JP2006201427A - Imaging element storage package, imaging apparatus, and imaging module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize an imaging module in which the positional accuracy between a lens and a light receiving portion of an imaging device is accurate, and light transmitted through the lens is accurately converted into an electric signal by the imaging device and can be extracted as a clear image.
SOLUTION: An element mounting portion 1a on which an image pickup device 3 is mounted, an upper surface 1b to which a translucent member 2 is bonded so as to face a light receiving portion 3a of the image pickup device 3, and an upper surface 1b side. An insulating substrate 1 having a side surface 1c to which a mounting portion 9a of the lens fixing member 9 is joined is provided. A cutout portion 1 d is provided at a location corresponding to the attachment portion 9 a of the lens fixing member 9 on the outer edge of the upper surface 1 b of the insulating base 1.
[Selection] Figure 1

Description

  The present invention relates to an image sensor housing package, an image pickup apparatus, and an image pickup module applied to an optical sensor using an image sensor such as a CCD type or a CMOS type.

  As a conventional CCD type or CMOS type imaging module, there is one shown in FIG. The conventional imaging module includes an imaging device including an insulating base 81, a translucent member 82 and an imaging element 83, a lens fixing member 89 bonded to the imaging device, and a lens 810.

  A wiring conductor 84 and an external connection terminal 85 are formed on the insulating base 81, and the image sensor 83 is electrically connected to the wiring conductor 84. The imaging element 83 is flip-chip mounted on the insulating base 81 so that the light receiving portion 83a formed on the surface thereof faces upward. Further, a translucent member 82 is bonded to the upper surface 81 b of the insulating base 81 so as to face the light receiving portion 83 a of the image sensor 83. A lens fixing member 89 that fixes the lens 810 is joined to the upper surface 81 b of the insulating base 81. The upper surface 81b of the insulating base 81 and the lower end of the lens fixing member 89 are joined together by, for example, a resin adhesive.

Light incident on the imaging module from the outside passes through the lens 810 fixed to the lens fixing member 89 and passes through the translucent member 82 bonded to the insulating base 81. The light that has passed through the translucent member 82 passes through the opening formed in the insulating base 81 and enters the light receiving portion 83 a of the image sensor 83. The light reaching the light receiving portion 83 a of the image sensor 83 is converted into an electric signal by the image sensor 83 and is output to the outside of the image pickup device module via the wiring conductor 84 and the external connection terminal 85.
Japanese Patent Application Laid-Open No. 2002-295992

  However, in the conventional imaging module, since the lens fixing member 89 is bonded to the upper surface 81b of the insulating base 81, the lens fixing member 89 may be displaced from the predetermined position in the horizontal direction. For this reason, a positional shift between the lens 810 and the light receiving portion of the image sensor occurs, and there is a possibility that the light transmitted through the lens 810 cannot be accurately incident on the light receiving portion 83a of the image sensor 83.

  Further, in order to reduce the displacement of the lens fixing member 89 in the horizontal direction, when the lens fixing member 89 is fitted from above the insulating base 81 and joined to the side surface 81c of the insulating base 81, the insulating base 81 and the lens fixing member As a result, the insulating base 81 or the lens fixing member 89 may be chipped and scrap may be generated. If such debris is generated inside the lens fixing member 89, the debris may block light transmitted through the lens 810 and be projected as a shadow.

  Further, when the insulating base 81 and the lens fixing member 89 are chipped, the outer dimensions of the insulating base 81 and the lens fixing member 89 change, and the lens fixing member 89 cannot be bonded to the insulating base 81 with high accuracy. There is a possibility that the light transmitted through the lens 810 cannot be accurately incident on the light receiving portion 83a of the image sensor 83.

  The present invention has been completed in view of the above-described conventional problems. The object of the present invention is to make the positional accuracy between the lens and the light receiving portion of the image sensor accurate, and the light transmitted through the lens is the image sensor. An object of the present invention is to realize an imaging module that can be accurately converted into an electrical signal and taken out as a clear image.

  An image sensor housing package according to the present invention is disposed on an element mounting portion on which an image sensor is mounted, an upper surface to which a translucent member is bonded so as to face the light receiving portion of the image sensor, and the upper surface side. An insulating base having a side surface to which a mounting portion of the lens fixing member is joined is provided, and a notch is provided at a position corresponding to the mounting portion of the lens fixing member on the outer edge of the upper surface of the insulating base. It is characterized by this.

  In the image pickup device storage package according to the present invention, the corner portion of the cutout portion is formed in an arc shape in a plan view.

  The image pickup device storage package according to the present invention is characterized in that a locking portion is formed on a side surface of the insulating base so as to contact a lower end of the lens fixing member.

  The imaging device of the present invention includes the imaging element storage package of the present invention, an imaging element mounted on the element mounting portion of the insulating base, and a translucent member bonded to the upper surface of the insulating base. It is characterized by that.

  The imaging module of the present invention is configured to face the translucent member, the imaging device of the present invention, a lens fixing member that is disposed on the upper surface side of the insulating base and has a protrusion that contacts the upper surface of the insulating base. And a lens fixed to the lens fixing member.

  The image pickup device storage package according to the present invention is provided with a notch at a position corresponding to the attachment portion of the lens fixing member on the outer edge of the upper surface of the insulating base. It is possible to reduce the generation of dust or the like that hinders light reception, and to improve the accuracy of the mounting position of the lens fixing member, thereby realizing an image sensor module with high image quality.

  That is, the imaging element storage package of the present invention has a chamfered corner corresponding to the mounting portion of the lens fixing member of the insulating base, so that when the lens fixing member is attached to the insulating base, the insulating base and lens The possibility that the insulating base and the lens fixing member may be lost due to rubbing with the fixing member can be reduced. Then, by reducing the chipping of the insulating base, the lens fixing member can be bonded to the insulating base with high positional accuracy.

  In the image pickup device storage package of the present invention, the notch is partially formed so as to correspond to the mounting portion of the lens fixing member. The position of the side surface of the insulating base to which the fixing member is joined can be clearly recognized by the image recognition device or the like.

  In addition, the image pickup device storage package of the present invention can reduce the occurrence of chipping due to contact between the insulating base and the lens fixing member by forming the corners of the notches in an arc shape in plan view. In addition, the lens fixing member can be accurately joined to the insulating base.

  In the image pickup device storage package of the present invention, the lens fixing member including the lens is bonded and fixed to the side surface of the insulating base by forming a locking portion that contacts the lower end of the lens fixing member. When the imaging module is used, the positional accuracy in the height direction between the lens fixed to the lens fixing member and the imaging element can be extremely increased by bonding and fixing the lens fixing member to the upper surface of the locking portion. .

  Therefore, by providing high focusing performance between the lens and the light receiving unit of the image sensor, the imaging module can convert the light transmitted through the lens into an electrical signal accurately by the image sensor and extract it as a clear image. Can do.

  The imaging device of the present invention includes the imaging element storage package of the present invention, an imaging element mounted on the element mounting portion of the insulating base, and a translucent member bonded to the upper surface of the insulating base, thereby providing a lens. When the fixing member is attached to the insulating base, the possibility that dust or the like is generated inside the lens fixing member can be reduced, and an image sensor module with high image quality can be realized.

  The imaging module of the present invention includes the imaging device of the present invention, a lens fixing member that is disposed on the upper surface side of the insulating base and has a protruding portion that contacts the upper surface of the insulating base, and a lens fixing member that faces the translucent member. By providing a lens fixed to the lens, the focusing performance between the lens and the light receiving portion of the image sensor is increased, so that the light transmitted through the lens is accurately converted into an electric signal by the image sensor and a clear image is obtained. An imaging module that can be taken out can be provided.

  An image sensor storage package, an imaging device, and an imaging module according to the present invention will be described in detail with reference to the drawings.

  First, a first example of the image pickup device storage package and the image pickup apparatus according to the present invention will be described with reference to FIG. FIG. 1A is a plan view showing a structure of a first example of an image pickup device storage package and an image pickup apparatus according to the present invention, and FIG. 1B shows an image pickup device storage shown in FIG. It is sectional drawing in the XX 'line of the package for imaging and an imaging device.

  The imaging element storage package of the present invention includes an insulating substrate 1 having an element mounting portion 1a, an upper surface 1b to which the translucent member 2 is bonded, and a side surface 1c to which the mounting portion 9a of the lens fixing member 9 is bonded. I have. A cutout portion 1 d is provided at a location corresponding to the mounting portion 9 a of the lens fixing member 9 on the outer edge of the upper surface 1 b of the insulating base 1. The image pickup apparatus of the present invention includes an image pickup element 3 mounted on the element mounting portion 1a of the image pickup element storage package of the present invention, and a translucent member 2 bonded to the upper surface 1b of the insulating substrate 1. Yes.

  The insulating substrate 1 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic) or an aluminum nitride sintered body, and is molded as a thin flat plate.

  If the insulating base 1 is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry, which is then formed into a sheet by the doctor blade method or calendar roll method. To obtain a green sheet (ceramic green sheet). Next, a punching process is performed to form a through hole for forming the wiring conductor 4 in the green sheet, a through hole 1f for allowing light to pass therethrough, and a recess 1g for accommodating the imaging element 3, A metal paste that becomes the wiring conductor 4 and the external connection terminal 5 is printed on the green sheet. These green sheets are laminated and cut to obtain a green sheet molded body for the insulating substrate 1. Finally, the molded body is sintered at a high temperature (about 1600 ° C.) to manufacture the insulating substrate 1.

  Inside the insulating base 1, a wiring conductor 4 made of a metal such as W (tungsten) or Mo (molybdenum), for example, is transmitted, through which an electrical signal output from the image sensor 3 is transmitted. For the wiring conductor 4, for example, a metal paste obtained by adding and mixing an appropriate organic solvent and solvent to a refractory metal powder such as W or Mo is preliminarily formed into a predetermined pattern on a green sheet to be an insulating substrate 1 by screen printing. By printing and coating, and simultaneously firing with the green sheet to be the insulating substrate 1, it is deposited on a predetermined position of the insulating substrate 1. An external connection terminal 5 that is electrically connected to the wiring conductor 4 is formed on the lower surface 1 e of the insulating base 1.

  If a metal having excellent corrosion resistance such as nickel or gold is applied to the exposed surfaces of the wiring conductor 4 and the external connection terminal 5 to a thickness of about 1 to 20 μm, the wiring conductor 4 and the external connection terminal 5 are used. The possibility of oxidative corrosion is reduced, and the bonding between the wiring conductor 4 and the electrode of the imaging device 3 and the bonding between the external connection terminal 5 and the wiring conductor of the external circuit board (not shown) are strong. Can be. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surfaces of the wiring conductor 4 and the external connection terminal 5 by an electrolytic plating method or an electroless plating method. It is preferable that

  A through hole 1f through which light incident on the image pickup element 3 from the upper surface 1a side of the insulating substrate 1 passes is formed at the center of the upper surface 1b of the insulating substrate 1. On the lower side of the through hole 1f (on the lower surface 1e side of the insulating base 1), an element mounting portion 1a on which the imaging element 3 is mounted and a recess 1g in which the imaging element 3 is accommodated are formed.

  The image pickup element 3 has a CCD-type and CMOS-type light receiving portion 3a formed on a silicon substrate, and an electrode made of gold or the like is provided on the outer peripheral portion of the surface (the upper surface in FIG. 1B). Is formed. The electrode of the image pickup device 3 is electrically connected to the wiring conductor 4 around the through hole 1f on the bottom surface of the recess 1g via an electrical connection member 6 such as a conductor bump. Further, in order to detect the light incident from the upper side of the insulating substrate 1, the image sensor 3 is arranged such that the light receiving part 3a formed on the surface thereof faces the through hole 2b (the light receiving part 3a is in the light incident direction). Flip-chip mounted on the insulating substrate 1.

  That is, the image pickup device 3 is flip-chip bonded by, for example, an ultrasonic bonding method to the wiring conductor 4 whose electrode is plated with nickel, gold, or the like of the insulating base 1 via the electrical connection member 6. The flip chip bonding by the ultrasonic bonding method is a bonding method in which bonding is performed by applying ultrasonic vibration to the bonding portion for about 0.5 seconds while pressurizing the bonding portion at room temperature. A sealing resin 7 that reinforces the joint portion and seals the image sensor 3 is provided around the joint portion of the image sensor 3. This sealing resin 7 is a resin in which the viscosity of a resin such as an epoxy resin is increased, and a thixo ratio that is an index of the strength of maintaining the shape of the resin is as large as 1.7 or more.

  The imaging element 3 is bonded to the element mounting portion 1a on the bottom surface of the recess 1g with a bonding member such as epoxy resin or solder, and the electrode is electrically connected to the wiring conductor 4 via a bonding wire or the like. But you can.

  Note that a translucent member 4 for protecting the light receiving portion 3a of the imaging element 3 is attached to the upper surface 1b of the insulating base 1 with a resin adhesive or the like. The translucent member 4 is made of glass, sapphire, or the like, and is bonded to the upper surface 1b of the insulating base 1 with a resin adhesive such as an epoxy resin to protect the light receiving portion 3a of the imaging element 3.

  In the image pickup device storage package of the present invention, a notch 1d is formed on the outer edge of the upper surface 1b of the insulating base 1 at a location corresponding to the mounting portion 9a of the lens fixing member 9. In FIG. 1A, the position where the lens fixing member 9 is arranged is indicated by a dotted line. In the structure shown in FIG. 1A, attachment portions (protruding portions) 9 a that are in contact with the side surface 1 c of the insulating base 1 of the image sensor housing package are formed at six locations on the inner side surface of the lens fixing member 9. A cutout 1d is formed on the upper surface 1b of the insulating base 1 so as to correspond to each of the six attachment portions 9a.

  The notch 1d is a chamfered corner formed by the upper surface 1b and the side surface 1c of the insulating substrate 1. With such a configuration, when the lens fixing member 9 is fitted into the insulating base 1, the mounting portion 9 a of the lens fixing member 9 is moved from the inclined surface of the notched portion 1 d of the insulating base 1 to the side surface 1 c of the insulating base 1. It can be moved in a sliding manner.

  In the structure shown in FIG. 1, the attachment portions 9a of the lens fixing member 9 are formed on each side of the rectangular lens fixing member 9, and the cutout portions 1d of the insulating base 1 correspond to the attachment portions 9a. And formed on each side of the rectangular insulating substrate 1.

  In the structure shown in FIG. 1, the notch 1 d of the insulating base 1 is partially formed on each side of the upper surface 1 b of the insulating base 1. According to the present invention, the edge of the upper surface 1b of the insulating substrate 1 can be clarified by such a structure, and the position where the lens fixing member 9 is arranged can be clearly detected by an image recognition device or the like.

  Here, the structure of the imaging module in which the lens fixing member 9 is joined to the imaging apparatus 1 shown in FIG. 1 will be described with reference to FIG. FIG. 2 is a cross-sectional view showing the structure of the imaging module of the present invention. The imaging module of the present invention includes the imaging apparatus of the present invention shown in FIG. 1, a lens fixing member 9 provided on the upper surface 1 b side of the insulating substrate 1, and a lens 10.

  The lens fixing member 9 is fitted from the upper surface side (the upper surface 1b side of the insulating base 1) of the imaging device, and the attachment portion 9a is joined to the side surface 1c of the insulating base 1. A through hole 9b through which light incident on the imaging device passes is formed in the upper surface 9c of the lens fixing member 9. The lens 10 is fixed to the inner side of the lens fixing member 9 so as to face the translucent member 2 and the light receiving portion 3a of the image sensor 3.

  The image pickup device storage package and the image pickup apparatus of the present invention are provided with a lens fixing portion by providing a cutout portion 1d at a position corresponding to the mounting portion 9a of the lens fixing member 9 on the outer edge of the upper surface 1b of the insulating substrate 1. When the member 9 is fitted into the imaging apparatus from the upper surface 1b side of the insulating base 1, the possibility that the insulating base 1 or the lens fixing member 9 is partially chipped and scraps are generated inside the lens fixing member 9 is reduced. Therefore, an imaging module with improved image quality can be realized.

  In addition, the image pickup device storage package and the image pickup apparatus of the present invention can reduce the possibility that the insulating base 1 is lost, and can improve the positional accuracy between the lens fixing member 9 and the insulating base 1. Become.

  That is, the image pickup device storage package of the present invention has the notch 1d formed in the insulating base 1, thereby reducing the hooking of the mounting portion 9a of the lens fixing member 9 to the insulating base 1 and the lens fixing member. 9 can be smoothly fitted into the insulating substrate 1.

  As shown in FIG. 3, in the image pickup device storage package and the image pickup apparatus of the present invention, it is preferable that the corner portion of the cutout portion 31 d of the insulating base 1 is formed in an arc shape in plan view. FIG. 3 is a plan view showing the structure of the second example of the imaging apparatus of the present invention. In FIG. 3, the position where the lens fixing member 9 is arranged is indicated by a dotted line.

  With such a configuration, the image pickup device storage package and the image pickup apparatus of the present invention can reduce the occurrence of chipping due to contact between the insulating base 1 and the lens fixing member 9, and the cutout portion 31 d has a cutout portion. Since it is inclined toward the center direction of the side surface 1c of the portion where the portion 31d is formed, the lens fixing contacting the insulating base 1 when the mounting portion 39a of the lens fixing member 9 is brought into contact with the side surface 1c of the insulating base 1 is performed. The attachment part 39a of the member 9 can be brought close to the center part of the notch part 31d, and the lens fixing member 9 can be joined to the insulating substrate 1 with high accuracy.

  Here, a method of forming the cutout portion 1d of the image pickup device storage package shown in FIG. 1 and the cutout portion 31d of the image pickup device storage package shown in FIG. 3 will be described with reference to FIG. The notch 1d and the notch 31d are prepared by preparing a mother substrate 41 having a recess 41a extending upward and cutting the mother substrate 41 along a dividing line NN ′ on the recess 41a (see FIG. As shown in FIG. 4A, the insulating base 1 is formed on the outer edge of the upper surface (FIG. 4B). The mother substrate 41 may be a ceramic green sheet laminate before firing. In this case, the ceramic green sheet laminate is divided along the dividing line NN ′, and then cut out by firing the ceramic green sheet laminate. A portion 1d and a notch portion 31d are formed. In addition, the concave portion 41a that expands upward is formed with a through hole that becomes a concave portion 41a that expands from one surface to the other surface in the ceramic green sheet so that the concave portion 41a expands upward. By laminating with other ceramic green sheets, the ceramic green sheet laminate or the mother substrate 41 can be formed.

  Further, as shown in FIG. 5 as a cross-sectional view of the imaging module, it is preferable that a locking portion 51 h that contacts the lower end of the lens fixing member 9 is formed on the side surface 1 c of the insulating base 1. With such a configuration, the imaging element storage package and the imaging device of the present invention lock the lens fixing member 9 when the imaging device is obtained by bonding and fixing the lens fixing member 9 including the lens 10 to the imaging device. By placing the lens fixing member 9 on the upper surface of the portion 2c, the positional accuracy in the height direction between the lens 10 fixed to the lens fixing member 9 and the imaging element 3 can be made extremely high.

  Therefore, when the subject is photographed, the focusing performance between the lens 10 and the light receiving unit 3a of the image sensor 3 is increased, so that the light transmitted through the lens 10 is accurately converted into an electric signal by the image sensor 3. An imaging module that can be extracted as a clear image can be provided.

  The locking portions 51h of the insulating base 1 may be formed on the four sides of the rectangular insulating base 1 or may be formed only on the two sides of the rectangular insulating base 1.

  Moreover, it is preferable that the locking part 51h has a width of 0.5 to 2.0 mm protruding from the side surface 1c of the insulating base 1. In the case of less than 0.5 mm, the range in which the lens fixing member 9 is bonded and fixed to the upper surface of the locking portion 51h becomes narrow, and the adhesive strength decreases. On the other hand, if it exceeds 2.0 mm, the image pickup device housing package 1, the image pickup apparatus, and the image pickup module are likely to be increased in size.

  Moreover, it is preferable that the flatness of the upper surface of the latching | locking part 51h and the bottom face of the recessed part 1g is 5-50 micrometers. If the thickness is less than 5 μm, the production process becomes complicated and the production becomes difficult. On the other hand, if it exceeds 50 μm, the focusing performance between the lens 9 and the light receiving portion 3a tends to be lowered.

  As shown in FIG. 6, the imaging module of the present invention includes the imaging device of the present invention of FIG. 1 or 3 and a protrusion 69 d that is disposed on the upper surface 1 b side of the insulating base 1 and contacts the upper surface 1 b of the insulating base 1. It is preferable to include a lens fixing member 9 and a lens 10 fixed to the lens fixing member 9 so as to face the translucent member 2. With this configuration, when the lens fixing member 9 including the lens 10 is bonded and fixed to the imaging device to form the imaging module 11, the protruding portion 69 d of the lens fixing member 9 is in contact with the upper surface 1 b of the insulating base 1, thereby The positional accuracy in the height direction between the lens 10 fixed to the fixing member 9 and the image sensor 3 can be made extremely high.

  Therefore, when the subject is photographed, the focusing performance between the lens 10 and the light receiving unit 3a of the image sensor 3 is increased, so that the light transmitted through the lens 10 is accurately converted into an electric signal by the image sensor 3. An imaging module that can be extracted as a clear image can be provided.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in a cross-sectional view of an imaging apparatus using the imaging element storage package of the present invention in FIG. 7, the imaging apparatus accommodates the element mounting portion 71 a of the imaging element 3 and the imaging element 3 on the upper surface 1 b. The insulating base 1 in which the concave portion 71g is formed, the wiring conductor 4 led out from the bottom surface of the concave portion 71g to the lower surface of the insulating base 1, and the light receiving portion 3a facing the upper side on the bottom surface of the concave portion 71g. The imaging element 3 electrically connected to the wiring conductor 4 and the translucent member 2 attached to the upper surface 1b of the insulating base 1 so as to cover the recess 71g may be provided. In addition, the electrode of the image pick-up element 3 is connected to the wiring conductor 4 by the wire 76, for example.

(A) is a top view which shows the structure of the 1st example of the image pick-up element accommodation package and image pick-up device of this invention, (b) is the image pick-up element housing package and image pick-up apparatus shown to (a). It is sectional drawing in a XX 'line. It is sectional drawing which shows the structure of the 1st example of the imaging module of this invention. It is a top view which shows the structure of the 2nd example of the image pick-up element accommodation package and image pick-up device of this invention. It is sectional drawing which shows the formation method of the notch formed in the insulation base | substrate 1 of the image pick-up element storage package of this invention. It is a top view which shows the structure of the 3rd example of the image pick-up element storage package of this invention, and an imaging device. It is sectional drawing which shows the structure of the 2nd example of the imaging module of this invention. It is a top view which shows the structure of the 4th example of the package for image pick-up element accommodation of this invention, and an imaging device. It is sectional drawing which shows the structure of the conventional imaging module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Insulation base | substrate 1a: Element mounting part 1b: Upper surface 1c: Side surface 1d Notch part 1e: Lower surface 1f: Through-hole 1g: Recessed part 2: Translucent member 3: Imaging element 3a: Light-receiving part 4: Wiring conductor 5: External Connection terminal 6: Electrical connection member 7: Sealing resin 9: Lens fixing member 9a: Mounting portion

Claims (5)

An element mounting portion on which the image sensor is mounted, an upper surface to which the translucent member is bonded so as to face the light receiving portion of the image sensor, and a mounting portion for the lens fixing member disposed on the upper surface side are bonded. An image pickup device storing package, comprising: an insulating base having a side surface, wherein a notch is provided at a position corresponding to the mounting portion of the lens fixing member on the outer edge of the upper surface of the insulating base. . 2. The image pickup device storage package according to claim 1, wherein the corner portion of the cutout portion is formed in an arc shape in a plan view. The image sensor housing package according to claim 1, wherein a locking portion that contacts a lower end of the lens fixing member is formed on a side surface of the insulating base. The image pickup device storage package according to any one of claims 1 to 3, an image pickup device mounted on the device mounting portion of the insulating base, and a translucent member bonded to the upper surface of the insulating base. An imaging device comprising: 5. The imaging apparatus according to claim 4, a lens fixing member that is disposed on an upper surface side of the insulating base and has a protruding portion that contacts the upper surface of the insulating base, and the lens fixing member so as to face the translucent member. And a lens fixed to the imaging module.

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