JP2009016578A - Flexible wiring substrate, semiconductor device using the flexible wiring substrate, and display device including the semiconductor device - Google Patents

Abstract

The present invention provides a flexible wiring board that does not easily peel off even when an impact is applied in a mounted state, a semiconductor device using the flexible wiring board, and a display device including the semiconductor device.
A flexible wiring board includes a terminal region in which an input terminal is formed, a terminal region in which an output terminal is formed, and a circuit region located between the terminal region and the terminal region. It has. In the circuit region 27, a boundary region 26 in contact with the terminal region 23 and a boundary region 25 in contact with the terminal region 24 are formed. The terminal region 23 is wider in the longitudinal direction than the boundary region 26, and the terminal region 24 is wider in the longitudinal direction than the boundary region 25. The semiconductor device 1 has a configuration in which the semiconductor element 22 is disposed on the circuit region 27 of the flexible wiring board 21. The display device includes the semiconductor device 1 as a liquid crystal driver.
[Selection] Figure 1

Description

  The present invention relates to a flexible wiring board, a semiconductor device using the flexible wiring board, and a display device including the semiconductor device, and in particular, a flexible wiring board that is difficult to peel off even when an impact is applied in a mounted state, The present invention relates to a semiconductor device using the flexible wiring board and a display device including the semiconductor device.

  In recent years, liquid crystal display devices are widely used in mobile devices such as mobile phones, notebook computers, and mobile game monitors. Since such a portable device is frequently carried, an impact may be applied to the module. In recent years, as seen in the increase in size of liquid crystal televisions, liquid crystal display devices tend to become larger and larger. As the liquid crystal display device increases in size as described above, a large impact may be applied to the module during transportation or the like.

  Here, a conventional liquid crystal display device 900 will be described with reference to FIGS. As illustrated in FIG. 8, the liquid crystal display device 900 includes a liquid crystal panel 100, a COF (Chip on Film) 200, and a PWB (Print Wiring Board) 300. As shown in FIG. 10B, the liquid crystal panel 100 has a structure in which a liquid crystal layer (not shown) is sandwiched between a glass 110 and a glass 120. A color filter is provided on the glass 110. On the other hand, a thin film transistor (TFT), a gate electrode line, and a source electrode line (not shown) are provided on the glass 120 of the liquid crystal panel 100.

  As shown in FIG. 9, the COF 200 has a structure in which an IC chip 220 is disposed on a flexible wiring board 210. Further, although not shown, a circuit is printed on the flexible wiring board 210. In the COF 200, an input terminal area 230 and an output terminal area 240 are provided at both ends of the flexible wiring board 210. A driver input terminal 280 for inputting a signal from the PWB 300 is formed in the input terminal area 230. On the other hand, a driver output terminal 290 for outputting a signal to the liquid crystal panel 100 is formed in the output terminal region 240.

  As shown in FIG. 8, the PWB 300 has a circuit printed on a substrate 320. A terminal region 310 in which an output terminal (not shown) for outputting a signal to the COF 200 is formed in an end region of the PWB 300.

  In the liquid crystal display device 900, the liquid crystal panel 100 and the COF 200 are connected using an anisotropic conductive film 430 as shown in FIG. Thereby, the gate electrode line and the source electrode line of the liquid crystal panel are electrically connected to the driver output terminal 290 of the COF 200, respectively.

  Similarly, in the liquid crystal display device 900, the COF 200 and the PWB 300 are connected using an anisotropic conductive film 430. Thereby, the driver input terminal 280 of the COF 200 and the output terminal of the PWB 300 are electrically connected.

  As shown in FIG. 8, the flexible wiring board 210 of the COF 200 provided in the liquid crystal display device 900 has a quadrangular shape or a substantially quadrangular shape. Therefore, an impact is applied to the liquid crystal display device 900. For example, when a force is applied to the PWB 300 in the left direction parallel to the longitudinal direction of the terminal region 310 (the direction of the arrow X shown in FIG. 10A), At the connection portion between the COF 200 and the PWB 300, a force is applied to the COF 200 in the right direction parallel to the longitudinal direction of the input terminal area 230 (to the right in FIG. 10A). On the other hand, in the connection portion between the COF 200 and the liquid crystal panel 100, a force is applied to the COF 200 in the left direction parallel to the longitudinal direction of the output terminal region 240 (left direction in FIG. 10A). That is, a force is applied to the COF 200 so as to distort the COF 200. In the conventional liquid crystal display device 900, this force is concentrated on the connection portion between the COF 200 and the liquid crystal panel 100 and / or the connection portion between the COF 200 and the PWB 300 (region I in FIG. 10A). At this time, since the COF 200 cannot actually be distorted, there arises a problem that the COF 200 itself is damaged. Further, a part of the force is converted into a force in a direction perpendicular to the surface of the COF 200. Therefore, there is a problem that the COF 200 is peeled off at the connecting portion between the COF 200 and the liquid crystal panel 100 and / or the connecting portion between the COF 200 and the PWB 300.

  Further, when an impact is applied to the liquid crystal display device 900 and, for example, a force in the direction of arrow Y shown in FIG. 10B (upward in FIG. 10B) is applied to the PWB 300, the COF 200 and the liquid crystal In the connection portion with the panel 100, the upward force on the paper surface of FIG. That is, a force in the direction of peeling the COF 200 from the liquid crystal panel 100 is loaded at the connection portion between the COF 200 and the liquid crystal panel 100 (region I in FIG. 10B). Therefore, if the force is large, there arises a problem that the COF 200 is peeled off.

  In order to solve such a problem, several techniques have been developed. Specifically, for example, in Patent Document 1, an anisotropic conductive adhesive is used for a terminal portion of a flexible wiring board in which a wiring pattern and an insulating protective layer for protecting the wiring pattern are formed on a substrate. When connecting to an external connection terminal provided on the display panel, the insulating protective layer of the flexible wiring board extends so as to enter the inside of the display panel in a connected state with the display panel, and the insulating protective layer The method of joining the peripheral part of the terminal part side end to the display panel surface using an anisotropic conductive adhesive is described. As a result, when the flexible wiring board is bent and used, an insulating protective layer exists on the inner side of the flexible wiring board so that the wiring pattern does not directly contact the end corner of the display panel. It is described that the disconnection of the wiring pattern can be prevented. Furthermore, since the insulating protective layer and the anisotropic conductive adhesive are bonded through a resin, the adhesion can be made strong.

  Further, as another technique for preventing the separation of the COF 200 at the connecting portion between the COF 200 and the liquid crystal panel 100 and / or the connecting portion between the COF 200 and the PWB 300, the connecting portion between the liquid crystal panel 100 and the COF 200, and the COF 200 and the PWB 300 An anisotropic conductive film 430 with improved adhesive strength has been developed in order to reinforce the adhesive strength at the connecting portion.

Further, as a technique for preventing the COF 200 itself from being damaged, for example, a region where stress is concentrated in the COF 200 when an impact is applied to the module while the COF 200 is mounted on the module is patterned with copper. Thus, a technique for improving the strength of the COF 200 has been developed.
JP 2002-358026 A (published on December 13, 2002; Patent No. 3792554 (registered on April 14, 2006))

  However, the improvement of the anisotropic conductive film 430 can improve the adhesive strength to some extent, but it cannot be said to be sufficient at a practical level. Specifically, the weight of the liquid crystal panel 100 tends to increase with an increase in the size of the liquid crystal display device. For this reason, the impact applied during transportation or the like is larger. Therefore, it is difficult to prevent peeling of the COF 200 only by improving the adhesive strength of the anisotropic conductive film 430.

  Further, the technique of patterning a specific area of the COF 200 with copper can improve the strength of the COF 200 itself to some extent, but it cannot be said that the reinforcement is sufficient at a practical level. Further, since the technique is a technique for increasing the strength of the COF 200 itself, the technique cannot prevent the separation of the COF 200 from the liquid crystal panel 100 and the PWB 300. Therefore, development of a new technique has been demanded for a technique for preventing peeling of the COF 200 from the liquid crystal panel 100 and the PWB 300.

  The present invention has been made in view of the above problems, and its purpose is to provide a flexible wiring board that does not easily peel off even when an impact is applied in a mounted state, a semiconductor device using the flexible wiring board, and the semiconductor device. It is to provide a display device provided.

  In order to solve the above-described problem, a flexible wiring board according to the present invention includes a terminal region provided with terminals for connection to an external circuit, and a circuit region in contact with the terminal region. The width is characterized by being wider than the width in the longitudinal direction of the boundary region in contact with the terminal region of the circuit region.

  Conventionally, when a flexible wiring board is mounted on a module, the terminal area is bonded to a substrate on which the external circuit is formed in order to connect the terminals provided in the terminal area to an external circuit. That is, when the flexible wiring board is mounted on a module, the terminal area is fixed to the object, but the circuit area is not fixed to the object. Therefore, when a stress is applied to the terminal region fixed to the object, the stress is concentrated on the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. Therefore, the flexible wiring board starts to peel from the tangent line between the terminal area and the boundary area, particularly from both ends of the tangent line, and finally the flexible wiring board may completely peel from the module. In some cases, the stress is concentrated on both ends of the tangent, so that the flexible wiring board may be broken from both ends of the tangent and the flexible wiring board itself may be damaged.

  However, according to the above configuration, in the flexible wiring board, the width in the longitudinal direction of the terminal area provided with the terminal for connecting to the external circuit is wider than the width in the longitudinal direction of the circuit area in contact with the terminal area. . Therefore, the stress applied to the terminal area fixed to the object is distributed without being concentrated on the tangent line between the terminal area and the boundary area not fixed to the object, particularly at both ends of the tangent line. Therefore, even when an impact is applied in a state of being mounted on the module, the flexible wiring board can maintain connection with the board on which the external circuit is formed without being peeled off or damaged.

  In the flexible wiring board according to the present invention, it is preferable that the longitudinal width of the terminal region is wider than the longitudinal width of the circuit region.

  The boundary area is a part of the circuit area. That is, according to the above configuration, the width of the terminal region in the longitudinal direction is wider than the width of the boundary region in the longitudinal direction. In other words, in the flexible wiring board, at least one of both ends in the longitudinal direction of the terminal region has a protruding portion that protrudes from the circuit region. Therefore, when stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is concentrated on the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. Without being distributed, the convex portions are also distributed and loaded. Therefore, the flexible wiring board can maintain the connection with the board on which the external circuit is formed without being peeled off or damaged even when an impact is applied in a state where the flexible wiring board is mounted on the module. .

  In the flexible wiring board according to the present invention, it is preferable that the terminal region protrudes in both longitudinal directions with respect to the circuit region.

  According to the above configuration, both ends in the longitudinal direction of the terminal region protrude in the longitudinal direction from both ends in the longitudinal direction of the circuit region. In other words, in the flexible wiring board, convex portions are provided at both ends in the longitudinal direction of the terminal region. Therefore, when stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is concentrated on the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. Without being distributed, the convex portions are also distributed and loaded. Therefore, even when an impact is applied in a state of being mounted on the module, the flexible wiring board can maintain connection with the board on which the external circuit is formed without being peeled off or damaged.

  In the flexible wiring board according to the present invention, it is preferable that the circuit area has a narrow width in the longitudinal direction in the boundary area.

  According to the above configuration, the width of the boundary region in the longitudinal direction is narrow in the circuit region. Further, as described above, the longitudinal width of the boundary region is narrower than the longitudinal width of the terminal region. That is, according to the above configuration, in the flexible wiring board, at least one of the both ends in the longitudinal direction of the boundary region is in the longitudinal direction inside. In other words, in the flexible wiring board, a recess is formed on at least one of both ends in the longitudinal direction of the boundary region. As a result, at least one of the both ends in the longitudinal direction of the terminal region is in a protruding state. Therefore, when stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is concentrated on the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. Without being distributed, the terminals are also distributed and loaded on the protruding end in the longitudinal direction of the terminal region. Therefore, even when an impact is applied in a state of being mounted on the module, the flexible wiring board can maintain connection with the board on which the external circuit is formed without being peeled off or damaged.

  In the flexible wiring board according to the present invention, the boundary region is preferably bound in both longitudinal directions in the circuit region.

  According to the above configuration, in the flexible wiring board, both ends in the longitudinal direction of the boundary region are confined inward in the longitudinal direction. In other words, in the flexible wiring board, concave portions are provided at both ends in the longitudinal direction of the boundary region. As a result, both ends in the longitudinal direction of the terminal region are in a protruding state. Therefore, when stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is concentrated on the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. Without being distributed, the terminals are also distributed and loaded at both ends of the terminal region protruding in the longitudinal direction. Therefore, even when an impact is applied in a state of being mounted on the module, the flexible wiring board can maintain connection with the board on which the external circuit is formed without being peeled off or damaged.

  Furthermore, in the flexible wiring board according to the present invention, it is preferable that at least one of both ends of the boundary region in the longitudinal direction has a rounded shape.

  According to the above configuration, at least one of the both ends of the boundary region in the longitudinal direction has a rounded shape. Accordingly, when stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is dispersed by roundness, and the tangent line between the terminal region and the boundary region, in particular, the There is no concentration at both ends of the tangent line. Therefore, even when an impact is applied in a state where it is mounted on a module, the flexible wiring board can maintain the connection with the board on which the external circuit is formed more reliably without being peeled off or damaged. Can do.

  In addition, in the flexible wiring board according to the present invention, it is preferable that at least one of the regions including the end of the tangent line between the terminal region and the boundary region is patterned with metal.

  As described above, when a stress is applied to the terminal region in a state where the flexible wiring board is mounted on the module, the stress is applied to the tangent line between the terminal region and the boundary region, particularly at both ends of the tangent line. concentrate. According to the said structure, at least 1 area | region is patterned with the metal among the area | regions including the terminal of the tangent of the said terminal area | region and the said boundary area | region. Therefore, the strength of the region patterned with metal is improved. Therefore, even when an impact is applied in a state where it is mounted on the module, the flexible wiring board is not damaged, and the connection with the board on which the external circuit is formed can be reliably maintained. In addition, as said metal, the metal which has electroconductivity is intended, Specifically, copper, silver, etc. can be mentioned.

  A semiconductor device according to the present invention includes the flexible wiring board according to the present invention and a semiconductor element, and the semiconductor element is disposed in the circuit region.

  According to the said structure, the said semiconductor device is equipped with the flexible wiring board concerning this invention as a flexible wiring board. As described above, the flexible wiring board according to the present invention can be connected to a board on which an external circuit is formed without being peeled off or damaged even when an impact is applied in a state where the flexible wiring board is mounted on a module. It can be reliably maintained. Therefore, even if an impact is applied to the semiconductor device mounted on the module, the flexible wiring board is not peeled off or damaged. Therefore, disconnection can be prevented from occurring in the module on which the semiconductor device is mounted.

  A display device according to the present invention includes the semiconductor device according to the present invention, a display panel, and an external circuit board, wherein the semiconductor device and the display panel are electrically connected, and the semiconductor device is provided. And the external circuit board are electrically connected.

  According to the above configuration, the semiconductor device is disposed between the display panel and the external circuit board and is electrically connected to each other. In the display device, the semiconductor device functions as a display driving unit.

  Generally, in a display device in which a semiconductor device functioning as a display drive unit is disposed between a display panel and an external circuit board, when the display device is subjected to an impact or the like, the display panel and the external circuit board are , Move relative to the display device. The resulting stress tends to concentrate on the connection between the semiconductor device and the display panel and the connection between the semiconductor device and the external circuit board. Therefore, the semiconductor device may be peeled off from the display panel or the external circuit board, or the semiconductor device itself may be damaged, and as a result, disconnection may occur in the display device.

  However, according to the above configuration, the semiconductor device functioning as the display driving unit is not peeled off or damaged even when an impact is applied while mounted on the module. That is, even if an impact or the like is applied to the display device on which the semiconductor device is mounted, the semiconductor device is peeled off from the display panel and / or the external circuit board due to the stress generated thereby, or the semiconductor itself is damaged. There is nothing to do. Therefore, occurrence of disconnection in the display device can be prevented.

  As described above, the flexible wiring board according to the present invention includes a terminal region provided with a terminal for connecting to an external circuit, and a circuit region in contact with the terminal region, and the width in the longitudinal direction of the terminal region is It is wider than the width in the longitudinal direction of the boundary area in contact with the terminal area of the circuit area. Therefore, even if stress is applied to the terminal area in a state where the flexible wiring board is mounted on the module, in other words, the terminal area is fixed to the object, the terminal area and the boundary area Concentration of the stress on the tangent line to the tangent line, particularly on both ends of the tangent line, is reduced. Therefore, the flexible wiring board can maintain the connection with the board on which the external circuit is formed without being peeled off or damaged even when an impact is applied in a state where the flexible wiring board is mounted on the module. There is an effect.

[Embodiment 1]
An embodiment according to the present invention will be described below with reference to FIGS. 1 to 4, but the present invention is not limited to this.

  In the semiconductor device 1 according to the present embodiment, a semiconductor element 22 is arranged on a flexible wiring board 21 as shown in FIGS. 1 (a), 2 (a), 3 (a), and 4 (a). It has a set configuration.

  The flexible wiring board 21 according to the present embodiment has a structure in which a wiring pattern is disposed on the surface of an insulating tape and a resist is formed thereon.

  The insulating tape has insulating properties and flexibility (flexibility) that can be bent freely. As a material for forming the insulating tape, for example, a resin material such as polyimide, glass epoxy, or polyester is used.

  The wiring pattern is a wiring formed in a pattern on the surface of the insulating tape. The wiring pattern is formed by forming a copper foil or sputtered copper (hereinafter also simply referred to as “copper foil”) on the insulating tape by a casting method or a sputtering method (metalizing method), and forming the copper foil into a desired pattern. It is formed by etching. In the present embodiment, copper will be described as an example of a material used for the wiring pattern, but the present invention is not limited to this. For example, a conductive metal such as silver can be used.

  In the flexible wiring board 21, a resist is further formed on the wiring pattern. The resist is made of, for example, a heat-resistant coating material, and prevents exposure except for the connection portion. Therefore, the resist is a portion other than a region where the semiconductor element 22 is mounted, a portion where terminals (an input terminal 28 and an output terminal 29 described later) are not provided, in other words, a wiring pattern of a circuit region 27 described later. Formed on top. That is, the resist is formed on the wiring pattern that is exposed when the semiconductor element 22 or the like is connected and mounted on the flexible wiring board 21.

  The flexible wiring board 21 according to the present embodiment has the above-described structure, but functionally, as shown in FIGS. 1A, 2A, 3A, and 4A. In addition, a terminal region (terminal region 23 and terminal region 24) provided with terminals for connection to an external circuit, and a circuit region 27 are provided. The terminal region 23 and the terminal region 24 are opposed to each other. The circuit region 27 is located between the terminal region 23 and the terminal region 24. The terminal area 23 is provided with input terminals 28 for inputting signals from an external circuit at a predetermined pitch. On the other hand, the terminal area 24 is provided with output terminals 29 for outputting signals to an external circuit at a predetermined pitch. In the circuit area 27, a circuit is printed. Further, the circuit region 27 includes a boundary region 26 in contact with the terminal region 23 and a boundary region 25 in contact with the terminal region 24.

  In the flexible wiring board 21, the width of the terminal region 23 in the longitudinal direction is the length of the boundary region 26 as shown in FIGS. 1 (a), 2 (a), 3 (a), and 4 (a). It is wider than the width of the direction. Similarly, the longitudinal width of the terminal region 24 is wider than the longitudinal width of the boundary region 25.

  Here, the width in the longitudinal direction of the terminal region 23 and the terminal region 24 of the flexible wiring board 21 will be described in more detail. In one embodiment of the flexible wiring board 21, the terminal region 23 and the terminal region 24 have a longer width in the longitudinal direction than a width in the longitudinal direction of the circuit region 27. Specifically, as shown in FIG. 1A and FIG. 2A, the terminal region 23 and the terminal region 24 protrude in both longitudinal directions in the semiconductor device 1. In FIGS. 1A and 2A, the terminal region 23 and the terminal region 24 protrude in both longitudinal directions, but may be configured to protrude only in one direction.

  In this embodiment, the shape of the protrusion part of the terminal area | region 23 and the terminal area | region 24 is not specifically limited. For example, as shown in FIG. 1 (a), a quadrangular shape can be used, or as shown in FIG. 2 (a), a semicircular shape can be used. Of course, other shapes may be used. Moreover, the shape of the protrusion part of the terminal area | region 23 and the terminal area | region 24 does not need to be the same all, and a shape may differ for every protrusion part.

  In another embodiment of the flexible wiring board 21, the circuit region 27 has a narrow width in the longitudinal direction in the boundary region 25 and the boundary region 26. Specifically, as shown in FIGS. 3A and 4A, in the semiconductor device 1, the boundary region 25 and the boundary region 26 are bound in both longitudinal directions. As a result, the longitudinal widths of the terminal region 23 and the terminal region 24 are wider than the longitudinal widths of the boundary region 26 and the boundary region 25, respectively. In this embodiment, the width in the longitudinal direction of the circuit region 27 excluding the boundary region 25 and the boundary region 26 may be smaller than or equal to the width in the longitudinal direction of the terminal region 23 and the terminal region 24. It may be wide. 3A and 4A, the boundary region 25 and the boundary region 26 are bundled in both longitudinal directions, but may be configured to be bundled only in one direction.

  In the present embodiment, the shapes of the constricted portions of the boundary region 25 and the boundary region 26 are not particularly limited. For example, as shown to Fig.3 (a), it can be set as a substantially square shape, and it can be set as a semicircle shape as shown to Fig.4 (a). Of course, other shapes may be used. Moreover, the shape of the constriction part of the boundary area | region 25 and the boundary area | region 26 does not need to be the same all, and a shape may differ for every constriction part.

  Further, in the flexible wiring board 21, as shown in FIGS. 1 (b), 2 (b), 3 (b), and 4 (b), both ends in the longitudinal direction of the boundary region 25 and the boundary region 26 are The shape is rounded. In other words, the boundary region 25 and the boundary region 26 are shapes in which rounded shapes are hollowed out from both ends in the longitudinal direction. In the present embodiment, both ends of the boundary region 25 and the boundary region 26 have rounded shapes, but the present invention is not limited to this. That is, it is only necessary that at least one of both ends of the boundary region 25 and the boundary region 26 has a rounded shape. The shapes of the boundary region 25 and the boundary region 26 will be described more specifically below, but the present invention is not limited to these.

  In the flexible wiring board 21 shown in FIG. 1A and FIG. 2A, as shown in FIG. 1B and FIG. One corner is hollowed out by a rounded quadrangle. Although not shown, the boundary region 26 has the same shape as the boundary region 25.

  Further, in the flexible wiring board 21 shown in FIG. 3 (a), as shown in FIG. 3 (b), the boundary region 25 is formed by a rectangle whose two longitudinal ends are rounded at two adjacent corners. It has a hollow shape. Although not shown, the boundary region 26 has the same shape as the boundary region 25.

  Further, in the flexible wiring board 21 shown in FIG. 4A, the boundary region 25 has a shape in which both ends of the rectangular longitudinal direction are hollowed out by a semicircle as shown in FIG. 4B. Although not shown, the boundary region 26 has the same shape as the boundary region 25.

  In the flexible wiring board 21 according to the present embodiment, the region including the end of the tangent line between the terminal region 23 and the boundary region 26 and the region including the end of the tangent line between the terminal region 24 and the boundary region 25 are patterned with metal. Preferably it is. The “region including the end of the tangent” may be a region including the end of the tangent, and the specific range of the region is not particularly limited. Specifically, the region including the terminal of the tangent line between the terminal region 24 and the boundary region 25 is, for example, a region A shown in FIG. 1A, a region B shown in FIG. 2A, and FIG. And a region D shown in FIG. 4A. The same applies to the region including the terminal end of the tangent line between the terminal region 23 and the boundary region 26, and a person skilled in the art in view of the above example of the region including the terminal end of the tangent line between the terminal region 24 and the boundary region 25, Since the area can be easily understood, detailed description thereof is omitted.

  As is apparent from FIGS. 1A, 2A, 3A, and 4A, the flexible wiring board 21 according to the present embodiment has a terminal area 23 and a boundary area 26. There may be two regions including the tangent ends, and two regions including the tangent ends of the terminal region 24 and the boundary region 25. All of these four regions may be patterned with metal, or only a part of the four regions may be patterned with copper.

  The metal is not particularly limited, but it is preferable to use the same metal as the material used for the wiring pattern formed on the insulating tape in the manufacturing process of the flexible wiring board 21. That is, it is preferable to use a conductive metal as the metal. Specifically, copper, silver, etc. can be mentioned, for example.

  The semiconductor device 1 according to the present embodiment has a configuration in which the semiconductor element 22 is disposed in a partial region of the circuit region 27 of the flexible wiring board 21 described above. Examples of the semiconductor element 22 include a large scaled integrated circuit (LSI) such as a CPU (Central Processing Unit) and a memory, and an IC chip. The semiconductor element 22 is provided with a plurality of protruding electrodes (not shown). The protruding electrode is an electrode protruding in a substantially vertical direction from the surface facing the flexible wiring board 21 when the semiconductor element 22 is mounted on the flexible wiring board 21. The protruding electrode is used to electrically connect the semiconductor element 22 and the flexible wiring board 21. For this reason, the protruding electrode may be made of a conductive material, and its shape is not limited. However, a shape that facilitates connection with the flexible wiring board 21 is preferable. As the protruding electrode, for example, a cylindrical, prismatic, or ball-shaped electrode made of Au or solder can be used.

  Specifically, the semiconductor element 22 is disposed on the flexible wiring board 21 by bonding the protruding electrode and a wiring pattern formed on the flexible wiring board 21. By connecting each wiring of the wiring pattern arranged on the flexible wiring board 21 and the protruding electrode of the semiconductor element 22 corresponding to each wiring, the wiring pattern and the semiconductor element 22 are electrically connected.

  The semiconductor device 1 according to the present embodiment can be a semiconductor module (electronic device) by connecting to other electronic components. In such a semiconductor module, for example, the semiconductor device 1 can drive and control other electronic components. As the semiconductor module, for example, a display device described in a second embodiment described later can be given.

[Embodiment 2]
Another embodiment according to the present invention will be described below with reference to FIGS. For convenience of explanation, members having the same functions as those used in the first embodiment are denoted by the same member numbers, and description thereof is omitted.

  As shown in FIG. 5A, the display device 9 according to the present embodiment includes a liquid crystal panel 10 (display panel), a liquid crystal driver 20 (semiconductor device), and a PWB 30 (external circuit board). In FIG. 5A, the gate-side liquid crystal driver 20 is referred to as a gate liquid crystal driver 20a, and the source-side liquid crystal driver 20 is referred to as a source liquid crystal driver 20b. Similarly, the gate-side PWB 30 is referred to as a gate PWB 30a, and the source-side PWB 30 is referred to as a source PWB 30b. In this specification, the semiconductor device is collectively referred to as a liquid crystal driver 20 without distinguishing between the gate liquid crystal driver 20a and the source liquid crystal driver 20b. Similarly, PWB is collectively referred to as PWB without distinguishing between the gate PWB 30a and the source PWB 30b.

  As shown in FIGS. 6A and 6B, the liquid crystal panel 10 includes a glass 11, a glass 12, and a liquid crystal layer (not shown). The liquid crystal layer is disposed between the glass 11 and the glass 12. The glass 11 is a color filter side glass, and a color filter (not shown) is provided thereon. On the other hand, the glass 12 is a TFT side glass, and although not shown, signal wiring, pixels, and the like are formed on the glass 12. The pixel includes a thin film transistor (hereinafter also referred to as “TFT”) which is a switching element, a pixel electrode, and the like. The pixels are arranged in an XY matrix (two-dimensional matrix) at a predetermined pitch on the glass 12. The source electrode and the gate electrode of the TFT are connected to the source electrode line and the gate electrode line, respectively. Further, the source electrode line and the gate electrode line extend in the column direction and the row direction of the glass 12, respectively. In the present embodiment, glass substrates of glass 11 and glass 12 are used for the liquid crystal panel 10, but the present invention is not limited to this. That is, conventionally known transparent substrates other than glass can be used for the glass 11 and the glass 12.

  The liquid crystal driver 20 functions as a liquid crystal display driving unit in the display device 9. The display device 9 according to the present embodiment includes the semiconductor device 1 described in the first embodiment as the liquid crystal driver 20. In the following description, the liquid crystal driver 20 and the semiconductor device 1 are used as interchangeable terms. As the liquid crystal driver 20, as shown in FIGS. 5B to 5E, any one of the semiconductor devices 1 described in the first embodiment may be used. Further, as shown in FIG. 5A, the display device 9 includes a plurality of liquid crystal drivers 20, in other words, a plurality of semiconductor devices 1. However, all of them may be the same semiconductor device 1. However, the semiconductor devices 1 having different forms may be used in combination.

  The pitch of the output terminals 29 of the semiconductor device 1 used as the gate liquid crystal driver 20a is set to coincide with the pitch of the gate electrode lines of the liquid crystal panel 10. Similarly, the pitch of the output terminals 29 of the semiconductor device 1 used as the source liquid crystal driver 20b is set to coincide with the pitch of the source electrode lines of the liquid crystal panel 10. On the other hand, the pitch of the input terminals 28 of the semiconductor device 1 used as the gate liquid crystal driver 20a is set to coincide with the pitch of the output terminals of the gate PWB 30a. Similarly, the pitch of the input terminals 28 of the semiconductor device 1 used as the source liquid crystal driver 20b is set to match the pitch of the output terminals of the source PWB 30b.

  The liquid crystal panel 10 is electrically connected to the liquid crystal driver 20. Specifically, the gate electrode line of the liquid crystal panel 10 is connected to the output terminal 29 of the semiconductor device 1 used as the gate liquid crystal driver 20a. The source electrode line of the liquid crystal panel 10 is connected to the output terminal 29 of the semiconductor device 1 used as the source liquid crystal driver 20b. Although the connection method of these electrode wires and terminals is not particularly limited, specifically, for example, as shown in FIGS. 5B to 5E and FIGS. 7A and 7B. As described above, the output terminal 29 of the semiconductor device 1 used as the source liquid crystal driver 20b and the output terminal 29 of the semiconductor device 1 used as the gate liquid crystal driver 20a are respectively provided on the source electrode line and the gate electrode line of the liquid crystal panel 10. It can be connected by superposing via thermosetting adhesive 43 and thermocompression bonding. Examples of the thermosetting adhesive 43 include an anisotropic conductive film (hereinafter also referred to as “ACF”), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), and NCP (Non Conductive Paste). Can be mentioned. Among them, it is preferable to use ACF. In place of the thermosetting adhesive 43, a semi-thermosetting adhesive can also be used.

  Here, referring to FIG. 7C, the source electrode line and the gate electrode line of the liquid crystal panel 10 (in FIG. 7C, the source electrode line and the gate electrode line are collectively referred to as “electrode line 13”. And the output terminal 29 will be described in more detail. A thermosetting adhesive 43 is disposed on the electrode wire 13 provided on the glass 12, and a terminal region 24 of the liquid crystal driver 20 (semiconductor device 1) is disposed thereon. The thermosetting adhesive 43 includes conductive particles 44, and the output terminal 29 formed in the terminal region 24 is connected to the electrode wire 13 through the conductive particles 44. Thereby, the electrode line 13 of the liquid crystal panel 10 and the output terminal 29 of the liquid crystal driver 20 are electrically connected.

  The PWB 30 transmits a signal for displaying an image on the liquid crystal panel 10 to the liquid crystal panel 10. The PWB 30 is formed with a circuit and has an output terminal (not shown) for outputting a signal to the liquid crystal driver 20.

  As shown in FIGS. 7A and 7D, the PWB 30 is electrically connected to the liquid crystal driver 20. Specifically, each of the input terminal 28 of the gate liquid crystal driver 20a and the input terminal 28 of the source liquid crystal driver 20b, and each of an output terminal (not shown) of the gate PWB 30a and an output terminal (not shown) of the source PWB 30b. Are connected via a thermosetting adhesive 43 such as ACF, ACP, NCF, or NCP. Further, instead of the thermosetting adhesive 43, a semi-thermosetting adhesive can also be used.

  The present invention is not limited to the configuration described above, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  As described above, the present invention includes a terminal region provided with a terminal for connecting to an external circuit, and a circuit region in contact with the terminal region, and the width in the longitudinal direction of the terminal region is the terminal of the circuit region. Provided is a flexible wiring board that is wider than a width in a longitudinal direction of a boundary region in contact with the region. Therefore, in the module mounted with the flexible wiring board, the flexible wiring board is not peeled off or damaged due to an impact or the like, and a module in which disconnection hardly occurs can be realized. Therefore, the present invention can be used not only for various modules including a flexible wiring board such as a semiconductor device and a display device, but also for various electronic devices including such modules, for example, televisions, notebook computers, and games. It can be widely applied to devices and mobile phones.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view of the semiconductor device concerning one Embodiment of this invention, (a) is a top view which shows the whole semiconductor device, (b) is an enlarged view of the area | region A in (a). It is a top view of the semiconductor device concerning another embodiment of the present invention, (a) is a top view showing the whole semiconductor device, and (b) is an enlarged view of field B in (a). It is a top view of the semiconductor device concerning another embodiment of the present invention, (a) is a top view showing the whole semiconductor device, and (b) is an enlarged view of field C in (a). It is a top view of the semiconductor device concerning another embodiment of the present invention, (a) is a top view showing the whole semiconductor device, and (b) is an enlarged view of field D in (a). In the display apparatus concerning one Embodiment of this invention, it is a figure which shows the connection with a liquid crystal panel, a liquid crystal driver, and PWB, (a) is the state by which the liquid crystal panel, the liquid crystal driver, and PWB were mounted. It is the top view to show, (b)-(d) is the enlarged view of the part M in (a), and shows the structure provided with the liquid crystal driver concerning each different embodiment. It is a figure which shows the liquid crystal panel of the display apparatus concerning one Embodiment of this invention, (a) is a top view, (b) is sectional drawing. (A) is sectional drawing which cut | disconnected the display apparatus of Fig.5 (a) by the EE 'line, (b) is an enlarged view of the area | region F in (a), (c) is the area | region H in (b). (D) is an enlarged view of region G in (a). It is a top view of the conventional semiconductor device. It is a top view which shows the peeling trouble of a liquid crystal driver in the conventional display apparatus. It is sectional drawing which shows the peeling trouble of a liquid crystal driver in the conventional display apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 9 Display apparatus 10 Liquid crystal panel (display panel)
20 LCD driver (semiconductor device)
20a gate liquid crystal driver 20b source liquid crystal driver 21 flexible wiring board 22 semiconductor element 23 terminal area 24 terminal area 25 boundary area 26 boundary area 27 circuit area 28 input terminal 29 output terminal 30 PWB (external circuit board)
30a Gate PWB
30b Source PWB

Claims (9)

A terminal region provided with terminals for connection to an external circuit, and a circuit region in contact with the terminal region;
The flexible wiring board, wherein a width in a longitudinal direction of the terminal region is wider than a width in a longitudinal direction of a boundary region in contact with the terminal region of the circuit region.   The flexible wiring board according to claim 1, wherein a width of the terminal region in a longitudinal direction is wider than a width of the circuit region in a longitudinal direction.   The flexible wiring board according to claim 1, wherein the terminal region protrudes in both longitudinal directions with respect to the circuit region.   The flexible circuit board according to any one of claims 1 to 3, wherein the circuit region has a narrow width in the longitudinal direction in the boundary region.   5. The flexible wiring board according to claim 1, wherein in the circuit region, the boundary region is bound in both longitudinal directions.   The flexible wiring board according to claim 1, wherein at least one of both ends of the boundary region in the longitudinal direction has a rounded shape.   The flexible wiring according to any one of claims 1 to 6, wherein at least one of the regions including a terminal end of a tangent line between the terminal region and the boundary region is patterned with a metal. substrate. The flexible wiring board according to any one of claims 1 to 7,
A semiconductor element,
The semiconductor device, wherein the semiconductor element is disposed in the circuit region. A semiconductor device according to claim 8;
A display panel;
An external circuit board,
The display device, wherein the semiconductor device and the display panel are electrically connected, and the semiconductor device and the external circuit board are electrically connected.

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