JP2008310880A - Near-field generating element and thermal assist element - Google Patents

Abstract

A near-field generating element that efficiently transmits a near field to an object and controls the distance to the object, and a heat assist element including the near-field generating element are obtained.
A near-field generating element including a light source and a near-field generating unit that is disposed on the light emission side of the light source and in which a near-field is excited by light from the light source. This near-field generating element is provided on a pair of heater units 3 provided on a base so as to have a predetermined interval, and a near-field generating unit provided on the pair of heater units 3 and supporting the near-field generating unit 2 Part support part 4. The near-field generating unit support unit 4 includes a pair of insulating units 6 and a pair of thermal deformation units 7 that expand and deform by heating. The near-field generating unit 2 has a protrusion 2 a and a recess 2 b that is directly irradiated with light from the light source 5, and is constructed so as to straddle the pair of thermal deformation units 7. The thermal assist element includes the near-field generating element.
[Selection] Figure 1

Description

  The present invention relates to a near-field generating element and a heat assist element using the near-field generating element.

  In recent years, various applications using a near field that is localized light have been developed. These applications make use of the property that light can be concentrated in the region below the diffraction limit. One of them is near-field exposure. The near-field exposure is a technique that exposes a resist or the like using a near-field generating element, and has attracted attention because it can expose a fine pattern. In addition, heat-assisted magnetic recording technology, which is a technology that realizes high-density recording by combining optical technology and magnetic recording / reproducing technology, has been studied.

  Various research and development have been conducted on optical recording media, magnetic recording media, and these recording / reproducing devices with the aim of increasing the capacity. However, the above-described heat-assisted magnetic recording technology is the next-generation high-density magnetic recording. It is attracting attention as a record. This technique performs magnetic recording on a magnetic recording medium having a high coercive force that is resistant to thermal fluctuations. Specifically, when a magnetic recording medium having a magnetic compensation point temperature at room temperature is irradiated with light, and the temperature of the magnetic recording medium is locally increased, the coercive force decreases at the portion where the temperature has increased, and thus it is usually used. Thus, magnetic recording with a magnetic head having a magnitude of the generated magnetic field becomes possible. In recent years, in order to perform higher density recording than the above-described heat-assisted magnetic recording technique, a heat-assisted magnetic recording technique using a near field has also been proposed (for example, see Patent Document 1 below). As described above, when a near field is used, a smaller area of the information recording medium can be heated, so that higher density recording is expected.

JP 2004-303299 A

  Since the near field is not propagating light but localized light, the light intensity rapidly attenuates as the distance from the near field generation region increases. Therefore, when performing near-field exposure using a near field or recording information on an information recording medium using a near field, the distance between the near-field generation region and an object (a master or information recording medium to be exposed) It is necessary to precisely control at the tens of nm level. However, such precise positioning is generally difficult, and a configuration for easily controlling the distance between the near-field generation region and the object is desired.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to transmit a near field to an object efficiently and control the distance to the object, An object of the present invention is to provide a thermal assist element including a near-field generating element.

Means and effects for solving the problems

(1) A near-field generating element of the present invention is a near-field generating element including a light source and a near-field generating unit that is disposed on the light emission side of the light source and is excited by light from the light source. , Having at least a pair of heater portions provided on the base so as to have a predetermined interval, and a pair of thermal deformation portions provided on the pair of heater portions and expanding and deforming by heating. A near-field generating unit supporting unit that supports the field generating unit, wherein the near-field generating unit has a depression that is directly irradiated with the light from the light source, and is disposed on the pair of thermal deformation units. It is built to straddle.

  According to the configuration of (1) above, by causing the pair of heater portions to generate heat, the heat is transmitted to cause the pair of thermally deformable portions to thermally expand, and the pair of thermally deformable portions approach each other. Therefore, both end portions of the near-field generating portion are displaced in a direction approaching each other. At this time, stress concentrates in the vicinity of the recessed portion of the near-field generating part, so that the periphery of the recessed portion is deformed so as to be pushed out to the side opposite to the light source side. Therefore, when the near-field generating element of the present invention is used for near-field exposure, the near-field generating region of the near-field generating unit can be arbitrarily moved. It becomes possible to control the distance. Alternatively, when the near-field generating element of the present invention is used as a thermal assist element, the distance between the magnetic recording medium and the near-field generating area can be controlled.

(2) In the near-field generating element of the above (2), it is preferable that a protrusion is provided on the side opposite to the light source side of the near-field generating unit.

  According to the configuration of (2) above, since the protrusion is provided on the side opposite to the light source side in the near-field generating part, the region where the near-field is excited can be localized around the protrusion. It becomes. In addition, in the near-field generating element, the portion closest to the object that irradiates the near-field can be a protrusion, so that the near-field is generated without bringing the object into contact with another part of the near-field generating element. It becomes easy to make an element and a target object (for example, magnetic recording medium) approach. Furthermore, since the depression is provided on the light source side, it becomes possible to displace the protrusion to the opposite side of the light source, that is, the object side by the heat generation of the heater part. For example, the magnetic recording medium) can be easily brought closer.

(3) In the magnetic reproducing element of the above (1) or (2), the near-field generating part support part is a pair formed between the pair of heater parts and the pair of thermal deformation parts. It is preferable that the thermal deformation portion is made of a conductive material.

  According to the configuration of (3) above, since the thermal deformation portion can be used as a current input electrode to the near field generation portion, a magnetic field can be generated in the near field generation portion and the heat deformation portion. In addition, since the thermally deformable portion is insulated from the heater portion, it is possible to prevent generation of an unnecessary magnetic field due to leakage current from the heater portion to the thermally deformable portion and the near field generating portion.

(4) In the magnetic reproducing element of (1) or (2), as another aspect, the near-field generating part support part is sandwiched between the pair of thermal deformation parts and the near-field generating part. It may have a pair of electrode portions provided as described above.

  According to the configuration of (4) above, the electrode portion can be used as a current input electrode to the near-field generating portion. Therefore, a magnetic field can also be generated in the near-field generating part and the electrode part.

(5) In the magnetic reproducing element of the above (4), the near-field generating portion support portion includes a pair of insulating portions formed between the pair of electrode portions and the pair of thermal deformation portions. It is preferable to have.

  According to the configuration of (5) above, since the heat transfer from the thermally deformable portion to the electrode portion can be reduced by the insulating portion, a change in resistance due to a temperature rise in the electrode portion can be suppressed. Therefore, it is possible to prevent a change in the magnitude of the magnetic field in the near-field generating part and the electrode part due to this resistance change.

(6) Moreover, in the magnetic reproducing element of the above (1) or (2), as another aspect, the thermal deformation portion may be in direct contact with the heater portion.

  According to the configuration of (6) above, since the heat deformation portion and the heater portion are in direct contact with each other, the heat transfer efficiency from the heater portion to the heat deformation portion is high, so that the heat deformation portion can be easily deformed. As a result, it is possible to reduce the power used to deform the near-field generating unit. Moreover, an excessive temperature rise of the entire near-field generating element can be prevented, and the life of the near-field generating element can be extended.

 (7) The thermal assist element of the present invention includes the near-field generating element according to any one of (1) to (6) above on a side surface of the slider.

  When the magnetic recording medium is heated by irradiating the magnetic recording medium by irradiating the magnetic recording medium with the heat assist element having the configuration of (7) above, the near field is supplied by supplying power to the heater unit. The distance between the generator and the magnetic recording medium can be controlled or brought closer. Therefore, it is possible to provide a heat assist element that can perform more stable recording or higher density recording on a magnetic recording medium as compared with the prior art. Moreover, if it is a heat assist element provided with the near-field generating element as described in any one of said (3)-(5) among the heat assist elements of the structure of said (7), arbitrary magnetic fields will be applied. Since it can be generated, magnetic recording using a heat assist technique can also be performed.

<First Embodiment>
The near-field generating element according to the first embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is a schematic view showing a near-field generating element according to the first embodiment of the present invention as seen from the negative direction side of the X axis, and FIG. 1B is seen from the positive direction side of the Z axis. It is a schematic diagram showing a near-field generating element according to the first embodiment of the present invention.

  The near-field generating element of this embodiment is configured on a substrate 1 and includes a near-field generating unit 2, a pair of heater units 3, a near-field generating unit support unit 4, and a light source 5. Yes. In addition, as a material of the board | substrate 1, metals, such as glass, ceramics, a silicon | silicone, aluminum, can be utilized, for example. When used as a heat-assisted magnetic recording head, a material usually used as a slider material may be used, and AlTiC can be used. However, when an electrically conductive material is used for the substrate 1, an insulating portion is provided between the substrate 1 and the light source 5, a pair of heater portions 3 to be described later, and each power supply wiring. There is a need.

  The near-field generating unit 2 has a protrusion 2 a formed on the end side of the substrate 1 and a recess 2 b formed on the center side of the substrate 1, and on the surface near the end of the substrate 1. It is supported on the substrate 1 through the formed near-field generating part support part 4. The near-field generating unit 2 is preferably a material that excites an efficient near-field by irradiating light from the light source 5. Examples of such a material include gold, silver, platinum, and titanium. Furthermore, since the near-field generating part 2 is directly supported by the thermal deformation part 7 in the near-field generating part support part 4 described later, if the thermal deformation part 7 and the near-field generating part 2 are made of the same material, Mutual adhesion can be improved and problems such as peeling can be avoided.

  The pair of heater portions 3 are formed on the surface of the substrate 1 so as to have a predetermined interval. Since the pair of heater portions 3 are desirably members that efficiently generate Joule heat by applying an electric current, metals, metal oxides, metal nitrides, and silicon oxides that are usually used as insulating materials Silicon nitride or the like can be used. Note that power supply wiring is connected to each pair of heater units 3 so that a current flows independently through each pair of heater units 3. More specifically, in FIG. 1, the power supply wiring to the left layer of the pair of heater units 3 is the wiring 3a and the wiring 3b, and the power supply wiring to the right layer of the pair of heater units 3 is the wiring 3c. And wiring 3d. Joule heat is generated by passing a current through the pair of heater portions 3 using these wirings 3a, 3b, 3c, and 3d, and the pair of heater portions 3 generates heat.

  The near-field generating part support part 4 includes a pair of insulating parts 6 formed on the upper part of the pair of heater parts 3 and a pair of thermal deformation parts 7 formed on the upper part of the pair of insulating parts 6. It is configured. Here, the relationship between the near-field generating unit 2 and the near-field generating unit support 4 will be described in more detail. The near-field generating unit 2 is placed on the pair of thermal deformation units 7 in the near-field generating unit support 4. It is built to straddle.

  A material having high resistance is used for the pair of insulating portions 6. Such materials include metal oxides, metal nitrides, silicon oxides, silicon nitrides, and the like. Resin materials can also be used, but they are not suitable for the film formation process, so the mass productivity is deteriorated.

  A material that thermally expands when heat is applied is used for the pair of thermally deformable portions 7. In particular, if the material has a large coefficient of thermal expansion, it can be greatly deformed with a small amount of heat, so that the amount of power used can be reduced. As such a material, there are a resin material and a metal material, and the metal material is more preferable from the viewpoint of thermal stability and the magnitude of the deformation force. Moreover, when using as an electrode, a conductive material is used. The magnitude of the deforming force is the magnitude of the force that deforms the near-field generating unit 2 by the deformation of the thermal deformation unit 7, but even if the material has a simply large thermal expansion coefficient. A resin material having a low Young's modulus is difficult to obtain a force for deforming the near-field generating unit 2. Therefore, a metal material having a large thermal expansion coefficient and Young's modulus is desirable. However, when the near-field generating part 2 is a very small material, it can be deformed even if the thermal deformation part 7 is a resin material. Therefore, an appropriate material should be used in a timely manner according to the required deformation amount. It ’s fine. As the metal material, copper, nickel, aluminum, silver, gold, cobalt, platinum, or the like is desirable because of its large thermal expansion coefficient. In addition, since a metal material can be formed by a film forming apparatus and patterned by photolithography, etching, or the like, an element can be easily created compared to a resin.

  The light source 5 is fixed in the vicinity of the center on the surface of the substrate 1 via a light source support portion 8 that is a solder layer, and is disposed so that the light emitting portion faces the recess 2 b of the near-field generating portion 2. ing. The light source 5 is a semiconductor laser, and an electrode pattern 5a for feeding and an electrode pattern 5b are formed on the upper and lower parts, respectively. Here, a semiconductor laser is used for the light source 5, but instead of the semiconductor laser, for example, light from a light source such as a semiconductor laser is transmitted to the near-field generating unit via an optical fiber, an optical waveguide, or a lens. It may be configured to irradiate. Further, although not shown, the light source 5 may be provided on a base separate from the near-field generating unit 2.

  In addition, the light emitted from the light source 5 (the portion indicated by the dotted line between the near-field generating unit 2 and the light source 5 in FIG. 1A) is applied to the depression 2b of the near-field generating unit 2, A near field (a dotted line portion around the tip portion of the protrusion 2 a in FIG. 1A) is excited on the surface of the near field generator 2 on the protrusion 2 a side. Here, since the near-field generating part 2 is provided with the protrusion 2a, the region where the near-field is excited can be localized around the protrusion 2a. Further, in the near-field generating element, the portion closest to the object that irradiates the near-field can be the protrusion 2a, so that the other part of the near-field generating element and the object (for example, a magnetic recording medium) The near-field generating element and the object can be brought close to each other without bringing them into contact with each other.

  Next, with reference to FIG. 2, a state when the near-field generating unit 2 in the near-field generating element of the present embodiment is deformed will be described. Note that the near-field generating unit 2 in FIG. 2A and the pair of thermal deformation units 7 in FIG. 2B are illustrated with a dotted line and a solid line. The subsequent shape is schematically shown.

  First, when the pair of heater portions 3 generate heat, the heat is transferred to the pair of heat-deformed portions 7 through the pair of insulating portions 6. The pair of thermally deformable portions 7 are thermally expanded and deformed when heat is applied (see FIG. 2A). As a result, the pair of thermal deformation parts 7 supporting both ends of the near-field generating part 2 expands in the direction (Y direction) approaching each other (illustrated by arrows in FIG. 2B). ). As described above, the near-field generating unit support 4 is deformed, so that both ends of the near-field generating unit 2 supported by the near-field generating unit support 4 also move from the both ends toward the central portion in the Y direction. The power of will be added.

  The depression direction (Z direction) of the depression 2b made of an arc-shaped depression centering on the center of the near field generation unit 2 and the direction in which the near field generation unit support unit 4 approaches each other (Y direction) are: Since it has the projection part 2a which protrudes toward the opposite side to the light source 5 side so that it may mutually orthogonally cross in the near field generation | occurrence | production part 2 and opposes the hollow 2b, a near field generation | occurrence | production part Since stress concentrates on the periphery of the recess 2b of No. 2, the periphery of the recess 2b is pushed out to the side opposite to the light source 5 side, and the near-field generating part 2 is deformed toward the side opposite to the light source 5 side. To do. Accordingly, the protrusion 2a provided in the near-field generating part 2 moves in a direction away from the light source 5, and the near-field generation region generated at the tip of the protrusion 2a is also accompanied by the movement of the protrusion 2a. Moving.

  With the configuration as described above, the position of the near field generation region of the near field generation unit 2 can be moved. Therefore, when the near field generation element of this embodiment is used for near field exposure, It becomes possible to control the distance between the master to be exposed and the near-field generation region. Alternatively, when the near-field generating element of the present embodiment is used as a thermal assist element, the distance between the magnetic recording medium and the near-field generating area can be controlled.

  Further, in the near-field generating unit 2, since the protrusion 2a is provided on the side opposite to the light source side, the region where the near-field is excited can be localized around the protrusion 2a. Further, in the near-field generating element of the present embodiment, the portion closest to the object to be irradiated with the near-field can be the protrusion 2a, so that the object is brought into contact with the other part of the near-field generating element. This makes it easy to bring the near-field generating element and the object (for example, a magnetic recording medium) close to each other. Furthermore, since the recess 2b is provided on the light source side, the protrusion 2a can be displaced to the opposite side of the light source, that is, the object side by the heat generated by the pair of heater units 3, so that the near field It becomes easier to bring the generating element and the object (for example, a magnetic recording medium) closer to each other. Therefore, when the near-field generating element of this embodiment is used as a thermal assist element, the distance between the near-field generating part 2 and the magnetic recording medium is controlled by the power supply to the pair of heater parts 3, or the approach Therefore, more stable recording or higher density recording is possible.

Second Embodiment
Next, a near-field generating element according to the second embodiment of the present invention will be described. FIG. 3A is a schematic view showing a near-field generating element according to the second embodiment of the present invention as viewed from the negative direction side of the X axis, and FIG. 3B is a view as viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 2nd Embodiment of this invention. In addition, the code | symbol 11 and 13-18 are attached | subjected in order to the part similar to the codes | symbols 1 and 3-8 of 1st Embodiment, and the description may be abbreviate | omitted.

  The near-field generating element according to the present embodiment has substantially the same part as that of the first embodiment. (1) When the near-field generating unit 12 is viewed from the negative direction side of the X axis, the substantially boomerang shape is obtained. (2) Instead of the protrusion 2a and the recess 2b, the near-field generating part 12 has an arcuate tip 12a and a recess 12b, and (3) X When viewed from the negative direction side of the shaft, the tip portion 12a substantially coincides with the edge (end surface) of the substrate 11, and (4) a pair of heater portions 13 so as to match the shape of the near-field generating portion 12. The near-field generating part support part 14 (a pair of insulating parts 16 and a pair of thermally deformable parts 17) is different in that it is disposed on the substrate 11.

  By adopting such a configuration, the same operation and effect as in the first embodiment can be obtained, and the near-field generating unit support unit 14 can be provided to the distal end portion 12a (near-field generating region) of the near-field generating unit 12. Since it can be arranged on the light source 15 side, it is easy to project only the near-field generating region of the tip end portion 12a toward the object side and to approach the object that irradiates the near-field. Note that the following third embodiment can be modified as in the present embodiment.

<Third Embodiment>
Next, a near-field generating element according to the third embodiment of the present invention will be described. FIG. 4A is a schematic view showing a near-field generating element according to the third embodiment of the present invention viewed from the negative direction side of the X axis, and FIG. 4B is a view viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 3rd Embodiment of this invention. In addition, the code | symbols 21-23, 25-28 are attached | subjected in order to the part similar to the codes 1-3, 5-8 of 1st Embodiment, The description may be abbreviate | omitted.

  The near-field generating element according to the present embodiment has substantially the same portion as that of the first embodiment. (1) The near-field generating unit support unit 24 is placed on the pair of heater units 23 on the substrate 21. A pair of thermal deformation portions 27, a pair of insulating portions 26, and a pair of near-field generating portion support auxiliary portions 29, which are sequentially laminated from the side, (2) a pair of near-field generating portions The point that the near field generation part 22 is formed on the support auxiliary part 29 so as to straddle between the pair of near field generation part support auxiliary parts 29 is different from the first embodiment.

  For the pair of near-field generating unit supporting auxiliary units 29, the same material as that constituting the near-field generating unit 22 is used. Thereby, the adhesiveness of a pair of near field generating part support auxiliary | assistant part 29 and the near field generating part 22 can be improved, and problems, such as peeling, can be avoided.

  Next, with reference to FIG. 5, a state when the near-field generating unit 22 in the near-field generating element of the present embodiment is deformed will be described. 5A, the pair of thermal deformation sections 27, the pair of insulating sections 26, and the pair of near-field generation section support auxiliary sections 29 in FIG. However, the dotted line and the solid line schematically show the shape before deformation, and the solid line schematically shows the shape after deformation.

  First, when the pair of heater portions 23 generate heat, the heat is transferred to the pair of heat deformation portions 27. The pair of thermal deformation portions 27 are thermally expanded and deformed when heat is applied. As a result, a pair of thermal deformation portions 27, a pair of insulating portions 26 supported in contact with the pair of thermal deformation portions 27, and a pair of near-field generating portion support auxiliary portions 29 are paired. The near-field generating part support parts 24 that support the both ends of the near-field generating part 22 are deformed by the force accompanying the deformation of the thermal deformation part 27 (force in the Y direction in FIG. 5). Direction) (shown by arrows in FIG. 5). By the deformation of the near-field generating unit support 24, a force in the Y direction is also applied to the near-field generating unit 22 supported by the near-field generating unit support 24.

  The depression direction (Z direction) of the depression 22b formed of an arc-shaped depression centering on the center of the near field generation unit 22 and the direction in which the near field generation unit support unit 24 approaches each other (Y direction) are: Since the near-field generating part 22 has projections 22a that project toward the opposite side to the light source 25 side so as to be orthogonal to each other and to face the opposite side of the recess 22b in the near-field generating part 22, Since stress concentrates around the depression 22b portion of 22, the vicinity of the depression 22b is pushed out to the opposite side to the light source 25 side, and the near-field generating part 22 is deformed toward the opposite side to the light source 25 side. To do. Accordingly, the protrusion 22a provided in the near-field generating unit 22 moves in a direction away from the light source 25, and the near-field generation region generated at the tip of the protrusion 22a is also accompanied by the movement of the protrusion 22a. Moving.

  By adopting such a configuration, the same operations and effects as in the first embodiment can be achieved. Since the pair of heater portions 23 directly support the pair of heat deformable portions 27, the heat transfer efficiency from the pair of heater portions 23 to the pair of heat deformable portions 27 is high, and thus As a result, the electric power used for deforming the near-field generating unit 22 can be reduced. Therefore, an excessive temperature rise of the near-field generating element can be prevented.

  Here, as a modification, the pair of near-field generating unit supporting auxiliary units 29 may be formed of a conductive material and used as an electrode. As a result, the near-field generating element of this modification can be applied to a thermally-assisted magnetic recording / reproducing element as a near-field and magnetic field generating element. In this case, the pair of near-field generating unit support auxiliary portions 29 is made of, for example, a metal member, and wirings for applying a recording current are connected to both ends of the pair of near-field generating unit support auxiliary units 29 by 1 A current can be applied to the pair of near-field generating unit support auxiliary unit 29 and the near-field generating unit 22.

  With this configuration, the pair of near-field generating unit support auxiliary units 29 can be used as current input electrodes to the near-field generating unit 22, so that the near-field generating unit 22 and the pair of near-field generating units can be used. A magnetic field can be generated in the generator support auxiliary unit 29. In addition, since the pair of insulating portions 26 is disposed between the pair of thermal deformation portions 27 and the pair of near-field generating portion support auxiliary portions 29, the heat from the pair of heat deformation portions 27 is generated. Transmission to the near-field generating unit 22 can be reduced. Therefore, it is possible to suppress a change in resistance due to a temperature rise in the near-field generating part support part 24, and it is possible to prevent a change in the magnitude of the generated magnetic field due to the resistance change.

  In addition, since the pair of near-field generating unit supporting auxiliary units 29 can be used as a magnetic field generating unit, the configuration of the heat-assisted magnetic recording element can be simplified. Further, since the near-field generating unit 22 serves as both a magnetic field generating unit and a near-field generating unit, the near field generating region and the magnetic field generating region can be integrated into the target by simply heating the pair of heater units 23. It can be brought close to a magnetic recording medium that is an object.

<Fourth embodiment>
Next, a near-field generating element according to the fourth embodiment of the present invention will be described. FIG. 6A is a schematic view showing a near-field generating element according to the fourth embodiment of the present invention viewed from the negative direction side of the X axis, and FIG. 6B is viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 4th Embodiment of this invention. In addition, the code | symbol 31-38 is attached | subjected in order to the part similar to the code | symbol 1-8 of 1st Embodiment, and the description may be abbreviate | omitted.

The near-field generating element according to the present embodiment has substantially the same part as that of the first embodiment, but (1) the magnetoresistive effect element 39 is on the substrate 31 and the pair of heater portions 33 (2) Power is supplied to the magnetoresistive effect element 39 at both ends of the magnetoresistive effect element 39, and the magnetoresistive effect element 39 is interposed between the pair of heater portions 33. (3) the wiring 39a and the wiring 39b, and the power supply wirings 37a and 37b for supplying power to the pair of thermal deformation portions 37; The electrode pattern 35a ₂ connected to the upper electrode pattern 35a ₁ of the light source 35 is in the direction opposite to the near-field generating part 32 on the side surface of the substrate 31 (slider) (the negative direction in the Z direction in FIG. 6). Formed point, ( ) That near-field generating unit 32 is formed always in a conductive material, different from the first embodiment.

  Here, the path of the recording current and the state of the generated magnetic field in the near-field generating element according to the present embodiment will be described. 7A and 7B show the path of the recording current and the state of the generated magnetic field. 7A and 7B, a thick arrow line is a path of a recording current flowing through the pair of thermal deformation portions 37 and the near-field generating portion 32, and a thin arc-shaped arrow line in FIG. The state of the generated magnetic field is shown. The direction of the magnetic field changes depending on the direction of the recording current. Here, a pair of insulating portions 36 are provided between the pair of heater portions 33 and the pair of thermal deformation portions 37. This is to prevent generation of an unnecessary magnetic field by preventing a current for generating heat from the pair of heater units 33 from leaking to the pair of thermal deformation units 37 or the near-field generation unit 22.

  According to the near-field generating element according to the present embodiment, the same operations and effects as in the first embodiment can be achieved. In addition, a pair of members that support the near-field generating unit 32 by applying a current corresponding to the recording signal to the near-field generating unit 32 via the pair of thermal deformation units 37 by the wires 37a and 37b. A magnetic field is generated around the thermal deformation unit 37 and the near-field generating unit 32, and the magnetic recording medium is heated in the near field generated by the near-field generating unit 32, whereby a magnetic signal is transmitted to the magnetic recording medium. It becomes possible to record. Therefore, heat-assisted magnetic recording can be performed. Further, the signal recorded on the magnetic recording medium can be read out by the magnetoresistive element 39.

  When the near-field generating element according to the present embodiment is used as a thermally assisted magnetic recording / reproducing element, the end surface of the substrate 31 (slider) in FIG. 8 on the magnetic recording medium 41 side is so-called ABS (Air Bearing Surface). The near field, the magnetic field generating part, and the magnetoresistive effect element are provided at substantially the same surface position. For example, as shown in FIG. 8, the heat-assisted magnetic recording / reproducing element is attached to a suspension 42, and floats on the magnetic recording medium 41 by a predetermined flying height by rotating the magnetic recording medium 41. In each of the other embodiments, it can be similarly attached to a suspension and used as a heat assist element or a heat assist magnetic recording / reproducing element.

Further, the wiring 39a and the wiring 39 b, 1 pair of wires 37a for power supply to the thermal deformation portions 37, 37b and the electrode 35a ₂ connected to the upper electrodes 35a ₁ of the light source 35, a substrate 31 (slider) Is formed in a direction opposite to the near-field generating portion 32 (a negative direction in the Z direction in FIG. 6), and therefore an electrode portion (not shown) provided on the suspension 42 to which the substrate 31 (slider) is attached. ) Can be easily joined.

<Fifth Embodiment>
Next, a near-field generating element according to the fifth embodiment of the invention is described. FIG. 9A is a schematic diagram showing a near-field generating element according to the fifth embodiment of the present invention viewed from the negative side of the X axis, and FIG. 9B is viewed from the positive side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 5th Embodiment of this invention. In addition, the code | symbol 51,53-58 is attached | subjected sequentially to the part similar to the code | symbol 31,33-38 of 4th Embodiment, The description may be abbreviate | omitted.

  The near-field generating element according to the present embodiment has substantially the same part as that of the fourth embodiment. (1) When the near-field generating unit 52 is viewed from the negative direction side of the X axis, the substantially boomerang shape is obtained. (2) A point in which the near-field generating part 52 has an arcuate tip 52a and a recess 52b instead of the protrusion 32a and the three depressions 2b, (3) When viewed from the negative direction side of the X-axis, the tip 52a is substantially coincident with the edge (end face) of the substrate 51, and (4) a pair of heater portions so as to match the shape of the near-field generating portion 52 53 and the near-field generating part support part 54 (a pair of insulating parts 56 and a pair of heat-deformed parts 57) are different on the substrate 51.

  By adopting such a configuration, the same operation and effect as in the first embodiment can be obtained, and the near-field generating unit support 54 can be provided to the distal end 52a (near-field generating region) of the near-field generating unit 52. Since it can be arranged on the light source 55 side, it is easy to project only the near-field generating region of the tip 52a toward the object side and to approach the object that irradiates the near-field. Note that the sixth embodiment described below can be modified in substantially the same way as the present embodiment.

  Further, when the near-field generating element according to the present embodiment is applied to a thermally-assisted magnetic recording / reproducing element, the tip part (tip part 52a) of the arc-shaped protrusion of the near-field generating part 52 is placed on the substrate 51 (slider ) In the Z direction (the surface side close to the magnetic recording medium) in the Z direction. By adopting such a configuration, the pair of heater portions 53 can be moved away from the end surface in the Z direction of the substrate 51 (slider) toward the light source 55, so that the pair of heater portions 53 are applied to heat the pair of heater portions 53. The influence on the magnetic recording due to the unnecessary magnetic field generated by the generated current can be suppressed.

<Sixth Embodiment>
Next, a near-field generating element according to the sixth embodiment of the invention will be described. FIG. 10A is a schematic diagram showing a near-field generating element according to the sixth embodiment of the present invention viewed from the negative side of the X axis, and FIG. 10B is viewed from the positive side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 6th Embodiment of this invention. In addition, the code | symbols 61-68 are attached | subjected in order to the part similar to the codes | symbols 31-38 of 4th Embodiment, The description may be abbreviate | omitted.

  The near-field generating element according to the present embodiment has substantially the same part as that of the fourth embodiment, but (1) a pair of insulating portions 70 are formed on a pair of thermal deformation portions 67. (2) The near field generating part 62 is integrally formed so as to be sandwiched between the pair of insulating parts 70, and (3) the pair of electrodes 71 are connected to the pair of insulating parts 70 and the proximity. The point formed on the field generating part 62, (4) The point that the wirings 71a and 71b connected to the pair of electrodes 71 are formed on the substrate 61 instead of the wirings 57a and 57b. 5) The difference is that the pair of thermal deformation portions 67 is the same as the pair of thermal deformation portions 7 in the first embodiment.

  In the fourth embodiment, a current is applied to the near-field generating unit via a member located on the substrate (slider) side. Specifically, a current is applied to the near-field generating unit via a pair of thermal deformation units located on the substrate (slider) side. With such a configuration, the magnetic field is concentrated on the substrate (slider side) with respect to the near-field generating portion. On the other hand, in the case of the near-field generating element according to the present embodiment, by applying a current to the pair of electrodes 71 and the near-field generating unit 62 via the wirings 71a and 71b, FIG. , (B) current paths are formed. Accordingly, a magnetic field is formed around the pair of electrodes 71 and the near-field generating unit 62 by this current, but the current is disposed on the side opposite to the substrate 61 (slider) side with respect to the near-field generating unit 62. By applying a current through a pair of electrodes 71 which are the members, the magnetic field can be concentrated on the side of the near-field generating unit 62 opposite to the substrate 61 (slider) side. Other effects are the same as in the first embodiment.

  As shown in FIG. 11B, the pair of insulating portions 70 is formed so that the current path is substantially U-shaped in the vicinity of the near-field generating portion 62, and the pair of electrodes 71 is formed. When forming by a film process or a photolithography process, the near-field generating part 62 and the pair of insulating parts 70 are arranged so as to constitute one plane. Accordingly, if the pair of electrodes 71 can be formed without forming the pair of insulating portions 70, the pair of insulating portions 70 is not necessarily required.

  The present invention can be changed in design without departing from the scope of the claims, and is not limited to the above-described embodiments and modifications. For example, the near-field generating unit in each embodiment may be transformed into any of the shapes shown in FIGS. 12 (a), (b), and (c). Specifically, the near-field generating unit 81 in FIG. 12A has a protrusion 81a and a recess 81b made of a notch, and in the near-field generating unit 82 in FIG. In FIG. 12, a recess 83b made of an arc-shaped recess similar to the near-field generating part 2 of the first embodiment is formed, but the projecting part 2a is not formed but is a flat surface. In the near-field generating part 83 of c), a recess 83b composed of an arc-shaped recess is formed as in the near-field generating part 2 of the first embodiment, but provided on the surface opposite to the recess 83b. The protruding portion 83a has the same arc shape as that of the recess 83b.

  Further, when the near-field generating element of each of the above embodiments is used as a thermal assist element, any one of the above-described embodiments and modified examples of the near-field generating element is provided on the side surface of the slider. The generator is disposed so as to face the magnetic recording medium. According to these heat assist elements, it is possible to perform more stable recording or higher density recording on the magnetic recording medium as compared with the conventional case. In addition, among the near-field generating elements of each of the above embodiments, magnetic recording using a heat assist technique can be performed as long as it is a heat assist element that can generate a magnetic field.

  Moreover, in each said embodiment, the example which provided a pair of insulation part in a part of near field generation | occurrence | production part support part was demonstrated. However, the purpose of the pair of insulating portions is to prevent the current for generating heat from the pair of heater portions from entering the near-field generating portion and generating an unnecessary magnetic field. When the element is used only as a near-field generating element, it is not always necessary to provide it. That is, the near-field generating element of the present invention is provided with an insulating part that prevents current from flowing from the pair of heater parts to the near-field generating part at an appropriate location of the near-field generating part support part. Can be used as a near-field and magnetic field generating element.

  Further, the amount of movement of the position of the near-field generation region due to the deformation of the near-field generation unit varies depending on the application to be used. For example, when used for a heat-assisted element or a heat-assisted magnetic recording element, the current standard slider flying height (gap between the recording / reproducing element and the magnetic recording medium) is around 10 nm, so the amount of movement is also several. It may be about nm. In order to obtain such an element, it is possible to design using an electric-thermal-structure coupled analysis simulation or the like.

(A) is a schematic diagram showing the near-field generating element according to the first embodiment of the present invention as viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention as viewed from the positive direction side of the Z axis. It is a mimetic diagram showing the near field generating element concerning one embodiment. In the near field generating element concerning a 1st embodiment of the present invention, it is a mimetic diagram for explaining a situation at the time of a near field generating part changing, and (a) was seen from the negative direction side of the X-axis. The schematic diagram which shows the near field generation | occurrence | production part and near field generation | occurrence | production part support part of this near field generation element, (b) is a schematic diagram which shows this near field generation element seen from the positive direction side of the Z-axis. (A) is a schematic diagram showing a near-field generating element according to the second embodiment of the present invention as viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention as viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near field generating element which concerns on 2 embodiment. (A) is a schematic diagram showing a near-field generating element according to the third embodiment of the present invention as viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention as viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 3rd Embodiment. In the near-field generating element which concerns on 3rd Embodiment of this invention, it is a schematic diagram for demonstrating the mode at the time of a near-field generating part deform | transforming, Comprising: (a) was seen from the negative direction side of the X-axis The schematic diagram which shows the near field generation | occurrence | production part and near field generation | occurrence | production part support part of this near field generation element, (b) is a schematic diagram which shows this near field generation element seen from the positive direction side of the Z-axis. (A) is a schematic diagram showing a near-field generating element according to a fourth embodiment of the present invention viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 4 embodiment. In the near-field generating element according to the fourth embodiment of the present invention, it is a schematic diagram for explaining the relationship between the current flowing in the near-field generating part and the pair of thermal deformation parts and the magnetic field, (a), The schematic diagram which shows the near field generation | occurrence | production part and near field generation | occurrence | production part support part of this near field generation element seen from the negative direction side of X-axis, (b) is this near field generation element seen from the positive direction side of Z axis It is a schematic diagram which shows. It is a schematic diagram which shows a mode that the near field generating element shown in FIG. 7 was attached to the suspension. (A) is a schematic diagram showing a near-field generating element according to the fifth embodiment of the present invention viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 5 embodiment. (A) is a schematic diagram showing a near-field generating element according to the sixth embodiment of the present invention as viewed from the negative direction side of the X axis, and (b) is a schematic diagram of the present invention as viewed from the positive direction side of the Z axis. It is a schematic diagram which shows the near-field generating element which concerns on 6 embodiment. In the near-field generating element according to the sixth embodiment of the present invention, a schematic diagram for explaining the relationship between the current flowing in the near-field generating part and the pair of thermal deformation parts and the magnetic field, (a), The schematic diagram which shows the near field generation | occurrence | production part and near field generation | occurrence | production part support part of this near field generation element seen from the negative direction side of X-axis, (b) is this near field generation element seen from the positive direction side of Z axis It is a schematic diagram which shows. It is a schematic diagram which shows the modification of the near field generation | occurrence | production part in each embodiment.

Explanation of symbols

1, 11, 21, 31, 51, 61 Substrate 2, 12, 22, 32, 52, 62, 81, 82, 83 Near-field generating portions 2a, 22a, 32a, 62a, 81a, 83a Protruding portions 2b, 22b, 32b, 62b, 81b, 82b, 83b Depression 3, 13, 23, 33, 53, 63 A pair of heater portions 3a, 3b, 3c, 3d, 13a, 13b, 13c, 13d, 33a, 33b, 33c, 33d, 37a, 37b, 39a, 39b, 53a, 53b, 53c, 53d, 57a, 57b, 59a, 59b, 63a, 63b, 63c, 63d, 69a, 69b, 71a, 71b Wiring 4, 14, 24, 34, 54, 64 near-field generating unit supporting portion 5, 15, 25, 35,55,65 sources _{5a, 5b, 15a, 15b,} 35a 1, 35a 2, 35b, 55a 1, 55 _{2, 55b, 65a 1, 65a} 2, 65b electrode pattern 6,16,26,36,56,66,70 pair of insulating portions 7,17,27, 37,57,67 a pair of heat-deformable portion 8, 18, 28, 38, 58, 68 Light source support portions 12a, 52a Tip portions 12b, 52b Recess 29 Near field generating portion support auxiliary portions 35a ₁ , 35a ₂ Electrodes 39, 59, 69 Magnetoresistive element 41 Magnetic recording medium 42 Suspension 54 Near-field generating part support part 71 Electrode

Claims (7)

In a near-field generating element comprising a light source and a near-field generating unit that is arranged on the light emission side of the light source and in which a near-field is excited by light from the light source,
A pair of heater portions provided on the base so as to have a predetermined interval;
A pair of near-field generating parts that are provided on the pair of heater parts, have at least a pair of heat-deformed parts that expand and deform by heating, and support the near-field generating part; and
The near-field generating element has a recess that is directly irradiated with the light from the light source, and is constructed so as to straddle over the pair of heat-deformed parts. .   The near-field generating element according to claim 1, wherein a projection is provided on a side opposite to the light source side of the near-field generating unit. The near-field generating part support part has a pair of insulating parts formed between the pair of heater parts and the pair of thermal deformation parts,
The near-field generating element according to claim 1, wherein the thermal deformation portion is made of a conductive material.   The near-field generating part support part has a pair of electrode parts provided so as to be sandwiched between the pair of thermal deformation parts and the near-field generating part. 3. A near-field generating element according to 2.   The said near field generation | occurrence | production part support part has a pair of insulation part formed between the said 1 pair of electrode part and the said 1 pair of heat deformation part, The Claim 4 characterized by the above-mentioned. Near-field generating element.   The near field generating element according to claim 1, wherein the thermal deformation portion is in direct contact with the heater portion. A thermal assist element comprising the near-field generating element according to claim 1 on a side surface of the slider.

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