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JP2006237073A - Electronic circuit unit - Google Patents

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Publication number
JP2006237073A
JP2006237073A JP2005045828A JP2005045828A JP2006237073A JP 2006237073 A JP2006237073 A JP 2006237073A JP 2005045828 A JP2005045828 A JP 2005045828A JP 2005045828 A JP2005045828 A JP 2005045828A JP 2006237073 A JP2006237073 A JP 2006237073A
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conductive pattern
heat
electronic component
circuit unit
electronic
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JP2005045828A
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Inventor
Koichi Higuchi
広一 樋口
Teruo Tadachi
晃夫 忠地
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit unit capable of maintaining an electronic characteristic in a good state by reducing the influence due to the heat of an electronic component in a usage environment temperature of 65°C or low. <P>SOLUTION: In this electronic circuit unit, a first heat dissipation conductive pattern 2b positioned inter-laminate 1b of a multilayer substrate 1 has a deleting section 2c of the first heat dissipation conductive pattern 2b opposing the entire lower surface of a first electronic component 5a having a usage environment temperature of 65°C or low. With this configuration, if the heat from a heat-generating component 4 is transmitted to the first heat dissipation conductive pattern 2b and the temperature in the first heat dissipation conductive pattern 2b rises, the deleting section 2c of the first heat dissipation conductive pattern 2b reduces the influence on a first electronic component 5a. Accordingly, a unit capable of maintaining the satisfactory electric characteristic of the first electronic component 5a can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は電灯線通信用モデム等に適用して好適な電子回路ユニットに関する。   The present invention relates to an electronic circuit unit suitable for application to a power line communication modem or the like.

図２は従来の電子回路ユニットの全体を示す一部断面正面図、図３は従来の電子回路ユニットに係る発熱部品近傍の断面図であり、次に、従来の電子回路ユニットの構成を図２、図３に基づいて説明すると、多層基板５１には、信号用導電パターン５２ａと接地用導電パターン５２ｂからなる配線パターン５２が設けられている。   FIG. 2 is a partial cross-sectional front view showing the entire conventional electronic circuit unit, FIG. 3 is a cross-sectional view of the vicinity of a heat generating component related to the conventional electronic circuit unit, and FIG. 2 shows the configuration of the conventional electronic circuit unit. Referring to FIG. 3, the multilayer substrate 51 is provided with a wiring pattern 52 including a signal conductive pattern 52a and a ground conductive pattern 52b.

また、図３に示すように、多層基板５１の上面と積層間には、放熱を兼ねる信号用導電パターン５２ａが設けられると共に、複数の接続導体（スルーホール）５３が多層基板５１の上面から積層間に跨って設けられて、積層間に位置した信号用導電パターン５２ａに接続され、また、多層基板５１の下部の積層間には、放熱を兼ねる接地用導電パターン５２ｂが設けられている。   Further, as shown in FIG. 3, a signal conductive pattern 52 a also serving as heat dissipation is provided between the upper surface of the multilayer substrate 51 and the stack, and a plurality of connection conductors (through holes) 53 are stacked from the upper surface of the multilayer substrate 51. A grounding conductive pattern 52 b that also serves as heat dissipation is provided between the lower layers of the multilayer substrate 51, and is connected to the signal conductive patterns 52 a located between the layers.

そして、多層基板５１には、発熱部品５４や種々の電子部品５５が搭載されて、所望の電気回路が形成されると共に、発熱部品５４は、図３に示すように、発熱部品５４の下面が接続導体５３に近接して、発熱部品５４の熱が接続導体５３と信号用導電パターン５２ａを介して放熱されるようになって、従来の電子回路ユニットが形成されている。（例えば、特許文献１参照）   A heat generating component 54 and various electronic components 55 are mounted on the multilayer substrate 51 to form a desired electric circuit. The heat generating component 54 has a lower surface of the heat generating component 54 as shown in FIG. In the vicinity of the connection conductor 53, the heat of the heat generating component 54 is dissipated through the connection conductor 53 and the signal conductive pattern 52a, so that a conventional electronic circuit unit is formed. (For example, see Patent Document 1)

しかし、従来の電子回路ユニットにおいて、電解コンデンサ等の使用環境温度が６５℃以下の電子部品を含む電子部品５５が使用されており、この場合、使用環境温度が６５℃以下の電子部品の下面と対向する位置には、放熱を兼ねる信号用導電パターン５２ａや接地用導電パターン５２ｂが存在して、発熱部品５４からの熱が信号用導電パターン５２ａや接地用導電パターン５２ｂに伝達されて温度が高くなり、従って、この伝達された高い熱が使用環境温度が６５℃以下の電子部品に影響して、使用環境温度が６５℃以下の電子部品の電気的な特性を悪くし、部品寿命を短くするものであった。   However, in the conventional electronic circuit unit, an electronic component 55 including an electronic component having an operating environment temperature of 65 ° C. or lower, such as an electrolytic capacitor, is used. There are signal conductive patterns 52a and grounding conductive patterns 52b that also serve as heat dissipation at opposite positions, and heat from the heat generating component 54 is transferred to the signal conductive patterns 52a and grounding conductive patterns 52b, resulting in a high temperature. Therefore, the transmitted high heat affects electronic parts whose operating environment temperature is 65 ° C. or lower, which deteriorates the electrical characteristics of the electronic components whose operating environment temperature is 65 ° C. or lower and shortens the component life. It was a thing.

特開平１０−１８９８１１号公報JP-A-10-189811

従来の電子回路ユニットにおいて、使用環境温度が６５℃以下の電子部品を含む電子部品５５が使用されている場合、使用環境温度が６５℃以下の電子部品の下面と対向する位置には、放熱を兼ねる信号用導電パターン５２ａや接地用導電パターン５２ｂが存在して、発熱部品５４からの熱が信号用導電パターン５２ａや接地用導電パターン５２ｂに伝達されて温度が高くなり、従って、この伝達された高い熱が使用環境温度が６５℃以下の電子部品に影響して、使用環境温度が６５℃以下の電子部品の電気的な特性を悪くし、部品寿命を短くするという問題がある   In the conventional electronic circuit unit, when an electronic component 55 including an electronic component having an operating environment temperature of 65 ° C. or lower is used, heat radiation is performed at a position facing the lower surface of the electronic component having an operating environment temperature of 65 ° C. or lower. The signal conductive pattern 52a and the ground conductive pattern 52b that also serve as the heat conductive component 52a and the ground conductive pattern 52b are transmitted to the signal conductive pattern 52a and the ground conductive pattern 52b. There is a problem that high heat affects electronic parts whose operating environment temperature is 65 ° C. or lower, which deteriorates the electrical characteristics of electronic components whose operating environment temperature is 65 ° C. or lower and shortens the life of the parts.

そこで、本発明は使用環境温度が６５℃以下の電子部品の熱による影響が少なく、電気的な特性を良好な状態に維持できる電子回路ユニットを提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic circuit unit that is less affected by heat of an electronic component having a use environment temperature of 65 ° C. or less and can maintain electrical characteristics in a good state.

上記課題を解決するための第１の解決手段として、配線パターンが設けられ、発熱部品と電子部品が上面に搭載されて所望の電気回路を形成した多層基板を備え、この多層基板は、積層間に設けられた第１の放熱用導電パターンと、前記発熱部品の下面の位置から前記第１の放熱用導電パターンに繋がるように配置された導電材からなる接続導体を有し、前記電子部品は、使用環境温度が６５℃以下の第１の電子部品を有し、この第１の電子部品の下面と対向する前記積層間に配置された前記第１の放熱用導電パターンには、前記第１の電子部品の前記下面全体に対向した位置において、前記第１の電子部品の前記下面全体とほぼ同一、或いはやや大きめの前記第１の放熱用導電パターンの削除部を有した構成とした。   As a first solving means for solving the above-mentioned problem, a wiring board is provided, and a multilayer board having a heating circuit and electronic parts mounted on the upper surface to form a desired electric circuit is provided. And a connection conductor made of a conductive material arranged so as to be connected to the first heat dissipation conductive pattern from the position of the lower surface of the heat generating component, and the electronic component is The first heat dissipation conductive pattern having the first electronic component having a use environment temperature of 65 ° C. or less and disposed between the stacked layers facing the lower surface of the first electronic component includes the first electronic component. In the position facing the entire lower surface of the first electronic component, the first heat dissipating portion of the first heat dissipating conductive pattern is substantially the same as or slightly larger than the entire lower surface of the first electronic component.

また、第２の解決手段として、前記多層基板の下面には、前記接続導体に接続された第２の放熱用導電パターンが設けられ、前記第１の電子部品の下面と対向する前記下面に配置された前記第２の放熱用導電パターンには、前記第１の電子部品の前記下面全体に対向した位置において、前記第１の電子部品の前記下面全体とほぼ同一、或いはやや大きめの前記第２の放熱用導電パターンの削除部を有した構成とした。   As a second solution, a second heat radiation conductive pattern connected to the connection conductor is provided on the lower surface of the multilayer substrate, and is disposed on the lower surface facing the lower surface of the first electronic component. The second heat dissipating conductive pattern is substantially the same as or slightly larger than the entire lower surface of the first electronic component at a position facing the entire lower surface of the first electronic component. It was set as the structure which had the deletion part of the conductive pattern for thermal radiation of.

また、第３の解決手段として、前記第１の電子部品が電解コンデンサ、又は／及び水晶発振器で形成された構成とした。
また、第４の解決手段として、前記発熱部品の下面に対向する前記多層基板の上面には、前記接続導体に繋がれ、前記発熱部品の下面に接触した第３の放熱用導電パターンが設けられた構成とした。
また、第５の解決手段として、前記配線パターンと前記放熱用導電パターンが銅箔パターンで形成された構成とした。 As a third solution, the first electronic component is formed of an electrolytic capacitor and / or a crystal oscillator.
As a fourth solution, a third heat radiation conductive pattern connected to the connection conductor and in contact with the lower surface of the heat generating component is provided on the upper surface of the multilayer substrate facing the lower surface of the heat generating component. The configuration was as follows.
Further, as a fifth solving means, the wiring pattern and the heat radiation conductive pattern are formed of a copper foil pattern.

本発明の電子回路ユニットは、配線パターンが設けられ、発熱部品と電子部品が上面に搭載されて所望の電気回路を形成した多層基板を備え、この多層基板は、積層間に設けられた第１の放熱用導電パターンと、発熱部品の下面の位置から第１の放熱用導電パターンに繋がるように配置された導電材からなる接続導体を有し、電子部品は、使用環境温度が６５℃以下の第１の電子部品を有し、この第１の電子部品の下面と対向する積層間に配置された第１の放熱用導電パターンには、第１の電子部品の下面全体に対向した位置において、第１の電子部品の下面全体とほぼ同一、或いはやや大きめの第１の放熱用導電パターンの削除部を有した構成とした。
即ち、多層基板の積層間に位置する第１の放熱用導電パターンには、使用環境温度が６５℃以下の第１の電子部品の下面全体に対向した第１の放熱用導電パターンの削除部を有したため、発熱部品からの熱が第１の放熱用導電パターンに伝達されて、第１の放熱用導電パターンの温度が高くなっても、第１の放熱用導電パターンの削除部によって、第１の電子部品への影響が少なくなり、従って、第１の電子部品の電気的な特性を良好な状態に維持できるものが得られる。 An electronic circuit unit according to the present invention includes a multilayer substrate provided with a wiring pattern, and on which an exothermic component and an electronic component are mounted to form a desired electric circuit. The multilayer substrate is a first layer provided between the layers. And a conductive conductor arranged so as to be connected from the position of the lower surface of the heat-generating component to the first heat-dissipating conductive pattern. The electronic component has a use environment temperature of 65 ° C. or lower. The first heat dissipating conductive pattern having the first electronic component and disposed between the layers facing the lower surface of the first electronic component has a position facing the entire lower surface of the first electronic component. The first electronic component is configured to have a deletion part of the first heat radiation conductive pattern that is substantially the same as or slightly larger than the entire lower surface of the first electronic component.
That is, the first heat-dissipating conductive pattern located between the multilayer substrates is provided with a deleted portion of the first heat-dissipating conductive pattern facing the entire lower surface of the first electronic component whose operating environment temperature is 65 ° C. or lower. Therefore, even if the heat from the heat-generating component is transmitted to the first heat dissipation conductive pattern and the temperature of the first heat dissipation conductive pattern increases, the first heat dissipation conductive pattern deletes the first heat dissipation component. Thus, it is possible to obtain a device that can maintain the electrical characteristics of the first electronic component in a good state.

また、多層基板の下面には、接続導体に接続された第２の放熱用導電パターンが設けられ、第１の電子部品の下面と対向する下面に配置された第２の放熱用導電パターンには、第１の電子部品の下面全体に対向した位置において、第１の電子部品の下面全体とほぼ同一、或いはやや大きめの第２の放熱用導電パターンの削除部を有したため、発熱部品の放熱効果が良好であるばかりか、熱による第１の電子部品への影響をより少なくできて、電気的な特性を一層良好な状態に維持できる。   In addition, a second heat dissipation conductive pattern connected to the connection conductor is provided on the lower surface of the multilayer substrate, and the second heat dissipation conductive pattern disposed on the lower surface facing the lower surface of the first electronic component includes The heat-dissipating effect of the heat-generating component is provided at the position facing the entire lower surface of the first electronic component because the second heat-dissipating conductive pattern is substantially the same as or slightly larger than the entire lower surface of the first electronic component. In addition to being good, the influence of the heat on the first electronic component can be reduced, and the electrical characteristics can be maintained in a better state.

また、第１の電子部品が電解コンデンサ、又は／及び水晶発振器で形成されたため、使用環境温度が６５℃以下の電解コンデンサや水晶発振器の電気的な特性を良好な状態に維持できる。   In addition, since the first electronic component is formed of an electrolytic capacitor and / or a crystal oscillator, the electrical characteristics of the electrolytic capacitor or the crystal oscillator having a use environment temperature of 65 ° C. or less can be maintained in a good state.

また、発熱部品の下面に対向する多層基板の上面には、接続導体に繋がれ、発熱部品の下面に接触した第３の放熱用導電パターンが設けられたため、発熱部品の放熱効果を一層良好にできる。   In addition, since the third heat dissipation conductive pattern connected to the connection conductor and in contact with the lower surface of the heat generating component is provided on the upper surface of the multilayer substrate facing the lower surface of the heat generating component, the heat dissipation effect of the heat generating component is further improved. it can.

また、配線パターンと放熱用導電パターンが銅箔パターンで形成されたため、銅箔パターンは熱伝導性が良く、発熱部品の放熱効果を一層良好にできる。   Moreover, since the wiring pattern and the conductive pattern for heat dissipation are formed of a copper foil pattern, the copper foil pattern has good thermal conductivity, and the heat dissipation effect of the heat-generating component can be further improved.

図１は本発明の電子回路ユニットの要部断面図であり、次に、本発明の電子回路ユニットの構成を図１に基づいて説明すると、セラミック等の絶縁板が積層からなる多層基板１には、信号用導電パターン２ａと接地用導電パターン等からなる放熱用導電パターン２ｂを有した銅箔パターン等からなる配線パターン２が設けられている。   FIG. 1 is a cross-sectional view of an essential part of an electronic circuit unit according to the present invention. Next, the configuration of the electronic circuit unit according to the present invention will be described with reference to FIG. Are provided with a wiring pattern 2 made of a copper foil pattern or the like having a heat radiating conductive pattern 2b made of a signal conductive pattern 2a and a grounding conductive pattern.

また、信号用導電パターン２ａと放熱用導電パターン２ｂは、多層基板１の上面１ａ、積層間１ｂ、及び下面１ｃに設けられると共に、多層基板１の上面１ａ、積層間１ｂ、及び下面１ｃに設けられた放熱用導電パターン２ｂは、導電材からなる１個、或いは複数個の接続導体（スルーホール）３によって接続されている。   The signal conductive pattern 2a and the heat radiating conductive pattern 2b are provided on the upper surface 1a, the interlaminate 1b, and the lower surface 1c of the multilayer substrate 1, and are provided on the upper surface 1a, the interlaminate 1b, and the lower surface 1c of the multilayer substrate 1. The heat-dissipating conductive pattern 2b is connected by one or a plurality of connecting conductors (through holes) 3 made of a conductive material.

そして、多層基板１の上面１ａには、半導体部品等からなる発熱部品４や電解コンデンサや水晶発振器からなる使用環境温度が６５℃以下の第１の電子部品５ａを含む種々の電子部品５が搭載されて、所望の電気回路が形成されている。
また、発熱部品４が多層基板１に搭載された際、発熱部品４の下面が上面１ａに設けられた放熱用導電パターン２ｂと接続導体３の上部に接触して、発熱部品４の熱が上面１ａ、積層間１ｂ、及び下面１ｃの放熱用導電パターン２ｂと接続導体３を介して放熱されるようになっている。 On the upper surface 1a of the multilayer substrate 1, various electronic components 5 including a heat generating component 4 made of a semiconductor component or the like and a first electronic component 5a made of an electrolytic capacitor or a crystal oscillator having a use environment temperature of 65 ° C. or less are mounted. Thus, a desired electric circuit is formed.
Further, when the heat generating component 4 is mounted on the multilayer substrate 1, the lower surface of the heat generating component 4 comes into contact with the heat conductive pattern 2 b provided on the upper surface 1 a and the upper portion of the connection conductor 3, and the heat of the heat generating component 4 is transferred to the upper surface. Heat is dissipated through the conductive pattern 2b for heat radiation on the lower surface 1c and the connecting conductor 3 between the la, 1b between the layers, and the lower surface 1c.

更に、使用環境温度が６５℃以下の第１の電子部品５ａの下面には、放熱用導電パターン２ｂと接続導体３が存在しない状態となっている。
即ち、使用環境温度が６５℃以下の第１の電子部品５ａの下面と対向する多層基板１の積層間１ｂに配置された放熱用導電パターン２ｂには、第１の電子部品５ａの下面全体に対向した位置において、第１の電子部品５ａの下面全体とほぼ同一、或いはやや大きめの放熱用導電パターン２ｂの削除部２ｃを有する。 Further, the heat radiation conductive pattern 2b and the connection conductor 3 are not present on the lower surface of the first electronic component 5a having a use environment temperature of 65 ° C. or less.
In other words, the heat radiation conductive pattern 2b disposed between the stacked layers 1b of the multilayer substrate 1 facing the lower surface of the first electronic component 5a having a use environment temperature of 65 ° C. or lower is disposed on the entire lower surface of the first electronic component 5a. At the facing position, there is a deleted portion 2c of the heat radiating conductive pattern 2b that is substantially the same as or slightly larger than the entire lower surface of the first electronic component 5a.

また、第１の電子部品５ａの下面と対向する多層基板１の下面１ｃに配置された放熱用導電パターン２ｂには、第１の電子部品５ａの下面全体に対向した位置において、第１の電子部品５ａの下面全体とほぼ同一、或いはやや大きめの放熱用導電パターン２ｂの削除部２ｃを有する。   Further, the heat radiation conductive pattern 2b disposed on the lower surface 1c of the multilayer substrate 1 facing the lower surface of the first electronic component 5a has a first electron at a position facing the entire lower surface of the first electronic component 5a. It has a deleted portion 2c of the conductive pattern 2b for heat dissipation that is substantially the same as or slightly larger than the entire lower surface of the component 5a.

このような構成によって本発明の電子回路ユニットが形成されているが、必要に応じて、多層基板１の下面１ｃに設けられた放熱用導電パターン２ｂを削除しても良い。   Although the electronic circuit unit of the present invention is formed by such a configuration, the heat radiation conductive pattern 2b provided on the lower surface 1c of the multilayer substrate 1 may be deleted as necessary.

本発明の電子回路ユニットの要部断面図。The principal part sectional drawing of the electronic circuit unit of this invention. 従来の電子回路ユニットの全体を示す一部断面正面図。The partial cross section front view which shows the whole conventional electronic circuit unit. 従来の電子回路ユニットに係る発熱部品近傍の断面図。Sectional drawing of the heat-emitting component vicinity which concerns on the conventional electronic circuit unit.

符号の説明Explanation of symbols

１：多層基板
１ａ：上面
１ｂ：積層間
１ｃ：下面
２：配線パターン
２ａ：信号用導電パターン
２ｂ：放熱用導電パターン
２ｃ：削除部
３：接続導体
４：発熱部品
５：電子部品
５ａ：第１の電子部品
1: Multilayer substrate 1a: Upper surface 1b: Between layers 1c: Lower surface 2: Wiring pattern 2a: Conductive pattern for signal 2b: Conductive pattern for heat dissipation 2c: Deletion part 3: Connection conductor 4: Heating component 5: Electronic component 5a: First Electronic components

Claims (5)

配線パターンが設けられ、発熱部品と電子部品が上面に搭載されて所望の電気回路を形成した多層基板を備え、この多層基板は、積層間に設けられた第１の放熱用導電パターンと、前記発熱部品の下面の位置から前記第１の放熱用導電パターンに繋がるように配置された導電材からなる接続導体を有し、前記電子部品は、使用環境温度が６５℃以下の第１の電子部品を有し、この第１の電子部品の下面と対向する前記積層間に配置された前記第１の放熱用導電パターンには、前記第１の電子部品の前記下面全体に対向した位置において、前記第１の電子部品の前記下面全体とほぼ同一、或いはやや大きめの前記第１の放熱用導電パターンの削除部を有したことを特徴とする電子回路ユニット。 A wiring pattern is provided, and includes a multilayer substrate in which a heat generating component and an electronic component are mounted on the upper surface to form a desired electric circuit. The multilayer substrate includes a first heat radiation conductive pattern provided between the layers, The electronic component has a connection conductor made of a conductive material arranged so as to be connected to the first heat radiation conductive pattern from the position of the lower surface of the heat-generating component, and the electronic component has a use environment temperature of 65 ° C. or lower. The first heat dissipating conductive pattern disposed between the stacks facing the lower surface of the first electronic component has a position facing the entire lower surface of the first electronic component. An electronic circuit unit comprising a deletion portion of the first heat radiation conductive pattern that is substantially the same as or slightly larger than the entire lower surface of the first electronic component. 前記多層基板の下面には、前記接続導体に接続された第２の放熱用導電パターンが設けられ、前記第１の電子部品の下面と対向する前記下面に配置された前記第２の放熱用導電パターンには、前記第１の電子部品の前記下面全体に対向した位置において、前記第１の電子部品の前記下面全体とほぼ同一、或いはやや大きめの前記第２の放熱用導電パターンの削除部を有したことを特徴とする請求項１記載の電子回路ユニット。 A second heat dissipation conductive pattern connected to the connection conductor is provided on the lower surface of the multilayer substrate, and the second heat dissipation conductive disposed on the lower surface facing the lower surface of the first electronic component. The pattern includes a deletion portion of the second heat radiation conductive pattern that is substantially the same as or slightly larger than the entire lower surface of the first electronic component at a position facing the entire lower surface of the first electronic component. The electronic circuit unit according to claim 1, wherein the electronic circuit unit is provided. 前記第１の電子部品が電解コンデンサ、又は／及び水晶発振器で形成されたことを特徴とする請求項１、又は２記載の電子回路ユニット。 The electronic circuit unit according to claim 1, wherein the first electronic component is formed of an electrolytic capacitor and / or a crystal oscillator. 前記発熱部品の下面に対向する前記多層基板の上面には、前記接続導体に繋がれ、前記発熱部品の下面に接触した第３の放熱用導電パターンが設けられたことを特徴とする請求項１、又は２記載の電子回路ユニット。 2. The third heat radiation conductive pattern connected to the connection conductor and in contact with the lower surface of the heat generating component is provided on the upper surface of the multilayer substrate facing the lower surface of the heat generating component. Or an electronic circuit unit according to 2. 前記配線パターンと前記放熱用導電パターンが銅箔パターンで形成されたことを特徴とする請求項１から４の何れかに記載の電子回路ユニット。
5. The electronic circuit unit according to claim 1, wherein the wiring pattern and the heat radiation conductive pattern are formed of a copper foil pattern.
JP2005045828A 2005-02-22 2005-02-22 Electronic circuit unit Withdrawn JP2006237073A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016080333A1 (en) * 2014-11-21 2017-08-24 株式会社村田製作所 module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016080333A1 (en) * 2014-11-21 2017-08-24 株式会社村田製作所 module
US10535581B2 (en) 2014-11-21 2020-01-14 Murata Manufacturing Co., Ltd. Module for heat generating electronic component

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