JP2007012483A - Male connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a male connector which can be fitted to a female connector certainly and, by making a connecting terminal contact an electrode terminal of the female connector, performs stable conduction of the connecting terminal and the electrode terminal. <P>SOLUTION: A groove 15 which exposes a first plated layer 18 made of nickel is formed in the direction crossing the extension direction of a male connecting terminal 5 by a width dimension W2 equal to or more than the width dimension W1 of the male connecting terminal 5 on a second plated layer 19 made of gold at a portion of the projection side portion 5b of the male connecting terminal 5 where the female connecting terminal 9 of a female connector 7 does not contact. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a male connector, and more particularly, a male connector in which one end of a male connection terminal is in contact with a female connection terminal of a female connector and the other end is conductively connected to an electrode terminal of a wiring component via solder. Related to mold connectors.

  Conventionally, as means for electrically connecting, for example, an electrode terminal of a printed circuit board, which is a wiring component, and an electrode terminal of another wiring component, means for electrically connecting the electrode terminals with a male connector and a female connector is known. ing.

  FIG. 4 is a schematic cross-sectional view showing an example of a conventional male connector and female connector.

  As shown in FIG. 4, the male connector 21 is provided with a convex portion 24 so as to protrude from the base 23 on one surface of the flat base 23. Furthermore, a plurality of male connection terminals 45 are provided along the outer surface of the convex portion 24 so as to reach the top surface of the convex portion 24 from one surface of the base body 23 through the side surface of the convex portion 24. The convex portion side portion 45 a of the connection terminal 24 is bent and extended in a direction away from the convex portion 24. Each male connection terminal 45 has a base conductive member made of a conductive material such as copper, and a plating layer made of a conductive material such as nickel or gold is laminated on the outer surface of the base conductive member.

  A female connector 27 mounted on a wiring component 28 made of a flexible wiring board or the like is detachably fitted to the male connector 21 mounted on the printed board 22. In the male connector 21, the female connector 27 is fitted into the male connector 21, so that the female connector 27 of the female connector 27 is placed on the protruding portion 45 b of each male connection terminal 45 of the male connector 21. The mold connection terminal 49 comes into contact with the electrode terminal 25 of the printed circuit board 22 and the electrode terminal 29 of the wiring component 28 conductively connected to one end portion of the female connection terminal 49. It is like that. Specifically, the base portion 45a of each male connection terminal 45 is fixed to a plurality of electrode terminals 25 formed on the printed circuit board 22 via solders 33, and is electrically connected thereto.

  However, in the male connector 21 as described above, in the step of fixing the base portion 45a of each male connection terminal 45 to the electrode terminal 25 of the printed circuit board 22 via the solder 33, each male connection terminal 45 is provided. When the solder 33 is disposed on the base-side portion 45a, as shown in FIG. 4, the solder 33 wets and spreads on the outer surface of each male connection terminal 45 and crawls in the direction of the convex-side portion 45b of each male connection terminal 45. It sometimes went up. In particular, when gold is used as the constituent material of the outermost plating layer among the plating layers, the solder 33 is easy to become familiar with the outermost plating layer, and the solder 33 is more protrusive side portion 45b of each male connection terminal 45. There was a risk of climbing in the direction of.

  Then, when the solder 33 crawls up to the portion where the female connection terminal 49 of the female connector 27 contacts with each male connection terminal 45, the male connector 21 and the female connector 27 are securely fitted. As a result, contact failure between each male connection terminal 45 of the male connector 21 and each female connection terminal 49 of the female connector 27 may occur, and stable conduction may not be achieved. was there.

  The present invention has been made in view of these points, and the female connector can be securely fitted, whereby the male connection terminal of the male connector can be securely connected to the female connection terminal of the female connector. It is an object of the present invention to provide a male connector that can be brought into contact with each other to achieve stable conduction between the connection terminals.

  In order to achieve the above object, the male connector according to the first aspect of the present invention has a base, a protrusion protruding from the base, and a male connection terminal provided along the protrusion. The male connection terminal includes a base conductive member and a plurality of plating layers stacked on the base conductive member, and the convex-side portion of the male connection terminal includes a female connector. In a male connector in which a female connection terminal is contacted, and an electrode terminal of a wiring component is conductively connected to the base-side portion of the male connection terminal, the male connection terminal is positioned at a predetermined position. Soldering prevention means is provided, and the predetermined position is a portion where the female connection terminal is not in contact with the convex side portion of the male connection terminal, and the base side portion of the male connection terminal Is the upper part Located in.

  According to the first aspect of the present invention, in the step of fixing the electrode terminal of the wiring component to the base portion of the male connection terminal of the male connector via the solder, the solder is applied to the base portion of the male connection terminal. When the solder is disposed, the solder that spreads out on the outer surface of the male connection terminal and spreads in the direction of the convex portion side can be stopped at the portion of the solder scum prevention means.

  The male connector according to claim 2 is characterized in that, as the solder leap prevention means, the outermost plating layer of the plurality of plating layers is laminated on the inner side of the outermost plating layer. The groove portion exposing the plated layer is formed in a direction intersecting with the extending direction of the male connection terminal.

  According to the second aspect of the present invention, in the step of fixing the electrode terminal of the wiring component to the base-side portion of the male connection terminal of the male connector via the solder, the base-side portion of the male connection terminal is soldered. When the solder is disposed, the solder that has spread out on the outer surface of the male connection terminal and spread in the direction of the convex portion side can be stopped in the groove portion where the inner plating layer is exposed. Here, since the groove portion is formed in a portion that does not contact the female connection terminal in the male connection terminal in a direction intersecting with the extending direction of the male connection terminal, the solder is formed in the female type in each male connection terminal. It is possible to prevent the female connection terminal of the connector from crawling up to the contact portion.

  The male connector according to claim 3 is characterized in that the outermost plating layer of the plurality of plating layers is a gold plating layer, and the plating layer is laminated inside the outermost plating layer. Is a nickel plating layer.

  According to the third aspect of the present invention, the nickel plating layer exposed in the groove portion is made of nickel, and nickel is less likely to become compatible with solder compared to gold constituting the gold plating layer. It is possible to more reliably prevent the solder from creeping up in the groove.

  Furthermore, the male connector according to the invention described in claim 4 is characterized in that the soldering prevention means is formed with a predetermined width dimension in a direction crossing the extending direction of the male connection terminal. The predetermined width dimension is that it is equal to or larger than the width dimension of the male connection terminal.

  According to the fourth aspect of the present invention, since the width dimension of the solder top prevention means such as the groove is equal to or larger than the width dimension of the male connection terminal, the solder creeping up is caused by the solder wrinkle such as the groove. The upper prevention means can be surely stopped. Thereby, it can prevent that a solder creeps up to the part which the female connection terminal of the female connector in each male connection terminal contacts.

  As described above, according to the male connector according to the present invention, the solder leap prevention means is formed in the portion of each male connection terminal that does not contact the electrode terminal of the female connector. It is possible to prevent the female connection terminal of the female connection terminal from climbing up to the portion where the female connection terminal contacts. As a result, the male connector and the female connector can be surely fitted to each other, and contact failure between each male connection terminal of the male connector and each female terminal of the female connector can be prevented, and stable conduction can be achieved. Can be achieved.

  Hereinafter, an embodiment of a male connector according to the present invention will be described with reference to FIGS.

  Here, in this embodiment, although demonstrated using the male connector currently formed in the printed circuit board, this invention is not limited to this.

  FIG. 1 is a schematic cross-sectional view showing a male connector and a female connector attached to the male connector according to the present embodiment.

  As shown in FIG. 1, a male connector 1 according to this embodiment is formed on one surface of a flat substrate 3 on a printed circuit board 2, and the male connector 1 includes a substrate 3 on one surface of the substrate 3. A rectangular parallelepiped convex portion 4 is provided so as to protrude.

  Further, in the male connector 1, a plurality of male connection terminals 5 protrude along the outer surface of the convex portion 4 so as to reach the top surface of the convex portion 4 from one surface of the base 3 through the side surface of the convex portion 4. The base-side portions 5 a of each male connection terminal 5 are bent and extended in a direction away from the convex portion 4.

  A female connector 7 mounted on a wiring component 8 made of a flexible wiring board or the like is detachably fitted to the male connector 1 of the printed circuit board 2. One end portion of the terminal 9 is conductively connected to the electrode terminal 10 of the wiring component 8. In such a male connector 1, the female connector 7 is fitted to the male connector 1, so that the female connector 7 is connected to the protruding portion 5 b of each male connection terminal 5. The terminals 9 are in contact with each other, whereby the male connection terminals 5 of the printed circuit board 2 and the female connection terminals 9 of the wiring component 8 are conductively connected.

  In addition, a plurality of electrode terminals 12 formed on a wiring component 11 made of another flexible wiring board or the like are fixed to the base portion 5 a of each male connection terminal 5 via solder 13. Thus, each male connection terminal 5 and each electrode terminal 12 of the wiring component 11 are electrically connected.

  As shown in FIG. 2, each male connection terminal 5 of the male connector 1 has a base conductive member 17 made of a conductive material such as copper, and the base conductive member 17 is disposed on the outer surface of the base conductive member 17. A first plating layer 18 made of a conductive material such as nickel is formed so as to cover the surface. Further, a second plating layer 19 made of a conductive material such as gold is formed on the outer surface of the base conductive member 17 so as to be laminated on the first plating layer 18.

  In the second plating layer 19, which is the outermost plating layer among the plating layers, is a portion where the female connection terminal 9 of the female connector 7 is not in contact with the convex-side portion 5 b of each male connection terminal 5. A groove portion 15 for exposing the first plating layer 18 is formed.

  As shown in FIG. 3, the groove 15 is formed on the entire circumference of the side surface of the male connection terminal 5 in a direction intersecting with, preferably perpendicular to, the extending direction of the male connection terminal 5. In the present embodiment, the groove 15 is formed on the entire circumference of the male connection terminal 5, but is not limited to this, and at least contacts the convex portion 4 of each male connection terminal 5. It suffices if it is formed in a portion that is not.

  The groove 15 is formed with a predetermined width dimension W2 in a direction intersecting with the extending direction of the male connection terminals 5, and the predetermined width dimension W2 is equal to or greater than the width dimension W1 of each male connection terminal 5. For example, it is formed with a width dimension W2 of 0.1 mm.

  And this groove part 15 is formed by laminating | stacking the 2nd plating layer 19 on the 1st plating layer 18 of each male connection terminal 5, masking a predetermined part.

  Next, the operation of this embodiment will be described.

  According to this embodiment, in the step of fixing the electrode terminal 12 of the wiring component 11 to the base-side portion 5 a of each male connection terminal 5 of the male connector 1 via the solder 13, When the solder 13 is disposed on the base-side portion 5a, the solder 13 that wets and spreads on the outer surface of each male connection terminal 5 and scoops up in the direction of the convex-side portion 5b is formed in the groove portion in which the first plating layer 18 is exposed. 15 can be stopped. Here, the groove portion 15 is formed in a portion of each male connection terminal 5 that does not contact the female connection terminal 9 of the female connector 7 in a direction orthogonal to the extending direction of the male connection terminal 5. It is possible to prevent the solder 13 from creeping up to the portion where the female connection terminal 9 of the female connector 7 in each male connection terminal 5 contacts.

  Therefore, the male connector 1 and the female connector 7 can be reliably fitted, and contact failure between each male connection terminal 5 of the male connector 1 and each female connection terminal 9 of the female connector 7 can be prevented. And stable conduction can be achieved.

  Further, the first plating layer 18 exposed in the groove portion 15 is made of nickel, and nickel is less likely to be intimate with the solder 13 as compared with gold constituting the second plating layer 19. It is possible to efficiently prevent 13 scooping.

  Further, the groove portion 15 is formed with a width dimension W2 that is equal to or greater than the width dimension W1 of the male connection terminal 5, whereby the scooping up of the solder 13 can be reliably stopped in the groove portion 15, It is possible to prevent the solder 13 from creeping up to the portion of the connection terminal 5 where the female connection terminal 9 of the female connector 7 contacts.

  In addition, this invention is not limited to the said embodiment, A various change is possible as needed.

  For example, in the present embodiment, the first plating layer 18 made of nickel or the like and the second plating layer 19 made of gold or the like are described as the plurality of plating layers of the male connection terminal 5. The material is not limited, and a plurality of layers may be used, and the constituent material of the plating layer is not limited to the present embodiment.

1 is a schematic cross-sectional view showing an embodiment of a male connector according to the present invention and a female connector fitted to the male connector. Typical sectional drawing which shows the principal part of the connecting terminal of the male connector of FIG. The typical perspective view which shows the principal part in the connecting terminal of the male connector of FIG. Typical sectional drawing which shows an example of the conventional male connector and female connector

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Male connector 2 Printed circuit board 3 Base | substrate 4 Convex part 5 Male type | mold connection terminal 5a Base | substrate side part 5b Convex part side part 7 Female connector 8 Wiring part 9 Female type | mold connection terminal 11 Wiring part 12 Electrode terminal 13 Solder 15 Groove part 17 Base Conductive member 18 First plating layer 19 Second plating layer

Claims (4)

A base, a protrusion protruding from the base, and a male connection terminal provided along the protrusion;
The male connection terminal includes a base conductive member and a plurality of plating layers provided to be laminated on the base conductive member,
The female connection terminal of the female connector is in contact with the convex side portion of the male connection terminal, and the electrode terminal of the wiring component is conductively connected to the base portion of the male connection terminal. In the male connector that is
Solder soldering prevention means is disposed at a predetermined position of the male connection terminal, and the predetermined position is a portion where the female connection terminal is not in contact with the convex portion side portion of the male connection terminal, A male connector, wherein the male connector is a portion above the base-side portion of the male connection terminal.   The solder top prevention means includes a groove portion that exposes a plating layer laminated inside the outermost plating layer on the outermost plating layer of the plurality of plating layers, and the extending direction of the male connection terminal. The male connector according to claim 1, wherein the male connector is formed in a direction intersecting with the connector.   3. The male connector according to claim 1, wherein the outermost plating layer of the plurality of plating layers is a gold plating layer, and the plating layer laminated on the inner side of the outermost plating layer is a nickel plating layer. The solder leap prevention means is formed with a predetermined width dimension in a direction intersecting with the extending direction of the male connection terminal, and the predetermined width dimension is not less than the width dimension of the male connection terminal. The male connector according to claim 1, 2, or 3.

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