JP2009194342A - Integrated circuit mounting substrate and integrated circuit mounting package manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide means for easily discriminating each of integrated circuits having the same shape and different functions only at a glance after the integrated circuits are mounted on film substrates having the same shape. <P>SOLUTION: An integrated circuit mounting package 140 having a SOF structure includes an identification mark describing part 1, and accordingly, the model name can be written after an integrated circuit 101 is mounted. Consequently, when integrated circuits 101A having the same shape and different functions are mounted on film substrates, corresponding model names can be written after they are mounted. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an integrated circuit mounting board using a film base material such as a tape carrier package, and more particularly to an integrated circuit mounting board that enables description of an identification mark such as a model name of the integrated circuit.

  A mounting package such as a liquid crystal driver needs to be mounted on the glass side of the liquid crystal panel and the panel frame needs to be small. Therefore, TCP (Tape Carrier Package) or SOF (System On Film: COF (Chip On) Also called Film)).

  11 and 12 show the configuration of an integrated circuit mounting package 120 having a TCP structure. FIG. 11 is a top view of the integrated circuit mounting package 120 and is a partial perspective view showing a state in which the sealing resin 109 is seen through. FIG. 12 is a cross-sectional view of the integrated circuit mounting package 120 shown in FIG. 11 taken along the cutting line B-B ′.

  In the integrated circuit mounting package 120 shown in FIGS. 11 and 12, a slit 114 and a hole portion called a device hole 115 are provided in the film base 113. Further, copper wirings 111 and 112 are formed on the film base 113, and a solder resist 116 is formed on the wirings 111 and 112. The integrated circuit (integrated circuit chip) 101 is provided in the device hole 115 and has a structure in which bumps 110 on the surface of the integrated circuit 101 and wirings 111 and 112 are connected. As shown in FIG. 12, a sealing resin 109 covers the periphery of the device hole 115 in order to protect the integrated circuit 101 and the like from the external environment.

  13 and 14 show the configuration of an integrated circuit mounting package 130 having an SOF structure. FIG. 13 is a top view of the integrated circuit mounting package 130, and FIG. 14 is a cross-sectional view taken along the line B-B ′ of the integrated circuit mounting package 130 shown in FIG.

  In the integrated circuit mounting package 130, copper wirings 111 and 112 are formed on a film base 113, and a solder resist 116 is formed on the copper wirings 111 and 112. The copper wirings 111 and 112 and the integrated circuit 101 are connected by the bumps 110 of the integrated circuit 101. Further, as shown in FIG. 14, an underfill material 117 is filled to protect the integrated circuit 101 and the like from the external environment.

  TCP and SOF form an integrated circuit and wiring to a lead terminal of a package with a copper foil pattern on a base material of a resin tape (polyimide film or the like), and a company name, model name, and the like.

  TCP and SOF are mainly used as a package of an integrated circuit for driving a liquid crystal panel. The wiring on the glass substrate of the liquid crystal panel on which the TCP or SOF is mounted, the shape of the connection part of the TCP or SOF, and the like are mounted. The external shape and wiring pattern of TCP and SOF differ depending on the terminal arrangement of the integrated circuit. In the liquid crystal panel driving integrated circuit, the shape of the TCP or SOF corresponds to the driving integrated circuit on a one-to-one basis. Therefore, the combination of the driving integrated circuit used and the shape of the TCP or SOF is used. Thus, the model name is set, and the model name is described in a wiring pattern on the TCP or SOF (see, for example, Patent Document 1).

Indicating a mark such as a model name on TCP or SOF is not limited to the formation of a copper foil pattern as described above. The method of printing is described. Patent Document 2 describes that in the case of a tape carrier, printing is performed on the back surface of a chip or a tape frame. The printing of the tape frame is performed by printing on the tape frame in the process of printing the lead wire pattern before mounting the integrated circuit.
Japanese Patent Laid-Open No. 5-3227 (published January 8, 1993) JP 63-263748 A (released October 31, 1988)

  However, the above conventional configuration has the following problems.

  In recent years, the spread of liquid crystal display devices has been remarkable and used in various fields and products. For this reason, in order to develop a product in which a part of the functions of a display panel produced in large quantities is changed, a product having a completely different TCP or SOF shape and a partly different function of a driving integrated circuit is required. Occurs. In such product development, the development period is short and the development cost is often low. For this reason, even if the function of the driving integrated circuit is changed, the same carrier tape of TCP or SOF is used as before the change. When producing a dedicated carrier tape, it is necessary to make it from a mold or mask, so it takes a development period and development costs are required, but if you use the same carrier tape as before the change, the development period, This is because there is an advantage that development costs are not required.

  However, when the same carrier tape is used, there arises a problem that it becomes impossible to distinguish TCP or SOF mounted with two types of driving integrated circuits having different functions. This is because one of the two types of integrated circuits for driving is mounted on the same carrier tape, so that if the model name of the integrated circuit for driving is printed on the carrier tape in advance as described in the cited document 2, the driving This is because it is impossible to discriminate between the two according to the model name described after the integrated circuit is mounted. Reference 2 shows a method of writing an identification mark on the back surface of the driving integrated circuit, but there is only a space for writing information (date code) at the time of manufacturing for downsizing of the driving integrated circuit, The model name cannot be entered.

  For this reason, when shipping TCP or SOF mounted with a driving integrated circuit, it is necessary to carefully manage the shipping label and make sure there is no mistake.

  In addition, since it cannot be judged by appearance as described above, in order to find out what function the driving integrated circuit has when it is returned due to a defect, the integrated circuit of which function is based on information from the return destination. It is necessary to estimate whether the IC has been used, or to peel off the integrated circuit from the TCP or SOF, to peel off the resin of the integrated circuit, and to check the mark etc. written on the circuit surface of the integrated circuit, or to check the circuit is there.

  The present invention has been made in view of the above-described problems, and its purpose is to easily mount each integrated circuit having the same shape and different functions on the same film base material, and then each of them can be easily seen only by appearance. It is intended to provide a means for discriminating.

  In order to solve the above problems, an integrated circuit mounting substrate according to the present invention is an identification symbol for identifying the integrated circuit in an integrated circuit mounting substrate in which integrated circuits having the same shape and different functions are mounted on a flexible base material. It is characterized by having an identification symbol description part for describing.

  An integrated circuit mounting package manufacturing method according to the present invention is an integrated circuit mounting package manufacturing method for manufacturing an integrated circuit mounting package by mounting the integrated circuit on the integrated circuit mounting substrate. After mounting on the integrated circuit mounting board, an identification symbol is described in the identification symbol description part.

  According to the above configuration, since the identification symbol description portion is provided, unlike the conventional configuration for printing on a tape frame or the like, a lead wire pattern is formed on the base material like stamp printing or laser marking. The identification symbol description part can be configured such that the identification symbol is described in the identification symbol description part independently of the process. Thereby, after mounting an integrated circuit on an integrated circuit mounting board, the identification symbol of the mounted integrated circuit can be described in an identification symbol description part.

  The integrated circuit mounting board is preferably formed of a material that enables the identification symbol description part to rewrite the identification symbol. Specifically, the color of the heated portion is changed by heating at a predetermined first temperature, and the portion heated at the first temperature is heated at a predetermined second temperature different from the first temperature. A thermoreversible substance that restores the color can be used as the material.

  Further, another integrated circuit mounting package manufacturing method according to the present invention is an integrated circuit mounting package manufacturing method for manufacturing an integrated circuit mounting package by mounting the integrated circuit on the integrated circuit mounting substrate. Before mounting the integrated circuit, the identification symbol of the integrated circuit to be mounted is described in the identification symbol description section, and when an integrated circuit other than the planned one is mounted, the identification symbol of the mounted integrated circuit depends on the identification symbol. Thus, all or a part of the identification symbol is rewritten.

  According to the above configuration, before mounting the integrated circuit on the integrated circuit mounting substrate, the identification symbol of the integrated circuit to be mounted is described in the identification symbol description section, and an integrated circuit other than the target is mounted. In this case, all or a part of the identification symbol can be rewritten according to the identification symbol of the mounted integrated circuit.

  As a result, the integrated circuit mounting package in which the integrated circuit is mounted as planned can reduce the time for the identification symbol to be described after mounting, and the integrated circuit mounting package in which the integrated circuit of the same shape with different functions other than the planned is mounted is discriminated. It becomes easy.

  As described above, the integrated circuit mounting substrate according to the present invention includes the identification symbol description portion that describes the identification symbol for identifying the integrated circuit to be mounted, so that the integrated circuits having the same shape and different functions are mounted. In this case, since the identification symbol can be described after mounting, there is an effect that discrimination is easy in the state after mounting.

  An embodiment of the present invention will be described with reference to FIGS. 1 to 10 as follows.

Embodiment 1
FIG. 1 is a diagram in which an identification symbol description unit 1 is provided in an integrated circuit mounting package 140 having an SOF structure.

  In the present embodiment, components having functions equivalent to those of the integrated circuit mounting package 130 shown in FIGS. 11 and 12 are denoted by the same reference numerals.

  In the integrated circuit mounting package 140 shown in FIG. 1, the copper wirings 111 and 112 are formed on the film base 113, and the solder resist 116 is formed on the copper wirings 111 and 112, as in the integrated circuit mounting package 130. Yes. The copper wirings 111 and 112 and the integrated circuit 101 are connected by bumps (not shown) of the integrated circuit 101. However, unlike the integrated circuit mounting package 130, the integrated circuit mounting package 140 includes the identification symbol description unit 1.

  The identification symbol description section 1 is provided as a space where an identification symbol such as a model name can be described in the integrated circuit mounting package 140, and copper wiring or the like is prevented from passing therethrough. Become.

  A method for describing the model name in the integrated circuit mounting package 140 will be described below with reference to FIGS.

  FIG. 2 shows the state of the film before the integrated circuit mounting for producing a plurality of integrated circuit mounting packages 140. In this state, nothing is described in the identification symbol description unit 1.

  FIG. 3 shows the state of the film after the integrated circuit 101 is mounted on the film of FIG. 2. In this state, nothing is described in the identification symbol description part 1 yet.

  FIG. 4 shows a state in which the model name A123401 is written on the film after the integrated circuit is mounted in FIG. The model name in the identification symbol description section 1 can be written by stamping or laser marking.

  FIG. 5 shows a state in which an integrated circuit 101A including another circuit is mounted on the film of FIG. In this state, by describing the model name A123402 in the identification symbol description section 1, it can be confirmed at a glance that different integrated circuits (101, 101A) are mounted on the film of FIG. 4 and the film of FIG.

[Embodiment 2]
FIG. 6 is a diagram in which an identification symbol description unit 2 is provided in an integrated circuit mounting package 150 having an SOF structure.

  In the present embodiment, components having functions equivalent to those of the integrated circuit mounting package 140 shown in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  An integrated circuit mounting package 150 illustrated in FIG. 6 is configured in the same manner as the integrated circuit mounting package 140 illustrated in FIG. 1, but includes an identification symbol description unit 2 instead of the identification symbol description unit 1.

  The identification symbol description unit 2 includes a light reflecting sheet that reflects light and a thermoreversible sheet made of a thermoreversible material that reversibly changes in white turbidity and transparency due to heat, and is thermally reversible on the light reflecting sheet. When the sheet is made cloudy by heat at a predetermined writing temperature (first temperature), a white display is displayed on a glossy silver ground, and a predetermined erasure that is different from the writing temperature. When it is made transparent by the heat of the temperature (second temperature), the display disappears.

  A method for describing the model name on the integrated circuit mounting package 150 will be described below with reference to FIGS.

  FIG. 7 shows the state of the film before the integrated circuit mounting for producing a plurality of integrated circuit mounting packages 150. In this state, the model name A123401 is described in the identification symbol description part 2. The model name is described by making the reversible material of the identification symbol description part 2 cloudy by applying heat with a thermal head or a laser.

  FIG. 8 shows a state where the integrated circuit 101 for the model name A123401 is mounted on the film in the state of FIG. If there is no change in the model name, it is completed in this state.

  FIG. 9 shows a state where the integrated circuit 101A for the model name A123402 is mounted on the film in the state of FIG. A model name A123401 is described in the identification symbol description part 2, and it is necessary to change the model name. In order to change the model name, heat is applied at an erasing temperature different from that when the model name is written in the identification symbol description part 2, and the cloudy thermoreversible sheet is made transparent to erase the model name. Then, the model name A123402 is obtained as shown in FIG. 10 by applying heat of the writing temperature to the identification symbol description unit 2 and writing the model name.

  As described above, by describing the model name A123402, it can be confirmed at a glance that different integrated circuits are mounted on the film of FIG. 8 and the film of FIG. Further, since the identification symbol description part 2 is formed of a thermoreversible material, the model name can be easily changed when the model name of the integrated circuit is changed in a state where the model name is already described in the identification symbol description part 2. You can change the name.

  In the above procedure, the procedure of writing the model name again after erasing all the model name A123401 described by making the thermoreversible sheet transparent is described, but the present invention is not limited to this. When the character to be changed is known in advance, for example, when only the last two digits are changed, heat can be applied to the description range of the character to make the thermoreversible sheet transparent, and only that portion can be rewritten.

  In the above description, the integrated circuit mounting package having the SOF structure has been described. However, the present invention is not limited to this. An integrated circuit mounting package having a TCP structure may be used. If it is an integrated circuit mounting package using a film substrate, the same effect as this embodiment can be obtained. Moreover, although the light reflection sheet and the thermoreversible sheet are used as the configuration in which the model name can be rewritten in the identification symbol description unit 2, the present invention is not limited to this.

  As an example, a leuco dye can be used as the material constituting the identification symbol description part 2. The identification symbol description part 2 using a leuco dye is colored when heated to a temperature (about 170 ° C. or higher) necessary for printing with a thermal head or laser and rapidly cooled. The model name is erased by applying a temperature necessary for erasing (about 120 ° C. to 140 ° C.) for a predetermined time.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  In an integrated circuit package having a common carrier tape and different functions, it can be used for package component management.

It is a top view which shows the structure of the integrated circuit mounting package of the SOF structure by Embodiment 1 of this invention. It is a figure which shows the state of the film before integrated circuit mounting by Embodiment 1 of this invention. It is a figure which shows the state of the film after integrated circuit mounting in the film shown in FIG. It is a figure which shows the state which described the model name on the film after the integrated circuit mounting of FIG. It is a figure which shows the state which mounted the integrated circuit of another model on the film of FIG. 2, and described the model name. It is a top view which shows the structure of the integrated circuit mounting package of SOF by Embodiment 2 of this invention. It is a figure which shows the state of the film before integrated circuit mounting by Embodiment 2 of this invention. It is a figure which shows the state of the film after integrated circuit mounting in the film shown in FIG. It is a figure which shows the state of the film after the integrated circuit of another model was mounted in the film shown in FIG. It is a figure which shows the state which rewritten the model name described in the film shown in FIG. It is a top view which shows the structure of the integrated circuit mounting package of the conventional general TCP structure. It is arrow sectional drawing which shows the state cut | disconnected in the cutting line B-B 'of FIG. It is a top view which shows the structure of the integrated circuit mounting package of the conventional general SOF structure. It is arrow sectional drawing which shows the state cut | disconnected in the cutting line B-B 'of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Identification symbol description part 2 Identification symbol description part 101 Integrated circuit 101A Integrated circuit 113 Film base material (base material)

Claims (5)

In an integrated circuit mounting board that mounts integrated circuits of the same shape with different functions on a flexible substrate,
An integrated circuit mounting board, comprising: an identification symbol description portion that describes an identification symbol for identifying the integrated circuit. An integrated circuit mounting package manufacturing method for manufacturing an integrated circuit mounting package by mounting the integrated circuit on the integrated circuit mounting substrate according to claim 1,
An integrated circuit mounting package manufacturing method, wherein after an integrated circuit is mounted on the integrated circuit mounting substrate, an identification symbol is described in the identification symbol description section.   The integrated circuit mounting substrate according to claim 1, wherein the identification symbol description part is made of a material that enables the identification symbol to be rewritten.   The color of the heated portion is changed by heating at a predetermined first temperature, and the color of the portion heated at the first temperature is restored by heating at a predetermined second temperature different from the first temperature. The integrated circuit mounting substrate according to claim 3, wherein a thermoreversible substance is used as the material. An integrated circuit mounting package manufacturing method for manufacturing an integrated circuit mounting package by mounting the integrated circuit on the integrated circuit mounting substrate according to claim 3,
Before mounting the integrated circuit, the identification symbol of the integrated circuit to be mounted in the identification symbol description section,
A method of manufacturing an integrated circuit mounting package, wherein when an integrated circuit other than the scheduled one is mounted, all or a part of the identification symbol is rewritten in accordance with the identification symbol of the mounted integrated circuit.

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