JP2010197750A - Exposure device, exposure method, and method for manufacturing display panel substrate - Google Patents

Abstract

When scanning a substrate with a light beam by moving a chuck on which a substrate is mounted by a stage, a reduction in drawing quality due to a stage running error is prevented.
A substrate coated with a photoresist is mounted on a chuck, and the substrate is scanned by a light beam from a light beam irradiation device while moving the chuck by an X stage. Draw a pattern. A Y stage 7 for moving the light beam irradiation device 20 in a direction orthogonal to the scanning direction is provided, and the X stage 5 moves the chuck 10 in the scanning direction, while orthogonal to the scanning direction of the substrate 1 mounted on the chuck 10. The direction displacement is detected, and based on the detection result, the Y stage 7 moves the light beam irradiation device 10 in a direction orthogonal to the scanning direction in accordance with the displacement of the substrate 1. Even if a running error such as rolling or yawing occurs on the X stage 5, the pattern is drawn with high accuracy.
[Selection] Figure 1

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a manufacturing method of a display panel substrate using them, and in particular, an exposure apparatus that scans a substrate with a light beam by moving a chuck on which the substrate is mounted by a stage, an exposure method, and a display using them. The present invention relates to a method for manufacturing a panel substrate for an automobile.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  The scanning of the substrate by the light beam is performed by relatively moving the substrate and the light beam, but the light beam irradiation device including a precise optical system is fixed and the chuck on which the substrate is mounted is moved by the stage. It is common. At that time, if a travel error such as rolling or yawing occurs on the stage and the movement path of the substrate mounted on the chuck is shifted, the pattern drawn by the light beam from the light beam irradiation device is shifted. There is a problem that drawing is not performed accurately and drawing quality is deteriorated.

  An object of the present invention is to prevent a reduction in drawing quality due to a running error of a stage when a chuck carrying a substrate is moved by a stage and the substrate is scanned by a light beam. Another object of the present invention is to manufacture a high-quality display panel substrate.

  The exposure apparatus of the present invention includes a chuck for mounting a substrate coated with a photoresist, a first stage for moving the chuck, and a light beam irradiation device for irradiating a light beam to the substrate mounted on the chuck, An exposure apparatus that scans a substrate with a light beam from a light beam irradiation apparatus and draws a pattern on the substrate while moving the chuck by a first stage, and moves the light beam irradiation apparatus in a direction orthogonal to the scanning direction. The detection result of the detection means while moving the chuck in the scanning direction by the second stage that moves, the detection means for detecting the displacement in the direction orthogonal to the scanning direction of the substrate mounted on the chuck, and the first stage. And a control means for moving the light beam irradiation device in a direction perpendicular to the scanning direction in accordance with the displacement of the substrate by the second stage. .

  In the exposure method of the present invention, a substrate coated with a photoresist is mounted on a chuck, and the substrate is scanned with a light beam from a light beam irradiation apparatus while the chuck is moved by a first stage. An exposure method for drawing a pattern, in which a second stage for moving a light beam irradiation device in a direction orthogonal to the scanning direction is provided, and the chuck is mounted on the chuck while moving the chuck in the scanning direction by the first stage. A displacement in a direction perpendicular to the scanning direction of the substrate is detected, and based on the detection result, the light beam irradiation device is moved in a direction perpendicular to the scanning direction by the second stage in accordance with the displacement of the substrate.

  A second stage for moving the light beam irradiation device in a direction perpendicular to the scanning direction is provided, and the first stage moves the chuck in the scanning direction while moving the chuck in the direction perpendicular to the scanning direction of the substrate mounted on the chuck. Since the displacement is detected and the light beam irradiation device is moved in the direction orthogonal to the scanning direction in accordance with the displacement of the substrate by the second stage based on the detection result, the first stage that moves the chuck on which the substrate is mounted Even if a running error such as rolling or yawing occurs, the pattern is drawn with high accuracy.

  Furthermore, in the exposure apparatus of the present invention, the detection means is provided above the chuck that is moved in the scanning direction by the first stage, acquires an image of the detection mark provided in the scanning direction of the substrate, and receives an image signal. And a detection circuit that processes the image signal output from the image acquisition device and detects displacement in a direction orthogonal to the scanning direction of the substrate. The exposure method of the present invention acquires an image of a detection mark provided in the scanning direction of the substrate by an image acquisition device provided above the chuck moved in the scanning direction by the first stage, and the image acquisition device. Is used to detect the displacement in the direction orthogonal to the scanning direction of the substrate. A displacement in a direction orthogonal to the scanning direction of the substrate is accurately detected by image processing using the detection marks provided in the scanning direction of the substrate.

  Further, in the exposure apparatus of the present invention, the control means moves the light beam irradiation apparatus in a direction orthogonal to the scanning direction by the second stage, and changes the scanning area by the light beam from the light beam irradiation apparatus. It is. In the exposure method of the present invention, the light beam irradiation device is moved in the direction orthogonal to the scanning direction by the second stage to change the scanning region by the light beam from the light beam irradiation device. In order to scan the entire substrate, it is not necessary for the first stage to move the chuck on which the substrate is mounted in a direction orthogonal to the scanning direction, and the dimension in the direction orthogonal to the scanning direction of the exposure apparatus is reduced.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, pattern drawing is performed with high accuracy, and thus a high-quality display panel substrate is manufactured.

  According to the exposure apparatus and the exposure method of the present invention, the second stage for moving the light beam irradiation apparatus in the direction orthogonal to the scanning direction is provided, and the chuck is moved by the first stage while moving the chuck in the scanning direction. By detecting the displacement of the mounted substrate in the direction orthogonal to the scanning direction and moving the light beam irradiation device in the direction orthogonal to the scanning direction according to the displacement of the substrate by the second stage based on the detection result Even if a running error such as rolling or yawing occurs on the first stage that moves the chuck on which the substrate is mounted, the pattern can be drawn with high accuracy. Therefore, when the chuck on which the substrate is mounted is moved by the stage and the substrate is scanned by the light beam, it is possible to prevent the drawing quality from being deteriorated due to the stage running error.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the image of the detection mark provided in the substrate scanning direction is acquired by the image acquisition device provided above the chuck moved in the scanning direction by the first stage. Then, the image signal output from the image acquisition device is processed to detect displacement in the direction orthogonal to the substrate scanning direction, and the image processing is performed using the detection marks provided in the substrate scanning direction. The displacement in the direction orthogonal to the scanning direction can be accurately detected.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the scanning region by the light beam from the light beam irradiation apparatus is changed by moving the light beam irradiation apparatus in the direction orthogonal to the scanning direction by the second stage. Thus, in order to scan the entire substrate, it is not necessary for the first stage to move the chuck on which the substrate is mounted in a direction orthogonal to the scanning direction, and the dimension of the exposure apparatus in the direction orthogonal to the scanning direction is reduced. be able to.

  According to the method for manufacturing a display panel substrate of the present invention, a pattern can be drawn with high accuracy, and thus a high-quality display panel substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a top view of the chuck | zipper which mounts a board | substrate. It is a side view of a chuck | zipper and a light beam irradiation apparatus. It is a front view of a chuck | zipper and a light beam irradiation apparatus. It is a figure which shows schematic structure of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation apparatus 20, a linear scale 31, an encoder 32, and a laser measurement system. The laser length measuring system control device 40, the CCD camera 50, the substrate displacement detection circuit 51, the stage drive circuits 60 and 61, and the main control device 70 are configured. 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the substrate displacement detection circuit 51, the stage drive circuits 60 and 61, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and seven or less or nine or more light beams are used. An irradiation device may be used.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and the X stage 5 is provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The θ stage 8 is mounted on the X stage 5 and rotates in the θ direction. The X stage 5 and the θ stage 8 are provided with a drive mechanism such as a ball screw (not shown), and each drive mechanism is driven by the stage drive circuit 60 of FIG. On the other hand, each light beam irradiation device 20 is mounted on the Y stage 7. The Y stage 7 is mounted on a Y guide 6 provided in the gate 11 and moves in the Y direction along the Y guide 6. The Y stage 7 is provided with a drive mechanism such as a ball screw (not shown), and the drive mechanism is driven by the stage drive circuit 61 of FIG.

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction and move the X stage 5 in the X direction. The main controller 70 also controls the stage drive circuit 61 to move the Y stage 7 in the Y direction.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. 1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32 and detects the amount of movement of X stage 5 in the X direction.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the substrate displacement detection circuit 51 shown in FIG. 1 is omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 in the Y direction. The bar mirror 45 is attached to one side surface of the Y stage 7 in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 to the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation in the X direction of the chuck 10 moved by the X stage 5 from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser light source 41 and the laser reflected by the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the Y stage 7 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  FIG. 6 is a top view of the chuck on which the substrate is mounted. 7 is a side view of the chuck and the light beam irradiation apparatus, and FIG. 8 is a front view of the chuck and the light beam irradiation apparatus. As shown in FIG. 6, substrate displacement detection marks 12 extending in the scanning direction (X direction) of the substrate 1 by the light beam from the light beam irradiation device 20 are provided at the corners of the surface of the substrate 1 mounted on the chuck 10. Is formed. As shown in FIGS. 7 and 8, a CCD camera 50 that acquires an image of the substrate displacement detection mark 12 of the substrate 1 is attached to the gate 11.

  The operation of the exposure apparatus according to this embodiment will be described below. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 to the exposure position by the X stage 5. When scanning the substrate 1 with the light beam from the light beam irradiation device 20 at the exposure position, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. . At that time, when a running error such as rolling or yawing occurs in the X stage 5, the substrate 1 mounted on the chuck 10 is displaced in the Y direction while moving in the X direction.

  7 and 8, the CCD camera 50 provided on the gate 11 acquires an image of the substrate displacement detection mark 12 provided on the substrate 1 and outputs an image signal to the substrate displacement detection circuit 51 of FIG. . In FIG. 1, the substrate displacement detection circuit 51 processes the image signal of the CCD camera 50 and compares the detected image of the substrate displacement detection mark 12 with the image of the substrate displacement detection mark at the correct position prepared in advance. The displacement of the substrate 1 in the Y direction is detected. The main controller 70 controls the stage driving circuit 61 based on the displacement in the Y direction of the substrate 1 detected by the substrate displacement detection circuit 51, and adjusts the light beam irradiation device 20 to the displacement of the substrate 1 by the Y stage 7. To move in the Y direction.

  A Y stage 7 for moving the light beam irradiation device 20 in a direction orthogonal to the scanning direction is provided, and the X stage 5 moves the chuck 10 in the scanning direction, while orthogonal to the scanning direction of the substrate 1 mounted on the chuck 10. The displacement in the direction is detected, and the light beam irradiation device 20 is moved in the direction perpendicular to the scanning direction in accordance with the displacement of the substrate 1 by the Y stage 7 based on the detection result, so that the chuck 10 on which the substrate 1 is mounted is moved. Even if a running error such as rolling or yawing occurs in the X stage 5 to be drawn, the pattern is drawn with high accuracy.

  Further, an image of the substrate displacement detection mark 12 provided in the scanning direction of the substrate 1 is acquired by the CCD camera 50 provided above the chuck 10 that is moved in the scanning direction by the X stage 5, and the CCD camera 50 outputs it. Since the image signal is processed to detect the displacement in the direction orthogonal to the scanning direction of the substrate 1, the substrate displacement detection mark 12 provided in the scanning direction of the substrate 1 is used to perform the scanning direction of the substrate 1 by image processing. The displacement in the direction orthogonal to is accurately detected.

  When moving the scanning region of the substrate 1, the main control device 70 controls the stage driving circuit 61 to move each light beam irradiation device 20 in the Y direction by the Y stage 7. The Y-stage 7 moves the light beam irradiation device 20 in the direction orthogonal to the scanning direction to change the scanning region by the light beam from the light beam irradiation device 20, so that the entire substrate 1 is scanned by X It is not necessary for the stage 5 to move the chuck 10 on which the substrate 1 is mounted in a direction orthogonal to the scanning direction, and the dimension in the direction orthogonal to the scanning direction of the exposure apparatus is reduced.

  In FIG. 1, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 9 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes a memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, and a coordinate determination unit 75. The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X direction before the exposure of the substrate 1 at the exposure position and the position of the Y stage 7 on which the light beam irradiation device 20 is mounted in the Y direction. The center point coordinate determination unit 74 determines the X coordinate of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the X direction of the chuck 10 detected by the laser measurement system control device 40. The center point coordinate determination unit 74 counts the pulse signals from the encoder 32, detects the amount of movement of the X stage 5 in the X direction, and determines the X coordinate of the center point of the chuck 10. Further, the center point coordinate determination unit 74 determines the Y coordinate of the center point of the Y stage 7 from the position in the Y direction of the Y stage 7 detected by the laser length measurement system control device 40.

  Based on the X coordinate of the center point of the chuck 10 and the Y coordinate of the center point of the Y stage 7 determined by the center point coordinate determination unit 74, the coordinate determination unit 75 supplies the DMD drive circuit 27 of each light beam irradiation apparatus 20. XY coordinates of drawing data to be determined are determined. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  10 to 13 are diagrams for explaining scanning of the substrate by the light beam. 10 to 13 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with eight light beams from the eight light beam irradiation devices 20. 10-13, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 10 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 10 by the first scan in the X direction. When the first scan is completed, the head unit 20a of the light beam irradiation apparatus 20 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 11 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 11 by the second scan in the X direction. When the second scan is completed, the head unit 20a of the light beam irradiation apparatus 20 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 12 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 12 by the third scan in the X direction. When the third scan is completed, the head unit 20a of the light beam irradiation apparatus 20 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 13 shows the fourth scan. By the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 13, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  10 to 13 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the Y stage 7 for moving the light beam irradiation device 20 in the direction orthogonal to the scanning direction is provided, and the chuck 10 is mounted on the chuck 10 while being moved in the scanning direction by the X stage 5. The displacement in the direction perpendicular to the scanning direction of the substrate 1 is detected, and based on the detection result, the Y-stage 7 moves the light beam irradiation device 20 in the direction perpendicular to the scanning direction in accordance with the displacement of the substrate 1. Thus, even if a running error such as rolling or yawing occurs on the X stage 5 that moves the chuck 10 on which the substrate 1 is mounted, the pattern can be drawn with high accuracy. Therefore, when the chuck on which the substrate is mounted is moved by the stage and the substrate is scanned by the light beam, it is possible to prevent the drawing quality from being deteriorated due to the stage running error.

  Furthermore, according to the embodiment described above, the image of the substrate displacement detection mark 12 provided in the scanning direction of the substrate 1 by the CCD camera 50 provided above the chuck 10 moved in the scanning direction by the X stage 5. Is obtained, the image signal output from the CCD camera 50 is processed, and the displacement in the direction orthogonal to the scanning direction of the substrate 1 is detected, whereby the substrate displacement detection mark 12 provided in the scanning direction of the substrate 1 is used. Thus, displacement in a direction orthogonal to the scanning direction of the substrate 1 can be detected with high accuracy by image processing.

  Furthermore, according to the embodiment described above, the light beam irradiation device 20 is moved in the direction orthogonal to the scanning direction by the Y stage 7 to change the scanning region by the light beam from the light beam irradiation device 20. Therefore, in order to scan the entire substrate 1, it is not necessary for the X stage 5 to move the chuck 10 on which the substrate 1 is mounted in a direction orthogonal to the scanning direction, and the dimension in the direction orthogonal to the scanning direction of the exposure apparatus is reduced. can do.

  By exposing the substrate using the exposure apparatus or the exposure method of the present invention, the pattern can be drawn with high accuracy, so that a high-quality display panel substrate can be manufactured.

  For example, FIG. 14 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 15 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a printing method or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 14, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 15, in the exposure process of the colored pattern forming process (step 202), the exposure of the present invention. An apparatus or an exposure method can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 12 Substrate displacement detection mark 20 Light beam irradiation apparatus 20a Head part 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD ( Digital Micromirror Device)
26 Projection Lens 27 DMD Drive Circuit 31 Linear Scale 32 Encoder 40 Laser Measuring System Control Device 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror 50 CCD Camera 51 Substrate Displacement Detection Circuit 60, 61 Stage Drive Circuit 70 Main Control Device 71 Drawing Control Unit 72 Memory 73 Bandwidth Setting Unit 74 Center Point Coordinate Determination Unit 75 Coordinate Determination Unit

Claims (8)

A chuck for mounting a substrate coated with a photoresist;
A first stage for moving the chuck;
A light beam irradiation device for irradiating the substrate mounted on the chuck with a light beam,
An exposure apparatus that draws a pattern on a substrate by scanning the substrate with a light beam from the light beam irradiation apparatus while moving the chuck by the first stage,
A second stage for moving the light beam irradiation device in a direction perpendicular to the scanning direction;
Detecting means for detecting displacement in a direction perpendicular to the scanning direction of the substrate mounted on the chuck;
While moving the chuck in the scanning direction by the first stage, based on the detection result of the detection means, the second stage causes the light beam irradiation device to be orthogonal to the scanning direction in accordance with the displacement of the substrate. An exposure apparatus comprising a control means for moving in a direction. The detection means includes
An image acquisition device that is provided above the chuck that is moved in the scanning direction by the first stage, acquires an image of a detection mark provided in the scanning direction of the substrate, and outputs an image signal;
The exposure apparatus according to claim 1, further comprising: a detection circuit that processes an image signal output from the image acquisition apparatus and detects a displacement in a direction orthogonal to a scanning direction of the substrate.   The control means moves the light beam irradiation device in a direction orthogonal to a scanning direction by the second stage to change a scanning region by the light beam from the light beam irradiation device. The exposure apparatus according to claim 1 or 2. An exposure method in which a substrate coated with a photoresist is mounted on a chuck, the substrate is scanned by a light beam from a light beam irradiation apparatus while a chuck is moved by a first stage, and a pattern is drawn on the substrate. ,
A second stage for moving the light beam irradiation device in a direction perpendicular to the scanning direction;
While moving the chuck in the scanning direction by the first stage, the displacement in the direction orthogonal to the scanning direction of the substrate mounted on the chuck is detected, and the light beam irradiation device is moved by the second stage based on the detection result. An exposure method characterized by moving in a direction orthogonal to the scanning direction in accordance with the displacement of the substrate. The image acquisition device provided above the chuck moved in the scanning direction by the first stage acquires an image of the detection mark provided in the substrate scanning direction,
5. The exposure method according to claim 4, wherein the image signal output from the image acquisition device is processed to detect displacement in a direction orthogonal to the scanning direction of the substrate.   6. The scanning region by the light beam from the light beam irradiation device is changed by moving the light beam irradiation device in a direction orthogonal to the scanning direction by the second stage. Exposure method.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure method according to any one of claims 4 to 6.

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