JP2006251160A - Drawing method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a calculation time for the correction amount of a wiring pattern in an exposure method for exposing a substrate by placing a plurality of wiring patterns at predetermined positions of a substrate, wherein a plurality of reference marks preliminarily disposed on a substrate are detected to acquire detected position information and the position of a wiring pattern placed on the substrate is corrected to carry out exposure, based on the detected position information and exposed by the detection position information. <P>SOLUTION: A reference mark 12a preliminarily disposed on a substrate 12 based on reference mark position information is detected to acquire detected position information showing the position of the reference mark 12a; and drawing position information 12c showing positions of wiring patterns P1 to P3 in wiring patterns P1 to P4 disposed at predetermined positions on the substrate 12 are corrected according to the misalignment between the detected position information of the reference mark 12a and the reference mark position information. A correction amount of the wiring pattern P4 is obtained, based on the correction amounts by drawing position information 12c of the wiring patterns P1 to P3; and the wiring pattern P4 is corrected using the obtained correction amount. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a drawing method and apparatus for arranging and drawing a plurality of images at predetermined positions on a drawing surface.

  Conventionally, various exposure apparatuses using a photolithographic technique have been proposed as apparatuses for recording a predetermined wiring pattern on a printed wiring board substrate.

  As an exposure apparatus as described above, for example, a light beam is scanned in a main scanning direction and a sub scanning direction on a substrate coated with a photoresist, and the light beam is modulated based on image data representing a wiring pattern. Thus, there has been proposed an exposure apparatus for forming a wiring pattern.

  Here, the wiring pattern of the printed wiring board formed by the exposure apparatus as described above tends to increase in definition. For example, when forming a multilayer printed wiring board, the wiring pattern of each layer Must be aligned with high accuracy.

  In order to perform the alignment as described above, the wiring pattern of each layer is exposed to a preset position with respect to the substrate. However, when forming a multilayer printed wiring board, the substrate is subjected to a pressing process in which the layers are bonded to each other. Since heat may be applied and the substrate may be deformed by the heat, if the wiring pattern of each layer is exposed to a preset position as described above, the recording position shift of the wiring pattern of each layer occurs, and each layer There is a possibility that it is difficult to align the wiring pattern with high accuracy.

  Therefore, for example, holes are provided at the four corners of the substrate of each layer based on preset reference mark position information, the positions of the holes are detected during exposure, and the detected position information of the detected holes and the reference By calculating the amount of deformation of the substrate based on the mark position information and correcting the layout of the wiring pattern according to the amount of deformation, highly accurate alignment can be performed without being affected by the deformation of the substrate as described above. An exposure apparatus that can be used has been proposed (see, for example, Patent Document 1).

JP 2000-122303 A

  However, for example, as a pattern formed on a substrate, not only a pattern used as a part of a circuit function, but also a circuit such as a predetermined code, number, mark, or a line used when cutting a substrate, etc. Some have nothing to do with the function of. Such a pattern does not require highly accurate alignment as compared with a pattern used as a part of the circuit function, and the correction amount is calculated individually for such a pattern as described above. If the correction is made so that the calculation amount of the correction amount is wasted, the processing efficiency may be reduced. On the other hand, such a pattern need not be aligned at all, and needs to be aligned with a certain degree of accuracy.

  In view of the above circumstances, the present invention appropriately aligns an image on a drawing surface without causing a reduction in processing efficiency as described above, in a drawing method and apparatus that performs alignment as in the exposure apparatus. An object of the present invention is to provide a drawing method and apparatus capable of performing the above.

  The drawing method of the present invention is a drawing method in which a plurality of images are arranged and drawn at predetermined positions on a drawing surface, and a plurality of preliminarily provided positions on the drawing surface indicated by a plurality of reference mark position information set in advance. Detection position information indicating the position of the reference mark is detected, the detection position information indicating the position of the reference mark is acquired, and the drawing position information indicating the position of some of the plurality of images arranged at a predetermined position on the drawing surface The correction amount of the position of the image other than the part on the drawing surface is corrected based on the correction amount of the drawing position information of the part of the image. It is characterized in that the position of the image other than the part is corrected using the acquired correction amount, and the image is drawn at the position of the drawing surface after the correction.

  Further, in the above drawing method, a plurality of the partial images are provided, a correction amount for each of the plurality of partial images is acquired, and each image is obtained using the acquired correction amount for each image. While correcting the position individually, acquiring the correction amount of the position on the drawing surface of the image other than the part based on the correction amount for each image, and using the acquired correction amount, the image other than the part The position of can be corrected.

  Further, it is possible to obtain an average value of correction amounts for each image of the partial image and correct the positions of the images other than the partial image using the average value.

  Further, images other than the above-mentioned part can be arranged on the peripheral edge of the drawing surface.

  The drawing device of the present invention is a drawing device that places and draws an image at a predetermined position on the drawing surface, and a plurality of reference marks provided in advance on the drawing surface indicated by a plurality of reference mark position information set in advance. Position information acquisition means for detecting detected position information indicating the position of the reference mark and drawing position information indicating the position of some of the plurality of images arranged at predetermined positions on the drawing surface Is corrected according to the difference between the detected position information of the reference mark and the reference mark position information, and the position of the image other than the part on the drawing surface based on the correction amount of the drawing position information of the part of the image. The image position correction unit that corrects the position of the image other than the part using the acquired correction amount, and the drawing that draws the image at the position of the drawing plane corrected by the image position correction unit Means And it said that there were pictures.

  Further, in the drawing apparatus, the partial image is plural, and the image position correcting unit acquires a correction amount for each image of the partial images, and sets the correction amount for each acquired image. And correcting the position of each image individually, acquiring the correction amount of the position on the drawing surface of the image other than the part based on the correction amount for each image, and using the acquired correction amount, It is possible to correct the positions of images other than a part.

  Further, the image position correcting means may acquire an average value of correction amounts for each image of the partial image and correct the positions of images other than the partial image using the average value. .

    Further, images other than the above-mentioned part can be arranged on the peripheral edge of the drawing surface.

  According to the drawing method and apparatus of the present invention, a detection position indicating a position of a reference mark by detecting a plurality of reference marks provided in advance on a drawing surface indicated by a plurality of reference mark position information set in advance. The drawing position information indicating the positions of some of the plurality of images arranged at predetermined positions on the drawing surface is acquired according to the difference between the reference mark detection position information and the reference mark position information. In addition to correction, the correction amount of the position on the drawing surface of the image other than the part is acquired based on the correction amount of the drawing position information of the part of the image, and other than the part using the acquired correction amount. Since the position of the first image is corrected, it is possible to perform high-precision correction for the part of the image, and it is possible to correct the image other than the part with a certain degree of accuracy. Further, since the correction amount of the image other than the part is acquired by using the correction amount of the part of the image without acquiring the correction amount individually for the image other than the part of the image, It is possible to shorten the calculation time of the correction amount of the image other than the image and improve the processing efficiency.

  Hereinafter, an exposure apparatus using an embodiment of the drawing method and apparatus of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of the exposure apparatus. This exposure apparatus is an apparatus for exposing a wiring pattern of each layer of a multilayer printed wiring board, and is characterized by a method of aligning the wiring pattern of each layer. First, the schematic configuration will be described.

  As shown in FIG. 1, the exposure apparatus 10 includes a flat moving stage 14 that holds the substrate 12 by adsorbing the substrate 12 to the surface. Two guides 20 extending along the stage moving direction are installed on the upper surface of the thick plate-like installation table 18 supported by the four legs 16. The moving stage 14 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 20 so as to be reciprocally movable.

  A U-shaped gate 22 is provided at the center of the installation table 18 so as to straddle the moving path of the moving stage 14. Each end of the U-shaped gate 22 is fixed to both side surfaces of the installation base 18. A scanner 24 is provided on one side of the gate 22, and the front and rear ends of the substrate 12 are provided on the other side, and a plurality of circular shapes (six in this embodiment) provided in advance on the substrate 12. A plurality of (three in the present embodiment) cameras 26 for detecting the position of the reference mark 12a.

  Here, the reference mark 12a in the substrate 12 is, for example, a hole formed on the substrate 12 based on preset reference mark position information. In addition to the holes, lands, vias, and etching marks may be used. The reference mark 12a may be a specific pattern. The reference mark position information will be described in detail later.

  The scanner 24 and the camera 26 are respectively attached to the gate 22 and fixedly arranged above the moving path of the stage 14. The scanner 24 and the camera 26 are connected to a controller (described later) that controls them.

  As shown in FIGS. 2 and 3B, the scanner 24 includes ten exposure heads 30 (30A to 30J) arranged in a substantially matrix of 2 rows and 5 columns.

  Each exposure head 30 is provided with a digital micromirror device (DMD) 36, which is a spatial light modulation element (SLM) for spatially modulating the incident light beam, as shown in FIG. Are attached such that the pixel column direction forms a predetermined inclination angle θ with the scanning direction. Therefore, the exposure area 32 by each exposure head 30 is a rectangular area inclined with respect to the scanning direction. As the stage 14 moves, a strip-shaped exposed region 34 is formed on the substrate 12 for each exposure head 30.

  The DMD 36 provided in each of the exposure heads 30 is on / off controlled in units of micromirrors, and the substrate 12 is exposed to a dot pattern (black / white) corresponding to the micromirrors of the DMD 36. As shown in FIG. 4, the above-described band-shaped exposed region 34 is formed by two-dimensionally arranged dots.

  The two-dimensional dot pattern is inclined with respect to the scanning direction, so that dots arranged in the scanning direction pass between dots arranged in the direction intersecting the scanning direction. Can be planned.

  Note that there may be a dot that is not used due to variations in the adjustment of the tilt angle. For example, in FIG. 4, the hatched dot is a dot that is not used, and the micromirror in the DMD 36 corresponding to this dot is always in the OFF state. Become.

  Further, as shown in FIGS. 3A and 3B, the exposure heads of the respective rows arranged in a line so that each of the strip-shaped exposed areas 34 partially overlaps the adjacent exposed areas 34. Each of 30 is arranged with a predetermined interval (natural number times the long side of the exposure area, 1 time in this embodiment) shifted in the arrangement direction. For this reason, for example, the portion that cannot be exposed between the exposure area 32A located on the leftmost side of the first row and the exposure area 32C located on the right side of the exposure area 32A is the exposure area located on the leftmost side of the second row. It is exposed by 32B. Similarly, the portion that cannot be exposed between the exposure area 32B and the exposure area 32D located on the right side of the exposure area 32B is exposed by the exposure area 32C.

  Next, the electrical configuration of the exposure apparatus 10 will be described. As shown in FIG. 5, the exposure apparatus 10 receives vector data representing a wiring pattern to be exposed, which is output from a data creation apparatus 40 having a CAM (Computer Aided Manufacturing) station, and converts the vector data into raster data ( Raster conversion processing unit 50 for converting to (bitmap data), a reference position setting unit 52 for setting reference mark position information and drawing position information for a plurality of wiring patterns, and a position of the reference mark 12a detected by the camera 26 Image position correction means 54 for correcting the drawing position information based on the detected position information indicating the reference position and the reference mark position information, and raster data of the wiring pattern based on the drawing position information corrected by the image position correction means 54 Image data correction means 56 for correcting and generating corrected image data, and image data correction An exposure head controller 58 that controls the exposure head 30 to be exposed by the exposure head 30 based on the corrected image data converted by the stage 56; a moving mechanism 60 that moves the moving stage 14 in the stage moving direction; And a controller 70 for controlling the entire exposure apparatus. The drawing position information and a method for correcting the drawing position information will be described in detail later. The moving mechanism 60 may adopt any known configuration as long as it moves the moving stage 14 back and forth along the guide 20.

  Next, the operation of the exposure apparatus 10 will be described with reference to FIG.

  First, in the data creation device 40, vector data representing the entire image pattern including the wiring pattern to be exposed on the substrate 12 is created. The vector data is input to the raster conversion processing unit 50. In the raster conversion processing unit 50, the vector data is converted into raster data and input to the image data correction unit 56, and the image data correction unit 56 is input. Raster data is temporarily stored.

  When the vector data is input to the raster conversion processing unit 52 as described above, the controller 70 that controls the operation of the entire exposure apparatus 10 outputs a control signal to the moving mechanism 60, and the moving mechanism 60 outputs the control signal. Accordingly, the moving stage 14 is once moved from the position shown in FIG. 1 along the guide 20 to a predetermined initial position on the upstream side, and then moved in the stage moving direction at a desired speed.

  When the substrate 12 on the stage 14 moving as described above passes under the plurality of cameras 26, the substrates 12 are photographed by these cameras 26, and image data representing the photographed images is image position correcting means. 54. The image position correcting unit 54 detects the position of the reference mark 12a of the substrate 12 placed on the stage 14 based on the image data, and acquires detected position information. As a method for detecting the position of the reference mark 12a, for example, it may be detected by extracting a circular image, but any other known detection method may be adopted. The detection position information of the reference mark 12a is specifically acquired as a coordinate value. The origin of the coordinate value is, for example, one of four corners of the captured image of the substrate 12. Alternatively, it may be a predetermined position set in advance in the captured image, or may be the position of one reference mark 12a among the plurality of reference marks 12a. However, the origin set as described above needs to coincide with the origin of the coordinate value of reference mark position information described later. As described above, in the present embodiment, the camera 26 and the image position correcting unit 54 constitute the detected position information acquiring unit in the claims.

  On the other hand, in the reference position setting unit 52, reference mark position information of the reference mark 12a on the standard substrate 12 that has not undergone the press process is set in advance. This reference mark position information is a design value, and is a predetermined value when the reference mark 12 a is provided on the substrate 12. The reference mark position information may be set by the user. For example, the reference mark position information may be acquired and set by photographing the standard substrate 12 as described above with the camera 26 in the same manner as described above. You may make it do. The reference mark position information is also set as a coordinate value.

  Further, the reference position setting unit 52 is preset with drawing position information indicating the positions of a plurality of wiring patterns. FIG. 6 shows an example of the positional relationship among the reference mark position information 12b, the drawing position information 12c, and the plurality of wiring patterns P1, P2, P3, and P4. The hatched black circle in FIG. 6 indicates the position of the reference mark position information 12b, the white circle indicates the drawing position information 12c, and the figure surrounded by a straight line indicates the wiring pattern that is actually exposed on the substrate.

  In the present embodiment, as shown in FIG. 6, wiring patterns P1, P2 and P3 are arranged in a region surrounded by a dotted line connecting the reference mark position information 12b on the substrate 12, and the peripheral portion of the substrate 12 outside the region. The wiring pattern P4 is arranged at 12e, and the drawing position information corresponding to these wiring patterns is set in the reference position setting unit 52, respectively.

  The drawing position information 12c is also set as a coordinate value, and the origin of the coordinate value is the same as the detection position information and the reference mark position information. The drawing position information 12c is arbitrarily set according to the arrangement of a plurality of wiring patterns on the substrate 12, and is set by the user.

  In the present embodiment, for the wiring patterns P1, P2, and P3, a point that circumscribes the short side of the rectangular area on the central axis in the long side direction of the rectangular area in which the wiring pattern is formed is drawn. The position information 12c is set.

  In the present embodiment, the drawing position information 12c is set as described above, but may be set by other methods. In the present embodiment, the wiring pattern P1 and the wiring pattern P2 have the same size and shape, but they may be different.

  In the above description, all are referred to as wiring patterns. However, the wiring pattern here does not necessarily mean only a wiring pattern that functions as a part of a circuit, and other markings, codes, numbers, etc. Shall be included.

  In this embodiment, the wiring patterns P1, P2, and P3 are wiring patterns including wiring that functions as a part of the circuit, and the wiring pattern P4 is a pattern that does not include the wiring as described above, and is a predetermined pattern. The pattern is composed of markings, codes, numbers or lines for cutting the substrate.

  The wiring pattern P4 is also not shown, but drawing position information is set in advance as in the case of the wiring patterns P1 to P3, and is arranged at the position indicated by the drawing position information. Regarding the method of setting the drawing position information, the wiring pattern P4 may be considered as one wiring pattern, and may be set at, for example, the four corners of the wiring pattern P4 so as to indicate the position of the one wiring pattern. The drawing position information may be individually set for the marking, code, number, cut line, etc. in the wiring pattern P4.

    Then, the coordinate values of the reference mark position information 12b and the drawing position information 12c set in advance as described above are output from the reference position setting unit 52 to the image position correcting means 54.

  Then, the image position correcting unit 54 detects the difference between the detected position information of the reference mark 12a of the substrate 12 actually captured by the camera 26 as described above and the reference mark position information 12b output from the reference position setting unit 52. Based on this, the correction amount for the drawing position information 12c of the wiring patterns P1 to P3 is acquired.

  A method of calculating the correction amount of one drawing position information b on the upper right side among the plurality of drawing position information shown in FIG. 6 will be specifically described with reference to FIG.

  As shown in FIG. 7, the image position correcting means 54 is based on the coordinate values of the drawing position information b and the four reference mark position information A, B, C, D around the drawing position information b. The areas Sa, Sb, Sc, and Sd of the four divided regions are obtained. Then, the corrected drawing position information b is substituted by substituting the coordinate values of the detected position information G, H, I, and J corresponding to the four reference mark position information A, B, C, and D into the following expression, respectively. Calculate the coordinate value of '.

b ′ (x, y) = (Sa × G (x, y) + Sb × H (x, y) + Sc × I (x, y) + Sd × J (x, y)) / (Sa + Sb + Sc + Sd)
However, Sa = x2 * y2, Sb = x1 * y2, Sc = x2 * y1, Sd = x1 * y1
In the same manner as described above, corrected coordinate values are acquired for the other drawing position information a, c to f. At this time, with respect to the drawing position information a to d of the wiring pattern P1 and the wiring pattern P2, four common reference mark position information A, B, C, D surrounding the wiring pattern P1 and the wiring pattern P2 and their detection. As for the drawing position information e, f of the wiring pattern P3, the reference mark position information C, D, E, F, G of the four reference marks surrounding the wiring pattern P3 and its detected position information are corrected. It is desirable to correct using and.

  In the present embodiment, the coordinate values of the drawing position information a to f are set in advance as described above. However, the coordinate values of the drawing position information a to f need to be set in advance. For example, as described above, only a function indicating the relationship between the reference mark position information 12b and the drawing position information 12c (in the above formula, the area ratio of Sa, Sb, Sc, and Sd) is set in advance. The coordinate values of the corrected drawing position information a ′ to f ′ may be calculated by substituting the detected position information into the function. As a function indicating the relationship between the reference mark position information 12b and each of the drawing position information a to f, not only based on the area ratio of Sa, Sb, Sc, Sd as described above, but also, for example, the reference mark position information 12b Further, it may be based on the drawing position information a to f and the distance. Also, a function indicating the relationship between the reference mark position information 12b and each of the drawing position information a to f is set, the function itself is corrected based on the detected position information, and the reference mark position information is added to the corrected function. The coordinate values of the corrected drawing position information a ′ to f ′ may be calculated by substituting 12b.

The correction amounts of the wiring patterns P1 to P3 are calculated based on the coordinate values of the corrected drawing position information a ′ to f ′ calculated as described above. Specifically, for the wiring pattern P1, the drawing position information a and c before correction and the coordinate values of the drawing position information a ′ and c ′ after correction and the coordinate values of the drawing position information a ′ and c ′ after correction and A vector ac connecting the drawing position information c, a vector a′-c ′ connecting the corrected drawing position information a ′ and the drawing position information c ′ are obtained, and the vector ac of the vector a′-c ′ is obtained. A shift amount Δx _{1 in the} X direction, a shift amount Δy _{1 in the} Y direction, and a rotation amount Δθ ₁ are calculated for the wiring pattern P 2, and for the wiring pattern P 2, the coordinate values of the drawing position information b and d before correction and the corrected value From the coordinate values of the drawing position information b ′ and d ′, the vector bd connecting the drawing position information b before correction and the drawing position information d, the corrected drawing position information b ′, and the drawing position information d ′. X b with respect to the vector bd of the vector b'-d ' Shift amount to the direction [Delta] x ₂ and the shift amount [Delta] y 2 in the Y _direction, and the rotation amount [Delta] [theta] ₂ is calculated, the wiring pattern P3 is corrected before the drawing position information e, and the coordinate values of f, the corrected drawing From the coordinate values of the position information e ′ and f ′, a vector ef connecting the drawing position information e before correction and the drawing position information f, and the drawing position information e ′ after correction and the drawing position information f ′ are connected. A vector e′−f ′ is obtained, and a shift amount Δx _{3 in the} X direction and a shift amount Δy _{3 in the} Y direction and a rotation amount Δθ ₃ of the vector e′−f ′ with respect to the vector ef are calculated. The calculated correction amounts Δx _{1 to 3} , Δy _{1 to 3} , and Δθ ₁ to ₃ are output to the image data correction unit 56. Then, the image data correction unit 56 performs processing such as rotation, shift, and scaling on the raster data temporarily stored in advance based on the input correction amounts Δx _{1 to 3} , Δy _{1 to 3} , and Δθ ₁ to ₃ . To correct the raster data of the wiring patterns P1 to P3. In the exposure apparatus of the present embodiment, the vector data created by the data creation device 40 is converted into raster data, and correction is performed on the raster data. However, the correction is not necessarily performed after conversion into raster data. There is no need to perform the above. After correcting the vector data before conversion into raster data, the corrected vector data may be converted into raster data.

Then, the image position correction unit 54 calculates the correction amount of the wiring pattern P4. At this time, the image position correction unit 54 sets the correction amount of the wiring pattern P4 to the correction amount Δx of the wiring patterns P1 to P3. _1-3 , Δy _1-3 , and Δθ _1-3 are calculated.

Specifically, an average value Δx _ave of Δx ₁ , Δx _2, and Δx ₃ is calculated for the shift amount of the wiring pattern P 4 in the X direction. For the shift amount of the wiring pattern P4 in the Y direction, an average value Δy _ave of Δy ₁ , Δy ₂ and Δy3 is calculated. Further, for the rotation amount of the wiring pattern P4, an average value Δθ _ave of Δθ ₁ , Δθ ₂ and Δθ ₃ is calculated.

Then, Δx _ave , Δy _ave, and Δθ _ave calculated as described above are used as the correction amount of the wiring pattern P4.

Then, Δx _ave , Δy _ave, and Δθ _ave obtained as described above are output to the image data correction unit 56, and the image data correction unit 56 temporarily stores in advance based on the above Δx _ave , Δy _ave, and Δθ _ave. The raster data of the wiring pattern P4 is corrected by performing processing such as rotation, shift, and scaling on the raster data. At this time, the wiring pattern P4 may be considered as one wiring pattern, and the above-described correction may be performed on the entire raster data representing the one wiring pattern, or the marking, code, number, and cut in the wiring pattern P4 may be performed. You may make it perform the said correction | amendment with respect to each raster data, such as a line, respectively. Further, as described above, the correction may be performed on the vector data before being converted into the raster data instead of the raster data of the wiring pattern P4. For example, when correcting the wiring pattern P4 as one wiring pattern as described above, it is desirable to perform correction as the data format of the raster data. On the other hand, the marking or code in the wiring pattern P4 is preferable. When individual patterns such as numbers, cut lines, etc. are corrected, it is desirable to correct the data in the form of vector data.

  For convenience of explanation, in the present embodiment, the image position correcting unit 54 and the image data correcting unit 56 are separately shown as described above. However, the image position correcting unit 54 and the image data correcting unit 56 are different from each other. Both are the structures corresponding to the image position correcting means in the claims.

  FIG. 8 shows an example of the positional relationship between the drawing position information 12c before correction, the drawing position information 12c after correction, the reference mark 12a of the standard substrate 12, the reference mark 12a after deformation, and the corrected wiring patterns P1 to P4. The schematic diagram of is shown. In FIG. 8, the dotted white circle in FIG. 8 is the drawing position information 12c before correction, the solid white circle is the drawing position information 12c after correction, the dotted diagonal circle is the reference mark 12a of the standard substrate 12, and the solid line The hatched circle is the reference mark 12a after deformation. For convenience of explanation, the reference mark 12 a and the drawing position information 12 c are shown on the same plane, but the drawing position information 12 c is not provided on the substrate 12.

  Then, corrected raster data or corrected vector data is calculated as described above, and the moving stage 14 is moved from the downstream position shown in FIG. 1 to the upstream side at a desired speed.

  Then, when the tip of the substrate 12 is detected by the camera 26, exposure is started. Specifically, the corrected raster data (including raster-converted corrected vector data) calculated as described above is output to the exposure head controller 58, and the exposure head controller 58 receives the input correction. A control signal is output to each exposure head 30 of the scanner 24 based on the completed raster data, and the exposure head 30 turns on / off the micromirrors of the DMD 36 based on the control signal, and the wiring pattern P1 according to the corrected raster data. -P4 is exposed on the substrate 12.

  As the moving stage 14 moves, a control signal is sequentially output to each exposure head 30 to perform exposure. When the rear end of the substrate 12 is detected by the camera 12, the exposure ends.

According to the exposure apparatus 10 of the above embodiment, the reference mark 12a provided in advance at the position of the substrate 12 indicated by the reference mark position information is detected, the detected position information indicating the position of the reference mark 12a is acquired, and the substrate 12 is acquired. The drawing position information indicating the positions of the wiring patterns P1 to P3 among the wiring patterns P1 to P4 arranged at the predetermined positions is corrected in accordance with the deviation between the reference mark detection position information and the reference mark position information. The correction amounts Δx _ave , Δy _ave, and Δθ _ave of the wiring pattern P4 are acquired based on the correction amounts Δx _1-3 , Δy _1-3 , Δθ _1-3 of the drawing position information of the wiring patterns P1 to P3, and the acquired Since the wiring pattern P4 is corrected using the correction amounts Δx _ave , Δy _ave and Δθ _ave , the wiring patterns P1 to P3 are highly accurate. The correction can be performed and the wiring pattern P4 can be corrected with a certain degree of accuracy. Further, since the correction amount of the wiring pattern P4 is acquired using the correction amounts of the wiring patterns P1 to P3 without acquiring the correction amount individually for the wiring pattern P4, the correction amount of the wiring pattern P4 is calculated. Time can be shortened and processing efficiency can be improved.

  Since the correction amount of the wiring pattern P4 is acquired using the correction amounts of the three wiring patterns P1 to P3, for example, the correction amount of the wiring pattern P4 is acquired using the correction amount of one wiring pattern P1. Compared with the case where it does, more highly accurate correction | amendment can be performed about the wiring pattern P4.

  In addition, since the average value is used as the correction amount of the wiring pattern P4, the correction amount of the wiring pattern P4 can be acquired by a simpler calculation.

  In the above embodiment, the correction amount of the wiring pattern P4 is obtained using the coordinate values of the drawing position information after correction of the wiring patterns P1 to P3. However, the correction amount is not necessarily corrected for all of the wiring patterns P1 to P3. For example, the correction amount of the wiring pattern P4 may be obtained using only the coordinate values of the corrected drawing position information of the wiring pattern P1 and the wiring pattern P2. The correction amount of the wiring pattern P4 may be obtained using only the coordinate values of the drawing position information after correction of P1 and the wiring pattern P3, or the coordinates of the drawing position information after correction of the wiring pattern P2 and the wiring pattern P3. The correction amount of the wiring pattern P4 may be obtained using only the value. Alternatively, the correction amount of the wiring pattern P4 may be obtained using only the coordinate values of the drawing position information after correction of the wiring pattern P1, the wiring pattern P2, or the wiring pattern P3.

  In the above embodiment, when calculating the correction amount of the wiring pattern P4, the average value of the correction amounts of the wiring patterns P1 to P3 is obtained. However, it is not always necessary to obtain the average value. The correction amount of the wiring pattern P4 may be calculated by weighting each correction amount of the patterns P1 to P3.

  Further, as in the above-described embodiment, the correction amount of the wiring patterns P1 to P3 arranged in the region surrounded by the dotted line connecting the reference mark position information 12b on the substrate 12 is used to be arranged on the peripheral portion 12e of the substrate 12. When the correction amount of the wiring pattern P4 is calculated, the correction amount of the entire substrate 12 can be reflected in the correction amount of the wiring pattern P4, so that correction with higher accuracy can be performed.

The drawing method and apparatus of the present invention can be used not only in the exposure apparatus as described above but also in, for example, an ink jet printer or an ink jet printing method. That is, the correction method according to the present embodiment can be applied to an apparatus that performs drawing by using dots of ejected droplets.

The perspective view which shows schematic structure of the exposure apparatus using one Embodiment of the drawing method and apparatus of this invention 1 is a perspective view showing the configuration of a scanner of the exposure apparatus in FIG. (A) is a plan view showing an exposed region formed on the exposure surface of the substrate, and (B) is a plan view showing an array of exposure areas by each exposure head. The figure which shows DMD in the exposure head of the exposure apparatus of FIG. 1 is a block diagram showing the configuration of an electric control system of the exposure apparatus in FIG. The figure which shows an example of the positional relationship of a reference mark position information, drawing position information, and several wiring patterns The figure for demonstrating the correction method of drawing position information The figure which shows typically the positional relationship of the drawing position information before correction | amendment, the drawing position information after correction | amendment, the reference | standard mark of a standard board | substrate, the reference | standard mark of the board | substrate after a deformation | transformation, and the wiring pattern after correction | amendment

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 12 Substrate 12a Reference mark 12b Reference mark position information 12c Drawing position information 14 Moving stage 18 Installation stand 20 Guide 22 Gate 24 Scanner 26 Camera 30 Exposure head 32 Exposure area 36 DMD
P1-P4 wiring pattern

Claims (8)

In a drawing method for arranging and drawing a plurality of images at predetermined positions on a drawing surface,
Detecting a plurality of reference marks provided in advance on the drawing surface indicated by a plurality of reference mark position information set in advance to obtain detection position information indicating the position of the reference mark;
Drawing position information indicating the position of a part of the plurality of images arranged at a predetermined position on the drawing surface is displayed according to a deviation between the detected position information of the reference mark and the reference mark position information. And correcting the position of the image other than the part on the drawing surface based on the correction amount of the drawing position information of the part of the image, and using the acquired correction amount Correct the position of images other than
A drawing method, wherein the image is drawn at the position of the drawing surface after the correction. A plurality of the partial images;
The correction amount for each image of the plurality of partial images is acquired, the position of each image is individually corrected using the acquired correction amount for each image, and the correction amount for each image The correction amount of the position on the drawing surface of the image other than the part is acquired based on the image, and the position of the image other than the part is corrected using the acquired correction amount. The drawing method described.   The drawing method according to claim 2, wherein an average value of correction amounts for each image of the partial image is acquired, and the position of the image other than the partial image is corrected using the average value.   The drawing method according to claim 1, wherein an image other than the part is arranged at a peripheral edge of the drawing surface. In a drawing apparatus that places and draws an image at a predetermined position on the drawing surface,
Detection position information acquisition means for detecting a plurality of reference marks provided in advance on the drawing surface indicated by a plurality of preset reference mark position information and acquiring detection position information indicating the positions of the reference marks; ,
Drawing position information indicating the position of a part of the plurality of images arranged at a predetermined position on the drawing surface is displayed according to a deviation between the detected position information of the reference mark and the reference mark position information. And correcting the position of the image other than the part on the drawing surface based on the correction amount of the drawing position information of the part of the image, and using the acquired correction amount Image position correcting means for correcting the position of an image other than
A drawing apparatus comprising drawing means for drawing the image at the position of the drawing surface corrected by the image position correcting means. A plurality of the partial images;
The image position correction means acquires the correction amount for each image of the plurality of partial images, individually corrects the position of each image using the acquired correction amount for each image, and Obtaining a correction amount of a position on the drawing surface of an image other than the part based on the correction amount for each image, and correcting the position of the image other than the part using the acquired correction amount The drawing apparatus according to claim 5, wherein:   The image position correcting means acquires an average value of correction amounts for each image of the partial image, and corrects the positions of images other than the partial image using the average value. The drawing apparatus according to claim 6.   The drawing apparatus according to claim 5, wherein an image other than the part is arranged at a peripheral edge of the drawing surface.

Images