JP2007193396A - Manufacturing method of antenna sheet for non-contact IC tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method in which an IC chip does not cause electrostatic breakdown in an antenna sheet manufacturing process, particularly at a stage of mounting an IC chip on an antenna.
The method of manufacturing an antenna sheet for a non-contact IC tag includes the step of manufacturing an antenna sheet for a non-contact IC tag, forming an antenna pattern on a base film 11 by a wet etching method, and then applying an antistatic agent to the film. The antenna pattern surface is applied, and then an IC chip is mounted on the end of the antenna pattern.
The surface resistivity of the base film 11 after application of the antistatic agent is preferably 10 ⁶ Ω / □ or more and 10 ¹³ Ω / □ or less.
[Selection] Figure 1

Description

The present invention relates to a method of manufacturing an antenna sheet for a non-contact IC tag. Specifically, in the process of manufacturing an antenna sheet for a non-contact IC tag, an antistatic agent is applied to the film immediately before mounting the IC chip after the antenna pattern is formed on the base film. It is related to a manufacturing method that can be safely implemented without receiving any damage.
Therefore, the technical field of the present invention is the field of manufacturing non-contact IC tags and antenna sheets.

Non-contact IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so they are widely used as a recognition medium in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be.
Such non-contact IC tags are often manufactured by forming an antenna pattern on a sheet or film and then mounting an IC chip on both ends of the antenna pattern. However, when the IC chip is mounted, if the sheet or film is charged by static electricity, there is a problem that the IC chip is destroyed by static electricity. Normally, an IC chip interface is provided with a mechanism for preventing an overvoltage. However, when an overvoltage of 1 Kv or more is applied, the overvoltage prevention mechanism is also destroyed.
Static electricity charging is not limited to the destruction of the IC chip itself, but the sheet or film supplied in a continuous state is charged. There is also a problem that it occurs.

In general production, the sheet or film is first coated with an antistatic agent and then processed, but the non-contact IC tag production process is wet etching. In such a sheet, after the antenna pattern is formed, the antistatic agent flows out due to an acid or alkali such as a resist remover and the effect is often lost.
In addition, it is conceivable to knead an antistatic agent into a sheet or the like, but the kneaded sheet or the like has a problem that the antistatic agent bleeds to the surface and the effect becomes unstable. There is also a problem that the antistatic agent that has bleed adheres to the rollers of the production facility and impairs the quality of subsequent products. Under such circumstances, sheet manufacturers seem to refrain from producing kneaded substrates.
Therefore, the present invention proposes a method for producing an antenna sheet for a non-contact IC tag, which includes a step of applying an antistatic agent to a sheet or the like immediately before the IC chip mounting.

  Although the prior art regarding the manufacturing method of the antenna sheet for non-contact IC tags as described above cannot be detected, there are Patent Documents 1 to 3 and the like regarding the manufacturing method of the antistatic film. Both relate to a method for producing an antistatic polyester film, but are not directly related to the present application.

JP 59-202852 A Japanese Patent No. 2563221 Japanese Patent No. 3105343

In the conventional method of manufacturing an antenna sheet for a non-contact IC tag, a base film that has not been subjected to antistatic treatment is used, so that there is a problem that the IC chip is damaged due to a failure caused by static electricity when the IC chip is mounted. . Even when the IC chip is not destroyed, there is a problem that the film charged on the roller of the processing machine is wound and the rotation stops, or dust or dust adheres to the film and the product value is lost. On the other hand, in the film or sheet coated with the antistatic treatment agent, the treatment agent flows out and loses its effect during the wet etching process before mounting the IC chip.
Therefore, the present application has been completed to complete the present invention by studying to solve such problems in the manufacture of antenna sheets for non-contact IC tags.

  The gist of the present invention for solving the above problems is that, in the process of manufacturing an antenna sheet for a non-contact IC tag, an antenna pattern is formed on the base film by an etching method, and then an antistatic agent is applied to the base film surface. And a method of manufacturing an antenna sheet for a non-contact IC tag, wherein an IC chip is mounted on an end portion of the antenna pattern.

In the above, the surface resistivity of the base film after application of the antistatic agent is 10 ⁶ Ω / □ or more and 10 ¹³ Ω / □ or less, neither electrostatic breakdown nor short circuit occurs, This is a preferable value as an antenna sheet for a non-contact IC tag. The antistatic agent can be applied by a dipping method or a spray method, and if the antistatic agent coating solution is an aqueous solution, it can be efficiently applied with excellent environmental performance.

In the method for manufacturing an antenna sheet for a non-contact IC tag according to the present invention, an anti-static agent is applied to the antenna pattern surface of the film after the antenna pattern is formed on the base film by a wet etching method. The IC chip is not charged and the IC chip is not subject to electrostatic breakdown.
In addition, since the base film can be prevented from being charged in the subsequent laminating process, there are also advantages that it is possible to prevent the roller from being caught by charging the sheet or film, and to prevent dust and dust from adhering to the non-contact IC tag.

The present invention relates to a method for producing an antenna sheet for a non-contact IC tag according to the present invention.
There are various types of contactless IC tags, but in general, an antenna pattern is formed on a base film, an IC chip is mounted on the antenna pattern, and the antenna pattern surface of the antenna sheet and the IC chip are protected. Usually, the surface is coated with a surface protective sheet. A sheet in which an antenna pattern is formed on the base film and an IC chip is mounted is generally referred to as an antenna sheet (or inlet base).
This antenna pattern may be used by printing with conductive ink or by winding a thin wire in a coil shape, but a method of forming a metal foil laminated on a base film by wet etching is efficient. In addition, it is widely used because an antenna with high accuracy can be obtained. The present invention also relates to the method.

First, the form of the non-contact IC tag will be described. As shown in FIG. 3, the non-contact IC tag 1 has a planar form in which a coiled antenna pattern 2 is formed on a base helmet 11 and IC chips 3 are mounted on both ends 2a and 2b of the antenna pattern.
The thing of FIG. 3 is the figure seen from the surface side which adheres to a to-be-adhered body by etching the metal foil laminated on the transparent base film 11, and forming the antenna pattern 2. FIG. One end of the antenna pattern 2 is connected to the back surface of the base film 11 to the conducting member 17 using a caulking tool or the like so as to communicate with the end portion 2 a connected to the IC chip 3. The IC chip 3 has pads connected to both ends 2a and 2b of the antenna pattern 2 by an anisotropic conductive adhesive or the like.

  As shown in FIG. 4, the cross section of the non-contact IC tag 1 is obtained by laminating the surface protection sheet 4 on the surface of the antenna pattern 2 of the base film 11 via the adhesive layer 5 and is opposite to the antenna pattern 2 of the base film 11. In general, the adhesive layer 7 is provided on the side surface, and the adhesive layer 7 is generally protected by a release paper 8. However, the non-contact IC tag may not be used after being attached to an article.

The manufacturing process of the non-contact IC tag will be described below with reference to the drawings.
FIG. 1 is a diagram showing an etching process, and FIG. 2 is a diagram showing an antistatic agent coating process.

FIG. 1 is a diagram showing an etching process, FIG. 1 (A) shows a state after an etching resist is formed on a base film with an aluminum foil, and FIG. 1 (B) shows a state after etching. . In either case, a continuous base film is used.
As shown in FIG. 1 (A), a base material obtained by laminating an aluminum foil 11a on a base film 11 is prepared, and an etching resist 10 is printed and dried on the base film 11, and then the resist 10 is etched with an etching solution such as iron chloride. Etch the exposed aluminum foil.

The metal foil used for the antenna is not limited to aluminum foil, and copper foil or the like is also used. A thickness of about 20 μm to 35 μm is often used.
Note that a photoresist may be used as the resist. However, in the case of a printing method, there are advantages that a photomask is not used and steps such as resist coating and exposure can be simplified. In addition, the resist after etching may be left as it is as a corrosion-resistant film without being removed.
After the etching, if the resist is removed and washed, the antenna pattern 2 is formed on the base film 11 and remains as shown in FIG. When the IC chip 3 is attached to the ends 2a and 2b of the antenna pattern 2, an electrostatic failure occurs.

FIG. 2 is a diagram showing an antistatic agent coating process, which is a feature of the present invention.
FIG. 2A shows a dipping method in which the continuous base film 11 after the antenna pattern 2 is formed is dipped in an antistatic agent diluent 6 in a coating tank 12 and dipped. The application method is not limited to the dipping method, and may be a roller or gravure coating method (FIG. 2B) or a spray method (FIG. 2C).
In the case of the gravure coating method, the gravure roll 13 and the backup roll 15 are used, and the antistatic agent is applied to the base film 11 while scraping off the excess coating diluent 6 with the doctor knife 14. Spray methods include air spray, airless spray, and electrostatic. The air spray utilizes the principle of spraying, and sprays the diluted solution 6 together with the compressed air from the spray gun 16 onto the base film 11. The airless spray is a liquefied atomization method in which air is not used and pressure is applied to the liquid agent 6 of the diluent 6 so as to be discharged as fine particles from a small nozzle.

The application surface may be both surfaces of the base film 11 or only one surface of the antenna pattern 2 side. Even on the back surface, an antistatic effect is produced, but in order to obtain a constant surface resistivity, the antenna pattern 2 side is preferable. In the case of dipping, of course, both sides are applied, but there are cases where a coating method in which only one side is applied, such as roller coating or gravure coating, is preferable because the influence of the coating agent does not remain on the other side surface.
After coating, the base film 11 is wound up by drying by blowing air, or IC chip mounting in the next process is performed in-line.

Next, an IC chip is mounted. The IC chip 3 is mounted on both ends 2a and 2b of the coil of the antenna pattern 2. Each IC chip 3 is gripped and fixed to both ends 2a and 2b of the antenna pattern 2 stopped at a predetermined position by a picking machine.
An anisotropic conductive adhesive sheet is laminated in advance on both ends 2a and 2b of the coil, or the adhesive sheet is laminated on the bump side of the IC chip. Alternatively, an anisotropic conductive adhesive may be used. After the IC chip 3 is positioned and fixed, electrical connection is made by heating and pressing using a jig to such an extent that the bumps of the IC chip 3 are in contact with both end portions 2a and 2b.
In some cases, the bumps are sharpened and bite into both end portions 2a and 2b. Even when the bumps are not completely in contact with each other, an anisotropic conductive material is used, so that electrical connection is made.
The mounting process of the IC chip 3 as described above is also described in detail in Japanese Patent Application Laid-Open No. 2001-143036.
The process of connecting one end of the coil to the end 2a from the back surface of the base material via the conducting member 17 is also performed. The antenna sheet is completed through the above steps.

  Next, the surface protective sheet 4 is laminated on the surface of the antenna pattern 2 of the base film 11. For the purpose of protecting the antenna and the IC chip, display printing is applied to the surface at the same time. When the IC tag is in a label form, a process of providing the adhesive layer 7 and the release paper 8 on the back side of the base film 11 is performed. The completed label-like non-contact IC tag is in the form of the plan view of FIG. 4 and the cross-sectional view of FIG.

After the antistatic agent is applied and dried, the surface resistivity of the plastic film is 10 ⁶ Ω / □ or more and 10 ¹³ Ω / □ or less at 23 ° C. and 50% RH (relative humidity). It is preferable that If the value exceeds 10 ¹³ Ω / □, the static electricity diffusion effect is extremely reduced and the film is easily charged, and the IC chip may be destroyed. Further, if it is less than 10 ⁶ Ω / □, a short circuit occurs between the antenna wires, and the antenna characteristics deteriorate.
Generally, a PET film is used as the plastic, but the above-described resistivity can be achieved under predetermined coating conditions. The same applies to other films.

Also, when applied to the conductive pattern surface (antenna surface), the surface resistivity of aluminum is preferably 2 mΩ / □ or more and 4 mΩ / □ or less at 23 ° C. and 50% RH. . This is because when the value exceeds 4 mΩ / □, the resistivity between the pads of the IC chip 3 becomes too large. In addition, less than 2 mΩ / □ cannot usually be realized.
The surface resistivity can be measured according to JIS K-6911.

As another test method, there is a method of charging the base film 11 with a charge and saturating it, and measuring a time during which the saturated charge decays to a half value. In this case, the half-life is preferably within 1 hour. The shorter the half-life, the faster the static electricity will diffuse. Since the amount of charge is the difference between the amount of charge generated and the amount of attenuation, there are two methods for eliminating the obstacles caused by charging: a method for suppressing charge generation and a method for promoting charge attenuation. Belonging to.
The charge decay time can be measured with a Static Decay Meter-40C manufactured by ETS in accordance with MIL-B-81705C, and the decay time under 23 ± 5 ° C. and 12 ± 3% RH. .

Examples of the antistatic agent used include anionic, cationic, nonionic, and amphoteric surfactants, fatty acid derivatives, and tetrafunctional silicon partial hydrolysates. The majority of these are water soluble.
The anionic surfactants include sulfated oils, soaps, sulfated ester oils, sulfated amide oils, olefinic sulfate salts, fatty alcohol sulfate esters, alkyl sulfate esters, fatty acid ethyl sulfonates, alkyls. Examples thereof include sulfonic acid salts, alkylbenzene sulfonic acid salts, mixtures of naphthalene sulfonic acid and formalin, succinic acid ester sulfonic acid salts, and phosphoric acid ester salts.

Examples of the cationic surfactant include a primary amine salt, a tertiary amine salt, a quaternary ammonium compound, and a pyridine derivative.
Nonionic surfactants include partial fatty acid esters of polyhydric alcohols, fatty acid ethylene oxide adducts, fatty acid ethylene oxide adducts, fatty amino or fatty acid amide ethylene oxide adducts, and alkylphenol ethylene oxides. Examples include adducts, ethylene oxide adducts of alkyl naphthols, ethylene oxide adducts of partial fatty acid esters of polyhydric alcohols, and the like.
Furthermore, examples of amphoteric surfactants include carboxylic acid derivatives and imidazoline derivatives.

  Although not commercially available as antistatic agents, some that are marketed as softeners for laundry include cationic active agents. Such a soft finish or a detergent or spray containing the soft finish may be effective as the antistatic agent of the present invention.

<Other materials>
(1) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(2) Surface protection sheet A wide variety of plastic films and paper substrates can be used. As the plastic film, those listed above can be used, and as the paper substrate, the following can be used. When performing printer printing on the surface, paper substrates such as fine paper and coated paper are particularly preferable.
Fine paper, coated paper, kraft paper, glassine paper, synthetic paper, latex and melamine impregnated paper.

Hereinafter, actual embodiments will be described using examples.
As the base film 11, a web-like substrate obtained by dry laminating a 25 μm thick aluminum foil on a transparent biaxially stretched PET film having a thickness of 38 μm was used, and a printing resist was screen-printed in an antenna pattern (see FIG. 1).
Next, the exposed aluminum part was photo-etched with an iron chloride solution to complete the base film 11 having the antenna pattern 2 as shown in FIG. The antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

The base film 11 was dipped in an antistatic agent aqueous solution and applied by dipping. As the antistatic agent, “Staticite RE” manufactured by ACL, USA was used. A commercial product of the antistatic agent is a 2.0% aqueous solution, which was further diluted 10 times.
After passing the base film 11 through the coating solution tank 12, it was dried by air blowing and wound up once. Thereafter, the IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was continuously mounted on both ends 2 a and 2 b of the antenna pattern 2 of the base film 11.
There was no electrostatic failure (spark) between the IC chip 3 and the base film or between the antennas during mounting, and the subsequent processability was good, and there were no phenomena such as roller winding and dust adhesion.

The surface resistivity of the PET film surface after applying and drying the antistatic agent was measured with a resistivity meter (“MCP-HT260” manufactured by Mitsubishi Chemical Corporation) at 23 ° C. and 50% RH. The range was from 10 ¹⁰ Ω / □ to 10 ¹² Ω / □. The surface resistivity of the aluminum surface of the antenna was in the range of 2 mΩ / □ to 4 mΩ / □.

It is a figure which shows an etching process. It is a figure which shows the application | coating process of an antistatic agent. It is a top view of a non-contact IC tag. It is a schematic cross section of a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 2 Antenna pattern 3 IC chip 4 Surface protection sheet 5 Adhesive layer 6 Antistatic agent dilution liquid 7 Adhesive layer 8 Release paper 10 Resist 11 Base film 12 Liquid tank 17 Conductive member

Claims (4)

In the process of manufacturing an antenna sheet for a non-contact IC tag, after forming an antenna pattern on the base film by an etching method, an antistatic agent is applied to the base film surface, and then an IC chip is attached to the end of the antenna pattern. A method of manufacturing an antenna sheet for a non-contact IC tag, characterized by being mounted. 2. The antenna sheet for a non-contact IC tag according to claim 1, wherein the surface resistivity of the base film after application of the antistatic agent is 10 ⁶ Ω / □ or more and 10 ¹³ Ω / □ or less. The manufacturing method. 3. The method for producing an antenna sheet for a non-contact IC tag according to claim 1, wherein the antistatic agent is applied by dipping or spraying. The method for producing an antenna sheet for a non-contact IC tag according to claim 1 or 2, wherein the coating solution of the antistatic agent is an aqueous solution.

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