JP2007329321A - Electronic component mounting substrate, display panel, display device, and display device manufacturing method - Google Patents

Abstract

A flexible printed circuit board, a display panel, a display device, and a method for manufacturing the display device that suppress the occurrence of a connection failure between a controller and a substrate on which the controller is mounted.
A flexible printed board includes a resin base material having external connection terminals, an IC chip having a linear expansion coefficient different from that of the resin base material, and external connection terminals, and the external connection terminals are resin base materials. A controller provided so as to be electrically connected to the external connection terminal, and between the resin base material and the controller, the linear expansion coefficient is the linear expansion coefficient of the resin base material and the linear expansion coefficient of the IC chip. An intermediate member having a member main body with a value between.
[Selection] Figure 3

Description

  The present invention relates to an electronic component mounting substrate, a display panel, a display device, and a method for manufacturing the display device.

  Conventionally, in a technique for mounting a semiconductor chip on a printed circuit board, a flip chip mounting method has been developed and studied from the viewpoint of reducing the mounting area and improving the electrical characteristics. In the flip chip mounting method, the semiconductor chip and the printed circuit board are not connected by wires as in wire bonding, but are connected by protruding external connection terminals called bumps arranged in an array.

As a technique related to the flip chip mounting method, for example, Patent Document 1 includes a printed wiring board having connection wiring for an IC chip and a semiconductor thin layer IC chip supported by a thick chip substrate. The semiconductor thin layer whose thermal expansion coefficient is significantly different from that of the printed wiring board is considered to be the thermal expansion coefficient of the chip substrate so as not to generate an undesired level of stress within a predetermined temperature range when the flip chip is mounted. A device that is formed to be sufficiently thinner than a chip substrate so as to be substantially the same is disclosed. According to this, it is described that it is possible to provide an IC chip device and a method for manufacturing the IC chip device that can reliably flip-chip bond an IC chip having a different thermal expansion coefficient and a printed wiring board.
JP 07-007042 A

  When manufacturing a mounting substrate for an electronic component such as a semiconductor chip using the conventional general flip chip mounting method described above, solder or a conductive adhesive is provided between the semiconductor chip and the printed circuit board and heated. Connect them.

  However, since the semiconductor chip and the printed circuit board on which the semiconductor chip is mounted are made of materials having different linear expansion coefficients, when the solder or the conductive adhesive is provided and heated as described above, the difference between the linear expansion coefficients causes them to be heated. Deviation occurs in the position. When the heating of the solder or the conductive adhesive is stopped, the expanded semiconductor chip and printed circuit board return to room temperature and begin to shrink. Thus, the position of the semiconductor chip and the printed circuit board on which the semiconductor chip is mounted is shifted. If so, stress is applied to the hardened solder or conductive adhesive when they begin to shrink. When this stress exceeds the breaking stress of the cured solder or conductive adhesive, the cured solder or conductive adhesive is damaged or peeled off, causing a problem that the connection between the semiconductor chip and the printed board is cut.

  The present invention has been made in view of such various points, and an object of the present invention is to provide an electronic component mounting substrate, a display panel, and a display device that suppress the occurrence of poor connection between the electronic component and the substrate on which the electronic component is mounted. And a method of manufacturing a display device.

  An electronic component mounting board according to the present invention includes a base board having external connection terminals, a component body having a linear expansion coefficient different from that of the base board, and external connection terminals, and the external connection terminals are external to the base board. An electronic component provided to be electrically connected to the connection terminal, and provided between the base substrate and the electronic component, the linear expansion coefficient is between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body. And an intermediate member having a member body having a value of.

  Here, the linear expansion coefficient is the rate of increase in the unit length of the solid by raising the temperature of 1 ° C. (K) under a constant pressure.

  According to such a configuration, the intermediate member having the member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body is provided between the base substrate and the electronic component. Therefore, the base substrate and the electronic component are not directly opposed to each other but have an intermediate member interposed therebetween. For this reason, the base substrate is connected to an intermediate member having a smaller linear expansion coefficient difference than the electronic component, and the electronic component is further connected to an intermediate member having a smaller linear expansion coefficient difference than the base substrate. Therefore, in the step of connecting them, when the solder or the conductive adhesive is provided and heated, the occurrence of misalignment due to the difference in linear expansion coefficient can be suppressed. By suppressing the occurrence of misalignment, it is possible to reduce the stress applied to the solder or the conductive adhesive when the electronic component and the base substrate, which have been expanded by heating, contract back to normal temperature. For this reason, it is possible to suppress poor connection between the electronic component and the base substrate due to occurrence of damage or peeling of the cured solder or the conductive adhesive.

  Furthermore, in the electronic component mounting board according to the present invention, the member main body of the intermediate member may have a linear expansion coefficient that is substantially intermediate between the linear expansion coefficient of the base board and the linear expansion coefficient of the component main body.

  According to such a configuration, the stress generated by the difference in linear expansion coefficient between the base substrate and the component main body of the electronic component is evenly dispersed, so that the stress relaxation action applied to the cured conductive resin adhesive is further improved. To do.

  In the electronic component mounting substrate according to the present invention, a plurality of intermediate members are provided so as to be laminated between the base substrate and the electronic component, and the plurality of intermediate members are linearly expanded between the base substrate and the component body. The members may be laminated in order from the one with the larger coefficient of linear expansion to the one with the smaller coefficient as it goes from the larger coefficient side to the smaller coefficient side.

  According to such a configuration, the plurality of intermediate members increase in the linear expansion coefficient of the member main body from the one on the side of the base substrate and the component main body having the larger linear expansion coefficient toward the one on the smaller side. From the base substrate and the member body of the intermediate member adjacent to the base substrate, and the component body of the electronic component and the member body of the intermediate member adjacent to the component body. The differences in the linear expansion coefficients are smaller. Therefore, the stress applied to the solder or conductive adhesive due to the difference in linear expansion coefficient can be further reduced. For this reason, poor connection between the electronic component and the base substrate due to occurrence of damage or peeling of the cured solder or the conductive adhesive can be more effectively suppressed.

  Furthermore, in the electronic component mounting substrate according to the present invention, the intermediate member is provided at a position corresponding to each of the external connection terminal of the base substrate and the external connection terminal of the electronic component, and the external connection terminal of the base substrate and the electronic component A conductive portion that electrically connects the external connection terminal may be provided.

  According to such a configuration, the intermediate member is provided at a position corresponding to each of the external connection terminal of the base substrate and the external connection terminal of the electronic component, and the external connection terminal of the base substrate and the external connection terminal of the electronic component. Since there is a conductive part that electrically connects the external connection terminal of the base substrate and the external connection terminal of the electronic component, the connection between the external connection terminal of the electronic component and the external connection terminal is not directly fixed with solder or the like between members having a large difference in linear expansion coefficient. May be. Therefore, the connection failure between the external connection terminals can be suppressed better.

  A display panel according to the present invention includes a base substrate having external connection terminals, a component body having a linear expansion coefficient different from that of the base substrate, and external connection terminals, and the external connection terminals are external connection terminals of the base substrate. Between the base substrate and the electronic component, and the linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body. And an intermediate member having a member main body, and an electronic component mounting board.

  According to such a configuration, in the electronic component mounting substrate constituting the display panel, the intermediate member having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body. Since the base substrate and the electronic component are provided between the base substrate and the electronic component, the base substrate and the electronic component are not directly opposed to each other, and the intermediate member is interposed therebetween. For this reason, the base substrate is connected to an intermediate member having a smaller linear expansion coefficient difference than the electronic component, and the electronic component is further connected to an intermediate member having a smaller linear expansion coefficient difference than the base substrate. Therefore, in the step of connecting them, when the solder or conductive adhesive is provided and heated, the occurrence of misalignment due to the difference in linear expansion coefficient is suppressed and the stress applied to the solder or conductive adhesive is reduced. be able to. Therefore, it is possible to obtain a display panel including an electronic component mounting substrate that can suppress a connection failure between the electronic component and the base substrate due to damage or peeling of the cured solder or conductive adhesive.

  A display device according to the present invention includes a base substrate having external connection terminals, a component body having a linear expansion coefficient different from that of the base substrate, and external connection terminals, and the external connection terminals are external connection terminals of the base substrate. Between the base substrate and the electronic component, and the linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body. And an intermediate member having a member main body, and an electronic component mounting board.

  According to such a configuration, in the electronic component mounting substrate constituting the display device, the intermediate member having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body is provided. Since the base substrate and the electronic component are provided between the base substrate and the electronic component, the base substrate and the electronic component are not directly opposed to each other, and the intermediate member is interposed therebetween. For this reason, the base substrate is connected to an intermediate member having a smaller linear expansion coefficient difference than the electronic component, and the electronic component is further connected to an intermediate member having a smaller linear expansion coefficient difference than the base substrate. Therefore, in the step of connecting them, when the solder or conductive adhesive is provided and heated, the occurrence of misalignment due to the difference in linear expansion coefficient is suppressed and the stress applied to the solder or conductive adhesive is reduced. be able to. Therefore, it is possible to obtain a display device including an electronic component mounting substrate that can suppress a connection failure between the electronic component and the base substrate due to damage or peeling of the cured solder or conductive adhesive.

  A method for manufacturing a display device according to the present invention is a method for manufacturing a display device in which an electronic component having a component body having a linear expansion coefficient different from that of a base substrate is mounted on a base substrate, the step of preparing the base substrate, Providing an intermediate member having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body on the substrate; and providing an electronic component on the intermediate member; It is provided with.

  According to such a configuration, the intermediate member having the member main body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component main body is provided between the base substrate and the electronic component. The base substrate and the electronic component can be configured such that the intermediate member is interposed therebetween without directly facing each other. For this reason, the base substrate is connected to an intermediate member having a smaller linear expansion coefficient difference than the electronic component, and the electronic component is further connected to an intermediate member having a smaller linear expansion coefficient difference than the base substrate. Therefore, in the step of connecting them, when the solder or conductive adhesive is provided and heated, the occurrence of misalignment due to the difference in linear expansion coefficient is suppressed and the stress applied to the solder or conductive adhesive is reduced. be able to. For this reason, it is possible to suppress poor connection between the electronic component and the base substrate due to occurrence of damage or peeling of the cured solder or the conductive adhesive.

  According to the present invention, it is possible to provide an electronic component mounting substrate, a display panel, a display device, and a method for manufacturing the display device that suppress the occurrence of poor connection between the electronic component and the substrate on which the electronic component is mounted.

(Embodiment 1)
(Configuration of liquid crystal display device)
Next, the display device according to the first embodiment will be described in detail with reference to the drawings, taking a liquid crystal display device as an example.

  FIG. 1 is a plan view of the liquid crystal display device 10. FIG. 2 is a sectional view taken along line II-II of the liquid crystal display device 10 of FIG.

  The liquid crystal display device 10 includes a laminated structure 14 having a liquid crystal display panel 13 having a source driver 11 and a gate driver 12, and a flexible printed circuit board connected to the liquid crystal display panel 13 of the laminated structure 14 and mounted with a controller 15. 16.

  The laminated structure 14 is configured by laminating the backlight unit 17 and the liquid crystal display panel 13 in this order from the lower layer to the upper layer.

  The backlight unit 17 is provided so as to cover a light guide plate, a lens sheet provided on the surface of the light guide plate, and a cold cathode tube and a cold cathode tube disposed below the light guide plate, respectively, not shown. It is composed of a holder, and these are integrated and set on a frame made of plastic or the like. Here, the backlight unit 17 constitutes a direct type backlight unit.

  The liquid crystal display panel 13 is stacked on the upper surface of the backlight unit 17. The liquid crystal display panel 13 is configured by bonding a CF substrate 18 and a TFT substrate 19 through a liquid crystal material 20 and a spacer 21.

  The CF substrate 18 is provided with polarizing plates 23 on both surfaces of a glass substrate 22 on which a CF layer is formed. The CF layer is composed of a fine pattern composed of three primary colors of red (R), green (G), and blue (B), and a black matrix provided as a border for obtaining contrast therebetween. In addition to the combination of RGB, complementary colors of cyan, magenta, and yellow may be used as constituents of the fine pattern.

  The TFT substrate 19 is configured by arranging TFTs and pixel regions constituting a switching element provided at each intersection of a gate line and a source line in an array on a glass substrate 24 on which a polarizing plate 25 is formed. ing.

  The switching element includes a gate electrode, a gate insulating film formed of silicon nitride covering the gate electrode, a semiconductor layer formed on the gate insulating film, a source electrode, a drain electrode, and the like. The TFT substrate 19 is formed larger than the CF substrate 18 in plan view, and an excess portion 26 of the TFT substrate 19 is formed when these are bonded together. In the surplus portion 26, the source driver 11 and the gate driver 12 are COG-mounted.

  The polarizing plates 23 and 25 each have a light absorption anisotropy by adsorbing or dyeing a dichroic dye such as iodine or a dye on a polyvinyl alcohol (PVA) film or the like, and uniaxially stretching and orienting with high accuracy. What has been used is used as the substrate.

  A plurality of source drivers 11 and gate drivers 12 are formed in the surplus portion 26 of the TFT substrate 19 and are arranged in a row.

  The flexible printed circuit board 16 is connected to the surplus portion 26 of the TFT substrate. The flexible printed circuit board 16 is formed of a resin base material 35 made of an epoxy resin. Further, the constituent material of the flexible printed circuit board 16 may be other than an epoxy resin, such as a phenol-epoxy mixed resin, a bismaleimide-triazine mixed resin, polycarbonate, polyethersulfone, or polyetherimide. May be used.

  Metal wiring is patterned on the flexible printed circuit board 16, and a plurality of ends of the metal wiring constitute external connection terminals 27 as shown in FIG. 3. The external connection terminal 27 of the flexible printed circuit board 16 is, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium oxide / tin oxide (ITO: Indium) Tin Oxide), zinc oxide, indium zinc oxide (IZO), and the like. The flexible printed circuit board 16 is electrically connected to the external connection terminal 27 and has a controller 15 for transmitting a control signal for controlling the TFT and an image signal for driving the TFT. An intermediate member 28 is provided between the flexible printed circuit board 16 and the controller 15.

  The controller 15 is composed of an IC chip 29 made of silicon resin. The controller 15 has a plurality of external connection terminals 30 formed on the surface of the flexible printed circuit 16 side. The plurality of external connection terminals 30 of the controller 15 are formed at positions facing the external connection terminals 27 of the corresponding flexible printed circuit board 16. The plurality of external connection terminals 30 of the controller 15 are, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium oxide / tin oxide (ITO: Indium) Tin Oxide), zinc oxide, indium zinc oxide (IZO), and the like.

  The intermediate member 28 is provided between the flexible printed circuit board 16 and the controller 15. The intermediate member 28 is formed in a flat plate shape that has substantially the same shape as the controller 15 in plan view. The intermediate member 28 includes a conductive portion 31 and a member main body 32.

The member main body 32 has a plurality of holes through which a conductive portion 31 described later passes, and is formed in a flat plate shape. The member body 32 is a material whose linear expansion coefficient has a value between the epoxy resin that is a constituent material of the resin base material 35 of the flexible printed circuit board 16 and the silicon resin IC chip 29 that constitutes the controller 15, For example, it is composed of an epoxy resin, an acrylic resin, a phenol resin, a urea resin, an imide resin, an amide resin, or the like mixed with a mixed material such as silica (silicon dioxide: SiO ₂ ) powder. The member main body 32 is configured by adding a mixed material such as siliceous powder to the resin material in this way, so that the linear expansion coefficient between the IC chip 29 of the controller 15 and the resin base material 35 of the flexible printed circuit board 16 that face each other. The linear expansion coefficient is adjusted so as to be a value between.

  Further, the intermediate member 28 has a linear expansion coefficient that is substantially the intermediate value of the linear expansion coefficient between the IC chip 29 of the controller 15 and the resin base material 35 of the flexible printed circuit board 16. It is good.

  A plurality of conductive portions 31 are formed so as to penetrate the member main body 32 in the thickness direction. The conductive portion 31 is provided at each position sandwiched between the plurality of external connection terminals 27 of the flexible printed circuit board 16 and the plurality of external connection terminals 30 of the controller 15 provided to face them. . The conductive portion 31 is formed so that the cross section thereof has the same shape as the external connection terminal 27 of the flexible printed circuit board 16 and the external connection terminal 30 of the controller 15 in plan view. The conductive portion 31 is, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium tin oxide (ITO), zinc oxide. Indium Zinc Oxide (IZO) or the like.

  A conductive adhesive 36 is provided between the intermediate member 28 and the flexible printed circuit board 16, and between the intermediate member 28 and the controller 15, and these are adhered to each other by the conductive adhesive 36. Yes. The conductive adhesive 36 is, for example, about 0.1 to 5 μm in an adhesive composed of a single compound or a plurality of mixtures such as an epoxy resin, an acrylic resin, a polyester resin, and a urethane resin. It is formed by mixing and dispersing metals such as Ag, Cu, Zn, Pd, and Sn, and alloys such as Cu—Zn, Au—Sn, and Ag—Pd.

(Manufacturing method of the liquid crystal display device 10)
Next, the manufacturing method of the liquid crystal display device 10 according to Embodiment 1 of the present invention will be described in detail.

(Preparation of flexible printed circuit board 16)
First, a flexible resin base material 35 having a thickness of, for example, about 0.2 mm is prepared.

  Next, a metal wiring made of Cu, Ni, or the like is patterned on the resin base material 35, and a plurality of ends of the metal wiring are used as the external connection terminals 27.

  Next, the intermediate member 28 is prepared, and the conductive portion 31 is disposed on the resin base material 35 so as to face the external connection terminals 27 with the conductive adhesive 36 provided therebetween.

  Next, a controller 15 composed of an IC chip 29 made of silicon resin is prepared, and the external connection terminal 27 faces the conductive portion 31 on the intermediate member 28 with the conductive adhesive 36 provided therebetween. It arrange | positions so that it may do.

  Next, the controller 15 and the intermediate member 28 are heated in a state where the controller 15 and the intermediate member 28 are pressed against the resin base material 35. At this time, since the controller 15, the intermediate member 28, and the resin base material 35 are also heated, they expand according to their respective linear expansion coefficients.

  Next, when the heating adhesive is finished for a while after the heating is completed, the conductive adhesive 36 is cured, whereby the resin base material 35 and the intermediate member 28, and the intermediate member 28 and the controller 15 are firmly bonded. The controller 15, the intermediate member 28, and the resin base material 35 gradually return to room temperature and contract. At this time, since the linear expansion coefficient of the intermediate member 28 is a value between the linear expansion coefficients of the resin base material 35 and the silicon resin IC chip 29, the difference in linear expansion coefficient between adjacent members is reduced. Accordingly, the stress applied to the conductive adhesive 36 is reduced.

(Preparation of liquid crystal display panel 13)
Next, glass substrates 22 and 24 each having a thickness of about 0.7 mm are prepared.

  Next, a TFT, a pixel electrode, a source driver 11, a gate driver 12, and the like using low-temperature polysilicon as an active layer are formed on the glass substrate 24, for example. At this time, the pixel electrodes are formed in the display area of the liquid crystal display panel 13, and the source driver 11 and the gate driver 12 are formed so as to extend in a line at the end of the glass substrate 24 with a predetermined distance from the display area. Metal wiring of the display panel 13 is formed around the display area.

  Subsequently, a sealing material is applied and formed in a frame shape so as to surround the display region. The sealing material is drawn by a dispenser using, for example, an epoxy adhesive. At this time, the metal wiring extends to the outside of the sealing material and has an external connection terminal at the end.

  Next, a counter electrode made of, for example, ITO, a color filter, and the like are formed on the glass substrate 22 at positions corresponding to the display area.

  Next, a predetermined amount of the liquid crystal material 20 is dropped on a region surrounded by the sealing material on the glass substrate 24.

  Next, after positioning the glass substrates 22 and 24 so that the display area on the glass substrate 24 and the counter electrode on the glass substrate 22 face each other, pressurizing them with a predetermined pressure, and bonding them together with a sealing material, The sealing material is cured and bonded.

  Next, the glass substrates 22 and 24 are thinned by polishing or the like so that the thickness thereof is, for example, 0.2 mm or less.

  Next, a polarizing plate having a thickness of, for example, 0.35 mm is bonded to the surface of the bonded substrate including the glass substrates 22 and 24 through an adhesive layer.

  Next, if necessary, the bonded substrate is cut into a predetermined size with a harmonic UV-YAG laser or the like.

(Production of liquid crystal display device 10)
Subsequently, the side edge part of the flexible printed circuit board 16 which mounted the controller 15 as mentioned above is connected to the surplus part 26 of the TFT substrate 19 with a conductive adhesive.

  Next, a light guide plate having a lens sheet on the surface is prepared, and a bar-shaped light source is arranged below the light guide plate to form the backlight unit 17, which is installed on the back surface (TFT substrate 19 side) of the liquid crystal display panel 13. Thus, the liquid crystal display device 10 is manufactured.

(Embodiment 2)
(Configuration of the liquid crystal display device 60)
Next, the configuration of the liquid crystal display device 60 according to the second embodiment will be described in detail with reference to the drawings.

  As in the first embodiment, the liquid crystal display device 60 has a plan view as shown in FIG. 1 and a cross-sectional view as shown in FIG. A cross-sectional view of the controller 65, the intermediate members 88 and 89, and the flexible printed circuit board 66 of the liquid crystal display device 60 is expressed as shown in FIG.

  Here, in the liquid crystal display device 10 shown in the first embodiment, only one layer of the intermediate member 28 is formed between the controller 15 and the flexible printed board 16 as described above. The liquid crystal display device 60 is one in which two layers of intermediate members 88 and 89 are formed. The intermediate member may be composed of three or more layers.

  The liquid crystal display device 60 includes a laminated structure 64 having a liquid crystal display panel 63 having a source driver 61 and a gate driver 62, and a flexible printed circuit board connected to the liquid crystal display panel 63 of the laminated structure 64 and mounted with a controller 65. 66.

  The multilayer structure 64 is configured by laminating a backlight unit 67 similar to the backlight unit 17 of the liquid crystal display device 10 and a liquid crystal display panel 63 in this order from the lower layer to the upper layer.

  The liquid crystal display panel 63 is stacked on the upper surface of the backlight unit 67. The liquid crystal display panel 63 is configured by bonding a CF substrate 68 and a TFT substrate 69 similar to those of the liquid crystal display device 10 through a liquid crystal material 70 and a spacer 71.

  The flexible printed circuit board 66 is connected to the surplus portion 76 of the TFT substrate 69. The flexible printed circuit board 66 is formed of a resin base material 85 made of an epoxy resin. The constituent material of the flexible printed circuit board 66 may be other than an epoxy resin, for example, phenol-epoxy mixed resin, bismaleimide-triazine mixed resin, polycarbonate, polyethersulfone, or polyetherimide. May be used.

  Metal wiring is patterned on the flexible printed circuit board 66, and a plurality of ends of the metal wiring constitute external connection terminals 77. The external connection terminal 77 of the flexible printed circuit board 66 is, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium oxide / tin oxide (ITO: Indium) Tin Oxide), zinc oxide, indium zinc oxide (IZO), and the like. The flexible printed circuit board 66 is electrically connected to the external connection terminal 77 and has a controller 65 for transmitting a control signal for controlling the TFT and an image signal for driving the TFT. Intermediate members 88 and 89 are provided between the flexible printed circuit board 66 and the controller 65.

  The controller 65 constitutes an IC chip 79 made of silicon resin. The controller 65 has a plurality of external connection terminals 80 formed on the surface on the flexible printed circuit board 66 side. The plurality of external connection terminals 80 of the controller 65 are formed at positions facing the external connection terminals 77 of the corresponding flexible printed circuit board 66. The plurality of external connection terminals 77 of the controller 65 are, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium oxide / tin oxide (ITO: Indium) Tin Oxide), zinc oxide, indium zinc oxide (IZO), and the like.

  The intermediate members 88 and 89 are provided so as to be stacked between the flexible printed circuit board 66 and the controller 65, respectively. The intermediate members 88 and 89 are each formed in a flat plate shape that has substantially the same shape as the controller 65 in plan view. The intermediate members 88 and 89 are each composed of a conductive portion 81 and a member main body 82.

The member main body 82 has a plurality of holes through which the conductive portion 81 passes, and is formed in a flat plate shape. The member main body 82 has a linear expansion coefficient of a material having a value between an epoxy resin that is a constituent material of the flexible printed circuit board 66 and a silicon resin IC chip 79 that constitutes the controller 65, for example, silica (dioxide dioxide). It is composed of an epoxy resin, an acrylic resin, a phenol resin, a urea resin, an imide resin, an amide resin, or the like mixed with a mixed material such as silicon: SiO ₂ ) powder. The member main body 82 is configured by adding a mixed material such as siliceous powder to the resin material in this way, so that the member main body 82 has a value between the coefficient of linear expansion between the component main body of the opposing electronic component and the base substrate. The linear expansion coefficient is adjusted. Further, of the two intermediate members 88 and 89 to be stacked, the intermediate member 89 on the side of the flexible printed circuit board 66 having a large linear expansion coefficient has a higher linearity than the intermediate member 88 on the controller 65 side having a small linear expansion coefficient. It is formed with a high expansion coefficient. That is, the intermediate members 88 and 89 have a larger linear expansion coefficient of the member main body 82 as they go from the flexible printed circuit board 66 and the controller 65 having the larger linear expansion coefficient toward the smaller one. They are stacked in order of decreasing size.

  A plurality of conductive portions 81 are formed so as to penetrate the member main body 82 in the thickness direction. The conductive portion 81 is provided at each position sandwiched between the plurality of external connection terminals 77 of the flexible printed circuit board 66 and the plurality of external connection terminals 80 of the controller 65 provided to face them. . The conductive portions 81 are formed so that the cross section thereof has the same shape as the external connection terminal 77 of the flexible printed circuit board 66 and the external connection terminal 80 of the controller 65 in plan view. The conductive portion 81 is made of, for example, copper, platinum, gold, silver, palladium, tantalum, nickel, chromium, aluminum, or an alloy thereof, tin oxide, indium tin oxide (ITO), zinc oxide. Indium Zinc Oxide (IZO) or the like.

  A conductive adhesive 86 is provided between the intermediate member 89 and the flexible printed circuit board 66, between the intermediate member 89 and the intermediate member 88, and between the intermediate member 88 and the controller 65. These are bonded by a conductive adhesive 86. The conductive adhesive 86 is, for example, about 0.1 to 5 μm in an adhesive composed of a single compound or a mixture of epoxy resins, acrylic resins, polyester resins, urethane resins, and the like. A metal such as Ag, Cu, Zn, Pd, or Sn having a particle diameter or an alloy such as Cu—Zn, Au—Sn, or Ag—Pd is mixed and dispersed.

(Manufacturing method of the liquid crystal display device 60)
Next, a manufacturing method of the liquid crystal display device 60 according to Embodiment 2 of the present invention will be described in detail.

(Preparation of flexible printed circuit board 66)
First, a flexible resin base 85 having a thickness of, for example, about 0.2 mm is prepared.

  Next, a metal wiring made of Cu, Ni or the like is formed on the resin base material 85, and a plurality of ends of the metal wiring are used as external connection terminals 77.

  Next, the intermediate member 89 is prepared, and the conductive portion 81 is disposed on the resin base material 85 so as to face the external connection terminal 77 with the conductive adhesive 86 provided therebetween.

  Next, a controller 65 including an intermediate member 88 and a silicon resin IC chip 79 is prepared, and the external connection terminal 80 is provided on the intermediate member 88 with a conductive adhesive 86 therebetween. It is arranged so as to face 81.

  Next, the controller 65 and the intermediate members 88 and 89 are heated in a state where they are pressed against the resin base material 85. At this time, since the controller 65, the intermediate members 88 and 89, and the resin base material 85 are also heated, they expand according to their respective linear expansion coefficients.

  Next, after the heating is finished, the conductive adhesive 86 is cured after a while, so that the resin base material 85 and the intermediate member 89, the intermediate member 89 and the intermediate member 88, and the intermediate member 88 and the controller 65 are cured. Is firmly bonded. The controller 65, the intermediate members 88 and 89, and the resin base material 85 gradually return to room temperature and contract. At this time, the intermediate members 88 and 89 have a larger linear expansion coefficient of the member main body 82 as they move from the flexible printed circuit board 66 and the controller 65 having the larger linear expansion coefficient toward the smaller one. Are stacked in order from the smallest to the smallest. For this reason, the difference of the linear expansion coefficient between adjacent members becomes even smaller than that of the intermediate member, and the stress applied to the conductive adhesive 86 is reduced accordingly.

(Preparation of liquid crystal display panel 63)
Next, glass substrates 72 and 74 each having a thickness of about 0.7 mm are prepared.

  Next, a TFT, a pixel electrode, a source driver 61, a gate driver 62, and the like using low temperature polysilicon as an active layer are formed on the glass substrate 74, for example. At this time, the pixel electrode is formed in the display area of the liquid crystal display panel 63, and the source driver 61 and the gate driver 62 are formed to extend in a line at the end of the glass substrate 74 with a predetermined distance from the display area. Metal wiring of the display panel 63 is formed around the display area.

  Subsequently, a sealing material is applied and formed in a frame shape so as to surround the display region. The sealing material is drawn by a dispenser using, for example, an epoxy adhesive. At this time, the metal wiring extends to the outside of the sealing material and has an external connection terminal at the end.

  Next, a counter electrode made of, for example, ITO, a color filter, and the like are formed on the glass substrate 72 at positions corresponding to the display area.

  Next, a predetermined amount of the liquid crystal material 70 is dropped onto a region surrounded by the sealing material on the glass substrate 74.

  Next, the glass substrates 72 and 74 are positioned and arranged so that the display area on the glass substrate 74 and the counter electrode on the glass substrate 72 are opposed to each other, and are pressed with a predetermined pressure and bonded with a sealant, The sealing material is cured and bonded.

  Next, the glass substrates 72 and 74 are polished and thinned by etching or the like so that the thickness thereof becomes, for example, 0.2 mm or less.

  Next, a polarizing plate having a thickness of, for example, 0.35 mm is bonded to the surface of the bonded substrate including the glass substrates 72 and 74 through an adhesive layer.

  Next, if necessary, the bonded substrate is cut into a predetermined size with a harmonic UV-YAG laser or the like.

(Production of liquid crystal display device 60)
Next, the side end portion of the flexible printed circuit board 66 on which the controller 65 is mounted as described above is connected to the surplus portion 76 of the TFT substrate 69 with a conductive adhesive.

  Next, a light guide plate provided with a lens sheet on the surface is prepared, and a bar-shaped light source is arranged below the light guide plate to form a backlight unit 67, which is installed on the back surface of the liquid crystal display panel 63 (TFT substrate 69 side). As a result, the liquid crystal display device 60 is manufactured.

  The combination of the base substrate and the electronic component on which the intermediate members 28, 88, and 89 are provided is not limited to the combination shown in the first and second embodiments, and other combinations are possible as long as they have different linear expansion coefficients. Can be applied to. For example, a glass epoxy substrate may be used as the base substrate, and a silicon IC chip having a linear expansion coefficient smaller than that of glass epoxy may be used as the electronic component mounted thereon. Further, other resin IC chips may be used as electronic components for COG mounting on a glass substrate.

  Further, in the present embodiment, the display device related to an LCD (liquid crystal display) is shown, but a PD (plasma display), a PALC (plasma addressed liquid crystal display) is shown. ), Organic EL (organic electroluminescence), inorganic EL (inorganic electroluminescence), FED (field emission display), or SED (surface-conduction electron-emitter display) It may be.

(Function and effect)
The flexible printed boards 16 and 66 (electronic component mounting boards) according to the first and second embodiments of the present invention include resin base materials 35 and 85 (base boards) having external connection terminals 27 and 77, resin base materials 35, IC chips 29 and 79 (component main bodies) having different linear expansion coefficients from 85 and external connection terminals 30 and 80, and the external connection terminals 30 and 80 are external connection terminals 27 of the resin base materials 35 and 85. , 77 are provided between the controllers 15 and 65 (electronic parts) provided so as to be electrically connected to the resin base materials 35 and 85 and the controllers 15 and 65, and the linear expansion coefficient is the resin base material 35. , 85 and intermediate members 28, 88, 89 having member bodies 32, 82 that are values between the linear expansion coefficients of the IC chips 29, 79.

  According to such a configuration, the intermediate member 28 having the member main bodies 32 and 82 whose linear expansion coefficient is a value between the linear expansion coefficient of the resin base materials 35 and 85 and the linear expansion coefficient of the IC chips 29 and 79, Since 88 and 89 are provided between the resin base materials 35 and 85 and the controllers 15 and 65, the resin base materials 35 and 85 and the controllers 15 and 65 do not face each other directly, 88 and 89 are interposed. For this reason, the resin base materials 35 and 85 are connected to the intermediate members 28 and 89 having a smaller difference in linear expansion coefficient than the controllers 15 and 65, and the controllers 15 and 65 have a difference in linear expansion coefficient from the resin base materials 35 and 85. Are connected to intermediate members 28 and 88 having a small height. Accordingly, in the step of connecting them, when the conductive adhesives 36 and 86 are provided and heated, the occurrence of misalignment due to the difference in linear expansion coefficient can be suppressed. By suppressing the occurrence of misalignment, it is possible to reduce the stress applied to the conductive adhesives 36 and 86 when the controllers 15 and 65 and the resin base materials 35 and 85 that have expanded by heating return to room temperature and contract. it can. For this reason, it is possible to suppress poor connection between the controllers 15 and 65 and the resin base materials 35 and 85 due to occurrence of damage or peeling of the cured conductive adhesives 36 and 86.

  Further, in the flexible printed circuit board 16 according to the first embodiment of the present invention, the linear expansion coefficient of the member main body 32 of the intermediate member 28 is approximately between the linear expansion coefficient of the resin base material 35 and the linear expansion coefficient of the IC chip 29. It is a value.

  According to such a configuration, the stress caused by the difference in linear expansion coefficient between the resin base material 35 and the IC chip 29 is evenly dispersed, so that the action of relaxing the stress applied to the cured conductive adhesive 36 is further improved. To do.

  The flexible printed circuit board 66 according to the second embodiment of the present invention is provided with a plurality of intermediate members 88 and 89 so as to be laminated between the resin base material 85 and the controller 65, and a plurality of intermediate members. As the members 88 and 89 move from the resin substrate 85 and the IC chip 79 having the larger linear expansion coefficient toward the smaller one, the member main body 82 has a larger linear expansion coefficient from the smaller one. It is characterized by being laminated respectively.

  According to such a configuration, the plurality of intermediate members 88 and 89 move from the member having the larger linear expansion coefficient of the resin base material 85 and the IC chip 79 toward the member having the smaller linear member, and the member main body 82. Of the resin base material 85 and the member body 82 of the intermediate members 88 and 89 adjacent to the resin base material 85, and the IC of the controller 65. The difference in linear expansion coefficient between the chip 79 and the member main body 82 of the intermediate members 88 and 89 adjacent to the IC chip 79 becomes smaller. Therefore, the stress applied to the conductive adhesive 86 due to the difference in linear expansion coefficient can be further reduced. For this reason, the connection failure of the controller 65 and the resin base material 85 by generation | occurrence | production of damage or peeling of the hardened | cured conductive adhesive 86 can be suppressed more favorably.

  Furthermore, in the flexible printed circuit boards 16 and 66 according to the first and second embodiments of the present invention, the intermediate members 28, 88, and 89 are externally connected to the external connection terminals 27 and 77 of the resin base materials 35 and 85 and the controllers 15 and 65. Conduction provided at a position corresponding to each of the connection terminals 30 and 80 and electrically connecting the external connection terminals 27 and 77 of the resin base materials 35 and 85 and the external connection terminals 30 and 80 of the controllers 15 and 65. It has the part 31 and 81, It is characterized by the above-mentioned.

  According to such a configuration, the intermediate members 28, 88, 89 are provided at positions corresponding to the external connection terminals 27, 77 of the resin base materials 35, 85 and the external connection terminals 30, 80 of the controllers 15, 65. In addition, since the external connection terminals 27 and 77 of the resin base materials 35 and 85 and the external connection terminals 30 and 80 of the controllers 15 and 65 are electrically connected, the resin base materials 35 and 85 are provided. The connection between the external connection terminals 27 and 77 and the external connection terminals 30 and 80 of the controllers 15 and 65 may not be directly fixed by solder or the like between members having a large difference in linear expansion coefficient. Therefore, the connection failure between the external connection terminals can be suppressed better.

  The liquid crystal display panels 13 and 63 according to the first and second embodiments of the present invention include resin base materials 35 and 85 having external connection terminals 27 and 77, and an IC chip 29 having a linear expansion coefficient different from that of the resin base materials 35 and 85. 79 and external connection terminals 30 and 80, and the external connection terminals 30 and 80 are provided so as to be electrically connected to the external connection terminals 27 and 77 of the resin base materials 35 and 85. 15 and 65, between the resin base materials 35 and 85 and the controller 15 and 65, and the linear expansion coefficient is the linear expansion coefficient of the resin base materials 35 and 85 and the linear expansion coefficient of the IC chips 29 and 79. The flexible printed circuit board 16 and 66 comprised by the intermediate members 28, 88, and 89 which have the member main bodies 32 and 82 which are the values of between are characterized by the above-mentioned.

  According to such a configuration, in the flexible printed boards 16 and 66 constituting the liquid crystal display panels 13 and 63, the linear expansion coefficient is the linear expansion coefficient of the resin base materials 35 and 85 and the linear expansion coefficient of the IC chips 29 and 79. Since the intermediate members 28, 88, 89 having the member main bodies 32, 82 having a value between the resin base materials 35, 85 and the controllers 15, 65 are provided, The controllers 15 and 65 are not directly opposed to each other, and the intermediate members 28, 88 and 89 are interposed therebetween. For this reason, the resin base materials 35 and 85 are connected to the intermediate members 28 and 89 having a smaller difference in linear expansion coefficient than the controllers 15 and 65, and the controllers 15 and 65 have a difference in linear expansion coefficient from the resin base materials 35 and 85. Are connected to intermediate members 28 and 88 having a small height. Therefore, in the step of connecting them, when the conductive adhesives 36 and 86 are provided between them and heated, the stress applied to the conductive adhesives 36 and 86 is suppressed by suppressing the occurrence of misalignment due to the difference in linear expansion coefficient. Can be reduced. For this reason, the flexible printed circuit boards 16 and 66 which can suppress the connection failure of the controllers 15 and 65 and the resin base materials 35 and 85 by generation | occurrence | production of damage or peeling of the hardened conductive adhesives 36 and 86 were provided. The liquid crystal display panels 13 and 63 can be obtained.

  The liquid crystal display devices 10 and 60 according to the first and second embodiments of the present invention include resin base materials 35 and 85 having external connection terminals 27 and 77, and an IC chip 29 having a linear expansion coefficient different from that of the resin base materials 35 and 85. 79 and external connection terminals 30 and 80, and the external connection terminals 30 and 80 are provided so as to be electrically connected to the external connection terminals 27 and 77 of the resin base materials 35 and 85. 15 and 65, between the resin base materials 35 and 85 and the controller 15 and 65, and the linear expansion coefficient is the linear expansion coefficient of the resin base materials 35 and 85 and the linear expansion coefficient of the IC chips 29 and 79. The flexible printed circuit board 16 and 66 comprised by the intermediate members 28, 88, and 89 which have the member main bodies 32 and 82 which are the values of between are characterized by the above-mentioned.

  According to such a configuration, in the flexible printed circuit boards 16 and 66 constituting the liquid crystal display devices 10 and 60, the linear expansion coefficients are the linear expansion coefficients of the resin base materials 35 and 85 and the linear expansion coefficients of the IC chips 29 and 79, respectively. Since the intermediate members 28, 88, 89 having the member main bodies 32, 82 having a value between the resin base materials 35, 85 and the controllers 15, 65 are provided, The controllers 15 and 65 are not directly opposed to each other, and the intermediate members 28, 88 and 89 are interposed therebetween. For this reason, the resin base materials 35 and 85 are connected to the intermediate members 28, 88 and 89 having a smaller difference in linear expansion coefficient than the controllers 15 and 65, and the controllers 15 and 65 are further connected to the resin base materials 35 and 85 by the linear expansion coefficient. Are connected to the intermediate members 28, 88, 89 having a small difference. Therefore, in the step of connecting them, when the conductive adhesives 36 and 86 are provided and heated, the occurrence of displacement due to the difference in linear expansion coefficient is suppressed and the solder or the conductive adhesives 36 and 86 are applied. Stress can be reduced. For this reason, the flexible printed circuit boards 16 and 66 which can suppress the connection failure of the controllers 15 and 65 and the resin base materials 35 and 85 by generation | occurrence | production of damage or peeling of the hardened conductive adhesives 36 and 86 were provided. The liquid crystal display devices 10 and 60 can be obtained.

  In the method for manufacturing the liquid crystal display devices 10 and 60 according to the first and second embodiments of the present invention, the controller includes the resin substrates 35 and 85 and the IC chips 29 and 79 having different linear expansion coefficients from the resin substrates 35 and 85. 15. A method of manufacturing the liquid crystal display devices 10 and 60 for mounting 15 and 65, the step of preparing the resin base materials 35 and 85, and the linear expansion coefficient on the resin base materials 35 and 85. Providing intermediate members 28, 88, 89 having member bodies 32, 82 having a value between the linear expansion coefficient of the IC chips 29, 79 and a controller on the intermediate members 28, 88, 89. And a step of providing 15 and 65.

  According to such a configuration, the intermediate member 28 having the member main bodies 32 and 82 whose linear expansion coefficient is a value between the linear expansion coefficient of the resin base materials 35 and 85 and the linear expansion coefficient of the IC chips 29 and 79, Since 88 and 89 are provided between the resin base materials 35 and 85 and the controllers 15 and 65, the resin base materials 35 and 85 and the controllers 15 and 65 are not directly opposed to each other, and the intermediate members 28, 88 and 89 are provided. An intervening configuration can be adopted. For this reason, the resin base materials 35 and 85 are connected to the intermediate members 28, 88 and 89 having a smaller difference in linear expansion coefficient than the controllers 15 and 65, and the controllers 15 and 65 are further connected to the resin base materials 35 and 85 by the linear expansion coefficient. Are connected to the intermediate members 28, 88, 89 having a small difference. Therefore, in the step of connecting them, when the conductive adhesives 36 and 86 are provided and heated, the occurrence of displacement due to the difference in linear expansion coefficient is suppressed and the solder or the conductive adhesives 36 and 86 are applied. Stress can be reduced. For this reason, it is possible to suppress poor connection between the controllers 15 and 65 and the resin base materials 35 and 85 due to occurrence of damage or peeling of the cured conductive adhesives 36 and 86.

  As described above, the present invention is useful for the flexible printed boards 16 and 66, the display panel, the display device, and the method for manufacturing the display device.

It is a top view of the liquid crystal display devices 10 and 60 which concern on Embodiment 1, 2 of this invention. It is sectional drawing in the II-II line of the liquid crystal display devices 10 and 60 of FIG. 2 is a cross-sectional view of the flexible printed circuit board 16, intermediate members 28, 88, and 8928 and a controller 15 of the liquid crystal display device 10 according to the first embodiment of the present invention. FIG. It is sectional drawing of the flexible printed circuit board 66, the intermediate members 28, 88, 8988, 89, and the controller 65 of the liquid crystal display device 60 which concern on Embodiment 2 of this invention.

Explanation of symbols

10, 60 Liquid crystal display device 13, 63 Liquid crystal display panel 15, 65 Controller 16, 66 Flexible printed circuit board 18, 68 CF substrate 19, 69 TFT substrate 27, 30, 77, 80 External connection terminals 28, 88, 89 Intermediate member 28 , 88, 89
29, 79 IC chip 31, 81 Conductive part 32, 82 Member body 32, 82
35, 85 Resin base material 36, 86 Conductive adhesive 36, 86

Claims (7)

A base substrate having external connection terminals;
An electronic component having a component main body having a linear expansion coefficient different from that of the base substrate and an external connection terminal, and the external connection terminal being electrically connected to the external connection terminal of the base substrate; ,
An intermediate member provided between the base substrate and the electronic component and having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body;
Electronic component mounting board equipped with. In the electronic component mounting substrate according to claim 1,
The member body of the intermediate member is an electronic component mounting board whose linear expansion coefficient is a value approximately in the middle between the linear expansion coefficient of the base board and the linear expansion coefficient of the component body. In the electronic component mounting substrate according to claim 1,
A plurality of the intermediate members are provided so as to be laminated between the base substrate and the electronic component,
As the plurality of intermediate members move from the base substrate and the component main body on the side having the larger linear expansion coefficient toward the smaller one on the smaller side, the member main body has a larger linear expansion coefficient from the smaller to the smaller one. Electronic component mounting boards that are sequentially stacked. In the electronic component mounting substrate according to claim 1,
The intermediate member is provided at a position corresponding to each of the external connection terminal of the base substrate and the external connection terminal of the electronic component, and electrically connects the external connection terminal of the base substrate and the external connection terminal of the electronic component. An electronic component mounting board having a conductive portion to be connected. A base substrate having external connection terminals;
An electronic component having a component main body having a linear expansion coefficient different from that of the base substrate and an external connection terminal, and the external connection terminal being electrically connected to the external connection terminal of the base substrate; ,
An intermediate member provided between the base substrate and the electronic component and having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body;
A display panel provided with an electronic component mounting board comprising: A base substrate having external connection terminals;
An electronic component having a component main body having a linear expansion coefficient different from that of the base substrate and an external connection terminal, and the external connection terminal being electrically connected to the external connection terminal of the base substrate; ,
An intermediate member provided between the base substrate and the electronic component and having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body;
A display device comprising an electronic component mounting board comprising: A method for manufacturing a display device in which an electronic component having a component body having a linear expansion coefficient different from that of a base substrate is mounted on a base substrate,
Preparing the base substrate;
Providing an intermediate member on the base substrate having a member body whose linear expansion coefficient is a value between the linear expansion coefficient of the base substrate and the linear expansion coefficient of the component body;
Providing the electronic component on the intermediate member;
A method for manufacturing a display device comprising:

Images