JP2009130003A - Semiconductor cooling device - Google Patents

Abstract

A semiconductor cooling device capable of cooling an element whose calorific value dynamically changes at a constant temperature.
In a semiconductor cooling device for transferring heat generated from a semiconductor element to an external cooling device, a boiling chamber in which a refrigerant is enclosed, a body to be cooled provided in the boiling chamber, and an external cooling device are provided. A cooling unit in which the refrigerant is cooled by an external cooling device; a first circulation pipe having one end connected to the lower side of the boiling chamber and the other end connected to the lower side of the cooling unit; and the boiling chamber. A pressure valve that keeps the pressure in the boiling chamber at a predetermined pressure by releasing the refrigerant vapor generated by the heat generation of the object to be cooled, one end connected to the outlet of the pressure valve, and the other end connected to the upper side of the cooling unit. A second circulation pipe, a liquid level meter provided in the boiling chamber for measuring the liquid level of the refrigerant, and a first pump provided in the first circulation pipe and operating based on a signal of the liquid level meter. And the heat of vaporization caused by boiling of the refrigerant The semiconductor cooling device, characterized in that cooled more object to be cooled.
It is.
[Selection] Figure 1

Description

The present invention relates to a semiconductor cooling device.
In particular, the present invention relates to a semiconductor cooling apparatus suitable for use in a semiconductor test apparatus or the like, and is used to cool semiconductor elements that generate heat during operation and whose temperature change has a large effect on characteristics.
In particular, the present invention relates to a semiconductor cooling apparatus suitable for cooling a semiconductor element in which the amount of heat generated dynamically changes during operation but the temperature of the semiconductor element needs to be constant.

  Prior art documents related to semiconductor cooling devices include the following.

Japanese Patent Laid-Open No. 08-094706 Japanese Patent Application Laid-Open No. 2001-349881 JP 2003-318342 A

FIG. 3 is a perspective view of a main part of a conventional example generally used in the past, FIG. 4 (a) is a plan view of FIG. 3, and FIG. 3 (b) is a front view of FIG. Called).
In the figure, 1 is a radiator made of aluminum or the like.
Reference numeral 2 denotes a pipe provided in the radiator 1.
A semiconductor element A is attached to the radiator 1.
B is a printed circuit board to which the semiconductor element A is attached.

In the above configuration, water 3 is poured into the radiator 1 for cooling.
A semiconductor element A is attached to the radiator 1.
The water 4 that has flowed in takes the heat of the semiconductor element A and flows out.
The warmed water 4 is cooled by an external cooling device and circulated to the radiator 1.

FIG. 5 is an explanatory diagram showing the configuration of the main part of another conventional example that is generally used conventionally (hereinafter referred to as “heat pipe system”).
A refrigerant 12 is enclosed in a sealed tube 11.
One end of the tube 11 is brought into contact with the semiconductor element A, and the other end is cooled by an external cooling device 13.

In the above configuration, at the semiconductor element A side end, the refrigerant 12 evaporates and takes heat of vaporization.
The evaporated refrigerant 12 moves to the cooling side end and is cooled to release condensation heat.
The condensed refrigerant 12 returns to the heat source side end due to a capillary phenomenon or the like.
Heat moves from the heat source side end to the cooling side end by the mechanism as described above.

Such an apparatus has the following problems.
Water cooling method.
Since a temperature difference exists between the upstream and downstream of the water flow, when a plurality of semiconductor elements A are attached to the radiator 1, a temperature difference is likely to occur between the semiconductor elements A.
In order to reduce this temperature difference, water is reciprocated inside the radiator 1 as shown in FIG.

However, in order to reduce the temperature difference, a large amount of water must be allowed to flow so that the water temperature hardly rises due to the amount of heat generated by the semiconductor element A, which is a design constraint.
Conversely, when the flow rate is small, a temperature difference between the upstream and downstream occurs, and this temperature difference also changes due to a dynamic change in power consumption of the semiconductor element A. Therefore, a plurality of semiconductor elements A whose power consumption changes dynamically are kept at a constant temperature. It is difficult to cool with.

Heat pipe method.
In general, the amount of the refrigerant 12 to be enclosed is small and the cooling capability by evaporation is limited, so the temperature at the end of the semiconductor element A varies depending on the amount of heat generated by the semiconductor element A.
If the refrigerant 12 is increased, the internal pressure of the pipe 11 rises due to a large amount of refrigerant vapor, and the boiling point temperature of the refrigerant 12 changes.
For this reason, in any case, it is difficult to cool the semiconductor element A at a constant temperature.

  An object of the present invention is to solve the above-described problems, and to provide a semiconductor cooling device capable of cooling an element whose calorific value dynamically changes at a constant temperature.

In order to achieve such a problem, in the present invention, in the semiconductor cooling device of claim 1,
In a semiconductor cooling device that transfers heat generated from a semiconductor element to an external cooling device, a boiling chamber in which a refrigerant is sealed, a body to be cooled provided in the boiling chamber, and a cooling device provided near the external cooling device is externally cooled. A cooling unit cooled by the apparatus, a first circulation pipe having one end connected to the lower side of the boiling chamber and the other end connected to the lower side of the cooling unit, and a cooling unit provided in the boiling chamber A pressure valve that keeps the pressure in the boiling chamber at a predetermined pressure by releasing the refrigerant vapor generated by the heat generation; and a second valve having one end connected to the outlet of the pressure valve and the other end connected to the upper side of the cooling unit. A circulation pipe, a liquid level meter provided in the boiling chamber for measuring the liquid level of the refrigerant, and a first pump provided in the first circulation pipe and operating based on a signal of the liquid level meter. Cooled by the heat of vaporization caused by boiling of the refrigerant And wherein the cooling of the body.

In the semiconductor cooling device according to claim 2 of the present invention, the semiconductor cooling device according to claim 1,
The object to be cooled is a semiconductor element attached to a boiling chamber.

In the semiconductor cooling device according to claim 3 of the present invention, the semiconductor cooling device according to claim 1,
The object to be cooled is a substrate on which a plurality of semiconductor elements to be cooled by being immersed in a cooling medium in the boiling chamber or a device on which a plurality of substrates are mounted.

In the semiconductor cooling device according to claim 4 of the present invention, the semiconductor cooling device according to any one of claims 1 to 3,
The refrigerant is a fluorocarbon refrigerant.

In the semiconductor cooling device according to claim 5 of the present invention, in the semiconductor cooling device according to any one of claims 1 to 4,
And a second pump that is provided in the second circulation pipe and pressurizes the refrigerant vapor to send it to the cooling unit.

In the semiconductor cooling device according to claim 6 of the present invention, the semiconductor cooling device according to any one of claims 1 to 5,
The refrigerant provided in the first circulation pipe between the boiling chamber and the first pump and returned to the boiling chamber has the same temperature as the refrigerant in the boiling chamber before being injected into the boiling chamber. It is characterized by having a heat exchange device.

In the semiconductor cooling device of Claim 7 of this invention, In the semiconductor cooling device in any one of Claim 1 thru | or 6,
Circulating means for circulating the refrigerant in the boiling chamber is provided.

According to claim 1 of the present invention, there are the following effects.
In an apparatus in which power consumption of a plurality of semiconductor elements fluctuates asynchronously and dynamically, a semiconductor cooling apparatus capable of cooling each semiconductor element at a constant temperature is obtained.

According to claim 2 of the present invention, there are the following effects.
Since the object to be cooled is a semiconductor element that is in contact with the boiling chamber, it is sufficient that the object to be cooled is in contact with the boiling chamber.

According to claim 3 of the present invention, there are the following effects.
Since the object to be cooled is a substrate on which a plurality of semiconductor elements to be cooled by being immersed in a refrigerant in a boiling chamber or a device on which a plurality of substrates are mounted, a plurality of semiconductor elements are arranged in one boiling chamber. A semiconductor cooling device capable of cooling the plurality of semiconductor elements at the same temperature is obtained.
Further, if the entire substrate on which a plurality of elements are mounted is directly immersed in a refrigerant in a boiling chamber, a semiconductor cooling device capable of cooling the entire substrate at a constant temperature can be obtained.

According to claim 4 of the present invention, there are the following effects.
Since the chlorofluorocarbon refrigerant is used as the refrigerant, the chlorofluorocarbon refrigerant is less corrosive, and a semiconductor cooling device is obtained that is less likely to damage the object to be cooled.

According to claim 5 of the present invention, there are the following effects.
Since the second pump provided in the second circulation pipe for pressurizing the refrigerant vapor and sending it to the cooling unit is provided, the temperature of the refrigerant vapor rises by pressurizing the refrigerant vapor. A temperature difference from the apparatus becomes large, and a semiconductor cooling apparatus with improved cooling efficiency can be obtained.

According to claim 6 of the present invention, there are the following effects.
There is provided a heat exchange device that is provided in a first circulation pipe between the boiling chamber and the first pump and that is made to have the same temperature as the refrigerant in the boiling chamber before the refrigerant that is refluxed to the boiling chamber is injected into the boiling chamber. Since it is provided, a semiconductor cooling device with improved cooling accuracy can be obtained.

According to claim 7 of the present invention, there are the following effects.
Since the circulation means for circulating the refrigerant in the boiling chamber is provided, the refrigerant can be forcibly sent even when the object to be cooled is a substrate or the like, depending on its shape, even if a portion where the refrigerant is partially insufficient occurs. Therefore, a semiconductor cooling device with further improved cooling efficiency can be obtained.

Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram illustrating the configuration of the main part of one embodiment of the present invention, and FIG. 2 is a diagram illustrating the operation of FIG.
In the figure, configurations with the same symbols as in FIG. 3 represent the same functions.
Only the difference from FIG. 3 will be described below.

In FIG. 1, a refrigerant 22 is sealed in a boiling chamber 21.
As the refrigerant 22, for example, CFC11 boiling point 23.7 ° C., Freon 123 boiling point 27.5 ° C., Freon 113 boiling point 47.6 ° C., or the like is used.
The cooled object A is in contact with the boiling chamber 21.
In this case, in the cooled object A, the semiconductor element A is in contact with the outside of the boiling chamber 21.

The cooling unit 23 is provided near the external cooling device 24, and the vapor of the refrigerant 22 is cooled by the external cooling device 24.
The first circulation pipe 25 has one end connected to the lower side of the boiling chamber 21 and the other end connected to the lower side of the cooling unit 23.
The pressure valve 27 is provided in the boiling chamber 21 and keeps the pressure in the boiling chamber 21 at a predetermined pressure.
The second circulation pipe 26 has one end connected to the outlet of the pressure valve 27 and the other end connected to the upper side of the cooling unit 23.
The liquid level meter 28 is provided in the boiling chamber 21 and measures the liquid level of the refrigerant 22.

The first pump 29 is provided in the first circulation pipe 25 and operates based on a signal from the liquid level meter 28.
The second pump 31 is provided in the second circulation pipe 26 and pressurizes the vapor of the refrigerant 22.

  The heat exchanging device 32 is provided in the first circulation pipe 25 between the boiling chamber 21 and the first pump 29, and before the refrigerant 22 recirculated to the boiling chamber 21 is injected into the boiling chamber 21, The temperature is the same as the temperature of the refrigerant 22 in the boiling chamber 21.

In the above configuration, as shown in FIG. 2, when the semiconductor element A operates and the temperature rises, the refrigerant 22 begins to boil and the temperature of the semiconductor element A is maintained at the boiling temperature.
Even if the power consumption of the semiconductor element A increases, the temperature of the semiconductor element A is maintained at the boiling point temperature within a certain range.
That is, a range where the temperature of the semiconductor element A does not depend on the power consumption appears.

When the power consumption further increases and the cooling cannot catch up, the temperature of the semiconductor element A begins to rise again.
If the semiconductor element A is used in such a range that the temperature of the semiconductor element A does not depend on the power consumption, the semiconductor element A can always be cooled at a constant temperature even if the power consumption changes.

The boiling point temperature of the refrigerant 22 depends on the atmospheric pressure.
In boiling in a closed space, there is a possibility that the internal pressure rises and the boiling point temperature rises. Therefore, a pressure valve 27 is provided in the boiling chamber 21 to keep the internal pressure of the boiling chamber 21 constant.
This makes it possible to keep the boiling temperature constant.
In addition, by adjusting the pressure at which the pressure valve 27 opens, the internal pressure of the boiling chamber 21 can be adjusted, and the boiling point of the refrigerant 22 can be adjusted. Therefore, the degree of freedom in setting the operating temperature of the semiconductor element A is increased.

  As a result, a semiconductor cooling device capable of cooling each semiconductor element A at a constant temperature in an apparatus in which the power consumption of the plurality of semiconductor elements A fluctuates asynchronously and dynamically is obtained.

The case where 1 kW is cooled is calculated using Freon 123 as an example.
Since Freon 123 has a heat of vaporization of 171 kJ / kg and a specific gravity of 1.46 g / cm ³ , the supply amount of Freon is only 4 cm ³ / sec to take 1 kW by the heat of vaporization.
The evaporated chlorofluorocarbon is discharged at a flow rate of 856 cm ³ / sec (in the case of 1 atm).

Therefore, piping that can flow a total of 860 cm ³ / sec is required for inflow and outflow, but if the pressure in the exhaust pipe is increased, the exhaust volume can be reduced. For example, if the pressure in the exhaust pipe is 2 atm, 432 cm ³ / sec is enough.
The second pump 31 can be used for this pressurization.

On the other hand, the case where 1 kW is cooled with water and a temperature difference is made into 1 degreeC or less is estimated.
At 1 kW, the temperature rises by 1 ° C. with an amount of water of 240 cm ³ / sec, so a minimum amount of water of 240 cc is required.
Therefore, piping that can flow a total of 480 cm ³ / sec is required for inflow and outflow.

  Considering that there is already a small pressure valve 27 on the market, as described above, it is sufficiently possible to configure the device with the same size as the water cooling device of FIG. In particular, in a device in which the power consumption of a plurality of elements A fluctuates asynchronously and dynamically, a semiconductor cooling device having a great advantage that each semiconductor element A can be cooled at a constant temperature can be obtained.

  Since the object A to be cooled is a semiconductor element in contact with the boiling chamber 21, it is only necessary to be in contact with the boiling chamber 21, and a semiconductor cooling device in which the semiconductor element can be easily attached and detached is obtained.

  Since the refrigerant 22 is a CFC-based refrigerant 22, the CFC-based refrigerant is less corrosive and a semiconductor cooling device is obtained that is less likely to damage the object to be cooled.

  Since the second pump 31 provided in the second circulation pipe 26 to pressurize the refrigerant vapor and send it to the cooling unit 23 is provided, the pressure of the refrigerant vapor raises the temperature of the refrigerant vapor. The temperature difference between the external cooling device 24 and the external cooling device 24 is increased, and a semiconductor cooling device with improved cooling efficiency is obtained.

  Before the refrigerant 22 provided in the first circulation pipe 25 between the boiling chamber 21 and the first pump 29 and recirculated to the boiling chamber 21 is injected into the boiling chamber 21, the refrigerant 22 in the boiling chamber 21. Since the heat exchanging device 32 having the same temperature is provided, a semiconductor cooling device with improved cooling accuracy can be obtained.

  In addition, the to-be-cooled body A may be a substrate on which a plurality of semiconductor elements to be cooled by being immersed in the coolant 22 in the boiling chamber 21 is mounted, or an apparatus on which a plurality of substrates are mounted.

As a result, the object A to be cooled is a substrate on which a plurality of semiconductor elements to be cooled by being immersed in the refrigerant 22 in the boiling chamber 21 or a device on which a plurality of substrates are mounted. Thus, a semiconductor cooling device capable of cooling the plurality of semiconductor elements at the same temperature is obtained.
Further, if the entire substrate on which a plurality of elements are mounted is directly immersed in the coolant 22 in the boiling chamber 21, a semiconductor cooling device capable of cooling the entire substrate at a constant temperature can be obtained.

Further, a circulation means for circulating the refrigerant 22 in the boiling chamber 21 may be provided.
As a result, when the object to be cooled is a substrate or the like, depending on the shape, even when a portion where the refrigerant is partially insufficient occurs, the refrigerant can be forcibly sent, so that the cooling efficiency is further improved. A cooling device is obtained.

Since the second pump 31 in FIG. 1 is for increasing the efficiency of the secondary cooling system, the second pump 31 may theoretically be omitted.
Moreover, since the heat exchanger 32 of FIG. 1 is for raising cooling accuracy, the heat exchanger 32 may theoretically be omitted.

  Further, since the circulation means for circulating the refrigerant in the boiling chamber 21 is for increasing the cooling efficiency, the circulation means for circulating the refrigerant in the boiling chamber 21 may theoretically be omitted.

Further, the liquid level meter 28 and the first pump 29 operate in conjunction with each other, and adjust the liquid amount so that the refrigerant 22 in the boiling chamber 21 is within a certain range. However, this adjustment need not be so strict.
The external cooling device 24 only needs to be able to cool the refrigerant vapor to the condensing point temperature or lower, so that strict temperature management is not necessary.

The above description merely shows a specific preferred embodiment for the purpose of explanation and illustration of the present invention.
Therefore, the present invention is not limited to the above-described embodiments, and includes many changes and modifications without departing from the essence thereof.

It is principal part structure explanatory drawing of one Example of this invention. It is operation | movement explanatory drawing of FIG. It is principal part perspective structure explanatory drawing of the prior art example generally used conventionally. (A) is a front view of FIG. 3, (b) is a plan view of FIG. It is composition explanatory drawing of the other conventional example generally used conventionally.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat radiator 2 Pipe 3 Water 11 Pipe 12 Refrigerant 13 Cooling device 21 Boiling chamber 22 Refrigerant 23 Cooling part 24 External cooling device 25 1st circulation pipe 26 2nd circulation pipe 27 Pressure valve 28 Liquid level meter 29 1st pump 31 Second pump 32 Heat exchange device A Semiconductor element B Printed circuit board

Claims (7)

In a semiconductor cooling device that transmits heat generated from a semiconductor element to an external cooling device,
A boiling chamber filled with refrigerant;
An object to be cooled provided in the boiling chamber;
A cooling unit provided near the external cooling device and in which the refrigerant is cooled by the external cooling device;
A first circulation pipe having one end connected to the lower side of the boiling chamber and the other end connected to the lower side of the cooling unit;
A pressure valve that is provided in the boiling chamber and keeps the pressure in the boiling chamber at a predetermined pressure by releasing the refrigerant vapor generated by the heat generation of the cooled object;
A second circulation pipe having one end connected to the outlet of the pressure valve and the other end connected to the upper side of the cooling unit;
A liquid level meter provided in the boiling chamber for measuring the liquid level of the refrigerant;
A semiconductor cooling apparatus, comprising: a first pump provided in the first circulation pipe and operating based on a signal from the liquid level gauge, wherein the object to be cooled is cooled by heat of vaporization caused by boiling of the refrigerant. The semiconductor cooling device according to claim 1, wherein the object to be cooled is a semiconductor element in contact with a boiling chamber. The semiconductor cooling device according to claim 1, wherein the object to be cooled is a substrate on which a plurality of semiconductor elements to be cooled by being immersed in a cooling medium in the boiling chamber or a device on which a plurality of substrates are mounted. . The semiconductor cooling device according to any one of claims 1 to 3, wherein the refrigerant is a fluorocarbon refrigerant. 5. The semiconductor cooling device according to claim 1, further comprising a second pump that is provided in the second circulation pipe and pressurizes the refrigerant vapor and sends the refrigerant vapor to a cooling unit. The refrigerant provided in the first circulation pipe between the boiling chamber and the first pump and returned to the boiling chamber has the same temperature as the refrigerant in the boiling chamber before being injected into the boiling chamber. The semiconductor cooling device according to claim 1, further comprising a heat exchange device. The semiconductor cooling device according to claim 1, further comprising a circulation unit that circulates the refrigerant in the boiling chamber.

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