[go: up one dir, main page]

JP2009026872A - Multilayer capacitor - Google Patents

Multilayer capacitor Download PDF

Info

Publication number
JP2009026872A
JP2009026872A JP2007187017A JP2007187017A JP2009026872A JP 2009026872 A JP2009026872 A JP 2009026872A JP 2007187017 A JP2007187017 A JP 2007187017A JP 2007187017 A JP2007187017 A JP 2007187017A JP 2009026872 A JP2009026872 A JP 2009026872A
Authority
JP
Japan
Prior art keywords
inner conductor
conductor layers
lead
multilayer capacitor
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007187017A
Other languages
Japanese (ja)
Inventor
Kenichi Kitazawa
賢一 北澤
Takafumi Suzuki
貴文 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2007187017A priority Critical patent/JP2009026872A/en
Publication of JP2009026872A publication Critical patent/JP2009026872A/en
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor wherein a lower ESL is realized. <P>SOLUTION: By having the end edges of drawn parts 15a and 16a of first and second inner conductor layers 15 and 16 constituting independent capacitor parts are exposed partially from both side surfaces of a body 11 between first and second outer electrodes 12 and 13, to which the drawn parts 15a and 16a of the first and second inner conductor layers 15 and 16 connected, the length of a current path from the drawn part 15a of one polarity to the drawn part 16a of the other polarity is shortened so that the inductance generated in the current path is lowered, while the drawn part 15a of one polarity and the drawn part 16a of the other polarity are made close to each other, for effective magnetic field cancelation action that is provided by the current that flows through the drawn parts 15a and 16a in the reverse directions. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、デカップリングの用途に適した積層コンデンサに関する。   The present invention relates to a multilayer capacitor suitable for decoupling applications.

デカップリングに用いられる積層コンデンサには高静電容量と低ESL(等価直列インダクタンス)が求められており、特許文献1及び2にはこの種の積層コンデンサが開示されている。   A multilayer capacitor used for decoupling requires high capacitance and low ESL (equivalent series inductance). Patent Documents 1 and 2 disclose this type of multilayer capacitor.

特許文献1の積層コンデンサは、直方体形状の本体と、本体の幅方向両側面それぞれに非接触で4個ずつ設けられた極性が交互に異なる計8個の外部電極とを備えている。本体は、幅方向両側縁にそれぞれ2個ずつ設けられた計4個の引出部を有する第1内部導体層と、幅方向両側縁にそれぞれ2個ずつ設けられた計4個の引出部を第1内部導体層の引出部とは異なる位置に有する第2内部導体層とを、誘電体層を介して交互に積層して一体化した構造を有している。各第1内部導体層の4個の引出部は一方極性の4個の外部電極に接続され、各第2内部導体層の4個の引出部は他方極性の残り4個の外部電極に接続されている。   The multilayer capacitor disclosed in Patent Document 1 includes a rectangular parallelepiped main body and a total of eight external electrodes that are provided in a non-contact manner on each of both sides in the width direction of the main body and have four different polarities. The main body has a first inner conductor layer having a total of four lead portions provided on each side edge in the width direction and a total of four lead portions provided on each side edge in the width direction. It has a structure in which the second inner conductor layers having positions different from the lead portions of the one inner conductor layer are alternately laminated and integrated through the dielectric layers. The four lead portions of each first inner conductor layer are connected to four external electrodes of one polarity, and the four lead portions of each second inner conductor layer are connected to the remaining four external electrodes of the other polarity. ing.

一方、特許文献2の積層コンデンサは、特許文献1の積層コンデンサの各第1内部導体層を幅方向に2分割すると共に各第2内部導体層を幅方向に2分割したような構造を備えている。
特表2002−508114号公報 特開2002−151349号公報
On the other hand, the multilayer capacitor disclosed in Patent Document 2 has a structure in which each first inner conductor layer of the multilayer capacitor disclosed in Patent Document 1 is divided into two in the width direction and each second inner conductor layer is divided in two in the width direction. Yes.
Special table 2002-508114 gazette JP 2002-151349 A

積層コンデンサの静電容量は基本的には内部導体層の積層数によって調整できるため、特許文献1及び特許文献2の積層コンデンサの何れもデカップリングの用途に適した充分な静電容量を得ることができる。   Since the capacitance of the multilayer capacitor can be basically adjusted by the number of laminated inner conductor layers, both of the multilayer capacitors disclosed in Patent Document 1 and Patent Document 2 can obtain sufficient capacitance suitable for decoupling applications. Can do.

一方、積層コンデンサのESLは該積層コンデンサの全体構造によって決まるものであるが、特許文献1及び特許文献2の積層コンデンサでは誘電体層を介して隣り合う異極性の引出部に流れる電流の向きが逆になるようにすることで各々の引出部に流れる電流により生じる磁界を相殺してESL低減を図っている。   On the other hand, the ESL of the multilayer capacitor is determined by the overall structure of the multilayer capacitor. However, in the multilayer capacitors of Patent Document 1 and Patent Document 2, the direction of the current flowing through the different-polarity lead-out portions through the dielectric layer is determined. By making it reverse, the magnetic field generated by the current flowing through each lead-out portion is canceled out to reduce ESL.

特許文献1及び特許文献2の積層コンデンサで採用されているESL低減手法は、一方極性の引出部から他方極性の引出部への電流経路で生じたインダクタンスを磁界相殺作用によって低減するものであるが、一方極性の引出部から他方極性の引出部への電流経路の長さを短くして該電流経路で生じ得るインダクタンスを低下させればより一層のESL低減を図ることができ、また、一方極性の引出部と他方極性の引出部を近づけて磁界相殺作用が効果的に行えるようにすればより一層のESL低減を図ることができる。   The ESL reduction method employed in the multilayer capacitors disclosed in Patent Document 1 and Patent Document 2 is to reduce the inductance generated in the current path from the one polarity lead portion to the other polarity lead portion by the magnetic field canceling action. If the length of the current path from the one-polarity lead part to the other-polarity lead part is shortened to reduce the inductance that can occur in the current path, the ESL can be further reduced. If the lead portion and the other polarity lead portion are brought close to each other so that the magnetic field canceling action can be effectively performed, the ESL can be further reduced.

本発明は前記事情に鑑みて創作されたもので、その目的とするところは、より一層の低ESL化が図られた積層コンデンサを提供することにある。   The present invention was created in view of the above circumstances, and an object of the present invention is to provide a multilayer capacitor in which ESL is further reduced.

前記目的を達成するため、本発明は、直方体形状の本体の側面に一方極性の第1外部電極と他方極性の第2外部電極とを非接触で交互に設けた積層コンデンサであって、本体は、同一平面に非接触で並ぶ複数の第1内部導体層と、同一平面に非接触で並ぶ第1内部導体層と同数の第2内部導体層とを、誘電体層を介して交互に積層して一体化した構造を有していて、誘電体層を介して積層方向で並ぶ第1,第2内部電極層それぞれによって複数の独立コンデンサ部を構成しており、各独立コンデンサ部の第1,第2内部導体層は同じ側縁の異なる位置に1つの引出部を有していて、各独立コンデンサ部の第1内部導体層の引出部は第1外部電極にそれぞれ接続され、且つ、第2内部導体層の引出部は該第1外部電極と隣接する第2外部電極にそれぞれ接続されており、各独立コンデンサ部の第1,第2内部導体層の引出部の端縁は該第1,第2内部導体層の引出部が接続された第1,第2外部電極の間の本体の側面で部分的に露出していて、該端縁露出部分は本体の側面の第1,第2外部電極の間に設けられた絶縁被覆部によって覆い隠されている、ことをその特徴とする。   To achieve the above object, the present invention provides a multilayer capacitor in which a first external electrode having one polarity and a second external electrode having the other polarity are alternately provided in a non-contact manner on a side surface of a rectangular parallelepiped body. A plurality of first inner conductor layers arranged in a non-contact manner on the same plane and the same number of second inner conductor layers as the first inner conductor layers arranged in a non-contact manner on the same plane are alternately stacked via dielectric layers. A plurality of independent capacitor portions are constituted by the first and second internal electrode layers arranged in the stacking direction via the dielectric layers, and the first and second inner capacitor portions are respectively The second inner conductor layer has one lead portion at a different position on the same side edge, the lead portion of the first inner conductor layer of each independent capacitor portion is connected to the first outer electrode, and the second The lead portion of the inner conductor layer is connected to the second outer electrode adjacent to the first outer electrode. The first and second external conductors connected to the lead portions of the first and second inner conductor layers are connected to each other, and the edge portions of the lead portions of the first and second inner conductor layers of each independent capacitor portion are connected to each other. It is partially exposed on the side surface of the main body between the electrodes, and the exposed edge portion is covered with an insulating coating provided between the first and second external electrodes on the side surface of the main body. Is the feature.

この積層コンデンサによれば、各独立コンデンサ部の第1,第2内部導体層の引出部の端縁を該第1,第2内部導体層の引出部が接続された第1,第2外部電極の間の本体の側面で部分的に露出させることによって、一方極性の引出部から他方極性の引出部への電流経路の長さを短くして該電流経路で生じ得るインダクタンスを低下させることができ、しかも、一方極性の引出部と他方極性の引出部を近づけて該引出部に逆向きに流れる電流により得られる磁界相殺作用を効果的に行うことができ、これにより積層コンデンサのESLをより一層低減することができる。   According to this multilayer capacitor, the first and second external electrodes to which the lead portions of the first and second internal conductor layers are connected to the end edges of the lead portions of the first and second internal conductor layers of each independent capacitor portion By partially exposing the side surface of the main body, the length of the current path from the one polarity lead portion to the other polarity lead portion can be shortened, and the inductance that can be generated in the current path can be reduced. In addition, it is possible to effectively cancel the magnetic field obtained by the current flowing in the opposite direction by bringing the one-polarity lead portion and the other-polarity lead portion close to each other, thereby further increasing the ESL of the multilayer capacitor. Can be reduced.

本発明によれば、より一層の低ESL化が図られた積層コンデンサを提供することができる。   According to the present invention, it is possible to provide a multilayer capacitor in which ESL is further reduced.

本発明の前記目的とそれ以外の目的と、構成特徴と、作用効果は、以下の説明と添付図面によって明らかとなる。   The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[第1実施形態]
図1〜図4は本発明(積層コンデンサ)の第1実施形態を示すもので、図1は積層コンデンサの斜視図、図2は図1に示した積層コンデンサの左側面図、図3は図1に示した積層コンデンサの横断面図、図4は図1に示した本体の層構成を示す斜視図である。
[First Embodiment]
1 to 4 show a first embodiment of the present invention (multilayer capacitor). FIG. 1 is a perspective view of the multilayer capacitor, FIG. 2 is a left side view of the multilayer capacitor shown in FIG. 1, and FIG. 1 is a cross-sectional view of the multilayer capacitor shown in FIG. 1, and FIG. 4 is a perspective view showing the layer structure of the main body shown in FIG.

この積層コンデンサ10は、所定の長さ,幅及び高さを有する直方体形状の本体11と、本体11の幅方向両側面それぞれに非接触で交互に設けられた一方極性の計4個の第1外部電極12と他方極性の計4個の第2外部電極13と、本体11の幅方向両側面の第1,第2外部電極12,13の間に設けられた計4個の絶縁被覆部14とを備えている。   The multilayer capacitor 10 includes a rectangular parallelepiped main body 11 having a predetermined length, width, and height, and a total of four first polarities provided in a non-contact manner on both side surfaces of the main body 11 in the width direction. A total of four insulation coating portions 14 provided between the external electrode 12 and the total of four second external electrodes 13 of the other polarity and the first and second external electrodes 12 and 13 on both side surfaces of the main body 11 in the width direction. And.

第1外部電極12と第2外部電極13は本体11の幅方向両側面それぞれに2個ずつ設けられており、本体11の一側面(図1の右側面)には計4個の第1,第2外部電極12,13が左から第1外部電極12,第2外部電極13,第1外部電極12,第2外部電極13の順に並んでいて、本体11の他側面(図1の左側面)には一側面の第1,第2外部電極12,13と向き合うように計4個の第1,第2外部電極12,13が左から第2外部電極13,第1外部電極12,第2外部電極13,第1外部電極12の順に並んでいる。   Two first external electrodes 12 and two second external electrodes 13 are provided on each side surface in the width direction of the main body 11, and a total of four first, first and second external electrodes 12 are provided on one side surface (the right side surface in FIG. 1). The second external electrodes 12, 13 are arranged in the order of the first external electrode 12, the second external electrode 13, the first external electrode 12, and the second external electrode 13 from the left, and the other side surface of the main body 11 (the left side surface in FIG. 1). ), A total of four first and second external electrodes 12 and 13 are arranged from the left so as to face the first and second external electrodes 12 and 13 on one side surface. The two external electrodes 13 and the first external electrode 12 are arranged in this order.

本体11は、図4に示すように、同一平面に非接触で並ぶ2個の第1内部導体層15と、同一平面に非接触で並ぶ第1内部導体層と同数の第2内部導体層16とを、誘電体層DLを介して交互に積層して一体化した構造を有している。各第1内部導体層15と各第2内部導体層16はほぼ同サイズの矩形状を成し、同一平面に非接触で並ぶ2個の第1内部導体層15と同一平面に非接触で並ぶ2個の第2内部導体層16は誘電体層DLを介して積層方向で向き合っている。つまり、本体11には、誘電体層DLを介して積層方向で並ぶ第1,第2内部電極層15,16それぞれによって2個の独立コンデンサ部(符号無し)が長さ方向に間隔をおいて構成されている。   As shown in FIG. 4, the main body 11 includes two first inner conductor layers 15 arranged in a non-contact manner on the same plane, and the same number of second inner conductor layers 16 as the first inner conductor layers arranged in a non-contact manner on the same plane. Are alternately stacked through a dielectric layer DL and integrated. Each of the first inner conductor layers 15 and each of the second inner conductor layers 16 has a rectangular shape having substantially the same size, and is arranged in a non-contact manner in the same plane as the two first inner conductor layers 15 arranged in a non-contact manner in the same plane. The two second inner conductor layers 16 face each other in the stacking direction via the dielectric layer DL. In other words, in the main body 11, two independent capacitor portions (not shown) are spaced in the length direction by the first and second internal electrode layers 15 and 16 arranged in the stacking direction via the dielectric layer DL. It is configured.

各第1内部導体層15はその幅方向一側縁(図4の右側縁)と幅方向他側縁(図4の左側縁)にそれぞれ1個の引出部15aを有し、各第2内部導体層16はその幅方向一側縁(図4の右側縁)と幅方向他側縁(図4の左側縁)にそれぞれ1個の引出部15aを有している。各第1内部導体層15の引出部15aと各第2内部導体層16の引出部16aはほぼ同サイズの矩形状を成し、同一平面に非接触で並ぶ2個の第1内部導体層15の引出部15aの位置と同一平面に非接触で並ぶ2個の第2内部導体層16の引出部16aの位置は長さ方向で異なっている。   Each first inner conductor layer 15 has one lead portion 15a on one side edge in the width direction (right side edge in FIG. 4) and the other side edge in the width direction (left side edge in FIG. 4). The conductor layer 16 has one lead portion 15a on one side edge in the width direction (right side edge in FIG. 4) and the other side edge in the width direction (left side edge in FIG. 4). The lead portion 15a of each first inner conductor layer 15 and the lead portion 16a of each second inner conductor layer 16 form a rectangular shape having substantially the same size, and are arranged in a non-contact manner on the same plane. The positions of the lead portions 16a of the two second inner conductor layers 16 arranged in a non-contact manner in the same plane as the positions of the lead portions 15a differ in the length direction.

図3に示すように、一方の独立コンデンサ部(図3の左側に構成されるコンデンサ部)を構成する各第1内部電極層15の一側縁(図3の上側縁)の引出部15aは本体11の一側面(図3の上側面)の最も左に位置する第1外部電極12に接続され、他側縁(図3の下側縁)の引出部15aは本体11の他側面(図3の下側面)の左から2番目に位置する第1外部電極12に接続されている。また、一方の独立コンデンサ部(図3の左側に構成されるコンデンサ部)を構成する各第2内部電極層16の一側縁(図3の上側縁)の引出部16aは本体11の一側面(図3の上側面)の左から2番目に位置する第2外部電極13に接続され、他側縁(図3の下側縁)の引出部16aは本体11の他側面(図3の下側面)の最も左に位置する第2外部電極13に接続されている。   As shown in FIG. 3, the lead-out portion 15a on one side edge (upper edge in FIG. 3) of each first internal electrode layer 15 constituting one independent capacitor portion (capacitor portion configured on the left side in FIG. 3) Connected to the first external electrode 12 located on the leftmost side of one side of the main body 11 (upper side of FIG. 3), the lead-out portion 15a on the other side edge (lower side edge of FIG. 3) 3 is connected to the first external electrode 12 located second from the left. Further, the lead-out portion 16a at one side edge (upper edge in FIG. 3) of each second internal electrode layer 16 constituting one independent capacitor portion (capacitor portion configured on the left side in FIG. 3) is one side surface of the main body 11. Connected to the second external electrode 13 located second from the left (upper side surface in FIG. 3), the lead-out portion 16a at the other side edge (lower side edge in FIG. 3) is connected to the other side surface of the main body 11 (lower side in FIG. 3). The second external electrode 13 located on the leftmost side of the side surface is connected.

他方の独立コンデンサ部(図3の右側に構成されるコンデンサ部)を構成する各第1内部電極層15の一側縁(図3の上側縁)の引出部15aは本体11の一側面(図3の上側面)の左から3番目に位置する第1外部電極12に接続され、他側縁(図3の下側縁)の引出部15aは本体11の他側面(図3の下側面)の左から4番目に位置する第1外部電極12に接続されている。また、一方の独立コンデンサ部(図3の右側に構成されるコンデンサ部)を構成する各第2内部電極層16の一側縁(図3の上側縁)の引出部16aは本体11の一側面(図3の上側面)の左から4番目に位置する第2外部電極13に接続され、他側縁(図3の下側縁)の引出部16aは本体11の他側面(図3の下側面)の左から3番目に位置する第2外部電極13に接続されている。   The lead-out portion 15a at one side edge (upper edge in FIG. 3) of each first internal electrode layer 15 constituting the other independent capacitor portion (capacitor portion configured on the right side of FIG. 3) is one side surface of the main body 11 (FIG. 3 is connected to the first external electrode 12 located at the third position from the left, and the lead portion 15a at the other side edge (lower side edge in FIG. 3) is the other side surface of the main body 11 (lower side face in FIG. 3). Is connected to the first external electrode 12 located fourth from the left. Further, the lead-out portion 16a at one side edge (upper edge in FIG. 3) of each second internal electrode layer 16 constituting one independent capacitor portion (capacitor portion configured on the right side in FIG. 3) is one side surface of the main body 11. Connected to the second external electrode 13 located fourth from the left (upper side surface in FIG. 3), the lead-out portion 16a at the other side edge (lower side edge in FIG. 3) is connected to the other side surface of the main body 11 (lower side in FIG. 3). The second external electrode 13 located third from the left side surface is connected.

図3に示すように、本体11の一側面(図3の上側面)に設けられた計4個の第1,第2外部電極12,13(2個の第1外部電極12と2個の第2外部電極13)の幅Waは全て等しく、隣接する第1,第2外部電極12,13の内側縁間隔a1〜a3も全て等しい。また、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの幅Wb,Wcは全て等しく、該幅Wb,Wcは前記幅Waよりも大きい。しかも、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの内側縁間隔b1,b2は全て等しい値で零よりも大きく、且つ、両引出部15a,16aは積層方向で向き合っておらず、また、該内側縁間隔b1,b2は前記内側縁間隔a1〜a3よりも小さい。   As shown in FIG. 3, a total of four first and second external electrodes 12 and 13 (two first external electrodes 12 and two first external electrodes 12 and two pieces provided on one side surface (upper side surface in FIG. 3) of the main body 11. The widths Wa of the second external electrodes 13) are all equal, and the inner edge intervals a1 to a3 of the adjacent first and second external electrodes 12 and 13 are also equal. Also, the widths Wb and Wc of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting each independent capacitor portion are all equal, and the widths Wb and Wc are larger than the width Wa. In addition, the inner edge intervals b1 and b2 of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are all equal and larger than zero, and both the lead portions 15a and 15a, 16a does not face in the stacking direction, and the inner edge intervals b1 and b2 are smaller than the inner edge intervals a1 to a3.

つまり、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの端縁は該第1,第2内部導体層15,16の引出部15a,16aが接続された第1,第2外部電極12,13の間の本体11の側面で部分的に露出している。   That is, the leading edges 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor sections are connected to the leading edges 15a and 16a of the first and second inner conductor layers 15 and 16, respectively. The first and second external electrodes 12 and 13 are partially exposed at the side surface of the main body 11.

寸法線等の図示を省略したが、本体11の他側面側(図3の下側面側)の各第1,第2外部電極12,13の幅と、隣接する第1,第2外部電極12,13の内側縁間隔と、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの幅と、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの内側縁間隔は前記と同じである。   Although illustration of dimension lines and the like is omitted, the widths of the first and second external electrodes 12 and 13 on the other side of the main body 11 (the lower side of FIG. 3) and the adjacent first and second external electrodes 12 are omitted. , 13, the widths of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions, and the first and second inner conductors constituting the independent capacitor portions, respectively. The inner edge intervals of the lead portions 15a and 16a of the layers 15 and 16 are the same as described above.

各絶縁被覆部14は絶縁性材料から成り、図2及び図3に示すように、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの端縁が部分的に露出する本体11の両側面の第1,第2外部電極12,13の間に帯状に設けられていて、該端縁露出部分はそれぞれ絶縁被覆部14によって覆い隠されている。また、各絶縁被覆部14の厚さは第1,第2外部電極12,13の厚さよりも小さい。   Each insulation coating portion 14 is made of an insulating material, and as shown in FIGS. 2 and 3, the edges of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are formed. Between the first and second external electrodes 12 and 13 on both side surfaces of the body 11 that are partially exposed, the edge exposed portions are respectively covered with an insulating coating portion 14. Further, the thickness of each insulation coating portion 14 is smaller than the thickness of the first and second external electrodes 12 and 13.

各絶縁被覆部14は本体11を構成する誘電体層DLと同じ材料とすることが好ましく、例えば誘電体層DLがチタン酸バリウム系誘電体材料から成る場合には各絶縁被覆部14もこれと同一組成のチタン酸バリウム系誘電体材料とすることが好ましい。各絶縁被覆部14の材料を本体11を構成する誘電体層DLと同じ材料とすれば、積層,圧着後の未焼成本体11の両側面に誘電体層DLと同じセラミックスラリーを用いて未焼成絶縁被覆部14を形成したものを同時焼成して絶縁被覆部14が一体化された本体11を得ることができる。   Each insulating coating portion 14 is preferably made of the same material as that of the dielectric layer DL constituting the main body 11. For example, when the dielectric layer DL is made of a barium titanate-based dielectric material, each insulating coating portion 14 is also formed of the same. It is preferable to use a barium titanate-based dielectric material having the same composition. If the material of each insulation coating portion 14 is the same as that of the dielectric layer DL constituting the main body 11, the same ceramic slurry as that of the dielectric layer DL is used on both sides of the unfired main body 11 after lamination and pressure bonding. The body 11 in which the insulating coating portion 14 is integrated can be obtained by simultaneously firing the insulating coating portion 14 formed.

誘電体層DL,内部電極層15,16及び外部電極12,13の組成等の関係から本体11の焼成と外部電極12,13の焼成を別工程で行う必要がある場合には、未焼成本体11に未焼成絶縁被覆部14を形成して該未焼成本体11と未焼成絶縁被覆部14を同時焼成した後に本体11に電極ペーストを用いて未焼成外部電極12,13を形成してこれを焼成すればよい。また、本体11の焼成と外部電極12,13の焼成を同時に行える場合には、未焼成本体11に未焼成絶縁被覆部14と未焼成外部電極12,13を同順序或いは逆順序で形成して該未焼成本体11と未焼成絶縁被覆部14と未焼成外部電極12,13を同時焼成すればよい。   When the firing of the main body 11 and the firing of the external electrodes 12 and 13 need to be performed in separate processes due to the composition of the dielectric layer DL, the internal electrode layers 15 and 16 and the external electrodes 12 and 13, the unfired main body After forming the unsintered insulation coating portion 14 on 11 and simultaneously firing the unsintered main body 11 and the unsintered insulation coating portion 14, unfired external electrodes 12, 13 are formed on the body 11 using an electrode paste. What is necessary is just to bake. Further, in the case where the main body 11 and the external electrodes 12 and 13 can be simultaneously fired, the unfired insulation coating portion 14 and the unfired external electrodes 12 and 13 are formed on the unfired body 11 in the same or reverse order. The unfired main body 11, the unfired insulation coating portion 14, and the unfired external electrodes 12 and 13 may be fired simultaneously.

この積層コンデンサ10にあっては、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの端縁を該第1,第2内部導体層15,16の引出部15a,16aが接続された第1,第2外部電極12,13の間の本体11の両側面で部分的に露出させることによって、一方極性の引出部15aから他方極性の引出部16aへの電流経路の長さを短くして該電流経路で生じ得るインダクタンスを低下させることができ、しかも、一方極性の引出部15aと他方極性の引出部16aを近づけて該引出部15a,16aに逆向きに流れる電流により得られる磁界相殺作用を効果的に行うことができ、これにより積層コンデンサ10のESLをより一層低減することができる。   In this multilayer capacitor 10, the edges of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are connected to the edges of the first and second inner conductor layers 15 and 16, respectively. By partially exposing both sides of the main body 11 between the first and second external electrodes 12 and 13 to which the lead portions 15a and 16a are connected, the lead portion 15a having one polarity and the lead portion 16a having the other polarity are exposed. The length of the current path can be shortened to reduce the inductance that can be generated in the current path, and the one-polarity lead portion 15a and the other-polarity lead portion 16a are brought close to each other and the lead portions 15a and 16a are reversed. The magnetic field canceling action obtained by the current flowing in the direction can be effectively performed, whereby the ESL of the multilayer capacitor 10 can be further reduced.

因みに、実験によれば、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの端縁を第1,第2外部電極12,13の間の本体11の側面で露出させずに該引出部15a,16aの内側縁間隔を400μmとした場合に比べ、前記内側縁間隔b1,b2を340μmとした場合には約16pHのESL低下を、また、前記内側縁間隔b1,b2を250μmとした場合には約30pHのESL低下を図ることができたことを付記する。   Incidentally, according to an experiment, the end edges of the lead portions 15a and 16a of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are connected to the main body 11 between the first and second outer electrodes 12 and 13, respectively. When the inner edge intervals b1 and b2 are set to 340 μm compared to the case where the inner edge intervals of the lead portions 15a and 16a are set to 400 μm without being exposed on the side surfaces of the It is added that the ESL reduction of about 30 pH could be achieved when the edge intervals b1 and b2 were 250 μm.

また、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a,16aの端縁露出部分は本体11の両側面の第1,第2外部電極12,13の間に設けられた絶縁被覆部14によって覆い隠されているので、該端面露出部分が外気に触れて変質することを防止できると共に該端面露出部分を通じて本体11内に水分等が侵入してコンデンサ特性の劣化を生じることも防止できる。   Further, the exposed edge portions of the lead portions 15a and 16a of the first and second internal conductor layers 15 and 16 constituting each independent capacitor portion are between the first and second external electrodes 12 and 13 on both side surfaces of the main body 11. Since the end surface exposed portion is prevented from being touched by external air and denatured, moisture or the like enters the main body 11 through the end surface exposed portion, and thus has capacitor characteristics. Deterioration can also be prevented.

さらに、各絶縁被覆部14の厚さを第1,第2外部電極12,13の厚さよりも小さくしてあるので、積層コンデンサ10の各第1,第2外部電極12,13を回路基板に半田を用いて接続する際に各絶縁被覆部14の存在によって各第1,第2外部電極12,13に対する半田の付着面積が減少することを極力防止することができる。   Furthermore, since the thickness of each insulation coating portion 14 is smaller than the thickness of the first and second external electrodes 12 and 13, the first and second external electrodes 12 and 13 of the multilayer capacitor 10 are used as a circuit board. When connecting using solder, it is possible to prevent as much as possible that the adhesion area of the solder to each of the first and second external electrodes 12 and 13 is reduced due to the presence of each insulating coating portion 14.

[第2実施形態]
図5及び図6は本発明(積層コンデンサ)の第2実施形態を示すもので、図5は図2に対応する積層コンデンサの左側面図、図6は図5に示した積層コンデンサの図3に対応する横断面図である。
[Second Embodiment]
5 and 6 show a second embodiment of the present invention (multilayer capacitor). FIG. 5 is a left side view of the multilayer capacitor corresponding to FIG. 2, and FIG. 6 is a diagram of the multilayer capacitor shown in FIG. FIG.

この積層コンデンサ10-1が前述の積層コンデンサ10と異なるところは、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a1,16a1の幅Wb1,Wc1を前述の積層コンデンサ10の引出部15a,16aの幅Wb,Wcよりも拡大し全て同じ値とした点と、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a1,16a1の内側縁間隔b1,b2を何れも零とした点にある。他の構成は前述の積層コンデンサ10と同じであるためその説明を省略する。   The multilayer capacitor 10-1 differs from the multilayer capacitor 10 described above in that the widths Wb1 and Wc1 of the lead portions 15a1 and 16a1 of the first and second internal conductor layers 15 and 16 constituting the independent capacitor portions are the same as those of the multilayer capacitor 10-1. It is larger than the widths Wb and Wc of the lead portions 15a and 16a of the capacitor 10 and all have the same value, and the lead portions 15a1 and 16a1 of the first and second inner conductor layers 15 and 16 constituting each independent capacitor portion. The inner edge intervals b1 and b2 are both zero. Since other configurations are the same as those of the multilayer capacitor 10 described above, description thereof is omitted.

この積層コンデンサ10-1にあっては、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a1,16a1の内側縁間隔b1,b2を零とすることによって、一方極性の引出部15a1から他方極性の引出部16a1への電流経路の長さをより一層短くして該電流経路で生じ得るインダクタンスをより低下させることができ、しかも、一方極性の引出部15a1と他方極性の引出部16a1をより一層近づけて該引出部15a1,16a1に逆向きに流れる電流により得られる磁界相殺作用をより効果的に行うことができ、これにより積層コンデンサ10-1のESLをより一層低減することができる。他の作用効果は前述の積層コンデンサ10と同じであるためその説明を省略する。   In the multilayer capacitor 10-1, the inner edge intervals b1 and b2 of the lead portions 15a1 and 16a1 of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are set to zero. The length of the current path from the polar lead part 15a1 to the other polar lead part 16a1 can be further shortened to further reduce the inductance that can be generated in the current path. The magnetic pole canceling action obtained by the current flowing in the reverse direction to the lead portions 15a1 and 16a1 can be more effectively performed by bringing the lead portion 16a1 of the polarity closer to each other, thereby further increasing the ESL of the multilayer capacitor 10-1. Can be reduced. Since other functions and effects are the same as those of the multilayer capacitor 10 described above, description thereof is omitted.

[第3実施形態]
図7及び図8は本発明(積層コンデンサ)の第3実施形態を示すもので、図7は図2に対応する積層コンデンサの左側面図、図8は図7に示した積層コンデンサの図3に対応する横断面図である。
[Third Embodiment]
7 and 8 show a third embodiment of the present invention (multilayer capacitor). FIG. 7 is a left side view of the multilayer capacitor corresponding to FIG. 2, and FIG. 8 is a diagram of the multilayer capacitor shown in FIG. FIG.

この積層コンデンサ10-2が前述の積層コンデンサ10と異なるところは、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a2,16a2の幅Wb2,Wc2を前述の積層コンデンサ10の引出部15a,16aの幅Wb,Wcよりも拡大し全て同じ値とした点と、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a1,16a1の内側縁間隔b1,b2を全て等しい値で零よりも大きくし、且つ、両引出部15a1,16a1が積層方向で部分的に向き合うようにした点にある。他の構成は前述の積層コンデンサ10と同じであるためその説明を省略する。   The multilayer capacitor 10-2 differs from the multilayer capacitor 10 described above in that the widths Wb2 and Wc2 of the lead portions 15a2 and 16a2 of the first and second inner conductor layers 15 and 16 constituting the independent capacitor portions are the same as those of the multilayer capacitor 10-2. It is larger than the widths Wb and Wc of the lead portions 15a and 16a of the capacitor 10 and all have the same value, and the lead portions 15a1 and 16a1 of the first and second inner conductor layers 15 and 16 constituting each independent capacitor portion. The inner edge intervals b1 and b2 are all equal and larger than zero, and the two lead portions 15a1 and 16a1 are partially opposed in the stacking direction. Since other configurations are the same as those of the multilayer capacitor 10 described above, description thereof is omitted.

この積層コンデンサ10-2にあっては、各独立コンデンサ部を構成する第1,第2内部導体層15,16の引出部15a2,16a2の内側縁間隔b1,b2を零よりも大きくし、且つ、両引出部15a1,16a1が積層方向で部分的に向き合うようにすることによって、一方極性の引出部15a2から他方極性の引出部16a2への電流経路の長さをより一層短くして該電流経路で生じ得るインダクタンスをより低下させることができ、しかも、一方極性の引出部15a2と他方極性の引出部16a2をより一層近づけて該引出部15a2,16a2に逆向きに流れる電流により得られる磁界相殺作用をより効果的に行うことができ、これにより積層コンデンサ10-2のESLをより一層低減することができる。他の作用効果は前述の積層コンデンサ10と同じであるためその説明を省略する。   In this multilayer capacitor 10-2, the inner edge intervals b1, b2 of the lead portions 15a2, 16a2 of the first and second inner conductor layers 15, 16 constituting each independent capacitor portion are made larger than zero, and By making the two lead portions 15a1 and 16a1 partially face each other in the stacking direction, the length of the current path from the one polarity lead portion 15a2 to the other polarity lead portion 16a2 is further shortened. The magnetic field canceling action obtained by the current flowing in the reverse direction to the lead portions 15a2 and 16a2 with the one polarity lead portion 15a2 and the other polarity lead portion 16a2 being brought closer to each other can be further reduced. Thus, the ESL of the multilayer capacitor 10-2 can be further reduced. Since other functions and effects are the same as those of the multilayer capacitor 10 described above, description thereof is omitted.

本発明の第1実施形態を示す、積層コンデンサの斜視図である。1 is a perspective view of a multilayer capacitor showing a first embodiment of the present invention. 図1に示した積層コンデンサの左側面図である。FIG. 2 is a left side view of the multilayer capacitor illustrated in FIG. 1. 図1に示した積層コンデンサの横断面図である。FIG. 2 is a transverse cross-sectional view of the multilayer capacitor shown in FIG. 1. 図1に示した本体の層構成を示す斜視図である。It is a perspective view which shows the layer structure of the main body shown in FIG. 本発明の第2実施形態を示す、図2に対応する積層コンデンサの左側面図である。FIG. 4 is a left side view of the multilayer capacitor corresponding to FIG. 2, showing a second embodiment of the present invention. 図5に示した積層コンデンサの図3に対応する横断面図である。FIG. 6 is a cross-sectional view corresponding to FIG. 3 of the multilayer capacitor shown in FIG. 5. 本発明の第3実施形態を示す、図2に対応する積層コンデンサの左側面図である。FIG. 6 is a left side view of the multilayer capacitor corresponding to FIG. 2, showing a third embodiment of the present invention. 図7に示した積層コンデンサの図3に対応する横断面図である。FIG. 8 is a transverse sectional view corresponding to FIG. 3 of the multilayer capacitor shown in FIG. 7.

符号の説明Explanation of symbols

10,10-1,10-2…積層コンデンサ、11…本体、12…第1外部電極、13…第2外部電極、14…絶縁被覆部、15…第1内部導体層、15a,15a1,15a2……引出部、16…第2内部導体層、16a,16a1,16a2…引出部、DL…誘電体層、b1,b2…引出部の内側縁間隔、Wa…外部電極の幅。   DESCRIPTION OF SYMBOLS 10, 10-1, 10-2 ... Multilayer capacitor, 11 ... Main body, 12 ... 1st external electrode, 13 ... 2nd external electrode, 14 ... Insulation coating | cover part, 15 ... 1st internal conductor layer, 15a, 15a1, 15a2 ... Leader, 16... Second internal conductor layer, 16a, 16a1, 16a2... Leader, DL... Dielectric layer, b1, b2.

Claims (8)

直方体形状の本体の側面に一方極性の第1外部電極と他方極性の第2外部電極とを非接触で交互に設けた積層コンデンサであって、
本体は、同一平面に非接触で並ぶ複数の第1内部導体層と、同一平面に非接触で並ぶ第1内部導体層と同数の第2内部導体層とを、誘電体層を介して交互に積層して一体化した構造を有していて、誘電体層を介して積層方向で並ぶ第1,第2内部電極層それぞれによって複数の独立コンデンサ部を構成しており、
各独立コンデンサ部の第1,第2内部導体層は同じ側縁の異なる位置に1つの引出部を有していて、各独立コンデンサ部の第1内部導体層の引出部は第1外部電極にそれぞれ接続され、且つ、第2内部導体層の引出部は該第1外部電極と隣接する第2外部電極にそれぞれ接続されており、
各独立コンデンサ部の第1,第2内部導体層の引出部の端縁は該第1,第2内部導体層の引出部が接続された第1,第2外部電極の間の本体の側面で部分的に露出していて、該端縁露出部分は本体の側面の第1,第2外部電極の間に設けられた絶縁被覆部によって覆い隠されている、
ことを特徴とする積層コンデンサ。
A multilayer capacitor in which a first external electrode having one polarity and a second external electrode having the other polarity are alternately provided in a non-contact manner on a side surface of a rectangular parallelepiped body,
The main body alternately includes a plurality of first inner conductor layers arranged in a non-contact manner on the same plane, and the same number of first inner conductor layers arranged in a non-contact manner on the same plane as the second inner conductor layers via a dielectric layer. A plurality of independent capacitor portions are configured by the first and second internal electrode layers arranged in the stacking direction via the dielectric layer, and having a structure integrated by stacking,
The first and second inner conductor layers of each independent capacitor portion have one lead portion at different positions on the same side edge, and the lead portion of the first inner conductor layer of each independent capacitor portion serves as the first outer electrode. Each connected, and the lead portion of the second inner conductor layer is connected to the second outer electrode adjacent to the first outer electrode,
The edge of the lead portion of the first and second inner conductor layers of each independent capacitor portion is the side surface of the main body between the first and second outer electrodes to which the lead portions of the first and second inner conductor layers are connected. It is partially exposed, and the edge exposed portion is covered with an insulating coating provided between the first and second external electrodes on the side surface of the main body.
A multilayer capacitor characterized by that.
第1外部電極と第2外部電極は本体の幅方向両側面それぞれに2個ずつ設けられ、
同一平面に非接触で並ぶ第1内部導体層の数は2で、同一平面に非接触で並ぶ第2内部導体層の数は2で、独立コンデンサ部の数は2であり、
引出部は各独立コンデンサ部の第1,第2内部導体層の幅方向両側縁にそれぞれ1個ずつ設けられていて、各独立コンデンサ部の第1内部導体層の一側縁の引出部は本体の一側面の第1外部電極に接続され、且つ、他側縁の引出部は本体の他側面の第1外部電極に接続され、各独立コンデンサ部の第2内部導体層の一側縁の引出部は本体の一側面の第2外部電極に接続され、且つ、他側縁の引出部は本体の他側面の第2外部電極に接続されている、
ことを特徴とする請求項1に記載の積層コンデンサ。
Two first external electrodes and two second external electrodes are provided on each side surface in the width direction of the main body,
The number of first internal conductor layers arranged in a non-contact manner on the same plane is 2, the number of second internal conductor layers arranged in a non-contact manner on the same plane is 2, and the number of independent capacitor portions is 2.
One lead-out portion is provided on each side edge in the width direction of the first and second inner conductor layers of each independent capacitor portion, and the lead-out portion on one side edge of the first inner conductor layer of each independent capacitor portion is the main body. The lead portion on the other side is connected to the first external electrode on the other side of the main body, and the lead on the one side edge of the second internal conductor layer of each independent capacitor portion is connected to the first outer electrode on the other side. The part is connected to the second external electrode on one side of the main body, and the lead-out part on the other side edge is connected to the second external electrode on the other side of the main body.
The multilayer capacitor according to claim 1.
各独立コンデンサ部の第1,第2内部導体層の引出部は矩形状を成し、該第1,第2内部導体層の引出部の内側縁間隔は零よりも大きく、且つ、両引出部は積層方向で向き合っていない、
ことを特徴とする請求項1または2に記載の積層コンデンサ。
The lead portions of the first and second inner conductor layers of each independent capacitor portion have a rectangular shape, the interval between the inner edges of the lead portions of the first and second inner conductor layers is greater than zero, and both lead portions Are not facing each other in the stacking direction,
The multilayer capacitor according to claim 1 or 2, wherein
各独立コンデンサ部の第1,第2内部導体層の引出部は矩形状を成し、該第1,第2内部導体層の引出部の内側縁間隔は零である、
ことを特徴とする請求項1または2に記載の積層コンデンサ。
The lead portions of the first and second inner conductor layers of each independent capacitor portion have a rectangular shape, and the inner edge interval of the lead portions of the first and second inner conductor layers is zero.
The multilayer capacitor according to claim 1 or 2, wherein
各独立コンデンサ部の第1,第2内部導体層の引出部は矩形状を成し、該第1,第2内部導体層の引出部の内側縁間隔は零よりも大きく、且つ、両引出部は積層方向で部分的に向き合っている、
ことを特徴とする請求項1または2に記載の積層コンデンサ。
The lead portions of the first and second inner conductor layers of each independent capacitor portion have a rectangular shape, the interval between the inner edges of the lead portions of the first and second inner conductor layers is greater than zero, and both lead portions Are partially facing in the stacking direction,
The multilayer capacitor according to claim 1 or 2, wherein
各独立コンデンサ部の第1,第2内部導体層の引出部の幅は該第1,第2内部導体層の引出部が接続された第1,第2外部電極の幅よりも大きい、
ことを特徴とする請求項3〜5の何れか1項に記載の積層コンデンサ。
The width of the lead portions of the first and second inner conductor layers of each independent capacitor portion is larger than the width of the first and second outer electrodes to which the lead portions of the first and second inner conductor layers are connected.
The multilayer capacitor according to any one of claims 3 to 5, wherein:
絶縁被覆部は本体を構成する誘電体層と同じ材料から成る、
ことを特徴とする請求項に請求項1〜6の何れか1項に記載の積層コンデンサ。
The insulating coating is made of the same material as the dielectric layer that makes up the body.
The multilayer capacitor according to any one of claims 1 to 6, wherein the multilayer capacitor is characterized by that.
絶縁被覆部の厚さは第1,第2外部電極の厚さよりも小さい、
ことを特徴とする請求項に請求項1〜7の何れか1項に記載の積層コンデンサ。
The thickness of the insulating coating is smaller than the thickness of the first and second external electrodes;
The multilayer capacitor according to any one of claims 1 to 7, wherein the multilayer capacitor is characterized by the above.
JP2007187017A 2007-07-18 2007-07-18 Multilayer capacitor Withdrawn JP2009026872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007187017A JP2009026872A (en) 2007-07-18 2007-07-18 Multilayer capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007187017A JP2009026872A (en) 2007-07-18 2007-07-18 Multilayer capacitor

Publications (1)

Publication Number Publication Date
JP2009026872A true JP2009026872A (en) 2009-02-05

Family

ID=40398425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007187017A Withdrawn JP2009026872A (en) 2007-07-18 2007-07-18 Multilayer capacitor

Country Status (1)

Country Link
JP (1) JP2009026872A (en)

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054973A (en) * 2007-08-29 2009-03-12 Kyocera Corp Multilayer capacitor and capacitor mounting board
US20130050893A1 (en) * 2011-08-26 2013-02-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
US20130050899A1 (en) * 2011-08-26 2013-02-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
JP2013055321A (en) * 2011-09-02 2013-03-21 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
JP2013055320A (en) * 2011-08-31 2013-03-21 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
JP2013187537A (en) * 2012-03-05 2013-09-19 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and method of manufacturing the same
CN103730254A (en) * 2012-10-12 2014-04-16 三星电机株式会社 Multi-layered ceramic capacitor
JP2014093514A (en) * 2012-11-06 2014-05-19 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and method of manufacturing the same
JP2014096552A (en) * 2012-11-07 2014-05-22 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and mounting substrate thereof
JP2014107532A (en) * 2012-11-29 2014-06-09 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
CN103854856A (en) * 2012-12-06 2014-06-11 三星电机株式会社 Multilayer ceramic electronic component
US20140160619A1 (en) * 2012-12-12 2014-06-12 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
CN103871736A (en) * 2012-12-10 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
CN103871734A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayered ceramic capacitor and method of manufacturing the same
CN103871735A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing same
CN103871742A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
US20140177128A1 (en) * 2012-12-20 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
JP2014120749A (en) * 2012-12-12 2014-06-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
JP2014120748A (en) * 2012-12-18 2014-06-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and circuit board mounted with the same
US20140345925A1 (en) * 2013-05-21 2014-11-27 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and mounting board therefor
CN104183387A (en) * 2013-05-21 2014-12-03 三星电机株式会社 Multilayered ceramic capacitor and board for mounting the same
KR20150009922A (en) * 2013-07-17 2015-01-27 삼성전기주식회사 Multi-layered ceramic capacitor part and board for mounting the same
JP2015035571A (en) * 2013-08-08 2015-02-19 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor and board for mounting multilayer ceramic capacitor thereon
JP2015038914A (en) * 2012-12-04 2015-02-26 サムソン エレクトロ−メカニックス カンパニーリミテッド. Laminated ceramic electronic component
US9349536B2 (en) * 2012-11-07 2016-05-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
JP2017168521A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Multilayer capacitor
JP2017168519A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Multilayer capacitor
US10593473B2 (en) 2013-07-17 2020-03-17 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same

Cited By (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054973A (en) * 2007-08-29 2009-03-12 Kyocera Corp Multilayer capacitor and capacitor mounting board
JP2014220521A (en) * 2011-08-26 2014-11-20 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor
US20130050899A1 (en) * 2011-08-26 2013-02-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
JP2013046052A (en) * 2011-08-26 2013-03-04 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
JP2013046051A (en) * 2011-08-26 2013-03-04 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
JP2014220520A (en) * 2011-08-26 2014-11-20 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor
US20130050893A1 (en) * 2011-08-26 2013-02-28 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
US8988853B2 (en) 2011-08-26 2015-03-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
JP2013055320A (en) * 2011-08-31 2013-03-21 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
JP2013055321A (en) * 2011-09-02 2013-03-21 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor
US8922975B2 (en) 2011-09-02 2014-12-30 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor
JP2014197720A (en) * 2011-09-02 2014-10-16 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor
JP2013187537A (en) * 2012-03-05 2013-09-19 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and method of manufacturing the same
TWI479520B (en) * 2012-10-12 2015-04-01 Samsung Electro Mech Multi-layered ceramic capacitor
US9236186B2 (en) * 2012-10-12 2016-01-12 Samsung Electro-Mechanics Co., Ltd. Multi-layered ceramic capacitor
CN103730254A (en) * 2012-10-12 2014-04-16 三星电机株式会社 Multi-layered ceramic capacitor
US20140104750A1 (en) * 2012-10-12 2014-04-17 Samsung Electro-Mechanics Co., Ltd. Multi-layered ceramic capacitor
JP2014093514A (en) * 2012-11-06 2014-05-19 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and method of manufacturing the same
CN103811175A (en) * 2012-11-06 2014-05-21 三星电机株式会社 Multilayer ceramic capacitor and manufacturing method thereof
US8964355B2 (en) 2012-11-06 2015-02-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and manufacturing method thereof
JP2014096552A (en) * 2012-11-07 2014-05-22 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and mounting substrate thereof
US9349536B2 (en) * 2012-11-07 2016-05-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
JP2014107532A (en) * 2012-11-29 2014-06-09 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
US8964353B2 (en) 2012-11-29 2015-02-24 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
CN103854855A (en) * 2012-11-29 2014-06-11 三星电机株式会社 Multilayer ceramic electronic component
KR101422934B1 (en) 2012-11-29 2014-07-23 삼성전기주식회사 Multi-layered ceramic electronic component
JP2015038914A (en) * 2012-12-04 2015-02-26 サムソン エレクトロ−メカニックス カンパニーリミテッド. Laminated ceramic electronic component
US9293258B2 (en) 2012-12-06 2016-03-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component including insulating layers formed on lateral and end surfaces thereof
CN103854856B (en) * 2012-12-06 2016-12-28 三星电机株式会社 Laminated ceramic electronic component
CN103854856A (en) * 2012-12-06 2014-06-11 三星电机株式会社 Multilayer ceramic electronic component
JP2014187055A (en) * 2012-12-06 2014-10-02 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
CN103871736A (en) * 2012-12-10 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
JP2014116571A (en) * 2012-12-10 2014-06-26 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and method for manufacturing the same
US9165715B2 (en) 2012-12-10 2015-10-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor with electrodes having lead-out parts and method of manufacturing the same
CN103871734A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayered ceramic capacitor and method of manufacturing the same
US8879238B2 (en) 2012-12-11 2014-11-04 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
TWI490897B (en) * 2012-12-11 2015-07-01 Samsung Electro Mech Multilayered ceramic capacitor and method of manufacturing the same
CN103871735A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing same
US8913367B2 (en) 2012-12-11 2014-12-16 Samsung Electro-Mechanics Co., Ltd. Multilayered ceramic capacitor and method of manufacturing the same
CN103871742A (en) * 2012-12-11 2014-06-18 三星电机株式会社 Multilayer ceramic capacitor and method of manufacturing the same
US9087647B2 (en) 2012-12-11 2015-07-21 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and method of manufacturing the same
JP2014160691A (en) * 2012-12-11 2014-09-04 Samsung Electro-Mechanics Co Ltd Multilayered ceramic capacitor and method of manufacturing the same
JP2014160693A (en) * 2012-12-11 2014-09-04 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and method of manufacturing the same
JP2014116570A (en) * 2012-12-11 2014-06-26 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and manufacturing method of the same
US20140160619A1 (en) * 2012-12-12 2014-06-12 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
JP2014120749A (en) * 2012-12-12 2014-06-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
JP2014120750A (en) * 2012-12-12 2014-06-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component
US9293259B2 (en) 2012-12-12 2016-03-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component including electrode lead out portions having different lengths
US9218908B2 (en) 2012-12-12 2015-12-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component capable of reducing acoustic noise generated therein
JP2014120748A (en) * 2012-12-18 2014-06-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic capacitor and circuit board mounted with the same
US20140177128A1 (en) * 2012-12-20 2014-06-26 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component
US9230738B2 (en) * 2012-12-20 2016-01-05 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component including a lateral surface and internal electrodes having different distances from the lateral surface
US9576732B2 (en) * 2013-05-21 2017-02-21 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and mounting board therefor
JP2014229892A (en) * 2013-05-21 2014-12-08 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayered ceramic capacitor and board for mounting multilayered ceramic capacitor
US20140345925A1 (en) * 2013-05-21 2014-11-27 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and mounting board therefor
US9424990B2 (en) 2013-05-21 2016-08-23 Samsung Electro-Mechanics Co., Ltd. Multilayered ceramic capacitor and board for mounting the same
CN104183387A (en) * 2013-05-21 2014-12-03 三星电机株式会社 Multilayered ceramic capacitor and board for mounting the same
JP2015023287A (en) * 2013-07-17 2015-02-02 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor and its mounting board
KR20150009922A (en) * 2013-07-17 2015-01-27 삼성전기주식회사 Multi-layered ceramic capacitor part and board for mounting the same
KR101659152B1 (en) * 2013-07-17 2016-09-22 삼성전기주식회사 Multi-layered ceramic capacitor part and board for mounting the same
KR101912279B1 (en) * 2013-07-17 2018-10-29 삼성전기 주식회사 Multi-layered ceramic capacitor part and board for mounting the same
US10593473B2 (en) 2013-07-17 2020-03-17 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
JP2015035571A (en) * 2013-08-08 2015-02-19 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic capacitor and board for mounting multilayer ceramic capacitor thereon
JP2017168521A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Multilayer capacitor
JP2017168519A (en) * 2016-03-14 2017-09-21 Tdk株式会社 Multilayer capacitor

Similar Documents

Publication Publication Date Title
JP2009026872A (en) Multilayer capacitor
KR101014508B1 (en) Multilayer capacitor
CN100533615C (en) Laminated Capacitor
JP4450084B2 (en) Multilayer capacitor and multilayer capacitor mounting structure
JP2020057738A (en) Electronic component, circuit board, and mounting method of electronic component onto circuit board
JP5806960B2 (en) Multilayer capacitor and manufacturing method thereof
JP2008091521A (en) Stacked capacitor and manufacturing method of stacked capacitor
JP2009016746A (en) Multilayer capacitor
JP2014027255A (en) Ceramic electronic component and ceramic electronic device
JP2009021512A (en) Multilayer capacitor
JP5929279B2 (en) Multilayer capacitor
JP2007235170A (en) Laminated capacitor and packaging structure thereof
WO2012137569A1 (en) Electronic component
JP6421138B2 (en) Multilayer ceramic capacitor
JP2007142296A (en) Stacked capacitor
JP5267584B2 (en) Multilayer electronic component and electronic component mounting structure
KR101872529B1 (en) Multi-layered chip electronic component
CN115863055A (en) Multilayer ceramic capacitor
JP5251834B2 (en) Multilayer capacitor
JP2006203168A (en) Laminated capacitor and packaging structure thereof
JP4287807B2 (en) Multilayer capacitor
JP2019046876A (en) Multilayer capacitor
JP6459717B2 (en) Multilayer ceramic capacitor
JP5173291B2 (en) Multilayer capacitor
JP2007235169A (en) Laminated capacitor and packaging structure thereof

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20101005