JP2007201262A - High frequency circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact high frequency circuit device in which an electric performance is good. <P>SOLUTION: In the high frequency circuit device, a connection conductor 6 which connects first and second lands 4 and 5, and a grounding pattern 10 which counters the connection conductor 6, are formed, it will become in the state where a low pass filter existed in a radio frequency between the primary and secondary lands 4 and 5. The improvement of a return loss in a desired frequency can be aimed at, and a thing is obtained with good electric performance. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a high-frequency circuit device suitable for use in various electric devices, electronic circuit units, and the like.

  FIG. 4 is a perspective view of a main part of a conventional high-frequency circuit device. Next, the configuration of the conventional high-frequency circuit device will be described with reference to FIG. First, second, and third land portions 53, 54, and 55, each having a portion connected to the wiring pattern 52, are provided, and one land of the first and second land portions 53 and 54 is provided. The parts are connected to each other by a conductive pattern 56.

  A resist film 57 of an insulating material is provided on the circuit board 51, the wiring pattern 52, and the conductive pattern 56 with the first, second, and third land portions 53, 54, and 55 exposed. A solder region is formed.

The first, second and third electronic parts 58a, 58b and 58c are soldered to the solder regions of the first, second and third land portions 53, 54 and 55, respectively. Although not shown, various circuit components are mounted on the circuit board 51 to form a desired high-frequency circuit (see, for example, Patent Document 1).
Japanese Utility Model Publication No. 8-599

  However, in the conventional high-frequency circuit device, when a high-frequency signal flows through the conductive pattern 56 that connects the first and second land portions 53 and 54, an inductor is provided between the first and second land portions 53 and 54. A resist for forming a solder region on the conductive pattern 56 between the first and second land portions 53 and 54 is obtained while the return loss is deteriorated and the electrical performance is deteriorated. Since the film 57 is provided, there is a problem that a space for forming the resist film 57 is required between the first and second land portions 53 and 54 and the size is increased.

  The present invention has been made in view of such a situation of the prior art, and an object thereof is to provide a small high-frequency circuit device having good electrical performance.

  In order to achieve the above object, the present invention provides a circuit board in which a plurality of insulating thin plates are laminated, first and second land portions provided on the surface of the circuit board, and the first and first lands. A connection conductor for connecting the two land portions, and an electronic component connected to each of the first and second land portions. The connection conductor includes a conductor pattern provided between the stacked circuit boards, and a circuit board. A first conductor connecting the first land portion and the conductive pattern, and a second conductor connecting the second land portion and the conductive pattern provided in the hole of the circuit board. In addition, the circuit board is provided with a grounding pattern facing the conductive pattern.

  According to the present invention configured as described above, a low-pass filter exists in a high frequency between the first and second land portions due to the connection conductor and the ground pattern, thereby improving return loss at a desired frequency. Therefore, a product with good electrical performance can be obtained.

  Further, the present invention is characterized in that, in the above-mentioned invention, the insulating thin plate is formed of a ceramic material.

  According to the present invention configured as described above, the ceramic material can improve the insulation between the first and second land portions, and can reduce the distance between the first and second land portions. Can be achieved.

  The present invention is also characterized in that, in the above invention, the insulating thin plate is formed of a low-temperature fired ceramic material.

  According to the present invention configured as described above, a low-temperature fired ceramic material can provide a high-frequency characteristic.

  Further, the present invention is characterized in that, in the above-mentioned invention, the conductive pattern and the ground pattern are provided between adjacent layers.

  The present invention configured as described above can be arranged in a state in which the conductive pattern and the ground pattern are close to each other, and can be downsized, and the conductive pattern and the ground pattern for forming the capacitor of the low-pass filter can be made small. Miniaturization can be achieved.

  Further, the present invention is characterized in that in the above invention, the resist film is eliminated on the surface of the circuit board located between the first and second lands connected by the connecting conductor.

  According to the present invention configured as described above, a resist film is not required, and the distance between the first and second land portions can be further reduced, and the size can be reduced.

  According to the present invention, a low-pass filter exists between the first and second land portions at a high frequency due to the connection conductor and the ground pattern, so that return loss at a desired frequency can be improved, and electrical With good performance.

  An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a plan view of the main part of the high-frequency circuit device of the present invention, FIG. 2 is a cross-sectional view of the main part of the high-frequency circuit device of the present invention, and FIG. It is an equivalent circuit diagram related to the high-frequency circuit device.

  Next, a configuration according to the high-frequency circuit device of the present invention will be described with reference to FIGS. 1 to 3. A circuit board 1 is a laminate of a plurality of insulating thin plates 2 such as a ceramic material or a low-temperature fired ceramic material (LTCC). On the surface of the circuit board 1, there are provided a wiring pattern 3 and first and second land portions 4, 5 made of a pair of lands partially connected to the wiring pattern 3. ing.

  One land portion of the first and second land portions 4 and 5 is connected to each other by a connection conductor 6, and the connection conductor 6 includes a conductive pattern 7 provided between the stacked circuit boards 1, and The first conductor 8 provided in the hole 1a of the circuit board 1 and connecting the first land portion 4 and the conductive pattern 7, and the second land portion 5 and the conductive pattern provided in the hole 1b of the circuit board 1. 7 and a second conductor 9 that connects 7 together.

  And between one land part of the 1st, 2nd land parts 4 and 5 connected by the connection conductor 6, it arrange | positions in the state which mutually adjoined (for example, space | interval of about 50 microns), and this land part The insulating film is removed from the surface of the circuit board 1 positioned between them.

  Note that the resist film may be provided at an appropriate place other than the surface of the circuit board 1 between the land portions.

  The ground pattern 10 made of a conductive material is provided between the stacked layers adjacent to the conductive pattern 7 in a state of facing the conductive pattern 7, and the ground pattern 10 is disposed between the stacked layers not adjacent to the conductive pattern 10, or You may provide in the lower surface of the circuit board 1. FIG.

  The first and second land parts 4 and 5 are soldered with the first and second electronic components 11a and 11b, respectively, and various circuits are mounted on the circuit board 1 although not shown here. Components are mounted to form a desired high-frequency circuit, and the high-frequency circuit device of the present invention is configured.

  The first and second electronic components 11a and 11b may be formed of the same electronic component such as a capacitor or a resistor, or one may be a capacitor or a resistor, and the other may be an IC component.

  In the high-frequency circuit device of the present invention having such a configuration, when a high-frequency signal flows through the connection conductor 6 connecting the first and second land portions 4 and 5, as shown in FIG. The first and second conductors 8 and 9 are the inductor L, and the capacitor C is between the conductive pattern 7 and the ground pattern 10, so that a T-shaped low-pass filter exists.

  As a result, the connection conductor 6 and the ground pattern 10 cause a low-pass filter to exist between the first and second land portions 4 and 5 at a high frequency, thereby improving return loss at a desired frequency. As a result, a product with good electrical performance can be obtained.

It is a top view of the principal part of the high frequency circuit device of the present invention. It is principal part sectional drawing of the high frequency circuit apparatus of this invention. It is an equivalent circuit diagram concerning the high frequency circuit device of the present invention. It is a perspective view of the principal part of the conventional high frequency circuit device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 1a, 1b Hole 2 Insulating thin plate 3 Wiring pattern 4 1st land part 5 2nd land part 6 Connection conductor 7 Conductive pattern 8 1st conductor 9 2nd conductor 10 Ground pattern 11a, 11b Electronic component L Inductor C Capacitor

Claims (5)

A circuit board on which a plurality of insulating thin plates are laminated; first and second land portions provided on the surface of the circuit board; a connection conductor connecting the first and second land portions; Electronic components connected to each of the first and second land portions, wherein the connection conductor is provided in a conductor pattern provided between the stacks of the circuit boards, and in the holes of the circuit boards. A first conductor connecting the first land portion and the conductive pattern, and a second conductor provided in the hole of the circuit board and connecting the second land portion and the conductive pattern; The circuit board is provided with a grounding pattern opposite to the conductive pattern. 2. The high frequency circuit device according to claim 1, wherein the insulating thin plate is made of a ceramic material. 3. The high frequency circuit device according to claim 2, wherein the insulating thin plate is made of a low-temperature fired ceramic material. The high-frequency circuit device according to claim 1, wherein the conductive pattern and the ground pattern are provided between adjacent layers. 5. The resist film according to claim 1, wherein a resist film is eliminated on a surface of the circuit board located between the first and second land portions connected by the connection conductor. 6. High frequency circuit device.

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