JP2007073668A - Heat transfer device for transferring heat, and electronic device mounted with the heat transfer device - Google Patents
Heat transfer device for transferring heat, and electronic device mounted with the heat transfer device Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
【課題】加工が容易で、基板に実装する電子部品の高さが異なっていても熱伝達の効率低下を防止する放熱構造を有する電子装置を提供する。
【解決手段】第１の回路基板１１に実装された熱伝達体３１と第２の回路基板４１に実装された発熱部材とを熱伝導接合し、且つ第２の回路基板４１を介して第１の回路基板１１と発熱部材とが電導接続されており、熱伝達体３１は、発熱部材と電導接続する領域以外は断熱材３２で被覆されている電子装置である。
【選択図】図２An electronic device having a heat dissipation structure that is easy to process and prevents a reduction in heat transfer efficiency even when the heights of electronic components mounted on a substrate are different.
A heat transfer body 31 mounted on a first circuit board 11 and a heat generating member mounted on a second circuit board 41 are thermally conductively joined, and the first circuit board 41 is used for the first circuit board. The circuit board 11 is electrically connected to the heat generating member, and the heat transfer body 31 is an electronic device covered with a heat insulating material 32 except for a region electrically connected to the heat generating member.
[Selection] Figure 2
Description
本発明は回路基板に実装された電子部品が発熱した熱を放熱体に伝達する伝熱装置と、この伝熱装置を回路基板に実装した電子装置に関する。 The present invention relates to a heat transfer device that transmits heat generated by an electronic component mounted on a circuit board to a heat radiating body, and an electronic device in which the heat transfer device is mounted on a circuit board.
最近、情報機器装置、携帯電話器等は高性能化、小型軽量化が望まれている。高性能化に伴って、機器装置内の回路基板に搭載された電子部品の発熱量が多くなっている。更に小型軽量化によって部品実装密度が増している。これらの理由にて機器装置内部の温度が上昇し高温になっている。この高温によって回路基板に実装された電子部品が誤動作する。従って電子部品が発熱した熱を放熱する放熱体に伝熱し、この放熱体から装置外部に放熱して電子部品を冷却する必要がある。 In recent years, there has been a demand for higher performance, smaller size, and lighter weight for information equipment, mobile phones, and the like. Along with higher performance, the amount of heat generated by the electronic components mounted on the circuit board in the device has increased. Furthermore, the component mounting density has increased due to the reduction in size and weight. For these reasons, the temperature inside the device rises and becomes high. The electronic component mounted on the circuit board malfunctions due to this high temperature. Therefore, it is necessary to transfer the heat generated by the electronic component to the heat radiating body that radiates heat, and to radiate heat from the heat radiating body to the outside of the apparatus to cool the electronic component.
一方、回路基板に搭載された電子部品は種類が多く、形状、サイズが異なり、具体的には回路基板に搭載された電子部品の背の高さ、つまり背高が異なる。更に実装された電子部品は回路基板上に散在している。これらの電子部品の熱を放熱体に伝熱する一般的な方法は下記のように行なわれている。 On the other hand, there are many types of electronic components mounted on the circuit board, and the shapes and sizes are different. Specifically, the electronic components mounted on the circuit board have different heights, that is, different heights. Furthermore, the mounted electronic components are scattered on the circuit board. A general method of transferring the heat of these electronic components to the heat radiating body is performed as follows.
複数の電子部品の頭部と当接する金属ケースを設けて電子部品の熱を金属ケースに伝熱している。更にこの金属ケースから放熱体に熱を伝熱している。そしてこの放熱体から装置外部に放熱している。複数の電子部品の背の高さが異なる各電子部品と金属ケースとに隙間がある。これらの隙間の寸法は異なっている。これらの異なる隙間の寸法に応じて金属ケースに各種類の深さの凹部を電子部品と対応する位置に設けている。その結果として金属ケースの凹部と電子部品とが接触して伝熱される。このような技術として下記特許文献１、２に記載された技術がある。 A metal case that contacts the heads of the plurality of electronic components is provided to transfer heat from the electronic components to the metal case. Further, heat is transferred from the metal case to the radiator. Then, heat is radiated from the radiator to the outside of the apparatus. There is a gap between each of the electronic parts having different heights and the metal case. The dimensions of these gaps are different. Depending on the dimensions of these different gaps, recesses of various types of depth are provided in the metal case at positions corresponding to the electronic components. As a result, the concave portion of the metal case and the electronic component come into contact with each other and heat is transferred. As such a technique, there is a technique described in Patent Documents 1 and 2 below.
これらの他の技術に、伝熱用のシールド板を使用し、このシールド板はＬ字状の切り欠き部が設けられている。このＬ字状の切り欠き部の高さ寸法は隙間の寸法に応じて各種類を設けられている。その結果としてシールド板のＬ字状欠き部と電子部品の頭部とが接触して伝熱される。このような技術として下記特許文献３に記載された技術がある。 For these other techniques, a heat transfer shield plate is used, and this shield plate is provided with an L-shaped notch. There are various types of heights of the L-shaped cutouts depending on the size of the gap. As a result, the L-shaped notch of the shield plate and the head of the electronic component come into contact with each other and heat is transferred. There exists a technique described in the following patent document 3 as such a technique.
これら以外の技術に、放熱ブロックを使用し、この放熱ブロックと電子部品との隙間にスペーサー、具体的には金属ピース、またはシリコン剤のゲル状物質が設けられている。このスペーサーは高さ寸法の異なる電子部品との隙間の寸法に応じて各種類の寸法の金属ピース、またはシリコン剤のゲル状物質が設けられている。その結果としてスペーサーと電子部品の頭部とが接触して伝熱される。そして放熱ブロックの上面は平坦に形成される。このような技術として下記特許文献４、５に記載された技術がある。 In other technologies, a heat dissipation block is used, and a spacer, specifically, a metal piece or a gel material of a silicon agent is provided in a gap between the heat dissipation block and the electronic component. This spacer is provided with metal pieces of various types of sizes or a gel-like substance of a silicon agent according to the size of the gap between the electronic components having different heights. As a result, the spacer and the head of the electronic component come into contact with each other and heat is transferred. And the upper surface of a thermal radiation block is formed flat. As such a technique, there are techniques described in Patent Documents 4 and 5 below.
さらに他の技術として、電子部品の搭載された２枚のプリント基板が対向配置して設けられている。これらのプリント基板との隙間に袋状薄膜が設けられている。この袋状薄膜は形状変化可能で薄膜の袋内に不活性液体またはゲル状物質が内封されている。そしてこの形状変化可能な袋状薄膜が各電子部品との異なる背の高さによって生じる隙間を埋めている。その結果として袋状薄膜と電子部品の頭部とが接触して伝熱される。このような技術として下記特許文献６、７に記載された技術がある。
しかしながら、特許文献１、２、３に記載された技術は金属ケースの凹部を設ける。またはシールド板にＬ字状の切り欠き部を設けている。これら凹部、Ｌ字状の切り欠き部は各種類が有るために凹部または、Ｌ字状の切り欠き部の加工工数が多く必要であり、さらに凹部、Ｌ字状の切り欠き部の深さ精度が必要である。何故ならば精度が悪いと電子部品と金属ケースとの接触圧力にバラツキが生じるからである。このバラツキにより密着度が変化する。この密着度の低下が熱伝達の効率を低下させる。 However, the techniques described in Patent Documents 1, 2, and 3 provide a recess for the metal case. Alternatively, an L-shaped notch is provided on the shield plate. Since these recesses and L-shaped notches have various types, it requires a large number of processing steps for the recesses or L-shaped notches, and the depth accuracy of the recesses and L-shaped notches is required. This is because if the accuracy is poor, the contact pressure between the electronic component and the metal case varies. The degree of adhesion changes due to this variation. This decrease in adhesion reduces the efficiency of heat transfer.
更に特許文献４、５に記載された技術は放熱ブロックと電子部品との隙間にスペーサーを設けている。このために電子部品とスペーサーとの接続面が２箇所になる。具体的には電子部品とスペーサーとの接続面が１箇所、スペーサーと放熱ブロックとの接続面が１箇所で合計２箇所有する。接続面の数が多くなるほどに接続面での熱伝達の抵抗が大きくなり、熱伝達の効率が低下する。 Furthermore, the techniques described in Patent Documents 4 and 5 provide a spacer in the gap between the heat dissipation block and the electronic component. For this reason, there are two connection surfaces between the electronic component and the spacer. Specifically, there are one connection surface between the electronic component and the spacer, and one connection surface between the spacer and the heat dissipation block. As the number of connection surfaces increases, the resistance of heat transfer at the connection surfaces increases, and the efficiency of heat transfer decreases.
次に特許文献６，７に記載された技術は２枚のプリント基板の隙間を埋める大容量の袋状薄膜が必要となる。したがって容積が多く必要になり更に不活性液体またはゲル状物質の重量が増加される。従って小型軽量化が望まれる情報機器装置、携帯電話器等に不適切である。 Next, the techniques described in Patent Documents 6 and 7 require a large-capacity bag-like thin film that fills the gap between the two printed boards. Therefore, a large volume is required and the weight of the inert liquid or gel substance is increased. Therefore, it is unsuitable for information equipment devices, mobile phones, etc., which are desired to be small and light.
本発明の目的は伝熱装置の製作に多くの加工工数、加工精度を必要とせず、実装する電子部品の背の高さが異なっても電子部品と放熱ブロックとの熱伝達の効率低下を防止でき、且つ電子部品と放熱ブロックとの接続面の数を少なくし熱伝達の効率低下を防止し、大容量化と、重量増加を防止する。 The object of the present invention does not require a large number of processing steps and processing accuracy for manufacturing a heat transfer device, and prevents a reduction in heat transfer efficiency between the electronic component and the heat dissipation block even if the height of the mounted electronic component is different. In addition, the number of connection surfaces between the electronic component and the heat dissipation block can be reduced to prevent a decrease in heat transfer efficiency, and an increase in capacity and an increase in weight can be prevented.
第１の回路基板に実装された熱伝達体と第２の回路基板に実装された発熱電子部品とを熱伝導接続し、且つ第２の回路基板を介して第１の回路基板と発熱電子部品とが電導接続されている電子装置である。更にこの熱伝達体は前記発熱電子部品と熱伝導接合する領域以外を断熱材で被覆されている。また第２の回路基板は発熱電子部品を１つ又は複数個実装されている。次に第１の回路基板に熱伝達体が少なくとも１つ実装されている。そして熱伝達体の少なくとも１面と回路基板に実装された発熱電子部品の一面とを熱伝導接続し、且つ前記回路基板を介して押圧力を調整可能に固定されていることを特徴とする熱伝達体装置である。 The heat transfer body mounted on the first circuit board and the heat generating electronic component mounted on the second circuit board are connected by heat conduction, and the first circuit board and the heat generating electronic component are interposed via the second circuit board. Are electronic devices that are conductively connected. Further, the heat transfer body is covered with a heat insulating material except for the region where the heat-generating electronic component is thermally conductively joined. The second circuit board is mounted with one or more heat generating electronic components. Next, at least one heat transfer body is mounted on the first circuit board. The heat is characterized in that at least one surface of the heat transfer body and one surface of the heat generating electronic component mounted on the circuit board are thermally conductively connected, and the pressing force is adjustable via the circuit board. It is a transmission device.
本発明によれば伝熱装置の製作に多くの加工工数と、加工精度を必要とせず、且つ電子部品と放熱ブロックとの接続面が少なくできる。更に背の高さが異なる電子部品、つまり各電子部品に背高差が有っても熱伝達体に各発熱部品を押圧する押圧力が容易に得られる。この押圧力は第２回路基板のネジの締め付け力にて容易に調整できる。このために熱伝達体と発熱部品との片当たりを無くすことができる。このために発熱電子部品と熱伝達体とが一体化される。従って発熱部品が回路基板上を散在することがない。換言すると熱伝達体の周囲に発熱部品を集約するために効率良く伝熱できる。続いて第１の回路基板に実装された熱伝達体は熱伝達パイプと着脱自在に接続されているので熱伝達装置を容易に交換できる。次に熱伝達体に実装された第２の回路基板はネジで固定されているので容易に交換できる。第２回路基板に実装された発熱部品は第２回路基板を介してネジ固定されているので発熱部品の交換が容易に行える。次に第２回路基板は複数種類を用意されているので如何なる背高差にも適用できる。 According to the present invention, a large number of processing steps and processing accuracy are not required for manufacturing a heat transfer device, and the connection surface between the electronic component and the heat dissipation block can be reduced. Furthermore, even if there is a difference in height between the electronic components having different heights, that is, there is a difference in height between the electronic components, it is possible to easily obtain a pressing force for pressing the heat generating components against the heat transfer body. This pressing force can be easily adjusted by the tightening force of the screw of the second circuit board. For this reason, the contact between the heat transfer body and the heat generating component can be eliminated. For this purpose, the heat generating electronic component and the heat transfer body are integrated. Therefore, the heat generating parts are not scattered on the circuit board. In other words, heat can be transferred efficiently because the heat generating components are gathered around the heat transfer body. Subsequently, since the heat transfer body mounted on the first circuit board is detachably connected to the heat transfer pipe, the heat transfer device can be easily replaced. Next, since the second circuit board mounted on the heat transfer body is fixed with screws, it can be easily replaced. Since the heat generating component mounted on the second circuit board is screwed through the second circuit board, the heat generating component can be easily replaced. Next, since a plurality of types of second circuit boards are prepared, it can be applied to any height difference.
本発明の実施の形態を説明する。 An embodiment of the present invention will be described.
図１は本実施形態に係る電子回路基板装置の概略構成図である。図２は本実施形態に係る熱伝達装置の概略構成図である。図3は本実施形態に係る第２の回路基板装置の概略構成図である。
１は電子回路基板装置、１０は第１の回路基板装置、１１は第１の回路基板、２０は非発熱電子部品であり、３０は熱伝達装置、３１は熱伝達体、３２は断熱材、３３は冷媒、４０は第２の回路基板装置、４１は第２の回路基板、４２は発熱電子部品、４３は接続リード線、４４は熱伝導補助部材、５０は第３の回路基板装置、６０は固定金具、６１は熱伝達パイプである。
FIG. 1 is a schematic configuration diagram of an electronic circuit board device according to the present embodiment. FIG. 2 is a schematic configuration diagram of the heat transfer device according to the present embodiment. FIG. 3 is a schematic configuration diagram of a second circuit board device according to the present embodiment.
1 is an electronic circuit board device, 10 is a first circuit board device, 11 is a first circuit board, 20 is a non-heat generating electronic component, 30 is a heat transfer device, 31 is a heat transfer body, 32 is a heat insulating material, 33 is a refrigerant, 40 is a second circuit board device, 41 is a second circuit board, 42 is a heat generating electronic component, 43 is a connection lead wire, 44 is a heat conduction auxiliary member, 50 is a third circuit board device, 60 Is a fixture, and 61 is a heat transfer pipe.
以下に上記の構成を詳細に説明する。
最初に、電子回路基板装置１は大略、第１の回路基板装置１０と熱伝達装置３０と第２の回路基板装置４０とから構成されている。第１の回路基板装置１０は非発熱電子部品３０が第１の回路基板１１上に複数実装され、さらに複数の熱伝達装置３０が固定金具６０を介してネジで固定されている。しかし図面は説明を理解し易いように１つの熱伝達装置３０を記載している。この熱伝達装置３０に第２の回路基板装置４０がネジで固定されている。非発熱部品３０は、例えばデジタル回路素子、コンデンサ、コイル、端子等である。
The above configuration will be described in detail below.
First, the electronic circuit board device 1 is generally composed of a first circuit board device 10, a heat transfer device 30, and a second circuit board device 40. In the first circuit board device 10, a plurality of non-heat-generating electronic components 30 are mounted on the first circuit board 11, and a plurality of heat transfer devices 30 are fixed with screws through fixing brackets 60. However, the drawing describes one heat transfer device 30 for ease of understanding the description. The second circuit board device 40 is fixed to the heat transfer device 30 with screws. The non-heat generating component 30 is, for example, a digital circuit element, a capacitor, a coil, a terminal, or the like.
次に、図２は本実施形態に係る熱伝達装置の構成図である。
熱伝達装置３０は熱伝達体３１の周囲を発熱部品４２が当接する領域を除いて断熱材３２で被覆されている。この熱伝達体３１はアルムニウム、銅、錫等の材料で作られており、断熱材３２はガラスウール材が使用される。そして、この熱伝達体３１は、例えば角柱体の形状であり、角柱体の中心部に貫通孔が設けられている。この貫通孔内を冷媒３３が流れる。この冷媒３３は液体または気体で熱伝達用の冷却媒体である。この熱伝達体２１の側面、上面のいずれかの１面に熱伝導補助部材４４を介して第２の回路基板装置３０に実装された発熱部品４２が当接されている。この熱伝導補助部材４４は発熱部品４２の発熱を熱伝達体３１に効率よく熱伝達するための補助部材である。熱伝達装置３０は第２の回路基板装置４０、または第３の回路基板装置５０が実装されている。これら第２の回路基板装置４０、第３の回路基板装置５０は熱伝達装置２０内を流れる冷媒の上流側から下流側に向かって発熱量の小さい部品から発熱量の大きい部品の順序で取り付けられる。
Next, FIG. 2 is a block diagram of the heat transfer device according to the present embodiment.
The heat transfer device 30 is covered with a heat insulating material 32 except for a region where the heat generating component 42 abuts the periphery of the heat transfer body 31. The heat transfer body 31 is made of a material such as aluminum, copper, or tin, and the heat insulating material 32 is made of glass wool. And this heat transfer body 31 is the shape of a prismatic body, for example, and the through-hole is provided in the center part of the prismatic body. The refrigerant 33 flows through the through hole. The refrigerant 33 is liquid or gas and is a cooling medium for heat transfer. A heat generating component 42 mounted on the second circuit board device 30 is brought into contact with one of the side surface and the upper surface of the heat transfer body 21 via a heat conduction auxiliary member 44. The heat conduction auxiliary member 44 is an auxiliary member for efficiently transferring heat generated by the heat generating component 42 to the heat transfer body 31. The heat transfer device 30 is mounted with the second circuit board device 40 or the third circuit board device 50. The second circuit board device 40 and the third circuit board device 50 are attached in the order of components having a small heat generation amount to components having a large heat generation amount from the upstream side to the downstream side of the refrigerant flowing in the heat transfer device 20. .
そして熱伝達体３１の両端は接続口が設けられ、これら接続口が熱伝達パイプ６１に接続される。前記熱伝達パイプ６１の一方は図示しない放熱装置へ接続されている。そして図示しない放熱装置から前記熱伝達パイプ６１の他方に接続されて冷媒３３が循環される。この熱伝達装置３０内を流れる冷媒３３が並列および／または直列に流れるように複数の熱伝達装置３０が接続されている。 And both ends of the heat transfer body 31 are provided with connection ports, and these connection ports are connected to the heat transfer pipe 61. One of the heat transfer pipes 61 is connected to a heat radiating device (not shown). And the refrigerant | coolant 33 is circulated by connecting to the other side of the said heat transfer pipe 61 from the thermal radiation apparatus which is not illustrated. The plurality of heat transfer devices 30 are connected so that the refrigerant 33 flowing in the heat transfer device 30 flows in parallel and / or in series.
続いて図３は本実施形態に係る第２の回路基板装置の構成図である。
第２の回路基板装置４０は第２の回路基板４１に複数の発熱部品４２が実装されている。これらの発熱部品４２の端子に接続された接続リード線４３が第１の回路基板１１の回路部に接続されている。これらの発熱部品４２の背の高さＨ１は同じ高さである。そして第２の回路基板４１の発熱部品４２を搭載していない両端にネジ孔が形成されている。この第２の回路基板４１を介して熱伝達装置３０に第２の回路基板装置４０をネジにて固定している。従って両端のねじを締めることで回路基板４１の撓みを利用して、熱伝達装置３０に第２の回路基板装置４０が押圧力を調整可能にネジで固定されている。また第３の回路基板装置５０は第３の回路基板５１に複数の発熱部品５２が実装されている。これらの発熱部品５２は背の高さがＨ２である。発熱部品４２のＨ１と発熱部品５２のＨ２とは背の高さが異なる。このように発熱部品の背の高さで第２の回路基板装置４０、第３の回路基板装置５０にグループ分けしている。従って同グループ内の部品は同じ背の高さとなる。従ってネジ３４の締め付け力を調整することで熱伝達装置と発熱部品との押圧力を調整でき接触圧力のバラツキを防止できる。そして第２の回路基板４１、第３の回路基板５１に形成されている各接続リード線４３が第１の回路基板１１の導体回路に導電接続されている。
Next, FIG. 3 is a configuration diagram of the second circuit board device according to the present embodiment.
In the second circuit board device 40, a plurality of heat generating components 42 are mounted on a second circuit board 41. Connection lead wires 43 connected to the terminals of these heat generating components 42 are connected to the circuit portion of the first circuit board 11. The heights H1 of the heat generating components 42 are the same. Screw holes are formed at both ends of the second circuit board 41 where the heat generating component 42 is not mounted. The second circuit board device 40 is fixed to the heat transfer device 30 via the second circuit board 41 with screws. Therefore, the second circuit board device 40 is fixed to the heat transfer device 30 with screws so that the pressing force can be adjusted by using the bending of the circuit board 41 by tightening the screws at both ends. In the third circuit board device 50, a plurality of heat generating components 52 are mounted on the third circuit board 51. These heat generating components 52 have a height of H2. H1 of the heat generating component 42 and H2 of the heat generating component 52 are different in height. Thus, the second circuit board device 40 and the third circuit board device 50 are grouped according to the height of the heat generating components. Therefore, the parts in the group have the same height. Therefore, by adjusting the tightening force of the screw 34, the pressing force between the heat transfer device and the heat generating component can be adjusted, and variation in contact pressure can be prevented. The connection lead wires 43 formed on the second circuit board 41 and the third circuit board 51 are conductively connected to the conductor circuit of the first circuit board 11.
本発明によれば、熱伝達装置３０の周囲、具体的には熱伝達体３１の側面、上面のいずれかの１面に発熱電子部品を集約できる。このために従来のように散在した発熱部品３２の発熱を放熱装置へ伝熱するのと比較すると、本発明のほうが伝熱する距離が短くなり効率良く放熱装置に伝熱できる。続いて第１の回路基板装置１０に搭載された熱伝達装置２０は熱伝達パイプ６１を介して接続されている。このために電子回路基板装置１の交換、例えばリペアー時の取外しや、組立作業を容易に行える。更に第１の回路基板装置１０に複数の熱伝達装置３０が固定金具６０を介してネジで固定されている。このために熱伝達装置２０の交換、例えばリペアー時の取外し、組立作業を容易に行える。次に第２の回路基板装置４０、第３の回路基板装置５０はネジ固定されている。このために回路基板装置４０、５０の交換、例えばリペアー時の取外し、組立作業を容易に行える。 According to the present invention, the heat generating electronic components can be collected around the heat transfer device 30, specifically, one of the side surface and the upper surface of the heat transfer body 31. For this reason, as compared with the case where the heat generated by the heat generating components 32 scattered as in the prior art is transferred to the heat radiating device, the heat transfer distance is shorter in the present invention, and the heat can be efficiently transferred to the heat radiating device. Subsequently, the heat transfer device 20 mounted on the first circuit board device 10 is connected via a heat transfer pipe 61. For this reason, the electronic circuit board device 1 can be easily replaced, for example, removed during repair or assembly. Furthermore, a plurality of heat transfer devices 30 are fixed to the first circuit board device 10 with screws through fixing brackets 60. For this reason, replacement of the heat transfer device 20, for example, removal at the time of repair, and assembly work can be performed easily. Next, the second circuit board device 40 and the third circuit board device 50 are fixed by screws. Therefore, replacement of the circuit board devices 40 and 50, for example, removal during repair, and assembly work can be easily performed.
以上のまとめとして、本発明の構成およびそのバリエーションを以下に付記として列挙する
（付記１） 第１の回路基板に実装された熱伝達体と第２の回路基板に実装された発熱電子部品とを熱伝導接続し、且つ第２の回路基板を介して第１の回路基板と発熱電子部品とが電導接続されていることを特徴とする電子装置。
As a summary of the above, the configurations of the present invention and variations thereof are listed below as appendices. (Appendix 1) A heat transfer body mounted on a first circuit board and a heat generating electronic component mounted on a second circuit board. An electronic device characterized in that the first circuit board and the heat-generating electronic component are conductively connected through a heat conductive connection and through a second circuit board.
（付記２） 付記１に記載の熱伝達体は前記発熱電子部品と熱伝導接続する領域以外を断熱材で被覆されていることを特徴とする電子装置。 (Additional remark 2) The heat transfer body of Additional remark 1 is coat | covered with the heat insulating material except the area | region which carries out heat conduction connection with the said heat-emitting electronic component, The electronic device characterized by the above-mentioned.
（付記３） 付記１に記載の第２の回路基板は発熱電子部品を１つ又は複数個実装されていることを特徴とする電子装置。 (Additional remark 3) The 2nd circuit board of Additional remark 1 is mounted with one or more heat generating electronic components, The electronic device characterized by the above-mentioned.
（付記４） 付記１に記載の第１の回路基板に熱伝達体が少なくとも１つ実装されていることを特徴とする電子装置。 (Appendix 4) An electronic device, wherein at least one heat transfer body is mounted on the first circuit board according to appendix 1.
（付記５） 熱伝達体の少なくとも１面と回路基板に実装された発熱電子部品の一面とを熱伝導接続し、且つ前記回路基板を介して押圧力を調整可能に固定されていることを特徴とする熱伝達体装置。 (Supplementary Note 5) The heat transfer body and at least one surface of the heat generating electronic component mounted on the circuit board are thermally conductively connected, and the pressing force is adjustable and fixed through the circuit board. Heat transfer device.
（付記６） 付記１、３に記載の第２の回路基板に複数個実装された各発熱電子部品は回路基板面からの高さが略同一であることを特徴とする電子装置。 (Appendix 6) An electronic device, wherein a plurality of heat generating electronic components mounted on the second circuit board according to appendices 1 and 3 have substantially the same height from the circuit board surface.
（付記７） 付記１，２、４に記載の複数個実装された熱伝達体内は並列又は/及び直列に流れるように接続されていることを特徴とする電子装置。 (Appendix 7) An electronic device, wherein the plurality of mounted heat transfer bodies according to appendices 1, 2, and 4 are connected to flow in parallel and / or in series.
（付記８） 付記１，２，４，６に記載の熱伝達体は冷媒通路を有することを特徴とする電子装置。 (Additional remark 8) The heat transfer body of Additional remark 1,2,4,6 has a refrigerant path, The electronic device characterized by the above-mentioned.
（付記９） 前記冷媒通路の上流側から下流側に向かって発熱量の少ない前記発熱部材から発熱量の多い発熱部材の順番で配置されていることを特徴とする請求項１に記載の電子装置。 (Supplementary note 9) The electronic device according to claim 1, wherein the heat generating member having a small heat generation amount and the heat generating member having a large heat generation amount are arranged in order from the upstream side to the downstream side of the refrigerant passage. .
（付記１０） 付記１、２，４，６に記載の熱伝達体は熱伝達パイプを介して放熱体に接続されていることを特徴とする電子装置。 (Additional remark 10) The heat transfer body of Additional remarks 1, 2, 4, and 6 is connected to the heat radiator via the heat transfer pipe, The electronic device characterized by the above-mentioned.
１ 電子回路基板装置、
１０ 第１の回路基板装置、
１１ 第１の回路基板、
２０ 冷却の対象に選択されない部品、例えば非発熱電子部品、
３０ 熱伝達装置、
３１ 熱伝達体、
３２ 断熱材、
３３ 冷媒、
４０ 第２の回路基板装置、
４１ 第２の回路基板、
４２ 発熱電子部品、
４３ 接続リード線、
４４ 熱伝導補助部材、
５０ 第３の回路基板装置、
６０ 固定金具、
６１ 熱伝達パイプである。
1 Electronic circuit board device,
10 first circuit board device,
11 first circuit board;
20 Parts that are not selected for cooling, such as non-heat generating electronic parts,
30 heat transfer device,
31 heat transfer body,
32 insulation,
33 refrigerant,
40 second circuit board device,
41 second circuit board,
42 exothermic electronic components,
43 connection leads,
44 heat conduction auxiliary member,
50 third circuit board device,
60 fixing bracket,
61 Heat transfer pipe.
Claims (5)
Heat transfer characterized in that at least one surface of the heat transfer body and one surface of the heat generating electronic component mounted on the circuit board are connected by heat conduction and the pressing force is adjustable via the circuit board. Body equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005257632A JP2007073668A (en) | 2005-09-06 | 2005-09-06 | Heat transfer device for transferring heat, and electronic device mounted with the heat transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005257632A JP2007073668A (en) | 2005-09-06 | 2005-09-06 | Heat transfer device for transferring heat, and electronic device mounted with the heat transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2007073668A true JP2007073668A (en) | 2007-03-22 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005257632A Withdrawn JP2007073668A (en) | 2005-09-06 | 2005-09-06 | Heat transfer device for transferring heat, and electronic device mounted with the heat transfer device |
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| Country | Link |
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| JP (1) | JP2007073668A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009043978A (en) * | 2007-08-09 | 2009-02-26 | Shinko Electric Ind Co Ltd | Semiconductor apparatus |
| US8251586B2 (en) | 2008-07-04 | 2012-08-28 | Nippon Thompson Co., Ltd. | Lubricating member for linear motion rolling guide unit and slider for linear motion rolling guide unit |
| JP2015087106A (en) * | 2013-10-29 | 2015-05-07 | 楊 泰和 | Single-sided pasted heat transfer type soaking device |
-
2005
- 2005-09-06 JP JP2005257632A patent/JP2007073668A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009043978A (en) * | 2007-08-09 | 2009-02-26 | Shinko Electric Ind Co Ltd | Semiconductor apparatus |
| US8251586B2 (en) | 2008-07-04 | 2012-08-28 | Nippon Thompson Co., Ltd. | Lubricating member for linear motion rolling guide unit and slider for linear motion rolling guide unit |
| JP2015087106A (en) * | 2013-10-29 | 2015-05-07 | 楊 泰和 | Single-sided pasted heat transfer type soaking device |
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