JP2008035441A - Piezoelectric vibrator manufacturing method, piezoelectric vibrator and electronic component - Google Patents

Abstract

An outer portion corresponding to a plurality of piezoelectric vibrating pieces is obtained by etching from a piezoelectric substrate, an electrode film is formed on the piezoelectric vibrating piece, and a groove is formed in each of a plurality of vibrating arm portions extending from a base. In the method for manufacturing a piezoelectric vibrator, when a substrate is immersed in a substrate etching solution and a portion corresponding to a groove is etched, generation of a protrusion on the side surface of the vibrating arm portion is suppressed.
The present invention includes a step of covering the entire outer portion of the piezoelectric vibrating piece with a metal film before the step of forming the groove in the vibrating arm portion of the piezoelectric vibrating piece. With such a configuration, when the substrate is immersed in the substrate etching solution and the portion corresponding to the groove is etched, there is no possibility that a protrusion is generated on the side surface of the vibrating arm portion.
[Selection] Figure 3

Description

  The present invention relates to a technique for manufacturing, for example, a tuning fork type piezoelectric vibrator using a piezoelectric substrate made of, for example, quartz.

  The tuning fork type crystal resonator is small, inexpensive, and has low power consumption, so that it has been conventionally employed as a signal source for engraving the rate of a wristwatch, and its application is going to expand. This crystal resonator is required to have a smaller CI (crystal impedance) value in order to suppress power loss. For this reason, a crystal resonator having a groove portion with improved vibration efficiency is used. Yes.

  As shown in FIG. 9, this crystal resonator is provided with a pair of vibrating arms 2a and 2b on the base 1, and grooves 31 and 32 are provided on both main surfaces of the vibrating arms 2a and 2b, respectively. Excitation electrodes for exciting tuning fork vibration based on flexural vibration are formed in the groove portions 31 and 32 and the vibrating arm portions 2a and 2b.

The above-described crystal resonator is manufactured by the following process (see Patent Document 1). 10 and 11 are diagrams showing a manufacturing process for a cross-sectional portion along the line AA in FIG. First, the cut crystal wafer 10 is polished and cleaned, and then a metal film 11 is formed by sputtering (FIG. 10A). As the metal film 11, for example, a film in which gold (Au) is laminated on a chromium (Cr) base film is used.
Subsequently, after applying a photoresist on such a metal film 11 by, for example, a spray method (FIG. 10B), this photoresist is exposed and developed so as to form a crystal piece shape, that is, a tuning fork shape pattern. Then, a tuning fork-shaped resist film 12 is formed (FIG. 10C). Thereafter, the portion of the metal film 11 not covered with the resist film 12 is removed by etching, and the resist film 12 remaining on the crystal wafer 10 is completely removed (FIG. 10D).
Next, a photoresist is applied to the entire surface of the quartz wafer 10 by, for example, a spray method to form a resist film 13 (FIG. 10E). Then, the resist film 13 is peeled off so that the outer shape of the crystal piece remains, and the resist film 13 corresponding to the grooves 31, 32 shown in FIG. 9 is peeled off (FIG. 11 (f)).

  Thereafter, while the resist film 13 is placed on the metal film 11, the crystal wafer 10 is immersed in hydrofluoric acid, which is a substrate etching solution, using the metal film 11 as a mask, and wet etching is performed, whereby the outer shape of the crystal piece is obtained. It forms (FIG.11 (g)). In the outer shape forming process of the crystal piece, as shown in FIG. 12A, a protrusion (side etch) 14 is formed on one side surface of the crystal piece. This is due to the anisotropy of the quartz piece, that is, the quartz wafer 10 is made of AT-cut quartz. Therefore, in FIG. Assuming that the right side of the crystal piece is −X and the left side is + X with respect to the axis, the etching rate of the crystal wafer 10 has a relationship of Z> + X> −X. Therefore, as shown in FIG. 12A, at + X, the etching from the front surface side (back surface side) to the back surface side (front surface side) of the crystal wafer 10 is affected by the etching toward the X axis direction. Etching is performed obliquely from the back side to the back side (front side), and in this example, a protrusion 14 is formed on the left side surface of the crystal piece. Further, as shown in FIG. 12A, at -X, the etching from the front surface side (back surface side) to the back surface side (front surface side) of the crystal wafer 10 is hardly affected by the etching toward the X axis direction. Therefore, etching is performed vertically from the front surface side (back surface side) to the back surface side (front surface side). In order to reduce the protrusion amount of the protrusion 14, the crystal wafer 10 is immersed in hydrofluoric acid even after the outer shape of the crystal piece is formed, and the side surface of the crystal piece is etched, so-called over-etching is performed. Yes. 11 and 15 in FIG. 11 are portions corresponding to the vibrating arm portions 2a and 2b, and 16 and 17 in FIG. 11 are outer frame portions described for the sake of convenience in order to extract one crystal piece from the crystal wafer. It is.

  Subsequently, using the resist film 13 as a mask, the quartz wafer 10 is dipped in a potassium iodide (KI) solution, which is a metal etching solution, and wet etching is performed, so that the metal corresponding to the grooves 31 and 32 shown in FIG. The film 11 is removed (FIG. 11 (h)). The quartz wafer 10 is immersed in hydrofluoric acid and wet etching is performed. As a result, grooves 31 and 32 are formed on both main surfaces of the crystal piece 10 (FIG. 11 (i)).

  However, the manufacturing process described above has the following problems. That is, by performing the over-etching, the outer shape of the crystal piece becomes slightly smaller than the outer shape of the metal film 11 as shown in FIG. 12B, and as a result, the metal film 11 protrudes from the outer shape of the crystal piece. Has been formed. On the other hand, when the wet etching is performed by immersing the quartz wafer 10 in a KI solution, which is a metal etching solution, as shown in FIG. 11 (h), it corresponds to the grooves 31, 32 as shown in FIG. 13 (a). A portion of the metal film 11 is removed, but at this time, the peripheral portion of the metal film 11 protruding from the crystal piece is also removed, and the metal film 11 is slightly smaller than the outer shape of the metal film 11. Therefore, when wet etching is performed by immersing the quartz wafer 10 in hydrofluoric acid as an etching solution as shown in FIG. 11 (i), grooves 31 are formed on both main surfaces of the quartz piece 10 as shown in FIG. 13 (b). , 32 are formed, and etching is also performed from the edge of the crystal piece where the metal film 11 is not covered. As a result, on one side surface of the crystal piece, in this example, the left side surface of the crystal piece, a new protrusion is formed between the protrusion 14 and the upper and lower edges of the crystal piece due to the anisotropy of the crystal piece. There is a problem that the portions (side etch) 15 and 16 are formed and three chevron portions are generated. Further, since the size of the protrusions is different on the left and right (+ X, −X) sides, the vibrations of the left and right vibrating arm portions 2a and 2b are different from each other, resulting in a problem that the energy balance is lost and the CI value is increased.

  On the other hand, when the crystal wafer 10 is immersed in the etching solution for a long time in order to reduce the protrusion amount of the protrusions 15 and 16, the grooves 31 and 32 shown in FIGS. 11 (i) and 13 (b) are formed. The problem arises that it becomes deeper than necessary or penetrates.

JP 2002-76806 (paragraphs 0094 to 0113, FIGS. 9 to 13)

  The present invention has been made in view of such circumstances, and its purpose is to generate a protrusion on the side surface of the vibrating arm when the substrate is immersed in a substrate etching solution to etch the portion corresponding to the groove. It is an object of the present invention to provide a method for manufacturing a piezoelectric vibrator capable of suppressing the above, a piezoelectric vibrator, and an electronic component having the piezoelectric vibrator.

In the present invention, an outer portion corresponding to a plurality of piezoelectric vibrating pieces is obtained by etching from a piezoelectric substrate, and an electrode film is formed on the piezoelectric vibrating piece, and a groove is formed in each of a plurality of vibrating arm portions extending from the base. In the method for manufacturing a piezoelectric vibrator,
Forming a metal film on the surface of the substrate which is a piezoelectric substrate;
Forming a resist mask patterned so that the shape portion of the piezoelectric vibrating piece remains on the surface of the metal film, and removing the metal film by etching;
Next, contacting the substrate with a substrate etching solution to form an outer shape of the piezoelectric vibrating piece;
Thereafter, the step of contacting the substrate with a metal etching solution to remove the peripheral portion of the metal film protruding from the piezoelectric vibrating piece;
A step of removing all the resist film remaining on the substrate surface;
Thereafter, a step of covering the entire piezoelectric vibrating piece with a metal film,
Forming a resist mask having an opening corresponding to the groove of the vibrating arm on the surface of the metal film, and removing the metal film by etching;
Forming a groove in each of the plurality of vibrating arms using the metal film as a mask by contacting the substrate with a substrate etching solution;
And a step of forming an electrode pattern made of a metal on the surface of the piezoelectric vibrating piece.

According to the present invention, an outer portion corresponding to the plurality of piezoelectric vibrating pieces is obtained by etching from the piezoelectric substrate, and an electrode film is formed on the piezoelectric vibrating piece, and a groove is formed in each of the plurality of vibrating arms extending from the base. In the method of manufacturing the formed piezoelectric vibrator,
Forming a metal film on the surface of the substrate which is a piezoelectric substrate;
Forming a resist mask patterned so that the shape portion of the piezoelectric vibrating piece remains on the surface of the metal film, and removing the metal film by etching;
Next, contacting the substrate with a substrate etching solution to form an outer shape of the piezoelectric vibrating piece;
Removing all the resist film and metal film remaining on the substrate surface;
Thereafter, a step of covering the entire piezoelectric vibrating piece with a metal film,
Forming a resist mask having an opening corresponding to the groove of the vibrating arm on the surface of the metal film, and removing the metal film by etching;
Forming a groove in each of the plurality of vibrating arms using the metal film as a mask by contacting the substrate with a substrate etching solution;
And a step of forming an electrode pattern made of a metal on the surface of the piezoelectric vibrating piece.
The method for manufacturing a piezoelectric vibrator described above may include a step of peeling the resist film and the metal film after forming the outer shape of the piezoelectric vibrating piece.
The piezoelectric vibrator of the present invention is manufactured by the method described above.
Furthermore, an electronic component of the present invention includes a piezoelectric vibrator, a container for housing the piezoelectric vibrator, an external electrode formed on the outer surface of the container and electrically connected to the electrode of the piezoelectric vibrator, It is provided with.

  According to the present invention, since the entire outer portion of the piezoelectric vibrating piece is covered with the metal film before the groove is formed in the vibrating arm portion of the piezoelectric vibrating piece, the substrate is immersed in the substrate etching solution to form the groove. When the corresponding portion is etched, there is no possibility that a protruding portion is generated on the side surface of the vibrating arm portion. For this reason, since generation | occurrence | production of the projection part in the side surface of a vibrating arm part can be suppressed, deterioration (increase) of CI value of a piezoelectric vibrator can be prevented.

  A method for manufacturing a tuning fork type crystal resonator which is a piezoelectric resonator will be described as an embodiment of the present invention. The structure of the crystal resonator according to this embodiment is the same as that of the crystal resonator described with reference to FIG. 10 in the section of the prior art, and thus description of the same portion is omitted.

  As shown in FIG. 1, this crystal resonator has a pair of one electrode and the other electrode. First, when attention is paid to the vibrating arm portion 2 a of the vibrating arm portion 2, one excitation electrode 41 is formed between the entire inner surfaces of the two groove portions 31 and 32 of the vibrating arm portion 2 a and between the groove portions 31 and 32. That is, the excitation electrodes 41 in the groove portions 31 and 32 of the vibrating arm portion 2a are connected to each other by the excitation electrode 41 formed in the bridge portion corresponding to the groove portions 31 and 32. The other excitation electrode 51 is formed on both side surfaces 21 and 21 of the vibrating arm portion 2a and on the upper surface of the main surfaces 22 and 22 (front side and back side) above the second groove portion 31 on the tip side. Yes. Furthermore, an adjustment weight 50, which is a metal film for adjusting the oscillation frequency by adjusting the weight of the vibration arm 2a, is provided at the tip of the vibration arm 2a. The adjustment weight 50 forms a part of the excitation electrode 51, but the film thickness and the electrode material are changed from those of the other parts. In FIG. 1, the excitation electrodes 41 and 51 are indicated by using a hatched line and a black interspersed area for easy understanding of the drawing. Therefore, the oblique lines in FIG. 1 do not indicate the cross section of the crystal piece.

  Focusing on the vibrating arm 2b, the other excitation electrode 51 is formed between the entire inner surfaces of the two grooves 31 and 32 of the vibrating arm 2b and between each of the grooves 31 and 32. One excitation electrode 41 is formed on both side surfaces 21 and 21 of the vibrating arm portion 2b and on the main surfaces 22 and 22 (front side and back side) above the second groove portion 31 on the tip side. Yes. Note that an adjustment weight 40 for adjusting the oscillation frequency by adjusting the weight is also provided at the tip of the vibrating arm 2a. The arrangement of the electrodes provided on the vibrating arm portions 2a and 2b is the same except that the excitation electrodes 41 and 51 are opposite to each other. Then, an electrode pattern composed of a lead electrode 42 is formed on the surface of the base 1 so that the one excitation electrode 41 is electrically connected, and the base 1 is connected so that the other excitation electrode 51 is connected. An electrode pattern made of extraction electrodes 52 is formed on the surface of the electrode.

Next, a method for manufacturing the crystal unit shown in FIG. 1 will be described with reference to FIGS. 2 to 5 illustrate one crystal resonator formed on a part of one piezoelectric substrate. 2-5 is a figure which shows the manufacturing process about the cross-sectional part along the BB line of FIG. First, after polishing and cleaning the crystal wafer 60 that is the cut out piezoelectric substrate, a metal film 61 is formed by a sputtering method (FIG. 2A). As the metal film 61, for example, a film in which gold (Au) is laminated on a chromium (Cr) base film is used.
Subsequently, after applying a photoresist on such a metal film 61 by, for example, a spray method (FIG. 2B), the photoresist is exposed and developed so as to form a crystal piece shape, that is, a tuning fork shape pattern. Then, a tuning fork-shaped resist film 62 is formed (FIG. 2C). Thereafter, wet etching is performed by immersing the quartz wafer 60 in a potassium iodide (KI) solution, which is a metal etching solution, using the resist film 62 as a mask, so that the metal film 61 not covered with the resist film 62 is formed. Is removed (FIG. 2D).
Then, this crystal wafer 60 is immersed in hydrofluoric acid, which is a substrate etching solution, and wet etching is performed to form the outer shape of the crystal piece 65 (FIG. 2E). In this outer shape forming process of the crystal piece, as described in detail in the section of the prior art, a protrusion (side etch) is formed on one side surface of the crystal piece 65, in this example, the left side surface of the crystal piece 65 due to the anisotropy of the crystal piece. ) 8 is formed (see FIG. 6A). In order to reduce the protrusion amount of the protrusion 8, the crystal wafer 60 is immersed in hydrofluoric acid even after the outer shape of the crystal piece 65 is formed, and the side surface of the crystal piece 65 is etched (overetching). By performing this over-etching, the outer shape of the crystal piece 65 becomes slightly smaller than the outer shape of the metal film 61 as shown in FIG. 6B. As a result, the metal film 61 protrudes from the outer shape of the crystal piece 65. Is formed. Thus, a plurality of crystal pieces 65 are formed on the crystal wafer 60 which is a piezoelectric substrate.

  Next, the quartz wafer 60 is immersed in a KI solution, which is a metal etching solution, and wet etching is performed to remove the peripheral portion of the metal film 61 protruding from the quartz piece 65 (FIG. 3F). That is, as shown in FIG. 6B, the metal film 61 that is slightly smaller than the outer shape of the crystal piece 65 is formed by etching from below the eaves of the metal film 61. Next, all of the resist film 62 remaining on the surface of the quartz wafer 60 is peeled off (FIG. 3G). Subsequently, a new metal film 63 is similarly formed on the surface of the quartz wafer 60 by sputtering, and the entire outer shape of the quartz piece 65 is covered with the metal film 63 (FIG. 3 (h)). The reason for removing the peripheral portion of the metal film 61 protruding from the crystal piece 65 in this way is that when the entire outer shape of the crystal piece 65 is covered with the metal film 63 in the step shown in FIG. This is to prevent voids (holes) from being formed at the corner portions (edge portions) of 65.

Next, a photoresist is applied on the metal film 63 by, for example, a spray method to form a resist film 64 (FIG. 3I). Thereafter, the resist film 64 corresponding to the grooves 31 and 32 shown in FIG. 1 is removed by photolithography (FIG. 4J). Subsequently, using the resist film 64 as a mask, the quartz crystal wafer 60 is immersed in a KI solution, which is a metal etching solution, and wet etching is performed to remove the metal film 63 where the resist film 64 has been peeled off (FIG. 4 (k )).
Thereafter, the quartz wafer 60 is dipped in hydrofluoric acid, which is a substrate etching solution, and wet etching is performed to form grooves 31 and 32 on both main surfaces of the quartz piece 65 (FIG. 4L). Thereafter, the resist film 64 and the metal film 63 remaining on the quartz wafer 60 are removed (FIG. 4M). Through the above steps, a prototype (quartz piece) 6 in which no electrode pattern is formed as shown in FIG. 7 is manufactured.
Next, a process for creating an electrode pattern will be described. First, a metal film 66 to be an electrode is formed on both surfaces of the prototype 6 by sputtering (FIG. 5 (n)). As the metal film 66, for example, a film in which gold (Au) is laminated on a chromium (Cr) base film is used.
Subsequently, a photoresist is applied on the metal film 66 by a spray method (FIG. 5 (o)). Then, the resist film 67 other than the resist film 67 to be an electrode pattern is removed by photolithography (FIG. 5 (p)). Thereafter, the metal film 66 where the resist film 67 is peeled is etched to form an electrode pattern (FIG. 5 (q)). Thereafter, all the resist film 67 remaining on the master 6 is peeled off (FIG. 5 (r)). In this way, a crystal resonator in which an electrode pattern is formed on the crystal piece 65 is obtained, and each crystal resonator is divided and individual crystal resonators are cut out.

  According to the above-described embodiment, the protrusion 8 is formed on one side surface of the crystal piece 65 when the crystal piece 65 is formed, but when the grooves 31 and 32 are formed in the subsequent crystal piece 65, Since the etching is performed in a state where the entire outer shape is covered with the metal film 63, the formation of the protrusions beyond this is suppressed. That is, conventionally, three chevron portions are generated on one side surface of the crystal piece, but in the present invention, it can be suppressed to one. That is, since there is one protrusion having a different size on the left and right (+ X, −X) side, it is possible to prevent the deterioration (increase) of the CI value of the piezoelectric vibrator.

  As another embodiment of the present invention, in FIG. 3G, after the metal film 61 remaining on the surface of the crystal wafer 60 is peeled off, a new metal film 63 is formed on the surface of the crystal wafer 60 by sputtering. The entire outer shape of the crystal piece 65 may be covered with the metal film 63 (FIG. 3 (h)). Even in such a configuration, when the quartz wafer is immersed in the substrate etching solution and the portion corresponding to the groove is etched as described above, it is possible to suppress the occurrence of protrusions on the side surface of the quartz piece.

  Further, for example, as shown in FIG. 8, the above-described crystal resonator is stored in a package 7 made of ceramic having an SMD (Surface Mounted Device) structure. The package 7 includes a case body 7a made of, for example, ceramic whose upper surface is open, and a metallic lid body 7b, for example. The case body 7a and the lid body 7b are seam welded via a sealing material 7c made of, for example, a welding material, and the inside is in a vacuum state. In the tuning fork type crystal resonator 70 described above, the extraction electrodes 42 and 52 of the base 1 are fixed to the pedestal 71 portion in the package 7 by the conductive adhesive 7d, and the vibrating arm portions 2a and 2b are the spaces inside the package 7. It is fixed to the pedestal 71 in a sideways posture that extends out. Conductive paths 72 and 73 (73 is a conductive path on the back side of the drawing) are wired on the surface of the pedestal 71, and the lead electrodes 42 and 52 of the base 1 are connected with the conductive adhesive 7d via the conductive adhesive 7d. Connected to conductive paths 72 and 73. The conductive paths 72 and 73 are connected to electrodes 74 and 75 provided to face the longitudinal direction of the outer bottom surface of the case body 7a. As a result, the electrodes 74 and 75 and the conductive paths 72 and 73 are connected. Further, when the current is applied to the lead electrodes 42 and 52 of the base 1 through the conductive adhesive 7d, the crystal resonator 70 is vibrated. Thus, a package type crystal resonator is configured, and this crystal resonator is mounted on a wiring board (not shown) on which circuit components of the oscillation circuit are mounted, thereby forming an electronic component.

It is a perspective view which shows an example of the tuning fork type | mold crystal resonator based on embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the tuning fork type crystal resonator which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the tuning fork type crystal resonator which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the tuning fork type crystal resonator which concerns on embodiment of this invention. It is a schematic sectional drawing which shows the manufacturing method of the tuning fork type crystal resonator which concerns on embodiment of this invention. It is sectional drawing of the groove part location currently formed in the vibration arm part of the said tuning fork type crystal resonator. It is a top view which shows an example of the original model of the crystal vibrating piece manufactured in the manufacturing process of the tuning fork type crystal resonator according to the embodiment of the present invention. FIG. 2 is a schematic longitudinal sectional view and a back view showing an example of an electronic component storing a tuning fork type crystal resonator according to an embodiment of the present invention. It is a schematic plan view which shows an example of a tuning fork type crystal resonator. It is a schematic sectional drawing which shows the manufacturing method of the conventional tuning fork type crystal resonator. It is a schematic sectional drawing which shows the manufacturing method of the conventional tuning fork type crystal resonator. It is sectional drawing of the groove part location currently formed in the vibration arm part of the said tuning fork type crystal resonator. It is sectional drawing of the groove part location currently formed in the vibration arm part of the said tuning fork type crystal resonator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base part 2a, 2b Vibration arm part 8 Package 10 Crystal wafer 11 Metal film 12 Resist film 31, 32 Groove parts 40, 50 Adjustment weight 41, 51 Excitation electrode 42, 52 Extraction electrode 6 Prototype 60 Crystal wafer 61, 63 Metal film 62 , 64 Resist film 65 Crystal piece

Claims (4)

Piezoelectric substrate in which outer portions corresponding to a plurality of piezoelectric vibrating pieces are obtained by etching and an electrode film is formed on the piezoelectric vibrating piece, and a groove is formed in each of the plurality of vibrating arm portions extending from the base. In a method of manufacturing a vibrator,
Forming a metal film on the surface of the substrate which is a piezoelectric substrate;
Forming a resist mask patterned so that the shape portion of the piezoelectric vibrating piece remains on the surface of the metal film, and removing the metal film by etching;
Next, contacting the substrate with a substrate etching solution to form an outer shape of the piezoelectric vibrating piece;
Thereafter, the step of contacting the substrate with a metal etching solution to remove the peripheral portion of the metal film protruding from the piezoelectric vibrating piece;
A step of removing all the resist film remaining on the substrate surface;
Thereafter, a step of covering the entire piezoelectric vibrating piece with a metal film,
Forming a resist mask having an opening corresponding to the groove of the vibrating arm on the surface of the metal film, and removing the metal film by etching;
Forming a groove in each of the plurality of vibrating arms using the metal film as a mask by contacting the substrate with a substrate etching solution;
And a step of forming an electrode pattern made of metal on the surface of the piezoelectric vibrating piece. Piezoelectric substrate in which outer portions corresponding to a plurality of piezoelectric vibrating pieces are obtained by etching and an electrode film is formed on the piezoelectric vibrating piece, and a groove is formed in each of the plurality of vibrating arm portions extending from the base. In a method of manufacturing a vibrator,
Forming a metal film on the surface of the substrate which is a piezoelectric substrate;
Forming a resist mask patterned so that the shape portion of the piezoelectric vibrating piece remains on the surface of the metal film, and removing the metal film by etching;
Next, contacting the substrate with a substrate etching solution to form an outer shape of the piezoelectric vibrating piece;
Removing all the resist film and metal film remaining on the substrate surface;
Thereafter, a step of covering the entire piezoelectric vibrating piece with a metal film,
Forming a resist mask having an opening corresponding to the groove of the vibrating arm on the surface of the metal film, and removing the metal film by etching;
Forming a groove in each of the plurality of vibrating arms using the metal film as a mask by contacting the substrate with a substrate etching solution;
And a step of forming an electrode pattern made of metal on the surface of the piezoelectric vibrating piece.   A piezoelectric vibrator manufactured by the method according to claim 1. A piezoelectric vibrator according to claim 3, a container for housing the piezoelectric vibrator, and an external electrode formed on an outer surface of the container and electrically connected to an electrode of the piezoelectric vibrator. An electronic component characterized by comprising.

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