode 7 include metal materials and alloys containing at least one of Ni, Ag, Pd, Cu, Au, and the like. .

  Here, by forming the internal electrode 7 from a metal material mainly composed of Ag and Pd, durability to a high temperature is increased, and when the molten resin to be the exterior material 5 is poured or during reflow in mounting. Since there is a merit that the internal electrode 7 is less damaged by high temperature, it is preferable that Ag and Pd are the main components.

  Further, the surface may be plated. The internal electrode 7 has a thickness of 1 to 5 μm. Moreover, it is preferable that the space | interval of adjacent internal electrodes 7 shall be 15 micrometers or more.

  Some of the internal electrodes 7 are electrically connected to the external electrode 3, and the internal electrode 7 connected to only one of the external electrodes 3 and the internal electrode 7 connected to only the other external electrode 3 are opposed to each other. A main capacitance is generated between the opposed internal electrodes 7.

  Note that the lead terminal 8 is electrically connected to the multilayer capacitor 6 through the external electrode 3, and the high temperature durability is increased by using a material mainly composed of copper at the time of connection.

The size of the multilayer capacitor 6 is as follows: when the length is L1, the height is L2, and the width is L3.
3.0mm ≦ L1 ≦ 5.5mm
0.5mm ≦ L2 ≦ 2.5mm
1.5mm ≦ L3 ≦ 3.5mm
Of course, the size may be other than this, and a plurality of multilayer capacitors 6 may be sealed by the outer packaging material 5 instead of a single size. This is the case as shown in FIG. Alternatively, a plurality of pairs of external electrodes 3 are provided separately on a single multilayer capacitor 6 and lead terminals 8 are connected to the separated external electrodes 3 so that a plurality of elements can be formed on a single substrate. Thus, a composite part can be easily formed. This is the case shown in FIG.

  If L1 to L3 are made smaller than the above lower limit value, the formation area of the internal electrodes 7 becomes insufficient, or the interval between the internal electrodes 7 becomes inevitably narrow, and the number of internal electrodes 7 must be reduced. It becomes difficult to obtain a large capacitance value and it becomes difficult to obtain an electronic component having a wide capacity.

  Further, when the multilayer capacitor 6 is molded with the exterior material 5, in order to prevent damage to the multilayer capacitor 6 due to an impact, chamfering is provided at the corner of the multilayer capacitor 6 or an arc-shaped curve curve is formed. It is also preferable to provide a part or all of each side surface.

  Next, the external electrode 3 will be described.

  As described above, the external electrode 3 is a pair of conductive members provided at both ends of the multilayer capacitor 6, and electrically connects the multilayer capacitor 6 and the lead terminal 8. The external electrodes 3 are usually provided as a pair at both ends of the multilayer capacitor 6, but may be provided at an intermediate portion of the multilayer capacitor 6 instead of at both ends. Alternatively, the multilayer capacitor 6 may be provided on the upper and lower surfaces instead of the side surface, or may be provided over the entire side surface and upper and lower surfaces, or may be provided only on a part thereof. Further, it may be provided so as to protrude from the other surface.

  Examples of the material of the external electrode 3 include a metal material containing at least one of Ni, Ag, Pd, Cu, Au, and the like. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used as long as it is realized by any one of single layer and multilayer plating, vapor deposition, sputtering, and paste application.

  Further, when the multilayer capacitor 6 and the lead terminal 8 are connected, the external electrode 3 is used. In this connection, it is also preferable to use a solder mainly composed of tin. By using tin as a main component, environmental load substances can be eliminated and the melting point can be increased, so that melting and damage during reflow during mounting can be prevented, and highly reliable electrons. The component 1 can be obtained. In particular, it is preferable to use solder having a melting temperature of 240 ° C. or higher. Further, at this time, the lead terminal 8 is preferably formed of a material mainly composed of copper. As a result, the lead terminals 8 themselves are also more durable against high temperatures when the molten resin is poured and high temperatures during reflow, and the highly reliable electronic component 1 can be realized.

  Next, the lead terminal 8 will be described.

  A pair of lead terminals 8 are provided and connected to the multilayer capacitor 6 via the external electrode 3. Usually, it is often provided at both ends, but may be provided at both ends. For example, when the external electrode 3 is provided on the upper and lower surfaces of the multilayer capacitor 6, the lead terminals 8 may be connected to the upper and lower surfaces according to this. The lead terminal 8 is made of a material containing at least one of Cu, Zn, Ni, Ag, Au and the like, and the surface thereof may be subjected to single layer or multilayer plating.

  At this time, as described above, when formed of a material or alloy containing copper as a main component as a countermeasure against high temperatures, there is a problem that the wettability of the solder between the mounting substrate and the lead terminals 8 is weak, and reflow is performed at high temperatures. However, as described above, the solder used for the external electrode 3 can be solved by using a solder having a melting temperature of 240 ° C. or higher.

  Alternatively, it is also preferable to use 42 alloy for the lead terminal 8 to improve solder wettability and facilitate mounting.

  Next, the lead terminal 8 is connected to the external electrode 3, is appropriately processed into an appropriate shape, and is formed so as to protrude outside the exterior material 5.

In addition, the multilayer capacitor 6 to which the lead terminal 8 is connected is installed in a mold by hooking the lead terminal 8, and a molten resin is poured into the mold to form an exterior material 5. With this mold, the manufacturing process can be simplified and the electronic component 1 can be manufactured at a very low cost.

  Next, it will be described how to improve the impact resistance and the bending resistance by the structure of the lead terminal 8 while being such an easy and low-cost manufacturing.

  As shown in FIG. 2, if the lead terminal 8 has a structure that has a portion outside the exterior material 5 that is thicker than the thickness inside the exterior material 5, from the impact on the lead terminal 8 outside. It is possible to prevent the influence of the above, and to improve the impact resistance.

  Alternatively, as shown in FIG. 3, the elasticity of the lead terminal 8 can be improved if the lead terminal 8 has a structure in which the thickness of the lead terminal 8 is thinner than the thickness inside the exterior material 5. Therefore, the bending resistance can be improved.

  Alternatively, as shown in FIG. 4, if the thickness becomes thinner toward the tip, the elasticity of the lead terminal 8 can be improved and the bending resistance can be improved.

  On the contrary, as shown in FIG. 5, when the structure increases in thickness as it goes to the tip, there is a merit that it is possible to improve the impact resistance at the tip where a large impact or stress is applied.

  Further, as shown in FIG. 6, by making the protruding root portion the thickest, it is possible to prevent bending at the root portion.

  On the other hand, as shown in FIG. 7, the tip portion is made thickest, so that it is strong against stress applied to the tip portion, and further, the weight of the tip is increased, so that the mounting strength can be improved. is there.

  Next, as shown in FIG. 8, when the lead terminal 8 has a structure that protrudes from the bottom surface 9 adjacent to the corner portion instead of from the corner portion between the bottom surface 9 and the side surface of the exterior member 5, the bottom surface 9. A gap is formed between them and a relaxation absorption force is generated, so that the bending resistance is improved.

  Alternatively, as shown in FIG. 9, when the lead terminal 8 has a structure protruding from the side surface close to the bottom surface 9 of the exterior member 5 and the corner of the side surface, a gap is formed between the side surface and relaxed. Absorbing power is generated, and the bending resistance is improved.

  Next, the reinforcing material 10, the convex type reinforcing material 11, and the bottom surface reinforcing material 12 will be described.

  The reinforcing material 10 is provided on at least one of the exterior material 5 and the lead terminal 8, and is provided, for example, at a portion where the exterior material 5 and the lead terminal 8 intersect as shown in FIG. 10. By providing such a reinforcing material 10, it is possible to prevent an impact on the lead terminal 8 or an impact on the exterior material 5 itself.

  The reinforcing material 10 may be bonded after being formed separately from the exterior material 5, or may be integrally formed like the convex reinforcing material 11.

The convex-type reinforcing material 11 is provided with a portion to be a convex portion in the exterior material 5 in advance, and this is used as a reinforcing material. At this time, for example, the lead terminal 8 is bonded to the lead terminal 8, and the like. The impact resistance to 8 can also be improved.

  The bottom surface reinforcing material 12 is a reinforcing material provided on the mounting surface so as to cover at least a part of each of the exterior material 5 and the lead terminal 8, and the lead terminal 8 protrudes as shown in FIG. 12. The impact resistance of the lead terminal 8 is enhanced by supporting the bottom surface side of the portion.

  At this time, the bottom surface reinforcing member 12 may be provided so as to support the bottom surface 9 and a part of the lead terminal 8. However, as shown in FIG. 13, the bottom surface reinforcing member 12 is surrounded by the width of the lead terminal 8. In addition to the area, the bottom reinforcing member 12 may be formed of one sheet so as to cover a part of the lead terminal 8. With such a structure, there is an advantage that the bottom reinforcing member 12 can be easily formed.

  Further, the bottom reinforcing member 12 and the reinforcing member 10 or the convex reinforcing member 11 may be provided in appropriate combination. By using them in combination, it is possible to ensure strength.

  Further, since the bottom surface reinforcing material 12 is provided, a part of the mounting surface of the lead terminal 8 has a distance from the mounting substrate. Therefore, as shown in FIG. By disposing the bottom reinforcing member 12 in accordance with the recess, the distance between the mounting substrate and the mounting surface of the lead terminal 8 is not increased, and the mounting strength can be enhanced. .

  Further, as shown in FIGS. 15 to 17, it is also preferable to provide the reinforcing material 13 on the non-mounting surface of the lead terminal 8. By providing the reinforcing material 13 on the non-mounting surface of the lead terminal 8, the impact resistance that can prevent the influence of the lead terminal 8 from being bent or bent is improved.

  The reinforcing material 13 formed on the non-mounting surface of the lead terminal 8 only needs to be formed at any position on the non-mounting surface of the lead terminal 8, and as shown in FIG. It may be formed substantially at the center, may be formed at the peripheral edge of the lead terminal 8 as shown in FIG. 16, or may be formed at the tip of the lead terminal 8 as shown in FIG. Of course, it may be provided at the root of the lead terminal 8, at the root and tip, at the center and tip, or in various forms.

  Next, the deflection absorbing portion will be described.

  The flexure absorbing portion has a relaxation absorption capability of vibration and impact applied to the electronic component 1 after mounting, provided on the lead terminal 8, and improves the flex resistance of the lead terminal 8. As shown in FIGS. 18 to 23, the deflection absorbing portion has a shape such as a curved surface portion 15, a bent portion 16, or a wavy surface 17, and any one of them may be appropriately selected and formed. Any combination may be formed. Moreover, a plurality may be formed or a single number may be formed. Moreover, shapes other than the curved surface part 15 etc. may be sufficient.

  The bent portion 16 may have a substantially U-shaped side cross-section, and in this case, it is easy to manufacture. Further, the corrugated surface 17 is realized by forming an appropriate corrugated shape by rolling or the like when the lead terminal 8 is manufactured.

  Each of the curved surface portion 15, the bent portion 16, and the corrugated surface 17 may be appropriately selected. For example, when the lead terminal 8 is very long, if the corrugated surface 17 is formed, the mounting strength and the bending resistance are improved. The balance is optimal.

  Further, the curved surface portion 15 can optimize the balance between ease of manufacture and securing the strength of the lead terminal 8 itself. The bent portion 16 is preferable in terms of ease of manufacture.

  In addition, in order to have relaxation absorption power, it is preferable that the flexure absorbing portion is not soldered at the time of mounting but has a state of floating from the mounting substrate. Further, if these are appropriately combined, the respective goodnesses can be mixed, so that the improvement of the flex resistance can be adjusted to various levels.

  With such a form, the relaxation absorbing power is increased and the flexibility is improved.

  The deflection absorbing portion may be provided at the base of the lead terminal 8, at the tip, or between them. When it is provided at the base, the tip end amount of the deflection absorbing portion of the lead terminal 8 is increased, and the mounting strength is improved. On the contrary, when the deflection absorbing portion is provided at the tip of the lead terminal 8, the virtual space surrounded by the deflection absorbing portion is widened, so that the deflection absorbing force against larger vibration is increased.

  As shown in FIG. 24, even if the deflection absorbing portion is not provided, if the lead terminal 8 and the bottom surface 9 of the exterior material 5 are made non-parallel, the lead terminal 8 can be made elastic. Further, the elasticity may improve the bending resistance.

  Next, the inclined portion 20 will be described.

  The inclined portion 20 is an inclined portion provided at a corner portion where the lead terminal 8 protrudes from the exterior material 5, and has a shape such that the corner portion is cut out. The inclined portion 20 may be formed, and the outer packaging material 5 may be formed and then cut off.

  In addition, as shown in FIG. 25, the inclined portion 20 may have a substantially straight plane, a substantially arc surface as shown in FIG. 27, or a substantially straight plane. It is easy to form, and if it is a substantially circular arc surface, the impact resistance against the impact applied to the exterior member 5 is greatly improved.

  By projecting the lead terminal 8 from the inclined portion 20, the impact resistance of the projecting portion of the lead terminal 8, which is the weakest part of the exterior material 5, is susceptible to the occurrence of cracks, etc. However, the strength of the impact resistance eliminates the occurrence of cracks, improves the moisture resistance, and improves the reliability. Further, since the lead terminal 8 protrudes from the inclined portion 20, a margin is generated between the exterior material 5 and the lead terminal 8, a relaxation absorption force is generated, and the flex resistance is improved.

  Further, as shown in FIG. 26, the lead terminal 8 protrudes from the corner portion where the inclined portion 20 and the bottom surface 9 intersect, so that the margin between the outer casing material 5 is further increased and the bending resistance is further increased. It will improve.

  The inclined portion 20 may not be formed over the entire surface of the protruding corner portion of the lead terminal 8, but may be formed in accordance with the width of the protruding lead terminal 8 or over a larger width. Is.

  Next, the dent portion 22 will be described.

  The recessed portion 22 is a recessed portion provided at a corner portion where the lead terminal 8 protrudes from the exterior material 5. Due to the presence of the recessed portion 22, a space is generated between the protruding lead terminal 8 and the exterior material 5. This provides a margin and improves the bending resistance of the lead terminal 8.

  In addition, the dent part 22 may be integrally formed beforehand by the metal mold | die used when forming the exterior material 5, or after the exterior material 5 is formed, it may be formed by shaving off etc. It is.

  Further, the recess 22 may be formed over the entire corner, or may be formed only for the width in which the lead terminal 8 protrudes. Furthermore, the dent portion 22 may be a square dent portion 22, a semicircular dent portion 22, other shapes, or various forms. It ’s good.

  Next, the chamfer 21 will be described.

  The chamfer 21 is provided at a corner other than the corner from which the lead terminal 8 of the exterior member 5 protrudes, and the chamfer 21 may have an arcuate surface, R, or a cut shape with a substantially straight plane. Further, the chamfer 21 may be formed integrally with the mold when the exterior material 5 is formed, or may be processed after the exterior material 5 is formed.

  By forming such a chamfer 21, the impact resistance of corner portions that are vulnerable to impact is increased, and the durability of the exterior material is improved, and the moisture resistance is improved accordingly. .

  Next, the convex part 23 is demonstrated.

  The convex portion 23 is provided on the bottom surface 9 of the exterior material 5 and is provided on a portion where the lead terminal 8 protrudes.

  The convex portion 23 may be formed integrally with the exterior material 5, or may be integrated after being formed separately. Moreover, the same material as an exterior material may be sufficient, and another material may be sufficient.

  However, for example, when molten resin or the like is poured into a mold or the like in which the multilayer capacitor 6 is installed, only the periphery of the lead terminal 8 protruding from the bottom surface 9 of the molten resin rises due to surface tension. Furthermore, when the poured resin is solidified while maintaining the lead terminal 8 at a temperature lower than the surrounding temperature, the outer packaging material 5 is formed while the swell remains. Thereby, the convex part 23 is formed automatically.

  Alternatively, after the exterior material 5 is once formed, the protrusions 23 may be formed by forming a bulge by a resin around the terminal portions 4 and the lead terminals 8 that are separately projected.

  In addition, the convex part 23 may be a substantially triangular prism or a semi-cylinder, and when formed using the surface tension at the time of solidification of the molten resin as described above, at the base of the lead terminal 8. In many cases, the shape becomes wider toward the bottom, but other shapes may be used as a matter of course.

  Moreover, although the convex part 23 may be formed in any position in the bottom face 9, it is located inside the bottom face 9 rather than the corner | angular part where the side surface of the exterior material 5 and the bottom face 9 cross | intersect. Is preferred. This is because the protrusion of the lead terminal 8 can secure a certain distance from the side surface of the exterior member 5 and has a relaxation absorption force against stress from the side surface direction.

  Further, since the lead terminal 8 protrudes from the convex portion 23, a space is naturally generated on the bottom surface of the lead terminal 8 and the exterior material 5, and this space becomes a margin as it is and vibration applied to the electronic component 1. This improves the resistance to bending. Further, when the convex portion 23 is provided on the bottom surface 9 at a position inside the corner portion between the side surface and the bottom surface 9 as described above, a distance from the side surface also occurs, and vibration applied in the horizontal direction, It is possible to cope with the vibration applied in the vertical direction and the three-dimensional vibration of the combined vibration, and the flex resistance of the lead terminal 8 is very strong enough to cope with the three-dimensional thing. Become.

  In addition, as shown in FIG. 31, the lead terminal 8 protrudes once from the convex portion 23 and protrudes below the bottom surface 9, and then bent into a substantially L shape, thereby further improving the bending resistance. Become.

  Regardless of whether or not the convex portion 23 is present, the lead terminal 8 may be bent outward and may be bent inward after protruding. When bent outward, the mounting strength can be improved, and when bent outward, the mounting area can be reduced.

  Further, the lead terminal 8 may protrude from the tip of the convex portion 23 or may protrude from the side surface portion.

  The electronic component 1 having the above-described structure enables the electronic component 1 to have a high flexibility and a long life while maintaining a low cost, and the electronic device on which the electronic component 1 is mounted It is possible to realize durability and long life.

  In particular, by using a material mainly composed of Ag and Pd for the internal electrode of the multilayer capacitor, it can be made excellent in heat resistance, so that the molten resin forming the exterior material 5 can be poured or mounted. It can withstand high temperatures during reflow, and can be formed with a simple manufacturing process. It is sealed by a high-impact, durable, and highly flexible exterior material at a low cost. A molded electronic component 1 having a high capacity and a high withstand voltage can be realized, which contributes to a long life and improved reliability of an electronic device to which this is applied.

The present invention provides a multilayer capacitor having a dielectric substrate with an internal electrode embedded therein, a pair of lead terminals provided in the multilayer capacitor, a part of the lead terminals, the multilayer capacitor, and an exterior material that covers the terminal portion. The internal electrode is formed of a material containing Ag and Pd, and the exterior material is either a substantially rectangular parallelepiped, a substantially cubic, or a substantially rectangular pillar,
For applications that require high impact resistance, moisture resistance, durability, and highly flexible electronic parts while maintaining low manufacturing costs due to the structure in which the terminal part protrudes from the bottom and side corners of the exterior material Is also applicable.

The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The side view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention The top view of the electronic component in embodiment of this invention Side view of electronic components in the prior art Side view of electronic components in the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 3 External electrode 5 Exterior material 6 Multilayer capacitor 7 Internal electrode 8 Lead terminal 9 Bottom surface 10, 13 Reinforcing material 11 Convex-type reinforcing material 12 Bottom surface reinforcing material 15 Curved surface portion 16 Bending portion 17 Wavy surface 20 Inclined portion 21 Chamfer 22 Dented part 23 Convex part 100 Electronic component 101 Multilayer capacitor 102 Internal electrode 103 Electrode 104 Lead terminal

Claims (48)

A multilayer capacitor having a dielectric substrate with embedded internal electrodes;
A pair of lead terminals provided in the multilayer capacitor;
An electronic component having an exterior material covering a part of the lead terminal and the multilayer capacitor, wherein the internal electrode is formed of a material containing Ag and Pd,
The exterior material is either a substantially rectangular parallelepiped, or a substantially cubic, or a substantially rectangular pillar,
The electronic component according to claim 1, wherein the lead terminal protrudes from a corner portion of the bottom surface and side surface of the exterior member or from the vicinity thereof. 2. The electronic component according to claim 1, wherein the lead terminal has a portion where the thickness outside the exterior material is thicker than the thickness inside the exterior material. 2. The electronic component according to claim 1, wherein the lead terminal protruding to the outside of the exterior material has a portion whose thickness outside the exterior material is thinner than the thickness inside the exterior material. The electronic component according to claim 1, wherein the protruding lead terminal has a thickness that increases toward the tip. The electronic component according to claim 1, wherein the protruding lead terminal has a thickness that decreases toward a tip. 6. The electronic component according to claim 1, wherein the lead terminal projecting outside the exterior material has the thickest thickness at the projecting portion. 6. The electronic component according to claim 1, wherein a tip end portion of the terminal portion has the largest thickness in the lead terminal protruding outside the exterior material. The said lead terminal protrudes from the position close | similar to the position which is the bottom face of the said exterior material, and the bottom face and side surface of the said exterior material cross | intersect. Electronic components. The electron according to any one of claims 1 to 8, wherein the lead terminal protrudes from a position on a side surface of the exterior material and close to a position where a bottom surface and a side surface of the exterior material intersect. parts. The electronic component according to any one of claims 1 to 9, wherein a reinforcing material is provided on at least one of the exterior material or the lead terminals protruding outside the exterior material. The electronic component according to claim 10, wherein the reinforcing material enhances impact resistance of the lead terminal protruding from the exterior material. The electronic component according to claim 10, wherein the reinforcing material is provided at an intersection of the exterior material and a lead terminal protruding from the exterior material. The electronic component according to claim 10, wherein the reinforcing material is a reinforcing member bonded to at least one of the exterior material or a lead terminal protruding from the exterior material. The electronic component according to claim 10, wherein the reinforcing material is a convex-type reinforcing material protruding from the exterior material. In addition to or instead of the reinforcing material, the outer material and the bottom surface of the protruding lead terminal are formed so as to cover at least a part of both the outer material and the lead terminal protruding from the outer material. The electronic component according to claim 10, further comprising a bottom reinforcing material. 16. The electronic component according to claim 15, wherein the bottom reinforcing material is formed from the entire bottom surface of the exterior material to a part of the protruding lead terminal. The electronic component according to claim 15, wherein the bottom reinforcing material is formed by applying a paste resin to a bottom surface of the exterior material. The electronic component according to claim 10, wherein the reinforcing material is provided on any part of a non-mounting surface of the lead terminal protruding from the exterior material. The electronic component according to claim 10, wherein the reinforcing material is formed along a peripheral edge portion of a non-mounting surface of the lead terminal protruding from the exterior material. The reinforcing material is a non-mounting surface of a lead terminal protruding from the exterior material, and is formed along the approximate center in the longitudinal direction of the lead terminal. Electronic components described in The electronic component according to claim 10, wherein the reinforcing material is a non-mounting surface of the lead terminal protruding from the exterior material, and is provided at a tip portion of the lead terminal. . The electronic component according to any one of claims 1 to 21, wherein a deflection absorbing portion is provided at any position of the lead terminal protruding to the outside of the exterior material. 23. The electronic component according to claim 22, wherein the deflection absorbing portion is an arcuate curved surface portion provided at any position of the protruding lead terminal. 23. The electronic component according to claim 22, wherein the deflection absorbing portion is a bent portion provided at any position of the protruding lead terminal. 25. The electronic component according to claim 24, wherein the bent portion has a substantially U-shaped cross-sectional shape. 23. The electronic component according to claim 22, wherein the deflection absorbing portion is a wavy surface provided at any position of the protruding lead terminal. 27. The electronic component according to claim 22, wherein a plurality of the deflection absorbing portions are provided on the protruding lead terminals. Either of the curved surface portion, the bent portion, or the corrugated surface is combined as the deflection absorbing portion, and is provided on the protruding lead terminal. The electronic component according to 1. The electron according to any one of claims 22 to 28, wherein the deflection absorbing portion is provided at a position where the protruding lead terminal is close to a protruding root portion protruding from the exterior material. parts. The electronic component according to any one of claims 22 to 28, wherein the deflection absorbing portion is provided at a leading end portion of the protruding lead terminal. 31. The electronic component according to claim 1, wherein a main surface of the lead terminal protruding from the exterior material and a bottom surface of the exterior material are non-parallel to each other. The electronic component according to any one of claims 1 to 31, wherein the exterior member is provided with an inclined portion at a corner portion from which the lead terminal protrudes. The electronic component according to claim 32, wherein the lead terminal protrudes from a corner portion where the inclined portion and the bottom surface of the exterior material intersect. The electronic component according to any one of claims 32 to 33, wherein the inclined portion has a substantially rectangular shape. The electronic component according to any one of claims 32 to 34, wherein the inclined portion has a substantially arc planar shape. 36. The electronic component according to any one of claims 32 to 35, wherein the corner portion of the exterior material is chamfered at a portion other than the corner portion at which the lead terminal protrudes. The lead terminal protruding from a corner portion where the inclined portion and the bottom surface of the exterior material intersect with each other is once extended downward from the bottom surface of the exterior material and bent into a substantially L shape. The electronic component according to any one of 32 to 36. 32. The electronic component according to claim 1, wherein a dent is provided in a corner portion of the exterior material from which the lead terminal protrudes. The electronic component according to any one of claims 1 to 31, wherein a convex portion is provided at a corner portion of the exterior material on which the lead terminal protrudes. 40. The electronic component according to claim 39, wherein the convex portion is provided on the inner side by a predetermined distance from the bottom surface and the corners of the side surface of the exterior material on the bottom surface. 41. The electronic component according to claim 39, wherein the lead terminal protrudes from any one of a tip end and a side surface of the convex portion. The external electrode for electrically connecting the multilayer capacitor and the pair of lead terminals is formed between the multilayer capacitor and the pair of lead terminals. Or the electronic component according to claim 1. 43. The electronic component according to claim 42, wherein in the external electrode, the multilayer capacitor and the lead terminal are connected by solder containing tin as a main component. The lead terminal is formed of a material mainly composed of copper.
43. The electronic component according to any one of 43. The external electrode is formed of a material mainly composed of copper, and the multilayer capacitor and the pair of lead terminals are connected via the external electrode, and solder having a melting point of 240 ° C. or more is used. The electronic component according to claim 1, wherein the electronic component is formed of a material mainly composed of. 44. The electronic component according to claim 1, wherein the lead terminal is made of 42 alloy. 47. The electronic component according to claim 1, wherein a plurality of the multilayer capacitors are sealed inside the exterior material. 48. The electronic component according to claim 1, wherein a plurality of pairs of the lead terminals are connected to the multilayer capacitor formed of a single substrate.

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