JP2008058926A - Optical waveguide member, optical wiring board, optical wiring module, display device, and optical waveguide member and optical wiring board manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical waveguide member excellent in productivity, an optical wiring substrate including the optical waveguide member, an optical wiring module including the optical wiring substrate and the optical semiconductor element, a display device including the optical waveguide member, and an optical waveguide. To provide a member and an optical wiring board manufacturing method.
A step of preparing a transfer member 26 having a transfer sheet 26a and a metal film 26b, wherein the transfer sheet 26a and the metal film 26b are held in a peelable state, and on the metal film 26b of the transfer member 26 Forming a first clad layer 6, a step of laminating a core layer 7 for propagating light on the first clad layer 6, and a second clad layer 8 covering the core layer 7 on the core layer 7. Forming a laminated body including the first clad layer 6, the core layer 7, and the second clad layer 8 by laminating, and a method of manufacturing an optical waveguide member, comprising:
[Selection] Figure 2

Description

  The present invention relates to an optical waveguide member for transmitting an optical signal, an optical wiring board having the optical waveguide member, an optical wiring module, a display device, and a method for manufacturing the optical waveguide member and the optical wiring board.

  In recent years, an optical signal is sometimes used instead of an electrical signal as a medium for transmitting information. As means for transmitting an optical signal, there is an optical waveguide member in which an optical waveguide is formed.

  A conventional optical waveguide member includes a core layer that propagates light, and a first cladding layer and a second cladding layer that cover the core layer. A light emitting element is provided on the surface of the optical waveguide member.

A conventional optical waveguide member is manufactured by sequentially laminating a first cladding layer, a core layer, and a second cladding layer on a support substrate such as a printed wiring board. The core layer is formed in a strip shape, and has an inclined surface at one end in the longitudinal direction. The inclined surface is inclined so as to be separated from the first cladding layer as it approaches the one end, and after the core material layer made of the constituent material of the core layer is laminated on the first cladding layer, Before laminating the second cladding layer, one end of the core material layer is formed by anisotropic etching or the like.
Japanese Patent Laying-Open No. 2005-148129 (page 11, FIG. 2)

  In the conventional optical waveguide member manufacturing method, it is necessary to use anisotropic etching to form the inclined surface of the core layer, and it is difficult to control the shape of the inclined surface. Therefore, the manufacturing process of the optical waveguide member becomes complicated.

  An object of the present invention is to solve the above problems, an optical waveguide member, an optical wiring substrate including the optical waveguide member, an optical wiring module including the optical wiring substrate and the optical semiconductor element, and a display device including the optical waveguide member And an optical waveguide member and an optical wiring board manufacturing method.

  The method for producing an optical waveguide member of the present invention includes a step of preparing a transfer member having a transfer sheet and a metal film, the transfer sheet and the metal film being held in a peelable state, Forming a first clad layer on the metal film; laminating a core layer for propagating light on the first clad layer; and a second clad layer covering the core layer on the core layer. Forming a laminated body including the first clad layer, the core layer, and the second clad layer.

  Moreover, the manufacturing method of the optical waveguide member of this invention is further provided with the process of peeling the said transfer sheet from the said laminated body and the said metal film in the manufacturing method of the above-mentioned optical waveguide member.

  Furthermore, the method for manufacturing an optical waveguide member of the present invention further includes the step of removing the metal film after the transfer sheet is peeled from the laminate and the metal film in the above-described method for manufacturing an optical waveguide member. .

  Moreover, the manufacturing method of the optical waveguide member of the present invention further includes a step of patterning the metal film after the transfer sheet is peeled from the laminate and the metal film in the above-described manufacturing method of the optical waveguide member. Yes.

  Furthermore, the method for manufacturing an optical waveguide member according to the present invention further includes a step of providing an inclined surface on the core layer in the above-described method for manufacturing an optical waveguide member, wherein the core layer is in contact with the inclined surface and the first cladding layer. The angle of inclination α with the surface is smaller than 90 degrees.

  The method for producing an optical waveguide member of the present invention further includes a step of providing a reflective film on the inclined surface provided in the core layer in the above-described method for producing an optical waveguide member, and the laminate includes the reflective film It is comprised including.

  Furthermore, the optical waveguide member manufacturing method of the present invention is the above-described optical waveguide member manufacturing method, wherein the transfer sheet has a second metal film on a surface in contact with the metal film, It can be peeled from the metal film.

  Moreover, the manufacturing method of the optical waveguide member of this invention WHEREIN: A 3rd metal film is deposited on the said 2nd cladding layer in the manufacturing method of the above-mentioned optical waveguide member.

  Furthermore, the method for manufacturing an optical waveguide member of the present invention is the above-described method for manufacturing an optical waveguide member, wherein at least one of the metal film and the third metal film is processed into a predetermined pattern.

  The method for manufacturing an optical wiring board of the present invention includes a step of preparing a transfer member having a transfer sheet and a metal film, and holding the transfer sheet and the metal film in a peelable state; Forming a first clad layer on the metal film; laminating a core layer for propagating light on the first clad layer; and a second clad layer covering the core layer on the core layer. Forming a laminate including the first clad layer, the core layer, and the second clad layer, and laminating the second clad layer as a wiring substrate. A step of attaching the wiring sheet to the wiring substrate so as to oppose the substrate, and a step of peeling the transfer sheet from the laminate and the metal film.

  The method for manufacturing an optical wiring board according to the present invention further includes the step of removing the metal film after peeling the transfer sheet from the laminate and the metal film in the method for manufacturing an optical wiring board described above. .

  Furthermore, the method for manufacturing an optical wiring board of the present invention further includes a step of patterning the metal film after the transfer sheet is peeled from the laminate and the metal film in the method for manufacturing an optical wiring board described above. Yes.

  The method for manufacturing an optical wiring board according to the present invention further includes the step of providing an inclined surface on the core layer in the method for manufacturing an optical wiring board, wherein the core layer is in contact with the inclined surface and the first cladding layer. The angle α to the surface is smaller than 90 °.

  Furthermore, the method for manufacturing an optical wiring board of the present invention further includes a step of providing a reflective film on the inclined surface provided in the core layer in the above-described optical wiring board manufacturing method, and the laminate includes the reflective film. It is configured to include.

  An optical wiring board of the present invention includes a wiring board and an optical waveguide member disposed on the wiring board, and the optical waveguide member includes a first cladding layer and the wiring board more than the first cladding layer. A second clad layer disposed on the side, and a plurality of core layers having an inclined surface interposed between the first clad layer and the second clad layer, and on the first clad layer side The angle α between the surface of the core layer positioned and the inclined surface is smaller than 90 degrees.

  In the optical wiring board of the present invention, in the above-described optical wiring board, the angle α is not less than 41 degrees and not more than 49 degrees.

  Furthermore, in the optical wiring board of the present invention, in the above-described optical wiring board, the inclined surface is formed in a curved shape protruding toward the second cladding layer.

  In the optical wiring board of the present invention, in the above-described optical wiring board, a reflective film for reflecting light is deposited on the inclined surface.

  Furthermore, in the optical wiring board of the present invention, in the above-described optical wiring board, the second cladding layer is formed so as to cover the inclined surface and the reflective film.

  In the optical wiring board of the present invention, in the optical wiring board described above, the surface of the optical waveguide member is a flat surface.

  Furthermore, the optical wiring board of the present invention is the above-mentioned optical wiring board, wherein the optical waveguide member has a conductive layer on the surface of the first cladding layer opposite to the wiring board.

  The optical wiring board of the present invention is the above-described optical wiring board, wherein the optical waveguide member has a resin layer between a surface of the first cladding layer opposite to the wiring board and the conductive layer, The conductive layer is formed by electroless plating.

  Furthermore, an optical wiring module of the present invention includes the above-described optical wiring board and an optical semiconductor element connected to the wiring pattern.

  An optical waveguide member according to the present invention includes a first cladding layer, a core layer disposed on the first cladding layer and having an inclined surface, and a second cladding layer continuously covering the core layer including the inclined surface. It is equipped with.

  The optical waveguide member of the present invention is the above-described optical waveguide member, wherein the first cladding layer and the second cladding layer have a pair of metal films, and at least one of the pair of metal films is covered by transfer. It is worn.

  And the display apparatus of this invention is provided with the display part, the operation part which controls the said display part, and the above-mentioned optical waveguide member which optically connects the said display part and the said operation part.

  According to the present invention, when an optical wiring board or an optical wiring module is formed, the inclined surface provided in the core layer of the optical waveguide member can be easily formed by transferring the optical waveguide member to the wiring board. Can contribute to improvement.

  Hereinafter, a plurality of embodiments for carrying out the present invention will be described with reference to the drawings. Portions corresponding to the matters described in the preceding forms in each embodiment are denoted by the same reference numerals, and overlapping description may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as those described in the preceding section. In addition to the combination of parts specifically described in each embodiment, the embodiments may be partially combined as long as the combination is not particularly troublesome.

(First embodiment)
FIG. 1A is a perspective sectional view showing the optical wiring module 1 according to the first embodiment.

  The optical wiring module 1 generally has a configuration including an optical wiring board 2 and a light emitting element 3 as an optical semiconductor element mounted on the optical wiring board 2. The optical wiring board 2 includes a support substrate 5 as a wiring board, and an optical waveguide member 4 that is disposed on the support substrate 5 and on which the light emitting element 3 is mounted.

  The optical wiring module 1 supplies an electric signal supplied from the support substrate 5 to the light emitting element 3 through the optical waveguide member 4 and causes the light emitting element 3 to emit light based on the electric signal. Then, the light of the light emitting element 3 is transmitted as an optical signal to an external connection member such as an optical fiber through the optical waveguide member 4.

  The optical wiring board 2 is generally rectangular and has a plate shape. In the following, the thickness direction of the optical wiring board 2 (vertical direction in FIGS. 1A to 1D) is the Z1 direction, the longitudinal direction (horizontal direction in FIGS. 1A to 1D) is the X1 direction, and is perpendicular to the Z1 direction and the X1 direction. The direction (the depth direction in FIGS. 1A to 1D) is referred to as a Y1 direction.

  The support substrate 5 is a wiring substrate having a wiring conductor. For example, an insulating substrate formed of an insulating material such as resin, alumina-based ceramic, or glass ceramic, and copper, gold, silver, aluminum, or the like on the insulating substrate. And a wiring conductor made of a conductive material. The wiring structure of the support substrate 5 may be a single layer wiring or a multilayer wiring. Such a support substrate 5 supports the optical waveguide member 4 on its upper surface and supplies an electric signal to the light emitting element 3 through the through electrode 10 in which the wiring conductor is provided on the optical waveguide member 4. When the optical wiring module 1 is incorporated in a computing device such as a computer, the wiring conductor of the support substrate 5 is electrically connected to an IC circuit such as a central processing unit (abbreviated as CPU).

  The optical waveguide member 4 mounted on the support substrate 5 includes a first cladding layer 6 disposed on the light emitting element 3 side, a second cladding layer 8 in contact with the support substrate 5, the first cladding layer 6, and the second cladding. A plurality of core layers 7 having an inclined surface 13, interposed between the layer 8, the reflective film 14 deposited on the inclined surface 13, and the light emitting element 3 and the wiring conductor of the support substrate 5 are electrically connected. And a through electrode 10 for the purpose. The optical waveguide member 4 has a thickness in the Z1 direction of 50 μm or more and 100 μm or less. Both main surfaces of the optical waveguide member 1, that is, the surface of the first cladding layer 6 and the surface of the second cladding layer 8 are formed flat.

  The plurality of core layers 7 are formed in a strip shape extending in the X1 direction, and are arranged along the Y1 direction at intervals. The cross-sectional shape of each core layer (the cross-sectional shape parallel to the Y1 axis and the Z1 axis) is a rectangular shape or a square shape. An inclined surface 13 is formed at one end of the core layer 7 in the X1 direction. The inclined surface 13 is inclined with respect to the X1 direction so that the inclination angle α between the surface 40 of the core layer 7 located on the first cladding layer 6 side and the inclined surface 13 is smaller than 90 degrees. The inclination angle α of the inclined surface 13 is preferably 41 degrees or more and 49 degrees or less (in this embodiment, the inclination angle α is set to 45 degrees). When the inclination angle α is not less than 41 degrees and not more than 49 degrees, the light of the light emitting element 3 can be favorably transmitted toward the core layer 7 and the transmission loss of the optical signal can be favorably reduced. However, it may be an inclined surface other than the range where the inclination angle is not less than 41 degrees and not more than 49 degrees. Further, the inclined surface 13 is not necessarily formed at one end of the core layer 7. The inclined surface 13 is formed with a reflective film 14 made of a material capable of reflecting light such as aluminum, nickel, and chromium.

  The first cladding layer 6, the core layer 7, and the second cladding layer 8 are made of a light-transmitting material, and the first and second cladding layers 6 and 8 have a refractive index different from that of the core layer 7. Made of sex material. The core layer 7 is higher in refractive index than the first and second cladding layers 6 and 8 and is made of the same light-transmitting material as the first and second cladding layers 6 and 8. As the translucent material, for example, epoxy resin, acrylic resin, polysilanol resin, polysilane, polysilazane resin, or glass is used. However, the core layer 7, the first cladding layer 6, and the second cladding layer 8 are not limited to being made of the same light-transmitting material, and the refractive index of the core layer 7 is the first and second cladding layers 6. , 8 may be formed of different translucent materials.

  On the other hand, the through electrode 10 is formed in a cylindrical shape from a conductive material such as copper, silver, gold, aluminum, nickel, chromium, iron, tungsten, or molybdenum, and a plurality of the through electrodes 10 are arranged in the Y1 direction.

Here, the through electrode 10 is formed of a material having a thermal conductivity of 100 W / m · K or more at room temperature (25 ° C.) and an electric resistivity of 1.0 × 10 ⁻⁷ Ω · m or less. It is preferred that In this case, the light emitting element 4 and other electronic elements that are mounted on the optical waveguide member 4 and electrically connected to the through electrode 10 are well radiated with heat generated through the through electrode 10 during operation. It will be. Therefore, the light emitting element 4 and other electronic elements can be stably operated.

If it is a material of penetration electrode 10 mentioned above, copper, silver, gold, aluminum, molybdenum, and tungsten are preferred. For example, copper (thermal conductivity: 395 W / m · K, electrical resistivity: 1.69 × 10 ⁻⁸ Ω · m), aluminum (thermal conductivity: 223 W / m · K, electrical resistivity: 2.66 × 10 ⁻⁸ Ω · m), gold (thermal conductivity: 293 W / m · K, electrical resistivity: 2.44 × 10 ⁻⁸ Ω · m), molybdenum (thermal conductivity: 147 W / m · K, electrical resistivity) : 5.78 × 10 ⁻⁸ Ω · m) and tungsten (thermal conductivity: 167 W / m · K, electric resistivity: 5.5 × 10 ⁻⁸ Ω · m).

  Further, the through electrode 10 is provided in the through hole 16 provided in the electrode forming layer 28 made of the same material as the core layer 7, and the cross-sectional area in a cross section parallel to the XY plane is larger than that of the light emitting element 3 side. It is larger on the support substrate 5 side. The electrode forming layer 28 is partially exposed on the light emitting element 3 side from the first cladding layer 6, and the surface on the support substrate 5 side is covered with the second cladding layer 8 and the through electrode 10. Is formed. That is, on the surface of the optical waveguide member 4 on the light emitting element 3 side, the surfaces of the first cladding layer 6, the electrode forming layer 28, and the through electrode 10 are exposed, and the exposed surfaces are formed to be substantially flat. Further, the second clad layer 8 and the through electrode 10 are exposed on the surface of the optical waveguide member 4 on the support substrate 5 side, and the exposed surface is formed to be substantially flat.

  On the other hand, the plurality of light emitting elements 3 mounted on the first clad layer 6 of the optical waveguide member 4 are configured by, for example, a surface emitting semiconductor laser (abbreviated as VCSEL). Each light emitting element 3 is electrically connected to the pair of through electrodes 10 via bumps 24. On the other hand, in order to prevent each light emitting element 3 from being inclined with respect to the optical waveguide member 4, a pair of dummy bumps 25 are provided corresponding to the bumps 24. The bumps 24 and the dummy bumps 25 are made of a conductive material such as gold (Au) or solder.

  Such a light emitting element 3 is disposed at a position where the laser light can enter the inclined surface 13 of the optical waveguide member 4 (for example, a position immediately above the inclined surface 13). When an electric signal is supplied from the support substrate 5 to the light emitting element 3 through the through electrode 10, the light emitting element 3 emits laser light toward the inclined surface 13 based on the electric signal, and the laser light is The light is reflected in the X1 direction by the reflective film 14 formed on the inclined surface 13. The reflected laser light propagates through the core layer 7 as an optical signal, whereby the electrical signal is converted into an optical signal.

  In the present embodiment, a VCSEL is used as the light emitting element 3, but is not necessarily limited to the VCSEL. For example, an edge-emitting laser diode may be used as long as it can irradiate laser light. Further, instead of the light emitting element 3, the light receiving element 42 may be disposed on the optical wiring board 2. When the light receiving element 42 is provided, the optical signal propagated from the optical waveguide member 4 is converted into an electric signal by the light receiving element 42. That is, the light propagated through the core layer 7 is incident on the inclined surface 13, and the incident light is reflected by the reflective film 14 toward the light receiving element 42. The reflected light is incident on the light receiving element 42, and the light receiving element 42 supplies an electrical signal to the support substrate 5 through the through electrode 10 based on the incident light. As a result, the optical signal is converted into an electric signal.

  FIG. 2 is a diagram showing a flowchart of each step of the method for manufacturing the optical wiring module 1 described above. 3A to 3N are perspective sectional views showing members manufactured in each step. Below, the manufacturing method of the optical wiring module 1 comprised in this way is demonstrated along the flowchart shown in FIG.

  In step s1, first, a rectangular transfer member 26 shown in FIG. 3A is prepared. In the following, the thickness direction of the transfer member 26 is defined as the Z2 direction (the vertical direction in FIGS. 3A to 3F), the longitudinal direction thereof is defined as the X2 direction (the horizontal direction in FIGS. 3A to 3F), and the Z2 direction and the X2 direction. A direction perpendicular to the Y direction is referred to as a Y2 direction (a depth direction in FIGS. 3A to 3F).

  The transfer member 26 has a configuration in which a metal film 26b made of a conductive material such as copper is formed on a transfer sheet 26a made of glass fiber reinforced epoxy resin, plastic, stainless steel, nickel alloy, aluminum, titanium, or the like. The transfer sheet 26a and the metal film 26b are bonded with an adhesive force that can be peeled off from each other. In order to make both easy to peel off, a release material may be interposed between the transfer sheet 26a and the metal film 26b.

  When the optical waveguide member 4 laminated on the transfer member 26 is transferred to the support substrate 5 using such a transfer member 26, first, the optical waveguide member 4 is bonded to the support substrate 5 together with the transfer member 26. Next, the transfer sheet 26a constituting the transfer member 26 is peeled off from the metal film 26b. Then, the optical waveguide member 4 is transferred to the support substrate 5 by removing the metal film 26b by etching. The metal film 26b on the transfer sheet 26a preferably has a thickness of 3 μm to 35 μm in order to facilitate removal by etching.

  As shown in FIG. 3N, the transfer sheet 26a may have a second metal film 26a 'made of a conductive material such as copper on the surface in contact with the metal film 26b. In this case, since the metal film 26b and the second metal film 26a 'are separated from each other, a release material may be interposed between the metal films 26b and 26a'.

  In step s2, the first cladding layer 6 is formed on the metal film 26b of the transfer member 26 as shown in FIG. 3B. The first cladding layer 6 is manufactured through the following processes. That is, first, a liquid obtained by dissolving a translucent material in a solvent is applied onto the metal film 26b using a spin coater, bar coater, doctor blade, die coater, dip coater, or the like. Next, the applied liquid is dried, and the first clad material layer is laminated on the transfer member 26 in one direction Z2 (upward in FIGS. 3A to 3F). The first clad layer 6 is formed by processing this laminated body into a predetermined pattern by a photolithography technique, etching, or the like. The first cladding layer 6 can use various processing methods such as a method of molding the first cladding material layer described above into a mold.

  Step s3 is a step of forming a plurality of core material layers 27 and a plurality of electrode formation layers 28 on the first cladding layer 6 as shown in FIG. 3C.

  First, a liquid obtained by dissolving a translucent material constituting the core layer 7 in a solvent is applied to the transfer member 26 and the first cladding layer 6 using a spin coater, bar coater, doctor blade, die coater, dip coater, or the like. Is done. Next, the translucent material layer 29 is formed by drying the applied liquid. Next, the plurality of core material layers 27 and the plurality of electrode formation layers 28 are formed by processing the translucent material layer 29 into a predetermined pattern using a photolithography technique, etching, or the like.

  Step s4 is a step of forming the core layer 7 by processing the core material layer 27 as shown in FIG. 3D. First, the inclined surface 13 is formed by pressing one end of the core material layer 27 in the X2 direction with a tool 32 made of a hard material such as a grindstone or diamond. Accordingly, the inclined surface 13 can be easily formed. The tool 32 has a tip shape corresponding to the inclined surface 13 as indicated by a virtual line in FIG. 3D. Specifically, the tool 32 can be realized by nanoimprinting or microembossing. When the core material layer 27 is pressed with the tool 32, the core material layer 27 may be in a completely cured state or a semi-cured state. However, when the tool 32 is press-fitted with the core material layer 27 in a completely cured state, the core material layer 27 is pressed. Since cracks may occur in the layer 27, the core material layer 27 is preferably processed in a semi-cured state. Here, the semi-cured state is a state in which 25% or more and 80% or less of a resin has undergone a polymerization reaction.

  In the present embodiment, the inclined surface 13 is formed by machining, but is not necessarily limited thereto. For example, laser processing or etching may be used. Etching is not limited to the photolithography technique, and may be plasma etching or may be removed by an ion beam.

  Step s5 is a step of forming the reflective film 14 on the inclined surface 13. Using a thin film forming technique such as physical vapor deposition (abbreviated as PVD), a reflective material such as aluminum, nickel, or chromium is vapor-deposited on the inclined surface 13, and the reflective film 14 is formed on the inclined surface 13.

  Step s6 is a step of forming the through hole 16 in the electrode forming layer 28. The through-hole 16 is formed by adopting a photolithography technique, a mold processing, an etching technique, etc. according to the characteristics of the optical waveguide material to be used. In this embodiment, step s6 is performed after step s5. However, in step s6, the laser is emitted between step s4 and s5, between step s3 and step s4, or between step s7 and step s8. You may process using. If the photolithography technique or the mold processing technique is used, the positional accuracy of the through hole 16 with respect to the optical waveguide can be maintained. Further, the method of processing using a laser has a feature that a thin and long through-hole 16 can be easily processed.

  Step s7 is a step of laminating the second cladding layer 8 on the first cladding layer 6 and the core layer 7 as shown in FIG. 3E. A liquid obtained by dissolving a translucent material, which is a constituent material of the second cladding layer, in a solvent uses a spin coater, a bar coater, a doctor blade, a die coater, a dip coater or the like, and the first cladding layer 6, the core layer 7 and the electrode It is applied to the forming layer 28. Next, the applied liquid is dried to form a second cladding material layer. Next, the second cladding layer 8 is formed by processing the second cladding material layer into a predetermined pattern. The second clad material layer may be polished to flatten the surface. As a polishing method, for example, a method of polishing using a grindstone containing abrasive grains such as alumina, silicon carbide or diamond, the abrasive grains on the surface A method of attaching to a part and polishing with a brush, or a method of polishing with a buff is used. Further, the surface portion of the second cladding layer precursor may be formed flat by a method of scraping with a cutting tool made of diamond.

  In step s8, as shown in FIG. 3F, the through electrode 10 is formed in the through hole 16, and a laminated body corresponding to the optical waveguide member 4 is formed on the transfer member 26 by the formation of the through electrode 10. .

  The through electrode 10 is formed by filling the through hole 16 with a conductive material made of copper or the like by electroplating. In this case, the surface of the metal film 26b constituting the transfer member 26 is exposed from the optical waveguide member 4, and energization for electroplating is performed from the exposed surface of the metal film 26b. 10 can be easily formed.

  In step s9, as shown in FIG. 3G, the optical waveguide member 4 formed on the transfer member 26 is transferred to the support substrate 5. Specifically, the optical waveguide member 4 is fixed to the support substrate 5 with an adhesive so that the second cladding layer 8 is in contact with the support substrate 5. At this time, the through electrode 10 of the optical waveguide member 4 and the wiring conductor provided on the support substrate 5 are electrically connected.

  In step s10, as shown in FIG. 3H, the transfer sheet 26a constituting the transfer member 26 is peeled off from the metal film 26b of the transfer member 26.

  In step s11, as shown in FIG. 3I, the metal film 26b constituting the transfer member 26 remaining on the first cladding layer 6 is removed by etching. When the metal film 26b is removed by etching, the first cladding layer 6 and the through electrode 10 are exposed.

  Step s12 is a step of mounting a plurality of light emitting elements 3 on the through electrode 10 as shown in FIG. 3J. Specifically, the light emitting element 3 is connected to the through electrode 10 via the bump 24 and the light emitting element 3 is connected to the first cladding layer 6 via the dummy bump 25. When the bumps 24 and the dummy bumps 25 are formed with solder, the light emitting element 3 is positioned and mounted with high accuracy by the self-alignment action between the through electrode 10 and the bumps 24. When the light emitting element 3 is mounted in this way, the optical wiring module 1 is formed, and the optical wiring module manufacturing process is completed.

  At this time, if a concave portion is formed on the surface of the through electrode 10 to which the bump 24 is connected, the bump 24 and the dummy bump 25 are easily self-aligned toward the concave portion, and the positioning of the light emitting element 3 is facilitated.

  Below, the effect which such a manufacturing method has is explained. According to the manufacturing method of the present embodiment, since the optical waveguide member is formed by the transfer technique, the inclined surface 13 can be easily formed. Moreover, the inclined surface 13 can be continuously covered with the second cladding layer 8 that covers the core layer 7 as in this embodiment, and the inclined surface 13 can be satisfactorily covered with the second cladding layer. Note that covering the inclined surface 13 with a third cladding layer different from the first and second cladding layers is not excluded.

  Further, according to the manufacturing method of the present embodiment, when the reflective film 14 is formed, not only the inclined surface 13 but also the surface of the core layer 7 is exposed, so that the reflective film 14 can be easily formed on the inclined surface 13. Therefore, the productivity of the optical waveguide member 4, the optical wiring board 2, and the optical wiring module 1 can be maintained high.

  According to the manufacturing method of this embodiment, after the optical waveguide member 4 is formed on the transfer member 26, the optical waveguide member 4 is fixed to the support substrate 5. The surface of the waveguide member 4 can be made extremely flat. Therefore, the positioning accuracy of mounting the light emitting element 3 is high, and this can contribute to the improvement of productivity. Note that the light tolerance of the light-emitting element 3 is preferably within ± 1 μm with respect to the inclined surface 13 and the reflective film 14 serving as a mirror that reflects light. 3 is aligned with the inclined surface 13 or the like.

  According to the manufacturing method of the present embodiment, since the through electrode 10 is formed at an interval with respect to the inclined surface 13, the wiring conductor and the light emitting element of the support substrate 5 can be easily electrically connected. . In addition, since the through electrode 10 is formed at a distance from the inclined surface 13, the through electrode 10 can be used as a positioning marker for the light emitting element 3 when the light emitting element 3 or the light receiving element 42 is provided.

  According to the manufacturing method of the present embodiment, the through electrode 10 and the metal film 26b constituting the transfer member 26 are formed of the same conductive material, thereby increasing the adhesion strength between the through electrode 10 and the metal film 26b. The optical waveguide member 4 can be prevented from being detached from the transfer member 26 before the optical waveguide member 4 is transferred to the support substrate 5.

  In the first embodiment, a gap is formed between the light emitting element 3 and the optical waveguide member 4D. As shown in FIG. 1B, the laser light emitted from the light emitting element 3 in this gap. The light shielding member 62 may be provided so as to surround the passage region. In this case, the light emitted from the light emitting element 3 is well shielded from the outside. As a result, it is possible to satisfactorily prevent the light of the light emitting element 3 from being undesirably emitted to other light emitting elements or light receiving elements.

  The light shielding member 62 is made of a non-light transmissive resin. As an example of the non-light transmissive resin, for example, a resin in which carbon powder, graphite powder, or the like is mixed with an epoxy resin, a cyanate resin, a polyphenylene ether resin, a bismaleimide triazine resin, or a polyimide resin can be considered. Other examples of the non-light-transmitting resin include a resin material blackened with a staining agent or a colorant, or a resin in which a silica filler and carbon powder are mixed in an epoxy resin.

  Such a non-light-transmitting resin has a light transmission amount ratio (light transmission amount / light input amount) of −30 dB or less with respect to the light input amount per 1 cm of resin with respect to light having a wavelength to be used (for example, 850 nm). More preferably, it should be -40 dB or less.

  For example, after the first and second optical fibers are prepared, a resin is interposed between both optical fibers, and light such as a laser and an LED is transmitted from the first optical fiber to the second optical fiber. It is obtained by measuring the amount of light emitted from the second optical fiber with a power meter. On the other hand, as a method for measuring the amount of light input, for example, light is transmitted from the first optical fiber to the second optical fiber in a state where the resin is directly connected between the first and second optical fibers, and the first optical fiber is transmitted. It is calculated | required by measuring the light quantity of the emitted light from 2 optical fibers with a power meter. Then, the ratio of the light transmission amount to the light input amount is obtained by using the two light amounts obtained by this measurement.

  In this embodiment, as shown in FIG. 1C, a light transmissive member 63 made of a light transmissive resin may be provided between the light emitting element 3 and the optical waveguide member 4. The translucent member 63 is provided, for example, in contact with both the light emitting elements 3 and the optical waveguide member 4. Thereby, each light emitting element 3 and the optical waveguide member 4 are mechanically connected to each other by the light transmitting member 63 more firmly.

  The light transmissive member 63 has a ratio of light attenuation (loss) to light input per 1 cm of light transmissive member (light attenuation / light input) of 6 dB or less with respect to light having a wavelength to be used (for example, 850 nm). It is. Desirably, 3 dB or less is suitably used, and 0.5 dB or less is optimal.

  For example, the first and second optical fibers are prepared, a resin is interposed between the two optical fibers, and light such as a laser or an LED is transmitted from the first optical fiber to the second optical fiber. The amount of light emitted from the second optical fiber is obtained by measuring with a power meter. On the other hand, the light attenuation amount is calculated by first obtaining the light input amount and subtracting the light transmission amount from the light input amount. The amount of light input is such that light is transmitted from the first optical fiber to the second optical fiber in a state where the first and second optical fibers are directly connected without interposing a resin, and the light emitted from the second optical fiber is transmitted. It is obtained by measuring the amount of light with a power meter. Then, the ratio of the light attenuation amount (loss) to the light input amount is obtained by the ratio of the two light amounts obtained by this measurement.

  Such a translucent member 63 is formed, for example, by injecting a predetermined amount of epoxy resin, acrylic resin, silicon resin or the like with a dispenser or the like and curing it.

  Furthermore, in this embodiment, as shown in FIG. 1D, the reflective film 14 is formed on the inclined surface 13, but it is not always necessary to form it. For example, instead of the reflective film 14, a space S may be formed between the second cladding layer 8 and the inclined surface 13. When the refractive index of the gas in the space S is higher than the refractive index of the core layer 7, since the light is reflected by the inclined surface 13, the same effect as the case where the reflective film 14 is provided is achieved.

  In the present embodiment, the through electrode 10 may be formed after step s11. In this case, although the connection between the wiring conductor of the wiring board and the through electrode 10 can be strengthened, the workability of electroplating for forming the through electrode 10 may be poor. Therefore, in this case, the surface of the first cladding layer 6 exposed by removing the metal film 26b in step s11 is subjected to copper, nickel, chromium, titanium by electroless plating, vapor deposition, sputtering, or the like. After the conductive material layer such as tungsten or molybdenum is deposited, the through electrode 10 may be formed in the through hole 16 through the conductive material layer. At this time, it is difficult to form a conductive material layer on the first cladding layer 6 by electroless plating. Therefore, the through electrode 10 is preferably formed by the following method.

  First, as shown in FIG. 3K, a resin material layer 64 made of an epoxy resin or the like is laminated in the first cladding layer 6 and the through hole 16. Next, as shown in FIG. 3L, a first conductive material layer 65 is formed on the surface of the resin material layer 64 by electroless plating. Subsequently, as shown in FIG. 3M, the through electrode 10 is formed in the through hole 16 by electroplating through the first conductive material layer 65. At this time, a second conductive material layer 66 made of the same material as the through electrode 10 is formed on the first conductive material layer 65. If necessary, the resin material layer 64, the first conductive material layer 65, and the second conductive material layer 66 may be removed by etching or the like, or may be patterned.

(Second Embodiment)
4A is a perspective sectional view showing an optical wiring board 2A according to the second embodiment, FIG. 4B is a perspective sectional view showing an optical wiring module 1A according to the second embodiment, and FIG. 4C is a second embodiment. It is a perspective sectional view showing a modification of optical wiring module 1A concerning. Here, only the configuration different from the first embodiment will be described, and the description of the common configuration will be omitted. Basically, the effects of the first embodiment are obtained.

  The optical wiring module 1A does not completely remove the metal film 26b constituting the transfer member 26, but removes the metal film 26b located in the mounting region of the light emitting element 3 or the formation region of the through electrode 10, and other metals. The film 26b is left. Therefore, by etching the remaining metal film 26b, it can be used as an electrical wiring. Therefore, it is not necessary to newly form an electrical wiring on the optical waveguide member 4A by a method such as plating, and man-hours are reduced. Can be reduced.

  In the present embodiment, as shown in FIG. 4C, the light emitting element 3 may be connected to the metal film 26b via the dummy bumps 25, or the dummy bumps 25 may function as normal bumps. 26b and the light emitting element 3 may be electrically connected.

  Of course, the optical wiring module 1A of the present embodiment has the same effects as those of the first embodiment.

(Third embodiment)
FIG. 5 is a diagram showing an optical wiring module 1B of the third embodiment. Here, only the configuration different from the first embodiment will be described, and the description of the common configuration will be omitted. Basically, the effects of the first embodiment are obtained.

  Unlike the first embodiment, the optical wiring module 1B is curved in a curved shape so that the inclined surface 13B protrudes toward the second cladding layer 8 side. Therefore, even when the light emitting element 3 is inclined with respect to the surface of the optical waveguide member 4B, the light of the light emitting element 3 incident on the inclined surface 13 can be favorably reflected toward the core layer 7. Therefore, the restriction on the arrangement position of the light emitting element 3 and the light receiving element 42 can be reduced, the tolerance for the arrangement position can be increased, and the productivity of the optical wiring module can be improved.

  When the core material layer 27 is pressed with the tool 32B in step s4 in the first embodiment, the inclined surface 13B having such a shape has a shape corresponding to the inclined surface 13B as shown by an imaginary line in FIG. It is formed by using the tool 32B in the part.

  A curved surface can be processed by making the tool 32B a curved surface. When the curing reaction of the resin material constituting the core material layer 27 is in the range of 50% to 90%, the inclined surface 13B can be curved using the elastic deformation of the core material layer 27.

  In the present embodiment, the inclined surface 13B is formed in a curved shape, but is not necessarily limited to such a shape. As long as the light from the light emitting element 3 can be favorably reflected on the core layer 7, the shape of the inclined surface may be stepped.

(Fourth embodiment)
FIG. 6 is a diagram showing an optical wiring module 1C of the fourth embodiment. Here, only the configuration different from the first embodiment will be described, and the description of the common configuration will be omitted. Basically, the effects of the first embodiment are obtained.

  The optical wiring module 1 </ b> C is different from the first embodiment in that the inclined surface 13 is formed not in one end portion of the core layer 7 but in the intermediate portion of the core layer 7. Even in such a case, since the same effect as in the first embodiment can be obtained, the degree of freedom of the formation position of the inclined surface 13 is high.

(Fifth embodiment)
FIG. 7 is a cross-sectional view showing an optical waveguide member 4D according to the fifth embodiment. Here, only the configuration and manufacturing method different from the optical waveguide member 4A of the second embodiment will be described, and the description of the common configuration will be omitted.

  The present embodiment is similar to the second embodiment, and the optical waveguide member 4D is configured to include the second metal film 26b in contact with the first cladding layer 6. However, in the present embodiment, Unlike the embodiment, the third metal film 52 is different from the other embodiments in that the third metal film 52 is deposited on the second cladding layer 8. That is, the metal film exists on both surfaces of the optical waveguide member 4D.

  The second metal film 26b may be formed by transfer as in the second embodiment, or may be formed by using electroless plating or the like. In this case, in order to increase the adhesion strength between the second metal film 26b and the first cladding layer 6, an epoxy resin is formed on the first cladding layer 6 before the second metal film 26b is formed. Electroless plating for forming the two metal film 26b is preferably performed.

  Further, the third metal film 52 may be formed by transfer or the electroless plating method, similarly to the second metal film 26b. In addition, it is better to form an epoxy resin on the second cladding layer 8 before forming the third metal film 52 before performing electroless plating.

  Further, the optical waveguide member 4D of the present embodiment may be mounted on the support substrate 5 or may not be mounted. However, even if the optical waveguide member 4D is not mounted on the support substrate 5, By processing the metal film 26b and the third metal film 52 into a predetermined pattern, a function as a wiring board can be added to the optical waveguide member 4D. On the other hand, when the optical waveguide member 4D is mounted on the support substrate 5, the optical semiconductor element (light emitting element or light receiving element) may be mounted on the optical waveguide member 4D before the optical waveguide member 4D is mounted on the support substrate 5. .

(Sixth embodiment)
FIG. 8 is a perspective view showing a mobile phone device 105 (display device) according to the sixth embodiment. 9A and 9B are enlarged cross-sectional views of the main part of the mobile phone device 105. FIG. 9A and 9B, the core layer 7, the through electrode 10, the inclined surface 13, the reflective film 14, and the like are not shown.

  The cellular phone device 105 of this embodiment includes a first casing 107 having a display unit 106, a second casing 109 having an operation unit 108, and a connection for connecting the first casing 107 and the second casing 109. Part 110. The second housing 109 is configured to be displaceable with respect to the first housing 107, and both are connected via the connection unit 110.

  For example, the cellular phone device 105 adjusts the angle between the first housing 107 and the second housing 109 to open the display unit 106 and the operation unit 108 as shown in FIG. 9B, the display unit 106 and the operation unit 108 can be adjusted to a closed state facing each other.

  The optical waveguide member 4D according to the fifth embodiment is accommodated in the first casing 107, the second casing 109, and the connection portion 110, and the optical waveguide member 4D is used to store the first casing 107. The display unit 106 and the operation unit 108 of the second housing 109 are optically connected.

  As will be described later, the optical waveguide member 4D has a light emitting element 3 and a light receiving element 42 on both sides thereof. 14 etc.

  Since the optical waveguide member 4D has flexibility, the optical waveguide member 4D is configured to be capable of optical communication even in a curved state as shown in FIG. 9B. The optical waveguide member 4D preferably has a Young's modulus of 3 GPa or less. Further, in order to give good flexibility to the optical waveguide member 4D, the total thickness of the first cladding layer 6, the core layer 7 and the second cladding layer 8 is 90 μm or less, and the first metal film 26b. The total thickness of the third metal film 52 is preferably set to be 18 μm or less.

  On the other hand, the second casing 109 supports the optical waveguide member 4D and is electrically connected to the operation unit 108, and emits light based on an electrical signal from the wiring board 5b. And the light emitting element 3 that transmits the light as an optical signal to the optical waveguide member 4D. The light emitting element 3 and the wiring board 5b are electrically connected through the through electrode 10 of the optical waveguide member 4D. The light from the light emitting element 3 is transmitted to the core layer 7 through the inclined surface 13 and the reflective film 14 of the optical waveguide member 4D.

  The first casing 107 receives the optical signal transmitted from the optical waveguide member 4D and the wiring board 5a that supports the optical waveguide member 4D and is electrically connected to the display unit 106, and receives the received light. A light receiving element 42 that converts the signal into an electrical signal and transmits the electrical signal to the wiring board 5a is accommodated. The light receiving element 42 and the wiring board 5a are electrically connected via the through electrode 10 of the optical waveguide member 4D. The light to the light receiving element 42 is transmitted to the core layer 7 through the inclined surface 13 and the reflective film 14 of the optical waveguide member 4D. The wiring boards shown in the first to fifth embodiments can be used as the wiring boards 5a and 5b.

    Information input from the operation unit 108 is transmitted as an electric signal to the wiring board 5b by an electric circuit (not shown) in the second casing 109, and the electric signal is transmitted through the through electrode 10 of the optical waveguide member 4D. To be supplied. When the electrical signal is converted into an optical signal by the light emitting element 3, the optical signal is transmitted to the core layer 7 through the inclined surface 13 of the optical waveguide member 4D. Then, the optical signal transmitted to the core layer 7 is input to the light receiving element 42 through the inclined surface 13 of the optical waveguide member 4D. When the light signal is converted into an electric signal by the light receiving element 42, the electric signal is transmitted to the wiring substrate 5a through the through electrode 10 of the optical waveguide member 4D. Then, an electrical signal is transmitted to the driving IC in the display unit 106 via the wiring board 5a, and an image is displayed by the driving IC.

  As described above, in the present embodiment, the display unit 106 of the first casing 107 and the operation unit 108 of the second casing 109 are optically connected by the optical waveguide member 4D. Even when there is a lot of information to be transmitted, it can be transmitted at high speed and low power. As a result, a highly convenient mobile phone device 105 can be realized.

  In the present embodiment, a mobile phone device has been described as an example of a display device. However, the present invention can also be applied to a personal computer, for example. In addition, the optical waveguide member 4D includes a plurality of electronic devices such as a connection member that connects a playback recorder such as a DVD player, a DVD recorder, or a video deck and a television, and a connection member that connects a television and a video camera. It is also possible to use as a connection member for connecting the two.

1 is a perspective sectional view showing an optical wiring module 1 according to a first embodiment of the present invention. It is a perspective sectional view showing a modification of optical fiber module 1 concerning a 1st embodiment of the present invention. It is a perspective sectional view showing a modification of optical fiber module 1 concerning a 1st embodiment of the present invention. It is a perspective sectional view showing a modification of optical fiber module 1 concerning a 1st embodiment of the present invention. It is a figure which shows the flowchart of each process of the manufacturing method of the optical wiring module 1 shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for demonstrating the manufacturing method of the optical wiring module shown in FIG. It is a perspective sectional view for explaining a formation method of a penetration electrode. It is a perspective sectional view for explaining a formation method of a penetration electrode. It is a perspective sectional view for explaining a formation method of a penetration electrode. It is sectional drawing for demonstrating a transfer member. It is a perspective sectional view showing optical wiring board 2A concerning a 2nd embodiment of the present invention. It is a perspective sectional view showing optical wiring module 1A concerning a 2nd embodiment of the present invention. It is a perspective sectional view showing a modification of optical wiring module 1A concerning a 2nd embodiment of the present invention. It is a figure which shows the optical wiring module 1B which concerns on the 3rd Embodiment of this invention. It is a figure which shows 1 C of optical wiring modules which concern on the 4th Embodiment of this invention. It is sectional drawing which shows 1D of optical wiring modules which concern on the 5th Embodiment of this invention. It is a perspective view which shows the mobile telephone apparatus 105 which concerns on the 6th Embodiment of this invention. It is a principal part expanded sectional view of the mobile telephone apparatus 105 shown in FIG. It is a principal part expanded sectional view of the mobile telephone apparatus 105 shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical wiring module 2 Optical wiring board 3 Light emitting element 4 Optical waveguide member 5 Support substrate 6 1st clad layer 7 Core layer 8 2nd clad layer 10 Through electrode 13 Inclined surface 14 Reflective film 16 Through hole 26 Transfer member 26a Transfer sheet 26b First metal film 26a 'Second metal film 42 Light receiving element 52 Third metal film 62 Light shielding member 63 Transparent member 64 Resin material layer 65 First conductive material layer 66 Second conductive material layer 105 Mobile phone device 106 Display unit 107 First Case 108 Operation part 109 Second case 110 Connection part

Claims (26)

Preparing a transfer member having a transfer sheet and a metal film, and holding the transfer sheet and the metal film in a peelable state;
Forming a first cladding layer on the metal film of the transfer member;
Laminating a core layer for propagating light on the first cladding layer;
Forming a laminated body including the first clad layer, the core layer, and the second clad layer by laminating a second clad layer covering the core layer on the core layer; And a method of manufacturing an optical waveguide member. In the manufacturing method of the optical waveguide member according to claim 1,
The manufacturing method of the optical waveguide member further provided with the process of peeling the said transfer sheet from the said laminated body and the said metal film. In the manufacturing method of the optical waveguide member according to claim 2,
A method for manufacturing an optical waveguide member, further comprising a step of removing the metal film after the transfer sheet is peeled from the laminate and the metal film. In the manufacturing method of the optical waveguide member according to claim 2,
A method for producing an optical waveguide member, further comprising a step of patterning the metal film after the transfer sheet is peeled from the laminate and the metal film. In the manufacturing method of the optical waveguide member according to claim 1,
A step of providing an inclined surface on the core layer;
A method for manufacturing an optical waveguide member, wherein an inclination angle α between the inclined surface and the surface of the core layer in contact with the first cladding layer is smaller than 90 degrees. In the manufacturing method of the optical waveguide member according to claim 5,
Further comprising a step of providing a reflective film on the inclined surface provided in the core layer;
The method for manufacturing an optical waveguide member, wherein the laminate includes the reflective film. In the manufacturing method of the optical waveguide member according to claim 1,
The method for manufacturing an optical waveguide member, wherein the transfer sheet has a second metal film on a surface in contact with the metal film, and is peelable between the second metal film and the metal film. In the manufacturing method of the optical waveguide member according to claim 1,
A method of manufacturing an optical waveguide member in which a third metal film is deposited on the second cladding layer. In the manufacturing method of the optical waveguide member according to claim 8,
An optical waveguide member manufacturing method in which at least one of the metal film and the third metal film is processed into a predetermined pattern. Preparing a transfer member having a transfer sheet and a metal film, and holding the transfer sheet and the metal film in a peelable state;
Forming a first cladding layer on the metal film of the transfer member;
Laminating a core layer for propagating light on the first cladding layer;
Forming a laminated body including the first clad layer, the core layer, and the second clad layer by laminating a second clad layer covering the core layer on the core layer; When,
Adhering the laminate to the wiring board such that the second cladding layer faces the wiring board;
And a step of peeling the transfer sheet from the laminate and the metal film. In the manufacturing method of the optical wiring board of Claim 10,
The manufacturing method of the optical wiring board further provided with the process of removing the said metal film, after peeling the said transfer sheet from the said laminated body and the said metal film. In the manufacturing method of the optical wiring board of Claim 10,
The manufacturing method of the optical wiring board further provided with the process of pattern-processing the said metal film, after peeling the said transfer sheet from the said laminated body and the said metal film. In the manufacturing method of the optical wiring board of Claim 10,
A step of providing an inclined surface on the core layer;
The manufacturing method of the optical wiring board whose angle (alpha) between the said inclined surface and the surface of the said core layer which contact | connects the said 1st cladding layer is smaller than 90 degrees. In the manufacturing method of the optical wiring board of Claim 10,
A step of providing a reflective film on the inclined surface provided in the core layer;
The method for manufacturing an optical wiring board, wherein the laminate includes the reflective film. A wiring board, and an optical waveguide member disposed on the wiring board,
The optical waveguide member is interposed between the first cladding layer, the second cladding layer disposed closer to the wiring substrate than the first cladding layer, the first cladding layer and the second cladding layer, An optical wiring board having a plurality of core layers each having an inclined surface, wherein an angle α between the surface of the core layer located on the first cladding layer side and the inclined surface is smaller than 90 degrees. The optical wiring board according to claim 15,
An optical wiring board in which the angle α is not less than 41 degrees and not more than 49 degrees. The optical wiring board according to claim 15,
An optical wiring board in which the inclined surface is formed in a curved shape protruding toward the second cladding layer. The optical wiring board according to claim 15,
An optical wiring board, wherein a reflective film for reflecting light is deposited on the inclined surface. The optical wiring board according to claim 18,
The second clad layer is an optical wiring board formed so as to cover the inclined surface and the reflective film. The optical wiring board according to claim 15,
The optical wiring board, wherein the surface of the optical waveguide member is a flat surface. The optical wiring board according to claim 15,
The optical waveguide member is an optical wiring board having a conductive layer on a surface of the first cladding layer opposite to the wiring board. The optical wiring board according to claim 15,
The optical waveguide member has a resin layer between a surface of the first cladding layer opposite to the wiring substrate and the conductive layer, and the conductive layer is formed by an electroless plating method. An optical wiring board according to claim 15,
And an optical semiconductor module connected to the wiring pattern.   An optical waveguide member comprising: a first cladding layer; a core layer disposed on the first cladding layer and having an inclined surface; and a second cladding layer continuously covering the core layer including the inclined surface. The optical waveguide member according to claim 24,
An optical waveguide member having a pair of metal films on the first clad layer and the second clad layer, and at least one of the pair of metal films being deposited by transfer. A display device comprising: a display unit; an operation unit that controls the display unit; and the optical waveguide member according to claim 24 that optically connects the display unit and the operation unit.

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