JP2009231192A - Manufacturing method for organic el device, organic el device, and electronic equipment - Google Patents

Abstract

An organic EL device manufacturing method, an organic EL device, and an electronic apparatus capable of narrowing a frame region are provided.
A method of manufacturing an organic EL device includes a light emitting pixel forming step of forming a light emitting pixel on a substrate and a sealant forming step of forming a frame-shaped sealing agent on the substrate or the substrate. And a filler coating step of coating the substrate 10 or the substrate 50 on a region surrounded by the sealant 6, and the substrate 10 and the substrate 50 are bonded together via the sealant 6 and the filler 46. A bonding process; a curing process for curing the sealant 6 and the filler 46; and a cutting process for cutting the substrate 10 and the substrate 50 along a cutting line L passing through a region surrounded by the sealant 6.
[Selection] Figure 7

Description

  One embodiment according to the present invention relates to a method for manufacturing an organic EL device, an organic EL device, and an electronic apparatus.

  An organic EL (Electro Luminescence) device capable of self-emission has advantages such as a wide viewing angle, high contrast, thinness, and high-speed response, and has recently been used in display units of various electronic devices. As one configuration of the organic EL device, a configuration is known in which an element substrate on which a light emitting pixel is formed and a counter substrate are bonded together via a frame-shaped sealing agent surrounding the light emitting pixel (Patent Document 1). ). According to such a configuration, the counter substrate provided with the color filter can be opposed to the element substrate, and the light emitting pixels can be sealed with the sealant and the counter substrate.

  In addition, a configuration in which a filler is further sealed in a region surrounded by an element substrate, a counter substrate, and a sealant is also known. 12A and 12B are diagrams showing the organic EL device 70 having such a configuration, in which FIG. 12A is a plan view and FIG. 12B is a cross-sectional view taken along the line CC in FIG. In the organic EL device 70, the element substrate 20 on which the light emitting pixels 2R, 2G, and 2B (hereinafter also simply referred to as the light emitting pixels 2) are formed and the counter substrate 60 are interposed via a frame-shaped sealing agent 6 that surrounds the light emitting pixels 2. And have a laminated structure. A region surrounded by the element substrate 20, the counter substrate 60, and the sealant 6 is filled with a filler 46. According to such a configuration, the sealing property of the light emitting pixel 2 can be further improved.

Japanese Patent Laid-Open No. 2003-2231992

  However, in the above configuration, a region where the frame-shaped sealing agent 6 is formed must be secured at the outer edge of the organic EL device 70, and the light emitting pixels 2 cannot be disposed in this region. For this reason, there is a problem that it is difficult to narrow the frame region between the outer periphery of the organic EL device 70 and the light emitting pixels 2.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A light emitting pixel forming step of forming a light emitting pixel on a first substrate, and a frame-shaped sealing agent is formed on the side of the first substrate on which the light emitting pixel is formed or on the second substrate. A sealing agent forming step, a filler applying step of applying a filler to a region surrounded by the sealing agent on the first substrate or the second substrate, and the first substrate and the second substrate. A bonding step of bonding through the sealing agent and the filler; a curing step of curing the sealing agent and the filler; and the first substrate along a cutting line passing through a region surrounded by the sealing agent; And a cutting step of cutting the second substrate.

  According to such a method, an organic EL device having a light emitting pixel sealed with a filler and a counter substrate can be manufactured. Here, the organic EL device is manufactured through a cutting process of cutting the first substrate and the second substrate along a cutting line passing through a region surrounded by the sealant. For this reason, the obtained organic EL device is in a state in which a sealing agent is not formed on at least a part of the outer edge portion. In this way, a part of the sealing agent forming region can be omitted in the organic EL device. Therefore, the frame region between the light emitting pixel and the outer periphery can be narrowed, and the organic EL device can be downsized.

  Application Example 2 In the method of manufacturing the organic EL device, the method includes a step of forming a terminal portion including a plurality of terminals arranged in a row on the first substrate, and the sealing agent forming step includes: A step of forming the sealing agent along the terminal portion between the terminal portion and the light emitting pixel, and the cutting step includes a rectangular shape including the sealing agent formed along the terminal portion inside. An organic EL device manufacturing method including a step of cutting the first substrate and the second substrate along a cutting line.

  According to such a method, it is possible to prevent the filler from entering the terminal portion due to the sealing agent serving as the partition wall in the filler application step. Thereby, an organic EL device having a narrow frame having a terminal part exposed to the outside can be manufactured.

  Application Example 3 In the method for manufacturing the organic EL device, the light emitting pixel forming step includes forming the light emitting pixels constituting the plurality of organic EL devices on the first substrate, The sealing agent forming step is a method of manufacturing an organic EL device including a step of forming the frame-shaped sealing agent surrounding the light emitting pixels included in the plurality of organic EL devices.

  According to such a method, the length of the sealant forming region can be shortened as compared with the method of surrounding the light emitting pixels with the sealant for each organic EL device. Moreover, the freedom degree of the position which applies a filler can be made high. Accordingly, the manufacturing process of the organic EL device can be simplified or shortened.

  Application Example 4 In the method for manufacturing the organic EL device, in the light emitting pixel forming step, the light emitting element in which the terminal portions constituting the two adjacent organic EL devices constitute the two organic EL devices. Forming the light emitting pixel and the terminal portion on the first substrate so as to be located on the opposite side across the pixel, and the sealing agent forming step is included in at least the two organic EL devices A manufacturing method of an organic EL device including a step of forming a frame-shaped sealing agent surrounding a light emitting pixel.

  According to such a method, the length of the sealant forming region can be further shortened. Further, the degree of freedom of the position where the filler is applied can be further increased. Accordingly, the manufacturing process of the organic EL device can be simplified or shortened.

  Application Example 5 A manufacturing method of the organic EL device, wherein the sealing agent is an ultraviolet curable resin, and the curing step includes a step of irradiating the sealing agent with ultraviolet rays.

  According to such a method, the sealing agent can be easily cured by irradiating the sealing agent with ultraviolet rays in the curing step.

  Application Example 6 In the method for manufacturing the organic EL device, the filler is a thermosetting resin, and the curing step includes a step of heating the filler.

  According to such a method, the filler can be easily cured by heating the filler in the curing step.

  Application Example 7 A manufacturing method of the organic EL device, wherein the sealing agent has a viscosity higher than that of the filler.

  According to such a method, in the bonding step, the sealing agent functions as a partition that defines the expansion range of the filler, and therefore the filler can be formed in a desired region.

  Application Example 8 Light Emitting Formed on the First Substrate, the Second Substrate Affixed to the First Substrate via Sealant and Filler, and the Surface of the First Substrate Opposing to the Second Substrate A pixel portion; and a terminal portion including a plurality of terminals formed along at least one side of the first substrate on an outer edge portion of a surface of the first substrate facing the second substrate, and the seal The agent is formed along the terminal portion between the terminal portion and the light emitting pixel in a plan view, and the filler is the region of the region between the first substrate and the second substrate. An organic EL device filled on the light emitting pixel side of a sealing agent.

  In the organic EL device having such a configuration, a sealing agent is not formed on at least a part of the outer edge portion. For this reason, the frame region between the light emitting pixel and the outer periphery can be narrowed, and as a result, the organic EL device can be miniaturized.

  Application Example 9 Electronic equipment including the organic EL device.

  According to such a configuration, the degree of freedom in designing electronic equipment can be increased by using an organic EL device with a narrow frame.

  Hereinafter, embodiments of a method for manufacturing an organic EL device, an organic EL device, and an electronic apparatus will be described with reference to the drawings. In the drawings shown below, the dimensions and ratios of the components are appropriately different from the actual ones in order to make the components large enough to be recognized on the drawings.

(First embodiment)
<Organic EL device>
FIG. 1 is a schematic diagram showing a wiring structure of the organic EL device 1. The organic EL device 1 is an active matrix organic EL device using a TFT (Thin Film Transistor) element as a switching element. In the organic EL device 1, a plurality of scanning lines 16, a plurality of signal lines 17 extending in a direction intersecting with each scanning line 16, and a plurality of power supply lines 18 extending in parallel with each signal line 17 are wired. It has a configuration. At each intersection of the scanning line 16 and the signal line 17, a light emitting pixel 2R, 2G, 2B is formed. The light emitting pixels 2R, 2G, and 2B emit red, green, and blue light, respectively. Hereinafter, when the luminescent colors are not distinguished, they are also simply referred to as the luminescent pixels 2.

  The signal line 17 is connected to a data line driving circuit 14 including a shift register, a level shifter, a video line, and an analog switch. The scanning line 16 is connected to a scanning line driving circuit 15 including a shift register and a level shifter. The data line driving circuit 14 and the scanning line driving circuit 15 are electrically connected to a terminal 19 for connecting to an external circuit.

  In each of the regions of the light emitting pixels 2, a switching TFT 11 to which a scanning signal is supplied to the gate electrode via the scanning line 16, and a storage capacitor for holding a pixel signal supplied from the signal line 17 via the switching TFT 11. 13, a driving TFT 12 to which a pixel signal held by the holding capacitor 13 is supplied to a gate electrode, and an organic into which a driving current flows from the power line 18 when electrically connected to the power line 18 through the driving TFT 12 A functional layer 30 is provided.

  In the organic EL device 1, when the scanning line 16 is driven and the switching TFT 11 is turned on, the potential of the signal line 17 at that time is held in the holding capacitor 13, and the driving TFT 12 is driven according to the state of the holding capacitor 13. The on / off state is determined. Then, a current flows from the power supply line 18 to the organic functional layer 30 through the channel of the driving TFT 12. The organic functional layer 30 emits light with a luminance corresponding to the magnitude of this current.

  FIG. 2 is a plan view of the organic EL device 1. 3 is a cross-sectional view taken along line AA in FIG. 2, and FIG. 4 is a cross-sectional view taken along line BB in FIG. In the organic EL device 1, an element substrate 20 including a rectangular substrate 10 as a first substrate and a counter substrate 60 including a rectangular substrate 50 as a second substrate are bonded via a sealant 6 and a filler 46. It has a combined configuration. The light emitting pixel 2 is formed on the surface of the substrate 10 facing the substrate 50.

  As shown in FIG. 2, the light emitting pixels 2 are arranged in a matrix on the substrate 10 in plan view. The light emitting pixels 2R, 2G, and 2B are repeatedly arranged in this order in the row direction. A light emitting pixel group composed of three light emitting pixels 2R, 2G, and 2B adjacent in the row direction is a display unit (pixel). As the arrangement in the column direction, for example, the light emitting pixels 2 arranged in a certain column can all have the same color, and the light emitting pixels 2R, 2G, and 2B can be arranged in stripes.

  The element substrate 20 including the substrate 10 is larger than the counter substrate 60 including the substrate 50, and a part of the element substrate 20 protrudes from the counter substrate 60. The protruding portion is formed with the terminal 19 exposed. More specifically, a terminal portion 9 including a plurality of terminals 19 is formed on the outer edge portion of the surface of the substrate 10 that faces the substrate 50. The terminal portion 9 is formed along one side of the substrate 10. That is, the terminals 19 are arranged so as to be aligned along one side of the substrate 10. The terminal portion 9 is not formed on the other three sides of the substrate 10. The terminal unit 9 is connected to an external circuit (not shown).

  The sealing agent 6 is formed along the terminal portion 9 between the terminal portion 9 and the light emitting pixel 2 in a plan view. Therefore, the sealing agent 6 is formed only on the portion along the terminal portion 9 in the outer edge portion of the substrate 50. The filler 46 is filled in the region between the substrate 10 and the substrate 50 on the light emitting pixel 2 side of the sealant 6 (the region where dots are arranged in FIG. 2).

  As shown in FIG. 3, the organic EL device 1 includes a circuit element layer 21, a pixel electrode 24, an organic functional layer 30, and a cathode 36 on a substrate 10, and these organic EL elements. A cathode protective layer 38, a buffer layer 42, and a gas barrier layer 44 are provided to cover the device. Here, the top emission type organic EL device 1 in which light emitted from the organic functional layer 30 is emitted to the gas barrier layer 44 side will be described as an example.

  As the substrate 10, a glass substrate, a quartz substrate, or the like can be used. The circuit element layer 21 is formed on the substrate 10. The circuit element layer 21 includes a driving TFT 12 for driving the pixel electrode 24, various circuits and elements, a conduction portion, an interlayer insulating layer, and the like. As shown in FIG. 4, a terminal portion 9 including a plurality of terminals 19 is formed in a region along one side of the substrate 10 on the circuit element layer 21.

  A pixel electrode 24 is formed in a region corresponding to each light emitting pixel 2 on the circuit element layer 21. The pixel electrode 24 is electrically connected to the drain of the driving TFT 12 through a contact hole. As the material of the pixel electrode 24, since the organic EL device 1 is a top emission method, a light-transmitting or non-light-transmitting conductive material can be appropriately used. The material of the pixel electrode 24 is, for example, ITO (Indium Tin Oxide). The pixel electrode 24 may have a multilayer structure such as a reflective layer / inorganic insulating layer / translucent anode in order to further improve reflectivity.

A lyophilic inorganic bank 26 is formed between adjacent pixel electrodes 24. The inorganic bank 26 is formed with an opening corresponding to each light emitting pixel 2. In addition, the inorganic bank 26 has a portion that overlaps the peripheral edge of the pixel electrode 24 with a predetermined width along the periphery of the opening. The inorganic bank 26 is made of an inorganic material such as SiO ₂ .

  On the inorganic bank 26, an organic bank 28 that partitions the region of the light emitting pixels 2 is formed. The organic bank 28 has an opening that overlaps the opening of the inorganic bank 26. The organic bank 28 is made of an organic material such as acrylic resin.

  A hole transport layer 32 and a light emitting layer 34 are laminated in this order in a recess having the pixel electrode 24 as a bottom and the organic bank 28 as a side wall. More specifically, a light emitting layer 34 that emits red, green, and blue light is formed in each of the light emitting pixels 2R, 2G, and 2B. The organic functional layer 30 includes a hole transport layer 32 and a light emitting layer 34. When the holes injected from the hole transport layer 32 and the electrons injected from the cathode 36 are recombined in the light emitting layer 34, light emission of any one of R, G, and B is obtained. The organic functional layer 30 may further include an electron injection layer stacked on the light emitting layer 34, or may be composed of four or more functional layers including the light emitting layer 34.

  As a material of the hole transport layer 32, for example, a polythiophene derivative, a polypyrrole derivative, or a doped body thereof can be used. Specifically, 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) dispersion, that is, 3,4-polyethylenediosithiophene is dispersed in polystyrene sulfonic acid as a dispersion medium. A dispersion in which water is dispersed in water can be used.

  As the material of the light emitting layer 34, a known light emitting material capable of emitting fluorescence or phosphorescence can be used. Specifically, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinylcarbazole (PVK), polythiophene derivative, polymethyl Polysilanes such as phenylsilane (PMPS) are preferably used. Further, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, nile red, coumarin 6, quinacridone. For example, a low molecular material such as the like may be doped. Instead of the polymer material described above, a known low molecular material may be used.

  A cathode 36 is formed on the organic functional layer 30 and the organic bank 28 so as to cover them. The cathode 36 is made of a translucent conductive material because the organic EL device 1 is a top emission type. As the material of the cathode 36, a material having a large electron injection effect, for example, calcium, magnesium, sodium, lithium metal, or metal compounds thereof, metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, acetylacetate, and the like. An organometallic complex such as sodium calcium, ITO, or the like can be used. In the present embodiment, as a material for the cathode 36, a laminate of lithium fluoride, a magnesium-silver alloy, and ITO is used by adjusting the film thickness so as to obtain translucency.

  A cathode protective layer 38 that covers the cathode 36 is formed on the cathode 36. The cathode protective layer 38 is for preventing the cathode 36 from being damaged by residual moisture or the like of the buffer layer 42 located in the upper layer in the manufacturing process. The cathode protective layer 38 is also intended to improve the flatness, defoaming property, adhesion, and the like during the formation of the buffer layer 42 and to reduce the angle of the side edge. As a material for the cathode protective layer 38, a silicon compound containing nitrogen such as silicon nitride or silicon oxynitride having a high density and a high density in consideration of translucency, denseness, water resistance, insulation and gas barrier properties. Etc. are preferred. The elastic modulus of the material of the cathode protective layer 38 is preferably 100 GPa or more. The thickness of the cathode protective layer 38 is preferably about 50 nm to 200 nm. In this embodiment, the material of the cathode protective layer 38 is SiON, and the film thickness is about 200 nm. As a method for forming the cathode protective layer 38, for example, a high-density plasma film forming method such as an ECR sputtering method or an ion plating method can be applied.

  A buffer layer 42 is provided on the cathode protective layer 38 in a wider range than the cathode 36. The buffer layer 42 is disposed so as to fill the concave and convex portions of the surface of the cathode 36 reflecting the shape of the organic bank 28, and has a substantially flat upper surface. The buffer layer 42 has a function of relieving stress generated by warping or volume expansion of the substrate 10 and preventing the cathode 36 from peeling from the organic bank 28. In addition, since the upper surface of the buffer layer 42 is substantially flattened, the gas barrier layer 44 located on the buffer layer 42 and made of a hard film is also flattened. Thereby, in the gas barrier layer 44, since the site | part which stress concentrates is lose | eliminated, generation | occurrence | production of a crack, peeling, and a defect | deletion can be prevented. The buffer layer 42 is formed by, for example, applying a coating material having an excellent fluidity and having no solvent or volatile component, such as an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less, and then curing it using a curing agent or the like. can do.

  A gas barrier layer 44 that covers the buffer layer 42 and the cathode protective layer 38 is formed on the buffer layer 42. The gas barrier layer 44 is for preventing the cathode 36 and the organic functional layer 30 from being deteriorated due to the entry of oxygen and moisture. As a material of the gas barrier layer 44, a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like is preferably used in consideration of translucency, gas barrier properties, and water resistance. The gas barrier layer 44 is preferably a dense and defect-free film in order to block gas such as water vapor. Therefore, as a method for forming the gas barrier layer 44, a high-density plasma film forming method such as an ECR sputtering method or an ion plating method capable of forming a dense film is suitable.

  The cathode protective layer 38, the buffer layer 42, and the gas barrier layer 44 laminated on the cathode 36 and the organic functional layer 30 are collectively referred to as the thin film sealing layer 8 below. The cathode 36 and the organic functional layer 30 are protected from gas and moisture by the thin film sealing layer 8. The element substrate 20 is configured by elements from the substrate 10 to the gas barrier layer 44.

  Next, the counter substrate 60 will be described. The counter substrate 60 is configured with the substrate 50 as a base. As the substrate 50, for example, a glass substrate or a quartz substrate can be used. On the surface of the substrate 50 on the substrate 10 side, color filters 52R, 52G, and 52B (hereinafter simply referred to as the color filter 52 when the corresponding colors are not distinguished) are formed. The color filters 52R, 52G, and 52B are formed in regions that overlap the light emitting pixels 2R, 2G, and 2B in plan view, and selectively transmit red, green, and blue light, respectively. By arranging the color filter 52, the color purity of the light extracted from the organic EL device 1 can be improved. Further, it is possible to suppress a change in color due to the viewing angle and to block the reflection of external light to some extent.

  In the same layer as the color filter 52, a light shielding layer 54 is formed in an area excluding the formation area of the color filter 52. The light shielding layer 54 is a resin that hardly transmits light, and plays a role of preventing color mixing between adjacent light emitting pixels 2. The counter substrate 60 is configured by the substrate 50, the color filter 52, and the light shielding layer 54.

  A filler 46 is filled between the element substrate 20 and the counter substrate 60. The filler 46 fixes the counter substrate 60 on the gas barrier layer 44 and has a buffering function for protecting the organic functional layer 30 and the gas barrier layer 44 against mechanical shock from the outside. Further, the filler 46 can prevent intrusion of gas and moisture from the outside. The filler 46 is, for example, a resin such as urethane, acrylic, epoxy, or polyolefin, and is formed of an adhesive made of a material that is softer than the counter substrate 60 and has a low glass transition point. As a material of the filler 46, a translucent resin material is preferable. Moreover, it is preferable to use a thermosetting resin. A two-component mixed material in which a curing agent is added to cure at a lower temperature may be used.

  In addition, it is preferable to add a silane coupling agent or alkoxysilane to the filler 46. In this way, the adhesion between the formed filler 46 and the gas barrier layer 44 becomes better, and therefore the buffering function against mechanical impact is enhanced. Further, when the gas barrier layer 44 is formed of a silicon compound, the adhesion with the gas barrier layer 44 can be improved by a silane coupling agent or alkoxysilane, and thus the gas barrier property of the gas barrier layer 44 is improved. be able to.

  As shown in FIGS. 2 and 3, in the vicinity of the three sides of the element substrate 20 where the terminal portions 9 are not formed, the filler 46 has a gap in a region overlapping the element substrate 20 and the counter substrate 60 in plan view. Filled without. On the other hand, as shown in FIGS. 2 and 4, the sealing agent 6 is formed in the vicinity of the side where the terminal portion 9 is formed in the element substrate 20 along this side (that is, along the terminal portion 9). The filler 46 is filled on the light emitting pixel 2 side of the sealant 6. Here, the sealing agent 6 is made of, for example, an ultraviolet curable resin, and has a role of adhering the element substrate 20 and the counter substrate 60. It plays a role of keeping constant. Further, like the filler 46, the sealing agent 6 has a function of protecting the organic functional layer 30 and the gas barrier layer 44 against external mechanical shock and external gas and moisture intrusion.

  According to the configuration of the present embodiment in which the sealing agent 6 is formed only on the portion along the terminal portion 9 and is not formed on the remaining three sides, the sealing agent 6 is formed in a frame shape along the four sides. Compared with the conventional configuration (FIG. 12A), the frame region between the light emitting pixel 2 and the outer periphery can be narrowed. That is, conventionally, in order to irradiate the sealing agent 6 made of an ultraviolet curable resin with ultraviolet rays, the sealing agent 6 cannot be provided at a position overlapping the light shielding layer 54, and the sealing agent 6 is disposed further outside the light shielding layer 54. Since it had to be formed, there was a problem that the frame area widened by the amount of the sealing agent 6. On the other hand, according to the configuration of the present embodiment, the light shielding layer 54 can be disposed up to the vicinity of the outer periphery of the substrate for the sides where the sealant 6 is not formed (in other words, FIG. 3 and FIG. 4). Since the outer periphery can be set to the inner side up to the vicinity of the formation region of the light shielding layer 54, the frame can be narrowed. Thereby, the organic EL device 1 can be reduced in size.

  The organic EL device 1 may be a bottom emission method. When the organic EL device 1 is a bottom emission system, it is configured to extract light from the substrate 10 side. Therefore, the material of the substrate 10 is a translucent or translucent material, and a glass substrate is used. Is preferred. The pixel electrode 24 is also made of a translucent material. On the other hand, the cathode 36 is configured to have light reflectivity so as to function as a reflective film. Further, both the filler 46 and the counter substrate 60 can be made of a material that does not have translucency.

<Method for manufacturing organic EL device>
Next, a method for manufacturing the organic EL device 1 will be described with reference to FIGS. FIG. 5 is a flowchart showing a method for manufacturing the organic EL device 1 according to the first embodiment. FIG. 6 is a cross-sectional view showing a manufacturing process of the organic EL device 1. FIG. 7 is a plan view showing the positions where the sealing agent 6 and the filler 46 are formed in the manufacturing process of the organic EL device 1. In the flowchart of FIG. 5, steps S <b> 11 to S <b> 14 are steps for manufacturing the element substrate 20, and step S <b> 21 is a step for manufacturing the counter substrate 60. Steps S31 to S34 are steps for combining the element substrate 20 and the counter substrate 60 to complete the organic EL device 1. Steps S11 to S14 and step S21 are performed independently. Hereinafter, it demonstrates along the flowchart of FIG.

  In step S11, the light emitting pixels 2 are formed on the substrate 10 (FIG. 6A). More specifically, the circuit element layer 21, the inorganic bank 26, the organic bank 28, the organic functional layer 30 including the light emitting layer 34, the cathode 36, and the like shown in FIG. 3 are formed on the substrate 10. In FIG. 6, some of these components are omitted. Here, as shown in FIG. 7, the light emitting pixels 2 constituting the plurality of organic EL devices 1 are formed on the substrate 10. Therefore, the element substrate 20 manufactured in steps S11 to S14 is a composite element substrate including components corresponding to the plurality of organic EL devices 1 on the same substrate. In FIG. 7, the components corresponding to the six organic EL devices 1 are formed on the substrate 10, but the number of organic EL devices 1 can be increased or decreased as necessary. In step S <b> 11, terminal portions 9 (FIG. 2 and FIG. 4) including a plurality of terminals 19 arranged in a row are also formed on the substrate 10. Step S11 can be performed by using various film forming methods and patterning methods such as a plasma CVD method, a sputtering method, a vapor deposition method, a droplet discharge method, and various etching methods. As a method for forming the light emitting layer 34, either a vapor deposition method or a droplet discharge method may be used. Step S11 corresponds to a light emitting pixel formation step.

  In step S12, thin film sealing is performed on the light emitting pixels 2 on the substrate 10 (FIG. 6A). More specifically, the cathode protective layer 38, the buffer layer 42, and the gas barrier layer 44 shown in FIG. 3 are formed so as to cover the light emitting pixels 2. In FIG. 6, the cathode protective layer 38, the buffer layer 42, and the gas barrier layer 44 are collectively drawn as the thin film sealing layer 8. This step can be performed using various film forming methods and patterning methods such as plasma CVD, sputtering, vapor deposition, droplet discharge, and various etching methods.

  In step S13, a frame-shaped sealing agent 6 is formed on the side of the substrate 10 on which the light emitting pixels 2 are formed (FIG. 6B). This step is performed by applying a sealing agent 6 made of an ultraviolet curable resin on the substrate 10 by a dispenser application method. As the sealing agent 6, one having a viscosity higher than that of the filler 46 applied in step S14 is used. In addition, a spacer is mixed in the sealing agent 6. The application amount of the sealing agent 6 is set, for example, such that the width of the sealing agent 6 after bonding in step S31 is about 2 mm. As shown in FIG. 7, the planar formation position of the sealing agent 6 is a substantially rectangular frame-like region surrounding the light emitting pixels 2 included in each organic EL device 1. Here, a chain line in FIG. 7 indicates a position that will later become the outer shape of the organic EL device 1, and a part of the sealing agent 6 is disposed outside the outer shape of the organic EL device 1. More specifically, a sealing agent 6 is formed between the terminal portion 9 and the light emitting pixel 2 along the terminal portion 9, and the sealing agent 6 excluding the portion along the terminal portion 9 is an organic EL device. It is located outside the outer shape of 1. Therefore, step S <b> 13 includes a step of forming the sealing agent 6 along the terminal portion 9 between the terminal portion 9 and the light emitting pixel 2. Step S13 corresponds to a sealant forming step. The sealing agent 6 may be formed by other coating methods such as a screen printing method.

  In step S14, the filler 46 is applied to the region surrounded by the sealing agent 6 on the substrate 10 (FIG. 6C). This step is performed by applying a filler 46 made of a thermosetting resin on the substrate 10 by a dispenser application method or a droplet discharge method. A filler having a lower viscosity than the sealant 6 is used as the filler 46. Further, as the filler 46, it is preferable to use a material that becomes transparent after curing, and a material that cures at a low temperature of 100 ° C. or less. In this step, it is not necessary for the filler 46 to spread over the entire rectangular frame formed by the sealing agent 6, but the sealing agent 6 functions as a partition even when the viscosity of the filler 46 is low and spreads. Therefore, the filler 46 is disposed in the frame of the sealant 6. The application amount of the filler 46 is set to a volume substantially equal to the volume of the region surrounded by the element substrate 20, the counter substrate 60, and the sealing agent 6 at the time of bonding in step S <b> 31. Step S14 corresponds to a filler coating step. The element substrate 20 is completed through steps S11 to S14.

  In step S21, the counter substrate 60 is manufactured by forming the color filter 52 and the light shielding layer 54 shown in FIG. Here, on the substrate 50, the color filter 52 and the light shielding layer 54 constituting the plurality of organic EL devices 1 are formed. Therefore, the counter substrate 60 manufactured in the step S21 is a composite counter substrate including components corresponding to the plurality of organic EL devices 1 on the same substrate.

  Step S31 is a bonding step. In this step, the element substrate 20 including the substrate 10 and the counter substrate 60 including the substrate 50 are bonded together via the sealant 6 and the filler 46 (FIG. 6D). More specifically, contact and pressure bonding are performed in a state where the element substrate 20 and the counter substrate 60 are aligned (positioned) in a reduced pressure environment. At this time, the element substrate 20 and the counter substrate 60 are supported by a spacer included in the sealant 6 and are bonded together with a certain distance. The distance between the element substrate 20 and the counter substrate 60 (that is, the spacer diameter) is, for example, 10 μm. Then, a filler 46 is filled in a region surrounded by the element substrate 20, the counter substrate 60, and the sealing agent 6. Here, since the sealant 6 having a viscosity higher than that of the filler 46 is used, the filler 46 is spread by the element substrate 20 and the counter substrate 60 while the sealant 6 serves as a partition wall. It stays within the frame that sealant 6 forms. Thereby, the filler 46 can be filled in the region while preventing a problem that the filler 46 enters the terminal portion 9.

  In step S32, the sealing agent 6 is cured. Specifically, the sealing agent 6 made of ultraviolet curable resin is cured by irradiating ultraviolet rays from the counter substrate 60 side.

  In step S33, the filler 46 is cured. Specifically, the filler 46 is cured by performing a heat treatment on the filler 46 made of a thermosetting resin. As a heat treatment method, for example, a method in which the element substrate 20 and the counter substrate 60 after bonding are heated in a baking furnace can be used. At this time, it is preferable to heat at a temperature of 100 ° C. or less from the viewpoint of preventing deterioration of the organic functional layer 30. Step S32 and step S33 correspond to a curing step, and the sealing agent 6 and the filler 46 are cured through these steps. The cured sealant 6 and filler 46 also serve to keep the distance between the element substrate 20 and the counter substrate 60 constant.

  Step S34 is a cutting step. In this step, the substrate 10 and the substrate 50 are cut, and the individual organic EL devices 1 are cut out from the bonded substrates (FIG. 6E). More specifically, the substrate 10 (element substrate 20) and the substrate 50 (counter substrate 60) are cut along a cutting line L indicated by a chain line in FIG. The cutting line L matches the outline of the organic EL device 1. For example, the substrates 10 and 50 are first scribed along the cutting line L, and then an external force is applied to the substrates 10 and 50 to cut (break) along the cutting line L.

  Here, since a part of the sealing agent 6 is formed outside the outline of the organic EL device 1, a cutting line L passing through a region surrounded by the sealing agent 6 (inside the frame formed by the sealing agent 6). The substrate 10 and the substrate 50 are cut along the line. That is, a part of the cutting line L is set in a region filled with the filler 46 in the frame of the sealing agent 6, and a part of the sealing agent 6 is not included in the organic EL device 1 obtained after cutting. It becomes. Moreover, this cutting line L is a rectangular cutting line which contains the sealing agent 6 formed along the terminal part 9 inside, and the sealing agent 6 formed along the terminal part 9 is organic EL after cutting. It remains in the device 1. Accordingly, in step S34, the organic EL device has the sealing agent 6 between the terminal portion 9 and the light emitting pixel 2 and the sealing agent 6 is not formed on the three sides where the terminal portion 9 is not formed. 1 (FIG. 2) is taken out.

  According to such a method, the obtained organic EL device 1 is in a state in which the sealing agent 6 is not formed on at least a part of the outer edge portion. In this way, a part of the formation area of the sealing agent 6 in the organic EL device 1 can be omitted. Therefore, the frame area between the light emitting pixel 2 and the outer periphery can be narrowed, and the organic EL device 1 can be downsized.

(Second Embodiment)
Next, a method for manufacturing the organic EL device 1 according to the second embodiment will be described. The configuration of the organic EL device 1 obtained by the manufacturing method of the present embodiment is the same as that of the organic EL device 1 according to the first embodiment. In addition, the manufacturing method of the organic EL device 1 of the present embodiment is partially different from the first embodiment, and the other steps are the same. For this reason, below, the difference of the manufacturing method with 1st Embodiment is demonstrated.

  FIG. 8 is a plan view illustrating positions where the sealing agent 6 and the filler 46 are formed in the manufacturing process of the organic EL device 1 according to the second embodiment. As shown in this figure, in this embodiment, the sealing agent 6 is formed on the substrate 10 so as to surround the light emitting pixels 2 included in the three organic EL devices 1 arranged side by side. In other words, the sealing agent forming step (step S13) of the present embodiment includes a step of forming a frame-shaped sealing agent 6 surrounding the light emitting pixels 2 included in the plurality of organic EL devices 1. In this way, the length of the region where the sealing agent 6 is formed can be shortened as compared with the method of surrounding the light emitting pixels 2 with the sealing agent 6 for each organic EL device 1. Therefore, the drawing time using a dispenser coating method or the like can be shortened. Also in this embodiment, a part of the sealing agent 6 is disposed outside the outer shape of the organic EL device 1. That is, the sealant 6 is formed between the terminal portion 9 and the light emitting pixel 2 in the organic EL device 1, while the other sealants 6 are formed outside the region of the organic EL device 1.

  In the subsequent filler application step (step S14), the filler 46 is applied to the region surrounded by the sealant 6. At this time, since the rectangular frame formed by the sealant 6 is larger than that in the first embodiment, the degree of freedom of the position where the filler 46 is applied or discharged by the dispenser or the droplet discharge device can be increased.

  A cutting process (process S34) is performed after a bonding process and a hardening process. More specifically, the substrate 10 (element substrate 20) and the substrate 50 (counter substrate 60) are cut along a cutting line L indicated by a chain line in FIG. The cutting line L matches the outline of the organic EL device 1. Here, since the sealing agent 6 is formed outside the outline of the organic EL device 1 except for a portion formed along the terminal portion 9, a part of the cutting line L is a frame of the sealing agent 6. It is set to the area | region where the inside filler 46 was filled, and a part of sealing agent 6 will not be contained in the organic electroluminescent apparatus 1 obtained after a cutting | disconnection. Therefore, after cutting, the organic EL device 1 has the sealing agent 6 between the terminal portion 9 and the light emitting pixel 2 and the sealing agent 6 is not formed on the three sides where the terminal portion 9 is not formed. (FIG. 2) is removed. Therefore, the organic EL device 1 with a narrow frame can be obtained as in the first embodiment.

  According to the method for manufacturing the organic EL device 1 of the present embodiment, the length of the region where the sealing agent 6 is formed can be shortened, and the degree of freedom of the position where the filler 46 is applied can be increased. The manufacturing process of the organic EL device 1 can be simplified or shortened.

(Third embodiment)
Next, a method for manufacturing the organic EL device 1 according to the third embodiment will be described. The configuration of the organic EL device 1 obtained by the manufacturing method of the present embodiment is the same as that of the organic EL device 1 according to the first embodiment. In addition, the manufacturing method of the organic EL device 1 of the present embodiment is partially different from the first embodiment, and the other steps are the same. For this reason, below, the difference of the manufacturing method with 1st Embodiment is demonstrated.

  FIG. 9 is a plan view illustrating positions where the sealing agent 6 and the filler 46 are formed in the manufacturing process of the organic EL device 1 according to the third embodiment. As shown in this figure, in this embodiment, the arrangement of the organic EL devices 1 on the element substrate 20 (composite element substrate) and the counter substrate 60 (composite counter substrate) is adjacent in the column direction (vertical direction in FIG. 9). Things are upside down. That is, the terminal portions 9 of the two organic EL devices 1 that are adjacent in the column direction are located on the opposite side with the light emitting pixel 2 that constitutes the two organic EL devices 1 interposed therebetween. In order to obtain such a configuration, in the light emitting pixel forming step (step S11) of the present embodiment, the terminal portions 9 that constitute the two adjacent organic EL devices 1 are the light emitting pixels that constitute the two organic EL devices 1. 2 includes a step of forming the light emitting pixels 2 and the terminal portions 9 on the substrate 10 so as to be positioned on the opposite side with respect to 2.

  Further, the sealant 6 is formed on the substrate 10 so as to surround the light emitting pixels 2 included in the six organic EL devices 1 arranged adjacent to each other over 2 rows and 3 columns. In other words, the sealing agent forming step (step S13) of the present embodiment is adjacent as described above (that is, adjacent in a state in which the terminal portions 9 are positioned on the opposite side across the light emitting pixels 2). A step of forming the sealant 6 in a frame shape surrounding the light emitting pixels 2 included in the device 1. At this time, the sealant 6 is formed between the terminal portion 9 of each organic EL device 1 and the light emitting pixel 2, while the other is formed outside the region of the organic EL device 1. In this way, the sealing agent 6 can be formed so as to surround the light emitting pixels 2 of a large number of organic EL devices 1. Compared to the method of surrounding the light emitting pixels 2 with the sealing agent 6 for each organic EL device 1, The length of the formation area of the sealing agent 6 can be shortened.

  In the subsequent filler application step (step S14), the filler 46 is applied to the region surrounded by the sealant 6. At this time, since the rectangular frame formed by the sealant 6 is larger than the first and second embodiments, the degree of freedom of the position where the filler 46 is applied or discharged by the dispenser or the droplet discharge device can be increased. it can.

  A cutting process (process S34) is performed after a bonding process and a hardening process. More specifically, the substrate 10 (element substrate 20) and the substrate 50 (counter substrate 60) are cut along a cutting line L indicated by a chain line in FIG. The cutting line L matches the outline of the organic EL device 1. Here, since the sealing agent 6 is formed outside the outline of the organic EL device 1 except for the portion formed along the terminal portion 9, a part of the cutting line L is a frame of the sealing agent 6. It is set to the area | region where the inside filler 46 was filled, and a part of sealing agent 6 will not be contained in the organic electroluminescent apparatus 1 obtained after a cutting | disconnection. Therefore, after cutting, the organic EL device 1 has the sealing agent 6 between the terminal portion 9 and the light emitting pixel 2 and the sealing agent 6 is not formed on the three sides where the terminal portion 9 is not formed. (FIG. 2) is removed. Therefore, the organic EL device 1 with a narrow frame can be obtained as in the first embodiment.

  According to the manufacturing method of the organic EL device 1 of the present embodiment, the length of the region where the sealing agent 6 is formed can be further shortened, and the degree of freedom of the position where the filler 46 is applied can be increased. Therefore, the manufacturing process of the organic EL device 1 can be simplified or shortened.

(Electronics)
The organic EL device 1 described above can be used by being mounted on an electronic device such as a mobile phone, for example. FIG. 11 is a perspective view of a mobile phone 100 as an electronic device. The mobile phone 100 has a display unit 110 and operation buttons 120. The display unit 110 can display various information including information input by the operation buttons 120 and incoming information by the organic EL device 1 incorporated therein. According to such a configuration, the degree of design freedom of the mobile phone 100 can be increased by using the organic EL device 1 having a narrow frame.

  The organic EL device 1 can be used for various electronic devices such as a mobile computer, a television, a digital camera, a digital video camera, an in-vehicle device, and an audio device in addition to the mobile phone 100.

  Various modifications can be made to the above embodiment. As modifications, for example, the following can be considered.

(Modification 1)
In each of the embodiments described above, the terminal portion 9 is formed only in a region along one side of the outer edge portion of the substrate 10, but the terminal portion 9 may be formed along a plurality of sides. FIG. 10 is a plan view of the organic EL devices 1A and 1B according to this modification. The organic EL device 1A shown in FIG. 10A has a configuration in which terminal portions 9 are formed on two opposite sides, and the organic EL device 1B shown in FIG. 10B has two orthogonal sides. The terminal portion 9 is formed. Even in such a configuration, the sealing agent 6 is formed along the terminal portion 9 between the terminal portion 9 and the light emitting pixel 2. That is, the sealant 6 is formed along the two opposing terminal portions 9 in FIG. 10A and along the two orthogonal terminal portions 9 in FIG. 10B. It is not formed on other sides. A region opposite to the terminal portion 9 with the sealant 6 interposed therebetween is filled with a filler 46. Since the organic EL devices 1A and 1B having such a configuration also have no sealant 6 on the side where the terminal portion 9 is not formed, the frame area can be narrowed as in the above embodiments.

(Modification 2)
In each of the embodiments described above, the sealing agent 6 and the filler 46 are disposed on the substrate 10 side as the first substrate and then bonded together. Instead, the sealing agent 6 is disposed on the substrate 50 side as the second substrate. Further, the bonding may be performed after the filler 46 is disposed.

(Modification 3)
In each of the above embodiments, an ultraviolet curable resin is used for the sealant 6 and a thermosetting resin is used for the filler 46. However, the present invention is not limited to this configuration, and the sealant 6 and the filler 46 are respectively Either an ultraviolet curable resin or a thermosetting resin may be used.

The schematic diagram which shows the wiring structure of an organic electroluminescent apparatus. The top view of an organic electroluminescent apparatus. Sectional drawing in the AA line in FIG. Sectional drawing in the BB line in FIG. 3 is a flowchart showing a method for manufacturing the organic EL device according to the first embodiment. Sectional drawing which shows the manufacturing process of the organic electroluminescent apparatus which concerns on 1st Embodiment. The top view which shows the formation position of the sealing agent and filler in the manufacturing process of the organic electroluminescent apparatus which concerns on 1st Embodiment. The top view which shows the formation position of the sealing agent and filler in the manufacturing process of the organic electroluminescent apparatus which concerns on 2nd Embodiment. The top view which shows the formation position of the sealing agent and filler in the manufacturing process of the organic electroluminescent apparatus which concerns on 3rd Embodiment. The top view of the organic electroluminescent apparatus which concerns on the modification 1. FIG. The perspective view of the mobile telephone as an electronic device. It is a figure which shows the organic electroluminescent apparatus of a conventional structure, (a) is a top view, (b) is sectional drawing in the CC line in (a).

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Organic EL device, 2 ... Light emitting pixel, 8 ... Thin film sealing layer, 9 ... Terminal part, 10 ... Substrate as 1st board | substrate, 11 ... Switching TFT, 12 ... Driving TFT, 13 ... Retention capacity, 14 DESCRIPTION OF SYMBOLS ... Data line drive circuit, 15 ... Scanning line drive circuit, 16 ... Scanning line, 17 ... Signal line, 18 ... Power supply line, 19 ... Terminal, 20 ... Element substrate, 21 ... Circuit element layer, 24 ... Pixel electrode, 26 ... Inorganic bank, 28 ... organic bank, 30 ... organic functional layer, 32 ... hole transport layer, 34 ... light emitting layer, 36 ... cathode, 38 ... cathode protective layer, 42 ... buffer layer, 44 ... gas barrier layer, 46 ... filler 50 ... Substrate as second substrate, 52 ... Color filter, 54 ... Light shielding layer, 60 ... Counter substrate, 100 ... Mobile phone, 110 ... Display unit, 120 ... Operation button, L ... Cutting line.

Claims (9)

A light emitting pixel forming step of forming a light emitting pixel on the first substrate;
A sealing agent forming step of forming a frame-shaped sealing agent on the side of the first substrate where the light emitting pixels are formed or on the second substrate;
A filler application step of applying a filler to a region surrounded by the sealant on the first substrate or the second substrate;
A bonding step of bonding the first substrate and the second substrate through the sealant and the filler;
A curing step of curing the sealant and the filler;
And a cutting step of cutting the first substrate and the second substrate along a cutting line passing through the region surrounded by the sealant. It is a manufacturing method of the organic EL device according to claim 1,
Forming a terminal portion including a plurality of terminals arranged in a row on the first substrate;
The sealing agent forming step includes a step of forming the sealing agent along the terminal portion between the terminal portion and the light emitting pixel,
The cutting step includes a step of cutting the first substrate and the second substrate along a rectangular cutting line including the sealing agent formed along the terminal portion. Device manufacturing method. It is a manufacturing method of the organic EL device according to claim 2,
The light emitting pixel forming step includes a step of forming the light emitting pixels constituting the plurality of organic EL devices on the first substrate,
The method of manufacturing an organic EL device, wherein the sealing agent forming step includes a step of forming a frame-like sealing agent surrounding the light emitting pixels included in the plurality of organic EL devices. It is a manufacturing method of the organic EL device according to claim 3,
In the light emitting pixel forming step, the first substrate is arranged such that the terminal portions constituting the two adjacent organic EL devices are located on opposite sides of the light emitting pixels constituting the two organic EL devices. Forming the light emitting pixel and the terminal portion on the substrate;
The method of manufacturing an organic EL device, wherein the sealing agent forming step includes a step of forming the frame-shaped sealing agent surrounding the light emitting pixels included in at least the two organic EL devices. It is a manufacturing method of the organic EL device according to any one of claims 1 to 4,
The sealing agent is an ultraviolet curable resin,
The method for manufacturing an organic EL device, wherein the curing step includes a step of irradiating the sealant with ultraviolet rays. It is a manufacturing method of the organic EL device according to any one of claims 1 to 4,
The filler is a thermosetting resin;
The method for manufacturing an organic EL device, wherein the curing step includes a step of heating the filler. It is a manufacturing method of the organic EL device according to any one of claims 1 to 6,
The method of manufacturing an organic EL device, wherein the sealant has a viscosity higher than that of the filler. A first substrate;
A second substrate bonded to the first substrate via a sealant and a filler;
A light emitting pixel formed on a surface of the first substrate facing the second substrate;
A terminal portion including a plurality of terminals formed along at least one side of the first substrate at an outer edge portion of the surface of the first substrate facing the second substrate;
The sealing agent is formed along the terminal portion between the terminal portion and the light emitting pixel in a plan view.
The organic EL device, wherein the filler is filled on the light emitting pixel side of the sealant in a region between the first substrate and the second substrate.   An electronic apparatus comprising the organic EL device according to claim 8.

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