JP2006346803A - Substrate polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate polishing device to chamfer a side surface of a substrate made of glass, etc. capable of preventing and removing attachment of polishing chips produced in polishing on the substrate. <P>SOLUTION: This substrate polishing device is furnished with a holding table TB to move in the prescribed proceeding direction by holding the glass substrate 10, a rotatable disc type grinding wheel 20, a rotating device 21 to rotate the grinding wheel 20 by supporting it, a first water pipe 30A extending along the prescribed proceeding direction at least upward above both end parts of the holding table TB and a plurality of side nozzles connected to the first water pipe 30A with prescribed intervals between each other and to spray and jet water against the side of the grinding wheel 20. The polishing chips on an end part of the glass substrate 10 is swept away toward the side of the grinding wheel 20 with the water sprayed and jetted from the side part nozzle 32 and discharged outside. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an apparatus for polishing a substrate made of glass or the like, and more particularly to a substrate polishing apparatus that polishes and chamfers a side surface of a substrate divided into predetermined dimensions.

  2. Description of the Related Art Conventionally, a so-called scribe / break process is known as a method for dividing a glass substrate used in a liquid crystal display panel, an organic EL (Electro Luminescent) display panel, or the like. The side surface of the glass substrate cut by the scribing / breaking process had burrs due to irregular cracking of the substrate. Therefore, in the manufacturing process of the display panel, it is necessary to chamfer the side surface of the glass substrate. This chamfering is performed, for example, by a substrate polishing apparatus as shown below.

  FIG. 7 is a diagram for explaining a conventional substrate polishing apparatus. 7A is a top view of the substrate polishing apparatus, and FIG. 7B is a cross-sectional view taken along line ZZ in FIG. 7A. As shown in FIGS. 7A and 7B, the substrate polishing apparatus includes a holding table TB that holds the glass substrate 10 and moves in a predetermined traveling direction.

  Then, at a position facing the side surface of the glass substrate 10, a rotatable disc-shaped grindstone 20 for polishing the side surface (with the central axis C as a rotation axis) and the grindstone 20 are supported and the central axis C is used. A rotating device 21 for rotating is arranged. The rotating device 21 itself has a configuration that can move, and moves to a position where the grindstone 20 comes into contact with the side surface of the glass substrate 10.

  A fixed water distribution pipe 30 to which predetermined water (or washing water) is supplied is fixedly arranged so as to extend above the center of the holding table TB (that is, the glass substrate 10). A central nozzle 31 that sprays water radially over the entire glass substrate 10 is connected to the end of the fixed water distribution pipe 30.

  Although not shown in FIG. 7A, as shown in FIG. 7B, the rotating device 21 is injected with cooling water for cooling the frictional heat generated in the grindstone 20 during polishing. A cooling nozzle N is fixed. The cooling water sprayed from the cooling nozzle N is sprayed so as to hit a predetermined portion of the grindstone 20 in contact with the glass substrate 10.

  Further, water spray is performed to remove foreign matter or the like adhering to the glass substrate 10 (for example, foreign matter adhering in another process) so as not to be brought into the region of the glass substrate 10 sandwiched by the grindstone 20. A foreign matter removing water distribution pipe 40 is arranged. The foreign matter removing water distribution pipe 40 is provided with an injection port for injecting water onto the glass substrate 10 or a nozzle (not shown).

  In this substrate polishing apparatus, the side surface of the glass substrate 10 is polished by the rotation of the grindstone 20 in contact therewith. At this time, polishing scraps such as glass particles generated at the time of polishing are mixed with the cooling water, and the mixed water is scattered toward the center of the glass substrate 10 by the centrifugal force generated by the rotation of the grindstone 20.

In addition, as a technical document relevant to this application, the following patent documents are mentioned, for example.
Japanese Patent Application Laid-Open No. 06-055426

  In the substrate polishing apparatus according to the conventional example, by spraying water from the central nozzle 31, the water flows on the glass substrate 10 toward the outside. 10 was prevented from adhering polishing scraps. However, since the momentum of water (mainly cooling water) containing abrasive debris scattered by centrifugal force due to the rotation of the grindstone 20 is stronger than the momentum of water going from the central nozzle 31 to the outside, adhesion of abrasive debris is sufficiently prevented. It was impossible or difficult to do.

  As a result, polishing dust may remain attached on the glass substrate 10 after the drying process. In this case, a predetermined layer (for example, organic EL material) formed on the glass substrate 10 in the subsequent process is formed on the remaining polishing waste. As a result, the predetermined layer formed on the glass substrate 10 is poorly formed, and the yield of the display panel is reduced.

  In order to solve this problem, it is conceivable to remove polishing debris by contact of a brush. However, when there is a layer that is already formed on the glass substrate 10, polishing scraps that are glass particles are attached so as to pierce the layer, and thus it is difficult to remove the polishing scraps. Alternatively, the contact of the brush may cause damage to the surface of the glass substrate 10 and reduce the yield of the display panel.

  Therefore, the present invention aims at preventing and removing adhesion of polishing waste generated during polishing in a substrate polishing apparatus for chamfering the side surface of a substrate made of glass or the like.

  The substrate polishing apparatus of the present invention has been made in view of the above-described problems, and supports and rotates a holding table that holds a substrate and moves in a predetermined traveling direction, a rotatable grindstone, and a grindstone. And a rotating device that moves to a position where the grindstone comes into contact with the side surface of the substrate, a water distribution pipe arranged to extend along the predetermined traveling direction on the end of the holding table, and the grindstone side. A plurality of nozzles connected to the water distribution pipe at predetermined intervals and spraying water onto the edge of the substrate, and the side surface of the substrate is polished by abutting against the rotating grindstone, which occurs during the polishing. The polishing debris to be carried out is washed away to the grindstone side by water sprayed onto the edge of the substrate from the plurality of nozzles toward the grindstone side.

  Further, in the substrate polishing apparatus of the present invention, in addition to the above configuration, the water distribution pipe extends longer than the length in the longitudinal direction of the substrate, and a plurality of nozzles are opposed to the grindstone side throughout the longitudinal direction. They are connected at a predetermined interval.

  Further, the substrate polishing apparatus of the present invention has a holding table that holds the substrate and moves in a predetermined traveling direction, a rotatable grindstone, a position that supports and rotates the grindstone, and the grindstone contacts the side surface of the substrate. A rotating device that moves to the end of the holding table, a water distribution pipe arranged to surround the grindstone on the end of the holding table, and an end of the substrate that is connected to the water distribution pipe at a predetermined interval so as to face the central axis of the grindstone A plurality of nozzles for spraying water on the substrate, and the side surface of the substrate is polished by contacting with the rotating grindstone, and polishing debris generated at the time of polishing is substrate from the plurality of nozzles toward the grindstone side The water is sprayed onto the end of the steel plate and is washed away to the grindstone side.

  Further, the substrate polishing apparatus of the present invention is characterized in that, in addition to the above configuration, the water distribution pipe is fixed to the rotating device so that the distance between the nozzle connected to it and the grindstone is always constant. To do.

  According to the present invention, in the substrate polishing apparatus, polishing debris on the substrate generated during polishing can be removed without adhering to the substrate. As a result, the yield of an apparatus manufactured using the substrate can be improved.

  For example, when polishing and chamfering the side surface of a glass substrate used for an organic EL display panel, since the polishing waste on the glass substrate is removed as much as possible, the yield in the subsequent organic EL material vapor deposition process is improved, and as a result The yield of the organic EL display panel is improved.

  Next, a substrate polishing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram for explaining a substrate polishing apparatus according to a first embodiment of the present invention. 1A is a top view of the substrate polishing apparatus, and FIG. 1B is a cross-sectional view taken along line XX in FIG. 1A. 1A and 1B, components similar to those of the conventional substrate polishing apparatus shown in FIG. 7 are denoted by the same reference numerals and described. Moreover, although the side nozzle 32 mentioned later does not exist on the XX line of FIG. 1 (A), in FIG.1 (B), this is shown for convenience of explanation.

  As shown in FIGS. 1A and 1B, the substrate polishing apparatus holds a glass substrate 10 and has a predetermined traveling direction (direction along the side surface of the glass substrate 10 to be polished). And a holding table TB that can be rotated.

  Then, on both sides of the holding table TB (that is, the side along the predetermined traveling direction), a disc-shaped grindstone 20 that rotates around the central axis C as a rotation axis facing the side surface of the glass substrate 10, and the grindstone 20 And a rotating device 21 that rotates around the central axis C is disposed. In addition, the rotating device 21 itself has a configuration that can move, and moves to a position where the grindstone 20 comes into contact with the side surface of the glass substrate 10. This movement is performed each time the side surface to be polished is switched to one side, for example, when the glass substrate 10 having the first side and the second side having different lengths is the target of polishing. .

  Further, above both end portions of the holding table TB (that is, both end portions of the glass substrate 10), the length extends in parallel with the traveling direction of the holding table TB and about the length of the diameter of the grindstone 20. One water distribution pipe 30A is arranged.

  In the first water distribution pipe 30A arranged on the end of the glass substrate 10, a plurality of side nozzles 32 for spraying water onto the end of the glass substrate 10 are provided at a predetermined interval (for example, about 70 mm). It is connected. The side nozzle 32 is arranged with a predetermined injection angle θ with respect to the surface of the glass substrate 10 with the injection port directed toward the grindstone 20. The predetermined injection angle θ is, for example, about 45 degrees.

  Furthermore, in the first water distribution pipe 30A and the side nozzle 32, the water sprayed from them is close to the grindstone 20 excluding the outermost end of the surface of the glass substrate 10 (for example, glass The substrate 10 is preferably disposed so as to be in contact with the outer edge of the substrate 10 at a position on the inner side of about 5 mm to 10 mm.

  The first water distribution pipe 30A is disposed not only on both ends of the holding table TB, but also extends above the central part of the holding table TB in the same manner as the fixed water distribution pipe 30 shown in the conventional example of FIG. The central nozzle 31 which sprays water radially on the whole glass substrate 10 is connected to the end part. Although not shown, a cooling nozzle for injecting cooling water for cooling the frictional heat generated in the grinding wheel 20 during polishing is applied to the rotating device 21 (that is, the cooling device shown in FIG. 7). The nozzle N) is fixed. The cooling water sprayed from the cooling nozzle N is sprayed so as to hit a predetermined portion of the grindstone 20 in contact with the glass substrate 10.

  Next, the operation of the substrate polishing apparatus having the above configuration will be described. First, the holding table TB holding the glass substrate 10 moves between the grindstones 20 arranged on both sides thereof along a predetermined traveling direction. At this time, the rotating device 21 moves toward the glass substrate 10 so that the grindstone 20 contacts the side surface of the glass substrate 10. And the side surface of the glass substrate 10 is grind | polished by rotation of the grindstone 20 which contact | abutted to it.

  At the same time, water is sprayed from the central nozzle 31 and the side nozzle 32 onto the glass substrate 10, and the water tends to flow outward from the glass substrate 10. Further, cooling water from a cooling nozzle (not shown) is applied to the grindstone 20. Here, the cooling water scatters toward the center of the glass substrate 10 due to the centrifugal force generated by the rotation of the grindstone 20 while containing the polishing debris. This scatter of the cooling water is caused by water sprayed from the side 32 nozzles. Prevented by pressure. Thereby, it becomes possible to remove polishing debris without adhering to the glass substrate 10.

  In the substrate polishing apparatus shown in FIG. 1, the range in which the water flow toward the grindstone 20 can be formed by the pressure of the water sprayed from the side nozzles 32 is the grindstone 20 on the end of the glass substrate 10. This is limited to the vicinity of the contact portion (the portion where the water sprayed from the side nozzle 32 hits). Therefore, in the region on the glass substrate 10 that is away from the contact point with the grindstone 20, that is, in the region on the glass substrate 10 that is not exposed to water sprayed from the side nozzles 32, the polishing scattered by the centrifugal force of the grindstone 20. There is a possibility that cooling water containing debris adheres and polishing debris contained in the cooling water remains. Accordingly, the inventors of the present invention have come up with a second embodiment in which improvements are made to the first embodiment.

  Next, a substrate polishing apparatus according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 2 is a diagram illustrating a substrate polishing apparatus according to the second embodiment of the present invention. In addition, about the component similar to 1st Embodiment shown in FIG. 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  As shown in FIGS. 2A and 2B, this substrate polishing apparatus is shown in the conventional example of FIG. 7 so as to extend above the center of the holding table TB (that is, the glass substrate 10). The same fixed water distribution pipe 30 and the central nozzle 31 are arrange | positioned.

  Furthermore, above both ends of the holding table TB (that is, both ends of the glass substrate 10), the entire side of the glass substrate 10 that extends in parallel along a predetermined traveling direction of the holding table TB and faces the grindstone 20 is provided. The second water distribution pipe 30B is disposed so as to cover the water. That is, the length of the second water distribution pipe 30B is equal to or longer than the length of the glass substrate 10 in the longitudinal direction (one side when the lengths of the first and second sides are equal).

  Further, the second water distribution pipe 30B has a plurality of side nozzles 32 similar to those of the first embodiment, with a predetermined interval (for example, about 70 mm) and a predetermined injection angle θ (over the entire longitudinal direction). For example, 45 degrees).

  Furthermore, in the second water distribution pipe 30B and the side nozzle 32, the water sprayed from them is a position close to the grindstone 20 excluding the outermost end portion of the surface of the glass substrate 10 (for example, glass The substrate 10 is preferably disposed so as to be in contact with the outer edge of the substrate 10 at a position on the inner side of about 5 mm to 10 mm.

  In the present embodiment, as a configuration obtained by improving the first embodiment, the second water distribution pipe 30B is fixed to the rotating device 21, and the distance between the grindstone 20 and the side nozzle 32 is kept constant. It moves together with the rotating device 21.

  Next, the operation of the substrate polishing apparatus having the above configuration will be described. In this substrate polishing apparatus, as in the first embodiment, simultaneously with polishing of the glass substrate 10, water is sprayed onto the glass substrate 10 from the central nozzle 31 and the side nozzle 32, and the water is injected into the glass substrate 10. It tries to flow from the top toward the outside (the grindstone 20 side).

  Here, unlike the first embodiment, the second water distribution pipe 30 </ b> B and the side nozzle 32 are arranged so as to cover the entire end portion of the glass substrate 10 facing the grindstone 20. Therefore, a water flow toward the grindstone 20 can be formed over the entire side, and a flow toward the center of the glass substrate 10 can be suppressed.

  Unlike the first embodiment, when the side surface of the glass substrate 10 to be polished is switched to one of the first and second sides, the position of the grindstone 20 that contacts the glass substrate 10 rotates. Even when the movement of the apparatus 21 is changed, the distance between the grindstone 20 and the side nozzle 32 is always constant. Therefore, it is possible to remove the polishing scraps on the glass substrate 10 together with the sprayed water more reliably without adhering to the glass substrate 10 than in the first embodiment.

  In the substrate polishing apparatus shown in FIGS. 1 and 2, the glass substrate 10 is rotated by the holding table TB when the side surface of the glass substrate 10 to be polished is switched to one of the first and second sides. It is necessary to let At that time, the water sprayed from the side nozzle 32 onto the glass substrate 10 reaches a region other than the end portion of the glass substrate 10, and scatters the water containing polishing debris onto the glass substrate 10. It will be. In order to cope with this problem, the inventors of the present invention have come up with a third embodiment in which further improvements are made to the second embodiment.

  Next, a substrate polishing apparatus according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a diagram illustrating a substrate polishing apparatus according to the third embodiment of the present invention. 3A is a top view of the substrate polishing apparatus, and FIG. 3B is a cross-sectional view taken along line YY in FIG. 3A. Further, the same components as those of the second embodiment shown in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 3 (A) and 3 (B), in this substrate polishing apparatus, the grindstones 20 are surrounded above the end portions on both sides of the holding table TB (that is, the glass substrate 10), and The third water pipe 30C is arranged so that the distance from the grindstone 20 is constant. A plurality of side nozzles 32 for spraying water onto the end portion of the glass substrate 10 are connected to the third water distribution pipe 30 </ b> C at a predetermined interval so as to face the central axis C of the grindstone 20.

  Further, the side nozzle 32 has a third angle at such an angle that the water flow on the glass substrate 10 at the time of spraying is not in contact with (or as much as possible) the water flow from the adjacent side nozzle 32. It is connected to the water distribution pipe 30C. Further, the predetermined injection angle θ of the side nozzle 32 with respect to the glass substrate 10 is the same as in the first and second embodiments. The third water distribution pipe 30 </ b> C is fixed to the rotating device 21 and moves together with the rotating device 21 while keeping the distance between the grindstone 20 and the side nozzle 32 constant.

  Next, the operation of the substrate polishing apparatus will be described with reference to the drawings. FIG. 4 is a top view of the substrate polishing apparatus, and shows an enlarged end portion of the glass substrate 10 and the vicinity of the grindstone 20 in contact therewith. However, in FIG. 4, the illustration of the third water distribution pipe 30C is omitted.

  As shown in FIGS. 3 and 4, water is jetted from the central nozzle 31 and the side nozzle 32 onto the glass substrate 10, and the water tends to flow from the glass substrate 10 toward the outside. Further, cooling water from a cooling nozzle (not shown) is applied to the grindstone 20. Here, the cooling water contains polishing debris and is scattered toward the center of the glass substrate 10 by the centrifugal force generated by the rotation of the grindstone 20, but this cooling water is caused by the pressure of water sprayed from the side nozzle 32, It stays in the area A on the glass substrate 10 outside the side nozzle 32. And the cooling water containing the grinding | polishing waste which retains in the area | region A is discharged | emitted outside the glass substrate 10 with the water flow produced by rotation of the grindstone 20. FIG.

  Further, in this embodiment, when the side surface of the glass substrate 10 to be polished is switched to one of the first and second sides, the position of the grindstone 20 that contacts the glass substrate 10 is moved by the rotation device 21. The distance between the grindstone 20 and the side nozzle 32 is always constant even when it is changed by.

  Furthermore, in this embodiment, the 3rd water distribution pipe 30C and the side part nozzle 32 are arrange | positioned so that the grindstone 20 may be enclosed. Accordingly, when the glass substrate 10 is rotated by the holding table TB when the side surface of the glass substrate 10 to be polished is switched to one of the first and second sides, the spray is sprayed from the side nozzle 32. The water that has been discharged does not reach the region other than the end portion of the glass substrate 10.

  Moreover, since the water flow at the time of the spray injection of the side nozzle 32 does not contact with the water flow from the adjacent side nozzle 32 (or does not contact as much as possible), it can be avoided that the water flow becomes weak due to interference between the water flows. That is, it is possible to keep the water flow that pushes back the cooling water scattered toward the center of the glass substrate 10 by the rotation of the grindstone 20 toward the grindstone 20 as much as possible. Therefore, it is possible to remove the polishing debris on the end portion of the glass substrate 10 without adhering to the glass substrate 10 more reliably than in the first and second embodiments.

  By the way, in the first, second, and third embodiments described above, as shown in FIG. 5A, when the cross section of the side surface of the glass substrate 10 is viewed from the grindstone 20 side, the spray is sprayed from the side nozzle 32. The water spreads in a triangular shape with the side nozzle 32 as a vertex. That is, there is a gap 50 between the curtains of water sprayed from the side nozzles 32. Therefore, as shown in FIG. 5B, when the cross section of the glass substrate 10 along the line connecting the two grindstones 20 is viewed, the center of the glass substrate 10 is caused by the rotation of the grindstone 20 or the rebound on the glass substrate 10. The problem is that a part of the water splashed toward the surface, that is, a part of the cooling water containing polishing scraps and the water sprayed from the side nozzle 32 passes through the gap 50 and reaches the center surface of the glass substrate 10. There was a case.

  Therefore, in order to deal with the above problem, in the first, second, and third embodiments described above, the splash prevention wall 60 for blocking the splash may be disposed. Next, the splash prevention wall 60 will be described with reference to FIG. FIG. 6A shows a cross section of the substrate polishing apparatus and the glass substrate 10 when the side surface of the glass substrate 10 is viewed from the grindstone 20 side. FIG. 6B shows a cross section of the substrate polishing apparatus and the glass substrate 10 along a line connecting the two grindstones 20.

  As shown in FIGS. 6 (A) and 6 (B), the splash prevention wall 60 is a gap existing between the curtains of water sprayed from the plurality of side nozzles 32 so as to block the splash. 50 is arranged so as to block. Further, the splash prevention wall 60 has a predetermined shape and area that does not contact the water sprayed from the side nozzle 32 as much as possible. In FIG. 6, the splash preventing wall 60 has a pentagonal shape, but may have other shapes.

  Moreover, the splash prevention wall 60 is arrange | positioned so that the whole 1st water pipe 30A, the 2nd water pipe 30B, and the 3rd water pipe 30C may be followed. Since the gap 50 between the plurality of side nozzles 32 is closed by the splash prevention wall 60, the splash of the splash to the center of the glass substrate 10 can be suppressed.

  In addition, although the 2nd water distribution pipe 30B in 2nd Embodiment mentioned above and the 3rd water distribution pipe 30C which concern on 3rd Embodiment shall be connected to the rotation apparatus 21, this invention is based on this. It is not limited. For example, when it is not necessary to switch the side surface of the glass substrate 10 to be polished from the first side to the second side, the second water distribution pipe 30B or the third water distribution pipe 30C is provided with the holding table TB (that is, the glass substrate 10). If it is arrange | positioned above the edge part, it may be fixed to the position.

  In the first, second, and third embodiments described above, the foreign matter removing water distribution pipe 40 is arranged separately from the first water distribution pipe 30A or the fixed water distribution pipe 30, but the present invention is not limited thereto. However, the foreign matter removing water distribution pipe 40 and the first water distribution pipe 30A or the fixed water distribution pipe 30 may be configured by a common water distribution pipe.

  In the first, second, and third embodiments described above, the substrate to be polished is the glass substrate 10 used in the organic EL display panel, but the present invention is not limited to this. That is, the present invention can also be applied to a case where a glass substrate used in a display panel other than the organic EL display panel, for example, a liquid crystal display panel, is a target for polishing. Furthermore, instead of the glass substrate, a substrate made of a material other than glass, for example, a semiconductor substrate, may be the target of polishing.

It is a figure explaining the substrate polisher concerning a 1st embodiment of the present invention. It is a figure explaining the substrate polishing apparatus which concerns on the 2nd Embodiment of this invention. It is a figure explaining the substrate polishing apparatus which concerns on the 3rd Embodiment of this invention. It is a top view explaining the substrate polisher concerning a 3rd embodiment of the present invention. It is sectional drawing explaining the substrate polishing apparatus which concerns on the 1st, 2nd and 3rd embodiment of this invention. It is sectional drawing explaining the substrate polishing apparatus which concerns on the 1st, 2nd and 3rd embodiment of this invention. It is a figure explaining the substrate polishing apparatus which concerns on a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Glass substrate 20 Grinding wheel 21 Rotating device 30 Fixed water distribution pipe 30A 1st water distribution pipe 30B 2nd water distribution pipe 30C 3rd water distribution pipe 31 Central nozzle 32 Side nozzle 40 Water distribution pipe for foreign material removal 50 Clearance 60 Splash prevention wall N Cooling nozzle TB holding table

Claims (6)

A holding table that holds the substrate and moves in a predetermined traveling direction, a rotatable grindstone, a rotating device that supports and rotates the grindstone, and moves to a position where the grindstone contacts the side surface of the substrate; A water distribution pipe disposed on the end of the holding table so as to extend along the predetermined traveling direction; and on the end of the substrate connected to the water distribution pipe at a predetermined interval so as to face the grindstone side. A plurality of nozzles for spraying water
The side surface of the substrate is polished by coming into contact with the rotated grindstone,
Polishing debris generated at the time of polishing is washed away to the grindstone side by water sprayed onto the end of the substrate from the plurality of nozzles toward the grindstone side. The water distribution pipe extends longer than the length of the substrate in the longitudinal direction, and the plurality of nozzles are connected at the predetermined interval so as to face the grindstone side throughout the longitudinal direction. The substrate polishing apparatus according to claim 1. A holding table that holds the substrate and moves in a predetermined traveling direction, a rotatable grindstone, a rotating device that supports and rotates the grindstone, and moves to a position where the grindstone contacts the side surface of the substrate; A water distribution pipe arranged on the end of the holding table so as to surround the grindstone, and connected to the water distribution pipe at a predetermined interval so as to face the central axis of the grindstone, and water on the end of the substrate. A plurality of nozzles for spraying,
The side surface of the substrate is polished by coming into contact with the rotated grindstone,
Polishing debris generated at the time of polishing is washed away to the grindstone side by water sprayed onto the end of the substrate from the plurality of nozzles toward the grindstone side. 4. The substrate according to claim 3, wherein the plurality of nozzles are connected to the water distribution pipe at a predetermined angle such that water flows generated by spraying from adjacent nozzles do not contact each other. 5. Polishing equipment. The said water pipe is fixed to the said rotation apparatus so that the distance of the said nozzle connected to it and the said grindstone may become fixed constantly, The any one of Claim 1, 2, 3, 4 characterized by the above-mentioned. The substrate polishing apparatus according to claim 1. A gap that exists between the curtains of water sprayed from the plurality of nozzles so as to block splashes that are made of a part of the water sprayed from the plurality of nozzles and splash toward the center of the substrate. 6. The substrate polishing apparatus according to claim 1, wherein a splash-preventing wall is disposed to close the substrate.

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