JP2008226887A - Holding apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding apparatus for holding a substrate in the more excellent condition by controlling deterioration of flatness of the substrate. <P>SOLUTION: The holding apparatus for holding substrate is provided with a holding member having a first plane for holding one plane of the substrate with an electrostatic force where at least a part of the first plane can be deformed in the normal direction of the first plane and with a supporting member having supporting portions arranged at least in three separate positions within the plane almost parallel to the first plane to control movement of the substrate held in the first plane in the normal direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a holding apparatus that holds a substrate, an exposure apparatus, and a device manufacturing method.

An exposure apparatus used in a photolithography process includes a holding member that holds a substrate (including a reticle and a photosensitive substrate). In the case of an EUV exposure apparatus that uses extreme ultra-violet (EUV) light as exposure light, the substrate is placed in a vacuum. Therefore, the EUV exposure apparatus includes a holding member that holds the substrate with an electrostatic force. The following patent document discloses an example of a holding device having a holding member that holds a substrate with an electrostatic force.
JP 2002-299228 A

  Conventionally, a member having high rigidity is used as a holding member of an EUV exposure apparatus. Moreover, the holding member has a holding surface, and in order to hold the substrate, the holding surface and almost the entire area of one surface of the substrate are brought into contact with each other. In the case of the holding member having such a configuration, high flatness is required for the holding surface in order to maintain the flatness of the substrate. In that case, for example, a large load may be applied to the manufacture of the holding member. Further, if a foreign substance enters between the holding surface of the holding member and one surface of the substrate, the flatness of the held substrate is likely to deteriorate. In that case, exposure accuracy may deteriorate.

  This invention is made | formed in view of such a situation, Comprising: It aims at providing the holding | maintenance apparatus which suppresses deterioration of the flatness of a board | substrate and can hold | maintain a board | substrate favorably. It is another object of the present invention to provide an exposure apparatus that can satisfactorily execute an exposure process while suppressing deterioration of the flatness of the substrate, and a device manufacturing method that uses the exposure apparatus.

  In order to solve the above-described problems, the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.

  According to the first aspect of the present invention, the holding device for holding the substrate (M) has the first surface (16) capable of holding one surface (Mb) of the substrate (M) with an electrostatic force. In addition, at least a part of the first surface (16) is separated from the holding member (17) that can be deformed in the normal direction of the first surface (16) and a plane substantially parallel to the first surface (16). And a support member (19) having a support portion (18) which is disposed at at least three positions and suppresses movement of the substrate (M) held on the first surface (16) in the normal direction. A device (1) is provided.

  According to the first aspect of the present invention, the substrate can be favorably held.

  According to the second aspect of the present invention, the first substrate (M) on which the pattern is formed is illuminated with exposure light (EL), and is photosensitive with exposure light (EL) from the first substrate (M). An exposure apparatus that exposes the second substrate (P), and includes a first holding device (1) that holds the first substrate (M) and a second holding device (2) that holds the second substrate (P). In addition, at least one of the first holding device (1) and the second holding device (2) is provided with an exposure apparatus (EX) including the holding device of the above aspect.

  According to the second aspect of the present invention, the exposure process can be executed satisfactorily.

  According to the third aspect of the present invention, exposing the second substrate (P) using the exposure apparatus (EX) of the above aspect and developing the exposed second substrate (P). A device manufacturing method is provided.

  According to the 3rd aspect of this invention, a device can be manufactured using the exposure apparatus which can be favorably exposed.

  According to the present invention, the substrate can be held satisfactorily and the exposure process can be performed satisfactorily. Therefore, a device having a desired performance can be manufactured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a schematic block diagram that shows an exposure apparatus EX according to the first embodiment. In FIG. 1, an exposure apparatus EX includes a mask stage 1 that is movable while holding a mask M on which a pattern is formed, a substrate stage 2 that is movable while holding a substrate P for forming a device, and a mask stage. The illumination system IL that illuminates the mask M held by 1 with the exposure light EL, the projection optical system PL that projects an image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and the entire exposure apparatus EX And a control device 5 for controlling the operation. Further, the exposure apparatus EX of the present embodiment includes a chamber apparatus 6 having a vacuum system that adjusts at least a predetermined space through which the exposure light EL passes to a vacuum state.

  The exposure apparatus EX of the present embodiment is an EUV exposure apparatus that exposes the substrate P with extreme ultraviolet light. Extreme ultraviolet light is an electromagnetic wave in a soft X-ray region having a wavelength of about 5 to 50 nm, for example. In the following description, extreme ultraviolet light is appropriately referred to as EUV light.

  The substrate P includes a substrate in which a film such as a photosensitive material (resist) is formed on a base material such as a semiconductor wafer. The mask M includes a reticle on which a device pattern to be projected onto the substrate P is formed. In the present embodiment, EUV light is used as the exposure light EL, and the mask M is a reflective mask having a multilayer film capable of reflecting EUV light. The mask M includes a plate-like substrate G and a multilayer film F formed on the substrate G. The exposure apparatus EX illuminates the reflection surface (pattern formation surface) Ma of the mask M, on which the pattern is formed with the multilayer film F, with exposure light (EUV light) EL, and makes the photosensitivity with the exposure light EL reflected by the mask M. The substrate P having it is exposed.

The illumination system IL includes a plurality of optical elements IR _{1 to} IR ₄ and illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution. The optical elements IR _{1 to} IR ₄ include a multilayer film reflecting mirror including a multilayer film capable of reflecting EUV light. The multilayer films of the optical elements IR _{1 to} IR ₄ include, for example, a Mo / Si multilayer film and a Mo / Be multilayer film. Each optical element _IR 1 _{~IR 4} is held in a lens barrel (not shown).

  The illumination system IL illuminates the mask M with the exposure light EL from the light source 8. The light source 8 of the present embodiment is a laser-excited plasma light source, and includes a housing 9, a laser device 10 that emits laser light, and a supply member 11 that supplies a target material such as xenon gas into the housing 9. . The laser light emitted from the laser device 10 and condensed by the condensing optical system 12 is applied to the target material emitted from the tip of the supply member 11. The target material irradiated with the laser light is turned into plasma and generates light including EUV light (exposure light EL). The light generated at the tip of the supply member 11 is collected by the capacitor 13. The light that has passed through the capacitor 13 enters a collimator mirror 14 that is disposed outside the housing 9. The light source 8 may be a discharge plasma light source or another light source.

  While holding the mask M, the mask stage 1 is movable in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. In the present embodiment, the mask stage 1 holds the mask M so that the reflection surface Ma of the mask M and the XY plane are substantially parallel. In the present embodiment, the mask stage 1 holds the mask M so that the reflection surface Ma of the mask M faces the −Z direction. Position information of the mask stage (mask M) is measured by a laser interferometer (not shown). The laser interferometer uses the measurement mirror provided on the mask stage 1 to measure position information regarding the X axis, the Y axis, and the θZ direction of the mask stage 1. Further, surface position information (position information regarding the Z axis, θX, and θY) of the surface of the mask M held on the mask stage 1 is detected by a focus / leveling detection system (not shown). The control device 5 controls the position of the mask M held on the mask stage 1 based on the measurement result of the laser interferometer and the detection result of the focus / leveling detection system.

Projection optical system PL includes a plurality of optical elements PR _{1 to} PR ₄ and projects an image of the pattern of mask M onto substrate P at a predetermined projection magnification. The optical elements PR _{1 to} PR ₄ include a multilayer film reflecting mirror including a multilayer film capable of reflecting EUV light. The multilayer films of the optical elements PR _{1 to} PR ₄ include, for example, a Mo / Si multilayer film and a Mo / Be multilayer film. Each optical element _PR 1 to PR ₄ is held in a lens barrel (not shown). In the present embodiment, the optical elements R _{1 to} PR ₄ of the projection optical system PL are accommodated in a dedicated vacuum chamber 15. Note that there is no need for a dedicated vacuum chamber.

  The substrate stage 2 is movable in the X axis, Y axis, Z axis, θX, θY, and θZ directions while holding the substrate P. In the present embodiment, the substrate stage 2 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. In the present embodiment, the substrate stage 2 holds the substrate P so that the surface Pa of the substrate P faces the + Z direction. The position information of the substrate stage 2 (substrate P) is measured by a laser interferometer (not shown). The laser interferometer uses the measurement mirror provided on the substrate stage 2 to measure position information regarding the X axis, the Y axis, and the θZ direction of the substrate stage 2. Further, surface position information (position information regarding the Z axis, θX, and θY) of the surface Pa of the substrate P held on the substrate stage 2 is detected by a focus / leveling detection system (not shown). The control device 5 controls the position of the substrate P held on the substrate stage 2 based on the measurement result of the laser interferometer and the detection result of the focus / leveling detection system.

  Next, the mask stage 1 according to the present embodiment will be described with reference to FIGS. FIG. 2 is a side view showing an example of the mask stage 1, and FIG. 3 is a view of the mask stage 1 as viewed from the −Z side. FIG. 2 shows the mask stage 1 in a state where the mask M is held.

  As shown in FIG. 2, the mask M includes a plate-like base material G and a multilayer film F formed on one surface of the base material G. As described above, the mask M of the present embodiment is a reflective mask having the multilayer film F that can reflect EUV light. The multilayer film F includes, for example, a Mo / Si multilayer film and a Mo / Be multilayer film. The substrate G includes ultra-low expansion glass such as ULE manufactured by Corning, and Zerodur (registered trademark) manufactured by Schott, and has a predetermined rigidity.

  As shown in FIGS. 2 and 3, the mask stage 1 that holds the mask M includes a holding member 17 (17 </ b> A, 17 </ b> B) having a holding surface 16 that can hold the back surface Mb of the mask M with an electrostatic force, and a holding member 17. A support member 19 having a support portion 18 that supports the table, a table member 20 that supports the support member 19, and a stage main body 21 that supports the table member 20. The back surface Mb of the mask M is a surface opposite to the reflection surface Ma irradiated with the exposure light EL and includes the other surface of the base material G.

  In the present embodiment, the holding member 17 is a thin plate-like member. In the following description, the holding member 17 of the present embodiment is appropriately referred to as a plate member 17.

  FIG. 4 is an enlarged view showing the vicinity of the plate member 17. In FIG. 4, the plate member 17 has a holding surface 16 that faces the back surface Mb of the mask M, and a back surface 22 opposite to the holding surface 16. In the present embodiment, each of the holding surface 16 and the back surface 22 is disposed so as to be substantially parallel to the XY plane. The holding surface 16 is disposed so as to face the −Z direction, and the back surface 22 is disposed so as to face the + Z direction. The support portion 18 of the support member 19 is disposed so as to face the back surface 22 of the plate member 17 and support the back surface 22 of the plate member 17.

  The plate member 17 has flexibility. At least a part of the holding surface 16 of the plate member 17 can be deformed in the normal direction (Z-axis direction) of the holding surface 16. In this embodiment, the rigidity (Young's modulus) of the plate member 17 is at least smaller than the rigidity (Young's modulus) of the mask M (base material G).

The plate member 17 includes an insulating layer 23 and an electrode layer 24. The insulating layer 23 is made of ceramics such as alumina (Al ₂ O ₃ ), for example. The electrode layer 24 is made of a metal such as aluminum (Al). The electrode layer 24 is disposed so as to face the support portion 18. The insulating layer 23 can face the back surface Mb of the mask M. That is, in the present embodiment, the electrode layer 24 is disposed on the + Z side of the insulating layer 23. The holding surface 16 includes the surface (lower surface) of the insulating layer 23, and the back surface 22 includes the surface (upper surface) of the electrode layer 24.

  In the present embodiment, the plate member 17 has a two-layer structure of the insulating layer 23 and the electrode layer 24, but other layers may be added.

  The holding surface 16 of the plate member 17 has a predetermined size so as to be in contact with a wide area (substantially the entire area) of the back surface Mb of the mask M. The mask stage 1 of this embodiment includes an electrostatic chuck mechanism that holds the mask M with electrostatic force, and the holding surface 16 of the plate member 17 holds the back surface Mb of the mask M with electrostatic force.

  In the present embodiment, the mask stage 1 has two plate members 17A and 17B. The electrostatic chuck mechanism of the present embodiment is a so-called bipolar system, and one of the two plate members 17A and 17B has one plate member 17A serving as a positive electrode and the other plate member 17B serving as a negative electrode. A voltage applicator (not shown) is connected to each of the plate members 17A and 17B. The control device 5 controls the voltage applicator so that one plate member 17A becomes a positive electrode and the other plate member 17B becomes a negative electrode. As a result, the mask M is held by the plate member 17 by the Coulomb force (Jansen-Rahbek force) generated between the holding surface 16 of the plate member 17 and the back surface Mb of the mask M.

  FIG. 5 is a view showing the support member 19, the table member 20, and the stage main body 21. FIG. 5 shows a state where the plate member 17 is removed from the mask stage 1 of FIG. As shown in FIG. 5, the support member 19 having the support portion 18 is disposed at a plurality of positions separated from each other within an XY plane substantially parallel to the holding surface 16. In the present embodiment, the support member 19 is disposed at six positions separated from each other on the front surface (lower surface) 20 </ b> A of the table member 20. That is, in the present embodiment, the support members 19 having the support portions 18 are arranged at six locations.

  As shown in FIGS. 2 and 4 and the like, the support member 19 is a rod-shaped member. In the present embodiment, the support portion 18 of the support member 19 that faces the back surface 22 of the plate member 17 is a plane substantially parallel to the XY plane. In the following description, the support portion 18 of the support member 19 of the present embodiment is appropriately referred to as a support surface 18. The support surface 18 is sufficiently smaller than the back surface 22 of the plate member 17. Each of the plurality of support surfaces 18 is disposed in the same plane (in the XY plane) (is flush).

  In the present embodiment, the outer shape of the stage main body 21 in the XY plane is larger than the table member 20. In the present embodiment, the outer shape of the front surface (lower surface) 20A of the table member 20 in the XY plane is a rectangular shape slightly smaller than the back surface Mb of the mask M. The support member 19 is disposed at each of four corners of the surface 20A and two positions at the center of the surface 20A. In the present embodiment, three support members 19 are arranged for one plate member 17A, and three support members 19 are arranged for the other plate member 17B. Then, six support members 19 are arranged for one mask M.

  Each of the support surfaces 18 of the plurality of support members 19 can come into contact with the back surface 22 of the plate member 17 (17A, 17B). As described above, the plate member 17 is flexible and can be deformed in the Z-axis direction. However, in the portion supported by the support surface 18 (the portion in contact with the support surface 18), the plate member The deformation of 17 in the Z-axis direction is suppressed (restrained). Therefore, the movement of the mask M held on the holding surface 16 of the plate member 17 in the Z-axis direction is suppressed by the support surface 18 (support member 19). On the other hand, in the region of the plate member 17 that is not in contact with the support surface 18, the plate member 17 can be deformed in the Z-axis direction.

  In the present embodiment, the mask stage 1 includes a fixing member 25 that fixes the periphery of the back surface 22 of the plate member 17. One end (upper end) of the fixing member 25 is fixed to the lower surface 21 </ b> A of the stage main body 21, and the other end (lower end) is fixed to the back surface 22 of the plate member 17. The fixing member 25 is a rod-shaped member and is arranged at a plurality of positions separated from each other on the XY plane. In the present embodiment, three fixing members 25 are arranged for one plate member 17A, and three fixing members 25 are arranged for the other plate member 17B. Then, six fixing members 25 are arranged for one mask M.

  By fixing the peripheral edge of the plate member 17 with the fixing member 25, it is possible to suppress the peripheral edge of the plate member 17 from being deformed by its own weight (gravity action) or the like.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described. In order to perform exposure of the substrate P, the substrate P is transported and held to the substrate stage 2 by a transport system (not shown), and the mask M is transported to the mask stage 1. In a state where the back surface Mb of the mask M and the holding surface 16 of the plate member 17 of the mask stage 1 are in contact with each other, the control device 5 makes one plate member 17A a positive electrode and the other plate member 17B a negative electrode. A voltage is applied to each of the plate members 17A and 17B by a voltage applicator. Thereby, the mask M is held by the plate member 17 with an electrostatic force.

  The mask M held by the holding member 17 of the mask stage 1 is emitted from the light source device 8 and illuminated with exposure light (EUV light) EL via the illumination system IL. The exposure light EL emitted from the illumination system IL is incident on the reflection surface Ma of the mask M. The exposure light EL that is irradiated onto the reflective surface Ma of the mask M and reflected by the reflective surface Ma enters the projection optical system PL from the object plane side of the projection optical system PL. The exposure light EL that has entered the projection optical system PL from the object plane side of the projection optical system PL is emitted to the image plane side of the projection optical system PL, and is irradiated onto the surface (exposure plane) Pa of the substrate P. Thereby, the pattern image of the mask M illuminated with the exposure light EL is projected onto the photosensitive substrate P via the projection optical system PL, and the substrate P is exposed.

  In the present embodiment, the plate member 17 that holds the mask M can be deformed in the normal direction of the holding surface 16. Therefore, as shown in FIG. 6, even if a foreign substance enters between the back surface Mb of the mask M and the holding surface 16 of the plate member 17, the deformation of the mask M is suppressed. As described above, the rigidity of the plate member 17 is smaller than the rigidity of the mask M (base material G). Therefore, as shown in FIG. 6, when a foreign substance enters between the mask M and the plate member 17, at least a part of the plate member 17 is deformed in the Z-axis direction, but the deformation of the mask M is suppressed. Therefore, the flatness of the mask M is maintained.

  Further, since the plate member 17 is supported by the support member 19, the movement of the mask M held by the plate member 17 in the Z-axis direction is suppressed. Since the mask M has a predetermined rigidity, the deformation of the mask M is suppressed while being held by the plate member 17. Further, the movement of the mask M in the XY directions is suppressed by the electrostatic force of the plate member 17.

  Further, the support surface 18 is sufficiently small with respect to the back surface 22 of the plate member 17, and the probability that foreign matter enters between the portion of the plate member 17 supported by the support surface 18 and the mask M is sufficiently suppressed. .

  Further, the fixing member 25 prevents the peripheral portion of the plate member 17 from being deformed or the plate member 17 from dropping from the mask stage 1.

  As described above, according to the present embodiment, deterioration of the flatness of the mask M can be suppressed, and the mask M can be favorably held by the mask stage 1. Therefore, deterioration of exposure accuracy can be suppressed, and the substrate P can be exposed satisfactorily.

  Further, even if the flatness of the holding surface 16 of the plate member 17 is somewhat rough, the mask M is held by the plate member 17 by setting the position and flatness of the support surface 18 of the support member 19 in the Z-axis direction to a desired state. At the same time, the deterioration of the flatness of the mask M can be suppressed. As described above, the support surface 18 is minute, and the support surface 18 can be adjusted to desired accuracy (including position accuracy and shape accuracy) without imposing a heavy load on the manufacturing process of the mask stage 1.

  In the present embodiment, the case where six support portions (support surfaces) 18 are arranged has been described as an example. However, for example, as shown in FIG. 7, five support portions 18 may be provided. . Moreover, as shown in FIG. 8, the support part 18 may be three. By disposing the support portion 18 at at least three positions, the movement of the mask M in the Z-axis, θX, and θY directions can be suppressed. Further, by disposing the support portion 18 at at least five positions, the movement of the mask M in the Z-axis, θX, and θY directions can be suppressed, and the surface accuracy of the mask M can be maintained better.

<Second Embodiment>
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 9 is a diagram showing a mask stage 1B according to the second embodiment. As shown in FIG. 9, the mask stage 1B according to the second embodiment includes a plate member 17 (17A, 17B) having a holding surface 16 that can hold the back surface of the mask M with an electrostatic force, a table member 20B, and a table. A stage body 21B that supports the member 20B.

  The mask stage 1B of the present embodiment is disposed on the surface (lower surface) of the table member 20B, and includes a plurality of pin members 191 having a support surface 181 and the surface (lower surface) of the table member 20B so as to surround the plurality of pin members 191. ) And a peripheral wall member 192 having a support surface 182 disposed thereon. In the following description, the pin member 191 is appropriately referred to as a first support member 191, and the peripheral wall member 192 is appropriately referred to as a second support member 192.

  In the present embodiment, a plurality of (two) second support members 192 are arranged so as to correspond to each of the plurality (two) of plate members 17A, 17B. A plurality of first support members 191 are arranged at predetermined intervals inside the second support member 192. Each of the support surface 181 of the first support member 191 and the support surface 182 of the second support member 192 is disposed in the same plane (in the XY plane) and supports the back surface 22 of the plate member 17.

  Also in this embodiment, the mask stage 1B can hold the mask M satisfactorily.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 10 is a side sectional view showing a mask stage 1C according to the third embodiment. As shown in FIG. 10, the mask stage 1C of this embodiment includes a holding member 17C having a holding surface 16C capable of holding the back surface Mb of the mask M with an electrostatic force, and the Z axis of the substrate P held by the holding surface 16C. A support member 19C having a support surface 18C that suppresses movement in the direction, a table member 20C that supports the support member 19C, and a stage body 21C that supports the table member 20C are provided.

  The holding member 17C includes an insulating member 23C having a surface (lower surface) 27 that can be elastically deformed at least in the Z-axis direction, and an electrode member 24C facing the back surface 28 opposite to the surface 27 of the insulating member 23C. The insulating member 23C is made of, for example, silicon rubber. The holding surface 16C of the holding member 17C includes the surface 27 of the insulating member 23C.

  In the present embodiment, the insulating member 23C and the electrode member 24C have holes 23H and 24H for disposing the rod-shaped support member 19C, respectively. The support surface 18C of the support member 19C disposed in the holes 23H and 24H is exposed from the holding surface 16C, and the support surface 18C and the back surface Mb of the mask M are in contact with each other. In the present embodiment, three support members 19C are provided, and the support surface 18C of the support member 19C supports three positions on the back surface Mb of the mask M.

  FIG. 11 is a plan view showing the electrode member 24C. As shown in FIG. 11, the electrode member 24C includes a first electrode member 241 that is a positive electrode and a second electrode member 242 that is a negative electrode. The electrode member 24C has a hole 24H for arranging the support member 19C. The holes 24H are formed to correspond to a plurality (three) of support members 19C. The hole 24H has an inner diameter larger than the outer diameter of the support member 19C, and the support member 19C is disposed in the hole 24H so as not to contact the electrode member 24C.

  In the present embodiment, since the back surface Mb of the mask M is supported by the support member 19C, the movement of the mask M in the Z-axis direction is suppressed. Further, the movement of the mask M in the XY directions is suppressed by the electrostatic force of the holding member 17C.

  In the present embodiment, the holding surface 16C of the insulating member 23C that holds the mask M can be deformed in the normal direction (Z-axis direction) of the holding surface 16C. Therefore, as shown in FIG. 12, even if a foreign substance enters between the back surface Mb of the mask M and the holding surface 16C of the insulating member 23C, the deformation of the mask M is suppressed. Since the rigidity of the insulating member 23C is smaller than the rigidity of the mask M (base material G) and the surface 27 (holding surface 16C) can be elastically deformed, as shown in FIG. 12, the back surface Mb of the mask M and the insulating member 23C. When a foreign object enters between the holding surface 16C and the insulating surface 23C, at least a part of the insulating member 23C is deformed in the Z-axis direction, but deformation of the mask M is suppressed. Therefore, the flatness of the mask M is maintained.

  Further, the support surface 18C of the support member 19C is sufficiently small with respect to the back surface Mb of the mask M, and the probability that foreign matter enters between the support surface 18C and the mask M is sufficiently suppressed.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a diagram showing an example of the substrate stage 2D according to the present embodiment. A substrate stage 2D shown in FIG. 13 has a configuration equivalent to that of the mask stage 1 described in the first embodiment.

  In FIG. 13, a substrate stage 2D that holds a substrate P includes a plate member 17D having a holding surface 16D that can hold the back surface Pb of the substrate P with an electrostatic force, and a support member 19D having a support portion 18D that supports the plate member 17D. And a table member 20D that supports the support member 19D, and a stage body 21D that supports the table member 20D. The back surface Pb of the substrate P is a surface on the side opposite to the surface Pa irradiated with the exposure light EL. The support surface 18D of the support member 19D supports at least three positions on the lower surface of the plate member 17D.

  The plate member 17D includes an insulating layer 23D and an electrode layer 24D, and has flexibility. The holding surface 16D of the plate member 17D has a predetermined size so as to be able to contact a wide area (substantially the entire area) of the back surface Pb of the substrate P. The holding surface 16D of the plate member 17D includes the surface of the insulating layer 23D, and holds the back surface Pb of the substrate P with an electrostatic force.

  A fixing member 25D for fixing the peripheral edge of the plate member 17D is disposed. By fixing the periphery of the plate member 17D with the fixing member 25D, it is possible to suppress deformation of the periphery of the plate member 17D due to, for example, its own weight (gravity action).

  FIG. 14 is a diagram illustrating an example of the substrate stage 2E. A substrate stage 2E shown in FIG. 14 has a configuration equivalent to the mask stage 1C described in the third embodiment.

  In FIG. 14, the substrate stage 2E suppresses the movement of the holding member 17E having the holding surface 16E capable of holding the back surface Pb of the substrate P with electrostatic force and the movement of the substrate P held by the holding surface 16E in the Z-axis direction. A support member 19E having a support surface 18E, a table member 20E that supports the support member 19E, and a stage body 21E that supports the table member 20E are provided.

  The holding member 17E includes an insulating member 23E having a surface (upper surface) 27E that can be elastically deformed at least in the Z-axis direction, and an electrode member 24E facing the back surface 28E opposite to the surface 27E of the insulating member 23E. The insulating member 23E is made of, for example, silicon rubber. The holding surface 16E of the holding member 17E includes a surface 27E of the insulating member 23E.

  The support surface 18E of the support member 19E is exposed from the holding surface 16E, and the support surface 18E and the back surface Pb of the substrate P are in contact with each other. In the present embodiment, three support members 19E are provided, and the support surface 18E of the support member 19E supports three positions on the back surface Pb of the substrate P.

  As described above, the configuration of the mask stage described in the above embodiment can be applied to the substrate stage. According to this embodiment, the deterioration of the flatness of the substrate P can be suppressed, and the substrate P can be favorably held on the substrate stage. Therefore, deterioration of exposure accuracy can be suppressed, and the substrate P can be exposed satisfactorily.

  In the first to fourth embodiments described above, the support member 19 includes the support surface 18 including a plane substantially parallel to the XY plane, but the support surface may be curved or spherical. For example, as shown in FIG. 15, the support portion 18 </ b> F of the support member 19 that supports the back surface 22 of the plate member 17 may be curved (spherical). In this case, the support portion 18 </ b> F and the back surface 22 of the plate member 17 are in point contact, and the support portion 18 forms a support point with respect to the back surface 22 of the plate member 17. Even in such a configuration, the mask stage can hold the mask M well, and the substrate stage can hold the substrate P well.

  As the substrate P in the above-described embodiment, not only a semiconductor wafer for manufacturing a semiconductor device but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask (reticle) used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate through a projection optical system, and one scanning exposure is performed on one substrate. The present invention can also be applied to an exposure apparatus that performs double exposure of shot areas almost simultaneously.

  Further, the present invention relates to US Pat. No. 6,341,007, US Pat. No. 6,400,441, US Pat. No. 6,549,269, US Pat. No. 6,590,634, US Pat. No. 6,208,407. The present invention is also applicable to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,262,796.

  Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 11-135400 (corresponding to International Publication No. 1999/23692), US Pat. No. 6,897,963, etc., a substrate stage for holding a substrate and a reference mark are provided. The present invention can also be applied to an exposure apparatus that includes a formed reference member and / or a measurement stage on which various photoelectric sensors are mounted. The present invention can also be applied to an exposure apparatus that includes a plurality of substrate stages and measurement stages.

  The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD) In addition, the present invention can be widely applied to an exposure apparatus for manufacturing a micromachine, MEMS, DNA chip, reticle, mask, or the like.

  As long as it is permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 16, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a substrate of the device. Manufacturing step 203, substrate processing step 204 including substrate processing (exposure processing) for exposing the substrate with an image of a mask pattern and developing the exposed substrate according to the above-described embodiment, device assembly step (dicing process, bonding) (Including processing processes such as process and package process) 205, inspection step 206 and the like.

  In the above-described embodiment, the case where the apparatus for forming a pattern on the substrate P is an exposure apparatus that forms a pattern on the substrate P by irradiating the exposure light EL to the substrate P having photosensitivity. Although described as an example, the holding device of the present invention is applicable to various pattern forming apparatuses that form patterns on the substrate P. As such a pattern forming apparatus, for example, an ink jet apparatus that forms a pattern on a substrate by ejecting ink droplets onto the substrate, an original plate on which a concavo-convex pattern is formed, and a substrate on which an organic material is applied And a nanoimprinting apparatus for transferring the pattern of the original plate onto the substrate by separating the original plate and the substrate and then cooling the substrate. When a holding device that holds a substrate is provided in these apparatuses, the substrate can be held in a desired state by holding the substrate using the holding device of the present invention.

  Although the embodiments of the present invention have been described as described above, the present invention can be used by appropriately combining all the above-described constituent elements, and some constituent elements may not be used.

It is a schematic diagram which shows an example of the exposure apparatus which concerns on 1st Embodiment. It is a side view which shows the mask stage which concerns on 1st Embodiment. It is the figure which looked at the mask stage which concerns on 1st Embodiment from the lower side. It is the figure which expanded a part of mask stage concerning a 1st embodiment. It is a figure which shows a part of mask stage which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the effect | action of the mask stage which concerns on 1st Embodiment. It is a figure which shows an example of a mask stage. It is a figure which shows an example of a mask stage. It is a perspective view which shows the mask stage which concerns on 2nd Embodiment. It is a sectional side view which shows the mask stage which concerns on 3rd Embodiment. It is a figure which shows the electrode member of the mask stage which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating the effect | action of the mask stage which concerns on 3rd Embodiment. It is a side view which shows the substrate stage which concerns on 4th Embodiment. It is a sectional side view which shows an example of a substrate stage. It is a figure which shows an example of a supporting member. It is a flowchart figure which shows an example of the manufacturing process of a microdevice.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mask stage, 2 ... Substrate stage, 16 ... Holding surface, 17 ... Holding member, 18 ... Supporting part, 19 ... Supporting member, 23 ... Insulating layer, 23C ... Insulating member, 23H ... Hole, 24 ... Electrode layer, 24C ... Electrode member, 24H ... Hole, 25 ... Fixing member, EL ... Exposure light, EX ... Exposure apparatus, M ... Mask, Ma ... Reflecting surface, Mb ... Back surface, P ... Substrate, Pa ... Front surface, Pb ... Back surface

Claims (11)

A holding device for holding a substrate,
A holding member having a first surface capable of holding one surface of the substrate by electrostatic force, wherein at least a part of the first surface is deformable in a normal direction of the first surface;
A support member having a support portion disposed at least at three positions separated from each other in a plane substantially parallel to the first surface and suppressing the movement of the substrate held on the first surface in the normal direction; Holding device.   The holding device according to claim 1, wherein the holding member includes a flexible plate member including an insulating layer and an electrode layer. The plate member has the first surface and a second surface opposite to the first surface;
The holding device according to claim 2, wherein the support portion of the support member supports at least three positions of the second surface of the plate member.   The holding device according to claim 2, further comprising a fixing member that fixes a peripheral edge of the second surface of the plate member. The holding member has an insulating member having a surface that is elastically deformable at least in the normal direction;
An electrode member facing the back surface opposite to the surface of the insulating member;
The holding device according to claim 1, wherein the first surface includes a surface of the insulating member.   The holding device according to claim 5, wherein the support portion of the support member supports at least three positions on one surface of the substrate.   The holding device according to claim 5 or 6, wherein the insulating member has a hole for disposing at least a part of the support member.   The holding device according to claim 1, wherein the other surface of the substrate is irradiated with exposure light. An exposure apparatus that illuminates a first substrate on which a pattern is formed with exposure light and exposes a second substrate having photosensitivity with the exposure light from the first substrate,
A first holding device for holding the first substrate; and a second holding device for holding the second substrate;
The exposure apparatus including the holding device according to claim 1, wherein at least one of the first holding device and the second holding device.   The exposure apparatus according to claim 9, wherein the exposure light includes extreme ultraviolet light. Exposing the second substrate using the exposure apparatus according to claim 9 or 10,
Developing the exposed second substrate. A device manufacturing method comprising:

Images