JP2008112853A - Substrate processing system, substrate transfer apparatus, substrate transfer method, and recording medium - Google Patents

Abstract

A substrate transport apparatus capable of performing an appropriate treatment on a substrate being transported is provided.
A substrate transfer device includes a fork support body that can move between a first substrate housing portion and a second substrate housing portion, and forks that are movably supported by the fork support body. And comprising. The fork supports the substrate transported from the first substrate housing portion to the second substrate housing portion at the first support position, and the substrate transported from the second substrate housing portion to the first substrate housing portion as the first support position. Support at different second support positions. The fork that supports the substrate at the first support position is disposed at the first standby position during movement of the fork support, and the fork that supports the substrate at the second support position is positioned at the first standby position during movement of the fork support. Is arranged at a second standby position different from the above.
[Selection] Figure 9

Description

  The present invention relates to a substrate transfer apparatus for transferring a substrate such as a semiconductor wafer, a substrate processing system provided with the substrate transfer apparatus, a transfer method for transferring a substrate using the substrate transfer apparatus, and a substrate transfer apparatus. The present invention relates to a recording medium on which a program for executing a transport method for transporting a substrate is recorded.

  2. Description of the Related Art Conventionally, various types of substrate processing systems for performing processing such as cleaning processing on a substrate such as a semiconductor wafer are known. In such a substrate processing system, a substrate is transferred from a first substrate storage unit (for example, a hoop) that stores a plurality of substrates into a second substrate storage unit (for example, a processing chamber) using a substrate transfer device. Then, the substrate is processed. Further, the processed substrate is transported again from the second substrate housing unit to the first substrate housing unit using the substrate transport device.

Here, FIG. 15 and FIG. 16 show an example of the substrate transfer apparatus. In this example, the substrate transport apparatus includes a fork support 151 that can move between the substrate accommodating portions, and a fork 160 that is movably supported by the fork support. The fork moves to enter the substrate container, and receives or delivers the substrate to and from the substrate container. Further, the fork support moves between the substrate accommodating portions in a state where the fork supports the substrate. In recent years, an attempt has been made to support a substrate (solid line) W1 before processing and a substrate (two-dot chain line) W2 that has been processed at different positions of the fork 160 (for example, Patent Document 1). Such a treatment is aimed at preventing the processed wafer from being recontaminated through the support portion of the fork.
JP-A-6-87531

  By the way, various inspections and treatments are performed on the substrate supported by the fork. Specifically, the inspection of the support position of the substrate on the fork, the correction of the support position on the fork, and the like. However, if the unprocessed substrate and the processed substrate are supported at different positions on the fork, as will be described below, inspection and treatment appropriate for both the unprocessed substrate and the processed substrate are performed. It becomes difficult to do.

  In the example shown in FIG. 16, one sensor 175 for detecting a defective substrate support position is provided near the position where the processed substrate W2 is disposed. According to this sensor, it is possible to appropriately detect a defective support position of the processed substrate. However, it is impossible to detect the case where the substrate is supported by being slightly shifted from the support position for the pre-treatment substrate. In order to avoid this problem, it is necessary to separately provide a sensor for detecting a defective support position of the substrate before processing in the vicinity of the position of the substrate before processing. Further, if a sensor is separately provided, not only a cost problem but also a space problem occurs.

  In the example shown in FIG. 15, a guide 171 for correcting the support position of the substrate is provided in the vicinity of the arrangement position of the substrate W1 before processing. According to this guide, the support position of the pre-treatment substrate can be appropriately corrected. However, the support position of the processed substrate cannot be corrected appropriately. In order to avoid this problem, a guide for the processed substrate must be separately provided in the vicinity of the position where the processed substrate is arranged. Further, if a guide is separately provided, not only a cost problem but also a space problem occurs.

  Further, for the purpose of improving the processing efficiency, there is a demand for increasing the moving speed of the fork support. In order to increase the moving speed of the fork support, it is necessary to effectively prevent the processed substrate and the unprocessed substrate from being displaced from the fork by the guide.

  The present invention has been made in consideration of the above points, and can solve the conventional problems and can perform an appropriate treatment on a substrate during transportation, a substrate processing system, and a substrate transportation method. An object of the present invention is to provide a recording medium on which a program for executing the substrate carrying method is recorded. Here, suitable measures include, for example, checking the support position of the substrate supported by the fork with high accuracy, correcting the support position of the substrate supported by the fork with high accuracy, and on the fork during movement. For example, it is possible to appropriately prevent the substrate from being displaced.

  The substrate transfer apparatus according to the present invention includes a substrate that transfers a substrate from a first substrate storage unit that stores a substrate to a second substrate storage unit that stores a substrate, and from the second substrate storage unit to the first substrate storage unit. A fork support body that is movable between the first substrate housing portion and the second substrate housing portion; and a fork that is movably supported by the fork support body. Are transported from the first substrate housing portion to the second substrate housing portion at a first support position, and are transported from the second substrate housing portion to the first substrate housing portion. A second support piece for supporting the substrate at a second support position different from the first support position, and the fork supporting the substrate at the first support position is moved during the movement of the fork support body. Against the fork support The fork disposed at one standby position and supporting the substrate at the second support position is disposed at a second standby position different from the first standby position with respect to the fork support during movement of the fork support. It is characterized by being.

  In the substrate transfer apparatus according to the present invention, the first standby position and the second standby position may be shifted along the moving direction of the fork relative to the fork support. In such a substrate transport apparatus, the first support position and the second support position may be shifted along the moving direction of the fork relative to the fork support. Furthermore, in such a substrate transport apparatus, the first standby position and the second standby position are a position along the moving direction of the fork of the substrate supported by the first support position and the second support position, respectively. You may make it shift | deviate so that the position along the moving direction of the said fork of the supported board | substrate may align.

  Further, the substrate transport apparatus according to the present invention is a support failure detection sensor fixed to the fork support, further comprising a support failure detection sensor for detecting a failure of a substrate support position by the fork, and the support failure detection. The sensor is at an outer position along the moving direction of the fork with respect to the substrate supported at the first support position by the fork disposed at the first standby position, and the second You may make it arrange | position at the outer position along the moving direction of the said fork with respect to the board | substrate supported by the said 2nd support position with the said fork arrange | positioned at a stand-by position.

  Furthermore, the substrate transport apparatus according to the present invention further includes a guide fixed to the fork support, and the guide is supported by the fork disposed at the first standby position of the substrate supported at the first support position. It is also possible to prevent displacement and prevent displacement of the substrate supported at the second support position by the fork disposed at the second standby position.

  Furthermore, in the substrate transfer apparatus according to the present invention, a plurality of forks may be supported on the fork support.

  A substrate processing system according to the present invention includes a first substrate housing portion that houses a substrate, a second substrate housing portion that houses a substrate, the first substrate housing portion to the second substrate housing portion, and the second substrate housing portion. One of the above-described substrate transport apparatuses that transports a substrate from the substrate housing portion to the first substrate housing portion.

  A substrate transport method according to the present invention includes a fork support that is movable between a first substrate storage unit that stores a substrate and a second substrate storage unit that stores a substrate, and a fork that is movably supported by the fork support. And a transport method for transporting a substrate from one of the first substrate housing portion and the second substrate housing portion to the other using a substrate transport device comprising: the fork facing one substrate housing portion The step of moving the fork support, the step of moving the fork forward, and supporting the substrate accommodated in the one substrate accommodating portion facing the substrate by the fork, and retracting the fork supporting the substrate. A step of moving the fork support so that the fork supporting the substrate faces the other substrate housing portion, and advancing the fork supporting the substrate And placing the substrate in the other substrate receiving portion facing each other, and when the substrate is transported from the first substrate receiving portion to the second substrate receiving portion, the fork has a first support. The substrate is supported at a position, and during the movement of the fork support, the fork is disposed at a first standby position with respect to the fork support, and the second substrate receiving portion is moved to the first substrate receiving portion. When transporting the substrate, the fork supports the substrate at the second support position different from the first support position, and the fork supports the fork support with a first standby while the fork support is moving. It is arranged at a second standby position different from the position.

  In the substrate transfer method according to the present invention, the first standby position and the second standby position may be shifted along the moving direction of the fork relative to the fork support. In such a substrate transport method, the first support position and the second support position may be shifted along the moving direction of the fork relative to the fork support. Furthermore, in such a substrate transport method, the first standby position and the second standby position are the position along the moving direction of the fork of the substrate supported at the first support position and the second support position. You may make it shift | deviate so that the position along the moving direction of the said fork of the supported board | substrate may align.

  In the substrate transport method according to the present invention, after the step of retracting the fork supporting the substrate, the substrate supported at the first support position by the fork disposed at the first standby position, A front position along the moving direction of the fork and along the moving direction of the fork with respect to the substrate supported at the second support position by the fork disposed at the second standby position. Whether or not the support position of the substrate is normal may be determined by a support failure detection sensor fixed to the fork support so as to be disposed at the front position.

  Further, in the substrate transport method according to the present invention, in the step of moving the fork support so that the fork supporting the substrate faces the other substrate housing portion, the guide fixed to the fork support supports the first The substrate supported at the first support position by the fork disposed at the first standby position is prevented from shifting from the first support position, or the second fork disposed at the second standby position. You may make it prevent the shift | offset | difference from the said 1st support position of the board | substrate supported by a support position.

  A program according to the present invention includes a fork support body that is movable between a first substrate housing portion that houses a substrate and a second substrate housing portion that houses a substrate, a fork that is movably supported by the fork support body, A program executed by a control device that controls a substrate transfer device comprising: the first substrate storage portion and the second substrate storage using the substrate transfer device when the program is executed by the control device. A substrate transport method for transporting a substrate from one of the parts to the other, the step of moving the fork support so that the fork faces one of the substrate housing parts, and advancing the fork, A step of supporting the substrate accommodated in one of the substrate accommodating portions facing each other by the fork, and a step of retracting the fork supporting the substrate; The step of moving the fork support so that the fork supporting the substrate faces the other substrate housing portion, and the fork supporting the substrate is advanced, and the substrate is placed in the other substrate housing portion facing the substrate. And when the substrate is transported from the first substrate container to the second substrate container, the fork supports the substrate at the first support position, and the fork support is being moved. The fork is disposed at a first standby position with respect to the fork support, and when the substrate is transferred from the second substrate housing portion to the first substrate housing portion, the fork is disposed at the first support position. Supports the substrate at a different second support position, and the fork is disposed at a second standby position different from the first standby position with respect to the fork support during movement of the fork support. , Characterized in that for carrying out the method of transporting the substrate to be processed in the substrate transfer apparatus.

  A recording medium according to the present invention includes a fork support that is movable between a first substrate housing portion that houses a substrate and a second substrate housing portion that houses a substrate, and a fork that is movably supported by the fork support. , A recording medium on which a program executed by a control device that controls the substrate transfer device is recorded, and the first substrate accommodation using the substrate transfer device when the program is executed by the control device. A substrate to be processed that transports a substrate from one of the first and second substrate housing portions to the other, the step of moving the fork support so that the fork faces one of the substrate housing portions; A step of advancing the fork and supporting the substrate accommodated in the one substrate accommodating portion facing each other by the fork; and the fork supporting the substrate A step of moving backward, a step of moving the fork support so that the fork supporting the substrate faces the other substrate housing portion, and advancing the fork supporting the substrate to move the fork in the other substrate housing portion facing And when the substrate is transported from the first substrate container to the second substrate container, the fork supports the substrate at a first support position, and the fork support When the body is moving, the fork is disposed at a first standby position with respect to the fork support, and when the substrate is transported from the second substrate container to the first substrate container, the fork The substrate is supported at the second support position different from the first support position, and the second fork is different from the first standby position with respect to the fork support during the movement of the fork support. It is arranged on the machine position, characterized in that to implement the method of transporting the substrate to be processed in the substrate transfer apparatus.

  According to the present invention, the fork that supports the wafer at the first support position is disposed at the first standby position with respect to the fork support during movement of the fork support and supports the wafer W at the second support position. The fork is arranged at the second standby position with respect to the fork support during movement of the fork support. Accordingly, by appropriately setting the first support position and the second support position on which the wafer is supported and the first standby position and the second standby position of the fork, appropriate measures can be taken for the wafer W during transfer. Can be applied.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following embodiments, the substrate processing system, the substrate transfer apparatus, and the substrate transfer method according to the present invention are an apparatus for processing a semiconductor wafer, more specifically, an apparatus for cleaning a semiconductor wafer. An applied example will be described. However, the substrate processing system, the substrate transfer apparatus, and the substrate transfer method according to the present invention are not limited to application to processing (cleaning) of semiconductor wafers, and can be widely applied to substrate processing.

  FIG. 1 to FIG. 14 are diagrams for explaining an embodiment of a substrate processing system, a substrate transport apparatus, and a substrate transport method according to the present invention and modifications thereof. 1 is a side view showing the substrate processing system, FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 4 is a cross-sectional view taken along arrows IV-IV in FIG.

  First, the overall configuration of the substrate processing system 10 will be described.

  As shown in FIGS. 1 to 4, the substrate processing system 10 according to the present embodiment includes a carrier station 10a for mounting a semiconductor wafer W (hereinafter also referred to as a wafer W) before and after processing, The process station 10b is provided adjacent to the carrier station 10a and for performing a cleaning process on the wafer W. In the carrier station 10a, a plurality of, for example, 25 wafers W, a hoop (first substrate housing portion) 20 capable of accommodating a substantially horizontal posture with a predetermined interval in the vertical direction, and a plurality of hoops 20 are arranged in parallel. A mounting table 25 capable of mounting four pieces, for example, four pieces is provided. Further, in the process station 10 b, a delivery unit (second substrate housing portion) 30 on which the wafer W sent from the FOUP 20 is temporarily placed, and a wafer temporarily placed on the delivery unit 30. A plurality of, for example, four spin processing chambers (SPIN) 40 for performing processing such as cleaning and drying of the sent wafer W are disposed.

  Further, in the carrier station 10a, a movable first wafer transfer device (substrate transfer device) 50 for transferring the wafer W between the FOUP 20 and the transfer unit 30 is disposed. Similarly, a movable second wafer transfer device (PRA) 80 for transferring the wafer W between the transfer unit 30 and the processing chamber 40 is disposed in the process station 10b. Further, the substrate processing system 10 is provided with a control device 15 for controlling the first wafer transfer device 50, the second wafer transfer device 80, each processing chamber 40, and the like.

  Next, each component of the substrate processing system 10 will be described in detail.

  First, each FOUP (FOUP: Front Opening Unified Pod) 20 mounted on the mounting table 25 will be described with reference to FIGS. Here, FIG. 5A and FIG. 5B are vertical cross-sectional views showing the hoop (first substrate housing portion) of the substrate processing system of FIG. Of these, FIG. 5A shows a state in which the wafer is accommodated in the hoop, and FIG. 5B shows a state in which one wafer is lifted by the forks 60 and 65 of the wafer transfer device 50 in the hoop. Show. 6 is a cross-sectional view taken along arrows VI-VI in FIG.

  Each hoop 20 can accommodate a plurality of, for example, 25 wafers W. The wafers W are supported in the hoop 20 so as to be stacked apart from each other by a first pitch P1 in the vertical direction. Specifically, each hoop 20 is attached to a hollow-shaped housing 21 extending in the vertical direction and an inner wall of the housing 21, and a plurality of wafer placements such that each wafer W is placed on the upper surface in a horizontal posture. Member 22. As shown in FIG. 6, the housing 21 has an opening on one side so that the cross section is U-shaped, and a window opening / closing mechanism 23 including a shutter or the like is provided in the opening. When the window opening / closing mechanism 23 is opened, the wafer W accommodated in the hoop 20 can be taken out.

  As shown in FIG. 5A, each wafer mounting member 22 is composed of a plate-like member attached to the inner wall of the housing 21 in the horizontal direction, and the upper surfaces of these wafer mounting members 22 are in the vertical direction. It is separated by the first pitch P1. As shown in FIG. 6, each wafer mounting member 22 has a U shape in a top view, and supports the wafer W from below by coming into contact with the peripheral portion of the wafer W.

  Next, a transfer unit (TRS) 30 will be described with reference to FIG. Here, FIG. 10 is a side view showing the delivery unit of the substrate processing system of FIG.

  The delivery unit 30 can accommodate a plurality of, for example, eight wafers W. In the delivery unit 30, the wafers W are supported so as to be stacked apart from each other by a second pitch P2 in the vertical direction (vertical direction). In the present embodiment, the second pitch P2 has the same length as the first pitch P1. As shown in FIG. 1, the delivery unit 30 includes a lower region 30 b that can accommodate four unprocessed wafers W before being sent to the processing chamber 40, and four processed wafers sent from the processing chamber 40. And an upper region 30a that can accommodate the wafer W.

  As shown in FIG. 10, the delivery unit 30 includes a housing 31 that extends in the vertical direction and a part of the side surface of which is open, and a plurality of substantially circular plate-like partition members attached to the inner wall of the housing 31. 32 and, for example, three projecting members 33 (only two of the three projecting members 33 are shown in FIG. 10) provided so as to project upward from the upper surface of each partition member 32. ing. As shown in FIG. 10, the plurality of partition members 32 are spaced apart from each other by a second pitch P2 in the vertical direction on the lower surface. Further, as shown in FIG. 10, each projecting member 33 is composed of a rod-shaped member that projects upward from the upper surface of each partition member 32. Each projection member 33 is arranged so as to be positioned at each vertex of a virtual equilateral triangle having the center point of the substantially circular partition member 32 as the center of gravity (see FIG. 8 described later). Each projecting member 33 abuts on the wafer W in the vicinity of the center of the wafer W, and supports the wafer W from below.

  Next, a first wafer transfer device (CRA) that transfers the wafer W between the FOUP 20 and the transfer unit 30 will be described with reference to FIGS. FIG. 7 is a perspective view showing a first wafer transfer apparatus (substrate transfer apparatus) of the substrate processing system of FIG. FIG. 8 is a top view showing a fork of the wafer transfer apparatus of FIG. FIG. 9 is a view for explaining a method of supporting a wafer with a fork.

  As shown in FIG. 7, the first wafer transfer apparatus 50 includes a fork support 51 that can move between the hoop 20 and the delivery unit 30, and a pair of forks 60 that are supported by the fork support 51 so as to be movable. , 65. The fork support 51 includes a base member 53 that travels on a rail 56 that extends in the Y direction in FIG. 2, a vertical movement mechanism 52 that is provided on the upper surface of the base member 53 and can expand and contract in the Z direction, and a vertical movement And a base 55 fixed to the upper part of the mechanism 52.

  As shown in FIG. 7, the base 55 has a rectangular shape in a top view, and is supported on the vertical movement mechanism 52 so that the base surface is parallel to the XY plane (horizontal plane). As shown in FIG. 7, the vertical movement mechanism 52 can rotate in the θ direction with respect to the base member 53 around an axis orthogonal to the XY plane (horizontal plane). That is, the base 55 is configured to be able to move in the Y direction and the Z direction and to rotate in the θ direction. Thereby, the fork support body 51 can move (move in the X, Y, and Z directions and rotate in the θ direction) so that the forks 60 and 65 face the hoop 20 or the delivery unit 30.

  Thus, the pair of forks 60 and 65 are supported by the base 55 of the fork support 51. The vertical movement mechanism 52 can move the base 55 in the vertical direction. For this reason, the vertical movement mechanism 52 can be used as a single drive unit that moves the pair of forks 60 and 65 simultaneously in the vertical direction (vertical direction).

On the other hand, the forks 60 and 65 that support the wafer W are supported by a base 55. As shown in FIG. 7, each fork 60, 65 has fork main bodies 61, 66 having a substantially flat plate shape, and horizontal movement mechanisms 62, 67 fixed to the base end portions of the fork main bodies 61, 66. ing. The horizontal movement mechanisms 62 and 67 can move relative to the base 55 along the longitudinal direction of the base 55. As a result, the forks 60 and 65 that support the wafer W are moved to the fork support 5.
The forks 60 and 65 are supported such that the plate surfaces of the fork main bodies 61 and 66 are parallel to the base 55 of the fork support body 51, that is, parallel to the XY plane (horizontal plane). Further, as shown in FIG. 7, the pair of forks 60, 65 are supported so that the respective fork bodies 61, 66 are separated by a preset fork pitch P3 in the vertical direction (vertical direction). Yes. In the present embodiment, the third pitch P3 is set to the same length as the first pitch P1 and the second pitch P2 described above.

  As described above, the forks 60 and 65 can move in the horizontal direction independently of each other with respect to the fork support body 51. Even when the forks 60 and 65 are moved horizontally, the fork pitch P3 between the forks 60 and 65 is not changed. The upper fork main body 61 and the lower fork main body 66 are similarly configured.

  As shown in FIG. 8, each fork main body 61, 66 has a substantially U-shaped distal end and a base end connected to the horizontal movement mechanisms 62, 67. As shown in FIG. 8, a wafer W (indicated by a two-dot chain line in FIG. 8) is supported by the substantially U-shaped tip. Further, the U-shaped opening portion of the tip portion is formed with an opening size through which the three protruding members 33 (indicated by a two-dot chain line in FIG. 8) in the delivery unit 30 can pass. Further, the tip portion can pass through an opening 22 a (see FIG. 6) of the U-shaped portion of the wafer mounting member 22 in the hoop 20.

  With such a configuration of the first wafer transfer device 50, when the forks 60 and 65 are arranged at a position facing the hoop 20 or the delivery unit 30 by the fork support 51, the base 55 of the fork support 50. Can move into the hoop 20 or the delivery unit 30. The forks 60 and 65 are moved up and down by the strokes ST1 and ST2 set in advance between the lift start position and the lift end position in a state of entering the hoop 20 or the delivery unit 30. As a result, the wafer W that has been supported can be placed on the wafer placement member 22 or the protrusion member 33, and the wafer W placed on the wafer placement member 22 or the protrusion member 33 can be taken up. it can. Thereafter, the forks 60 and 65 are retracted from the FOUP 20 or the delivery unit 30, and the delivery of the wafer W between the transfer device 50 and the FOUP 20 or the delivery unit 30 is completed. The transfer of the wafer W between the transfer device 50 and the FOUP 20 or the transfer unit 30 will be described in detail later.

  The forks 60 and 65 support the wafer W transferred from the FOUP 20 to the transfer unit 30 from below at the first support position, and the wafer 30 transferred from the transfer unit 30 to the FOUP 20 is different from the first support position. The second support position is supported from below. That is, the forks 60 and 65 support the unprocessed wafer W picked up from the FOUP 20 at the first support position, and support the processed wafer W picked up from the delivery unit 30 at the second support position. For this reason, as shown in FIGS. 8 and 9, each fork 60, 65 includes four first support pieces 63a, 68a for supporting the wafer W at the first support position, and the wafer W at the second support position. And four second support pieces 63b and 68b for supporting. In the present embodiment, as shown in FIGS. 8 and 9, the first support pieces 63a and 68a and the second support pieces 63b and 68b are formed as a single support member 63 and 68, respectively. Yes. The support member 63 attached to the upper fork main body 61 and the support member 68 attached to the lower fork main body 66 are configured similarly.

  As shown in FIG. 9, in the present embodiment, the first support position and the second support position are shifted with respect to the forks 60 and 65 along the moving direction of the forks 60 and 65 with respect to the fork support 51. In position. In the example shown in FIG. 9, the upper fork 60 represents the case where the wafer W is supported at the first support position, and the lower fork 65 represents the case where the wafer W is supported at the second support position. As shown in FIG. 9, the wafer W at the first support position and the wafer W at the second support position are inclined at the same angle in the opposite direction with respect to each other with the horizontal direction as the center.

  The forks 60 and 65 are retracted on the base 55 of the fork support 51 when the fork support 51 moves between the hoop 20 and the delivery unit 30. Each of the forks 60 and 65 has at least two standby positions as positions that are disposed when the forks 60 and 65 are retracted on the base 55 of the fork support body 51. Specifically, as shown in FIG. 9, when the wafer W is supported at the first support position, the first standby position where the fork (upper fork 60 in FIG. 9) is disposed and the second support position There is provided a second standby position where a fork (lower fork 65 in FIG. 9) is arranged when the wafer W is supported. That is, depending on whether each of the forks 60 and 65 supports the wafer W at the first support position or the second support position (whether the wafer W is picked up from the hoop 20 or the wafer W from the transfer unit 30). The retracted position after picking up the wafer W changes.

  As shown in FIG. 9, in the present embodiment, the first standby position and the second standby position are shifted along the moving direction of the forks 60 and 65 relative to the fork support 51. More specifically, in the present embodiment, the forks 60 and 65 of the wafer W supported at the position along the moving direction of the forks 60 and 65 of the wafer W supported at the first support position and the second support position. The first standby position and the second standby position of the forks 60 and 65 are deviated with respect to the fork support body 51 so that the positions along the moving direction are aligned.

  As shown in FIGS. 7 to 9, in the present embodiment, the first wafer conveyance device 50 further includes guides 71 and 72 fixed to the base 55 of the fork support 51. The guides 71 and 72 are provided to prevent the shift of the support position of the wafer W supported by the forks 60 and 65. In the present embodiment, the upper guide 71 that prevents the wafer W supported by the upper fork 60 from being displaced and the lower guide that prevents the wafer W supported by the lower fork 65 from being displaced. The guide 72 is provided.

  The upper guide 71 is connected and held to a bracket 74 fixed to the base 55 via a first guide support member 73a. As shown in FIGS. 8 and 9, the upper guide 71 is arranged on both sides of the upper fork main body 61. As shown in FIG. 8, the upper guide 71 is adjacent to the wafer W supported at the first support position by the upper fork 60 disposed at the first standby position on the rear side and the side side. . In the present embodiment, the arrangement position of the wafer W supported at the first support position by the upper fork 60 arranged at the first standby position, and the second support position by the upper fork 60 arranged at the second standby position. The arrangement positions of the wafers W supported by the substrate substantially coincide with each other when viewed from above. Therefore, the upper guide 71 is located on the rear side in the movement direction of the upper fork 60 and the upper fork 60 with respect to the wafer W supported at the second support position by the upper fork 60 disposed at the second standby position. Adjacent to the lateral side perpendicular to the moving direction. Therefore, according to the upper guide 71, the rear and upper forks 60 move along the moving direction of the upper fork 60 regardless of whether the wafer W is supported at the first support position or the second support position. It is possible to effectively prevent the wafer W from shifting from an appropriate support position to the side orthogonal to the moving direction. Specifically, the upper guide 71 corrects the deviation of the wafer W from the first support position when the upper fork 60 supports the wafer W and retracts from the hoop 20 to the first standby position. Further, the upper guide 71 prevents the wafer W from being displaced from the first support position or the second support position when the fork support 51 moves. Therefore, the fork support 51 can be moved at a high speed.

  On the other hand, the lower guide 72 is connected and held to a bracket 74 fixed to the base 55 via a second guide support member 73b. The lower guide 72 is configured in the same manner as the upper guide 71, and coincides with the upper guide 71 even at the arrangement position along the fork moving direction. That is, as shown in FIGS. 8 and 9, the lower guide 72 is disposed on both sides of the lower fork main body 65. As shown in FIG. 8, the lower guide 72 supports the second support by the lower fork 65 in the same manner for the wafer W supported at the first support position by the lower fork 65 disposed at the first standby position. The wafer W supported at the position is adjacent to the rear side along the moving direction of the lower fork 65 and the lateral side perpendicular to the moving direction of the lower fork 65. Therefore, according to the lower guide 72, the rear and lower sides along the moving direction of the lower fork 65 regardless of whether the wafer W is supported at the first support position or the second support position. It is possible to effectively prevent the wafer W from shifting from an appropriate support position to the side perpendicular to the moving direction of the fork 65. Specifically, the lower guide 72 corrects the deviation of the wafer W from the second support position when the lower fork 65 supports the wafer W and retracts from the transfer unit 30 to the second standby position. Further, the lower guide 72 prevents the wafer W from being displaced from the first support position or the second support position when the fork support 51 moves. Therefore, the fork support 51 can be moved at a high speed.

  Further, as shown in FIGS. 7 to 9, in the present embodiment, the first wafer transfer device 50 has a plurality of sensors fixed to the base 55 of the fork support 51. Specifically, a support position defect sensor 75 that detects when the wafer W is not supported at an appropriate position by the forks 60 and 65, and an upper support sensor that detects when the wafer W is supported by the upper fork 60. 76, and a lower support sensor 77 for detecting when the wafer W is supported by the lower fork 65 are provided. Each of the sensors 75, 76, and 77 is formed of, for example, a photoelectric sensor, and includes light emitting portions 75a, 76a, and 77a and light receiving portions 75b, 76b, and 77b.

  As shown in FIGS. 7 and 9, the light emitting portion 75a of the poor support position sensor 75 and the light emitting portion 77a of the lower support sensor 77 are connected and held to the base 55 via a first sensor support member 78a. The light emitting part 76a of the upper support sensor 76 and the light receiving part 77b of the lower support sensor 77 are connected and held by a bracket 79 fixed to the base 55 via a second sensor support member 78b. The light receiving portion 75b of the support position defect sensor 75 and the light receiving portion 76b of the upper support sensor 76 are connected and held by a bracket 79 fixed to the base 55 via a third sensor support member 78c. The optical path La of the inspection light of the support position defect sensor 75 is orthogonal to the plate surfaces of the fork bodies 61 and 66 having a flat plate shape. That is, the line connecting the light emitting portion 75a and the light receiving portion 75b of the support position defect sensor 75 is orthogonal to the plate surfaces of the fork main bodies 61 and 66. Similarly, the optical path Lb of the inspection light of the upper support sensor 76 and the optical path Lc of the inspection light of the lower support sensor 77 are respectively orthogonal to the plate surfaces of the fork bodies 61 and 66 having a flat plate shape.

  As shown in FIGS. 8 and 9, the poor support detection sensor 76 is arranged in the moving direction of the upper fork 60 with respect to the wafer W supported at the first support position by the upper fork 60 arranged at the first standby position. It is arranged close to the outer (front) position along. As described above, in the present embodiment, the arrangement position of the wafer W supported at the first support position by the upper fork 60 arranged at the first standby position and the upper fork 60 arranged at the second standby position. Thus, the arrangement position of the wafer W supported by the second support position substantially coincides with the top view. Therefore, the poor support detection sensor 76 is also outward (forward) along the moving direction of the upper fork 60 with respect to the wafer W supported at the second support position by the upper fork 60 disposed at the second standby position. It is arranged close to the position of. Further, as described above, the first standby position and the second standby position of the upper fork 60 coincide with the first standby position and the second standby position of the lower fork along the moving direction of the forks 60 and 65, respectively. To do. Accordingly, the poor support detection sensor 76 is configured such that the wafer W supported at the first support position by the lower fork 65 disposed at the first standby position and the second support position by the lower fork 65 disposed at the second standby position. Also, the wafer W supported by the second fork 65 is arranged close to the outer (front) position along the moving direction of the lower fork 65. Furthermore, as described above, in the present embodiment, the wafer W supported by the forks 60 and 65 in the first standby position or the second standby position is shifted backward in the movement direction of the forks 60 and 65, and The lateral displacement perpendicular to the moving direction of the forks 60, 65 is accurately corrected by the guides 71, 72. Therefore, the wafer W supported by the forks 60 and 65 at the first standby position or the second standby position can be displaced only forward in the movement direction of the forks 60 and 65. Thus, whether the wafer W is supported by the upper fork 60 or the lower fork 65 regardless of whether the wafer W is supported by the first support position or the second support position. Regardless, the single support failure detection sensor 75 can accurately determine whether or not the wafer W is accurately supported at the support position.

  On the other hand, the light emitting portion 76a and the light receiving portion 76b of the upper support sensor 76 are moved to the second support position by the wafer W supported by the upper support fork 60 disposed at the first standby position and similarly by the upper fork 60. It arrange | positions so that the wafer W to be supported may be pinched | interposed. Therefore, the upper support sensor 76 accurately determines whether or not the wafer W is supported by the upper fork 60 regardless of whether the wafer W is supported at the first support position or the second support position. can do.

  Similarly, the light emitting portion 77a and the light receiving portion 77b of the lower support sensor 77 are the first wafer W supported by the lower fork 65 disposed at the first standby position, and the lower fork 65 similarly. (2) The wafers W supported at the supporting positions are arranged so as to be sandwiched therebetween. Therefore, the lower support sensor 77 determines whether or not the wafer W is supported by the lower fork 65 regardless of whether the wafer W is supported at the first support position or the second support position. Can be judged well.

  Further, the first wafer transfer apparatus 50 further includes a control unit 58. The control unit 58 controls the vertical movement mechanism 52 and the vertical movement and rotation of the vertical movement mechanism 52 and the movement of the forks 60 and 65 relative to the base 55. That is, the control unit 58 can control the operations of the forks 60 and 65 independently of each other. As shown in FIG. 1, the control unit 58 is connected to the control device 15 of the substrate processing system 10, and a control signal is sent from the control device 15. Although FIG. 1 illustrates an example in which the control unit 58 is built in the first wafer transfer apparatus 50, the control unit 58 may be separately provided outside the first wafer transfer apparatus 50. . Further, such a control unit 58 can be omitted, and instead, the control device 15 may directly control the operations of the forks 60 and 65 of the first wafer transfer device 50. Details of control contents in the control unit 58 will be described later.

  Next, the second wafer transfer apparatus (PRA) 80 disposed in the process station 10b will be described with reference to FIGS. Here, FIG. 11 is a perspective view showing a second wafer transfer apparatus in the substrate processing system of FIG. 1, and FIG. 12 is a cross-sectional view taken along arrow XII-XII of FIG.

  As described above, the second wafer transfer apparatus (PRA) 80 is configured to transfer the wafer W between the transfer unit 30 and the processing chamber 40 in the process station 10b. Note that the processing chamber 40 may be configured as, for example, spin processing chambers (SPIN) that perform cleaning processing, drying processing, or the like on the wafer W while rotating the wafer W.

  As shown in FIG. 11, the second wafer transfer apparatus 80 includes a fork support 81 that can move between the transfer unit 30 and the processing chamber 40, and a pair of forks that are movably supported by the fork support 81. 90, 95. The fork support 81 includes a base member 83 that travels on a rail 86 that extends in the X direction in FIG. 2, a vertical movement mechanism 82 that is provided on the upper surface of the base member 83 and can expand and contract in the Z direction, and a vertical movement And a base 85 provided on the upper portion of the mechanism 82.

  As shown in FIG. 11, the base 85 has a rectangular shape when viewed from above, and is supported on the vertical movement mechanism 82 so that the base surface is parallel to the XY plane (horizontal plane). As shown in FIG. 11, the vertical movement mechanism 82 can rotate in the θ direction with respect to the base member 83 about an axis orthogonal to the XY plane (horizontal plane). That is, the base 85 is configured to be able to move in the Y direction and the Z direction and to rotate in the θ direction. As a result, the fork support 51 can be moved (moved in the X, Y, and Z directions and rotated in the θ direction) so that the forks 90 and 95 face the delivery unit 30 or the processing chamber 40.

  Thus, the pair of forks 90 and 95 are supported on the base 85 of the fork support 81. The vertical movement mechanism 82 can move the base 85 in the vertical direction. For this reason, the vertical movement mechanism 82 can be used as a single drive unit that moves the pair of forks 90 and 95 simultaneously in the vertical direction (vertical direction).

  On the other hand, the forks 90 and 95 that support the wafer W are supported by a base 85. As shown in FIG. 11, each fork 90, 95 has a substantially flat fork main body 91, 96, a horizontal movement mechanism 92, 97 fixed to the base end of the fork main body 91, 96, have. The horizontal movement mechanisms 92 and 97 can move relative to the base 85 along the longitudinal direction of the base 85. As a result, the forks 90 and 95 that support the wafer W are movable with respect to the fork support 81.

  As shown in FIG. 11, each fork main body 61, 66 has a substantially U-shaped distal end portion and a base end portion connected to the horizontal movement mechanisms 92, 97. The wafer W is held by the substantially U-shaped tip. The U-shaped opening at the tip is formed with an opening size that allows the three protruding members 33 in the delivery unit 30 to pass through.

  As shown in FIG. 12, for example, three support members 93 and 98 for holding and positioning the edge of the wafer W are attached to the forks 90 and 95.

  The control device 15 is connected to each component of the substrate processing system 10 and controls the operation of each component. In the present embodiment, the control device 15 includes a computer 16 and a program recording medium 17 that can be read by the computer 16. Each component of the substrate processing system 10 is operated by the computer 16 executing a program stored in advance in the recording medium 17.

  Next, an example of a wafer W processing method in the substrate processing system 10 of the present embodiment having such a configuration will be described. First, the overall operation in the substrate processing system 10 will be described.

  First, the FOUP 20 containing, for example, 25 wafers W to be processed is mounted on the mounting table 25. Next, the window opening / closing mechanism 23 provided in the FOUP 20 is opened, and the wafer W in the FOUP 20 can be taken out. The first wafer transfer device 50 approaches the hoop 20, and the forks 60 and 65 of the first wafer transfer device 50 lift and support the wafer W in the hoop 20. At this time, two adjacent wafers W in the hoop 20 are taken out by the pair of forks 60 and 65. The details of the operation when the two adjacent wafers W are taken out from the FOUP 20 by the first wafer transfer device 50 will be described later.

  Each fork 60, 65 supports the wafer W picked up from the hoop 20 at the first support position. Then, each of the forks 60 and 65 moves relative to the fork support 51 and moves back to the first standby position on the base 55. At this time, the wafer W supported by the forks 60, 65 is located on the rear side along the moving direction of the forks 60, 65 from the first standby position on the forks 60, 65 or on the side orthogonal to the moving direction of the forks 60, 65. It may be supported at a position shifted to the side. In this case, however, the guides 71 and 72 accurately correct the support position of the wafer W to the first support position.

  When the forks 60 and 65 are retracted to the first standby position, it is confirmed by the upper support sensor 76 that the upper fork 60 supports the wafer W. Similarly, the lower support sensor 77 causes the lower fork 65 to move. It is confirmed that the wafer W is supported. Further, the support position defect sensor 75 detects whether or not the wafer W protrudes from the first support position of the forks 60 and 65 to the front side along the moving direction of the forks 60 and 65. As described above, the guides 71 and 72 are provided so as to be adjacent to the rear side and the side side of the wafer W supported by the forks 60 and 65. Therefore, the support position of the wafer W by the forks 60 and 65 can be shifted only to the front side along the moving direction of the forks 60 and 65. On the other hand, as described above, the optical path La of the inspection light of the support position defect sensor 75 passes in the vicinity of the wafer W supported at the first support position by the forks 60 and 65 at the first standby position. Therefore, even if the wafer W is slightly deviated from the first support position, the support position defect sensor 75 detects the support position defect of the wafer W with high accuracy.

  Next, in a state where the forks 60 and 65 are arranged at the first standby position while supporting the wafer W at the first support position, the fork support body 51 starts from the position facing the hoop 20 so far. Move to the position facing the. The operation of the fork support 51 is controlled by the control device 15. Specifically, the first wafer transfer device 50 moves and rotates in the horizontal direction (Y direction) in the carrier station 10 a and approaches the delivery unit 30.

  As shown in FIG. 2, when the fork support body 51 moves in the horizontal direction (Y direction), the fork main bodies 61 and 66 face the X direction. That is, the wafer W supported at the first support position by the forks 60 and 65 moves in a direction (Y direction) orthogonal to the moving direction of the forks 60 and 65. In the present embodiment, the guides 71 and 72 are orthogonal to the moving direction of the forks 60 and 65 with respect to the wafer W supported at the first support position by the forks 60 and 65 at the first standby position. It is also arranged close to the direction (Y direction) side. Therefore, even if the force for shifting the wafer W from the first support position to the direction (Y direction) perpendicular to the moving direction of the forks 60 and 65 acts on the wafer W as the fork support 51 moves, The guides 71 and 72 prevent the wafer W from being displaced. Thereby, the fork support 51 can be moved at high speed, and the processing efficiency of the wafer W can be remarkably improved.

  When the forks 60, 65 face the delivery unit 30, the forks 60, 65 move forward and horizontally, and the base 55 moves downward, so that the wafer W is transferred from the forks 60, 65 to the delivery unit 30. It is transferred onto each of the 30 protruding members 33. Here, the wafer W is accommodated in the lower region 30 b of the delivery unit 30. The details of the operation when the wafer W is transferred from the first wafer transfer apparatus 50 to the delivery unit 30 will be described later.

  Thereafter, the second wafer transfer device 80 approaches the transfer unit 30 and the lower fork 95 of the second wafer transfer device 80 lifts the wafer W placed on the protruding member 33 of the transfer unit 30. To support. Then, the second wafer transfer device 80 approaches the processing chamber 40 with the lower fork 95 supporting the wafer W, and the wafer W held by the lower fork 95 is brought into the processing chamber 40. . Thereafter, the cleaning process and the drying process for the wafer W are performed in the processing chamber 40. The operation of the second wafer transfer device 80 and the processing by the processing chamber 40 are controlled by the control device 15.

  The wafer W that has been subjected to the cleaning process and the drying process is again received by the second wafer transfer device 80 and brought into the delivery unit 30. At this time, the wafer W is supported by the upper fork 90 of the second wafer transfer device 80 and is accommodated in the upper region 30 a of the delivery unit 30. That is, in the present embodiment, the unprocessed wafer W transferred from the transfer unit 30 to the processing chamber 40 is supported by the lower fork 95 of the second wafer transfer device 80 and transferred from the processing chamber 40 to the transfer unit 30. The processed wafer W to be processed is supported by the upper fork 90 of the second wafer transfer device 80. In other words, the processed wafer W and the unprocessed wafer W do not share the same fork. For this reason, it is possible to prevent the cleaned wafer (processed wafer) W from being recontaminated through the fork.

  Thereafter, the wafer W sent into the transfer unit 30 is received by the first wafer transfer device 50 and transferred into the FOUP 20 again. Specifically, first, the first wafer transfer device 50 moves and rotates in the horizontal direction in the carrier station 10 a and approaches the delivery unit 30. The forks 60 and 65 move forward and horizontally, and the base 55 further moves upward, so that the forks 60 and 65 lift and support the wafers W on the projection members 33 of the delivery unit 30. .

  Each fork 60, 65 supports the wafer W picked up from the delivery unit 30 at the second support position. Then, each of the forks 60 and 65 moves relative to the fork support 51 and moves back to the second standby position on the base 55. At this time, the wafer W supported by the forks 60, 65 is located on the rear side along the moving direction of the forks 60, 65 from the second standby position on the forks 60, 65 or on the side orthogonal to the moving direction of the forks 60, 65. It may be supported at a position shifted to the side. However, in such a case, the support position of the wafer W is accurately corrected to the second support position by the guides 71 and 72.

  When the forks 60 and 65 are retracted to the second standby position, it is confirmed by the upper support sensor 76 that the upper fork 60 is supporting the wafer W. Similarly, the lower support sensor 77 causes the lower fork 65 to move. It is confirmed that the wafer W is supported. Further, the support position defect sensor 75 detects whether or not the wafer W protrudes from the second support position of the forks 60 and 65 to the front side along the moving direction of the forks 60 and 65. As described above, the guides 71 and 72 are provided so as to be adjacent to the rear side and the side side of the wafer W supported by the forks 60 and 65. Therefore, the support position of the wafer W by the forks 60 and 65 can be shifted only to the front side along the moving direction of the forks 60 and 65. On the other hand, as described above, the optical path La of the inspection light of the support position defect sensor 75 passes in the vicinity of the wafer W supported at the second support position by the forks 60 and 65 at the second standby position. Therefore, even if the wafer W is slightly displaced from the second support position, the support position defect sensor 75 can accurately detect the support position defect of the wafer W.

  Next, in a state where the forks 60 and 65 are positioned at the second standby position while supporting the wafer W at the second support position, the fork support 51 is moved from the position facing the transfer unit 30 until then. Move to a position facing 20. The operation of the fork support 51 is controlled by the control device 15. Specifically, the first wafer transfer device 50 moves and rotates in the horizontal direction (Y direction) in the carrier station 10 a and approaches the hoop 20.

  As shown in FIG. 2, when the fork support body 51 moves in the horizontal direction (Y direction), the fork main bodies 61 and 66 face the X direction. That is, the wafer W supported at the first support position by the forks 60 and 65 moves in a direction (Y direction) orthogonal to the moving direction of the forks 60 and 65. In this embodiment, the guides 71 and 72 are orthogonal to the moving direction of the forks 60 and 65 with respect to the wafer W supported at the second support position by the forks 60 and 65 at the second standby position. It is also arranged close to the direction (Y direction) side. Therefore, even if the force for shifting the wafer W from the second support position to the direction (Y direction) perpendicular to the moving direction of the forks 60 and 65 acts on the wafer W as the fork support 51 moves, The guides 71 and 72 prevent the wafer W from being displaced. Thereby, the fork support 51 can be moved at high speed, and the processing efficiency of the wafer W can be remarkably improved.

  When the forks 60 and 65 come to face the hoop 20, the forks 60 and 65 move forward and horizontally, and the base 55 moves downward, so that the wafer W moves from the forks 60 and 65 to the hoop 20. Transferred onto the wafer mounting member 22.

  In this way, a series of processes for the wafer W in the substrate processing system 10 is completed.

  Next, details of a series of operations when two wafers W adjacent in the vertical direction are taken out from the FOUP 20 by the first wafer transfer device 50 will be described with reference to FIGS. Here, FIGS. 13A to 13D show a series of operations when the wafer is taken out from the hoop by the wafer transfer device in the substrate processing system of FIG. 1, (a), (b), (c). It is the schematic shown continuously in order of (d). This series of operations is performed by controlling the first wafer conveyance device 50 by the control unit 58 built in the first wafer conveyance device 50.

  First, as shown in FIG. 13A, the first wafer transfer device 50 approaches the FOUP 20. At this time, the base 55 has been moved in the vertical direction in advance so that the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are positioned at the elevation start position in the vertical direction. The raising / lowering start position here means a position in the vertical direction when the fork bodies 61 and 66 move forward and horizontally and enter the hoop 20.

  As described above, in the present embodiment, the first pitch P1 and the fork pitch P3 have substantially the same length. When the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are positioned at the up / down start position in the vertical direction, the upper fork 60 and the lower fork 65 are respectively located below the wafer W to be taken out. The upper surface of each fork main body 61, 66 is arranged at a position away from the surface by a distance R1 in the vertical direction. The distance R1 is smaller than the first lifting stroke amount ST1.

  Next, the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are moved forward and horizontally, and the fork main body 61 is arranged directly below the wafer W to be taken out as shown in FIG.

  Next, as shown in FIG.13 (c), the base 55 is moved upward only 1st raising / lowering stroke amount ST1. As the base 55 is raised, the upper fork 60 and the lower fork 65 supported by the base 55 are moved upward by the first lifting stroke amount ST1, and the fork main body 61 and the lower fork 65 of the upper fork 60 are moved. The fork main body 66 ascends from the lift start position to the lift end position in the vertical direction. While the upper fork 60 and the lower fork 65 are raised, the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are respectively placed on different wafers W supported by the wafer mounting member 22 of the hoop 20. Each wafer W is supported by contacting from below.

  Next, the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are moved backward and horizontally. As a result, as shown in FIG. 13 (d), the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 supporting the wafer W are retracted from the hoop 20. As described above, two wafers W are picked up simultaneously from the hoop 20 by the two forks 60 and 65.

  A series of operations when transferring the two wafers W held by the first wafer transfer device 50 to the FOUP 20 when the wafer W is returned from the transfer unit 30 to the FOUP 20 are shown in FIG. ) To (d) are performed in the reverse order (in the order of FIGS. 13D to 13A).

  Next, details of a series of operations when the two wafers W held by the first wafer transfer apparatus 50 are transferred to the delivery unit 30 will be described with reference to FIGS. 14A to 14D show a series of operations when the wafer is transferred from the wafer transfer device to the transfer unit in the substrate processing system of FIG. It is the schematic shown continuously in order of (c) and (d). This series of operations is performed by controlling the first wafer conveyance device 50 by the control unit 58 built in the first wafer conveyance device 50.

  First, a method for transferring the wafer W supported by the forks 60 and 65 of the first wafer transfer apparatus 50 to the delivery unit 30 will be described. First, as shown in FIG. 14A, the first wafer transfer device 50 approaches the delivery unit 30. At this time, the base 55 has been moved in the vertical direction in advance so that the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are positioned at the elevation start position in the vertical direction. The lifting start position here means a position in the vertical direction when the fork main bodies 61 and 66 move forward together with the supported woofer W and enter the delivery unit 30.

  As described above, in the present embodiment, the second pitch P2 and the fork pitch P3 have substantially the same length. When the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are positioned at the up / down start position in the vertical direction, the lower surfaces of the wafers W supported by the forks 60 and 65 are respectively W is separated from the protruding member 33 of the delivery unit 30 to be transferred by a distance R2 along the vertical direction. Note that the distance R2 is smaller than the second lifting stroke amount ST2.

  Next, the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower fork 65 are moved forward and horizontally, as shown in FIG. The fork main body 66 of the fork 65 is moved directly above the protruding member 33.

  Next, as shown in FIG. 14C, the base 55 is moved downward together with the forks 60 and 65 by the second lifting stroke amount ST2. Here, when the upper fork 60 and the lower fork 65 move downward by the second lifting stroke amount ST2, the fork main body 61 of the upper fork 60 and the fork main body 66 of the lower 65 fork respectively start moving up and down. Move from the position to the lift end position. While the forks 60 and 65 are lowered, the wafer W supported by the fork main body 61 of the upper fork 60 is transferred to the protruding member 33 of the transfer unit 30 and supported by the fork main body 66 of the lower fork 65. The other wafer W is transferred to the other protruding member 33 of the transfer unit 30.

  Finally, the upper fork 60 and the lower fork 65 are moved backward and horizontally simultaneously. As a result, the upper fork 60 and the lower fork 65 are retracted from the delivery unit 30 as shown in FIG. In this way, a series of operations for transferring the two wafers W held by the first wafer transfer apparatus 50 to the delivery unit 30 is completed. As described above, two wafers W are simultaneously transferred from the two forks 60 and 65 to the delivery unit 30.

  The operations when the forks 60 and 65 of the first wafer transfer apparatus 50 receive the wafer W from the transfer unit 30 are the reverse of the above-described series of operations as shown in FIGS. The operation is performed in order (in the order of FIGS. 14D to 14A).

  According to the present embodiment as described above, the forks 60 and 65 of the first wafer transfer device (substrate transfer device) 50 are moved from the first substrate storage portion (hoop) 20 to the second substrate storage portion (delivery unit) 30. The wafer W transported to the first support position is supported at the first support position, and the wafer W transported from the second substrate housing portion (delivery unit) 30 to the first substrate housing portion (hoop) 20 is different from the first support position. It supports in the 2nd support position. Therefore, the processed wafer (cleaned wafer in the present embodiment) W transferred from the second substrate housing unit 30 to the first substrate housing unit 20 passes from the first substrate housing unit 20 to the second through the hoop 20. It is possible to prevent problems such as recontamination by the unprocessed wafer W transferred to the substrate housing unit 30. Further, according to the present embodiment, the forks 60 and 65 that support the wafer W at the first support position are arranged at the first standby position with respect to the fork support 51 while the fork support 51 is moving, and the like. The 60 and 65 forks that support the wafer W at the second support position are arranged at the second standby position with respect to the fork support 51 while the fork support 51 is moving. That is, the stand-by position on the fork support 51 of the forks 60 and 65 is different between when the wafer W is supported at the first support position and when the wafer W is supported at the second support position. Therefore, by appropriately setting the first standby position and the second standby position of the forks 60 and 65 according to the first support position and the second support position where the wafer W is supported, the wafer W during transfer is set. Therefore, appropriate measures can be taken. Specifically, the relative position of the wafer W supported at the first support position by the forks 60 and 65 disposed at the first standby position with respect to the base 55 and the forks 60 and 65 disposed at the second standby position. By setting each support position and each standby position so that the relative position of the wafer W supported by the second support position with respect to the base 55 is close to each other and the same, the wafer W can be Regardless of whether the wafer W is supported by the first support position or the second support position, the wafer W can always be subjected to the same treatment.

  Further, according to the present embodiment, the first support position and the second support position are shifted on the forks 60 and 65 along the moving direction of the forks 60 and 65 with respect to the fork support 51. Further, the first standby position and the second standby position are shifted on the fork support 51 along the moving direction of the forks 60 and 65 relative to the fork support 51. Accordingly, the shift between the first standby position and the second standby position along the movement direction of the forks 60, 65 according to the shift between the first support position and the second support position along the movement direction of the forks 60, 65. By appropriately setting the above, it is possible to perform the same appropriate treatment on the wafer W supported at the first support position and the wafer W supported at the second support position.

  Further, according to the present embodiment, the first support position and the second support position coincide with each other along a direction orthogonal to the moving direction of the forks 60 and 65 with respect to the fork support 51. Similarly, the first standby position and the second standby position coincide with each other along a direction orthogonal to the moving direction of the forks 60 and 65 with respect to the fork support 51. Accordingly, the wafer W supported at the first support position and the wafer W supported at the second support position are at the same position along the direction orthogonal to the moving direction of the forks 60 and 65 relative to the fork support 51 during the transfer. Has been placed. Therefore, the same appropriate treatment can be performed on the wafer W supported at the first support position and the wafer W supported at the second support position.

  Further, according to the present embodiment, the first standby position and the second standby position are the position along the moving direction of the forks 60 and 65 of the wafer W supported at the first support position and the second support position. It is set so that the position of the supported wafer W along the moving direction of the forks 60 and 65 is aligned. In particular, in the present embodiment, the arrangement position of the wafer W supported at the first support position and the arrangement position of the wafer W supported at the second support position are substantially completely viewed from above during transfer. It is supposed to overlap. Accordingly, the same appropriate treatment can be performed on the wafer W supported at the first support position and the wafer W supported at the second support position. Further, the same appropriate treatment is performed on the wafer W supported at the first support position and the wafer W supported at the second support position by using one treatment means fixed to the fork support 51. It becomes possible.

  Further, according to the present embodiment, the first wafer transfer device (substrate transfer device) 50 is a support failure detection sensor 75 fixed to the fork support 51, and the support position by the forks 60 and 65 is defective. The support failure detection sensor 75 is detected. Then, the poor support detection sensor 75 is located close to the wafer W supported at the first support position by the forks 60 and 65 disposed at the first standby position along the moving direction of the forks 60 and 65. And the wafer W supported at the second support position by the forks 60 and 65 disposed at the second standby position and close to the outside along the moving direction of the forks 60 and 65. Placed in position. Therefore, regardless of whether the wafer W is supported at the first support position or the second support position, it is shared by the wafer W supported at the first support position and the wafer W supported at the second support position. The deviation of the wafer W from the support position can be accurately detected by the single support failure detection sensor 75.

  Furthermore, according to the present embodiment, the first wafer transfer device (substrate transfer device) 50 further includes guides 71 and 72 fixed to the fork support 51. The guides 71 and 72 are disposed close to the wafer W supported at the first support position by the forks 60 and 65 disposed at the first standby position, and the forks 60 disposed at the second standby position. , 65 are also arranged close to the wafer W supported at the second support position. Therefore, regardless of whether the wafer W is supported at the first support position or the second support position, it is shared by the wafer W supported at the first support position and the wafer W supported at the second support position. The guides 71 and 72 can correct and prevent the deviation of the wafer W from the support position.

  In addition, the substrate processing system 10 by this Embodiment is not limited to said aspect, A various change can be added. Hereinafter, an example of a modification will be described.

(Modification 1)
In the above-described embodiment, the example in which the second wafer transfer device 80 has a configuration different from that of the first wafer transfer device 50 has been described (see FIG. 9). The wafer transfer device 80 may have the same configuration as the first wafer transfer device 50. That is, when the second wafer transfer device 80 transfers the wafer W from the transfer unit (first substrate storage unit) 30 to the processing chamber (second substrate storage unit) 40, The fork supports the wafer W at the first support position, and the fork of the second wafer transfer device 80 is disposed at the first standby position with respect to the fork support while the fork support is moving, while the processing chamber is When the wafer W is transferred from the (second substrate accommodating portion) 40 to the transfer unit (first substrate accommodating portion) 30, the fork of the second wafer conveying device 80 is a second supporting position different from the first supporting position. The fork of the second wafer transfer device 80 is disposed at a second standby position different from the first standby position with respect to the fork support during the movement of the fork support. It may be is.

  Further, the configuration of the first wafer transfer device 50 and the configuration of the second wafer transfer device 80 may be reversed.

(Modification 2)
In the embodiment described above, the wafer W at the first support position and the wafer W at the second support position are supported by being inclined at the same angle in the opposite direction with respect to each other about the horizontal direction. However, the present invention is not limited to this. For example, one of the wafer W at the first support position and the wafer W at the second support position is supported so that the plate surface is along the horizontal direction, and the other is supported while being inclined from the horizontal direction. You may be made to do.

  Furthermore, in the above-described embodiment, the arrangement area of the wafer W supported at the first support position by the forks 60, 65 arranged at the first standby position, and the fork 60 arranged at the second standby position, Although the arrangement region of the wafer W supported by the second support position by 65 substantially coincides with the top view, the example is not limited thereto. For example, the range of the wafer W supported at the first support position by the forks 60 and 65 disposed at the first standby position, and the second support position supported by the forks 60 and 65 disposed at the second standby position. The arrangement range of the wafers W may be matched in the moving direction of the forks 60 and 65. Further, the wafer W supported at the first support position by the forks 60 and 65 disposed at the first standby position, and the wafer supported at the second support position by the forks 60 and 65 disposed at the second standby position. The arrangement positions of one end (for example, front or rear) along the moving direction of each of the W forks 60 and 65 may be aligned in the moving direction of the forks 60 and 65.

(Modification 3)
Furthermore, in the above-described embodiment, the example in which the first wafer transfer device has two forks has been described, but the present invention is not limited to this. The first wafer transfer apparatus may have only one fork. The first wafer transfer device may have three or more forks.

  As described above, one embodiment of the present invention has been described together with a plurality of modified examples. Naturally, the above-described modified examples can be applied in appropriate combination.

  Incidentally, as described above, the substrate processing system 10 includes the control device 15 including the computer 16. The control device 15 operates each component of the substrate processing system 10 so that processing on the wafer W to be processed is executed. A program executed by the computer 16 of the control device 15 in order to carry out the processing of the wafer W using the substrate processing system 10 is also the subject of this case. The computer-readable recording medium 16 that records the program is also the subject of this case. Here, the recording medium 16 includes a medium that can be recognized as a single unit, such as a floppy disk (flexible disk) or a hard disk drive.

  In the above description, the substrate processing system, the substrate transfer apparatus, and the substrate transfer method according to the present invention are applied to the processing of the wafer W. However, the present invention is not limited to this. It is also possible to apply to such processing.

FIG. 1 is a side view showing an embodiment of a substrate processing system according to the present invention. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along arrows III-III in FIG. 4 is a cross-sectional view taken along arrows IV-IV in FIG. FIG. 5 is a longitudinal sectional view showing a hoop of the substrate processing system of FIG. 1. FIG. 5 (a) shows a state in which a wafer is accommodated in the hoop, and FIG. A state in which a single wafer is lifted by a fork of a wafer transfer device is shown. 6 is a cross-sectional view taken along arrows VI-VI in FIG. FIG. 7 is a perspective view showing a first wafer transfer device of the substrate processing system of FIG. FIG. 8 is a top view showing a fork of the wafer transfer apparatus of FIG. FIG. 9 is a cross-sectional view taken along arrow IX-IX in FIG. 8 and is a view for explaining a method of supporting a wafer by a fork. FIG. 10 is a side view showing a delivery unit of the substrate processing system of FIG. FIG. 11 is a perspective view showing a second wafer transfer device in the substrate processing system of FIG. 12 is a cross-sectional view taken along arrow XII-XII in FIG. FIGS. 13A to 13D show an example of a series of operations when the wafer is taken out from the hoop by the wafer transfer device in the substrate processing system of FIG. 1, (a), (b), (c). It is the schematic shown continuously in order of (d). 14A to 14D show an example of a series of operations when the wafer is transferred from the wafer transfer device to the delivery unit in the substrate processing system of FIG. It is the schematic shown continuously in order of c) and (d). FIG. 15 is a partial top view showing a conventional substrate transfer apparatus. 16 is a cross-sectional view taken along arrow XVI-XVI in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate processing system 15 Control apparatus 16 Computer 17 Recording medium 20 Hoop 30 Delivery unit 40 Processing chamber 50 First wafer conveyance apparatus 51 Fork support body 60 Fork 61 Upper fork body 63a First support piece 63b Second support piece 65 Below Fork 66 fork main body 68a first support piece 68b second support piece 71 guide 72 guide 75 support failure detection sensor 80 second wafer transfer device 90 upper fork 95 lower fork W substrate

Claims (15)

A substrate transfer apparatus for transferring a substrate from a first substrate storage unit that stores a substrate to a second substrate storage unit that stores a substrate, and from the second substrate storage unit to the first substrate storage unit,
A fork support body movable between the first substrate housing portion and the second substrate housing portion;
A fork movably supported on the fork support,
The fork includes a first support piece that supports a substrate transported from the first substrate housing portion to the second substrate housing portion at a first support position, and the second substrate housing portion to the first substrate housing portion. A second support piece for supporting the substrate to be transported at a second support position different from the first support position;
The fork that supports the substrate at the first support position is disposed at a first standby position with respect to the fork support during movement of the fork support, and the fork supports the substrate at the second support position. Is arranged at a second standby position different from the first standby position with respect to the fork support during movement of the fork support. 2. The substrate transfer apparatus according to claim 1, wherein the first standby position and the second standby position are deviated along a moving direction of the fork with respect to the fork support. 3. The substrate transfer apparatus according to claim 2, wherein the first support position and the second support position are shifted along a moving direction of the fork with respect to the fork support body. The first standby position and the second standby position are a position along the moving direction of the fork of the substrate supported at the first support position and a movement of the fork of the substrate supported at the second support position. The substrate transfer apparatus according to claim 2, wherein the substrate transfer device is shifted so as to be aligned with a position along the direction. A support failure detection sensor fixed to the fork support, further comprising a support failure detection sensor for detecting a failure of a substrate support position by the fork,
The poor support detection sensor is an outer position along the moving direction of the fork with respect to the substrate supported at the first support position by the fork disposed at the first standby position, and The fork disposed at the second standby position is disposed at an outer position along the moving direction of the fork with respect to the substrate supported at the second support position. The board | substrate conveyance apparatus as described in any one of Claims 1 thru | or 4. A guide fixed to the fork support;
The guide prevents displacement of the substrate supported at the first support position by the fork disposed at the first standby position, and the second by the fork disposed at the second standby position. 6. The substrate transfer apparatus according to claim 1, wherein the substrate supported at the supporting position is prevented from being displaced. The substrate transport device according to claim 1, wherein a plurality of the forks are supported on the fork support body. A first substrate housing portion for housing a substrate;
A second substrate housing portion for housing the substrate;
The substrate according to claim 1, wherein the substrate is transported from the first substrate housing portion to the second substrate housing portion and from the second substrate housing portion to the first substrate housing portion. A substrate processing system. A substrate transport apparatus comprising: a fork support that is movable between a first substrate storage unit that stores a substrate and a second substrate storage unit that stores a substrate; and a fork that is movably supported by the fork support. A method of transporting a substrate from one of the first substrate housing portion and the second substrate housing portion to the other,
Moving the fork support so that the fork faces one substrate housing;
A step of advancing the fork and supporting the substrate accommodated in the one substrate accommodating portion facing each other by the fork;
Retreating a fork supporting the substrate;
Moving the fork support so that the fork supporting the substrate faces the other substrate housing;
A step of advancing the fork supporting the substrate and placing the substrate in the other substrate receiving portion facing the substrate,
When transporting a substrate from the first substrate housing portion to the second substrate housing portion, the fork supports the substrate at a first support position, and the fork supports the fork during the movement of the fork support. Placed in a first standby position relative to the body,
When transporting a substrate from the second substrate housing portion to the first substrate housing portion, the fork supports the substrate at the second support position different from the first support position, and the fork support body moves. In the substrate transport method, the fork is disposed at a second standby position different from the first standby position with respect to the fork support. The substrate transfer method according to claim 9, wherein the first standby position and the second standby position are shifted along a moving direction of the fork relative to the fork support. The substrate transport method according to claim 10, wherein the first support position and the second support position are shifted along a moving direction of the fork with respect to the fork support body. The first standby position and the second standby position are a position along the moving direction of the fork of the substrate supported at the first support position and a movement of the fork of the substrate supported at the second support position. The substrate transport method according to claim 10 or 11, wherein the substrate is shifted so as to be aligned with a position along the direction. After the step of retracting the fork supporting the substrate, a forward position along the moving direction of the fork with respect to the substrate supported at the first support position by the fork disposed at the first standby position And with respect to the substrate supported at the second support position by the fork disposed at the second standby position, the substrate is disposed at a front position along the moving direction of the fork. 13. The substrate transport method according to claim 9, wherein whether or not the substrate support position is normal is determined by a support failure detection sensor fixed to the fork support. In the step of moving the fork support so that the fork supporting the substrate faces the other substrate housing portion, the fork disposed at the first standby position by the guide fixed to the fork support The substrate supported at the first support position is prevented from shifting from the first support position, or the substrate supported at the second support position by the fork disposed at the second standby position. The substrate transfer method according to claim 9, wherein deviation from one support position is prevented. A substrate transport apparatus comprising: a fork support that is movable between a first substrate storage unit that stores a substrate and a second substrate storage unit that stores a substrate; and a fork that is movably supported by the fork support. A recording medium on which a program executed by a control device for controlling the recording medium is recorded,
By executing the program by the control device,
A substrate transport method for transporting a substrate from one of the first substrate housing portion and the second substrate housing portion to the other using a substrate transport device,
Moving the fork support so that the fork faces one substrate housing;
A step of advancing the fork and supporting the substrate accommodated in the one substrate accommodating portion facing each other by the fork;
Retreating a fork supporting the substrate;
Moving the fork support so that the fork supporting the substrate faces the other substrate housing;
A step of advancing the fork supporting the substrate and placing the substrate in the other substrate receiving portion facing the substrate,
When transporting a substrate from the first substrate housing portion to the second substrate housing portion, the fork supports the substrate at a first support position, and the fork supports the fork during the movement of the fork support. Placed in a first standby position relative to the body,
When transporting a substrate from the second substrate housing portion to the first substrate housing portion, the fork supports the substrate at the second support position different from the first support position, and the fork support body moves. A recording medium, wherein the fork is disposed at a second standby position different from the first standby position with respect to the fork support body, and causes the substrate transfer apparatus to carry out a substrate transfer method.

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