JP2009098625A - Electro-optical device, its manufacturing method, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device, capable of preventing unnecessary conduction or electric short-circuit at an end of an FPC (flexible printed circuit) even in a case in which no molding material is applied. <P>SOLUTION: The liquid crystal display device 100 is provided with the FPC 51 having a terminal 56a formed thereon, a liquid crystal panel having a terminal 52a electrically connected to the terminal 56a, and an ACF (anisotropic conductive film) 70 disposed between the FPC 51 and the liquid crystal panel to adhere the terminal 56a to the terminal 52a. The ACF 70 covers an end surface 56y of the terminal 56a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device suitable for displaying various types of information, a method for manufacturing the same, and an electronic apparatus.

  In general, a liquid crystal display device which is one of electro-optical devices mainly functions as a display panel, a liquid crystal display panel in which liquid crystal is sandwiched between two substrates, an LED (Light Emitting Diode), and the like. And a lighting device configured by a light guide plate having an end surface of the light source.

  In such a liquid crystal display device, the lighting device is housed in a frame-shaped frame, and the liquid crystal display panel is bonded to the frame with a double-sided tape. A driving IC for driving the liquid crystal display panel is installed on the substrate of the liquid crystal display panel, and is connected to an external electronic component via a flexible printed circuit (FPC). Here, in order to prevent the terminal of the flexible substrate from being exposed at the end face of the flexible substrate connected to the driving IC, a molding material is applied to the exposed terminal portion.

  Patent Document 1 listed below describes a method for preventing melting of the FPC terminal even in a harsh environment by forming the tip of the FPC so that the terminal is disposed inside the outer shape of the film substrate. ing.

JP 2007-26846 A

  From the viewpoint of rationalizing the manufacturing process, it is desirable that the step of applying the molding material can be omitted. However, if the end face of the FPC is exposed without applying the molding material, if the FPC terminal is melted in an environment of high temperature or the like, unnecessary conduction between the melted portion and other wiring is caused by contact between the melted portion and other wiring. There is a problem that an electrical short occurs. In addition, when condensation occurs on the liquid crystal display panel and the condensation comes into contact with the end face of the FPC and other wiring, there is a problem that an electrical short circuit occurs between them.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical device according to this application example includes an interface substrate on which a first terminal is formed, a display panel including a second terminal electrically connected to the first terminal, An adhesive member that is provided between the interface substrate and the display panel and that bonds the first terminal and the second terminal; and the adhesive member covers an end surface of the first terminal. It is characterized by.

  According to this configuration, the display panel, the interface substrate, and the adhesive member are provided. The display panel and the interface substrate are electrically connected via an adhesive member and bonded to each other. The interface board includes a first terminal and a base material that covers and protects the first terminal. The adhesive member is formed so as to cover the first terminal of the interface substrate, and is adhered to the end surface of the first terminal. As a result, since the end surface of the first terminal of the interface board is covered with the adhesive member, even if the first terminal melts due to an environment such as a high temperature, it does not come into contact with other wiring, etc. Can be prevented. Even when condensation occurs on the display panel, the condensation does not come into contact with the first terminal of the interface board, thereby preventing the occurrence of unnecessary continuity and electrical shorts with other wirings. be able to.

  Application Example 2 In the electro-optical device according to the application example, the interface substrate includes a base material on which the first terminal is formed, and an end surface of the first terminal is an end surface of the base material. It is preferable that it is located inside.

  According to this configuration, since the boundary surface between the end surface of the first terminal and the adhesive member is blocked by the base material, it is possible to prevent water from entering from the boundary surface.

  Application Example 3 In the electro-optical device according to the application example, the interface substrate includes a base material on which the first terminal is formed, and an end surface of the first terminal is an end surface of the base material. It is characterized by being located outside.

  According to this configuration, even if the end face of the first terminal is located outside the end face of the base material, the end face of the first terminal and the portion where the first terminal is exposed to the outside from the end face of the base material are adhesive members. Therefore, it is possible to prevent the occurrence of unnecessary conduction and the occurrence of an electrical short circuit.

  Application Example 4 In the electro-optical device according to the application example, the first terminal is formed along the base material over an end surface of the base material.

  According to this configuration, even if the end surface of the first terminal is formed so as to cover a part of the end surface of the base material (for example, generated when the first terminal and the base material are cut), the first terminal Since the end face is covered with the adhesive member, it is possible to prevent the occurrence of unnecessary conduction and the occurrence of an electrical short circuit.

  Application Example 5 In the electro-optical device according to the application example, it is preferable that the adhesive member covers at least a part of an end surface of the base material.

  According to this configuration, since the adhesive member is bonded to the end surface of the base material provided on the first terminal, it is possible to further prevent water from entering from the interface between the first terminal and the base material.

  Application Example 6 In the electro-optical device according to the application example described above, the display panel includes a driving IC, a first wiring that electrically connects the interface substrate and the driving IC, and the driving IC. And a second wiring that electrically connects the display panel, the first wiring includes the second terminal, and the adhesive member includes at least a part of the first wiring. It is preferable that the display panel and the driving IC, and the display panel and the interface substrate are bonded to the second wiring.

  According to this configuration, the interface substrate and the driving IC are fixed to the display panel by the adhesive member, and the first wiring and the second wiring are covered by the adhesive member. Thereby, it is not necessary to cover the wiring with a molding material or the like, and the man-hour for fixing the interface substrate and the driving IC to the display panel is reduced. Furthermore, moisture can be prevented from entering the wiring.

  Application Example 7 In the electro-optical device according to the application example, it is preferable that the adhesive member is an anisotropic conductive film.

  According to this configuration, since the anisotropic conductive film is used as the adhesive member, the first terminal and the second terminal can be electrically connected, and the display panel and the interface substrate can be bonded.

  Application Example 8 A method for manufacturing an electro-optical device according to this application example includes a display panel, an interface substrate electrically connected to the display panel, and a driving IC electrically connected to the display panel. An electro-optical device manufacturing method comprising: a first terminal formed on the interface substrate; and a second terminal formed on the display panel, wherein the first terminal and the second terminal are thermoplastic. A thermocompression bonding process in which thermocompression bonding is performed using an adhesive member having electrical connection, and the thermocompression bonding process performs thermocompression bonding by aligning the end surface of the interface substrate and one wall surface of the thermocompression bonding member. And features.

  According to this method, the interface substrate and the adhesive member are crimped by aligning the end surface of the interface substrate and the wall surface (end surface) of the thermocompression bonding member, so that, for example, a buffer material is interposed between the thermocompression bonding member and the interface substrate. Even if the pressure bonding is performed, it is possible to prevent the buffer material from dripping down and closing the end surfaces of the interface substrate and the adhesive member. Therefore, the adhesive member crushed by the thermocompression bonding member can easily move to the end surface of the interface substrate, and the end surface of the first terminal of the interface substrate can be covered with the adhesive member. Therefore, generation | occurrence | production of unnecessary conduction | electrical_connection and generation | occurrence | production of an electrical short can be prevented.

  Application Example 9 In the method of manufacturing an electro-optical device according to the application example, the thermocompression bonding process includes a thermocompression bonding process at a first temperature and a thermocompression bonding process at a second temperature higher than the first temperature. It is preferable to contain.

  According to this method, since thermocompression bonding is performed at the second temperature, which is a high temperature, after the thermocompression bonding at the first temperature, which is a low temperature, the adhesive member moves to a place close to the normal position and covers the end surface of the first terminal. Later, the adhesive member can be cured.

  Application Example 10 In the method of manufacturing the electro-optical device according to the application example, it is preferable that the thickness of the adhesive member is larger than the thickness of the first terminal.

  According to this method, since the thickness of the adhesive member is thicker than the thickness of the first terminal, when the adhesive member is crushed by thermocompression bonding, the amount of the adhesive member that appears on the end face side of the first terminal can be increased. it can. Therefore, the end surface of the first terminal can be covered with the adhesive member.

  Application Example 11 In the method of manufacturing an electro-optical device according to the application example, in the thermocompression bonding process, the interface substrate and the driving IC are simultaneously thermocompression bonded to the display panel, or the interface substrate is driven. It is preferable to perform thermocompression bonding before the IC for use.

  According to this method, when the thermocompression bonding of the interface substrate and the driving IC is performed using the adhesive member, the first method is performed before the end surface of the first terminal is covered by the first method. It is possible to prevent excessive heat from being applied in the vicinity of the terminal, and it is possible to suppress the adhesive member in the vicinity of the first terminal from being cured. Therefore, when the thermocompression processing is performed, the end surface of the first terminal can be covered with the adhesive member and then cured.

  Application Example 12 An electronic apparatus according to this application example includes the above-described electro-optical device.

  According to this configuration, it is possible to obtain an electronic device that can prevent the occurrence of unnecessary conduction and the occurrence of an electrical short.

  Hereinafter, preferred embodiments will be described with reference to the drawings. The following embodiment is applied to a liquid crystal display device. An applicable electro-optical device is not limited to a liquid crystal display device, and an organic EL (OLED: Organic Light Emitting Diode), a plasma panel, or the like may be used. In each drawing used for the description in this specification, each layer or each member is displayed with a different scale so that each layer or each member has a size that can be recognized on the drawing. That is, it is not necessarily displayed in proportion to actual dimensions.

[Liquid Crystal Display]
FIG. 1 is a plan view of a liquid crystal display device 100 according to the present embodiment, and FIG. 2 is a cross-sectional view taken along a section AA ′ of the liquid crystal display device 100 shown in FIG.

  As shown in FIG. 2, the liquid crystal display device 100 mainly includes a lighting device 9 and a liquid crystal panel 20 as a display panel. The liquid crystal panel 20 is disposed to face the upper surface of the light guide plate 11.

  The illumination device 9 includes a light guide plate 11, a reflection sheet 14, and a light source unit 15. The reflection sheet 14 is disposed on the lower surface of the light guide plate 11. The light source unit 15 is disposed on the end face of the light guide plate 11 and includes a plurality of LEDs 16 that are point light sources. The light L emitted from each LED 16 enters the light guide plate 11, changes its direction by repeating reflection on the upper and lower surfaces of the light guide plate 11, and is emitted to the outside from the upper surface. The emitted light L travels toward the liquid crystal panel 20.

  The liquid crystal panel 20 has a display area substantially the same as the light emission area of the light guide plate 11. The liquid crystal panel 20 is configured by bonding a substrate 1 such as glass and a substrate 2 through a sealing material 3 to form a cell structure, and enclosing the liquid crystal 4 therein. The liquid crystal panel 20 includes a polarizing plate 5 on the outer surface of each of the substrate 1 and the substrate 2.

  For example, a diffusion sheet 12 and a prism sheet 13 are provided as optical sheets between the illumination device 9 and the liquid crystal panel 20. The diffusion sheet 12 has a role of diffusing the light L emitted from the light guide plate 11 in all directions. The prism sheet 13 has a role of condensing the light L onto the liquid crystal panel 20 and has a shape in which a prism shape having a substantially triangular cross section is extended in one side direction (direction of a side perpendicular to the cross section). The light L emitted from the light guide plate 11 passes through these optical sheets and then illuminates by passing through the liquid crystal panel 20.

  The liquid crystal panel 20 is directly mounted with a driving IC 40 as a liquid crystal driving IC (driver) by COG (Chip On Glass) technology. An FPC (Flexible Printed Circuit) 51 as an interface substrate is connected to the end of the liquid crystal panel 20, and some terminals (bumps 72) of the driving IC 40 are first wirings formed on the liquid crystal panel 20. Are connected to the FPC 51 through the wiring 52 and the terminal 52a as the second terminal.

  In this case, the end portion of the FPC 51 is fixed to the end portion of the liquid crystal panel 20 by crimping using an anisotropic conductive film (ACF) having thermoplasticity as an adhesive member. A connector 51x (see FIG. 1) is provided at the other end of the FPC 51. An external electronic device is electrically connected to the connector 51x. The driving IC 40 drives the driving circuit of the liquid crystal panel 20 based on a control signal from an external electronic device supplied via the FPC 51. Thereby, the alignment state of the liquid crystal 4 is controlled.

  Further, some terminals (bumps 72) of the driving IC 40 are electrically connected to the wiring 53 as the second wiring formed on the liquid crystal panel 20 via the ACF 71. That is, the wiring 53 electrically connects the external electronic device and the liquid crystal panel 20 via the driving IC 40.

In addition, a protective film 54 for protecting the wirings 52 and 53 and a part of the region on the terminal 52a is formed. The protective film 54 is, for example, a silicon nitride film (SiN) or a silicon oxide film (SiO ₂ ). Specifically, it is formed at least in a region exposed when the ACFs 70 and 71 are crimped (thermocompression bonded) on the wirings 52 and 53 and the terminal 52a. If the ACFs 70 and 71 can cover the terminals 52 a and the wirings 52 with the ACFs 70 and 71, the protective film 54 may not be provided on the terminals 52 a and the wirings 52. Note that the wiring 53 is covered with a protective film 54 at least other than the junction between the wiring 53 and the driving IC 40.

  The lighting device 9, that is, the light guide plate 11, the reflection sheet 14, and the light source unit 15 are fitted into an opening of a frame-shaped frame 61 formed of resin or a metal frame. Further, in the frame 61, optical sheets such as the diffusion sheet 12 and the prism sheet 13 are disposed on the upper surface of the light guide plate 11. The liquid crystal panel 20 is attached to the frame 61 by, for example, a frame-shaped double-sided tape 21 having a light shielding property so as to cover the opening of the frame 61.

(FPC structure)
Next, the structure of the FPC 51 will be described in detail. FIG. 3 is an exploded perspective view of a connection portion between the FPC 51 and the substrate 1.

  On the substrate 1 in the liquid crystal display device 100, a plurality of terminals 52a electrically connected to the external connection wiring 52 are formed.

  The FPC 51 is a flexible printed circuit board on which circuits and wiring necessary for display drive control of the liquid crystal display device 100 are formed. As shown in FIG. 3, the FPC 51 is mainly formed on the surface of the film base material 57 as a base material made of a plastic film having flexibility such as polyimide resin or epoxy resin, and copper. A wiring 56 patterned from a metal such as (Cu), and a terminal protective material 55 such as a cover lay film made of a plastic film provided for protecting the wiring 56 and the like. A plurality of terminals 56 a as first terminals are formed at the end of the FPC 51 connected to the substrate 1, and these are electrically connected to the wiring 56 on the FPC 51.

  The plurality of terminals 56a formed on the FPC 51 are electrically connected to the terminals 52a on the substrate 1 through ACFs 70 disposed on the terminals 52a.

  Conventionally, in order to prevent the end face of the terminal 56a on the FPC 51 from being exposed, a molding material made of resin or the like has been applied so as to cover the terminal 56a on the FPC 51. However, the process of applying the molding material takes a certain number of man-hours. In addition, the application of the molding material may limit the degree of freedom in designing the liquid crystal display device. On the other hand, when the step of applying the molding material is omitted and the terminal 56a disposed on the end face of the FPC 51 is exposed, the terminal 56a of the FPC 51 is melted and contacted with other wiring, thereby causing unnecessary conduction or electrical short. In addition, there is a problem that dew condensation occurs and contacts with other wiring, and unnecessary conduction or electrical short-circuiting occurs.

  A comparative example when no molding material is applied is shown in FIG. FIG. 4 is an enlarged view of a cross section of a connection portion between the FPC 51 and the substrate 1 of the liquid crystal display device 100a according to the comparative example. That is, FIG. 4 is an enlarged view of a portion of the liquid crystal display device 100 corresponding to the area within the broken line frame 80 shown in FIG.

  Generally, the film substrate 57 and the terminal 56a of the FPC 51 are formed by being integrally punched with a mold. As a result of the film substrate 57 of the FPC 51 and the terminal 56a being integrally punched with a mold, the end surface 51y of the FPC 51 in the comparative example is the end surface 57y of the film substrate 57 and the end surface of the terminal 56a on the FPC. 56y is formed on the same plane, that is, flush. Further, the terminal 56 a may be bent along the film substrate 57 of the FPC 51 toward the end surface 57 y of the film substrate 57 of the FPC 51 due to stress when the die is punched and molded integrally. As a result, the end surface 56y of the terminal 56a on the FPC 51 is exposed. For example, when dew condensation 150 occurs on the substrate 1 as shown in FIG. 4, the dew 150 is interposed between the terminal 56a and the wiring 52. Unnecessary conduction may occur and electrical shorts may occur.

  FIG. 5 is an enlarged view of the liquid crystal display device 100 according to the present embodiment in the broken line frame 80 in FIG. As shown in FIG. 5, in the liquid crystal display device 100 according to the present embodiment, the ACF 70 has a raised portion 70 a that rises in a broken line frame 81, and the raised portion 70 a covers the end face 56 y of the terminal 56 a on the FPC 51. Is arranged. That is, the raised portion 70a of the ACF 70 is bonded to the entire surface of the exposed portion of the end surface 56y of the terminal 56a. Further, in the liquid crystal display device 100 of FIG. 5, the raised portion 70 a is further bonded to a part of the end surface 57 y of the film base material 57. Thereby, since the end face 56y of the terminal 56a is covered and protected by the raised portion 70a, it is possible to prevent the occurrence of an electrical short circuit at the terminal portion of the FPC 51 without applying a molding material. The raised portion 70a of the ACF 70 is formed, for example, by adjusting the pressure applied to the FPC 51 when the FPC 51 is pressure-bonded to the substrate 1 using the ACF 70. That is, as the FPC 51 is pressed to the substrate 1 by applying a stronger pressure, the raised portion 70a of the ACF 70 increases, and the end surface 56y of the terminal 56a of the FPC 51 is surely covered.

  FIG. 6 is a schematic cross-sectional view showing the method of manufacturing the liquid crystal display device in the order of steps. Hereinafter, a method of manufacturing the liquid crystal display device will be described with reference to FIG. The process of thermocompression bonding the FPC 51 to the substrate 1 will be mainly described.

  First, as shown in FIG. 6A, the ACF 70 is attached to a region (for example, a partial region on the substrate 1, the terminal 52a, and the protective film 54) to which the FPC 51 is attached.

  Next, as shown in FIG. 6B, the FPC 51 is arranged on the ACF 70, and the position of the FPC 51 is aligned with a normal position that is fixed on the substrate 1. A heat tool 58 as a thermocompression bonding member for applying heat to the FPC 51 and the ACF 70 is disposed on the FPC 51.

Here, each member will be described. The substrate 1 has a thickness of 0.2 mm to 0.5 mm. The terminal 52a and the wiring 52 have a configuration in which ITO (Indium Tin Oxide) is laminated on an aluminum film. As described above, the protective film 54 formed on the terminals 52a and the wirings 52 is, for example, a silicon oxide film (SiO ₂ ). ACF70 is thermoplastic and has a thickness of, for example, 24 μm. The particle diameter is, for example, 4 μm. The terminal 56a of the FPC 51 is a copper foil and has a thickness of 20 μm, for example. The thickness of the ACF 70 is desirably thicker than the thickness of the terminal 56a of the FPC 51 so that the ACF 70 protrudes from the end surface of the FPC 51. The film base material 57 of the FPC 51 is a polyimide resin as described above, and has a thickness of 20 μm to 25 μm, for example.

  Next, as shown in FIG. 6C, the FPC 51 is connected to the substrate 1 by thermocompression bonding (thermocompression bonding step). First, a tape (buffer material) 59 is disposed between the FPC 51 and the heat tool 58. The tape 59 is used to prevent the ACF 70 from sticking to the surface of the heat tool 58. The thickness of the tape 59 is, for example, 30 μm to 100 μm. Note that the tape 59 may not be used when the tip of the heat tool 58 has been processed so that the ACF 70 does not stick.

  Next, the heat tool 58 is arranged so that the position of the end face (57y, 56y) of the FPC 51 and the position of the wall surface 58a of the heat tool 58 are aligned. Next, the heat tool 58 is pressed against the ACF 70 via the FPC 51. The temperature of the heat tool 58 is 200 ° C to 300 ° C. The pressing time is, for example, 8 seconds. The temperature of the ACF 70 at this time is 220 ° C., for example.

  Further, the temperature of the heat tool 58 may be lower than 200 ° C. to 300 ° C. in order to prevent the ACF 70 from solidifying before the end surface 56y of the terminal 56a is covered. Specifically, the ACF 70 is pressed at a temperature of 150 ° C. to 200 ° C. for 10 seconds to 15 seconds. According to this, the ACF 70 that has been crushed and moved can be further solidified after being raised on the end surface 56y of the terminal 56a.

  Further, the temperature of the heat tool 58 may be changed in two stages and thermocompression bonded. Specifically, for example, after temporarily pressing the heat tool 58 at a low temperature of 100 ° C. as the first temperature, the main bonding is performed at a high temperature of 200 ° C. to 300 ° C. as the second temperature.

  It is possible to prevent the end surfaces (56y, 57y) of the FPC 51 from being covered with the tape 59 by pressing the temperature condition and the wall surface 58a of the heat tool 58 so as to be aligned with the end surface of the FPC 51. Therefore, the crushed ACF 70 becomes the raised portion 70 a and can cover the end surface 56 y of the terminal 56 a constituting the FPC 51. Therefore, since the end face 56y is protected by the raised portion 70a, it is possible to prevent an electrical short from occurring at the terminal 56a portion of the FPC 51 without applying a molding material. The dimensions of the raised portion 70a are, for example, 100 μm outward from the end face 56y of the terminal 56a, and the height is, for example, 50 μm to 70 μm to prevent the occurrence of an electrical short in the terminal 56a portion of the FPC 51.

  After that, the driving IC 40 is pressure-bonded to the liquid crystal panel 20 by thermocompression processing, but it is desirable to perform the following method. As a first method, the FPC 51 and the driving IC 40 are thermocompression bonded at the same time, or as a second method, the driving IC 40 is thermocompression bonded after the FPC 51 is thermocompression bonded. According to this, before the ACF 70 covers the end face of the terminal 56a of the FPC 51, it is possible to prevent excessive heat from being applied in the vicinity of the terminal 56a, and it is possible to suppress the ACF 70 in the vicinity of the terminal 56a from being cured. Therefore, when the thermocompression processing is performed, the end surface 56y of the terminal 56a can be covered with the ACF 70.

  FIG. 7 is an enlarged view of a bonding portion between the FPC 51 and the substrate 1 of the liquid crystal display device 100b according to another embodiment 1. (A) is a schematic plan view which shows an adhesion part. (B) is a schematic cross section which shows an adhesion part. In the liquid crystal display devices 100 and 100a, the end surface 56y of the terminal 56a of the FPC 51 and the end surface 57y of the film base member 57 are formed on the same plane. In this case, for example, when there is a gap at the boundary between the terminal 56a in the broken line frame 81 and the raised portion 70a of the ACF 70 shown in FIG. 5, moisture may enter from the gap. Then, due to moisture intrusion, unnecessary conduction may occur in the terminal 56a or an electrical short circuit may occur.

  Therefore, in the liquid crystal display device 100b of FIG. 7, the end surface 57y of the film base material 57 is disposed outside the end surface 56y of the terminal 56a of the FPC 51 by a certain distance 90. In other words, the end surface 56y of the terminal 56a is disposed inside the end surface 57y of the film base material 57. Thereby, since the boundary surface of the end surface 56y of the terminal 56a in the broken line frame 82 and the raised portion 70a of the ACF 70 is blocked by the film base material 57, it is possible to prevent moisture from entering the boundary surface. It is possible to prevent an electrical short circuit of the terminal 56a due to the contact. In addition, since the end surface 56y of the terminal 56a is covered with the raised portion 70a of the ACF 70, it is not necessary to bend the film base material 57 to the terminal 56a side so as to cover the terminal 56a. Therefore, the distance 90 may be so small that the film base material 57 cannot be bent.

  FIG. 8 is an enlarged view of a bonding portion between the FPC 51 and the substrate 1 of the liquid crystal display device 100c according to the second embodiment. (A) is a schematic plan view which shows an adhesion part. (B) is a schematic cross section which shows an adhesion part. In the liquid crystal display devices 100 (see FIG. 5) and 100a (see FIG. 4) described above, the end surface 56y of the terminal 56a of the FPC 51 and the end surface 57y of the film base material 57 are formed on the same plane. Further, in the liquid crystal display device 100b (see FIG. 7), the end surface 57y of the film substrate 57 is disposed outside the end surface 56y of the terminal 56a of the FPC 51 by a certain distance 90.

  Generally, the film substrate 57 and the terminal 56a of the FPC 51 are formed by being integrally punched with a mold. As a result of integrally forming the film substrate 57 of the FPC 51 and the terminal 56a with a die, the end surface 51y of the FPC 51 in the comparative example is composed of the end surface 57y of the film substrate 57 and the end surface 56y of the terminal 56a. They are formed on the same plane, that is, flush with each other.

  However, the terminal 56a may be formed so as to protrude from the end surface 57y of the film substrate 57 of the FPC 51 due to stress when it is integrally punched with a mold. Further, depending on the strength of the stress when it is integrally punched with a mold, the terminal 56a is bent along the film base 57 of the FPC 51 over the end surface 57y of the film base 57 of the FPC 51. Sometimes. As a result, the end face 56y of the terminal 56a on the FPC 51 is exposed. For example, as shown in FIG. 4, when condensation 150 occurs on the substrate 1, the terminal 56a and the wiring 52 are connected via the condensation 150. Unnecessary conduction may occur, and an electrical short circuit may occur.

  Therefore, in the liquid crystal display device 100 c shown in FIG. 8, the end surface 56 y of the terminal 56 a of the FPC 51 is disposed outside the end surface 57 y of the film base material 57 by a certain distance 90. In other words, the end surface 56y of the terminal 56a protrudes from the end surface 57y of the film base material 57. In this case, not only the end surface 56y of the terminal 56a but also the entire protruding portion 83 is covered with the raised portion 70a of the ACF 70, so that an electrical short circuit of the terminal 56a due to contact with moisture can be prevented.

  In addition, embodiment is not limited above, It can also implement with the following forms.

[Modification 1]
In the liquid crystal display devices 100 and 100b according to the above-described embodiments, the ACF 70 covers the end face 56y of the terminal 56a of the FPC 51, thereby preventing an electrical short circuit and unnecessary conduction at the exposed portion of the terminal 56a of the FPC 51. However, in the liquid crystal display device 100 shown in FIG. 5 and the liquid crystal display device 100b shown in FIG. 7, the wiring 52 on the substrate 1 is exposed. Therefore, it is necessary to apply a protective material to the wiring 52 separately.

  Therefore, as a modification, the ACF 70 is extended to the driving IC 40 as shown in the liquid crystal display device 100c of FIG. That is, the ACF 70 that bonds the substrate 1 and the FPC 51 and the ACF 70 that bonds the substrate 1 and the driving IC 40 are made common. In other words, the FPC 51 and the driving IC 40 are fixed to the substrate 1 by one connected ACF 70. The wiring 52 is covered with the ACF 70. Therefore, the terminal 56a of the FPC 51 is protected by the ACF 70, and the wiring 52 is protected by the ACF 70, so that it is not necessary to separately cover the wiring 52 with a protective material. Further, the FPC 51 and the driving IC 40 can be bonded to the substrate 1 by one ACF 70, and the number of steps in the manufacturing process can be reduced. Note that a portion of the wiring 53 that is not covered with the ACF 70 is preferably covered with the protective film 54.

[Modification 2]
Instead of mounting the driving IC 40 on the wirings 52 and 53 of the liquid crystal panel 20, the driving IC 40 may be mounted on the FPC 51 as shown in FIG. FIG. 10 is a schematic cross-sectional view showing a partial cross section of the liquid crystal display device 200. Specifically, for example, the wiring 52 and the terminal 52 a are formed on the substrate 1. And on the terminal 52a, the terminal 56a of the FPC 51 is electrically connected via the ACF 70. The terminal 56a is electrically connected to the wiring 56. The driving IC 40 is connected to the wiring 56. According to this, when connecting the liquid crystal panel 20 and the FPC 51, the work of attaching the ACF 70 to the liquid crystal panel 20 can be simplified at a time. In addition, the area where the ACF 70 is attached can be reduced.

[Modification 3]
When bonding the driving IC 40 to the liquid crystal panel 20, NCF (Non Conductive Film) or ACP (Anisotropic Conductive Paste) may be used instead of using the ACF 71.

[Electronics]
Next, specific examples of electronic devices to which the liquid crystal display devices 100, 100b, 100c, and 200 according to the above-described embodiments can be applied will be described with reference to FIG.

  First, an example in which the liquid crystal display device 100 according to the above-described embodiment is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 11A is a perspective view showing the configuration of this personal computer. As shown in the figure, the personal computer 710 includes a main body 712 having a keyboard 711 and a display 713 to which the liquid crystal display device 100 or the like is applied.

  Subsequently, an example in which the liquid crystal display devices 100, 100b, 100c, and 200 according to the above-described embodiment are applied to a display unit of a mobile phone will be described. FIG. 11B is a perspective view showing the configuration of this mobile phone. As shown in the figure, the mobile phone 720 includes a plurality of operation buttons 721, a receiver 722, a transmitter 723, and a display unit 724 to which the liquid crystal display device 100 or the like is applied.

  As electronic devices to which the liquid crystal display devices 100, 100b, 100c, and 200 can be applied, in addition to the personal computer and the mobile phone shown in FIG. 11, a liquid crystal television, a viewfinder type and a monitor type video tape recorder. Car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, digital still cameras, and the like.

The top view of the liquid crystal display device which concerns on embodiment. Sectional drawing of the liquid crystal display device which concerns on embodiment. The disassembled perspective view of the connection part of FPC and the board | substrate of the liquid crystal display device which concerns on embodiment. The enlarged view of the cross section of the liquid crystal display device which concerns on a comparative example. The enlarged view of the section of the liquid crystal display concerning an embodiment. The schematic cross section which shows the manufacturing method of a liquid crystal display device in order of a process. It is an enlarged view of the liquid crystal display device which concerns on other Embodiment 1 at the time of arrange | positioning a film base material outside a terminal, (a) is a schematic plan view which shows an adhesion part, (b) is a model which shows an adhesion part. Sectional drawing. It is an enlarged view of the liquid crystal display device which concerns on other Embodiment 2 at the time of arrange | positioning a film base material inside a terminal, (a) is a schematic plan view which shows an adhesion part, (b) is a model which shows an adhesion part. Sectional drawing. The enlarged view of the cross section of the liquid crystal display device which concerns on a modification. The schematic cross section which shows the cross section of the liquid crystal display device which concerns on a modification. FIG. 14 is a diagram showing an example of an electronic apparatus to which the liquid crystal display device of the embodiment is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 9 ... Illuminating device, 11 ... Light guide plate, 15 ... Light source part, 16 ... LED, 20 ... Liquid crystal panel as a display panel, 40 ... Driving IC, 51 ... FPC as an interface board, 52 ... Wiring as 1st wiring 52a ... terminal as second terminal, 53 ... wiring as second wiring, 56a ... terminal as first terminal, 56y, 57y ... end face, 57 ... film base material as base material, 58 ... as thermocompression bonding member Heating tool, 58a ... Wall surface, 61 ... Frame, 70, 71 ... ACF as an adhesive member, 100, 100a, 100b, 100c, 200 ... Liquid crystal display device.

Claims (12)

An interface board on which a first terminal is formed;
A display panel comprising a second terminal electrically connected to the first terminal;
An adhesive member provided between the interface substrate and the display panel and bonding the first terminal and the second terminal;
The electro-optical device, wherein the adhesive member covers an end surface of the first terminal. The interface board comprises a base material on which the first terminals are formed,
2. The electro-optical device according to claim 1, wherein an end surface of the first terminal is positioned on an inner side than an end surface of the base material. The interface board comprises a base material on which the first terminals are formed,
2. The electro-optical device according to claim 1, wherein an end surface of the first terminal is located outside an end surface of the base material.   The electro-optical device according to claim 3, wherein the first terminal is formed along the base material over an end surface of the base material.   The electro-optical device according to claim 1, wherein the adhesive member covers at least a part of an end surface of the base material. The display panel includes a driving IC, a first wiring that electrically connects the interface substrate and the driving IC, and a second wiring that electrically connects the driving IC and the display panel. , Is further provided,
The first wiring includes the second terminal,
The adhesive member is provided on the first wiring and at least a part of the second wiring, and bonds the display panel and the driving IC, and the display panel and the interface substrate. The electro-optical device according to any one of claims 1 to 5.   The electro-optical device according to claim 1, wherein the adhesive member is an anisotropic conductive film. A display panel, an interface board electrically connected to the display panel, a driving IC electrically connected to the display panel, a first terminal formed on the interface board, and formed on the display panel A second terminal, and a manufacturing method of an electro-optical device comprising:
A thermocompression bonding step in which the first terminal and the second terminal are electrically connected by thermocompression bonding using an adhesive member having thermoplasticity;
The method of manufacturing an electro-optical device, wherein the thermocompression bonding step performs thermocompression bonding by aligning an end surface of the interface substrate and one wall surface of the thermocompression bonding member.   The electro-optical device manufacturing method according to claim 8, wherein the thermocompression bonding step includes a thermocompression bonding step at a first temperature and a thermocompression bonding step at a second temperature higher than the first temperature. Method.   10. The method of manufacturing an electro-optical device according to claim 8, wherein a thickness of the adhesive member is greater than a thickness of the first terminal.   9. The thermocompression bonding step, wherein the interface substrate and the driving IC are simultaneously thermocompression bonded to the display panel, or the interface substrate is thermocompression bonded before the driving IC. Item 11. A method for manufacturing an electro-optical device according to any one of Items 10 to 10.   An electronic apparatus comprising the electro-optical device according to claim 1.

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