JP2007109947A - Phosphor plate and light-emitting device provided with the same - Google Patents
Phosphor plate and light-emitting device provided with the same Download PDFInfo
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- JP2007109947A JP2007109947A JP2005300314A JP2005300314A JP2007109947A JP 2007109947 A JP2007109947 A JP 2007109947A JP 2005300314 A JP2005300314 A JP 2005300314A JP 2005300314 A JP2005300314 A JP 2005300314A JP 2007109947 A JP2007109947 A JP 2007109947A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
Description
本発明は、発光素子から発せられる光を受けて励起されることにより波長変換光を発する蛍光体板及びこれを備えた発光装置に関する。 The present invention relates to a phosphor plate that emits wavelength-converted light when excited by receiving light emitted from a light-emitting element, and a light-emitting device including the phosphor plate.
周知のように、単一の発光ダイオード（Light Emitting Diode：ＬＥＤ）素子から発せられる光と、この光で蛍光体が励起されて発する波長変換光との混合により白色光を得ることができる発光装置が実用化されている。 As is well known, a light emitting device capable of obtaining white light by mixing light emitted from a single light emitting diode (LED) element and wavelength converted light emitted by exciting a phosphor with this light. Has been put to practical use.
一般に、この種の発光装置には、光取出側に開口するケースを有するパッケージと、ケース内に収容されたＬＥＤ素子と、ＬＥＤ素子をケース内で封止する蛍光体含有の封止部材とを備えたものが知られている。 Generally, this type of light emitting device includes a package having a case that opens to the light extraction side, an LED element housed in the case, and a phosphor-containing sealing member that seals the LED element in the case. What you have is known.
このような発光装置においては、ＬＥＤ素子として青色光を発する青色ＬＥＤ素子であり、また蛍光体として青色光で励起されて黄色光を発する蛍光体であると、ＬＥＤ素子から発せられる青色の励起光と蛍光体から発せられる黄色の波長変換光との混合により白色光が得られる。 In such a light emitting device, a blue LED element that emits blue light as an LED element, and a phosphor that is excited by blue light and emits yellow light as a phosphor, emits blue excitation light emitted from the LED element. Is mixed with yellow wavelength-converted light emitted from the phosphor to obtain white light.
しかし、このような発光装置においては、ＬＥＤ素子から様々な方向に発せられる各光の行路長が蛍光体含有の封止部材内で一定でなく、このため色むらが生じるという不都合がある。 However, in such a light-emitting device, the path length of each light emitted from the LED element in various directions is not constant in the phosphor-containing sealing member, and thus there is a disadvantage that color unevenness occurs.
そこで、上述した不都合を回避するために、蛍光板層の厚さを一定の寸法に設定し、各光の行路長を蛍光体層内で一定の寸法に近づけて色むらを改善することができる発光装置が従来から提案されている（例えば特許文献１参照）。 Therefore, in order to avoid the inconveniences described above, the thickness of the fluorescent plate layer is set to a constant dimension, and the light emission that can improve the color unevenness by making the path length of each light close to a constant dimension in the phosphor layer An apparatus has been conventionally proposed (for example, see Patent Document 1).
このような発光装置は、光取出側に開口するケースと、このケース内に収容されたＬＥＤ素子と、このＬＥＤ素子の光取出側に配置された蛍光体層を有するカバーとを備えている。
しかしながら、特許文献１においては、カバー（蛍光体板）が単一層で形成されているため、上記した色むらを改善するために蛍光体層の厚さを過度に薄い寸法に設定すると、蛍光体層（カバー）の機械的強度が低下するという問題があった。 However, in Patent Document 1, since the cover (phosphor plate) is formed of a single layer, if the thickness of the phosphor layer is set to an excessively thin dimension in order to improve the color unevenness described above, the phosphor There was a problem that the mechanical strength of the layer (cover) was lowered.
また、カバー（蛍光体板）が単一層で形成されていることは、ＬＥＤ素子からの光がカバーに入射すると同時に蛍光体層に到達することになり、このため蛍光体層が劣化し易くなる。この結果、長期間にわたって輝度の高い光を得ることができず、近年における大出力化に応じることができないという問題もあった。 In addition, the fact that the cover (phosphor plate) is formed as a single layer means that the light from the LED element enters the cover and reaches the phosphor layer at the same time, and therefore the phosphor layer is likely to deteriorate. . As a result, there is a problem that light with high luminance cannot be obtained over a long period of time and it is not possible to respond to the increase in output in recent years.
従って、本発明の目的は、機械的強度の低下を抑制することができる蛍光体及び近年における大出力化に応じることができる発光装置を提供することにある。 Accordingly, an object of the present invention is to provide a phosphor capable of suppressing a decrease in mechanical strength and a light emitting device capable of responding to the recent increase in output.
（１）本発明は、上記目的を達成するために、発光素子の光取出側に配設され、光透過性材料からなる基部材と、前記基部材の光取出側に配設され、前記発光素子から発せられる光を受けて励起されることにより波長変換光を発する蛍光体層とを備えたことを特徴とする蛍光体板を提供する。 (1) In order to achieve the above object, the present invention is disposed on a light extraction side of a light emitting element, and is disposed on a light extraction side of the base member, and a base member made of a light transmissive material. Provided is a phosphor plate comprising a phosphor layer that emits wavelength-converted light when excited by receiving light emitted from an element.
（２）本発明は、上記目的を達成するために、光取出側に開口するケースと、前記ケースの光取出側に配設された蛍光体板と、前記蛍光体板の光反取出側に配設され、かつ前記ケース内に収容された発光素子とを備えた発光装置において、前記蛍光体板は、上記（１）に記載の蛍光体板であることを特徴とする発光装置を提供する。 (2) In order to achieve the above object, the present invention provides a case opening on the light extraction side, a phosphor plate disposed on the light extraction side of the case, and a light anti-extraction side of the phosphor plate. A light emitting device comprising a light emitting element disposed and housed in the case, wherein the phosphor plate is the phosphor plate described in (1) above. .
本発明によると、蛍光体板における機械的強度の低下を抑制することができるとともに、近年における発光装置の大出力化に応じることができる。 According to the present invention, it is possible to suppress a decrease in mechanical strength of the phosphor plate, and it is possible to respond to the increase in output of the light emitting device in recent years.
[第１の実施の形態]
図１は、本発明の第１の実施の形態に係る蛍光体板を備えた発光装置を説明するために示す断面図である。
[First embodiment]
FIG. 1 is a cross-sectional view for explaining a light emitting device provided with a phosphor plate according to a first embodiment of the present invention.
〔発光装置１の全体構成〕
図１において、発光装置１は、素子収容用のパッケージ２と、このパッケージ２内に収容されたＬＥＤ素子３と、パッケージ２内に充填されてＬＥＤ素子３を封止する封止部材８と、ＬＥＤ素子３の光取出側に封止部材８を覆うように配置された蛍光体板９とから大略構成されている。
[Overall configuration of light-emitting device 1]
In FIG. 1, a light emitting device 1 includes an element housing package 2, an LED element 3 housed in the package 2, a sealing member 8 that fills the package 2 and seals the LED element 3, The phosphor plate 9 is generally configured to cover the sealing member 8 on the light extraction side of the LED element 3.
（パッケージ２の構成）
パッケージ２は、ＬＥＤ素子３を収容可能なケース５と、ケース５の一方側（図１では下側）開口部を覆う素子搭載基板６とを有している。
(Configuration of package 2)
The package 2 includes a case 5 that can accommodate the LED element 3 and an element mounting substrate 6 that covers an opening on one side (lower side in FIG. 1) of the case 5.
<ケース５の構成>
ケース５は、基板側から光取出側に向かって開口する平面円形状の内部空間５Ａを有し、全体が例えばアルミナ（Ａｌ2Ｏ3）等のセラミックス材料からなる箱体によって形成されている。ケース５の材料としては、Ａｌ2Ｏ3の他にシリコン（Ｓｉ）や窒化アルミニウム（ＡｌＮ）あるいは白色樹脂が用いられる。ケース５内には、ＬＥＤ素子３からの光を光取出側に反射するための傾斜面５ａが設けられている。内部空間５Ａの光取出側には、蛍光体板９を取り付けるための段状面５ｂが設けられている。内部空間５Ａには封止部材８が充填されている。
<Configuration of Case 5>
The case 5 has a planar circular internal space 5A that opens from the substrate side toward the light extraction side, and is entirely formed of a box made of a ceramic material such as alumina (Al 2 O 3 ). As a material of the case 5, silicon (Si), aluminum nitride (AlN), or white resin is used in addition to Al 2 O 3 . In the case 5, an inclined surface 5a for reflecting light from the LED element 3 to the light extraction side is provided. A stepped surface 5b for attaching the phosphor plate 9 is provided on the light extraction side of the internal space 5A. A sealing member 8 is filled in the internal space 5A.
<素子搭載基板６の構成>
素子搭載基板６はＡｌ2Ｏ3のセラミックス材料によって形成されている。素子搭載基板６の材料としては、Ａｌ2Ｏ3の他に、ＳｉやＡｌＮあるいは白色樹脂が用いられる。素子搭載基板６の光取出側面（表面）には、ＬＥＤ素子３のｐ側電極及びｎ側電極（共に図示せず）にそれぞれ金（Ａｕ）からなるボンディングワイヤ１２，１３を介して接続する第１配線パターン１４，１５が設けられている。素子搭載基板６の実装側面（裏面）には、ＬＥＤ素子３に対して電源電圧を供給するための第２配線パターン１６，１７が設けられている。そして、第１配線パターン１４と第２配線パターン１６と及び第１配線パターン１５と第２配線パターン１７とは、それぞれ素子搭載基板６を貫通するビアホール１９，２０内に充填されたビアパターン２２，２３により電気的に接続されている。第１配線パターン１４，１５及び第２配線パターン１６，１７は、例えばタングステン（Ｗ），モリブデン（Ｍｏ）等の高融点金属によりビアパターン２２，２３と一体的に形成されている。
<Configuration of element mounting substrate 6>
The element mounting substrate 6 is made of an Al 2 O 3 ceramic material. As a material for the element mounting substrate 6, Si, AlN, or white resin is used in addition to Al 2 O 3 . A light extraction side surface (front surface) of the element mounting substrate 6 is connected to a p-side electrode and an n-side electrode (both not shown) of the LED element 3 via bonding wires 12 and 13 made of gold (Au), respectively. One wiring patterns 14 and 15 are provided. Second wiring patterns 16 and 17 for supplying a power supply voltage to the LED element 3 are provided on the mounting side surface (back surface) of the element mounting substrate 6. The first wiring pattern 14 and the second wiring pattern 16, and the first wiring pattern 15 and the second wiring pattern 17 are respectively filled in via holes 19 and 20 penetrating the element mounting substrate 6, 23 is electrically connected. The first wiring patterns 14 and 15 and the second wiring patterns 16 and 17 are integrally formed with the via patterns 22 and 23 using a high melting point metal such as tungsten (W) or molybdenum (Mo).
なお、第１配線パターン１４，１５及び第２配線パターン１６，１７の表面には、ニッケル（Ｎｉ），アルミニウム（Ａｌ），白金（Ｐｔ），チタン（Ｔｉ），Ａｕ，銀（Ａｇ），銅（Ｃｕ）など単層又は積層あるいは半田材料による金属層が必要に応じて形成される。 Note that nickel (Ni), aluminum (Al), platinum (Pt), titanium (Ti), Au, silver (Ag), copper are formed on the surfaces of the first wiring patterns 14 and 15 and the second wiring patterns 16 and 17. A single layer such as (Cu) or a laminated or metal layer made of a solder material is formed as necessary.
（封止部材８の構成）
封止部材８は、シリコーン等の光透過性樹脂材料からなり、素子搭載基板６と蛍光体板９との間に配置され、ケース５内でＬＥＤ素子３を封止するように構成されている。封止部材８の材料としては、シリコーンの他に、エポキシ等の樹脂材料やＮ2，Ａｒ等の不活性ガスが用いられる。
(Configuration of sealing member 8)
The sealing member 8 is made of a light transmissive resin material such as silicone, and is arranged between the element mounting substrate 6 and the phosphor plate 9 and configured to seal the LED element 3 in the case 5. . As a material of the sealing member 8, in addition to silicone, a resin material such as epoxy or an inert gas such as N 2 or Ar is used.
（ＬＥＤ素子３の構成）
ＬＥＤ素子３は、ｐ側電極及びｎ側電極を有するフェイスアップ型の青色ＬＥＤ素子からなり、パッケージ２内の封止部材８によって封止され、かつ素子搭載基板６上に接着剤１００によって搭載されている。ＬＥＤ素子３は、サファイア（Ａｌ2Ｏ3）基板上にＡｌＮからなるバッファ層及びｎ型半導体（ｎ−ＧａＮ）層・発光層・ｐ型半導体（ｐ−ＧａＮ）層を順次結晶成長させることにより形成されている。ＬＥＤ素子３の平面縦横寸法は、例えば縦寸法及び横寸法をそれぞれ約１ｍｍとする平面サイズに設定されている。
(Configuration of LED element 3)
The LED element 3 is composed of a face-up type blue LED element having a p-side electrode and an n-side electrode, and is sealed by a sealing member 8 in the package 2 and mounted on the element mounting substrate 6 by an adhesive 100. ing. The LED element 3 is formed by sequentially growing a buffer layer made of AlN and an n-type semiconductor (n-GaN) layer, a light emitting layer, and a p-type semiconductor (p-GaN) layer on a sapphire (Al 2 O 3 ) substrate. Is formed. The planar vertical and horizontal dimensions of the LED element 3 are set to a planar size in which the vertical dimension and the horizontal dimension are about 1 mm, for example.
（蛍光体板９の構成）
蛍光体板９は、基部材９１及び蛍光体層９２からなり、ケース５内（内部空間５Ａ）に収容され、かつ段状面５ｂに取り付けられている。基部材９１は、シリコーン等の光透過性樹脂からなる平面円形状の薄板部材によって形成され、蛍光体層９２の補強部材として機能し得るように構成されている。蛍光体層９２は、基部材９１の光取出側に配設されている。そして、ＬＥＤ素子３からの光（青色光）を受けて励起されることにより、波長変換光（黄色光）を発するＹＡＧ（ＹｔｔｒｉｕｍＡｌｕｍｉｎｕｍ Ｇａｒｎｅｔ）等の蛍光体を含有するシリコーン等の光透過性樹脂によって形成されている。蛍光体層９２の厚さは均一な寸法に設定されている。これにより、ＬＥＤ素子３から発せられる各光の行路長を蛍光体層９２内において一定の寸法に近づけ、蛍光体層９２から出射される光の色むらの発生が抑制される。
(Configuration of phosphor plate 9)
The phosphor plate 9 includes a base member 91 and a phosphor layer 92, is accommodated in the case 5 (internal space 5A), and is attached to the stepped surface 5b. The base member 91 is formed by a planar circular thin plate member made of a light-transmitting resin such as silicone, and is configured to function as a reinforcing member for the phosphor layer 92. The phosphor layer 92 is disposed on the light extraction side of the base member 91. Then, by receiving light (blue light) from the LED element 3 and being excited, the light-transmitting resin such as silicone containing a phosphor such as YAG (Yttrium Aluminum Garnet) that emits wavelength-converted light (yellow light) is used. Is formed. The thickness of the phosphor layer 92 is set to a uniform dimension. Thereby, the path length of each light emitted from the LED element 3 is brought close to a certain dimension in the phosphor layer 92, and the occurrence of uneven color of the light emitted from the phosphor layer 92 is suppressed.
〔発光装置１の動作〕
ＬＥＤ素子３に電源から第２配線パターン１６，１７及びビアパターン２２，２３・第１配線パターン１４，１５・ボンディングワイヤ１２，１３を介して電圧が印加されると、ＬＥＤ素子３の発光層において青色光を発し、この光がＬＥＤ素子３の光取出面から封止部材８に出射される。
[Operation of Light Emitting Device 1]
When a voltage is applied to the LED element 3 from the power source through the second wiring patterns 16 and 17 and the via patterns 22 and 23, the first wiring patterns 14 and 15, and the bonding wires 12 and 13, in the light emitting layer of the LED element 3 Blue light is emitted, and this light is emitted from the light extraction surface of the LED element 3 to the sealing member 8.
次に、ＬＥＤ素子３からの出射光が封止部材８を透過する。そして、蛍光体板９（蛍光体層９２）では入射した光（青色光）を受けて励起されることにより黄色の波長変換光を発する。このため、ＬＥＤ素子３から発せられる青色の励起光と蛍光体板９から発せられる黄色の波長変換光とが混合して白色光となる。この後、白色光が蛍光体板９を透過し、その光出射面から出射される。 Next, the emitted light from the LED element 3 passes through the sealing member 8. The phosphor plate 9 (phosphor layer 92) receives the incident light (blue light) and is excited to emit yellow wavelength converted light. For this reason, the blue excitation light emitted from the LED element 3 and the yellow wavelength converted light emitted from the phosphor plate 9 are mixed to form white light. Thereafter, white light passes through the phosphor plate 9 and is emitted from the light exit surface.
[第１の実施の形態の効果]
以上説明した実施の形態によれば、次の（１）〜（３）に示す効果が得られる。
[Effect of the first embodiment]
According to the embodiment described above, the following effects (1) to (3) can be obtained.
（１）蛍光体板９が基部材９１及び蛍光体層９２からなるため、基部材９１によって蛍光体層９２を補強することができる。これにより、蛍光体層９２の厚さを可能な限り小さい寸法に設定しても、蛍光体板９における機械的強度の低下を抑制することができる。 (1) Since the phosphor plate 9 includes the base member 91 and the phosphor layer 92, the phosphor layer 92 can be reinforced by the base member 91. Thereby, even if the thickness of the fluorescent substance layer 92 is set to the smallest possible dimension, the fall of the mechanical strength in the fluorescent substance board 9 can be suppressed.
（２）蛍光体層９２が基部材９２の光取出側に配置されているため、それだけＬＥＤ素子３からの光を遠い位置で受けることになり、蛍光体層９２の劣化を抑制することができる。このため、長期間にわたって輝度の高い光を得ることができ、近年における大出力化に応じることができる。 (2) Since the phosphor layer 92 is arranged on the light extraction side of the base member 92, the light from the LED element 3 is received at a far position, and deterioration of the phosphor layer 92 can be suppressed. . For this reason, light with high luminance can be obtained over a long period of time, and the increase in output in recent years can be met.
[第２の実施の形態]
図２は、本発明の第２の実施の形態に係る蛍光体板を説明するために示す断面図である。図２において、図１と同一の部材については同一の符号を付し、詳細な説明は省略する。
[Second Embodiment]
FIG. 2 is a cross-sectional view for explaining a phosphor plate according to a second embodiment of the present invention. 2, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
図２に示すように、第２の実施の形態に示す蛍光体板２１は、出射光量を多くするためにダイクロイックミラー９３を用いた点に特徴がある。 As shown in FIG. 2, the phosphor plate 21 shown in the second embodiment is characterized in that a dichroic mirror 93 is used to increase the amount of emitted light.
このため、基部材９１の素子側には、ＬＥＤ素子３から発せられる青色光と透過し、かつ蛍光体層９２から発せられる黄色光（波長変換光）を反射するダイクロイックミラー９３が配設されている。 For this reason, a dichroic mirror 93 that transmits blue light emitted from the LED element 3 and reflects yellow light (wavelength converted light) emitted from the phosphor layer 92 is disposed on the element side of the base member 91. Yes.
[第２の実施の形態の効果]
以上説明した第２の実施の形態によれば、第１の実施の形態の効果（１）に加え、次に示す効果が得られる。
基部材９１の素子側にダイクロイックミラー９３が配設されているため、ＬＥＤ素子３からの青色光がダイクロイックミラー９３を透過して蛍光体板２１内に入射し易くなるとともに、蛍光体板２１内で発する黄色光をダイクロイックミラー９３で反射し易くなる。これにより、蛍光体板２１からの出射光量が多くなり、光取出効率を高めることができる。
[Effect of the second embodiment]
According to the second embodiment described above, the following effect is obtained in addition to the effect (1) of the first embodiment.
Since the dichroic mirror 93 is disposed on the element side of the base member 91, the blue light from the LED element 3 easily passes through the dichroic mirror 93 and enters the phosphor plate 21, and in the phosphor plate 21. It becomes easy to reflect the yellow light emitted by the dichroic mirror 93. As a result, the amount of light emitted from the phosphor plate 21 increases, and the light extraction efficiency can be increased.
[第３の実施の形態]
図３は、本発明の第３の実施の形態に係る蛍光体板を説明するために示す断面図である。図３において、図１と同一の部材については同一の符号を付し、詳細な説明は省略する。
[Third embodiment]
FIG. 3 is a cross-sectional view for explaining a phosphor plate according to a third embodiment of the present invention. 3, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
図３に示すように、第３の実施の形態に示す蛍光体板３１は、出射光量を多くするために蛍光体層９２に表面処理を施した点に特徴がある。 As shown in FIG. 3, the phosphor plate 31 shown in the third embodiment is characterized in that a surface treatment is performed on the phosphor layer 92 in order to increase the amount of emitted light.
このため、蛍光体層９２の光出射面は、断面矩形状の凹部を有する凹凸面９２Ａで形成されている。 For this reason, the light emission surface of the phosphor layer 92 is formed by an uneven surface 92A having a recess having a rectangular cross section.
[第３の実施の形態の効果]
以上説明した第３の実施の形態によれば、第１の実施の形態の効果（１）に加え、次に示す効果が得られる。
蛍光体層９２の光出射面は凹凸面９２Ａで形成されているため、蛍光体板３１からの白色光が蛍光体層９２と空気との界面で拡散して蛍光体層９２から出射され易くなる。これにより、蛍光体板３１からの出射光量が多くなり、光取出効率を高めることができる。
[Effect of the third embodiment]
According to the third embodiment described above, the following effect is obtained in addition to the effect (1) of the first embodiment.
Since the light emitting surface of the phosphor layer 92 is formed by the uneven surface 92A, white light from the phosphor plate 31 is easily diffused at the interface between the phosphor layer 92 and air and is easily emitted from the phosphor layer 92. . As a result, the amount of light emitted from the phosphor plate 31 increases, and the light extraction efficiency can be increased.
[第４の実施の形態]
図４は、本発明の第４の実施の形態に係る蛍光体板を説明するために示す断面図である。図４において、図１と同一の部材については同一の符号を付し、詳細な説明は省略する。
[Fourth embodiment]
FIG. 4 is a cross-sectional view for explaining a phosphor plate according to a fourth embodiment of the present invention. 4, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
図４に示すように、第４の実施の形態に示す蛍光体板４１は、出射光量を多くするために基部材９１及び蛍光体層９２に表面処理を施した点に特徴がある。 As shown in FIG. 4, the phosphor plate 41 shown in the fourth embodiment is characterized in that surface treatment is performed on the base member 91 and the phosphor layer 92 in order to increase the amount of emitted light.
このため、基部材９１の光出射面は、断面矩形状の凹凸部を有する凹凸面９１Ａで形成されている。また、蛍光体層９２の光入射面は、凹凸面９１Ａに適合し、かつ断面矩形状の凹凸部を有する凹凸面９２Ｂで形成されている。 For this reason, the light emission surface of the base member 91 is formed by an uneven surface 91A having an uneven portion having a rectangular cross section. In addition, the light incident surface of the phosphor layer 92 is formed of a concavo-convex surface 92B that is compatible with the concavo-convex surface 91A and has a concavo-convex portion having a rectangular cross section.
[第４の実施の形態の効果]
以上説明した第４の実施の形態によれば、第１の実施の形態の効果（１）に加え、次に示す効果が得られる。
基部材９１の光出射面は凹凸面９１Ａで形成され、蛍光体層９２の光入射面は凹凸面９１Ａに適合する凹凸面９２Ｂで形成されているため、蛍光体板９からの白色光が基部材９１と蛍光体層９２との界面で拡散して蛍光体層９２に出射され易くなる。これにより、蛍光体板９からの出射光量が多くなり、光取出効率を高めることができる。
[Effect of the fourth embodiment]
According to the fourth embodiment described above, in addition to the effect (1) of the first embodiment, the following effect can be obtained.
Since the light emitting surface of the base member 91 is formed by the uneven surface 91A and the light incident surface of the phosphor layer 92 is formed by the uneven surface 92B that matches the uneven surface 91A, white light from the phosphor plate 9 is based on the light. Diffusion at the interface between the member 91 and the phosphor layer 92 facilitates emission to the phosphor layer 92. Thereby, the emitted light quantity from the fluorescent substance plate 9 increases, and it can improve light extraction efficiency.
以上、本発明の発光装置を上記の実施の形態に基づいて説明したが、本発明は上記の実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で種々の態様において実施することが可能であり、例えば次に示すような変形も可能である。 As mentioned above, although the light-emitting device of this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment, It implements in a various aspect in the range which does not deviate from the summary. For example, the following modifications are possible.
（１）本実施の形態では、蛍光体層９２が蛍光体含有のシリコーン等の光透過性樹脂である場合について説明したが、本発明はこれに限定されず、蛍光体含有の無機ガラスからなるもの、あるいは蛍光体含有の有機・無機ハイブリッド材料からなるものでもよい。 (1) Although the case where the phosphor layer 92 is a light-transmitting resin such as phosphor-containing silicone has been described in the present embodiment, the present invention is not limited to this and is made of phosphor-containing inorganic glass. Or a phosphor-containing organic / inorganic hybrid material.
（２）本実施の形態では、ＬＥＤ素子２から発せられる光（青色光）を受けて励起されることにより黄色の波長変換光を発する蛍光体板９，２１，３１，４１である場合について説明したが、本発明はこれに限定されず、ＬＥＤ素子から発せられる光（紫色光：波長３７０〜３９０ｎｍ）を受けて励起されることにより白色の波長変換光を発する蛍光体板であってもよい。 (2) In the present embodiment, a description will be given of the case where the phosphor plates 9, 21, 31, and 41 emit yellow wavelength converted light when excited by receiving light (blue light) emitted from the LED element 2. However, the present invention is not limited to this, and may be a phosphor plate that emits white wavelength-converted light when excited by receiving light (purple light: wavelength 370 to 390 nm) emitted from the LED element. .
（３）本実施の形態では、フェイスアップ型のＬＥＤ素子３を用いたが、フェイスダウン型のＬＥＤ素子３を用いてもよい。この場合、ＬＥＤ素子３は第１配線パターン１４，１５にフリップチップ接続される。 (3) Although the face-up type LED element 3 is used in the present embodiment, a face-down type LED element 3 may be used. In this case, the LED element 3 is flip-chip connected to the first wiring patterns 14 and 15.
１…発光装置、２…パッケージ、３…ＬＥＤ素子、５…ケース、５Ａ…内部空間、５ａ…傾斜面、５ｂ…段状面、６…素子搭載基板、８…封止部材、９，２１，３１，４１…蛍光体板、１２，１３…ボンディングワイヤ、１４，１５…第１配線パターン、１６，１７…第２配線パターン、１９，２０…ビアホール、２２，２３…ビアパターン、９１…基部材、９１Ａ…凹凸面、９２…蛍光体層、９２Ａ，９２Ｂ…凹凸面 DESCRIPTION OF SYMBOLS 1 ... Light-emitting device, 2 ... Package, 3 ... LED element, 5 ... Case, 5A ... Internal space, 5a ... Inclined surface, 5b ... Stepped surface, 6 ... Element mounting substrate, 8 ... Sealing member, 9, 21, 31, 41 ... phosphor plate, 12, 13 ... bonding wire, 14, 15 ... first wiring pattern, 16, 17 ... second wiring pattern, 19, 20 ... via hole, 22, 23 ... via pattern, 91 ... base member 91A ... Uneven surface, 92 ... Phosphor layer, 92A, 92B ... Uneven surface
Claims (10)
前記基部材の光取出側に配設され、前記発光素子から発せられる光を受けて励起されることにより波長変換光を発する蛍光体層とを備えたことを特徴とする蛍光体板。 A base member disposed on the light extraction side of the light emitting element and made of a light transmissive material;
A phosphor plate, comprising: a phosphor layer disposed on a light extraction side of the base member and emitting wavelength-converted light when excited by receiving light emitted from the light emitting element.
前記蛍光体層の素子側面は、前記凹凸面に適合する凹凸面で形成されている請求項１に記載の蛍光体板。 The light extraction side surface of the base member is formed as an uneven surface,
2. The phosphor plate according to claim 1, wherein an element side surface of the phosphor layer is formed with an uneven surface that conforms to the uneven surface.
前記ケースの光取出側に配設された蛍光体板と、
前記蛍光体板の光反取出側に配設され、かつ前記ケース内に収容された発光素子とを備えた発光装置において、
前記蛍光体板は、請求項１乃至７のいずれかに記載の蛍光体板であることを特徴とする発光装置。 A case opening to the light extraction side;
A phosphor plate disposed on the light extraction side of the case;
In a light emitting device provided with a light emitting element disposed on the light extraction side of the phosphor plate and housed in the case,
The phosphor plate according to claim 1, wherein the phosphor plate is the phosphor plate according to claim 1.
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