JP2008227188A - Apparatus and method of removing coil insulating film - Google Patents

Abstract

An object of the present invention is to reduce the deviation of the peeling position caused by the variation in the wire diameter of the wire, and to prevent quality defects due to subsequent processes.
A winding device for manufacturing a coil includes a device for stripping a coil insulating film. The peeling device includes a peeling mechanism 7 including a chuck that peels an insulating film applied to the surface of the wire 2 constituting the coil, and a wire diameter measuring device 6 that measures in advance the wire diameter of the wire 2 supplied to the peeling mechanism 7. And a CPU 8 for controlling the peeling mechanism 7 in order to adjust the peeling position in the wire 2 from which the insulating film is peeled by the peeling mechanism 7 based on the measured wire diameter.
[Selection] Figure 1

Description

  The present invention relates to a coil insulating film peeling apparatus and a peeling method for peeling an insulating film applied to the surface of a wire in the vicinity of an end of the wire when a wire is wound around a bobbin.

  Conventionally, as this type of technology, for example, a peeling device described in Patent Document 1 below is known. This peeling device is provided in a part of a winding device that manufactures a coil by winding a wire rod around a bobbin. And just before finishing winding a wire around a bobbin, the insulating coating applied to the surface of the wire is peeled off near the end of the wire for each coil.

Japanese Patent No. 2997450

  However, in the peeling apparatus described in Patent Document 1, when peeling is performed for each coil, even if the variation in the wire diameter of the wire is within the manufacturing tolerance range, the position on the wire where the insulating coating is to be peeled off There was a possibility that the (peeling position) was slightly deviated due to variations in the wire diameter. That is, the wire diameter of the wire may be slightly different depending on the lot in which the supply wire is bundled in advance. In this case, the finished diameter of the coil when the wire is wound around the bobbin may change, and the winding amount of the wire may change somewhat. As a result, the peeling position on the wire may be shifted from the intended position.

  FIGS. 3A to 3C are explanatory diagrams showing the difference in the peeling position P1 of the end portion (wire end portion) 32a of the wire 32 of the coil 31. FIG. 3A to 3C, an insulating coating is applied to the surface of the coil 31 as shown in dark color, and the insulating coating is peeled off from the wire end portion 32a as shown in white. A boundary between the insulating coating portion and the peeling portion in the wire end portion 32a is set as a peeling position P1. Here, “P0” shown in FIGS. 3 (A) to 3 (C) means a standard peeling position P0 that should be used as a measure of the boundary between the insulating coating portion and the peeling portion. In FIG. The standard peeling position P0 matches the actual peeling position P1. On the other hand, the peeling position P1 in FIG. 3B is a position where the peeling is excessively about “about 4 mm” than the standard peeling position P0. The peeling position P1 of FIG. 3C is a position where peeling is insufficient by “about 5 mm” than the standard peeling position P0.

  For this reason, in the post-process of coil manufacture, when joining a wire to a predetermined terminal at the peeling position, there is a concern that a portion that is out of the peeling position of the wire is joined to the terminal, resulting in poor bonding quality. For example, FIG. 4 shows the stator 35 in a sectional view. In FIG. 4, a coil unit 37 formed by winding a coil 31 around a bobbin 36 is inserted into a tooth 38 a of a stator core 38 and attached, and a wire rod end 32 a of the coil 31 is connected to a connection terminal of a bus bar unit 39 attached to the stator core 38. 39a may be connected. In this case, as shown in FIG. 3C, if the insulation coating is insufficiently peeled at the wire end portion 32a, the connection between the wire end portion 32a and the connection terminal 39a may be poor, leading to a quality defect. was there.

  The present invention has been made in view of the above circumstances, and its purpose is to reduce the deviation of the peeling position due to the variation in the wire diameter of the wire, and to prevent the coil quality from being deteriorated in the subsequent process. It is providing the peeling apparatus and peeling method of a film.

  In order to achieve the above object, the invention according to claim 1 is a coil provided with a peeling device that is provided in a winding device for manufacturing a coil and peels off an insulating coating applied to the surface of a wire constituting the coil. In the insulating film peeling apparatus, the wire diameter measuring means for measuring the wire diameter of the wire supplied to the peeling means in advance, and the peeling position in the wire from which the insulating film is peeled off by the peeling means are set to the measured wire diameter. It is intended to include peeling position adjusting means for adjusting based on the above.

  According to the configuration of the invention described above, when the insulating coating applied to the surface of the wire in the vicinity of the end of the wire after winding the coil is peeled off by the peeling means, the wire diameter of the wire supplied to the peeling means is the wire diameter. The peeling position in the wire is measured in advance by the measuring means, and the peeling position adjusting means is adjusted based on the wire diameter measured in advance. Here, when the wire diameter of the wire is different from the standard wire diameter, the predetermined position to be peeled in the vicinity of the end of the wire after winding the coil is slightly deviated from the standard position. Since the peeling position is adjusted based on the wire diameter of the wire, the actual peeling position in the vicinity of the end of the wire is brought close to the standard position.

  In order to achieve the above object, the invention according to claim 2 is a coil insulating film peeling method for peeling an insulating film applied to the surface of a wire constituting the coil in the process of manufacturing the coil. The purpose is to measure the wire diameter of the wire in advance before the wire is peeled off, and to adjust the peeling position in the wire from which the insulating coating is peeled off according to the measured wire diameter.

  According to the configuration of the above invention, when the insulating coating applied to the surface is peeled in the vicinity of the end of the wire after winding the coil, the wire diameter of the wire before being peeled is measured in advance. The peeling position is adjusted according to the wire diameter measured in advance. Here, when the wire diameter of the wire is different from the standard wire diameter, the predetermined position to be peeled in the vicinity of the end of the wire after winding the coil is slightly deviated from the standard position. Since the peeling position is adjusted according to the wire diameter of the wire, the actual peeling position in the vicinity of the end of the wire is brought close to the standard position.

  According to invention of Claim 1 and 2, the shift | offset | difference of the peeling position resulting from the wire diameter variation of a wire can be reduced in the end part vicinity of the wire which finished winding a coil, and a peeling position is made into a post process. It can be adapted, and quality defects due to subsequent processes can be prevented.

  Hereinafter, an embodiment embodying a peeling apparatus and a peeling method for a coil insulating film according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic configuration diagram showing a winding device in this embodiment. In this embodiment, a winding device that manufactures a coil by simultaneously aligning and winding two wires 2 on a bobbin 1 will be described. This winding device includes a rotating shaft 3 that rotates the bobbin 1, and supplies the two wire rods 2 to the bobbin 1 while rotating the bobbin 1. This winding device includes two wire rods 4 in which supply wires are bundled in advance, a tensioner 5 that applies tension to each wire 2 drawn from the drums 4, and a wire diameter of each wire 2 drawn from the tensioner 5. Based on the measurement result of the wire diameter measuring device 6 for measuring, the peeling mechanism 7 for peeling the insulating coating applied to the surface of each wire 2 drawn from the wire diameter measuring device 6, and the wire diameter measuring device 6. In order to control the operation of the peeling mechanism 7, a central processing unit (CPU) 8 and a pair of nozzles 9 and a nozzle holder 10 for guiding each wire 2 drawn from the peeling mechanism 7 to the bobbin 1 are provided.

  The tensioner 5 applies tension to the plurality of pulleys 11A to 11C through the wire 2. In this embodiment, the wire diameter measuring device 6 is an optical measuring device, and a wire rod is disposed between the light projecting unit and the light receiving unit, and the difference in the amount of light emitted from the light projecting unit and received by the light receiving unit. From the above, the wire diameter of the wire is measured. This wire diameter measuring device 6 measures the wire diameter of each wire 2 individually. This wire diameter measuring device 6 corresponds to the wire diameter measuring means of the present invention. As the wire diameter measuring device 6, for example, “Dimension / Outer Diameter Measuring Device LS-7000 Series” manufactured by Keyence Corporation can be used.

  FIG. 2 is a schematic configuration diagram showing the nozzle unit 12 including the peeling mechanism 7. The nozzle unit 12 includes a first ball screw 14 supported horizontally on the machine base 13, a nozzle frame 15 provided on the machine base 13 so as to be movable along the first ball screw 14, and a nozzle frame 15. A second ball screw 16 supported horizontally and a peeling frame 17 provided on the nozzle frame 15 so as to be movable along the second ball screw 16 are provided. A nozzle holder 10 and a nozzle 9 are provided at one end (left end of the drawing) of the nozzle frame 15. The first ball screw 14 is rotationally driven by a first motor 18 fixed on the machine base 13. The second ball screw 16 is rotationally driven by a second motor 19 fixed on the nozzle frame 15. Each of the ball screws 14 and 16 extends along the same direction as the direction in which the wire 2 extends in order to supply the wire 2 toward the bobbin 1. The peeling mechanism 7 includes a peeling frame 17, a second ball screw 16, and a second motor 19. Therefore, by rotating the ball screws 14 and 16 forward and backward by the motors 18 and 19, the nozzle frame 15 and the peeling frame 17 approach or separate from the bobbin 1 along the ball screws 14 and 16, respectively. Become. The wire rod 2 that has passed through the wire diameter measuring device 6 passes through the peeling mechanism 7.

  The peeling mechanism 7 further includes an electric chuck 20 that can slidably contact the surface of the wire 2 so as to hold the wire 2. The peeling mechanism 7 includes two chucks 20 corresponding to each wire 2 (only one is shown). In order to peel off the insulating film applied to the surface of the wire 2, the wire 2 is moved while being gently held by the chuck 20, whereby the insulating film on the surface of the wire 2 is scraped off and peeled off. Here, in order to manufacture the coil, the bobbin 1 is rotated a predetermined number of times by the rotating shaft 3. The bobbin 1 is rotated to wind the wire 2 around the bobbin 1, and then the bobbin 1 is temporarily stopped to wind up immediately before the bobbin 1 is finished winding the wire 2. At this time, the CPU 8 drives the second motor 19 to move the peeling mechanism 7 along the wire 2 and operates the chuck 20 to peel off the insulating coating applied to the surface of the wire 2. The CPU 8 adjusts the moving range of the peeling mechanism 7 by controlling the second motor 19 based on the measurement result of the wire diameter of the wire 2 measured in advance by the wire diameter measuring device 6. Thereby, the movement position of the peeling mechanism 7 is adjusted, and the peeling position on the wire 2 is adjusted. Then, by rotating the bobbin 1 again, the wire 2 is wound around the bobbin 1 until the peeled portion, and the wire 2 is finished. Thereafter, the wire 2 is cut at the peeled portion to complete the manufacture of the coil. That is, in this embodiment, while the winding of the wire 2 around the bobbin 1 is stopped, the chuck 20 of the peeling mechanism 7 is moved and adjusted along the traveling direction of the wire 2 and the chuck 20 is operated, thereby insulating coating. The peeling position is adjusted. In this embodiment, each chuck 20 corresponds to the peeling means of the present invention. Further, the second ball screw 16, the peeling frame 17, the second motor 19 and the CPU 8 constitute a peeling position adjusting means of the present invention. Further, the nozzle frame 15 is moved along the first ball screw 14 by driving the first motor 18. The CPU 8 controls the motors 18 and 19 and the chucks 20 as appropriate.

  In this embodiment, by using the winding device as described above, the insulating coating is peeled off in order to peel off the insulating coating applied to the surface of the wire 2 constituting the coil in the process of manufacturing the coil. Before measuring, the wire diameter of the wire 2 is measured by the wire diameter measuring device 6 in advance, and the peeling mechanism 7 is operated according to the measured wire diameter, whereby the insulation film is peeled off at the end of the wire 2. The peeling method of adjusting the position is adopted.

  According to the coil insulation film peeling apparatus and the peeling method in this embodiment described above, the insulation film applied to the surface of the wire 2 near the end of the coil 2 after winding the coil is removed by the chuck 20 of the peeling mechanism 7. When peeling, the wire diameter of the wire 2 is measured in advance by the wire diameter measuring device 6, and the peeling position P1 (see FIGS. 3A to 3C) in the wire 2 is based on the wire diameter measured in advance. The CPU 8 and the peeling mechanism 7 are adjusted. Here, when the wire diameter of the wire 2 is different from the standard wire diameter, the peeling position P1 (see FIG. 3) to be peeled in the vicinity of the end of the wire 2 after winding the coil is the standard peeling position P0 (see FIG. 3). ). However, in this embodiment, since the peeling position P1 is adjusted based on the wire diameter of the wire 2, the actual peeling position P1 in the vicinity of the end of the wire 2 is brought close to the standard peeling position P0. For this reason, the shift | offset | difference of the peeling position P1 resulting from the wire diameter variation of the wire 2 can be reduced. As a result, when the wire 2 is joined to a predetermined terminal at the peeling position P1 in the post-process of coil manufacture (see FIG. 4), the portion suitable for the peeling position P1 of the wire 2 is joined to the terminal. It is possible to prevent bonding quality defects due to subsequent processes.

  In addition, this invention is not limited to the said embodiment, A part of structure can also be changed suitably and implemented in the range which does not deviate from the meaning of invention.

  (1) In the above embodiment, the optical measuring device is used to measure the wire diameter of the wire 2, but the wire diameter of the wire is measured using another type, for example, a contact type measuring device. It may be.

  (2) In the above-described embodiment, the peeling unit that peels the insulating coating of the wire 2 by loosely holding the wire 2 with the chuck 20 is employed, but the peeling unit is not limited to this method.

The schematic block diagram which shows a winding apparatus. The schematic block diagram which shows the nozzle unit containing a peeling mechanism. (A)-(C) are explanatory drawings which show the difference in the peeling position of a wire end part. Sectional drawing which shows a stator.

Explanation of symbols

2 Wire 6 Wire diameter measuring device (wire diameter measuring means)
7 Peeling mechanism 8 CPU (Peeling adjustment means)
16 Second ball screw (peeling adjustment means)
17 Peeling frame (peeling adjustment means)
19 Second motor (peeling adjustment means)
20 Chuck (peeling means)

Claims (2)

In the coil insulation film peeling apparatus provided with the winding device for manufacturing the coil and provided with a peeling means for peeling the insulation film applied to the surface of the wire constituting the coil,
Wire diameter measuring means for measuring in advance the wire diameter of the wire supplied to the peeling means;
A coil insulating film peeling apparatus comprising: a peeling position adjusting means for adjusting a peeling position in the wire from which the insulating film is peeled by the peeling means based on the measured wire diameter. . In the process of manufacturing the coil, in the method of peeling the coil insulating film, the insulating film applied to the surface of the wire constituting the coil is peeled off.
A coil characterized in that the wire diameter of the wire is measured in advance before the insulating coating is peeled off, and the peeling position in the wire from which the insulating coating is peeled is adjusted according to the measured wire diameter. Insulating film peeling method.

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