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JP2006120996A - Circuit module - Google Patents

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Publication number
JP2006120996A
JP2006120996A JP2004309813A JP2004309813A JP2006120996A JP 2006120996 A JP2006120996 A JP 2006120996A JP 2004309813 A JP2004309813 A JP 2004309813A JP 2004309813 A JP2004309813 A JP 2004309813A JP 2006120996 A JP2006120996 A JP 2006120996A
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Prior art keywords
circuit board
heat
generating component
circuit
heat generating
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Atsushi Yamauchi
淳 山内
Hiroaki Kitada
宏明 北田
Masakazu Hori
堀　　正和
Osamu Tamakoshi
修 玉越
Makoto Fujita
真 藤田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2004309813A priority Critical patent/JP2006120996A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit module which has sufficient radiating power even if the module is provided with a heating component enough to radiate heat from the heating component. <P>SOLUTION: A heating component 100 is mounted on the upper face 10a of a lower layer circuit board 1, and its bottom is connected to a thermal via 14 for conducting heat to the lower face 10b of the lower layer circuit board 1 to which inter-layer connecting members 3 lays an upper layer circuit board 2 at a specified height. The top face of the heating component 100 is adhered to the lower face 20b of the upper layer circuit board 2 with a conductive adhesive 6. This conducts heat to a high-radiating base board near the lower face of the lower layer circuit board 1 through the thermal via 14 from the bottom face of the heating component 100, and also to the base board through the upper layer circuit board 2, the inter-layer connecting members 3 and the lower layer circuit board 1 from the top face of the heating component 100. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、複数の回路部品が実装されて所定の機能を果たす回路モジュール、特に、発熱部品を備えた回路モジュールに関するものである。   The present invention relates to a circuit module in which a plurality of circuit components are mounted to perform a predetermined function, and more particularly to a circuit module having a heat generating component.

従来、携帯電話機等の通信機器の小型化にともない、複数の機能部をそれぞれ個別のＩＣや回路で実現するのではなく、複数の機能部を単一の回路モジュールで形成して、この回路モジュールを通信機器のベース基板に実装する構造が多く用いられている。その一例として、携帯電話機におけるディジタル処理部とアンテナとの間に接続されるＲＦ回路も単一の回路モジュールで形成されるようになってきている。しかしながら、ＲＦ回路内には送信信号を増幅するパワーアンプが必要である。このようなパワーアンプは動作時に発熱する発熱部品であるので、この場合、回路モジュール内に発熱部品が配置されることとなる。そして、このパワーアンプのような発熱部品を備えた回路モジュールでは、発熱部品から発する熱を放熱する必要がある。   Conventionally, with the miniaturization of communication devices such as mobile phones, a plurality of functional units are not realized by individual ICs or circuits, but a plurality of functional units are formed by a single circuit module. In many cases, a structure is used in which is mounted on a base substrate of a communication device. As an example, an RF circuit connected between a digital processing unit and an antenna in a mobile phone is also formed by a single circuit module. However, a power amplifier that amplifies the transmission signal is required in the RF circuit. Since such a power amplifier is a heat generating component that generates heat during operation, the heat generating component is disposed in the circuit module in this case. In a circuit module having a heat generating component such as this power amplifier, it is necessary to dissipate heat generated from the heat generating component.

このような放熱を考慮した回路モジュールが、例えば特許文献１に開示されている。特許文献１では、複数層からなる回路モジュールの発熱部品の実装位置に、この発熱部品が実装された基板の上面から下面に熱伝導する放熱用貫通配線、いわゆるサーマルビアが形成されており、このサーマルビアを形成することにより、発熱部品からの熱を外部に放熱している。
特開２００３−１００９３７公報 A circuit module considering such heat dissipation is disclosed in, for example, Patent Document 1. In Patent Document 1, a heat radiating through-wiring that conducts heat from the upper surface to the lower surface of the substrate on which the heat generating component is mounted, that is, a so-called thermal via, is formed at the mounting position of the heat generating component of the circuit module composed of multiple layers. By forming the thermal via, the heat from the heat generating component is radiated to the outside.
Japanese Patent Laid-Open No. 2003-1000093

しかしながら、特許文献１に記載の回路モジュールでは、サーマルビアを介して発熱部品からの熱を外部に放熱しているが、発熱部品からの放熱がサーマルビアのみに依存するため放熱量が不十分になる可能性があった。   However, in the circuit module described in Patent Document 1, heat from the heat generating component is radiated to the outside through the thermal via, but since the heat radiation from the heat generating component depends only on the thermal via, the heat radiation amount is insufficient. There was a possibility.

したがって、この発明の目的は、発熱部品を備えていても、十分な放熱能力を有し、発熱部品からの熱を十分放熱することができる回路モジュールを提供することにある。   Accordingly, an object of the present invention is to provide a circuit module that has a sufficient heat dissipation capability and can sufficiently dissipate heat from the heat generating component even if the heat generating component is provided.

この発明は、発熱部品を含む複数の回路部品が備えられた回路モジュールにおいて、発熱部品が上面に実装されるとともに下面で外部基板に実装される下層回路基板と、発熱部品の天面が下面に接触する上層回路基板と、を備えたことを特徴としている。   According to the present invention, in a circuit module including a plurality of circuit components including a heat generating component, the heat generating component is mounted on the upper surface and the lower surface circuit substrate is mounted on the external substrate on the lower surface, and the heat generating component has the top surface on the lower surface. And an upper circuit board in contact therewith.

この構成では、外部基板に直接実装される下層回路基板に発熱部品が実装されることで、発熱部品からの熱が下層回路基板に伝導されるとともに、この下層回路基板から外部基板に熱が伝導されて放熱される。さらに、発熱部品からの熱はこの発熱部品の天面が接触している上層回路基板にも伝導されて放熱される。   In this configuration, the heat generation component is mounted on the lower circuit board that is directly mounted on the external board, so that the heat from the heat generation component is conducted to the lower circuit board and the heat is conducted from the lower circuit board to the external board. Is dissipated. Furthermore, the heat from the heat generating component is also conducted to the upper layer circuit board with which the top surface of the heat generating component is in contact and is dissipated.

また、この発明の回路モジュールは、下層回路基板における発熱部品の実装位置に、上面と下面との間を熱伝導させるサーマルビアを備えたことを特徴としている。   The circuit module according to the present invention is characterized in that a thermal via for conducting heat between the upper surface and the lower surface is provided at a mounting position of the heat generating component on the lower circuit board.

この構成では、発熱部品からの熱がサーマルビアを介して発熱部品の実装面すなわち下層回路基板の上面から下層回路基板の下面に短距離で伝導される。下層回路基板は下面で外部基板に実装されているので、下層回路基板の下面に伝導された熱は外部基板に伝導されて、下層回路基板とともに外部基板からも放熱される。   In this configuration, heat from the heat generating component is conducted through the thermal via at a short distance from the mounting surface of the heat generating component, that is, from the upper surface of the lower circuit board to the lower surface of the lower circuit board. Since the lower circuit board is mounted on the external board on the lower surface, the heat conducted to the lower surface of the lower circuit board is conducted to the external board and dissipated from the external board together with the lower circuit board.

また、この発明の回路モジュールは、上層回路基板と下層回路基板とを接続する層間接続部材を備え、この層間接続部材が上層回路基板と下層回路基板とを熱伝導させる層間熱伝導手段となることを特徴としている。   The circuit module of the present invention includes an interlayer connection member for connecting the upper circuit board and the lower circuit board, and the interlayer connection member serves as an interlayer heat conduction means for conducting heat between the upper circuit board and the lower circuit board. It is characterized by.

この構成では、上層回路基板に伝導した熱が層間熱伝導手段の役割を果たす層間接続部材により下層回路基板に伝導される。これにより、発熱部品から直接下層回路基板に伝導された熱とともに、上層回路基板から層間接続部材（層間熱伝導手段）により下層回路基板に伝導された熱も外部基板に伝導されて放熱される。   In this configuration, the heat conducted to the upper circuit board is conducted to the lower circuit board by the interlayer connection member serving as an interlayer heat conduction means. As a result, the heat conducted from the heat generating component directly to the lower circuit board and the heat conducted from the upper circuit board to the lower circuit board by the interlayer connection member (interlayer heat conduction means) are also conducted to the external board and dissipated.

また、この発明の回路モジュールは、層間接続部材を導電性材料にするとともに、上層回路基板における発熱部品の接触する位置に電極を備え、さらにこの電極と層間接続部材とに接続または近接する導電性材料からなる基板面熱伝導手段を上層回路基板に備えたことを特徴としている。   In the circuit module of the present invention, the interlayer connection member is made of a conductive material, and an electrode is provided at a position where the heat generating component is in contact with the upper layer circuit board. Further, the conductivity is connected to or close to the electrode and the interlayer connection member. An upper layer circuit board is provided with a substrate surface heat conduction means made of a material.

この構成では、層間接続部材が導電性材料であることで層間の熱伝導性が向上し、上層回路基板の発熱部品の接触位置に電極が形成されることで発熱部品から上層回路基板への熱伝導性が向上する。さらに、これら電極と層間接続部材との間に基板面伝導手段が備えられることで、発熱部品からの熱が、前記電極から基板面伝導手段を介して層間接続部材に高効率に伝導される。   In this configuration, the interlayer connection member is made of a conductive material, so that the thermal conductivity between the layers is improved, and an electrode is formed at the contact position of the heating component of the upper circuit board, so that the heat from the heating component to the upper circuit board is formed. Conductivity is improved. Furthermore, by providing the substrate surface conduction means between these electrodes and the interlayer connection member, the heat from the heat generating component is efficiently conducted from the electrodes to the interlayer connection member via the substrate surface conduction means.

また、この発明の回路モジュールは、下層回路基板における層間接続部材の接続する位置に、上面と下面との間を熱伝導させるサーマルビアを備えたことを特徴としている。   In addition, the circuit module of the present invention is characterized in that a thermal via for conducting heat between the upper surface and the lower surface is provided at a position where the interlayer connection member is connected on the lower circuit board.

この構成では、下層回路基板における層間接続部材の接続する位置にサーマルビアが存在することで、層間接続部材を介して上層回路基板から下層回路基板に伝導された熱がサーマルビアにより短距離で下層回路基板の下面に伝導される。   In this configuration, since there is a thermal via at the position where the interlayer connection member is connected on the lower circuit board, the heat conducted from the upper circuit board to the lower circuit board via the interlayer connection member is short-range by the thermal via in a short distance. Conducted to the lower surface of the circuit board.

この発明によれば、発熱部品からの熱が下層回路基板およびこの下層回路基板に直接接続する外部基板により効果的に放熱されるとともに、上層回路基板からも放熱されるので、放熱性に優れる回路モジュールを構成することができる。   According to the present invention, the heat from the heat-generating component is effectively radiated by the lower circuit board and the external board directly connected to the lower circuit board, and is also radiated from the upper circuit board. Modules can be configured.

また、この発明によれば、発熱部品からの熱がサーマルビアを介して短距離で下層回路基板の下面に伝導されてこの下面から外部基板に伝導されるので、さらに放熱性に優れる回路モジュールを構成することができる。   Further, according to the present invention, the heat from the heat generating component is conducted to the lower surface of the lower circuit board through the thermal via at a short distance and then conducted from the lower surface to the external substrate. Can be configured.

また、この発明によれば、上層回路基板に伝導された熱が層間熱伝導手段の役割を果たす層間接続部材により下層回路基板に伝導され、下層回路基板から外部基板に伝導されるので、上層回路基板に伝導された熱も放熱され易くなり、さらに放熱性に優れる回路モジュールを構成することができる。   Further, according to the present invention, the heat conducted to the upper circuit board is conducted to the lower circuit board by the interlayer connection member serving as an interlayer heat conduction means, and is conducted from the lower circuit board to the external board. The heat conducted to the substrate is also easily radiated, and a circuit module with excellent heat dissipation can be configured.

また、この発明によれば、上層回路基板に発熱部品からの熱を層間熱伝導手段の役割を果たす層間接続部材に効率良く伝導する伝導経路が導電性部材により形成されるので、さらに放熱性に優れる回路モジュールを構成することができる。   Further, according to the present invention, since the conductive path for efficiently conducting heat from the heat-generating component to the interlayer connection member serving as the interlayer heat conduction means is formed on the upper circuit board by the conductive member, the heat dissipation is further improved. An excellent circuit module can be configured.

また、この発明によれば、上層回路基板から層間接続部材を介して下層回路基板に伝達された熱が下層回路基板に設けられたサーマルビアで下層回路基板の下面に伝導されるので、上層回路基板から下層回路基板の下面までの熱伝導性が向上し、さらに放熱性に優れる回路モジュールを構成することができる。   According to the present invention, the heat transferred from the upper circuit board to the lower circuit board through the interlayer connection member is conducted to the lower surface of the lower circuit board by the thermal via provided in the lower circuit board. The thermal conductivity from the substrate to the lower surface of the lower circuit board can be improved, and a circuit module having excellent heat dissipation can be configured.

本発明の第１の実施形態に係る回路モジュールについて、図を参照して説明する。
図１は本実施形態の回路モジュールの概略構成を示す側面断面図である。なお、図１における太線矢印は主な熱伝導経路を示す。 A circuit module according to a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a side sectional view showing a schematic configuration of the circuit module of the present embodiment. In addition, the thick line arrow in FIG. 1 shows the main heat conduction paths.

回路モジュールは、それぞれに所定機能を有する回路部品を実装するとともに、これら回路部品とともに所定の電気回路を形成する回路電極パターンを備えた下層回路基板１と上層回路基板２とを備える。これら下層回路基板１と上層回路基板２とは半田柱、金属球等の導電性部材により構成される層間接続部材３により、所定の間隔（高さ）をもって、電気的および機械的に接続されており、さらに加えて両層間の熱伝導を行う。ここで、層間接続部材３が本発明の「層間熱伝導手段」に相当する。   The circuit module includes a lower circuit board 1 and an upper circuit board 2 each having a circuit electrode pattern for mounting a circuit component having a predetermined function and forming a predetermined electric circuit together with the circuit component. The lower circuit board 1 and the upper circuit board 2 are electrically and mechanically connected to each other at a predetermined interval (height) by an interlayer connection member 3 composed of a conductive member such as a solder column or a metal ball. In addition, it conducts heat between the two layers. Here, the interlayer connection member 3 corresponds to the “interlayer heat conduction means” of the present invention.

下層回路基板１の上層回路基板２側の面（上面）１０ａには、所定の電気回路を構成する回路電極パターン１１と、層間接続部材３に接続する接続電極パターン１３とが形成されている。また、下層回路基板１の上面１０ａには、パワーアンプ等の発熱部品１００を実装する発熱部品用実装電極（図示せず）と、この発熱部品１００に対するサーマルビア１４の上面側電極１５とが形成されている。一方、下層回路基板１の下面１０ｂには、この回路モジュールが実装されるベース基板に接続するためのベース基板接続用電極１２と、サーマルビア１４の下面側電極１６とが形成されている。ここで、上面側電極１５と下面側電極１６とは下層回路基板１における上面、下面の対向する位置に形成されており、下層回路基板１に形成された導電性材料により内部が充填された複数のビア１７により導通されている。そして、これら複数のビア１７、上面側電極１５、および下面側電極１６によりサーマルビア１４が構成されて、上面１０ａ側と下面１０ｂ側との電気伝導および熱伝導が可能になっている。
また、下層回路基板１の上面１０ａ側の回路電極パターン１１および接続電極パターン１３と下面１０ｂ側のベース基板接続用電極１２とは、図示しないスルーホール等により導通されており、所定の電気回路が構成されている。 On the surface (upper surface) 10a on the upper circuit board 2 side of the lower circuit board 1, a circuit electrode pattern 11 constituting a predetermined electric circuit and a connection electrode pattern 13 connected to the interlayer connection member 3 are formed. On the upper surface 10 a of the lower circuit board 1, a heat generating component mounting electrode (not shown) for mounting the heat generating component 100 such as a power amplifier and an upper surface side electrode 15 of the thermal via 14 for the heat generating component 100 are formed. Has been. On the other hand, on the lower surface 10b of the lower circuit board 1, a base substrate connection electrode 12 for connecting to the base substrate on which the circuit module is mounted and a lower surface side electrode 16 of the thermal via 14 are formed. Here, the upper surface side electrode 15 and the lower surface side electrode 16 are formed at positions where the upper surface and the lower surface of the lower circuit board 1 are opposed to each other, and a plurality of conductive materials formed on the lower circuit board 1 are filled inside. The via 17 is conducted. The plurality of vias 17, the upper surface side electrode 15, and the lower surface side electrode 16 constitute a thermal via 14, and electrical conduction and heat conduction between the upper surface 10 a side and the lower surface 10 b side are possible.
In addition, the circuit electrode pattern 11 and the connection electrode pattern 13 on the upper surface 10a side of the lower circuit board 1 and the base substrate connection electrode 12 on the lower surface 10b side are electrically connected by a through hole (not shown), and a predetermined electric circuit is connected. It is configured.

さらに、下層回路基板１の上面の前記発熱部品用実装電極にはベアチップ状の発熱部品１００がフリップチップ実装されており、この発熱部品１００は半田等の導電性接続部材５によりサーマルビア１４の上面側電極１５に接続されている。   Furthermore, a bare chip-shaped heat generating component 100 is flip-chip mounted on the mounting electrode for the heat generating component on the upper surface of the lower circuit board 1. It is connected to the side electrode 15.

上層回路基板２の上面２０ａには、所定の電気回路を構成する回路電極パターン２１が形成されており、上面２０ａ側の回路電極パターン２１に所定機能を備える回路部品４ａ〜４ｃが実装されている。これら回路部品４ａ〜４ｃとしては、本回路モジュールがＲＦ回路モジュールであり、発熱部品１００がパワーアンプであるとした場合に、例えば、高周波信号処理ＩＣやＲＦフィルタやアンテナスイッチ等に相当するものである。なお、本実施形態の例では、下層回路基板１に発熱部品１００のみが実装されているが、下層回路基板１の上面１０ａや
上層回路基板２の下面２０ｂに他の回路部品が実装されていてもよい。 A circuit electrode pattern 21 constituting a predetermined electric circuit is formed on the upper surface 20a of the upper circuit board 2, and circuit components 4a to 4c having a predetermined function are mounted on the circuit electrode pattern 21 on the upper surface 20a side. . As these circuit components 4a to 4c, when this circuit module is an RF circuit module and the heat generating component 100 is a power amplifier, for example, it corresponds to a high-frequency signal processing IC, an RF filter, an antenna switch, or the like. is there. In the example of this embodiment, only the heat generating component 100 is mounted on the lower circuit board 1, but other circuit components are mounted on the upper surface 10 a of the lower circuit board 1 and the lower surface 20 b of the upper circuit board 2. Also good.

また、上層回路基板２の下面２０ｂには、下層回路基板１の上面１０ａ側に実装された発熱部品１００の上面が導電性接着剤６を用いて接着されている。また、上層回路基板２の下面２０ｂには、所定の電気回路を構成する回路電極パターン２２と層間接続部材３に接続する接続電極パターン２３とが形成されている。また、上層回路基板２の上面２０ａ側の回路電極パターン２１と下面２０ｂ側の回路電極パターン２２および接続電極パターン２３とは、図示しないスルーホール等により導通されており所定の電気回路が構成されている。   Further, the upper surface of the heat generating component 100 mounted on the upper surface 10 a side of the lower circuit board 1 is bonded to the lower surface 20 b of the upper circuit board 2 using the conductive adhesive 6. Further, a circuit electrode pattern 22 constituting a predetermined electric circuit and a connection electrode pattern 23 connected to the interlayer connection member 3 are formed on the lower surface 20 b of the upper circuit board 2. In addition, the circuit electrode pattern 21 on the upper surface 20a side, the circuit electrode pattern 22 on the lower surface 20b side, and the connection electrode pattern 23 of the upper circuit board 2 are electrically connected by a through hole or the like (not shown) to form a predetermined electric circuit. Yes.

そして、このように形成された下層回路基板１と上層回路基板２とが層間接続部材３により電気的に接続されることで、全体として所定機能（例えば、ＲＦ回路機能等）を備える回路モジュールが形成される。   Then, the lower circuit board 1 and the upper circuit board 2 formed in this way are electrically connected by the interlayer connection member 3 so that a circuit module having a predetermined function (for example, an RF circuit function) as a whole It is formed.

このような構成の回路モジュールでは、次に示すように発熱部品１００の放熱が行われる。なお、以下の説明では、主な放熱経路のみを示し、詳細な説明は省略するが、発熱部品１００から下層回路基板１と上層回路基板２とに囲まれる空間への直接放射や、下層回路基板１、上層回路基板２内での拡散放熱も存在し、発熱部品１００の放熱を助長している。
（第１の放熱経路）
発熱部品１００で発生した熱は、導電性接続部材５を介してサーマルビア１４に伝導される。サーマルビア１４では、まず上面側電極１５に発熱部品１００からの熱が伝導され、複数のビア１７を介して下面側電極１６に伝導される。下面側電極１６に伝導された熱は、この下層回路基板１の下面に近接するベース基板（図示せず）に伝搬される。一般に、ベース基板は回路モジュールよりも放熱性が高い。このため、ベース基板への接続に導電性を有する導電性接続部材５およびサーマルビア１４を用いることで高い熱伝導性を有することができ、効率良く放熱することができる。 In the circuit module having such a configuration, heat generation from the heat generating component 100 is performed as follows. In the following description, only main heat dissipation paths are shown, and detailed description is omitted. However, direct radiation from the heat generating component 100 to the space surrounded by the lower circuit board 1 and the upper circuit board 2, or lower circuit board 1. There is also diffusion heat dissipation in the upper circuit board 2, which promotes heat dissipation of the heat generating component 100.
(First heat dissipation path)
Heat generated in the heat generating component 100 is conducted to the thermal via 14 through the conductive connection member 5. In the thermal via 14, first, heat from the heat generating component 100 is conducted to the upper surface side electrode 15, and is conducted to the lower surface side electrode 16 through the plurality of vias 17. The heat conducted to the lower surface side electrode 16 is propagated to a base substrate (not shown) adjacent to the lower surface of the lower circuit board 1. In general, the base substrate has higher heat dissipation than the circuit module. For this reason, by using the conductive connection member 5 and the thermal via 14 having conductivity for connection to the base substrate, high thermal conductivity can be obtained, and heat can be efficiently radiated.

（第２の放熱経路）
発熱部品１００で発生した熱は、導電性接着剤６を介して上層回路基板２の下面２０ｂに伝導される。上層回路基板２の下面２０ｂに伝導された熱は、上層回路基板２内の、特に下面２０ｂ付近を介して接続電極パターン２３に伝導される。上層回路基板２の接続電極パターン２３に伝導された熱は、層間接続部材３を介して下層回路基板１の接続電極パターン１３に伝導される。下層回路基板１の上面１０ａ側に伝導された熱は、下層回路基板１内を介して下面１０ｂ側に伝導される。そして、この伝導された熱は、ベース基板接続用電極１２および下層回路基板１とベース基板とに挟まれる空間を介してベース基板に伝導（伝搬）されて放熱される。この際、層間接続部材３が導電性であることにより、下層回路基板１と上層回路基板２との間で高い熱伝導性を有することができ、効率良く放熱することができる。なお、上層回路基板２から下層回路基板１に伝導されなかった熱も上層回路基板２自身をヒートシンクとして空気中に放熱される。 (Second heat dissipation path)
Heat generated in the heat generating component 100 is conducted to the lower surface 20 b of the upper circuit board 2 through the conductive adhesive 6. The heat conducted to the lower surface 20 b of the upper circuit board 2 is conducted to the connection electrode pattern 23 through the upper circuit board 2, particularly near the lower surface 20 b. The heat conducted to the connection electrode pattern 23 of the upper circuit board 2 is conducted to the connection electrode pattern 13 of the lower circuit board 1 through the interlayer connection member 3. Heat conducted to the upper surface 10 a side of the lower circuit board 1 is conducted to the lower surface 10 b side through the lower circuit board 1. Then, the conducted heat is conducted (propagated) to the base substrate through the space between the base substrate connection electrode 12 and the lower circuit board 1 and the base substrate to be dissipated. At this time, since the interlayer connection member 3 is conductive, it can have high thermal conductivity between the lower circuit board 1 and the upper circuit board 2 and can efficiently dissipate heat. Note that heat not conducted from the upper circuit board 2 to the lower circuit board 1 is also radiated into the air using the upper circuit board 2 itself as a heat sink.

以上のような構成とすることにより、発熱部品１００で発生した熱が発熱部品１００の下面側から直接下層回路基板１を介してベース基板に伝導されて放熱されるとともに、発熱部品１００の上面側から上層回路基板２、層間接続部材３、および下層回路基板１を介してベース基板に伝導されて放熱される。すなわち、発熱部品１００に対して十分な放熱性能を備える放熱経路を形成することができ、発熱部品１００を効果的に放熱することができる。   With the above configuration, the heat generated in the heat generating component 100 is conducted from the lower surface side of the heat generating component 100 directly to the base substrate via the lower circuit board 1 to be dissipated, and the upper surface side of the heat generating component 100 The heat is conducted to the base substrate through the upper circuit board 2, the interlayer connection member 3, and the lower circuit board 1, and then radiated. That is, a heat dissipation path having sufficient heat dissipation performance can be formed for the heat generating component 100, and the heat generating component 100 can be effectively dissipated.

次に、第２の実施形態に係る回路モジュールについて図２を参照して説明する。
図２は本実施形態の回路モジュールの概略構成を示す側面断面図である。 Next, a circuit module according to a second embodiment will be described with reference to FIG.
FIG. 2 is a side sectional view showing a schematic configuration of the circuit module of the present embodiment.

図２に示す回路モジュールは、発熱源となる回路ＩＣ１０２を樹脂モールドしてなる発熱部品１０１を用いた例であり、この発熱部品１０１の下層回路基板１、上層回路基板２への実装、接触構造を除き第１の実施形態に示した回路モジュールと同じ構成である。   The circuit module shown in FIG. 2 is an example using a heat generating component 101 formed by resin-molding a circuit IC 102 serving as a heat generating source. The heat generating component 101 is mounted on the lower circuit board 1 and the upper circuit board 2 and has a contact structure. The configuration is the same as that of the circuit module shown in the first embodiment.

回路ＩＣ１０２はベアチップ部品であり、その底面は導電性接着剤６によりサーマルビア１４の上面側電極１５に接着されている。回路ＩＣ１０２の上面の各種パッドは下層回路基板１の上面１０ａに形成された実装用電極１１とワイヤーボンディングによって接続されている。さらに、回路ＩＣ１０２は樹脂モールドされて発熱部品１０１となっており、発熱部品１０１のモールド部の天面は上層回路基板２の下面２０ｂに面接触されている。   The circuit IC 102 is a bare chip component, and the bottom surface thereof is bonded to the upper surface side electrode 15 of the thermal via 14 by the conductive adhesive 6. Various pads on the upper surface of the circuit IC 102 are connected to the mounting electrodes 11 formed on the upper surface 10a of the lower circuit board 1 by wire bonding. Further, the circuit IC 102 is resin-molded to form a heat generating component 101, and the top surface of the mold part of the heat generating component 101 is in surface contact with the lower surface 20 b of the upper circuit board 2.

このような構成とすることで、発熱部品１０１の発熱源である回路ＩＣ１０２から発生する熱は底面側モールド部と導電性接着剤６とを介して下層回路基板１のサーマルビア１４に伝導されるとともに、天面側モールド部を介して上層回路基板２の下面２０ｂに伝導される。これら、下層回路基板１のサーマルビア１４に伝導された熱および上層回路基板２の下面２０ｂに伝導された熱は第１の実施形態と同様の放熱経路により放熱される。   With this configuration, heat generated from the circuit IC 102 that is a heat generation source of the heat generating component 101 is conducted to the thermal via 14 of the lower circuit board 1 through the bottom surface mold part and the conductive adhesive 6. At the same time, it is conducted to the lower surface 20b of the upper circuit board 2 through the top surface mold part. The heat conducted to the thermal via 14 of the lower circuit board 1 and the heat conducted to the lower surface 20b of the upper circuit board 2 are radiated through the same heat radiation path as in the first embodiment.

以上のような構成とすることで、モールド部品からなる発熱部品１０１であっても、効果的に放熱することができる。   With the above configuration, even the heat generating component 101 made of a molded component can effectively dissipate heat.

次に、第３の実施形態に係る回路モジュールについて図３、図４を参照して説明する。
図３は本実施形態の回路モジュールの概略構成を示す側面断面図であり、図４は本実施形態の回路モジュールの他の概略構成を示す側面断面図である。 Next, a circuit module according to a third embodiment will be described with reference to FIGS.
FIG. 3 is a side sectional view showing a schematic configuration of the circuit module of the present embodiment, and FIG. 4 is a side sectional view showing another schematic configuration of the circuit module of the present embodiment.

図３に示す回路モジュールは、上層回路基板２の下面２０ｂに、発熱部品１００との接触部を含みこの接触部の面積よりも大きい所定面積の放熱用電極パターン２４が形成されたものであり、他の構成は第１の実施形態の図１に示す回路モジュールと同じである。放熱用電極パターン２４は、可能な限り大きく、且つ接続電極パターン２３に近接するように形成されている。一方、図４はこの放熱用電極パターン２４が接続電極パターン２３に導通する、すなわち一体化したものである。なお、この放熱用電極パターン２４が「基板面熱伝導手段」に相当する。   The circuit module shown in FIG. 3 includes a lower surface 20b of the upper circuit board 2 and a heat radiation electrode pattern 24 including a contact portion with the heat generating component 100 and having a predetermined area larger than the area of the contact portion. Other configurations are the same as those of the circuit module shown in FIG. 1 of the first embodiment. The heat radiation electrode pattern 24 is formed as large as possible and close to the connection electrode pattern 23. On the other hand, FIG. 4 shows that the heat radiation electrode pattern 24 is electrically connected to the connection electrode pattern 23, that is, integrated. The heat radiation electrode pattern 24 corresponds to “substrate surface heat conduction means”.

これらのような構成とすることで、発熱部品１００から発生し、上層回路基板２の下面２０ｂに伝導された熱が熱伝導性に優れる放熱用電極パターン２４を介して接続用電極２３に伝導される。これにより、放熱用電極パターン２４が形成されていない場合よりも、効果的に且つ素早く接続用電極２３および層間接続部材３に熱を伝導することができる。この結果、より効果的に素早く発熱部品１００を放熱することができる。特に、図４に示す構造の場合、発熱部品１００の天面が放熱用電極パターン２４を介して接続用電極２３、層間接続部材３に導通しているので、より一層熱伝導性が高まる。   With such a configuration, the heat generated from the heat generating component 100 and conducted to the lower surface 20b of the upper circuit board 2 is conducted to the connection electrode 23 through the heat radiation electrode pattern 24 having excellent thermal conductivity. The Thereby, heat can be conducted to the connection electrode 23 and the interlayer connection member 3 more effectively and more quickly than when the heat radiation electrode pattern 24 is not formed. As a result, the heat generating component 100 can be radiated more effectively and quickly. In particular, in the case of the structure shown in FIG. 4, since the top surface of the heat generating component 100 is electrically connected to the connection electrode 23 and the interlayer connection member 3 through the heat radiation electrode pattern 24, the thermal conductivity is further increased.

次に、第４の実施形態に係る回路モジュールについて図５を参照して説明する。
図５は本実施形態に係る回路モジュールの概略構成を示す側面断面図である。 Next, a circuit module according to a fourth embodiment will be described with reference to FIG.
FIG. 5 is a side sectional view showing a schematic configuration of the circuit module according to the present embodiment.

図５に示す回路モジュールは、下層回路基板１の接続用電極１３とベース基板接続用電極１２とを導通する導電性部材を内部に備えたビア１８が形成されたものであり、他の構成は第３の実施形態の図４に示した回路モジュールと同じである。   The circuit module shown in FIG. 5 has a via 18 provided therein with a conductive member that conducts between the connection electrode 13 of the lower circuit board 1 and the base substrate connection electrode 12. This is the same as the circuit module shown in FIG. 4 of the third embodiment.

このような構成とすることで、上層回路基板２の下面２０ｂから層間接続部材３を介して下層回路基板１の上面１０ａに伝導された熱がビア１８を介してベース基板接続用電極１２に効果的に伝導される。これにより、さらに効果的に発熱部品を放熱することができる。   With such a configuration, heat conducted from the lower surface 20 b of the upper circuit board 2 to the upper surface 10 a of the lower circuit board 1 through the interlayer connection member 3 is effective on the base substrate connection electrode 12 through the via 18. Conducted. Thereby, a heat-emitting component can be radiated more effectively.

なお、本実施形態の下層回路基板１のビア１８は、第３の実施形態の図４に示した構成に適用したものであるが、第１の実施形態の図１に示す回路モジュール、第２の実施形態の図２に示す回路モジュール、および第３の実施形態の図３に示す回路モジュールにも適用することができ、前記効果を奏することができる。   The via 18 of the lower layer circuit board 1 of this embodiment is applied to the configuration shown in FIG. 4 of the third embodiment, but the circuit module shown in FIG. This can be applied to the circuit module shown in FIG. 2 of the embodiment and the circuit module shown in FIG. 3 of the third embodiment, and the effects described above can be obtained.

第１の実施形態に係る回路モジュールの概略構成を示す側面断面図Side surface sectional drawing which shows schematic structure of the circuit module which concerns on 1st Embodiment 第２の実施形態に係る回路モジュールの概略構成を示す側面断面図Side surface sectional drawing which shows schematic structure of the circuit module which concerns on 2nd Embodiment. 第３の実施形態に係る回路モジュールの概略構成を示す側面断面図Side surface sectional drawing which shows schematic structure of the circuit module which concerns on 3rd Embodiment. 第３の実施形態に係る回路モジュールの他の概略構成を示す側面断面図Side surface sectional drawing which shows the other schematic structure of the circuit module which concerns on 3rd Embodiment. 第４の実施形態に係る回路モジュールの概略構成を示す側面断面図Side surface sectional drawing which shows schematic structure of the circuit module which concerns on 4th Embodiment

符号の説明Explanation of symbols

１００−発熱部品（ベアチップ）
１０１−発熱部品（モールド部品）
１０２−回路ＩＣ
１−下層回路基板
１０ａ−下層回路基板１の上面
１０ｂ−下層回路基板１の下面
１１−回路電極パターン
１２−ベース基板接続用電極
１３−接続電極パターン
１４−サーマルビア
１５−サーマルビア１４の上面側電極
１６−サーマルビア１４の下面側電極
１７−サーマルビア１４のビア
１８−ビア
２−上層回路基板
２０ａ−上層回路基板２の上面
２０ｂ−上層回路基板２の下面
２１，２２−回路電極パターン
２３−接続電極パターン
２４−放熱用電極パターン
３−層間接続部材
４ａ〜４ｃ−回路部品
５−導電性接続部材
６−導電性接着剤 100-Heat-generating component (bare chip)
101-Heat-generating parts (mold parts)
102-circuit IC
1-lower circuit board 10a-upper surface 10b of lower circuit board 1-lower surface 11 of lower circuit board 1-circuit electrode pattern 12-electrode 13 for base substrate connection-connection electrode pattern 14-thermal via 15-upper surface side of thermal via 14 Electrode 16-lower surface side electrode 17 of thermal via 14-via 18 of thermal via 14-via 2-upper circuit board 20a-upper surface 20b of upper circuit board 2-lower surface 21 of upper circuit board 2, 22-circuit electrode pattern 23- Connection electrode pattern 24 -Heat radiation electrode pattern 3 -Interlayer connection members 4a to 4c -Circuit component 5 -Conductive connection member 6 -Conductive adhesive

Claims (5)

発熱部品を含む複数の回路部品が備えられた回路モジュールにおいて、
前記発熱部品が上面に実装されるとともに下面で外部基板に実装される下層回路基板と、
前記発熱部品の天面が下面に接触する上層回路基板と、を備えたことを特徴とする回路モジュール。 In a circuit module provided with a plurality of circuit components including heat generating components,
A lower circuit board mounted on the external substrate on the lower surface and the heat generating component is mounted on the upper surface;
A circuit module comprising: an upper circuit board in which a top surface of the heat generating component contacts a lower surface. 前記下層回路基板は、前記発熱部品の実装位置に、上面と下面との間を熱伝導させるサーマルビアを備えている請求項１に記載の回路モジュール。   2. The circuit module according to claim 1, wherein the lower circuit board includes a thermal via that conducts heat between an upper surface and a lower surface at a mounting position of the heat generating component. 前記上層回路基板と前記下層回路基板とを接続する層間接続部材を備え、該層間接続部材が前記上層回路基板と前記下層回路基板とを熱伝導させる層間熱伝導手段となる請求項１または請求項２に記載の回路モジュール。   The interlayer connection member for connecting the upper circuit board and the lower circuit board is provided, and the interlayer connection member serves as an interlayer heat conduction means for conducting heat between the upper circuit board and the lower circuit board. 2. The circuit module according to 2. 前記層間接続部材は導電性材料からなり、
前記上層回路基板は、前記発熱部品の接触する位置に電極を備えるとともに、該電極と前記層間接続部材とに接続または近接する導電性材料からなる基板面熱伝導手段を備えた請求項３に記載の回路モジュール。 The interlayer connection member is made of a conductive material,
The said upper circuit board was equipped with the board | substrate surface heat conduction means which consists of an electroconductive material which connects or adjoins to this electrode and the said interlayer connection member while providing an electrode in the position where the said heat-emitting component contacts. Circuit module. 前記下層回路基板は、前記層間接続部材の接続位置に、上面と下面との間を熱伝導させるサーマルビアを備えた請求項３または請求項４に記載の回路モジュール。   5. The circuit module according to claim 3, wherein the lower circuit board includes a thermal via that thermally conducts between an upper surface and a lower surface at a connection position of the interlayer connection member.
JP2004309813A 2004-10-25 2004-10-25 Circuit module Pending JP2006120996A (en)

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