JP2007098404A - Laser processing equipment - Google Patents

Abstract

Provided is a laser processing apparatus capable of effectively preventing processing dust generated in laser processing from scattering into the air and minimizing adverse effects of processing dust on laser processing.
In a dust suction mechanism, processed dust passes through a plurality of partition sections of a rectifying unit and then reaches a tray part. At this time, the air generated by suction by a pump (not shown) has a flow direction parallel to the wall surfaces (partition walls 32) of the plurality of partition sections 32 a of the rectification unit 31, and the partition wall 32 of the rectification unit 31 Adhering processing dust D is minimized. Thereafter, the processed dust D that has reached the tray portion 33 is sucked through a suction hole 33 a formed in the bottom portion of the tray portion 33, and is sent to a pump (not shown) through the suction duct 36. In addition, the rectification | straightening part 31 of the dust suction mechanism 30 is arrange | positioned in the state spaced apart only predetermined distance with respect to the vapor deposition thin film of the solar cell substrate.
[Selection] Figure 3

Description

  The present invention relates to a laser processing apparatus that performs laser processing by irradiating a substrate to be processed with laser light, and in particular, laser processing that performs laser processing on a deposited thin film formed on a solar cell substrate that is a substrate to be processed. Relates to the device.

  This type of solar cell substrate is formed by sequentially depositing a thin film such as a transparent electrode layer, a solar cell layer, and a back electrode layer on a transparent base material. Grooves (processing lines) are formed. Such a processing line is usually formed by performing laser processing on the deposited thin film and selectively removing the thin film at a desired site.

  In general, when laser processing is performed on a vapor-deposited thin film formed on a solar cell substrate, more or less processed dust is generated, although the degree varies depending on the type of vapor-deposited thin film. If such processed dust is scattered in the air during laser processing, it not only adversely affects the laser processing itself but is also undesirable from the environment.

  Therefore, a laser processing apparatus that performs such laser processing is usually provided with a dust suction mechanism for removing processing dust, and performs laser processing while absorbing dust generated near the laser processing point by the dust suction mechanism. .

  Specifically, as a first method, a dust collection tray that covers the entire surface of the solar cell substrate that is the substrate to be processed is disposed on almost the entire lower surface of the solar cell substrate fixed to the moving table. There has been proposed a method of performing laser processing while suctioning (see Patent Document 1). However, in this first method, it is necessary to suck a large area corresponding to the lower surface of the solar cell substrate with the dust collecting tray. In this case, the machining dust generated by the laser processing is sucked in by the suction duct attached to the dust suction tray, but even if the processing dust can be sucked sufficiently in the area near the suction duct of the dust suction tray. There is a problem that the suction effect is drastically reduced in a region that is some distance away from the suction duct. Also, with such a dust collection tray, it is possible to sufficiently suck the processed dust in a state where it is floating in the air, but once the processed dust has adhered to the surface of the dust collection tray, it will absorb the dust. It becomes very difficult. Then, the processing dust adhering to the surface of the dust tray in this way will gradually rise in the air due to the movement of the moving table and the like, resulting in an adverse effect on laser processing.

On the other hand, as a second method, a dust suction nozzle that is not fixed to the moving table is used, and the dust suction nozzle is always held in the vicinity of the laser processing point regardless of the movement of the solar cell substrate that is the substrate to be processed. A method of processing has also been proposed. However, in this second method, the mechanism for holding the dust suction nozzles is complicated, and when there are a plurality of laser processing points, it is necessary to provide a number of dust suction nozzles corresponding to the number of laser processing points. There is also.
Japanese Patent Laid-Open No. 2001-111078

  The present invention has been made in consideration of such points, and scattering of processing dust generated when laser processing is performed on a vapor deposition thin film formed on a substrate to be processed such as a solar cell substrate into the air. It is an object of the present invention to provide a laser processing apparatus capable of effectively preventing the adverse effects of processing dust on laser processing.

  The present invention provides a laser processing apparatus for selectively removing a thin film at a desired site by irradiating a vapor deposition thin film formed on a substrate to be processed with a laser beam, and a transparent base material that transmits the laser light and the base material. A holding mechanism for holding a workpiece substrate having a vapor deposition thin film formed on the first surface, and vapor deposition from the second surface side of the substrate on which the vapor deposition thin film is not formed among the workpiece substrates held by the holding mechanism. A laser irradiation mechanism for irradiating a thin film with laser light, a moving mechanism for changing the relative positional relationship between the laser light irradiated by the laser irradiation mechanism and the substrate to be processed, and a substrate to be processed held by a holding mechanism Provided on the side where the deposited thin film is formed, and a dust suction mechanism for sucking machining dust generated by laser processing of the deposited thin film by the laser light irradiated by the laser irradiation mechanism. The structure is a rectification unit arranged in a state separated from the vapor deposition thin film of the substrate to be processed by a predetermined distance, and has a plurality of cylindrical partition sections extending along the normal direction of the substrate to be processed. And a suction unit that is disposed on the downstream side of the rectification unit and sucks the processing dust that has passed through each partition section of the rectification unit.

  In addition, in this invention, it is preferable that the height of each partition division of a rectification | straightening part is larger than the half of the dimension of the aperture part of each said partition division.

  In the present invention, it is preferable that the plurality of partition sections of the rectifying unit cover substantially the same size as the processed surface on which laser processing is performed in the deposited thin film of the substrate to be processed.

  Furthermore, in the present invention, it is preferable that the upstream outer surface formed by the upstream surfaces of the plurality of partition sections of the rectifying unit is curved along the surface shape of the deposited thin film of the substrate to be processed. In addition, the plurality of partition sections of the rectifying unit may be configured such that the direction of the dimension of the opening of the partition section on the outer peripheral side is larger than the dimension of the opening of the partition section on the center side.

  Furthermore, in this invention, the member for preventing the entrainment of the air from the outside may be attached to the outer peripheral part surrounding the several partition division of a rectification | straightening part.

  According to the present invention, a dust suction mechanism for sucking processing dust generated by laser processing on a vapor deposition thin film of a substrate to be processed has a rectification unit having a plurality of partition sections extending along a normal direction of the substrate to be processed, and a rectification unit And a suction part arranged on the downstream side, the flow of air sucked into the suction part via the rectification part is regulated in the normal direction of the substrate to be processed, and a plurality of partitions of the rectification part The suction effect by the pump connected to the suction part through the suction duct is uniformly given over the entire surface of the compartment. In addition, each partition section of the rectifying part of the dust suction mechanism has a cylindrical shape whose dimension (height) in the depth direction is larger than the dimension of the opening part, so that the processing adhered to the bottom surface of the suction part It is possible to effectively prevent dust from flowing back through the rectifying unit. For this reason, it is possible to effectively prevent the processing dust from being scattered in the air, and to minimize the adverse effect on the laser processing.

  In addition, according to the present invention, since the rectifying unit of the dust suction mechanism is arranged in a state of being separated from the vapor deposition thin film of the substrate to be processed by a predetermined distance, the air is drawn from outside the rectifying unit. It is possible to efficiently collect the processing dust generated in the deposited thin film on the processing substrate.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, the configuration of a laser processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

  As shown in FIG. 1, a laser processing apparatus 1 according to this embodiment is for performing laser processing on a solar cell substrate (substrate to be processed) 80, and a holding mechanism 5 that holds the solar cell substrate 80. And a laser irradiation mechanism 10 that irradiates laser light L toward the solar cell substrate 80 held by the holding mechanism 5, and a relative position between the laser light L irradiated by the laser irradiation mechanism 10 and the solar cell substrate 80. A moving mechanism 20 that changes the relationship in the XY plane and a dust suction mechanism 30 that sucks in machining dust generated by laser processing using the laser light L irradiated by the laser irradiation mechanism 10 are provided. In addition, the solar cell substrate 80 laser-processed in this embodiment is a vapor deposition formed in the transparent glass base material 81 which permeate | transmits a laser beam, and the 1st surface 81a of the glass base material 81, as shown in FIG. A thin film 82.

  Among these, the holding mechanism 5 holds a part (four portions in FIG. 1) of the outer peripheral portion of the solar cell substrate 80 so that the deposited thin film 82 of the solar cell substrate 80 faces downward. The holding mechanism 5 is fixed to the moving mechanism 20, and the side of the solar cell substrate 80 moves in the XY plane with the laser light L side fixed as the moving mechanism 20 moves.

  The laser irradiation mechanism 10 includes a laser oscillator 11 that emits laser light L, and a reflection mirror 12 and a condenser lens 13 that guide the laser light L emitted from the laser oscillator 11 toward the solar cell substrate 80. .

  The moving mechanism 20 includes an X table 21 that moves in the X direction and a Y table 22 that moves the X table 21 in the Y direction. On the X table 21, the dust suction mechanism 30 is fixed together with the holding mechanism 5 that holds the solar cell substrate 80, and the solar cell substrate 80 and the dust suction mechanism 30 move together in the XY plane. .

  The dust suction mechanism 30 is provided on the solar cell substrate 80 held by the holding mechanism 5 on the side where the deposited thin film 82 is formed, thereby processing dust D (see FIG. 2) generated in the deposited thin film 82. You can inhale.

  Here, as shown in FIGS. 3 and 4, the dust suction mechanism 30 includes a rectifying unit 31 disposed in a state of being separated from the deposited thin film 82 of the solar cell substrate 80 by a predetermined distance, and a downstream of the rectifying unit 31. It has the saucer part (suction part) 33 arrange | positioned at the side. Note that the tray portion 33 is connected to a pump (not shown) via a suction duct 36.

  Among these, the rectifying unit 31 has a plurality of partition sections 32 a defined by a plurality of partition walls 32. Here, each partition section 32 a has a rectangular column shape (tubular shape) extending along the normal direction of the solar cell substrate 80. In addition, the plurality of partition sections 32 a cover approximately the same size as the processed surface on which the laser processing is performed in the deposited thin film 82 of the solar cell substrate 80. The dimension (height) H in the depth direction of each partition section 32a is preferably larger than half of the dimension W of the opening of each partition section 32a (H> W / 2).

  The tray portion 33 includes a side wall 34 having a shape corresponding to the outer peripheral portion of the rectifying unit 31, and a partition wall 35 that partitions an area surrounded by the side wall 34. In addition, a suction hole 33a connected to the suction duct 36 is formed at the bottom of the tray portion 33, and the processing dust D generated by laser processing on the deposited thin film 82 of the solar cell substrate 80 is sucked. ing. One suction hole 33 a is provided for each region partitioned by the side wall 34 and the partition wall 35.

  The rectifying unit 31 and the tray part 33 of the dust suction mechanism 30 are joined to each other when in use, but are separable from each other in order to facilitate the cleaning operation of removing the processing dust D accumulated in the tray part 33. It is preferable to have a structure. However, in this case, it is necessary that the joint portion between the rectifying unit 31 and the tray unit 33 has a structure that does not leak air.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, as shown in FIG. 1, the solar cell substrate 80 to be laser processed is transferred onto the X table 21 of the moving mechanism 20, and the solar cell substrate 80 is held by the holding mechanism 5 fixed on the X table 21. The deposited thin film 82 is held in a state of facing downward. At this time, the dust suction mechanism 30 fixed on the X table 21 of the moving mechanism 20 is laser-processed among the deposited thin films 82 of the solar cell substrate 80 below the solar cell substrate 80 held by the holding mechanism 5. Is positioned so as to cover approximately the same size as the size of the processed surface on which is performed.

  In this state, a pump (not shown) connected to the dust suction mechanism 30 is operated. Further, the laser oscillator 11 of the laser irradiation mechanism 10 is operated, the laser light L is guided through the reflection mirror 12 and the condenser lens 13, and the laser light L is directed toward the solar cell substrate 80 held by the holding mechanism 5. Irradiate. Further, the X table 21 and the Y table 22 of the moving mechanism 20 are operated, and the solar cell substrate is selectively removed by the irradiated laser beam L at a desired portion of the deposited thin film 82 of the solar cell substrate 80. Move 80. Specifically, for example, whenever the Y table 22 of the moving mechanism 20 moves in the Y direction at a predetermined pitch, the X table 21 moves in the X direction (linear scanning) repeatedly. In this way, a plurality of striped processing grooves (processing lines) are formed over the entire surface of the deposited thin film 82 of the solar cell substrate 80.

  Here, since the solar cell substrate 80 held by the holding mechanism 5 is held with the deposited thin film 82 facing downward, the laser light L guided by the laser irradiation mechanism 10 is as shown in FIG. The solar cell substrate 80 is incident from the second surface 81b side of the glass substrate 81 on which the deposited thin film 82 is not formed, passes through the glass substrate 81, and reaches the deposited thin film 82. Thereby, laser processing is performed on the vapor deposition thin film 82 of the solar cell substrate 80, and the thin film at a desired portion of the vapor deposition thin film 82 is selectively removed.

  When laser processing is performed in this way, a large amount of processing dust D is generated from the deposited thin film 82 of the solar cell substrate 80, and the processing dust D thus generated is sucked by the dust suction mechanism 30. .

  Specifically, as shown in FIGS. 3 and 4, the processing dust D generated in the deposited thin film 82 of the solar cell substrate 80 passes through the plurality of partition sections 32 a of the rectifying unit 31, and then enters the tray unit 33. To reach. At this time, the air generated by suction by a pump (not shown) has a flow direction parallel to the wall surfaces (partition walls 32) of the plurality of partition sections 32 a of the rectification unit 31. The adhering dust D is minimized.

  Thereafter, the processed dust D that has reached the tray portion 33 is sucked through a suction hole 33 a formed in the bottom portion of the tray portion 33, and is sent to a pump (not shown) through the suction duct 36.

  At this time, a part of the processing dust D that has reached the tray part 33 adheres to the surface of the bottom part of the tray part 33 without being sucked through the suction holes 33a, and is slightly in the air due to the movement of the moving mechanism 20 and the like. Soar. However, the rectifying unit 31 provided on the upstream side of the tray part 33 has a plurality of partition sections 32a extending along the normal direction of the solar cell substrate 80, and each partition section 32a has an opening portion. Since the dimension (height) H in the depth direction is larger than the dimension W, the processing dust D adhering to the bottom surface of the tray portion 33 flows back through the rectifying portion 31. It can be effectively prevented. Thereby, even if the processing dust D adheres to the surface of the bottom part of the saucer part 33, it returns to the solar cell substrate 80 side through the rectifying part 31 and is not scattered in the air. It will be kept in the tray part 33.

  As described above, according to the present embodiment, the dust suction mechanism 30 that sucks the processing dust D generated by the laser processing on the vapor deposition thin film 82 of the solar cell substrate 80 has a plurality of partition sections extending along the normal direction of the solar cell substrate 80. Since the rectifying unit 31 having 32 a and the tray part 33 disposed on the downstream side of the rectifying part 31 are included, the flow of air sucked into the tray part 33 through the rectifying part 31 is reduced by the solar cell substrate 80. As a result, the suction effect by a pump (not shown) connected to the tray portion 33 via the suction duct 36 is uniform over the entire surface of the plurality of partition sections 32a of the rectifying portion 31. Given. Further, each partition section 32a of the rectifying unit 31 of the dust suction mechanism 30 has a cylindrical shape with a dimension (height) H in the depth direction larger than the dimension W of the opening, so that the bottom of the tray part 33 It is possible to effectively prevent the processing dust D adhering to the surface of the material from flowing back through the rectifying unit 31. For this reason, it is possible to effectively prevent the processing dust D from being scattered in the air and to minimize the adverse effect on the laser processing.

  Moreover, according to this embodiment, since the rectification | straightening part 31 of the dust suction mechanism 30 is arrange | positioned in the state spaced apart only predetermined distance with respect to the vapor deposition thin film 82 of the solar cell substrate 80, it is wound from the exterior of the rectification | straightening part 31. The processing dust D generated in the vapor deposition thin film 82 of the solar cell substrate 80 can be efficiently collected using air.

  Furthermore, according to the present embodiment, in the dust suction mechanism 30, the tray part 33 where the processed dust D is collected and the rectifying part 31 are joined to each other, so that air generated in the tray part 33 due to movement by the moving mechanism 20 or the like. , And the processing dust D adhering to the bottom surface of the tray portion 33 can be more effectively prevented from being scattered in the air.

  In the above-described embodiment, the upstream outer surface formed by the upstream surfaces of the plurality of partition sections 32a of the rectifying unit 31 of the dust suction mechanism 30 has a flat shape, but the shape of the upstream outer surface is the same. However, the present invention is not limited to this, and can take any shape. In general, when the solar cell substrate 80 is held by the holding mechanism 5 in the manner shown in FIG. 1, when the planar size of the solar cell substrate 80 is increased, the central portion of the solar cell substrate 80 is vertically downward. Tend to bend. When the central portion of the solar cell substrate 80 is bent, the separation distance between the upstream outer surface of the rectifying unit 31 of the dust suction mechanism 30 and the deposited thin film 82 of the solar cell substrate 80 becomes uneven (the center of the solar cell substrate 80). The separation distance on the outer peripheral portion side becomes larger than that on the outer portion side), and the suction effect of the rectifying portion 31 of the dust suction mechanism 30 varies depending on the location in the plane of the solar cell substrate 80. For this reason, in the case where the above-described problem occurs due to the large planar size of the solar cell substrate 80 and the central portion thereof being bent, a plurality of partition sections of the rectifying unit 41 as in the dust suction mechanism 40 shown in FIG. The upstream outer surface 43 formed by the upstream surface of 42a (the region defined by the partition wall 42) may be curved along the surface shape of the deposited thin film 82 of the solar cell substrate 80. Thereby, the separation distance between the upstream outer surface of the rectification unit 31 of the dust suction mechanism 30 and the vapor deposition thin film 82 of the solar cell substrate 80 is made uniform, and the suction effect of the rectification unit 31 of the dust suction mechanism 30 can be reduced to an in-plane location. Regardless of whether it is constant or not.

  Moreover, in embodiment mentioned above, although the dimension of the opening part of the some partition division 32a of the rectification | straightening part 31 of the dust suction mechanism 30 is the same irrespective of the place in a surface, not only this but a some partition You may make it change the dimension of the opening part of the division 32a according to the place in the surface of the solar cell board | substrate 80. FIG. Specifically, for example, as in the dust suction mechanism 50 shown in FIG. 6, a plurality of partition sections 52 a (regions defined by the partition walls 52) of the rectifying unit 51 are formed in the openings of the partition section 52 a on the center side. It is preferable that the dimension direction of the opening of the partition section 52a on the outer peripheral side is larger than the dimension. In this case, since the suction effect on the outer peripheral portion side is larger than the suction effect on the central portion side of the solar cell substrate 80, the planar size of the solar cell substrate 80 is large and the central portion is bent as described above. Even if a serious problem occurs, the problem can be solved effectively.

  Furthermore, in the above-described embodiment, the rectifying unit 31 of the dust suction mechanism 30 is disposed in a state of being separated from the vapor deposition thin film 82 of the solar cell substrate 80 by a predetermined distance. May be involved more than necessary. In such a case, a plurality of partition sections 32a (areas defined by the partition walls 52) of the rectifying unit 61 are surrounded like the dust suction mechanism 60 shown in FIG. You may make it attach to the outer peripheral part the elastic material 62 for preventing the entrainment of the air from the outside as a sealing material. As the elastic material 62, rubber, sponge, or the like can be used.

  Furthermore, in the above-described embodiment, each partition section 32a of the rectifying unit 31 of the dust suction mechanism 30 has a quadrangular prism shape (tubular shape), but is not limited thereto, and is not limited to a quadrangular prism shape (cylindrical shape). It is good also as arbitrary cylindrical shapes, such as cylindrical shape. Specifically, for example, as shown in FIG. 8A, each partition section 32a ′ of the rectifying unit 31 ′ is formed by overlapping a plurality of wave-shaped partition walls 32 ′, or FIG. As shown, each partition section 32a "of the rectifying section 31" may be formed as a honeycomb structure by the partition wall 32 "having an opening having a polygonal cross section. The partition 32a may be formed by combining a plurality of partition walls 32 as shown in FIGS. 3 and 4, or may be formed by partition walls 32 ′ and 32 ″ as shown in FIGS. However, the present invention is not limited to this, and it may be formed by arranging a plurality of independent cylindrical suction nozzles having thin sidewalls in close proximity.

  Further, in the above-described embodiment, the plurality of partition sections 32 a of the rectifying unit 31 of the dust suction mechanism 30 cover substantially the same size as the size of the processing surface on which the laser processing is performed in the vapor deposition thin film 82 of the solar cell substrate 80. In addition, the case where the dust suction mechanism 30 moves together with the solar cell substrate 80 in the XY plane has been described as an example. Of the deposited thin film 82 of the solar cell substrate 80, only a part near the laser processing point may be covered. In this case, it is preferable to hold the dust suction mechanism 30 without being fixed to the moving mechanism 20 so that the dust suction mechanism 30 comes close to the laser processing point regardless of the movement of the solar cell substrate 80.

  Further, in the embodiment described above, the relative positional relationship between the laser light L irradiated by the laser irradiation mechanism 10 and the solar cell substrate 80 is changed by moving the solar cell substrate 80 side by the moving mechanism 20. However, the present invention is not limited to this, and the laser beam L irradiated by the laser irradiation mechanism 10 is moved relative to the solar cell substrate 80 by moving the laser beam L irradiated by the laser irradiation mechanism 10. You may make it implement | achieve the change of a general positional relationship.

  Furthermore, in the above-described embodiment, the case where the laser processing point on the solar cell substrate 80 by the laser beam L irradiated by the laser irradiation mechanism 10 is one example has been described as an example. The present invention can be similarly applied when there are a plurality of laser processing points on the solar cell substrate 80 in order to increase the processing tact.

  Furthermore, in the above-described embodiment, the case where the two suction ducts 36 are connected to the tray portion 33 of the dust suction mechanism 30 (see FIGS. 1, 3 and 4) has been described as an example. Not limited to this, only one suction duct 36 may be connected to the receiving tray 33 (see FIGS. 5 to 7), or conversely, three or more suction ducts may be connected to the receiving tray 33. When three or more suction ducts are connected to the tray portion 33, the tray portion 33 is partitioned for each portion of the tray portion 33 to which the suction duct is connected, as shown in FIGS. Separation by the wall 35 is preferred.

1 is a perspective view showing an overall configuration of a laser processing apparatus according to an embodiment of the present invention. The enlarged view which shows the relationship between the to-be-processed substrate and the dust suction mechanism in the laser processing apparatus shown in FIG. The disassembled perspective view which shows the detail of the dust suction mechanism of the laser processing apparatus shown in FIG. Sectional drawing along the IV-IV line of the dust suction mechanism shown in FIG. The perspective view which shows the modification of the dust suction mechanism used for the laser processing apparatus shown in FIG. The perspective view which shows the other modification of the dust suction mechanism used for the laser processing apparatus shown in FIG. The perspective view which shows the further another modification of the dust suction mechanism used for the laser processing apparatus shown in FIG. The enlarged view which shows the modification of the rectification | straightening part of the dust suction mechanism used for the laser processing apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 5 Holding mechanism 10 Laser irradiation mechanism 11 Laser oscillator 12 Reflecting mirror 13 Condensing lens 20 Moving mechanism 21 X table 22 Y table 30,40,50,60 Dust absorption mechanism 31,31 ', 31 ", 41,51 , 61 Rectifier 32, 32 ', 32 ", 42, 52 Partition wall 32a, 32a', 32a", 42a, 52a Partition compartment 33 Sauce tray (suction unit)
33a Suction hole 34 Side wall 35 Partition wall 36 Suction duct 43 Upstream outer surface 62 of rectifying unit Elastic material 80 Solar cell substrate (substrate to be processed)
81 Glass substrate 81a 1st surface 81b 2nd surface 82 Deposition thin film L Laser beam D Processing dust

Claims (6)

In a laser processing apparatus for selectively removing a thin film at a desired site by irradiating a vapor deposition thin film formed on a substrate to be processed with laser light,
A holding mechanism for holding a transparent base material that transmits laser light and a substrate to be processed having a deposited thin film formed on the first surface of the base material;
A laser irradiation mechanism for irradiating a laser beam toward the vapor deposition thin film from the second surface side of the base material on which the vapor deposition thin film is not formed among the substrate to be processed held by the holding mechanism;
A moving mechanism that changes a relative positional relationship between the laser beam irradiated by the laser irradiation mechanism and the substrate to be processed;
Processing dust generated by laser processing on the vapor deposition thin film by the laser beam provided on the side where the vapor deposition thin film is formed in the substrate to be processed held by the holding mechanism. A dust suction mechanism
The dust suction mechanism is a rectifying unit arranged in a state of being separated from the vapor deposition thin film of the substrate to be processed by a predetermined distance, and has a plurality of cylindrical shapes extending along a normal direction of the substrate to be processed. It has a rectification part which has a partition section, and a suction part arranged on the downstream side of the rectification part, and a suction part which sucks the processing dust which passed through each partition section of the rectification part. Laser processing equipment.   2. The laser processing apparatus according to claim 1, wherein a height of each partition section of the rectifying unit is larger than half of a dimension of an opening portion of each partition section.   The plurality of partition sections of the rectifying unit cover substantially the same size as the size of the processed surface on which laser processing is performed in the vapor-deposited thin film of the substrate to be processed. 2. The laser processing apparatus according to 2.   The upstream outer surface formed by the upstream surface of the plurality of partition sections of the rectifying unit is curved along the surface shape of the deposited thin film of the substrate to be processed. The laser processing apparatus as described in any one of thru | or 3.   The plurality of partition sections of the rectifying unit are configured such that the direction of the dimension of the opening of the partition section on the outer peripheral side is larger than the dimension of the opening of the partition section on the center side. The laser processing apparatus according to any one of claims 1 to 3.   The member for preventing the entrainment of the air from the outside is attached to the outer peripheral portion surrounding the plurality of partition sections of the rectifying unit. The laser processing apparatus as described.

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