JP2007208277A - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crimping apparatus capable of preventing damage to a substrate and capable of crimping an electronic component satisfactorily.
An electronic component crimping apparatus that uses a buffer member to arrange a plurality of electronic components on a straight line and mounts them on a substrate is a pressure tool that applies pressure to the electronic component, and a pressure tool that faces the pressure tool. A pressure receiving tool 29 provided as a support, a substrate holding tool 31 for supporting the substrate between the pressing tool and the pressure receiving tool, and holding the buffer member between the substrate and the pressing tool. A position adjustment device 35 connected to at least one of the buffer member holding tool 34, the pressure tool, and the buffer member holding tool, and relatively moving the pressure tool and the buffer member holding tool with respect to the linear direction. And a control device for controlling the pressing tool to crimp the substrate and the electronic component.
[Selection] Figure 1

Description

The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping an electronic component to a substrate.

As an apparatus for manufacturing a flat panel display or the like typified by a plasma display panel (PDP), an electronic component mounting apparatus for mounting an electronic component formed of a film-like member or the like on a glass substrate is known.
FIG. 11 shows an example of a glass substrate on which an electronic component is mounted by the electronic component mounting apparatus. FIG. 11 (a) is a plan view and FIG. 11 (b) is a side view thereof. The glass substrate 1 shown here is formed by bonding two types of substrates 1a and 1b having different sizes. On the lower surface of the upper substrate 1a and the upper surface of the lower substrate 1b, a plurality of electronic components 2 are provided along an edge of each substrate through an anisotropic conductive film (hereinafter referred to as "ACF") 3, respectively. Has been implemented.
Further, in an electronic component mounting apparatus for manufacturing this type of glass substrate, an ACF 3 is attached along the side of the glass substrate 1 where the electronic component 2 is mounted, and then an electronic component is utilized using the adhesiveness of the ACF 3. The component 2 is temporarily attached to the glass substrate 1, and then the electronic component 2 thus temporarily attached is heated and pressed against the glass substrate 1 using an electronic component crimping device, whereby leads formed on the glass substrate 1 and The lead of the electronic component 2 is connected.
FIG. 12 shows an example of the electronic component crimping apparatus 10. The electronic component crimping apparatus 10 shown in FIG. 1 is moved up and down by a pressure cylinder 11 and is arranged to face the pressure tool 13 having a long pressure tool 13 with a built-in heater 12. The backup tool 15 as a pressure receiving tool in which the heater 14 is built up and moved up and down, and the sheet member 16 disposed between the pressurizing tool 13 and the backup tool 15 are provided. The sheet member 16 is interposed between the pressing tool 13 and the electronic component 2 when the electronic component 2 is pressed by the pressing tool 13, and absorbs variations in the flatness of the pressing surface of the pressing tool 13. A uniform pressure can be applied to the entire pressure area, and the size is set so as to cover the entire pressure surface of the pressure tool 13.
The crimping operation using the electronic component crimping apparatus 10 is performed as follows. First, the glass substrate 1 to which the electronic component 2 is temporarily attached in the previous process is placed on a substrate stage (not shown) and positioned at a crimping position. In this positioning, in FIG. 12, the left end a of the electronic component 2-1 located at the leftmost end of the electronic component group located along the side of the glass substrate 1 that is scheduled to be crimped this time is the pressing tool 13. Is aligned with the left end A (more precisely, the left end of the pressing surface of the pressurizing tool) or slightly inside the left end A of the pressurizing tool 13. Next, the backup tool 15 rises to support the glass substrate 1 from below (the state shown in FIG. 12), and then the pressure tool 13 is lowered by the pressure cylinder 11. As a result, the four electronic components 2-1, 2-2, 2-3, 2-4 existing within the length range of the pressurizing tool 13 pass through the sheet member 16 as shown in FIG. By the pressure applied by the pressure cylinder 11 and the heating by the heaters 12 and 14, the glass substrate 1 is thermocompression bonded together via the ACF3.
Now, when the thermocompression bonding to the electronic components 2-1 to 2-4 is finished, the pressurizing tool 13 is raised, and after the backup tool 15 is lowered, this time, as shown in FIG. In the electronic component group, the right end b of the electronic component 2-6 located at the rightmost end coincides with the right end B of the pressing tool 13 (more precisely, the right end of the pressing surface of the pressing tool), Alternatively, it is positioned so as to be slightly inside the right end B of the pressing tool 13. Then, the backup tool 15 rises to support the glass substrate 1 from below as in the previous case, and the pressure tool 13 descends, and four electronic components 2-3 existing within the length range of the pressure tool 13 2-4, 2-5, 2-6 are heated and pressurized.

JP 2005-317784 A

By the way, according to the electronic component crimping apparatus 10 described above, the type of the glass substrate 1 is changed, and the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval, and the like are changed. Then, the inconvenience as shown in FIG. 15 may occur. That is, as described above, first, the left end c of the electronic component 2-1a located at the leftmost end of the electronic components located along the side of the glass substrate 1 that is scheduled to be pressed at this time is first applied to the pressurizing tool 13. The right end B of the pressurizing tool 13 is exactly the center of the upper surface of the electronic component 2-5a when positioned so as to coincide with the left end A of the press or slightly inside the left end A of the pressurizing tool 13. As a result, in the electronic component 2-5a, the pressing surface of the pressing tool 13 is only partially in contact with the electronic component 2-5a. When the crimping operation is performed in such a state, the ACF 3 located under the electronic component 2-5a is also affected by heat from the pressing tool 13 through the electronic component 2-5a or from the backup tool 15. However, since the ACF 3 is thermosetting, the ACF 3 under the electronic component 2-5a is also cured at the portion not subjected to the pressure applied by the pressing tool 13.
For this reason, even if the remaining part of the electronic component 2-5a is heated and pressed later, the ACF 3 under the component 2-5a has already been cured as described above, and therefore corresponds to this remaining part. The lead of the glass substrate 1 to be connected to the lead of the electronic component 2 cannot be connected via the ACF 3. Therefore, the connection between the two in this portion becomes defective, and the glass substrate 1 becomes a defective product.
In order to eliminate this drawback, whenever the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval of the electronic components, etc. are changed, the pressure tool 13 must be replaced with a suitable one. Can be considered. However, replacing the pressure tool requires a lot of adjustment time, which is not preferable because the operating rate of the apparatus is lowered.
An object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of favorably crimping an electronic component to a substrate.

  According to the present invention, an electronic component crimping apparatus that uses a buffer member and arranges a plurality of electronic components in a straight line and mounts them on a substrate includes: a pressing tool that applies pressure to the electronic component; A pressure receiving tool provided; a substrate holding tool for supporting the substrate between the pressing tool and the pressure receiving tool; and a buffer member holding tool for holding the buffer member between the substrate and the pressing tool. And a position adjusting device that is connected to at least one of the pressure tool and the buffer member holding tool and moves the pressure tool and the buffer member holding tool relatively with respect to the linear direction, and the pressure tool And a control device for pressure-bonding the substrate and the electronic component.

  According to the present invention, there is provided an electronic component crimping method in which a plurality of electronic components are arranged on a straight line and mounted on a substrate using a buffer member, the steps of arranging the plurality of electronic components at predetermined positions on the substrate, Moving the substrate relative to the pressing tool, adjusting the position of the electronic component to a position where the entire electronic component located closest to one end of the substrate is crimped; and At the same time as or before and after the step of moving the buffer member relative to the pressurizing tool, the buffer member is moved relative to the pressurizing tool, and one end of the buffer member is The position of the buffer member is adjusted relative to the pressurizing tool so that the one end of the pressurizing tool located in the vicinity of one end of the substrate and the position inside the one end of the substrate are located. That consists of a step.

  According to the present invention, there is provided a crimping apparatus that can prevent damage to a substrate and can crimp an electronic component satisfactorily.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 is a perspective view showing a configuration of an electronic component crimping apparatus according to the present invention, FIG. 2 is a front view showing an operating state of the electronic component crimping apparatus of FIG. 1, FIG. 3 is a right side view of FIG. FIG. 5 is a partially enlarged front view showing the operation state of the component crimping apparatus, and FIG. 5 is a front view showing the crimping operation state with respect to the electronic component at a position different from FIG.
Here, description will be made assuming that an electronic component is crimped to a plasma display panel using the electronic component crimping apparatus 20, but a person skilled in the art will recognize an EL display (Electroluminescence Display), FED (Field Emission Display), liquid crystal display, and the like. Clearly, other devices such as displays are equally applicable.
In FIG. 1, the electronic component crimping apparatus 20 includes a crimping head 21, a pressure receiving unit 22, a substrate stage 23, a sheet member supply unit 24, and a control device 25.
The pressure bonding head 21 has a long pressure tool 26, a heater 27 that heats the pressure tool 26, and a pressure cylinder 28 that moves the pressure tool 26 up and down. The lower surface of the pressure tool 26 is a pressure surface. 26a is configured. The pressure cylinder 28 is fixedly supported by a gantry (not shown).
The pressure receiving unit 22 includes a backup tool 29 as a pressure receiving tool and a heater 30 for heating the backup tool 29, and the upper surface of the backup tool 29 is connected to a pressing surface 26 a of the pressing tool 26 constituting the crimping head 21. It arrange | positions so that it may oppose. Note that the backup tool 29 can be moved up and down via lifting means (not shown).
The substrate stage 23 supports a glass substrate 1 as a substrate holding tool with a suction cup and the like, and a θ table 32 that rotatably supports the support portion 31 and a θ table 32 that are movable in the X and Y directions. An XY table 33 is provided. The substrate stage 23 is supplied with a glass substrate 1 on which a row of a plurality of electronic components 2 is temporarily attached in the previous process by carrying means (not shown), and the crimping operation by the electronic component crimping apparatus 20 is completed. The glass substrate 1 that has been removed is carried out toward the next process by unillustrated unloading means. Here, the θ table 32 and the XY table 33 constitute a moving device for the support portion 31.
The electronic component 2 is, for example, an insulating substrate such as epoxy having a wiring pattern formed on the surface thereof, and is electrically connected to other control circuits of the plasma display when the plasma display panel is assembled. If necessary, electronic elements such as transistors and resistors may be mounted on the wiring pattern. Such an electronic component 2 is generally called an FPC (Flexible Printed Circuit). In other applications such as EL display, FED, liquid crystal display, etc., electronic components suitable for the application are used.
The sheet member supply unit 24 includes a holder 34 as a buffer member holding tool and a position adjusting device 35 that moves the holder 34 in the longitudinal direction (m direction in FIG. 1) of the pressurizing tool 26. The holder 34 accommodates a sheet member 36 as a buffer member made of silicon or the like. That is, the holder 34 includes a supply reel 37 that supplies the sheet member 36, a storage reel 38 that winds up the sheet member 36, and guide rollers 39 and 40, and appropriately rotates the supply reel 37 and the storage reel 38. By actuating the drive source, the sheet member 36 is supplied from the supply reel 37 and stored in the storage reel 38 via the guide rollers 39 and 40. The sheet member 36 positioned between the guide roller 39 and the guide roller 40 is disposed so as to pass between the pressing surface of the pressing tool 26 and the upper surface of the backup tool 29 facing the pressing surface. Further, the width of the sheet member 36 in the m direction in FIG. 1 is set to be approximately equal to the length L (see FIG. 2) of the pressing tool 26.
In this case as well, after the ACF is attached along the side of the glass substrate 1 where the electronic component 2 is mounted, the electronic component 2 is temporarily attached to the glass substrate 1 using the adhesiveness of the ACF. The attached electronic component 2 is heated and pressed against the glass substrate 1 using an electronic component crimping apparatus, thereby connecting the leads formed on the glass substrate 1 and the leads of the electronic component 2. The ACF is made of a thermosetting material that can be made conductive by applying pressure and is cured by heat. However, any other suitable material may be used as long as it has adhesiveness. For example, even if it does not necessarily have conductivity, it is only necessary to fix the lead of the glass substrate 1 and the lead of the electronic component 2 in an electrically connected state by applying pressure. Further, it may be bonded by ultrasonic waves instead of heat.
The control device 25 drives and controls the pressure cylinder 28, the position adjustment device 35, the θ table 32, the XY table 33, and the like. The control device 25 includes information on the glass substrate 1 and the pressure tool 26. The tool length L and the like are stored. The information about the glass substrate 1 is, for example, the individual positional relationship (the width of each electronic component or the interval between the electronic components) of the plurality of electronic components temporarily attached to each side of the glass substrate 1 and the pressure tool 26. The number of electronic components 2 that can be pressure-bonded by one press, or the order in which the pressure-bonding operations are performed, can be mentioned.
Next, the operation | movement by this electronic component crimping | compression-bonding apparatus 20 is demonstrated using FIG.
In FIG. 2, the number of electronic components temporarily attached to the glass substrate 1, the mounting interval, and the length of the pressing tool are the same as those of the prior art described above with reference to FIG. 15. In addition, as information regarding the glass substrate 1, the control device 25 has four electronic components that can be collectively pressed by the pressing tool 26. First, the four electronic components 2-1a to 2-4a are collectively pressed. Thereafter, information such as information for collectively pressurizing the two electronic components 2-5a and 2-6a is set.
First, the glass substrate 1 on which a plurality of electronic components 2 are temporarily attached in the previous step is placed on the substrate stage 23 and positioned at the crimping position. In the initial positioning, the control device 25 determines the substrate based on the supplied information on the glass substrate 1 and the position information of the glass substrate 1 detected using a camera (not shown) arranged in the vicinity of the backup tool 29. The stage 23 is moved and controlled so that the glass substrate 1 is positioned as follows. That is, a total of six electronic components 2-1a to 2-6a are arranged and temporarily attached along the side that is scheduled to be crimped this time. From the condition that the four electronic components can be collectively pressed by the pressurizing operation, the end of the electronic component group composed of the six electronic components 2-1a to 2-6a arranged along this side is arranged. The fourth electronic component (2-4a in this example) adjacent to the side including the electronic component (2-1a in this example), and the end opposite to the electronic component 2-1a ( In FIG. 2, the right end portion (but also referred to as the outer end portion in this specification) e coincides with the corresponding end portion (right end portion in FIG. 2) D of the pressing surface 26a of the pressing tool 26, or the pressing surface 26a. The substrate stage 23 is slightly inward of the right end D. Control to. At this time, as shown in FIG. 2, the length (necessary crimping length) h between the electronic components 2-1a to 2-4a to be collectively pressed is from the length L of the pressing tool 26. Therefore, the left end C of the pressurizing tool 26 protrudes on the end of the glass substrate 1.
Now, under such a positional relationship between the pressing tool 26 and the glass substrate 1, the control device 25 then drives and controls the position adjusting device 35 to press the pressing surface of the pressing tool 26 in the sheet member 36. The edge f on the electronic component 2-1a side (left side in FIG. 2) located below 26a coincides with the outer end (left end portion in FIG. 2) d of the electronic component 2-1a, or the electronic component 2-1a. The relative position between the sheet member 36 and the glass substrate 1 is adjusted by moving the holder 34 so that the position slightly protrudes from the left end d of the sheet member 36. Here, the relative position adjustment between the sheet member 36 and the pressing tool 26 may be performed before or after the relative position adjustment between the pressing tool 26 and the glass substrate 1.
When the above-described position setting is completed, the control device 25 then controls a lifting device (not shown) to raise the backup tool 29 to support the glass substrate 1 from below (state of FIG. 2), and the pressure cylinder 28 The pressure tool 26 is moved down by driving the pressure tool 26, whereby the pressure tool 26 collectively presses the electronic components 2 against the glass substrate 1 through the sheet member 36, thereby causing the electronic components 2-1 a to 2-4 d to move. The glass substrate 1 is thermocompression bonded.
Here, in FIG. 2, the left edge f of the sheet member 36 located below the pressing surface 26a of the pressing tool 26 coincides with the left end d of the electronic component 2-1a, or the electronic component 2-1a. The relative position of the sheet member 36 and the glass substrate 1 was adjusted so that the position slightly protruded from the left end d of the glass substrate 1 because of the following reason. That is, as described above, the left end C of the pressurizing tool 26 protrudes on the end of the glass substrate 1 due to the positional relationship at the time of crimping. However, as shown in FIG. Since f is small even if it matches the left end d of the electronic component 2-1a or protrudes from the left end d of the electronic component 2-1a, when the electronic component is pressed by the pressing tool 26, the glass substrate 1 There is a gap g between the upper surface of the left end portion and the pressing surface 26 a of the pressing tool 26. In FIG. 4, if the sheet member 36 is positioned up to the end of the pressing surface 26 a of the pressing tool 26, the pressing force is applied to the electronic component 2 of the glass substrate 1 through the sheet member 26 when the pressing tool 26 is pressed. However, in the present embodiment, the end of the glass substrate 1 is pressed even when the pressing tool 26 is pressed due to the presence of the gap g described above. The portion is prevented from receiving overheating and pressure from the pressurizing tool 26, and damage to the glass substrate 1 can be prevented.
Now, returning to FIG. 2, when the electronic components 2-1a to 2-4a are thermocompression bonded to the glass substrate 1, the pressure tool 26 is raised and the backup tool 29 is lowered.
Next, as shown in FIG. 5, the control device 25 controls the movement of the substrate stage 23 again, and then moves along the side among the remaining two electronic components 2-5a and 2-6a to be collectively crimped. 2 adjacent to each other along the side including an electronic component (2-6a in this example) located at a different end from the tip of the electronic component group composed of the six electronic components 2-1a to 2-6a arranged side by side. The first electronic component (2-5a in this example) and the end (the left end in FIG. 5) opposite to the electronic component 2-6a k corresponds to the corresponding end of the pressing surface 26a of the pressing tool 26. The substrate stage 23 is controlled so as to coincide with (the left end portion in FIG. 5) C or slightly inside the left end portion C of the pressure surface 26a. At this time, as shown in FIG. 5, the length (required crimping length) n between the electronic components 2-5a and 2-6a to be collectively pressed is from the length L of the pressing tool 26. Therefore, the pressing surface of the pressing tool 26 exists on the end portion of the glass substrate 1. Therefore, for the reasons described above, the edge q on the electronic component 2-6a side (right side in FIG. 5) of the sheet member 36 coincides with the outer end (right end portion in FIG. 5) p of the electronic component 2-6a, or The relative position between the sheet member 36 and the glass substrate 1 is adjusted by moving the holder 34 so that the position slightly protrudes from the right end p of the electronic component 2-6a.
When the above-described position setting is completed, the backup tool 29 rises and supports the glass substrate 1 from below by driving control of the control device 25, and the pressing tool 26 descends to electronic components 2-5a and 2-6a. Is thermocompression-bonded to the glass substrate 1.
As described above, the crimping operation of the electronic component 2 to one side of the glass substrate 1 is completed. When there is an electronic component 2 temporarily attached to the other side of the glass substrate 1 as in this example, the side is placed at the crimping position under the pressure tool 26 and the other operation is performed by the same operation as described above. A crimping operation is performed on the side of the. The sheet member 36 is sequentially fed from the supply reel 37 to the storage reel 38 when the number of times of crimping reaches a predetermined number, and a new surface of the sheet member is positioned under the pressure tool 26.
As described above, according to the above-described embodiment, when performing the crimping operation by the pressing tool 26, the electronic components 2-1a to 2-4a to be subjected to the current crimping operation are arranged along the side. An end of an electronic component group composed of a plurality of electronic components, that is, an outer edge e of the electronic component 2-4a located on the opposite side of the edge of the glass substrate 1 is placed on the pressing surface 26a of the pressing tool 26. Since the other end C of the pressurizing tool 26 is projected on the end of the glass substrate 1 so as to correspond to the corresponding end D, the crimping length h of the pressurizing tool 26 is increased. Even when the length is shorter than the length L, the entire electronic components 2-1a to 2-4a can be heated and pressurized by the pressurizing tool 26, and only a part of the electronic component 2 as has occurred in the past can be obtained. By being heated and pressurized by the pressurizing tool 26, Thus cured without the portion corresponding to the portion protruding from the pressure tool 26 in child part 2 below ACF3 is subjected to pressure applied by the pressurizing tool 26, a phenomenon can be prevented. As a result, the electronic component 2 can be favorably crimped.
Further, according to the above-described embodiment, for example, when the electronic components 2-1a to 2-4a are collectively pressed by the pressing tool 26, the edge of the sheet member 36 positioned below the pressing surface 26a of the pressing tool 26 Since the part f is positioned at a position corresponding to the left end d of the electronic component 2-1 a, the pressing tool 26 is used even when the crimping length h is shorter than the length L of the pressing tool 26. It is possible to prevent the glass substrate 1 from being damaged by the pressing, and the electronic component 2 can be pressure-bonded satisfactorily. The reason is as described above.
Furthermore, according to the above-described embodiment, each time the size of the glass substrate 1, the size of the electronic component 2 mounted on the glass substrate 1, the mounting interval of the electronic components, and the like are changed as in the prior art, it is appropriate. There is no need to replace the pressure tool 13. Therefore, a lot of adjustment time required for exchanging the pressurizing tool can be omitted, and the operating rate of the apparatus can be maintained.
In the above-described embodiment, the sheet member 36 is disposed between the pressing tool 26 and the backup tool 29. However, the sheet member 36 is not necessarily required if reliability is ensured.
The sheet member 36 is supplied from the supply reel 37. However, the present invention is not limited to this. For example, the sheet member cut into a strip shape is held by a chuck and pressed by the pressing tool 26. The electronic component 2 may be supplied each time.
In addition, as information on the glass substrate 1, the example in which the number of electronic components 2 to be heated and pressed at once with the pressurizing tool 26 and the crimping order are preset in the control device 25 for each side of the glass substrate 1 has been described. It is not limited to. For example, the mounting position of the electronic component 2 relative to the glass substrate 1 and the width dimension of the electronic component 2 are set in the control device 25 as information related to the glass substrate 1, and the control device 25 adds the information based on these information. You may make it obtain | require the number of the electronic components 2 which can be heated and pressurized at once by the pressure tool 26. FIG. Specifically, for example, the width dimension of the electronic component 2 located at one end of the side of the glass substrate 1 is compared with the tool length L. As a result, if the tool length L is larger, the crimping length h obtained by adding the electronic component 2 to the electronic component 2 to the electronic component 2 is set as the mounting position of the electronic component 2 and the width dimension of the electronic component 2. And is compared with the tool length L. Then, this operation is repeated until the crimping length h exceeds the tool length L. When the crimping length h exceeds the tool length L, the number of electronic components 2 immediately before that is increased by the pressing tool 26 at a time. It is determined as the number of electronic components 2 that can be heated and pressurized. After determining the number of electronic components 2 that can be heated and pressurized at once by the pressurizing tool 26 in this way, the crimping operation is performed in the same manner as in the above-described embodiment.
Next, a specific example of the control device 25 will be described in more detail. FIG. 10 is a diagram showing an implementation example of the control device 25 according to the embodiment of the present invention. The control device 25 includes a CPU 51, a RAM 53, a FLASH ROM 55, an input / output control unit 57, and a parameter setting unit 61. Here, the CPU 51 controls each element of the electronic component crimping apparatus 20, that is, the crimping head 21, the pressure receiving unit 22, the substrate stage 23, and the sheet member supply unit 24 by executing a control program loaded in the RAM 53. The above crimping operation is performed. The parameter setting unit 61 includes a user interface 59, a network control unit 63, and a ROM 65, and registers parameters related to the glass substrate 1 and the tool length L of the pressing tool 26 in the RAM 53 (or FLASH ROM 55). To do. As described above, these pieces of information are used by the control device 25 to control the actual crimping operation.
Next, a method for setting information regarding the glass substrate 1 as a parameter using the parameter setting unit 61 will be described. When a two-dimensional code such as a barcode or a vericode is provided on the glass substrate 1, it is read by the code reader 71, and a corresponding parameter is transferred to the RAM 53 by referring to a database stored in the ROM 65. . When there is no necessary information in the code provided on the glass substrate 1, the parameter setting unit 61 accesses the server that seems to provide the information via the network control unit 63, and If the parameter can be acquired, it is transferred to the RAM 53.
When a two-dimensional code such as a barcode or a vericode is not provided on the glass substrate 1, the parameter setting unit 61 accesses a default server via the network control unit 63 to obtain necessary parameters. If possible, it is transferred to the RAM 53. If the necessary parameters cannot be obtained from the default server, the operator manually uses the user interface 59 to search for a server that seems to be providing information and access it via the network control unit 63. Search for the required parameters. If the parameter can be acquired, it is transferred to the RAM 53. If the necessary parameters cannot be obtained, the operator manually inputs a numerical value directly to the parameter setting unit 61 using the user interface 59. The parameters transferred to the RAM 53 are processed by the control program by the method as described above and used for appropriate control of each element of the electronic component crimping apparatus 20. Further, the operator may directly input the actual movement amount of each element of the electronic component crimping apparatus 20 to the parameter setting unit 61 instead of the above-described parameters as information regarding the glass substrate 1.
Although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that the present invention is not limited to the embodiments described herein. The apparatus of the present invention can be implemented as a modified or changed mode without departing from the spirit and scope of the present invention defined by the description of the scope of claims. Therefore, the description of the present application is for illustrative purposes and does not have any limiting meaning to the present invention.
For example, in the above-described embodiment, an example in which a plurality of electronic components are crimped at a time has been described.
Needless to say, the substrate is not limited to glass.
Moreover, it is applicable even when heat is not required for pressure bonding.
In the example of FIG. 2, first, electronic parts (specifically, four electronic parts) that can be heated and pressed by the pressing tool 26 are pressure-bonded, and then the remaining electronic parts (two electronic parts) However, it is not always necessary to crimp as many electronic parts as possible at the beginning, and a smaller number of electronic parts may be crimped at a time. For example, even when six electronic components 2 are mounted on one side of the glass substrate 1 and four electronic components 2 can be pressed at a time by the pressing tool 26, three electronic components 2 are two by two. You may make it heat-press in divided.
Further, when all the electronic components 2 mounted on one side of the glass substrate 1 can be heated and pressed at once by the pressurizing tool 26, the outside of the electronic component 2 (glass) positioned at one end of the side. The end of the substrate 1 is aligned with the corresponding end of the pressing surface 26a of the pressing tool 26, and the sheet member is placed on the outer end of the electronic component 2 located on the other end of the glass substrate 1. The 36 corresponding edges may be aligned.
Further, FIGS. 6 to 9 show other embodiments of the positions that the pressure tool 26 can take and the order of pressing by the pressure tool 26. In each figure, the circled numbers indicate the pressing order, and the thick solid line indicates the position of the sheet member.
In FIG. 6, the electronic components 2 that can be pressed together are pressed from the left side, the electronic components 2 that can be pressed together are pressed from the right side, and finally the remaining electronic components 2 are pressed alternately. The case where it is made to perform is shown.
FIG. 7 shows a case where the pressing tool 26 does not protrude to the right side of the substrate and the electronic components 2 that can be pressed together in order from the left are pressed.
FIG. 8 shows a case where the electronic component 2 existing on the side is divided into two equal parts and pressed.
FIG. 9 is similar to FIG. 6, but shows the order when the number of electronic components 2 is large compared to the length of the pressing tool 26.

It is a perspective view which shows the structure of the electronic component crimping | compression-bonding apparatus which concerns on this invention. It is a front view which shows the operation state of an electronic component crimping device. It is a right view of the electronic component crimping apparatus of FIG. It is a partial enlarged front view which shows the operation state of an electronic component crimping device. 3 is a front view showing a crimping operation state with respect to an electronic component at a position different from that in FIG. 2 in the electronic component crimping apparatus of FIG. It is a schematic diagram which shows another embodiment of the position which the pressurization tool of the electronic component crimping apparatus by this invention can take, and the press order by a pressurization tool. It is a schematic diagram which shows another embodiment of the position which the pressurization tool of the electronic component crimping apparatus by this invention can take, and the press order by a pressurization tool. It is a schematic diagram which shows another embodiment of the position which the pressurization tool of the electronic component crimping apparatus by this invention can take, and the press order by a pressurization tool. It is a schematic diagram which shows another embodiment of the position which the pressurization tool of the electronic component crimping apparatus by this invention can take, and the press order by a pressurization tool. It is a figure which shows the example of mounting of the control apparatus of the electronic component crimping | compression-bonding apparatus by embodiment of invention. FIG. 11A is a plan view showing an example of a glass substrate on which an electronic component is mounted, and FIG. 11B is a side view thereof. It is. It is a schematic diagram which shows the structure of the conventional electronic component crimping | compression-bonding apparatus. It is a schematic diagram which shows the operation state in the electronic component crimping apparatus of FIG. It is a schematic diagram which shows the operation state in the electronic component crimping apparatus of FIG. It is a schematic diagram which shows the problem of the conventional electronic component crimping | compression-bonding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Electronic component 10, 21 Electronic component crimping device 11, 28 Pressure cylinder 12, 14, 27, 30 Heater 13, 26 Press tool 15, 29 Backup tool 16, 36 Sheet member 21 Crimp head 22 Pressure receiving unit 23 Substrate stage 24 Sheet member supply unit 25 Controller 26a Pressure surface 31 Support portion 32 XY table 33 θ table 34 Holder 35 Position adjustment device 37 Supply reel 38 Storage reel 39, 40 Guide roller 57 Input / output control unit 59 User interface 61 Parameters Setting unit 63 Network control unit 71 Code reader

Claims (2)

  An electronic component crimping apparatus for mounting a plurality of electronic components in a straight line on a substrate using a buffer member, a pressure tool for applying pressure to the electronic component, and a pressure provided opposite to the pressure tool A receiving tool, a substrate holding tool that supports the substrate between the pressing tool and the pressure receiving tool, a buffer member holding tool that holds the buffer member between the substrate and the pressing tool, and the processing tool. A position adjusting device that is connected to at least one of the pressure tool and the buffer member holding tool and relatively moves the pressure tool and the buffer member holding tool with respect to the linear direction; and controls the pressure tool. An electronic component crimping apparatus comprising the substrate and a control device for crimping the electronic component.   An electronic component crimping method in which a plurality of electronic components are arranged on a straight line and mounted on a substrate using a buffer member, the step of arranging the plurality of electronic components at a predetermined position on the substrate, and the substrate as a pressing tool Moving relative to the electronic component, adjusting the position of the entire electronic component that is closest to one end of the substrate among the electronic components, and adjusting the substrate relative to the pressing tool. At the same time as or before and after the moving step, the buffer member is moved relative to the pressurizing tool, and at the time of crimping the electronic component, one end of the buffer member is in the vicinity of one end of the substrate. From the step of adjusting the position of the buffer member relative to the pressurizing tool so as to be positioned inside the one end of the pressurizing tool and the one end of the substrate. Electronic parts crimping how.

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