JP2010056973A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rich technique concerned with fixing between a circuit board and a shield case. <P>SOLUTION: A mobile phone 1 includes a main substrate 29 having a first mounting surface 29a, a shield case 28 arranged oppositely to the first mounting surface 29a to shield the first mounting surface 29a, a nut 43 stuck to the first mounting surface 29a, and a screw 41 which is inserted and engaged into/with the shield case 28 and screwed into the nut 43. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a portable wireless device such as a mobile phone, a PDA, and a game machine.

An electronic device having a shield member that blocks electromagnetic wave noise is known. Patent document 1 is disclosing the mobile telephone which has a circuit board and the shield case which covers the mounting surface of a circuit board. In such a mobile phone, the circuit board and the shield case are generally fixed by screwing a screw that is inserted into the circuit board and whose head engages with the circuit board into the shield case.
JP 2008-140797 A

  However, the above-described method for fixing the circuit board and the shield case causes various problems. For example, the screw head protrudes from the surface of the circuit board opposite to the shield case. For this reason, the large surface of a relatively large component / member cannot be brought close to or brought into contact with the surface of the circuit board opposite to the shield case. For example, the battery cannot be brought close to or in contact with the circuit board. As a result, the size of the portable electronic device is increased and the degree of freedom in design is reduced. In other words, if the battery and the circuit board are brought close to or in contact with each other, the circuit board and the shield case cannot be fixed.

  Therefore, it is preferable that a fixing method different from the above-described fixing method is proposed and the technology is enriched.

  An electronic apparatus according to the present invention includes a circuit board having a mounting surface, a shield member that is disposed to face the mounting surface and shields the mounting surface, a fixing member that is bonded to the mounting surface, the shield member, and the fixing A threaded member that is inserted into and engaged with one of the members and is threadedly engaged with the other member.

  Preferably, the fixing member has a female screw portion opposed to the shield member, and the shield member is formed with a hole portion opposed to the female screw portion, and the screwing member includes the hole portion. The male screw part is inserted from the side opposite to the circuit board, the head engages with the shield member, and the male screw part engages with the female screw part.

  Preferably, an opening is formed in the circuit board, and the fixing member is bonded to the circuit board so as to cover the opening from the mounting surface side and is smaller than the opening. A hole is formed so as to communicate with the opening. The shield member is formed with a female screw portion facing the hole. The screwing member is formed on the mounting surface with the opening and the hole. The male screw part is inserted from the back side, the head engages with the fixing member in the opening, and the male screw part is screwed into the female screw part.

  Preferably, a gap is formed between the shield member and the fixing member in the opposing direction of the shield member and the circuit board.

  Preferably, the screwing member has conductivity, and the fixing member has conductivity, and is bonded to the ground layer of the circuit board by solder.

  Preferably, the shield member includes a flexible board laminated on a side opposite to the circuit board, and a pressing switch mounted on the flexible board, and the switch is a plan view of the flexible board. In FIG. 4, the screw member is disposed at a position overlapping with the screw member.

  Preferably, the battery has a battery disposed opposite to the surface of the circuit board opposite to the mounting surface, and the screwing member is disposed at a position overlapping the battery in a plan view of the circuit board. .

  According to the present invention, it is possible to enrich the technology related to fixing the circuit board and the shield case.

(First embodiment)
FIG. 1 is a perspective view showing the appearance of the mobile phone 1 according to the first embodiment of the present invention in an open state. The mobile phone 1 is configured as a so-called foldable mobile phone, and includes a transmitting case 2 and a receiving case 3 that are rotatably connected to each other between an open state and a closed state.

  The transmitting case 2 and the receiving case 3 are configured to form a case of the entire mobile phone 1 by connecting the end portions of the transmitting case 2 and the receiving case 3 by a connecting portion 4 that is the center of rotation. The transmitter casing 2 and the receiver casing 3 are each formed in a generally thin rectangular parallelepiped shape, and are overlapped with each other in the closed state so that their outlines substantially coincide with each other.

  The transmitter case 2 is provided with, for example, a microphone 87 for calls (see FIG. 6), a built-in antenna 81 for communication (see FIG. 6), and an operation unit 6 for receiving user operations. The receiving case 3 includes, for example, a call speaker 83 (see FIG. 6), a notification speaker 85 (see FIG. 6), a display unit 7 for displaying images and characters, and an imaging unit 89 (see FIG. 6). Is provided.

  In the following, in the transmitter case 2, the side where the operation unit 6 is exposed may be referred to as the front side of the transmitter case 2, and the back side thereof may be referred to as the back side of the transmitter case 2.

  FIG. 2 is an exploded perspective view of the transmission case 2.

  The mobile phone 1 includes a front case 21 that constitutes the front side portion of the transmission case 2, and a rear case 22 and a lid 23 that constitute the back side of the transmission case 2. The mobile phone 1 includes a key sheet 25, a flexible printed wiring board (FPC) 27, a shield case 28, and a stack arranged between the front case 21 and the rear case 22 from the front case 21 side. A main substrate 29 is provided. Furthermore, the mobile phone 1 has a battery 30 between the rear case 22 and the lid 23.

  The front case 21, the rear case 22, and the lid body 23 are each formed of, for example, a nonconductive resin. For example, the front case 21 and the rear case 22 are fixed to each other by screwing a screw inserted into one into a screw boss provided in the other. The key sheet 25, the FPC 27, the shield case 28, and the main board 29 are sandwiched between the front case 21 and the rear case 22. The lid 23 is fixed to the rear case 22 by an engaging portion or the like, and prevents the battery 30 fitted in the opening 22a of the rear case 22 from falling off.

  The key sheet 25 is a sheet formed of an elastic member such as silicon rubber, for example. A plurality of keys 24 exposed from the front case 21 are fixed to the front surface of the key sheet 25. The plurality of keys 24 are made of, for example, hard resin. Note that only the key sheet 25 or only a plurality of keys 24 may be provided.

  A plurality of switches 26 are mounted on the FPC 27. The plurality of switches 26 have a movable contact 26a formed of a dome-shaped metal plate and a fixed contact 26b (see FIG. 5) covered with the movable contact 26a. When the movable contact 26a is pressed by the user via the key 24, the movable contact 26a is elastically deformed and reversed while producing a click feeling, and comes into contact with the fixed contact 26b. Further, when the pressing is released, the movable contact 26a is restored to its original shape by a restoring force and is separated from the fixed contact 26b. Although the movable contact 26a is covered with an insulating film (not shown) that covers the FPC 27, the insulating film is not shown in the present application. In addition to the plurality of switches 26, the FPC 27 is provided with a plurality of LEDs, a plurality of chip resistors, and the like.

  The main board 29 is composed of, for example, a multilayer printed wiring board based on hard resin, and has a first mounting surface 29a on the front case 21 side and a second mounting surface 29b on the back side thereof. . Various electronic components 31 are provided on the first mounting surface 29a. The first mounting surface 29a is formed with a ground pattern layer 33 extending vertically and horizontally so as to divide each mounting surface into a plurality of regions. The plurality of electronic components 31 are divided into a plurality of groups by the ground pattern layer 33. Each group is surrounded by a ground pattern layer 33.

  FIG. 3 is a perspective view of the main board 29 and the shield case 28 as seen from the rear case 22 side.

  Similarly to the first mounting surface 29a, the second mounting surface 29b of the main substrate 29 is provided with various electronic components 31 and a ground pattern layer 33 is disposed. The second mounting surface 29 b includes a facing area 29 c that faces the battery 30. In the facing region 29c, a thick electronic component 31 such as an IC is not mounted, and only an electrode layer is provided. The electrode layer is, for example, a ground pattern layer 33, a wiring pattern layer (not shown), and a planar terminal (not shown). Therefore, in the facing area 29c, there is no unevenness due to the electronic component 31, and it is a flat surface. The battery 30 is disposed in contact with the facing region 29c through an opening 22a formed in the rear case 22. Note that an insulating seal is affixed to the facing region 29c for the purpose of insulation from the outside or the battery 30, but illustration is omitted.

  The shield case 28 is entirely formed of a conductive material. For example, it is formed of a resin in which a metal or a conductive material is kneaded. Alternatively, the shield case 28 is configured by forming a conductive layer such as a metal layer on the surface of an insulating member such as a resin. The shield case 28 includes a facing surface portion 28a that faces the first mounting surface 29a of the main substrate 29, and a partition wall 28b that protrudes from the facing surface portion 28a toward the first mounting surface 29a. The partition wall 28b extends in the same shape as the ground pattern layer 33 on the first mounting surface 29a. When the mobile phone 1 is assembled, the partition wall 28 b comes into contact with the ground pattern layer 33. Thereby, the shield case 28 is electrically connected to the ground pattern layer 33. The shield case 28 may be mounted on the ground pattern layer 33 and electrically connected to the ground pattern layer 33 by a spring terminal (not shown) that contacts the shield case 28. The plurality of electronic components 31 are accommodated in a plurality of spaces (rooms) formed by the first mounting surface 29a, the opposing surface portion 28a, and the partition walls 28b.

  4 is a schematic cross-sectional view taken along line IV-IV in FIG. In addition, the lower side of the drawing is the front side of the transmission housing 2.

  As described above, the battery 30, the main board 29, the shield case 28, and the key sheet 25 are stacked inside the transmission housing 2. The main board 29 and the shield case 28 are fixed to each other by a plurality of screws 41.

  FIG. 5 is a schematic cross-sectional view showing the region V of FIG. 4 in an enlarged manner.

  The screw 41 is inserted into a hole 45 formed in the shield case 28 from the side opposite to the main board 29 and is screwed into a nut 43 mounted on the main board 29, whereby the shield case 28 and the main board are inserted. 29 is fixed. Specifically, it is as follows.

  The screw 41 is a male screw part, and has a male screw portion 41a and a head 41b. The male screw portion 41a is configured by forming a screw groove on the outer peripheral surface of the shaft portion. Note that the male screw portion 41a may be provided over the entire shaft portion, or may be provided at a part on the tip side of the shaft portion. The head 41b is provided at one end of the male screw portion 41a and has a larger diameter than the male screw portion 41a. The screw 41 may be composed of an appropriate type of male screw component. In other words, the shape of the head 41b may be appropriate. For example, the head 41b is formed in a circular shape concentric with the male screw portion 41a, and the top surface is formed in a flat shape. On the top surface of the head 41b, a groove for inserting a driver or a recess for inserting a wrench is formed. The screw 41 is formed of a conductive member, for example, metal.

  The nut 43 has a female screw portion 43a formed by forming a screw groove on the inner peripheral surface of the hole portion. More specifically, the female screw portion 43a is constituted by a concave portion that is shallower than the length of the shaft portion (male screw portion 41a) of the screw 41. However, the female screw portion 43a may be configured by a hole (through hole). The outer shape of the nut 43 may be an appropriate shape such as a circle or a rectangle. The nut 43 is formed of a conductive member, for example, metal. Moreover, the nut 43 may be formed by metal-depositing a nonconductive member. By having such a conductive surface, it becomes possible to mount both sides of a solder paste or a nut in the case of solder mounting, which will be described in detail later, so that assemblability is improved.

  The main substrate 29 has a ground plane layer 29d closer to the shield case 28 than the center. The nut 43 is bonded to the ground plane layer 29d exposed at the non-arranged position of the solder resist layer 29e of the main substrate 29 by solder 47. The nut 43 may be adhered to the ground pattern layer 33.

  The hole 45 is formed in the bottom of a recess 49 formed in the shield case 28 and having a recess on the FPC 27 side. Although the shape of the recessed part 49 may be set suitably, it is circular, for example. The recess 49 is set to a size that can accommodate the head 41 b of the screw 41. The diameter of the recess 49 is set to be slightly larger than the head 41 b of the screw 41 so that there is a margin (play) between the head 41 b of the screw 41 and the recess 49. The depth of the recess 49 is set to be equal to the thickness of the head 41b (the size of the screw 41 in the axial direction).

  The shape of the hole 45 may be set as appropriate, but is circular, for example. The hole 45 has a larger diameter than the male screw portion 41a (shaft portion) of the screw 41 and a smaller diameter than the head 41b. The diameter of the hole 45 is set to be slightly larger than the shaft of the screw 41 so that there is a margin (play) between the shaft of the screw 41 and the hole 45.

  When the main board 29 and the shield case 28 are overlapped, and the male screw part 41a of the screw 41 is inserted into the hole 45 and screwed into the female screw part 43a of the nut 43, the head 41b of the screw 41 is recessed. 49 and is engaged with the bottom surface of the recess 49. At this time, the top surface of the head 41b and the surface of the shield case 28 on the FPC 27 side are flush with each other. Further, the male screw portion 41a reaches the bottom of the female screw portion 43a, and further screwing is prohibited. Due to the prohibition of the screwing, a gap H is formed between the shield case 28 and the nut 43 in the opposing direction of the main board 29 and the shield case 28. Note that the screwing amount of the screw 41 may be adjusted by the worker or the robot so that the gap H is formed when the worker or the robot screwes the screw 41. The FPC 27 is placed on the top surface of the screw 41 that is flush with the FPC 27 side surface of the shield case 28. The switch 26 is located on the screw 41.

  FIG. 6 is a block diagram showing an example of the configuration of the signal processing system of the mobile phone 1.

  The cellular phone 1 includes a CPU 71, a memory 72, a communication processing unit 75, an acoustic processing unit 77, and an image processing unit 79. Each of these parts is constituted by an IC or the like provided on the main board 29.

  The CPU 71 and the memory 72 function as a control unit that performs predetermined calculations based on signals from various units such as the operation unit 6 and controls various units such as the image processing unit 79.

  The communication processing unit 75 performs acoustic communication and image data processed by the CPU 71 in order to communicate with other portable terminal devices and servers via a communication system (telephone network or the Internet) by wireless communication using radio waves. And the like, and the modulated signal is transmitted via the antenna 81. The communication processing unit 75 demodulates the signal received via the antenna 81 and outputs the demodulated data to the CPU 71.

  The acoustic processing unit 77 converts the acoustic data from the CPU 71 into an electrical signal, and outputs the signal to the speaker 83 for call or the speaker 85 that outputs a notification sound or the like. The speaker 83 and the speaker 85 convert the electric signal from the sound processing unit 77 into sound and output the sound. On the other hand, the microphone 87 converts the input sound into an electrical signal and outputs the signal to the sound processing unit 77. The acoustic processing unit 77 converts the electrical signal from the microphone 87 into acoustic data, and outputs the acoustic data to the CPU 71.

  The image processing unit 79 converts the image data from the CPU 71 into an image signal and outputs the signal to the display unit 7. In addition, the image processing unit 79 converts the imaging signal (image data) output from the imaging unit 89 into image data of a predetermined format, and outputs the image data to the CPU 71.

  According to the first embodiment described above, the mobile phone 1 includes the main board 29 having the first mounting surface 29a, and the shield case 28 that is disposed opposite to the first mounting surface 29a and shields the first mounting surface 29a. Have Further, the mobile phone 1 includes a nut 43 bonded to the first mounting surface 29 a and a screw 41 that is inserted into and engaged with the shield case 28 and screwed into the nut 43. Therefore, a new fixing method is provided and the assembly technique is enriched. The assembly technique of the present embodiment does not directly fix the main board 29 and the shield case 28, but fixes the member (nut 43) bonded to the main board 29 and the shield case 28. As described above, various effects can be obtained.

  The nut 43 has a female screw portion 43a that faces the shield case 28, and the shield case 28 has a hole 45 that faces the female screw portion 43a. The screw 41 is a male screw component that is inserted into the hole 45 from the side opposite to the main board 29, the head 41b engages with the shield case 28, and the male screw portion 41a is screwed into the female screw portion 43a. As described above, in the present embodiment, the female screw portion that has been conventionally provided only on the shield case 28 side can be provided on the main board 29 side. As a result, for example, the head 41 b of the screw 41 can be prevented from protruding from the main board 29.

  Since the nut 43 is bonded to the main board 29, the nut 43 may be peeled off from the main board 29 when subjected to a strong impact due to dropping of the mobile phone 1 or the like. However, in the present embodiment, since the gap H is formed between the shield case 28 and the nut 43 in the opposing direction of the shield case 28 and the main board 29, peeling of the nut 43 from the main board 29 is suppressed. Is done. That is, by allowing the part of the main board 29 near the nut 43 to bend, the impact transmitted from the shield case 28 to the screw 41 and the nut 43 is reduced.

  The screw 41 has conductivity, and the nut 43 has conductivity, and is bonded to the ground plane layer 29 d of the main board 29 by solder 47. Therefore, the screw 41 and the nut 43 are also used for grounding the shield case 28, and the number of members can be reduced.

  The mobile phone 1 includes an FPC 27 stacked on the opposite side of the shield case 28 from the main substrate 29, and a push-type switch 26 mounted on the FPC 27. The switch 26 is connected to the screw 41 in a plan view of the FPC 27. It is arranged at the overlapping position. Accordingly, the screw 41 functions as a support column that supports the switch 26. As a result, the operational feeling (clicking feeling, etc.) of the switch 26 can be improved.

  The cellular phone 1 can achieve both the proximity or contact between the battery 30 and the facing area 29c and the fixing of the facing area 29c and the shield case 28, which could not be performed conventionally. That is, the mobile phone 1 includes a battery 30 that is disposed to face a surface (second mounting surface 29 b) opposite to the first mounting surface 29 a of the main substrate 29, and the screws 41 are planar views of the main substrate 29. Can be disposed at a position overlapping the battery 30.

  In the above first embodiment, the mobile phone 1 is an example of the electronic device of the present invention, the main substrate 29 is an example of the circuit board of the present invention, and the shield case 28 is an example of the shield member of the present invention. The nut 43 is an example of the fixing member of the present invention, the screw 41 is an example of the screwing member and the male screw component of the present invention, and the ground plane layer 29d and the ground pattern layer 33 are the ground layer of the present invention. It is an example.

(Second Embodiment)
FIG. 7 is a diagram corresponding to FIG. 4 of the first embodiment of the mobile phone 101 of the second embodiment. Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Also in the second embodiment, as in the first embodiment, the main substrate 129 and the shield case 128 are fixed by a plurality of screws 41.

  FIG. 8 is a schematic cross-sectional view showing a region VIII in FIG. 7 in an enlarged manner.

  The screw 41 is inserted into the main board 129 and screwed into the shield case 128 to fix the shield case 128 and the main board 129. Specifically, it is as follows.

  The shield case 128 is formed with a female screw portion 128g into which the male screw portion 41a of the screw 41 is screwed. Specifically, the female screw portion 128g is configured by forming a screw groove in a hole portion of a screw boss 128f protruding from the shield case 128 toward the main substrate 129 side. The hole portion of the female screw portion 128g is a concave portion shorter than the shaft portion of the screw 41. However, the female screw portion 128g may be a hole (through hole).

  An opening 129h is formed in the main substrate 129. The opening 129h is sized to accommodate the head 41b of the screw 41. The shape of the opening 129h may be set as appropriate, but is circular, for example. The main board 129 is thicker than the head 41 b of the screw 41. Therefore, the depth of the opening 129h is also larger than the thickness of the head 41b. However, the thickness of the main board 129 (the depth of the opening 129h) may be equal to the thickness of the head 41b or may be smaller than the thickness of the head 41b. The diameter of the opening 129h is set to be slightly larger than the head 41b of the screw 41 so that there is a margin (play) between the head 41b of the screw 41 and the opening 129h.

  A sheet metal 143 is mounted on the main substrate 129 so as to cover the opening 129h from the first mounting surface 29a side. Specifically, like the nut 43 of the first embodiment, the ground plane layer 129d exposed at the non-arranged position of the solder resist layer 129e of the main substrate 129 is bonded by the solder 47. The sheet metal 143 may be bonded to the ground pattern layer 33.

  The sheet metal 143 is formed with a hole 143a through which the male screw portion 41a (shaft portion) of the screw 41 can be inserted. The hole 143a communicates with the opening 129h. The shape of the hole 143a may be set as appropriate, but is, for example, circular. The hole portion 143a has a larger diameter than the male screw portion 41a (shaft portion) of the screw 41 and a smaller diameter than the head 41b. The diameter of the hole portion 143a is set slightly larger than the shaft portion of the screw 41 so that there is a margin (play) between the shaft portion of the screw 41 and the hole portion 143a.

  When the main board 129 and the shield case 128 are overlapped, and the male screw portion 41a of the screw 41 is inserted into the opening portion 129h and the hole portion 143a and screwed into the female screw portion 128g, the head 41b of the screw 41 is It is accommodated in the opening 129h and engages with the sheet metal 143. At this time, the male screw portion 41a reaches the bottom of the female screw portion 43a, and further screwing is prohibited. Due to the prohibition of the screwing, a gap H is formed between the shield case 28 and the sheet metal 143 in the opposing direction of the main substrate 29 and the shield case 28. Note that the screwing amount of the screw 41 may be adjusted by an operator or a robot so that the gap H is formed. The FPC 27 is placed on the surface of the shield case 28 on the FPC 27 side. The switch 26 is located on the screw 41.

  In the second embodiment described above, the mobile phone 101 is an example of the electronic device of the present invention, the main board 129 is an example of the circuit board of the present invention, and the shield case 128 is an example of the shield member of the present invention. The sheet metal 143 is an example of the fixing member of the present invention.

  According to the above embodiment, the same effect as that of the first embodiment, that is, the technology for fixing the main substrate 129 and the shield case 128 can be enriched.

  An opening 129h is formed in the main substrate 129, and the sheet metal 143 is bonded to the main substrate 129 so as to cover the opening 129h from the first mounting surface 129a side, and a hole smaller than the opening 129h. 143a is formed to communicate with the opening 129h. The shield case 128 has a female screw portion 128g facing the hole portion 143a. The screw 41 is inserted into the opening portion 129h and the hole portion 143a from the back side of the first mounting surface 129a, and the head 41b is opened. It is a male screw part that engages with the sheet metal 143 in 129h and the male screw part 41a is screwed into the female screw part 128g. Accordingly, the screw 41 can be inserted in the same direction as the conventional one while suppressing the protrusion amount of the head 41b on the second mounting surface 129b or preventing the head 41b from protruding.

  Since a gap H is formed between the shield case 128 and the sheet metal 143 in the opposing direction of the shield case 128 and the main board 129, the shock transmitted to the sheet metal 143 is reduced as in the first embodiment. Thus, peeling of the sheet metal 143 is suppressed. Further, in the second embodiment, since the bending of the sheet metal 143 is allowed, the force for peeling the sheet metal 143 is also reduced by the bending.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The electronic device is not limited to a mobile phone. For example, the electronic device may be a PDA, a notebook computer, a music player, or a game machine. The housing of the electronic device is not limited to a foldable type. Other openable casings such as a slide type may be used, or a straight type casing that does not open and close may be used.

  A fixing member and a screwing member are not limited to what is arrange | positioned in the position covered with a shield member. Further, the screwing member is not limited to one that is inserted and screwed in the facing direction of the circuit board and the shield member. For example, the fixing member is bonded to the mounting surface adjacent to the outer surface of the partition wall of the shield case, and the screwing member is inserted into one of the shield case and the fixing member in the direction along the mounting surface and screwed to the other. May be.

  The screwing member is not limited to a male screw part. For example, it may have a shaft portion and a head having a diameter larger than that of the shaft portion, and a female screw portion may be formed on the shaft portion. In this case, when the fixing member is screwed with the screwing member, a male screw portion is formed on the fixing member.

  The fixing member is not limited to a plate-like member when a hole through which the screwing member is inserted is formed as in the second embodiment. For example, it may be a rectangular parallelepiped or columnar member having a certain thickness. Further, when the circuit board is thinner than the head of the screwing member, a recess is formed on the opening (129h in the second embodiment) side of the circuit board so as to accommodate a part of the head. May be.

  The fixing member may be bonded to the base (insulator) of the circuit board, or may be bonded to the conductive layer as in the embodiment. When the fixing member is bonded to the conductive layer, the fixing member may be bonded to the conductive layer laminated on the surface of the circuit board insulator, or the conductive member embedded in the multilayer circuit board insulator. It may be adhered to the layer. In the present application, if it is adhered to the part exposed on the mounting surface side of the circuit board, it is adhered to the mounting surface. That is, in the present application, not only when the circuit board is bonded to the substrate surface or the conductive layer laminated on the substrate surface, but the multilayer circuit board is exposed to the mounting surface side among the layers inside the substrate. Even when the conductive layer embedded in the part or the base is bonded to the part exposed on the mounting surface side, the conductive layer is also bonded to the mounting surface.

1 is an external perspective view of a mobile phone according to a first embodiment of the present invention. The disassembled perspective view of the mobile telephone of FIG. The perspective view which shows the main board | substrate and shield case of FIG. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 1. FIG. 5 is a schematic cross-sectional view showing a region V of FIG. 4 in an enlarged manner. The block diagram which shows the structure of the signal processing system of the mobile telephone of FIG. The typical sectional view of the cellular phone concerning the 2nd embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing a region VIII in FIG. 7 in an enlarged manner.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mobile telephone (mobile radio apparatus), 29 ... Main board (circuit board), 29a ... 1st mounting surface, 28 ... Shield case (shield member), 41 ... Screw (screwing member), 43 ... Nut (fixing member) ).

Claims (7)

A circuit board having a mounting surface;
A shield member that is disposed opposite to the mounting surface and shields the mounting surface;
A fixing member bonded to the mounting surface;
A screwing member that is inserted into and engaged with one member of the shield member or the fixing member, and screwed into the other member;
Electronic equipment having The fixing member has a female screw portion facing the shield member,
The shield member is formed with a hole facing the female screw portion,
The screwing member is a male screw component that is inserted into the hole portion from the side opposite to the circuit board, the head engages with the shield member, and the male screw portion engages with the female screw portion. Item 2. The electronic device according to Item 1. An opening is formed in the circuit board,
The fixing member is adhered to the circuit board so as to cover the opening from the mounting surface side, and a hole smaller than the opening is formed to communicate with the opening.
The shield member is formed with a female screw portion facing the hole portion,
The screwing member is inserted into the opening and the hole from the back side of the mounting surface, the head engages with the fixing member in the opening, and the male screw engages with the female screw. The electronic device according to claim 1, wherein the electronic device is a male screw component. The electronic device according to any one of claims 1 to 3, wherein a gap is formed between the shield member and the fixing member in a facing direction of the shield member and the circuit board. The screw member has conductivity,
The electronic device according to claim 1, wherein the fixing member has conductivity and is bonded to a ground layer of the circuit board with solder. A flexible board laminated on the opposite side of the shield member from the circuit board;
A pressure switch mounted on the flexible substrate;
Have
The electronic device according to claim 1, wherein the switch is disposed at a position overlapping the screwing member in a plan view of the flexible substrate. A battery disposed opposite to the surface of the circuit board opposite to the mounting surface;
The electronic device according to claim 1, wherein the screwing member is disposed at a position overlapping the battery in a plan view of the circuit board.

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