JP2010086978A - Semiconductor manufacturing system - Google Patents

Abstract

The present invention quickly grasps troubles in an apparatus and conveyance.
A semiconductor manufacturing system includes a host computer, a CR layout storage device, a general production information system, a device management system, a transfer control system, a yield control system, a semiconductor manufacturing device, a semiconductor manufacturing device. A device 7n, a LAN 8, a device information acquisition unit 11, a conveyance information acquisition unit 12, a production information acquisition unit 13, a linked display control unit 14, a linked display unit 15, and a conveyance instruction unit 16 are provided. The interlocking display control unit 14, the interlocking display unit 15, and the transfer instruction unit 16 quickly grasp the apparatus and transport troubles in the semiconductor manufacturing automation clean room and display them on the clean room layout screen. After the display, the transport vehicle is designated on the clean room layout screen, and the transfer path of the transport vehicle is changed and the semiconductor manufacturing apparatus of the transfer destination is changed.
[Selection] Figure 1

Description

  The present invention relates to a semiconductor manufacturing system.

  An automated clean room for semiconductor manufacturing (for example, a CR having a wafer size of 300 mm) includes a large number of semiconductor manufacturing apparatuses and a transfer apparatus that transfers wafers in a manufacturing process in which semiconductor integrated circuits are formed. Semiconductor manufacturing automation clean room is a large-scale and various for automating production control of lots with long manufacturing processes, control of semiconductor manufacturing equipment and transport equipment, control of transport of lots between semiconductor manufacturing equipment, etc. It consists of various control system groups and control programs that support them (see, for example, Patent Document 1).

In an automated clean room for semiconductor manufacturing described in Patent Document 1 and the like, production due to device troubles such as semiconductor manufacturing equipment and transfer equipment, a decrease in yield of semiconductor integrated circuits caused by process fluctuations, and drastic switching of manufacturing product groups In the event of a decline in performance, the person in charge of the system sequentially checks and checks the operating dynamics of each system, the operating status of semiconductor manufacturing equipment and transport, and the inventory status of semiconductor manufacturing equipment. For this reason, there is a problem that it takes a lot of time to discover the factor of lowering productivity.
Japanese Patent Laid-Open No. 2007-141019

  The present invention provides a semiconductor manufacturing system capable of quickly grasping an apparatus and a transportation trouble.

  A semiconductor manufacturing system according to an aspect of the present invention is a semiconductor manufacturing system that is used in a semiconductor manufacturing automation clean room, and displays the operating state and stock state of the semiconductor manufacturing apparatus and the operating state of the transport vehicle and the transport device on a clean room layout screen. In the case where trouble occurs in the semiconductor manufacturing apparatus or transport, an interlocking display unit that reflects and displays the trouble state on the clean room layout screen, and transfer of the specified transport vehicle selected by the interlocking display unit A transfer instructing unit for instructing to change a path and instructing to change a semiconductor manufacturing apparatus as a transfer destination.

  Furthermore, in the semiconductor manufacturing system of another aspect of the present invention, the operation information of the semiconductor manufacturing apparatus in the semiconductor manufacturing automation clean room is inputted, the apparatus information acquisition unit for storing the information, the production information of the semiconductor manufacturing automation clean room, and the semiconductor manufacturing The device inventory information is input, the production information acquisition unit for storing the information, the operation information of the transport vehicle and the transfer device are input, the transfer information acquisition unit for storing the information, and the semiconductor manufacturing automation clean room The latest layout information of the semiconductor manufacturing apparatus, the transfer track, the transfer vehicle, and the transfer apparatus is input, the CR layout storage device that stores the updated information, and the operation information of the semiconductor manufacturing apparatus that is output from the apparatus information acquisition unit, The operation information of the transport vehicle and the transport device output from the transport information acquisition unit, and the output from the production information acquisition unit Based on the interlocking display control unit that reflects production information and inventory information on a clean room layout screen, the operating state of the semiconductor manufacturing apparatus, the operating state of the transport vehicle and the transport apparatus, An interlocking display unit that displays a clean room layout screen in which the stock status of the semiconductor manufacturing apparatus is reflected, and an instruction to change the transfer path of the designated transport vehicle selected by the interlocking display unit, and a semiconductor manufacturing apparatus as a transfer destination And a conveyance instruction unit for instructing to change the position.

  ADVANTAGE OF THE INVENTION According to this invention, the semiconductor manufacturing system which can grasp | ascertain the apparatus and the trouble of conveyance rapidly can be provided.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, a semiconductor manufacturing system according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a semiconductor manufacturing system. In this embodiment, an interlock display control unit, an interlock display unit, and a transport instruction unit are provided in order to quickly grasp troubles in the semiconductor manufacturing automation clean room and transport, and to quickly respond to the troubles.

  As shown in FIG. 1, a semiconductor manufacturing system 70 includes a host computer 1, a CR layout storage device 2, an integrated production information system (Manufacturing Execution System) 3, a device management system 4, a transfer control system (Material Control System) 5, Yield Management System 6, Semiconductor Manufacturing Device 7a, Semiconductor Manufacturing Device 7n, LAN 8, Device Information Acquisition Unit 11, Transport Information Acquisition Unit 12, Production Information Acquisition Unit 13, Interlocking Display Control Unit 14, Interlocking Display Unit 15, a transport instruction unit 16 is provided.

  The semiconductor manufacturing system 70 has n semiconductor manufacturing apparatuses and is a system applied to an automatic clean room (for example, CR with a wafer size of 300 mm) for manufacturing semiconductors for memory and logic products. Processing is performed.

  The LAN 8 includes a host computer 1, CR layout storage device 2, integrated production information system 3, device management system 4, transfer control system 5, yield control system 6, semiconductor manufacturing device 7 a, and semiconductor manufacturing device provided in the semiconductor manufacturing system 70. 7n, the apparatus information acquisition unit 11, the conveyance information acquisition unit 12, the production information acquisition unit 13, the interlock display control unit 14, the interlock display unit 15, and the conveyance instruction unit 16 are connected.

  The host computer 1 includes a CR layout storage device 2, an integrated production information system 3, an apparatus management system 4, a transfer control system 5, a yield control system 6, a semiconductor manufacturing apparatus 7a, a semiconductor manufacturing apparatus 7n, provided in the semiconductor manufacturing system 70. The apparatus information acquisition unit 11, the conveyance information acquisition unit 12, the production information acquisition unit 13, the interlocking display control unit 14, the interlocking display unit 15, and the conveyance instruction unit 16 are controlled in an integrated manner, and information to be controlled is transmitted via the LAN 8. Is done. In addition, the host computer 1 receives information output from a device or system that is controlled in an integrated manner via the LAN 8.

  The CR layout storage device 2 includes layout information of semiconductor manufacturing apparatuses 7a to 7n and transport lanes that constitute an automated clean room, layout information of transport apparatuses such as a transport stocker, lifter, and OHB (Over Head Buffer transport shelf), and OHT. (Overhead Hoist Transport) and OHS (Over Head Shuttle) and other vehicle layout information are stored. Here, the transport lane is installed, for example, on the ceiling of a clean room, and automatically transports a transport vehicle carrying a lot or the like. OHT (Overhead Hoist Transport) is used for in-process transport and is an automatic guided vehicle that moves on or just below the track rail. It is an automated guided vehicle that moves underneath.

  The Integrated Production Information System (Manufacturing Execution System) 3 is a system that plays a central role in various information management in an automated clean room. Specifically, production information such as process flow and inventory, and the operating status of semiconductor manufacturing equipment. The target lot and processing recipe are instructed to the semiconductor manufacturing apparatus via the apparatus management system 4, and the target lot is instructed to be transferred via the transfer control system (Material Control System) 5.

  The equipment management system 4 transmits the target lot instruction from the integrated production information system 3 to the semiconductor manufacturing apparatus, the operation status of the semiconductor manufacturing apparatus to the integrated production information system 3, etc. I do.

  The conveyance control system (Material Control System) 5 appropriately transmits various instructions from the general production information system (Manufacturing Execution System) 3 to each conveyance facility, and summarizes the reports from each conveyance facility to produce a comprehensive production information system (Manufacturing Execution System). System) 3, for example, a target lot instructed by a manufacturing execution system 3 is transferred to a target semiconductor manufacturing apparatus. In addition, the conveyance control system (Material Control System) 5 is also called an AMHS integrator (Automated Material Handling System Integrator).

  Yield Management System 6 is the yield information for each lot and wafer of memory and logic products in an automated clean room, yield information for each product and process, process process conditions necessary for yield analysis, Information on the process capability of the semiconductor manufacturing apparatus and information on the process process conditions required for each memory and logic product are provided, and based on these information, yield analysis, yield monitoring, etc. are performed.

  The semiconductor manufacturing apparatus 7a and the semiconductor manufacturing apparatus 7n perform processing of memory and logic product process steps. Semiconductor manufacturing equipment includes batch processing equipment (batch processing equipment) for each lot or a plurality of lots, processing equipment for single wafer processing (single wafer processing equipment), and equipment for simultaneously processing a plurality of process steps ( Multifunctional devices) and the like, which are appropriately used depending on the application.

  The apparatus information acquisition unit 11 acquires information on the operating state of the semiconductor manufacturing apparatus, such as operation, QC, maintenance, trouble, standby, etc., from the integrated manufacturing information system 3 and displays the information as a linked display control unit. 14 to send.

  The conveyance information acquisition unit 12 receives the information on the state of the conveyance vehicles (OHT (Overhead Hoist Transport) and OHS (Over Head Shuttle)) on which the lot is loaded, the position information on the conveyance lane, and the conveyance from the conveyance control system (Material Control System) 5. The operating state of the transfer device such as the stocker, lifter, or OHB is acquired, and the information is transmitted to the interlocking display control unit 14. Also, the conveyance information acquisition unit 12 obtains lot information such as product name and lot ID from the central manufacturing information system (Manufacturing Execution System) 3 based on the ID of the FOUP (Front Opening head Hoist Transport) that the conveyance vehicle is transporting. get.

  The production information acquisition unit 13 acquires the inventory information of the semiconductor manufacturing apparatus from the integrated production information system 3 and transmits the information to the interlocking display control unit 14. In addition, the production information acquisition unit 13 acquires lot information input to the automated clean room from the integrated production information system 3 and transmits the information to the interlocking display control unit 14.

  The interlocking display control unit 14 acquires the operating state of the semiconductor manufacturing apparatus acquired from the apparatus information acquisition unit 11, the operating state of the transfer device such as the transport vehicle, the transfer stocker, and the lifter acquired from the transfer information acquisition unit 12, and the production information acquisition. The inventory information and the lot information acquired from the unit 13 are reflected on the interlocking display unit 15 as a clean room layout image.

  Based on the interlock display control unit 14, the interlocking display unit 15 displays information reflecting the operating state of the semiconductor manufacturing apparatus, the operating state of the transfer apparatus, and the inventory state of the semiconductor manufacturing apparatus on the clean room layout screen. The interlocking display unit 15 selects a transport vehicle on the clean room layout screen, and displays the transport path of the selected transport vehicle. Moreover, the change of the semiconductor manufacturing apparatus of a transfer destination is displayed.

  The transfer instruction unit 16 responds to the change of the transfer route of the transfer vehicle selected by the interlocking display unit 15 and the change of the semiconductor manufacturing apparatus of the transfer destination, and the production control system 3 and the transfer control system (Material Control). System) 5 is instructed to change. The conveyance instructing unit 16 issues a change instruction to the conveyance control system 5 in the case of changing the transfer path. The transfer instruction unit 16 issues a change instruction to the production execution system 3 in the case of changing the semiconductor manufacturing apparatus at the transfer destination. Further, the transfer instruction unit 16 issues a change instruction to the transfer control system (Material Control System) 5 from the integrated production information system (Manufacturing Execution System) 3, and issues a change instruction to the apparatus management system 4.

  Next, the operation of the interlocking display control unit will be described with reference to FIGS. 2 to 6 are flowcharts showing the processing procedure of the interlocking display control unit. 3 to 6 are diagrams for explaining FIG. 2 in more detail.

  As shown in FIG. 2, first, the interlocking display control unit 14 is activated based on a command from the host computer 1 (step S1). Next, clean room layout screen information is acquired from the CR layout storage device 2. After the acquisition, the device information reflection program, the inventory information reflection program, the transport vehicle information reflection program, and the transport device information program are each started (step S2).

  As shown in FIG. 3, in the device information reflection program, first, the device information reflection program is started (step S3). Next, after startup, operation information of the semiconductor manufacturing apparatus is acquired from the apparatus information acquisition unit 11 at regular intervals (step S31). Subsequently, the information is reflected on the clean room layout screen (step S32).

  Here, the operation information acquisition time interval of the semiconductor manufacturing apparatus can be arbitrarily set, and is acquired every few seconds in the normal state. The operation information of the semiconductor manufacturing apparatus is information such as operation, QC, maintenance, failure, and start of construction. The operation information of the semiconductor manufacturing apparatus includes a stopped state (chocolate stop) during processing derived from the alarm information of the semiconductor manufacturing apparatus. The clean room layout screen of the operation information of the semiconductor manufacturing apparatus is easy to discriminate the display for the person in charge of the system, the operator of the clean room, the administrator, etc., and is a display friendly to the work environment. The display can be changed arbitrarily.

  As shown in FIG. 4, in the inventory information reflection program, first, the inventory information reflection program is started (step S4). Next, the inventory information of the semiconductor manufacturing apparatus is acquired from the production information acquisition unit 13 at regular intervals (step S41). Subsequently, the information is reflected on the clean room layout screen (step S42).

  Here, the production information acquisition time interval can be arbitrarily changed, and is acquired every few seconds in the normal state. The reflection on the clean room layout screen is classified and displayed for each predetermined numerical range of the number of stock lots, for example. The classification display can be changed arbitrarily.

  As shown in FIG. 5, in the transport vehicle information reflection program, first, the transport vehicle information reflection program is started (step S5). Next, the transport vehicle information is acquired from the transport information acquisition unit 12 at regular intervals (step S51). Subsequently, the information is reflected on the clean room layout screen (step S52).

  Here, the acquisition time interval of the transport vehicle information can be arbitrarily changed, and is acquired every few seconds in the normal state. The transport vehicle information includes a transport ID, a position on the transport lane of the transport vehicle, a transport state such as taking a FOUP (Front Opening Head Hoist Transport) / transporting a FOUP, a FOUP ID being transported, and the like. The transport vehicle information includes the product name, lot ID, and the like of the lot stored in the FOUP being transported. The transport vehicle information includes information on a semiconductor manufacturing apparatus as a transport destination, a transport path, and the like.

  Reflecting on the clean room layout screen, the transport vehicle is displayed at the position on the transport lane. For example, the display state is determined for the person in charge of the system, the clean room worker, the manager, etc. Easy to operate and friendly to the work environment. The display can be changed arbitrarily. If there are more than the specified number of transport vehicles within the specified distance of the transport lane, the display of the transport lane is changed and displayed. When the time required for the transport vehicle to pass the specified distance of the transport lane exceeds the specified time, the transport lane is changed and displayed.

  As shown in FIG. 6, in the transfer device information reflection program, first, the transfer device information reflection program is activated (step S6). Next, operation information of the conveyance device such as the conveyance stocker, lifter, and OHB is acquired from the conveyance information acquisition unit 12 at regular intervals (step S61). Subsequently, the information is reflected on the clean room layout screen (step S62).

  Here, the setting of the acquisition time interval of the operation information of the transfer device can be arbitrarily changed, and is acquired every few seconds in the normal state. The reflection on the clean room layout screen is classified and displayed for each predetermined numerical range of the number of stock lots, for example. The classification display can be changed arbitrarily. The operation information of the transfer device includes operation, maintenance, failure, and the like. The display of the operation information of the transfer device on the clean room layout screen is easy for the person in charge of the system, the clean room operator, the administrator, etc. to distinguish the display, and is friendly to the work environment. The display can be changed arbitrarily.

  Next, a specific display on the clean room layout screen of the operating state of the semiconductor manufacturing apparatus and the transport vehicle in the semiconductor manufacturing automation clean room will be described with reference to FIGS. FIG. 7 is a diagram showing a screen image after selecting the operating status of the semiconductor manufacturing apparatus, FIG. 8 is a diagram showing a screen image after selecting the inventory status of the semiconductor manufacturing apparatus, and FIG. 9 is a diagram showing the status of the semiconductor manufacturing apparatus with a large inventory. 10 is a diagram showing a screen image in the conveyance instruction mode, and FIG. 11 is a diagram showing a screen image after the change of the conveyance path and the conveyance destination device.

  At the top of the clean room layout screen, an apparatus display selection panel 21, a transport vehicle display selection panel 24, and a transport instruction panel 27 are provided. The device display selection panel 21 is provided with a display button 22 for displaying an operating state and a display button 23 for displaying an inventory state. The transport vehicle display selection panel 24 is provided with a display button 25 for displaying a transport state and a display button 26 for displaying lot information. The transport instruction panel 27 is provided with a display button 28 for displaying a path change. In the center of the clean room layout screen, a semiconductor manufacturing apparatus, a transport track 30, and a transport vehicle 31 are displayed.

  As shown in FIG. 7, when the display button 22 of the device display selection panel 21 is selected, the operating status of the semiconductor manufacturing apparatus is, for example, in operation (semiconductor device 32a), standby (semiconductor device 32b), or failure (semiconductor device). 32c) and maintenance (semiconductor device 32d). The semiconductor manufacturing apparatus immediately after the failure occurs is indicated by (x) in the drawing in order to clarify which semiconductor device and which transport track portion.

  As shown in FIG. 8, when the display button 23 of the device display selection panel 21 is selected, the stock status of the semiconductor manufacturing device is, for example, 0 (zero) lot, 1 to 5 lot, 6 to 10 lot, 11 to 50 lot, 51 lot. Are classified and displayed. In addition, in the upper part of the clean room layout screen, the memory and logic product input lot status input to the semiconductor manufacturing automation clean room, for example, the CR remaining lot number, the processing lot number, and the waiting lot number are displayed. In this screen, the display of the device display selection panel 21, the transport vehicle display selection panel 24, and the transport instruction panel 27 is omitted.

As shown in FIG. 9, for example, in a semiconductor manufacturing apparatus with a large number of stocks, detailed information on the stock can be obtained by selecting the semiconductor manufacturing apparatus (for example, touch-selecting the display portion). Specifically, as shown in FIG. 9 (a), in the multi-chamber multifunction device (I) in which the stock quantity is displayed as 11 to 50 Lots, for example, the stock quantity is 40 Lots, the metal sputtering A condition is 5 Lots, The metal sputter B condition is 10 Lot, the metal sputter C condition is 8 Lot, the RIE Etching D condition is 9 Lot, and the RIE Etching E condition is 8 Lot in detail, so that it is easy to determine which condition is in stock. As shown in FIG. 9B, in the multi-chamber multi-function device (II) in which the stock quantity is displayed as 51 lots or more, for example, the stock quantity is 60 lots, the film formation (SiN film) condition is 25 lots, and the film formation ( The SiO ₂ film) condition is displayed in detail as 18 Lots, and the film formation (PolySi film) condition is displayed as 27 Lots, so that it is easy to determine which condition is in stock.

  Although not shown, when the display button 25 on the transport vehicle display selection panel 24 is selected, the operation status (operating, standby, failure, maintenance, etc.) of the transport vehicle 31 on the transport track 30 on the clean room layout screen is classified. Is displayed. The operating status (operating, standby, failure, maintenance, etc.) of the transfer device is displayed in a classified manner. When the display button 26 on the transport vehicle display selection panel 24 is selected, the types of lots stored in the FOUP transferred to the transport vehicle 31 are classified and displayed. System personnel, cleanroom workers, managers, etc. display the operating status of semiconductor manufacturing equipment, the status of semiconductor manufacturing equipment inventory, the operating status of transport vehicles and transport equipment, and the type of lots stored in FOUP. For example, a classification display may be made using a plurality of colors or a plurality of patterns.

  As shown in FIG. 10, for example, when a failure occurs in a semiconductor manufacturing apparatus, and a stock is increased due to a stay in a lot such as a memory or logic product, the display button 28 on the transfer instruction panel 27 is selected and the transfer is performed. Car path changes and transfer destination semiconductor manufacturing equipment changes. Specifically, first, a transport vehicle in a lot transport on the clean room layout screen selected by the display button 28 (a transport vehicle corresponding to a semiconductor manufacturing apparatus in which a failure has occurred) is selected. Next, a semiconductor manufacturing apparatus that is on standby or has a small number of stocks and that can be replaced is selected from the process information of the lot mounted on the selected transport vehicle. Subsequently, the transfer path (transfer path from the right to the lower left in the drawing) of the transfer vehicle that connects the current position of the selected transfer vehicle and the selected semiconductor manufacturing apparatus is selectively displayed.

  As shown in FIG. 11, for example, when a sudden review of a production plan of a semiconductor manufacturing automation clean room or a production review of a specific lot (e.g. promotion to an express lot) occurs, first, on the clean room layout screen, for example, By using a mouse click operation, a semiconductor manufacturing apparatus different from the semiconductor manufacturing apparatus shown in FIG. 10 that is on standby or has a small number of stocks and can be replaced is selected from the process information of the lot mounted on the selected transport vehicle. The Next, the transfer path (transfer path from right to upper left in the drawing) of the transfer vehicle connecting the current position of the selected transfer vehicle and the selected semiconductor manufacturing apparatus is selected and displayed.

  As described above, in the semiconductor manufacturing system of this embodiment, the host computer 1, the CR layout storage device 2, the integrated production information system 3, the device management system 4, the transfer control system 5, the yield control system 6, and the semiconductor manufacturing device 7a. The semiconductor manufacturing apparatus 7n, the LAN 8, the apparatus information acquisition unit 11, the conveyance information acquisition unit 12, the production information acquisition unit 13, the interlock display control unit 14, the interlock display unit 15, and the conveyance instruction unit 16 are provided. The interlocking display control unit 14 reflects the operating state of the semiconductor manufacturing apparatus, the operating state of the transporting device such as the transport vehicle, the transport stocker, and the lifter, and the inventory information and the lot information on the interlocking display unit 15. The interlocking display unit 15 displays information reflecting the operating state of the semiconductor manufacturing apparatus, the operating state of the transfer apparatus, and the inventory state of the semiconductor manufacturing apparatus on the clean room layout screen. The interlocking display unit 15 selects a transport vehicle on the clean room layout screen, and displays the transfer route of the selected transport vehicle. The interlocking display unit 15 displays a change of the semiconductor manufacturing apparatus as the transfer destination. The conveyance instructing unit 16 issues an instruction to change the transfer path of the conveyance vehicle instructed by the interlocking display unit 15 and an instruction to change the semiconductor manufacturing apparatus as the transfer destination.

  For this reason, the trouble of a semiconductor manufacturing apparatus and conveyance can be grasped | ascertained easily, and retention of a lot can be suppressed to the minimum. In addition, by selecting a transport vehicle on the clean room layout screen, it is possible to easily change the transport path of the transport vehicle and the semiconductor manufacturing apparatus of the transport destination, and greatly reduce trouble avoidance time. Therefore, the overall equipment efficiency (OEE) and production efficiency can be significantly improved as compared with the prior art.

  The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the invention.

  For example, in the embodiment, the present invention is applied to semiconductor manufacturing (pre-process and post-process), but may be applied to liquid crystal manufacturing. Further, although RGV (Rail Guided Vehicle) such as OHS and OHT moving on the transport track is used, AVG (Automatic Guided Vehicle) moving on trackless may be used.

The present invention can be configured as described in the following supplementary notes.
(Appendix 1) A semiconductor manufacturing system used in a semiconductor manufacturing automation clean room, wherein the operating state and stock state of the semiconductor manufacturing apparatus and the operating state of the transport vehicle and the transport apparatus are displayed on a clean room layout screen. Alternatively, when a transport trouble occurs, the trouble display is reflected on the clean room layout screen, and the interlock display section for switching and displaying the state of the transport vehicle and the lot information being transported is selected by the interlock display section. A semiconductor manufacturing system comprising: a transfer instruction unit that issues an instruction to change a transfer path of a designated transport vehicle and issues an instruction to change a semiconductor manufacturing apparatus as a transfer destination.

(Additional remark 2) The said interlocking | linkage display part is a semiconductor manufacturing system of Additional remark 1 which selects a conveyance vehicle and changes the semiconductor manufacturing apparatus of a conveyance destination.

(Additional remark 3) The said interlocking | linkage display part is a semiconductor manufacturing system of Additional remark 1 which selects a conveyance vehicle and changes a conveyance path.

1 is a block diagram showing a semiconductor manufacturing system according to Embodiment 1 of the present invention. The flowchart which shows the process sequence of the interlocking display control part which concerns on Example 1 of this invention. The flowchart which shows the process sequence of the interlocking display control part which concerns on Example 1 of this invention. The flowchart which shows the process sequence of the interlocking display control part which concerns on Example 1 of this invention. The flowchart which shows the process sequence of the interlocking display control part which concerns on Example 1 of this invention. The flowchart which shows the process sequence of the interlocking display control part which concerns on Example 1 of this invention. The figure which shows the screen image after the operating condition selection of the semiconductor manufacturing apparatus which concerns on Example 1 of this invention. The figure which shows the screen image after the stock condition selection of the semiconductor manufacturing apparatus which concerns on Example 1 of this invention. The figure which shows the condition of the semiconductor manufacturing apparatus with much stock which concerns on Example 1 of this invention. FIG. 5 is a diagram illustrating a screen image in a conveyance instruction mode according to the first embodiment of the present invention. The figure which shows the screen image after the change of the conveyance path and conveyance destination apparatus which concern on Example 1 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Host computer 2 CR layout memory | storage device 3 General production information system 4 Device management system 5 Transfer control system 6 Yield control system 7a, 7n Semiconductor manufacturing apparatus 8 LAN
DESCRIPTION OF SYMBOLS 11 Apparatus information acquisition part 12 Conveyance information acquisition part 13 Production information acquisition part 14 Interlocking display control part 15 Interlocking display part 16 Conveyance instruction | indication part 21 Device display selection panel 22,23,25,26,28 Display button 24 Conveyance vehicle display selection panel 27 Transport instruction panel 29 Transport device 30 Transport track 31 Transport vehicles 32a to 32d Semiconductor manufacturing device

Claims (5)

A semiconductor manufacturing system used in a semiconductor manufacturing automation clean room, wherein the operating state and inventory state of the semiconductor manufacturing apparatus and the operating state of the transport vehicle and the transport apparatus are displayed on the clean room layout screen,
When a trouble occurs in the semiconductor manufacturing apparatus or conveyance, an interlocking display unit that reflects and displays the trouble state on the clean room layout screen;
A transfer instruction unit that is selected by the interlocking display unit and performs a change instruction of a transfer path of a designated transport vehicle, and a change instruction of a transfer destination semiconductor manufacturing apparatus; and
A semiconductor manufacturing system comprising: Operation information of semiconductor manufacturing equipment in a semiconductor manufacturing automation clean room is input, and an apparatus information acquisition unit for storing the information,
Production information of the semiconductor manufacturing automation clean room and inventory information of the semiconductor manufacturing apparatus are input, a production information acquisition unit for storing the information,
Operation information of the transport vehicle and the transport device is input, and a transport information acquisition unit that stores the information,
A CR layout storage device for storing the latest arrangement information of the semiconductor manufacturing apparatus, the transfer track, the transfer vehicle, and the transfer apparatus that constitute the semiconductor manufacturing automation clean room, and storing updated information;
Operation information of the semiconductor manufacturing apparatus output from the apparatus information acquisition unit, operation information of the transport vehicle and transfer apparatus output from the transfer information acquisition unit, and production information and inventory information output from the production information acquisition unit And an interlocking display control unit that reflects on the clean room layout screen,
Based on the interlock display control unit, an interlock display that displays a clean room layout screen that reflects the operating state of the semiconductor manufacturing apparatus, the operating states of the transport vehicle and the transport apparatus, and the inventory state of the semiconductor manufacturing apparatus. And
A transfer instruction unit that is selected by the interlocking display unit and performs a change instruction of a transfer path of a designated transport vehicle, and a change instruction of a transfer destination semiconductor manufacturing apparatus; and
A semiconductor manufacturing system comprising:   The semiconductor manufacturing system according to claim 1, wherein the interlocking display unit switches and displays an operating state and an inventory state of the semiconductor manufacturing apparatus on a clean room layout screen.   The semiconductor manufacturing system according to claim 1, wherein the interlocking display unit displays in detail the stock contents of the selected semiconductor manufacturing apparatus.   3. The semiconductor manufacturing system according to claim 1, wherein the interlock display unit selects a transport vehicle and displays a transport path of the selected transport vehicle.

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