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JP2007093468A - Electronic component - Google Patents

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JP2007093468A
JP2007093468A JP2005285001A JP2005285001A JP2007093468A JP 2007093468 A JP2007093468 A JP 2007093468A JP 2005285001 A JP2005285001 A JP 2005285001A JP 2005285001 A JP2005285001 A JP 2005285001A JP 2007093468 A JP2007093468 A JP 2007093468A
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elements
hall sensor
electronic component
sensors
hall
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JP4786986B2 (en
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Sousuke Nishida
聡佑 西田
Ichiro Okada
一朗 岡田
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Asahi Kasei Electronics Co Ltd
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Asahi Kasei Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Magnetic Variables (AREA)
  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact electronic component that is easy to install wiring with high-accuracy mounting of a plurality of elements, and allowing the characteristics among the plurality of the elements to be substantially uniform. <P>SOLUTION: When the crystal of a semiconductor thin film deposited on a substrate is anisotropic, or the input resistance and output resistance are different, a first Hall sensor 57 and a Hall sensor 58 are clockwise rotated up to 45 degrees to be mounted on a die pad 52 of a lead frame perform wire bonding, when the characteristics of one terminal pair direction and the other terminal pair direction of the Hall sensor are different. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

電子部品内のリードフレーム上へ複数の素子をマウントする方法と、各素子の端子の接続方法に関する。より詳細には、上記複数の素子がセンサであり、位置検出や回転検出など様々な用途に使われる電子部品に関する。   The present invention relates to a method for mounting a plurality of elements on a lead frame in an electronic component, and a method for connecting terminals of each element. More specifically, the plurality of elements are sensors, and the present invention relates to an electronic component used for various purposes such as position detection and rotation detection.

近年、様々なセンサがあらゆるところで用いられるようになっている。
例えば、デジタルカメラの手ブレ補正機構では、瞬時に高精度な位置検出を行う必要があり、それと同時に機器全体の小型化の要求が強いので、センサ自体の小型化が要求されている。さらには、長寿命化、埃や油（グリース）などの影響を受けにくいなど様々な要求がある。 In recent years, various sensors have been used everywhere.
For example, in the camera shake correction mechanism of a digital camera, it is necessary to instantly detect a position with high accuracy, and at the same time, there is a strong demand for downsizing the entire device, and thus downsizing of the sensor itself is required. Furthermore, there are various demands such as longer life and less influence from dust and oil (grease).

上記のような要求をみたすために、磁気センサを用いた位置検出方法などが知られている。例えば、特許文献１等に記載されている方法をアレンジして行うことができる。つまり、特許文献１の図３で示されるように、可動部に磁石を内包させ、その移動を複数の磁気センサを用いて検出する方法である。   In order to meet the above requirements, a position detection method using a magnetic sensor is known. For example, the method described in Patent Document 1 can be arranged and performed. That is, as shown in FIG. 3 of Patent Document 1, a magnet is included in the movable part, and the movement is detected using a plurality of magnetic sensors.

ここで、複数個の磁気センサを用いて、位置検出を行う原理と構成を説明する。   Here, the principle and configuration for performing position detection using a plurality of magnetic sensors will be described.

図２は、従来のホールセンサを用いた位置検出センサの端子接続図である。図３は、ホールセンサを用いた位置検出方法を説明するための概略図である。
図３に示すように、規定の間隔を隔てて配置された２個のホールセンサ１１、１２に対向して配置された永久磁石２３の側方移動による磁束密度の変化に応じて、２個のホールセンサ１１、１２のホール出力電圧がそれぞれ変化する。そのホール出力電圧の差を、図２で示すように差動信号処理回路２１により処理することで、永久磁石２３の位置検出を行うことができる。 FIG. 2 is a terminal connection diagram of a position detection sensor using a conventional Hall sensor. FIG. 3 is a schematic diagram for explaining a position detection method using a Hall sensor.
As shown in FIG. 3, according to the change of the magnetic flux density due to the lateral movement of the permanent magnet 23 arranged opposite to the two Hall sensors 11 and 12 arranged at a predetermined interval, The hall output voltages of the hall sensors 11 and 12 change. The position of the permanent magnet 23 can be detected by processing the difference in the Hall output voltage by the differential signal processing circuit 21 as shown in FIG.

図２に示した従来のホールセンサを用いた位置センサは、２個のホールセンサ１１、１２を有するホールセンサの駆動・処理回路を備えている。第１のホールセンサ１１は、正極入力端子１１ａと負極入力端子１１ｃと、正極出力端子１１ｂと負極出力端子１１ｄとからなる。また、第２のホールセンサ１２は、正極入力端子１２ａと負極入力端子１２ｃと、正極出力端子１２ｂと負極出力端子１２ｄとからなる。   The position sensor using the conventional hall sensor shown in FIG. 2 includes a hall sensor driving / processing circuit having two hall sensors 11 and 12. The first hall sensor 11 includes a positive input terminal 11a, a negative input terminal 11c, a positive output terminal 11b, and a negative output terminal 11d. The second Hall sensor 12 includes a positive electrode input terminal 12a, a negative electrode input terminal 12c, a positive electrode output terminal 12b, and a negative electrode output terminal 12d.

第１のホールセンサ１１の正極入力端子１１ａと、第２のホールセンサ１２の正極入力端子１２ａとを接続し、第１のホールセンサ１１の負極入力端子１１ｃと、第２のホールセンサ１２の負極入力端子１２ｃとを接続して駆動回路の入力端子とする。
第１のホールセンサ１１の正極出力端子１１ｂと負極出力端子１１ｄは、差動信号処理回路２１の第１の差動増幅器２１ａに接続され、第２のホールセンサ１２の正極出力端子１２ｂと負極出力端子１２ｄは、差動信号処理回路２１の第２の差動増幅器２１ｂに接続される。第１の差動増幅器２１ａと第２の差動増幅器２１ｂの出力信号は、第３の差動増幅器２１ｃに接続される。 The positive input terminal 11a of the first hall sensor 11 and the positive input terminal 12a of the second hall sensor 12 are connected, and the negative input terminal 11c of the first hall sensor 11 and the negative pole of the second hall sensor 12 are connected. The input terminal 12c is connected to be an input terminal of the drive circuit.
The positive output terminal 11b and the negative output terminal 11d of the first hall sensor 11 are connected to the first differential amplifier 21a of the differential signal processing circuit 21, and the positive output terminal 12b and the negative output of the second hall sensor 12 are connected. The terminal 12d is connected to the second differential amplifier 21b of the differential signal processing circuit 21. Output signals of the first differential amplifier 21a and the second differential amplifier 21b are connected to the third differential amplifier 21c.

このような駆動・処理回路によって、第３の差動増幅器２１ｃから第１のホールセンサ１１と第２のホールセンサ１２のホール出力電圧の差が得られ、その値は、永久磁石２３の位置に対応したものになる。   By such a driving / processing circuit, the difference between the Hall output voltages of the first Hall sensor 11 and the second Hall sensor 12 is obtained from the third differential amplifier 21c, and the value is obtained at the position of the permanent magnet 23. It will be compatible.

特開２００２−２８７８９１号公報Japanese Patent Laid-Open No. 2002-287991

しかし、特許文献１に記載の手法では、センサをばらばらに配置しているので、センサ全体のサイズが大きくなる。また、センサをばらばらに配置しているので、センサ１つずつの配置誤差が重畳し、高精度な位置検出に適していない。また、高精度に位置検出を行うには、センサどうしの特性が類似のものを選ぶ必要がある。さらにセンサをばらばらに配置しているので、配線の引き回しが複雑になる。   However, in the method described in Patent Document 1, since the sensors are arranged separately, the size of the entire sensor increases. In addition, since the sensors are arranged apart from each other, an arrangement error of each sensor is superimposed, which is not suitable for highly accurate position detection. In addition, in order to detect a position with high accuracy, it is necessary to select sensors having similar characteristics. Furthermore, since the sensors are arranged separately, the wiring is complicated.

また、図２に示す２個のホールセンサを、例えばリードフレームにマウントして、各ホールセンサの各端子をリードフレームにワイヤボンディングしようとすると、一部の配線が交差してしまい、これを回避するような配線の引き回しができず、結局、その実現は困難であった。   In addition, if the two Hall sensors shown in FIG. 2 are mounted on, for example, a lead frame and each terminal of each Hall sensor is to be wire-bonded to the lead frame, a part of wiring crosses to avoid this. In the end, it was difficult to realize such wiring.

上記のような問題は、位置センサのみならず、回転を検知するセンサなど他のセンサにも共通の問題となっている。   The above problems are common to not only position sensors but also other sensors such as sensors that detect rotation.

本発明は、上記のような問題に鑑みてなされたもので、その目的とするところは、小型で、複数の素子を高精度に実装可能で、複数の素子間の特性がほぼ均一で、配線の引き回しが容易な、電子部品を提供することにある。   The present invention has been made in view of the above-described problems, and the object of the present invention is a small size, a plurality of elements can be mounted with high accuracy, characteristics between the plurality of elements are substantially uniform, and wiring is achieved. It is to provide an electronic component that can be easily routed.

また、位置検出や回転検出のセンサだけに限らず、小型で、複数の素子を高精度に実装可能で、複数の素子間の特性がほぼ均一で、配線の引き回しが容易な、電子部品を提供することにもある。   In addition to sensors for position detection and rotation detection, we provide electronic components that are small in size, can mount multiple elements with high accuracy, have almost uniform characteristics between multiple elements, and are easy to route. There is also to do.

本発明は、このような目的を達成するためになされたもので、請求項１の発明は、１つのパッケージ内に複数個の素子と複数の電極を有するリードフレームとを内包した電子部品において、素子の厚さ方向以外の各辺がパッケージの厚さ方向以外の各辺それぞれに対して、平行もしくは垂直以外の角度となるように、前記複数個の素子を前記リードフレーム上にマウントし、前記複数個の素子の同機能を有する少なくとも各端子の１つを前記電極の１つに共通に接続したことを特徴とする。   The present invention has been made to achieve such an object. The invention of claim 1 is an electronic component including a lead frame having a plurality of elements and a plurality of electrodes in one package. The plurality of elements are mounted on the lead frame such that each side other than the thickness direction of the element has an angle other than parallel or perpendicular to each side other than the thickness direction of the package, At least one of the terminals having the same function of a plurality of elements is commonly connected to one of the electrodes.

ここで、素子とは種々の半導体部品や、各種センサ、そのほかにもアモルファス部品やケミカル部品などのことを指す。センサには磁気式センサや光学式センサ、温度センサなど様々なセンサが適用される。   Here, the element refers to various semiconductor parts, various sensors, amorphous parts, chemical parts, and the like. Various sensors such as a magnetic sensor, an optical sensor, and a temperature sensor are applied as the sensor.

また、請求項２の発明は、請求項１において、前記複数個の素子のうち隣接する素子の同機能を有する少なくとも１対の端子同士が対向するように、前記複数個の素子を前記リードフレーム上にマウントし、前記隣接する素子の同機能を有する少なくとも１対の端子を１つの前記電極に共通に接続したことを特徴とする。   According to a second aspect of the present invention, in the first aspect, the plurality of elements are connected to the lead frame so that at least one pair of terminals having the same function of adjacent elements among the plurality of elements face each other. It is characterized in that at least one pair of terminals mounted on each other and having the same function of the adjacent elements are connected in common to one of the electrodes.

さらに、請求項３の発明は、請求項１または２において、前記複数個の素子がセンサであることを特徴とする。   Furthermore, the invention of claim 3 is characterized in that, in claim 1 or 2, the plurality of elements are sensors.

ここで、センサには磁気式センサや光学式センサ、温度センサなど様々なセンサが適用される。   Here, various sensors such as a magnetic sensor, an optical sensor, and a temperature sensor are applied to the sensor.

さらに、請求項４の発明は、請求項３において、前記センサがホールセンサであることを特徴とする。   The invention of claim 4 is characterized in that, in claim 3, the sensor is a hall sensor.

磁気式センサとしては、ホールセンサの他にも磁気抵抗効果素子など様々なものが適用可能である。   As the magnetic sensor, various devices such as a magnetoresistive effect element can be applied in addition to the Hall sensor.

さらに、請求項５の発明は、請求項３または４において、前記複数個の素子が２個のホールセンサであることを特徴とする。   Furthermore, the invention of claim 5 is characterized in that, in claim 3 or 4, the plurality of elements are two Hall sensors.

さらに、請求項６の発明は、請求項１乃至５のいずれかにおいて、前記複数個の素子を基板上に多数形成された素子の中で隣り合った位置、もしくは近隣の位置にあるものから選択したことを特徴とする。   Further, in a sixth aspect of the present invention, in any one of the first to fifth aspects, the plurality of elements are selected from elements adjacent to each other or neighboring positions among a plurality of elements formed on the substrate. It is characterized by that.

基板上に多数形成された素子の中で隣り合った位置、もしくは近隣の位置にあるものから選択して組み立てることにより、複数個の素子の特性が類似のものになり、様々な用途において好適に対応可能となる。   By selecting and assembling a number of elements on the substrate that are next to each other or adjacent to each other, the characteristics of multiple elements will be similar and suitable for various applications. It becomes possible to respond.

本発明によれば、電子部品が位置検出や回転検出のセンサの場合は特に、また、それ以外の電子部品においても、小型で、複数の素子を高精度に実装可能で、配線の引き回しが容易な、電子部品を提供することが可能になる。   According to the present invention, especially when the electronic component is a sensor for position detection or rotation detection, and also in other electronic components, it is small, a plurality of elements can be mounted with high precision, and wiring can be easily routed. It is possible to provide electronic components.

また、基板上に多数形成された素子の中で隣り合った位置、もしくは近隣の位置にあるものから選択して組み立てることにより、複数の素子間の特性がほぼ均一なものを一体化して供給することが可能となり、様々な用途において好適に対応可能となる。   In addition, by selecting and assembling a plurality of elements formed on the substrate from adjacent or neighboring positions, elements having substantially uniform characteristics among a plurality of elements are supplied in an integrated manner. Therefore, it is possible to suitably cope with various applications.

以下、図面を参照して本発明の実施例について説明する。各図面の説明において、先行する図面と共通するものについては重複説明を省略する。   Embodiments of the present invention will be described below with reference to the drawings. In the explanation of each drawing, the duplicate explanation is omitted for those that are common to the preceding drawings.

前述のとおり、本発明の電子部品は様々な用途に用いられる種々の電子部品に関するものであるが、本実施例では、複数個の素子を２個のホールセンサとし、電子部品を位置検出センサとしたもので説明を行う。   As described above, the electronic component of the present invention relates to various electronic components used for various applications. In this embodiment, a plurality of elements are used as two Hall sensors, and the electronic components are used as position detection sensors. I will explain with what I did.

図１は基板上に成膜された半導体薄膜に多数形成されたホールセンサの概略図で、３１は基板、３２、３３、３４は基板上に形成されたホールセンサ、３５はホールセンサの一方の端子対方向を示す矢印、３６はホールセンサの他方の端子対方向を示す矢印である。本実施例における位置検出素子に用いる２個のホールセンサの一方に、ホールセンサ３２を選択した場合、他方に、ホールセンサ３２と隣り合う位置にあるホールセンサ３３を選択する。万が一、ホールセンサ３３が不良ホールセンサであった場合は、ホールセンサ３３の次にホールセンサ３２に近い位置にあるホールセンサ３４を選択する。このように、本実施例における位置検出素子に用いる２個のホールセンサを、感磁部を形成する半導体薄膜の結晶性や電極の特性がほぼ同一の隣り合う位置にあるホールセンサ、もしくは近隣にあるホールセンサを選択的に用いることによって、２個の電気的・磁気的な特性をほぼ同一にし、高精度な位置検出を行うことができる。   FIG. 1 is a schematic view of a hall sensor formed on a semiconductor thin film formed on a substrate. 31 is a substrate, 32, 33 and 34 are hall sensors formed on the substrate, and 35 is one of the hall sensors. An arrow indicating the terminal pair direction, and 36 are arrows indicating the other terminal pair direction of the Hall sensor. When the hall sensor 32 is selected as one of the two hall sensors used for the position detection element in the present embodiment, the hall sensor 33 located adjacent to the hall sensor 32 is selected as the other. If the hall sensor 33 is a defective hall sensor, the hall sensor 34 located next to the hall sensor 32 and next to the hall sensor 32 is selected. As described above, the two Hall sensors used for the position detecting element in this embodiment are arranged adjacent to Hall sensors in adjacent positions where the crystallinity and electrode characteristics of the semiconductor thin film forming the magnetic sensitive portion are almost the same. By selectively using a certain Hall sensor, the two electrical and magnetic characteristics can be made substantially the same, and highly accurate position detection can be performed.

図４は、本実施例の電子部品に用いる２個のホールセンサをリードフレームのダイパッド上へ搭載し、ワイヤーボンディングしたときの概略図である。本実施例は、図１で示した、ホールセンサの一方の端子対方向３５と他方の端子対方向３６の電気的・磁気的特性が異なる場合、つまりどちらの端子対を入力端子、もしくは出力端子にするかが決定している場合（今回は図１中の端子対方向３５を入力端子方向とする）を示している。５７は第１のホールセンサ、５８は第２のホールセンサ、５１は正極入力電極、５２は負極入力電極（ダイパッド、グラウンド端子）、５３は第１のホールセンサの正極出力電極、５４は第１のホールセンサの負極出力電極、５５は第２のホールセンサの正極出力電極、５６は第２のホールセンサの負極出力電極、５９はパッケージの外形を示す。   FIG. 4 is a schematic view when two Hall sensors used for the electronic component of this embodiment are mounted on a die pad of a lead frame and wire bonded. In this embodiment, when the electrical and magnetic characteristics of one terminal pair direction 35 and the other terminal pair direction 36 of the Hall sensor shown in FIG. 1 are different, that is, which terminal pair is an input terminal or output terminal. (This time, the terminal pair direction 35 in FIG. 1 is set as the input terminal direction). 57 is a first Hall sensor, 58 is a second Hall sensor, 51 is a positive input electrode, 52 is a negative input electrode (die pad, ground terminal), 53 is a positive output electrode of the first Hall sensor, and 54 is a first The negative output electrode of the Hall sensor, 55 the positive output electrode of the second Hall sensor, 56 the negative output electrode of the second Hall sensor, and 59 the outer shape of the package.

斜線の入っている端子対が、図１中の端子対方向３５の端子対である。本実施例においては、一部の各電極が長方形または正方形の基板の角部に配置されている。   The pair of terminals with diagonal lines is the terminal pair in the terminal pair direction 35 in FIG. In the present embodiment, some of the electrodes are arranged at corners of a rectangular or square substrate.

基板上に成膜された半導体薄膜の結晶が異方性の場合、もしくは、入力抵抗と出力抵抗が異なる場合など、ホールセンサの一方の端子対方向３５と他方の端子対方向３６の電気的・磁気的特性が異なる場合は、図４で示すように、第１のホールセンサ５７と第２のホールセンサ５８を、当該センサ５７，５８の厚さ方向以外の各辺がパッケージ５９の厚さ方向以外の各辺に対して、平行もしくは垂直の状態から、それ以外の角度となるように、当該センサ５７，５８が形成する平面上で、時計回りに４５度回転し、リードフレームのダイパッド５２に搭載し、ワイヤーボンディングを行う。   When the crystal of the semiconductor thin film formed on the substrate is anisotropic, or when the input resistance and the output resistance are different, the electrical characteristics of one terminal pair direction 35 and the other terminal pair direction 36 of the Hall sensor When the magnetic characteristics are different, as shown in FIG. 4, the first Hall sensor 57 and the second Hall sensor 58 are arranged such that each side other than the thickness direction of the sensors 57 and 58 is in the thickness direction of the package 59. Rotate 45 degrees clockwise on the plane formed by the sensors 57 and 58 so as to be at an angle other than the parallel or vertical state with respect to each side except for the die pad 52 of the lead frame. Install and perform wire bonding.

このように、第１のホールセンサ５７と第２のホールセンサ５８を時計回りに４５度回転してリードフレームのダイパッド５２に搭載することによって、第１のホールセンサ５７および第２のホールセンサ５８の正極入力端子同士を対向させることができ、その結果、図２で示したように回転せずにリードフレームのダイパッド４２に搭載しようとしたときには困難であったワイヤーボンディングを可能にすることができる。すなわち、１つのパッケージ内で２個のホールセンサの第１のホールセンサの正極入力端子と第２のホールセンサの正極入力端子を同電極に接続し、第１のホールセンサの負極入力端子と第２のホールセンサの負極入力端子を同電極に接続して該電子部品の入力端子とすることができる。よって、電子部品の電極数を減らし素子の小型化を実現し、配線の引き回しが容易になる。また、２個のホールセンサを１つのパッケージ内に収納することにより、２つのホールセンサの位置関係は、プリント基板上に電子部品を配置する精度ではなく、素子をリードフレーム上に配置する精度で実装できることになるので、一般的に高精度でお互いの位置関係を決めることができるようになる。   As described above, the first hall sensor 57 and the second hall sensor 58 are mounted on the die pad 52 of the lead frame by rotating the first hall sensor 57 and the second hall sensor 58 clockwise by 45 degrees. The positive electrode input terminals can be made to face each other, and as a result, wire bonding, which was difficult when trying to mount on the die pad 42 of the lead frame without rotating as shown in FIG. 2, can be made possible. . That is, the positive input terminal of the first hall sensor and the positive input terminal of the second hall sensor of the two hall sensors are connected to the same electrode in one package, and the negative input terminal of the first hall sensor and the second The negative input terminal of the Hall sensor 2 can be connected to the same electrode to serve as the input terminal of the electronic component. Therefore, the number of electrodes of the electronic component is reduced, the element can be miniaturized, and the wiring can be easily routed. In addition, by storing two Hall sensors in one package, the positional relationship between the two Hall sensors is not the accuracy of placing electronic components on the printed circuit board, but the accuracy of placing elements on the lead frame. Since it can be mounted, it is generally possible to determine the positional relationship between each other with high accuracy.

図５は、本発明の電子部品に用いられる複数の端子を備えた素子の概略図である。６１は複数の端子を備えた素子、６２は正極入力端子、６３は負極入力端子である。図５では、簡単のために他の端子は省略している。前記複数の端子を備えた素子６１はホールセンサのように、正極入力端子と負極入力端子を入れ替えることができない素子である。図６は電子部品に用いられる複数の端子を備えた電気的素子６１を、リードフレームのダイパッド上へ２個搭載し、ワイヤーボンディングしたときの概略図である。７１は正極入力電極、７２は負極入力電極（ダイパッド）、７３は第１の複数の端子を備えた素子、７４は第２の複数の端子を備えた素子、７５は電子部品のパッケージ外形を示してある。図６で示すように、各素子７３，７４が形成する平面上で、第１の複数の端子を備えた素子７３を時計回りに４５度回転し、第２の複数の端子を備えた素子７４を反時計回りに１３５度回転しリードフレームのダイパッド７２に搭載することによって、各素子の正極入力端子同士を対向させて、ワイヤーボンディングを行うことができる。   FIG. 5 is a schematic view of an element having a plurality of terminals used in the electronic component of the present invention. 61 is an element having a plurality of terminals, 62 is a positive input terminal, and 63 is a negative input terminal. In FIG. 5, other terminals are omitted for simplicity. The element 61 having the plurality of terminals is an element in which the positive electrode input terminal and the negative electrode input terminal cannot be interchanged like a Hall sensor. FIG. 6 is a schematic view when two electrical elements 61 having a plurality of terminals used for electronic components are mounted on a die pad of a lead frame and wire bonded. 71 is a positive input electrode, 72 is a negative input electrode (die pad), 73 is an element having a plurality of first terminals, 74 is an element having a plurality of second terminals, and 75 is an outline of the package of the electronic component. It is. As shown in FIG. 6, on the plane formed by the elements 73 and 74, the element 73 having the first plurality of terminals is rotated 45 degrees clockwise, and the element 74 having the second plurality of terminals. Is rotated 135 degrees counterclockwise and mounted on the die pad 72 of the lead frame, so that the positive electrode input terminals of each element face each other and wire bonding can be performed.

上記方法をとることによって、正極入力端子と負極入力端子を入れ替えることができず配線が困難であった素子でも、ワイヤーボンディングを容易に実現可能にし、パッケージ内で第１の複数の端子を備えた素子の正極入力端子と第２の複数の端子を備えた素子の正極入力端子を同電極に接続し、第１の複数の端子を備えた素子の負極入力端子と第２の複数の端子を備えた素子の負極入力端子を同電極に接続して該電子部品の入力端子とすることができる。よって、電子部品の電極数を減らし素子の小型化を実現し、配線の引き回しが容易になる。また、２個の素子を１つのパッケージ内に収納することにより、２つの素子の位置関係は、プリント基板上に電子部品を配置する精度ではなく、素子をリードフレーム上に配置する精度で実装できることになるので、一般的に高精度でお互いの位置関係を決めることができるようになる。   By adopting the above method, it is possible to easily realize wire bonding even in an element in which the positive electrode input terminal and the negative electrode input terminal cannot be interchanged and wiring is difficult, and the first plurality of terminals are provided in the package. A positive input terminal of an element having a second plurality of terminals and a positive input terminal of the element having the second plurality of terminals are connected to the same electrode, and a negative input terminal and a second plurality of terminals of the element having the first plurality of terminals are provided. The negative input terminal of the device can be connected to the same electrode as the input terminal of the electronic component. Therefore, the number of electrodes of the electronic component is reduced, the element can be miniaturized, and the wiring can be easily routed. In addition, by storing two elements in one package, the positional relationship between the two elements can be mounted with the precision of placing the elements on the lead frame, not the precision of placing the electronic components on the printed circuit board. Therefore, it is generally possible to determine the positional relationship between each other with high accuracy.

上記のように、素子を回転させてリードフレーム上に搭載する方法を用いる事により、ホールセンサに限らず様々な素子の同機能を有する端子を共有化することが可能になる。   As described above, by using a method of rotating an element and mounting it on a lead frame, it is possible to share not only the Hall sensor but also terminals having the same function of various elements.

また、本実施例では素子を２個含む電子部品で説明を行ったが、当然、素子の数は２個である必要はなく、３個でも４個でも複数個であれば同様な効果を有する。   In this embodiment, the electronic component including two elements has been described. Of course, the number of elements is not necessarily two, and the same effect can be obtained if there are three or four elements. .

また、本実施例では素子をホールセンサとした電子部品で説明を行ったが、素子はホールセンサに限定されるものではなく、ＬＥＤや光ディテクタ、温度センサなどとしても同様な効果を有する。   In the present embodiment, the electronic component having the element as a hall sensor has been described. However, the element is not limited to the hall sensor, and the same effect can be obtained as an LED, a photodetector, a temperature sensor, or the like.

また、本実施例では素子を４５度もしくは１３５度回転させてリードフレームに配置する説明を行ったが、リードフレームに素子を配置する際の回転角度は、電極の位置により適宜調整可能である。   In the present embodiment, the element is described as being rotated 45 degrees or 135 degrees and disposed on the lead frame. However, the rotation angle when the element is disposed on the lead frame can be adjusted as appropriate depending on the position of the electrode.

基板上に成膜された半導体薄膜に多数形成されたホールセンサの概略図である。It is the schematic of the Hall sensor formed in large numbers by the semiconductor thin film formed into a film on the board | substrate. 従来のホールセンサを用いた位置検出センサの端子接続図である。It is a terminal connection diagram of a position detection sensor using a conventional Hall sensor. ホールセンサを用いた位置検出方法を説明するための概略図である。It is the schematic for demonstrating the position detection method using a Hall sensor. 本発明の電子部品に用いる２個のホールセンサをリードフレームのダイパッド上へ搭載し、ワイヤーボンディングしたときの概略図である。FIG. 3 is a schematic view when two Hall sensors used for the electronic component of the present invention are mounted on a die pad of a lead frame and wire bonded. 本発明の電子部品に用いられる複数の端子を備えた素子の概略図である。It is the schematic of the element provided with the some terminal used for the electronic component of this invention. 本発明の電子部品に用いられる複数の端子を備えた素子を、リードフレームのダイパッド上へ２個搭載し、ワイヤーボンディングしたときの概略図である。It is the schematic when two elements provided with the some terminal used for the electronic component of this invention are mounted on the die pad of a lead frame, and are wire-bonded.

符号の説明Explanation of symbols

１１ 第１のホールセンサ
１２ 第２のホールセンサ
１１ａ、１２ａ 正極入力端子
１１ｂ、１２ｂ 正極出力端子
１１ｃ、１２ｃ 負極入力端子
１１ｄ、１２ｄ 負極出力端子
２１ 差動信号処理回路
２１ａ，２１ｂ，２１ｃ 差動増幅器
２３ 永久磁石
３１ 基板
３２、３３、３４ ホールセンサ
３５ ホールセンサの一方の端子対方向を示す矢印
３６ ホールセンサの他方の端子対方向を示す矢印
５１ 正極入力電極
５２ 負極入力電極
５３ 第１のホールセンサの正極出力電極
５４ 第１のホールセンサの負極出力電極
５５ 第２のホールセンサの正極出力電極
５６ 第２のホールセンサの負極出力電極
５７ 第１のホールセンサ
５８ 第２のホールセンサ
５９ パッケージ外形
６１ 複数の端子を備えた素子
６２ 正極入力端子
６３ 負極入力端子
７１ 正極入力電極
７２ 負極入力電極
７３ 第１の複数の端子を備えた素子
７４ 第２の複数の端子を備えた素子
７５ 電子部品のパッケージ外形
11 First Hall Sensor 12 Second Hall Sensor 11a, 12a Positive Input Terminal 11b, 12b Positive Output Terminal 11c, 12c Negative Input Terminal 11d, 12d Negative Output Terminal 21 Differential Signal Processing Circuits 21a, 21b, 21c Differential Amplifier 23 Permanent magnet 31 Substrate 32, 33, 34 Hall sensor 35 Arrow 36 indicating direction of one terminal pair of Hall sensor Arrow 51 indicating direction of other terminal pair of Hall sensor 51 Positive electrode input electrode 52 Negative electrode input electrode 53 First Hall sensor Positive output electrode 54 of the first Hall sensor Negative output electrode 55 of the second Hall sensor Positive output electrode 56 of the second Hall sensor Negative output electrode 57 of the second Hall sensor 57 First Hall sensor 58 Second Hall sensor 59 Package outline 61 Element 62 with multiple terminals Positive input terminal 63 Negative input terminal 71 Positive input electrode Element 75 package outline of an electronic component of device 74 second plurality of terminals with two negative input electrode 73 first plurality of terminals

Claims (6)

１つのパッケージ内に複数個の素子と、複数の電極を有するリードフレームとを内包した電子部品において、素子の厚さ方向以外の各辺がパッケージの厚さ方向以外の各辺それぞれに対して、平行もしくは垂直以外の角度となるように、前記複数個の素子を前記リードフレーム上にマウントし、前記複数個の素子の同機能を有する少なくとも各端子の１つを前記電極の１つに共通に接続したことを特徴とする電子部品。   In an electronic component including a plurality of elements and a lead frame having a plurality of electrodes in one package, each side other than the thickness direction of the element is different from each side other than the thickness direction of the package. The plurality of elements are mounted on the lead frame so as to have an angle other than parallel or vertical, and at least one of the terminals having the same function of the plurality of elements is shared by one of the electrodes. An electronic component characterized by being connected. 前記複数個の素子のうち隣接する素子の同機能を有する少なくとも１対の端子同士が対向するように、前記複数個の素子を前記リードフレーム上にマウントし、前記隣接する素子の同機能を有する少なくとも１対の端子を１つの前記電極に共通に接続したことを特徴とする請求項１に記載の電子部品。   The plurality of elements are mounted on the lead frame so that at least one pair of terminals having the same function of adjacent elements among the plurality of elements face each other, and have the same function of the adjacent elements. The electronic component according to claim 1, wherein at least one pair of terminals is commonly connected to one of the electrodes. 前記複数個の素子がセンサであることを特徴とする請求項１または２に記載の電子部品。   The electronic component according to claim 1, wherein the plurality of elements are sensors. 前記センサがホールセンサであることを特徴とする請求項３に記載の電子部品。   The electronic component according to claim 3, wherein the sensor is a Hall sensor. 前記複数個の素子が２個のホールセンサであることを特徴とする請求項３または４に記載の電子部品。   The electronic component according to claim 3 or 4, wherein the plurality of elements are two Hall sensors. 前記複数個の素子を基板上に多数形成された素子の中で隣り合った位置、もしくは近隣の位置にあるものから選択したことを特徴とする請求項１乃至５のいずれかに記載の電子部品。
6. The electronic component according to claim 1, wherein the plurality of elements are selected from elements adjacent to each other or neighboring positions among elements formed on the substrate. .
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JP2019070563A (en) * 2017-10-06 2019-05-09 株式会社デンソー Current sensor
US11199563B2 (en) 2017-10-06 2021-12-14 Denso Corporation Electric current sensor

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