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JP2010198828A - Lighting device - Google Patents

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JP2010198828A
JP2010198828A JP2009040646A JP2009040646A JP2010198828A JP 2010198828 A JP2010198828 A JP 2010198828A JP 2009040646 A JP2009040646 A JP 2009040646A JP 2009040646 A JP2009040646 A JP 2009040646A JP 2010198828 A JP2010198828 A JP 2010198828A
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printed circuit
heat
circuit board
heat radiating
cylindrical case
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Katsuhiko Fujiwara
勝彦 藤原
Tomohide Maruoka
智秀 丸岡
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Shihen Technical Corp
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Shihen Technical Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of efficiently reducing increase in temperature of LEDs when it is on, in spite of having the LEDs arranged in a sealed space within the device. <P>SOLUTION: The lighting device 100 includes: a printed circuit board 14; light-emitting means 14C mounted on the printed circuit board 14; a heat dissipating member 123 for dissipating heat emitted from the light-emitting means 14c; and a translucent cylindrical case 10 for arranging the printed circuit board 14c, the light-emitting means 14c and the light-emitting member 123 therein. The light dissipating member 123 is cylindrical and has a flat portion 11g on its outer side surface, and the circuit board 14 is connected to the flat portion 11g. The cylindrical case 10 and the heat dissipating member 123 together form a sealed space within the cylindrical case 10, and the inside of the heat dissipating member 123 and the ambient air are made to communicate with each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、発光手段であるLEDが実装されたプリント回路基板と、このLEDから発する熱を放熱させるための放熱部材等を備えた照明装置に関する。   The present invention relates to a lighting device including a printed circuit board on which an LED as a light emitting means is mounted, and a heat radiating member for radiating heat generated from the LED.

従来、例えば工作機械の内部を照明する照明装置として、蛍光灯(直管)が用いられてきた。蛍光灯は、工作機械による金属加工時に飛散する金属くずや潤滑油などにより劣化や破損しやすいため、金属くずや潤滑油から蛍光灯を守るために強化ガラスで防護する必要があった。
しかし、強化ガラスは複雑な形状に加工するのは難しいため、円筒状に加工して用いるのが一般的だった。また、円筒状であれば比較的容易に防水性を持たることができ、また広範囲を照明できるという利点もあるため、このような理由からも円筒管が一般的に用いられていた。
そして、環境問題に対する配慮から、蛍光灯の代わりにCO2排出量の少ないLEDを利用した照明装置が用いられる事が多くなった。LED光は指向性であるので、LEDをプリント回路基板に実装して照明に用いた事でプリント回路基板背面への照明がなくなり、円筒管を用いることが少なくなった。
また、LEDの発する熱を放熱するためにプリント回路基板背面に放熱構造を付加する必要があったため、LEDを用いた照明装置は箱型のものが一般的となった。
しかし、蛍光灯をLEDに置き換える場合、蛍光灯と同じ形状、同じ照明範囲を持つ照明装置が望まれていたため、強化ガラス製の円筒管を用いたLED照明装置がみられるようになった(例えば、特許文献1)。
Conventionally, for example, a fluorescent lamp (straight tube) has been used as an illumination device for illuminating the inside of a machine tool. Fluorescent lamps are prone to deterioration or breakage due to metal scraps or lubricating oil scattered during metal processing by machine tools, so it was necessary to protect them with tempered glass to protect the fluorescent lamps from metal scraps and lubricating oil.
However, since it is difficult to process tempered glass into a complicated shape, it was generally processed into a cylindrical shape. In addition, a cylindrical tube is generally used because of its advantages that it can be waterproofed relatively easily and can illuminate a wide area if it is cylindrical.
And in consideration of environmental problems, an illuminating device using an LED with a small amount of CO2 emission is often used instead of a fluorescent lamp. Since the LED light is directional, since the LED is mounted on a printed circuit board and used for illumination, illumination on the back surface of the printed circuit board is eliminated, and the use of a cylindrical tube is reduced.
Further, since it is necessary to add a heat dissipation structure to the back surface of the printed circuit board in order to dissipate heat generated by the LED, a box-type lighting device using an LED has become common.
However, when replacing a fluorescent lamp with an LED, an illuminating apparatus having the same shape and the same illumination range as a fluorescent lamp has been desired, so that an LED illuminating apparatus using a tempered glass cylindrical tube has been seen (for example, Patent Document 1).

上記特許文献1の照明装置は、両端が開口した円筒部を有し、この両端開口は位置決めスリーブにて閉塞されている。この円筒部の内部は密閉された空間となっており、この円筒部の密閉空間に半割した筒状の取り付け基底部が配置されている。この取り付け基底部内部にはその開口面に沿って長方形状の放熱プレートが設けられており、この放熱プレートの両側縁部は取り付け基底部の内壁面に支持されている。そして、放熱プレートの上面にプリント回路基板が接合されており、このプリント回路基板にはLEDが実装されている。取り付け基底部の周壁と放熱プレートとにより放熱空間が形成されている。   The illuminating device of Patent Document 1 has a cylindrical portion that is open at both ends, and the opening at both ends is closed by a positioning sleeve. The inside of the cylindrical portion is a sealed space, and a cylindrical mounting base portion that is divided in half into the sealed space of the cylindrical portion is disposed. A rectangular heat radiating plate is provided along the opening surface inside the mounting base, and both side edges of the heat radiating plate are supported by the inner wall surface of the mounting base. A printed circuit board is bonded to the upper surface of the heat radiating plate, and an LED is mounted on the printed circuit board. A heat radiating space is formed by the peripheral wall of the mounting base and the heat radiating plate.

LEDを点灯すると、LEDで発生した熱が放熱プレートを介して放熱空間へ放熱され、これによりLEDを冷却するようになっている。   When the LED is turned on, the heat generated in the LED is radiated to the heat radiating space through the heat radiating plate, thereby cooling the LED.

実用新案登録第3121894号公報Utility Model Registration No. 3121894

しかしながら、このような照明装置では、放熱空間が密閉された空間に形成されているので、放熱プレートから放熱した熱を円筒部外部へ放熱させにくいものとなる。そのため、密閉空間内の温度が上昇し、プリント回路基板やこのプリント回路基板に実装されたLED等の電子部品の温度上昇を抑えることが難しく、十分な放熱性を備えているとはいい難かった。   However, in such an illuminating device, since the heat radiation space is formed in a sealed space, it is difficult to dissipate the heat radiated from the heat radiation plate to the outside of the cylindrical portion. Therefore, the temperature in the sealed space rises, it is difficult to suppress the temperature rise of the printed circuit board and electronic components such as LEDs mounted on the printed circuit board, and it is difficult to say that it has sufficient heat dissipation. .

これを解消するために、放熱プレートを直接円筒部の内周壁に面接合すればよいが、この放熱プレートをプリント回路基板に接合するため、平板状に形成しなければならず、このため円筒部の内周壁に面接合することができない。
また、特許文献1の照明装置は構造が複雑で照明装置内部のLED交換が容易ではなかった。
In order to solve this problem, the heat dissipation plate may be directly bonded to the inner peripheral wall of the cylindrical portion. However, in order to bond this heat dissipation plate to the printed circuit board, it must be formed in a flat plate shape. It cannot be surface-bonded to the inner peripheral wall of.
Moreover, the illumination device of Patent Document 1 has a complicated structure, and it is not easy to replace the LED inside the illumination device.

また、放熱用の円筒管端部金属を円筒部の端部に設け、放熱用プレートの両端をこの円筒管端部金属に接続することにより放熱効率を高めた照明装置が知られている。しかし、放熱プレートの両端部だけが円筒管端部金属に接続されているだけなので、このような照明装置でもLEDから発した熱を十分に放熱させることができない。さらに上記放熱効率を高める為に、円筒管端部金属の肉厚を厚くして放熱効率を高める構成とすると照明装置の重量が増加してしまう。   There is also known an illuminating device in which heat radiation efficiency is improved by providing a metal tube end metal for heat radiation at the end of the cylindrical portion and connecting both ends of the heat radiation plate to the metal tube end metal. However, since only both ends of the heat radiating plate are connected to the cylindrical tube end metal, even such an illuminating device cannot sufficiently dissipate the heat generated from the LED. Furthermore, if the thickness of the cylindrical tube end metal is increased to increase the heat dissipation efficiency in order to increase the heat dissipation efficiency, the weight of the lighting device increases.

また、LEDの発熱量を減らすために順電流を抑えて使用するようにすると、必要照度を得るためにLEDの搭載個数を増やす必要があり、円筒部がおおきくなってしまう。   Further, if the forward current is suppressed to reduce the amount of heat generated by the LED, it is necessary to increase the number of LEDs mounted in order to obtain the required illuminance, resulting in a large cylindrical portion.

本発明は、上記問題に着目してなされたもので、円筒状ケース内部の密閉空間に設けられた発光手段の熱を効率良く放熱させることができ、その発光手段の交換が容易にできる照明装置を提供することを目的とする。     The present invention has been made paying attention to the above problem, and can efficiently dissipate the heat of the light emitting means provided in the sealed space inside the cylindrical case, and can easily replace the light emitting means. The purpose is to provide.

上記目的を達成するため、本発明では、プリント回路基板と、このプリント回路基板に実装される発光手段と、この発光手段から発する熱を放熱させるための放熱部材と、前記プリント回路基板、前記発光手段および前記放熱部材を内部に配置する為の透光性の円筒状ケースを備えた照明装置であって、
前記放熱部材は、筒状で外側面に平坦部を有し、
この平坦部に前記プリント回路基板を接合させ、
前記円筒状ケースと前記放熱部材とにより前記円筒状ケース内に密閉空間を形成するとともに前記放熱部材の内部と外気とを連通させたことを特徴とする。
In order to achieve the above object, according to the present invention, a printed circuit board, a light emitting means mounted on the printed circuit board, a heat radiating member for radiating heat generated from the light emitting means, the printed circuit board, and the light emission A lighting device comprising a translucent cylindrical case for disposing means and the heat dissipating member therein,
The heat dissipation member is cylindrical and has a flat portion on the outer surface,
Bonding the printed circuit board to the flat part,
A sealed space is formed in the cylindrical case by the cylindrical case and the heat radiating member, and the inside of the heat radiating member communicates with the outside air.

この発明によれば、円筒状ケース内部の密閉空間に設けられた発光手段の熱を効率良く放熱させることができる。また、照明装置内部のLEDを容易に交換することができる。   According to this invention, the heat of the light emitting means provided in the sealed space inside the cylindrical case can be efficiently radiated. Further, the LED inside the lighting device can be easily replaced.

実施例1の照明装置の斜視図である。It is a perspective view of the illuminating device of Example 1. FIG. 図1のK−K線に沿う照明装置の断面図である。It is sectional drawing of the illuminating device which follows the KK line | wire of FIG. 実施例1の照明装置の分解斜視図である。It is a disassembled perspective view of the illuminating device of Example 1. FIG. 実施例1の端部金具管の正面図である。FIG. 3 is a front view of an end fitting pipe of the first embodiment. 図4のL−L線に沿う端部金具管の断面図である。FIG. 5 is a cross-sectional view of an end fitting pipe along line LL in FIG. 4. 図4の端部金具管の背面図である。FIG. 5 is a rear view of the end fitting tube of FIG. 4. 実施例1の照明装置の組付説明図である。It is assembly explanatory drawing of the illuminating device of Example 1. FIG. 実施例1の照明装置の組付説明図である。It is assembly explanatory drawing of the illuminating device of Example 1. FIG. 実施例1の他の例を示す図である。6 is a diagram illustrating another example of the first embodiment. FIG. 実施例2の照明装置を示す図である。It is a figure which shows the illuminating device of Example 2. FIG. 実施例3の照明装置を示す図である。It is a figure which shows the illuminating device of Example 3. FIG.

以下、本発明の照明装置を実現する最良の形態を、図面に示す実施例1〜実施例4に基づいて説明する。   Hereinafter, the best mode for realizing the illumination device of the present invention will be described based on Examples 1 to 4 shown in the drawings.

まず、本発明に係る実施例1の照明装置の構成を説明する。   First, the structure of the illuminating device of Example 1 which concerns on this invention is demonstrated.

図1は、実施例1の照明装置の斜視図である。図2は図1のK−K線に沿う照明装置の断面図である。図3は、実施例1の照明装置の分解斜視図である。   FIG. 1 is a perspective view of the lighting apparatus according to the first embodiment. FIG. 2 is a cross-sectional view of the lighting device along the line KK in FIG. FIG. 3 is an exploded perspective view of the lighting apparatus according to the first embodiment.

実施例1の照明装置100は、図1乃至図3に示すように、プリント回路基板14と、このプリント回路基板14に実装される高輝度LED(発光手段)14c,・・・と、この高輝度LED14c,・・・から発する熱を放熱させるための放熱板11および金属板12と、両端が開口した透光性の円筒状ケース10と、この円筒状ケース10の両端の開口10a,10bを塞いで内部を密閉する一対の端部用金具15A,15Bと、これら放熱板11、金属板12および一対の端部用金具15A,15Bを円筒状ケース10内に保持するための端部金具管21,21等を有している。   As shown in FIGS. 1 to 3, the illumination device 100 according to the first embodiment includes a printed circuit board 14, high-intensity LEDs (light emitting means) 14 c mounted on the printed circuit board 14, A heat radiating plate 11 and a metal plate 12 for radiating heat generated from the luminance LEDs 14c,..., A translucent cylindrical case 10 having both ends opened, and openings 10a, 10b at both ends of the cylindrical case 10 are provided. A pair of end fittings 15A and 15B that are closed and sealed inside, and a heat sink 11, the metal plate 12, and a pair of end fittings 15A and 15B for holding the end fitting tubes in the cylindrical case 10. 21 and 21 etc.

18は、照明装置100を工作機械等の内部の壁面等に取り付けるための環状金具である。   Reference numeral 18 denotes an annular fitting for attaching the illumination device 100 to an internal wall surface of a machine tool or the like.

放熱板11と金属板12とで、放熱部材123を構成する。また、端部用金具15A,15Bと端部金具管21,21とで一対の蓋部材を構成する。   The heat radiating plate 11 and the metal plate 12 constitute a heat radiating member 123. Further, the end fittings 15A and 15B and the end fitting tubes 21 and 21 constitute a pair of lid members.

プリント回路基板14の長手方向の長さは、円筒状ケース10のそれより短く設定され、短手方向の巾は円筒状ケース10の内径よりやや小さく設定されている。   The length in the longitudinal direction of the printed circuit board 14 is set shorter than that of the cylindrical case 10, and the width in the short direction is set slightly smaller than the inner diameter of the cylindrical case 10.

また、プリント回路基板14には、複数のネジ穴14f,・・・が所定の間隔で形成されている。また、プリント回路基板14には、複数の高輝度LED14c,・・・が所定の間隔で実装されている。   Further, a plurality of screw holes 14f,... Are formed in the printed circuit board 14 at predetermined intervals. A plurality of high-brightness LEDs 14c,... Are mounted on the printed circuit board 14 at predetermined intervals.

プリント回路基板14の長手方向左端(図3において)には電源用ケーブルのコネクタ14eが設けられている。   At the left end in the longitudinal direction of the printed circuit board 14 (in FIG. 3), a power cable connector 14e is provided.

放熱板11は、アルミや鉄等の金属製で、その短手方向の巾がプリント回路基板14のそれと略同一に設定されている。放熱板11の短手方向の両側端面は下方向(図7において)に向かって傾斜している。   The heat sink 11 is made of a metal such as aluminum or iron, and the width in the short direction is set to be substantially the same as that of the printed circuit board 14. Both side end surfaces of the heat sink 11 in the short direction are inclined downward (in FIG. 7).

また、放熱板11の長手方向の長さは円筒状ケース10のそれと略同一に設定されている。   The length of the heat sink 11 in the longitudinal direction is set to be substantially the same as that of the cylindrical case 10.

そして、この放熱板11には、プリント回路基板14の複数のネジ穴14fに対応する箇所にネジ穴11b,・・・が形成されている。   In the heat radiating plate 11, screw holes 11b,... Are formed at locations corresponding to the plurality of screw holes 14f of the printed circuit board 14.

金属板12は、アルミや鉄等の金属製であり、図7に示すように、ベース部12gとこの両側縁部に所定の角度で支持板部12e,12fが連続形成されている。金属板12の断面は略凹字状(図7において)を呈している。   The metal plate 12 is made of a metal such as aluminum or iron, and as shown in FIG. 7, support plate portions 12e and 12f are continuously formed at a predetermined angle on a base portion 12g and both side edge portions. The cross section of the metal plate 12 has a substantially concave shape (in FIG. 7).

金属板12の支持板部12e,12fの縁部12c,12dの離間距離は、放熱板11の短手方向の巾と略同一に設定されている。また、金属板12の長手方向の長さは放熱板11と略同一に設定されている。金属板12の支持板部12e,12fの内側面12ea,12faが成す角度は、放熱板11の短手方向の両側端面がなす角度と同一に設定されている。   The distance between the edge portions 12c and 12d of the support plate portions 12e and 12f of the metal plate 12 is set to be substantially the same as the width of the heat radiating plate 11 in the short direction. The length of the metal plate 12 in the longitudinal direction is set to be substantially the same as that of the heat radiating plate 11. The angle formed by the inner side surfaces 12ea and 12fa of the support plate portions 12e and 12f of the metal plate 12 is set to be the same as the angle formed by both side end surfaces of the heat sink 11 in the short direction.

端部用金具15A,15Bは、アルミや鉄等の金属製であり、円筒状ケース10の内径と略同一径の円板状に形成されている。また、端部用金具15A,15Bの周縁部の近傍には、周縁に沿って等間隔でネジ穴15Aa,・・・、15Ba,・・・が形成されている。   The end fittings 15 </ b> A and 15 </ b> B are made of metal such as aluminum or iron, and are formed in a disk shape having substantially the same diameter as the inner diameter of the cylindrical case 10. Further, screw holes 15Aa,..., 15Ba,... Are formed at equal intervals along the periphery in the vicinity of the periphery of the end fittings 15A, 15B.

また、この端部用金具15A,15Bには、略逆台形状(図3において)の開口15Ac,15Bcが形成されている(図7参照)。また、端部用金具15Aの開口15Acの上には、後述する電線貫通金物16用の貫通穴15Abが形成されている。   Further, openings 15Ac and 15Bc having substantially inverted trapezoidal shapes (in FIG. 3) are formed in the end fittings 15A and 15B (see FIG. 7). Further, a through hole 15Ab for the wire through metal fitting 16 to be described later is formed on the opening 15Ac of the end fitting 15A.

端部金具管21は、アルミや鉄等の金属製であり、図4〜6に示すように、両端が開口した筒状に形成されている。この端部金具管21内には大径の穴21aと小径の穴21bが連続形成されている。
また、端部金具管21の外周面21acには、高輝度LED14を平面視した方向からみた中心軸上に、照明装置100を工作機械に取り付ける際のガイドライン21adが描かれている(図8参照)。
The end fitting pipe 21 is made of a metal such as aluminum or iron, and is formed in a cylindrical shape having both ends opened as shown in FIGS. A large-diameter hole 21a and a small-diameter hole 21b are continuously formed in the end fitting pipe 21.
Further, on the outer peripheral surface 21ac of the end fitting tube 21, a guideline 21ad for attaching the illumination device 100 to the machine tool is drawn on the central axis viewed from the direction in which the high-intensity LED 14 is viewed in plan (see FIG. 8). ).

端部金具管21の内側面21bdに環状溝21cが形成されている。また、環状溝21cの内径は、円筒状ケース10の内径と略同一に設定されている。環状溝21cの外径は、円筒状ケース10の外径と略同一に設定されている。   An annular groove 21 c is formed on the inner side surface 21 bd of the end fitting pipe 21. Further, the inner diameter of the annular groove 21 c is set substantially the same as the inner diameter of the cylindrical case 10. The outer diameter of the annular groove 21 c is set to be substantially the same as the outer diameter of the cylindrical case 10.

環状溝21c内には、図3に示すパッキン20が設けられている(図2参照)。   A packing 20 shown in FIG. 3 is provided in the annular groove 21c (see FIG. 2).

また、内側面21bdの環状溝21cより内側の部分に端部金具管15A,15Bのネジ穴15Aa,・・・、15Ba,・・・に対応するネジ穴21ba,・・・が形成されている。   Further, screw holes 21ba,... Corresponding to the screw holes 15Aa,..., 15Ba,... Of the end fitting pipes 15A, 15B are formed in a portion inside the annular groove 21c of the inner side surface 21bd. .

環状金具18は、端部金具管21を保持する環状部18aと、この環状部18aを支持する一対のL字状のアーム部を有している。その環状部18aの外周面には、複数のガイドライン18c,・・・が等間隔に描かれている。   The annular fitting 18 has an annular portion 18a that holds the end fitting pipe 21 and a pair of L-shaped arm portions that support the annular portion 18a. A plurality of guide lines 18c,... Are drawn at equal intervals on the outer peripheral surface of the annular portion 18a.

電線貫通金物16には、端部用金具15Aの貫通穴15Abに嵌合する小径の嵌合部16aが形成されている。また、電線貫通金物16には、給電線17を通す貫通穴16cが形成されている。   The wire penetration hardware 16 is formed with a small-diameter fitting portion 16a that fits into the through hole 15Ab of the end fitting 15A. Further, the through-hole metal fitting 16 is formed with a through hole 16c through which the power supply line 17 is passed.

上述したように、放熱板11、金属板12、端部用金具15A,15B、端部金具管21は、アルミや鉄等の金属製であるが、熱伝導性が高く成形性を有していれば上記材質に限られない。   As described above, the heat radiating plate 11, the metal plate 12, the end fittings 15A and 15B, and the end fitting tube 21 are made of metal such as aluminum or iron, but have high thermal conductivity and formability. If it is, it will not be restricted to the said material.

次に本実施例の照明装置の組付けを図3、図7および図8を参照しながら説明する。   Next, assembly of the illumination device of the present embodiment will be described with reference to FIGS. 3, 7, and 8. FIG.

図7に示すように、金属板12の支持板部12e,12fの上部間に放熱板11を配置して、断面が台形状の放熱空間となる放熱部材123を形成する。   As shown in FIG. 7, the heat radiating plate 11 is disposed between the upper portions of the support plate portions 12 e and 12 f of the metal plate 12 to form a heat radiating member 123 having a trapezoidal cross section as a heat radiation space.

そして、この放熱部材123の両端を端部用金具15A,15Bの開口15Ac,15Bcにそれぞれ嵌合させ、端部用金具15A,15Bの外側面15Ae,15Beと放熱部材123の両端面をそれぞれ面一とする。   Then, both ends of the heat radiating member 123 are fitted into the openings 15Ac and 15Bc of the end fittings 15A and 15B, respectively, and the outer side surfaces 15Ae and 15Be of the end fittings 15A and 15B and the both end faces of the heat radiating member 123 are respectively faced. One.

図3に示す電線貫通金物16の嵌合部16aを端部用金具15Aの貫通穴15Abに嵌合させ(図2参照)、プリント回路基板14のコネクタ14eに接続された給電線17の電源側の端部を電線貫通金物16の貫通穴16cに通して引き出す(図2参照)。   The fitting portion 16a of the wire through metal fitting 16 shown in FIG. 3 is fitted into the through hole 15Ab of the end fitting 15A (see FIG. 2), and the power supply side of the feeder 17 connected to the connector 14e of the printed circuit board 14 Is pulled out through the through hole 16c of the wire through metal fitting 16 (see FIG. 2).

次に、放熱部材123、プリント回路基板14および端部用金具15A,15B等を、図8に示すように、円筒状ケース10内に配置する。   Next, the heat dissipating member 123, the printed circuit board 14, the end fittings 15A and 15B, and the like are arranged in the cylindrical case 10 as shown in FIG.

この後、図2に示すように、円筒状ケース10の両端10a,10bをパッキン20,20が装着された端部金具管21,21の環状溝21c,21cに挿入する。   Thereafter, as shown in FIG. 2, both ends 10 a and 10 b of the cylindrical case 10 are inserted into the annular grooves 21 c and 21 c of the end fitting pipes 21 and 21 to which the packings 20 and 20 are attached.

これにより、円筒状ケース10の両端10a,10bをパッキン20,20に密着させるとともに、端部用金具15A,15Bの外側面15Ae,15Beを、端部金具管21,21の内側面21bdに当接させる。この当接により、放熱部材123の両端の開口が端部金具管21,21の小径の穴21b,21b内に臨む。   Thus, both ends 10a and 10b of the cylindrical case 10 are brought into close contact with the packings 20 and 20, and the outer side surfaces 15Ae and 15Be of the end fittings 15A and 15B are brought into contact with the inner side surface 21bd of the end fitting pipes 21 and 21, respectively. Make contact. Due to this contact, the openings at both ends of the heat radiating member 123 face the small-diameter holes 21b and 21b of the end fitting pipes 21 and 21, respectively.

そして、端部用金具15A,15Bのネジ穴15Aa,・・・,15Ba,・・・および各端部金具管21のネジ穴21ba,・・・に防水パッキン付きの座金Zkを通してネジ止めし、端部金具管21,21に端部用金具15A,15Bを固定する。このネジ止めに拠り座金Zkがネジ穴の全てを塞ぐ。   Then, the screw holes 15Aa,..., 15Ba,... Of the end fittings 15A, 15B and the screw holes 21ba,... Of each end fitting tube 21 are screwed through a washer Zk with waterproof packing, The end fittings 15A and 15B are fixed to the end fitting pipes 21 and 21, respectively. Based on this screwing, the washer Zk closes all the screw holes.

以上説明した組み付けに拠り、放熱部材123内の放熱空間が端部用金具15A,15Bの開口15Ac,15Bcおよび端部金具管21,21の小径の穴21b,21bを介して円筒状ケース10の外部と連通するとともに円筒状ケース10と放熱部材123との間の空間が密閉されることとなる(図2参照)。この段階で照明装置100の組み付けが完了する。   Based on the above-described assembly, the heat radiating space in the heat radiating member 123 is formed in the cylindrical case 10 via the openings 15Ac and 15Bc of the end fittings 15A and 15B and the small diameter holes 21b and 21b of the end fitting tubes 21 and 21. While communicating with the outside, the space between the cylindrical case 10 and the heat radiating member 123 is sealed (see FIG. 2). At this stage, the assembly of the lighting device 100 is completed.

この照明装置100は、環状金具18,18によって工作機械内部の所定位置に例えば内壁に円筒ケース10の軸線が鉛直方向に沿った方向となるように取り付けられる。   The illuminating device 100 is attached to a predetermined position inside the machine tool by annular fittings 18 and 18, for example, on the inner wall so that the axis of the cylindrical case 10 is in the direction along the vertical direction.

次に本実施例の照明装置の作用を図1および図2を参照しながら説明する。   Next, the operation of the illumination device of the present embodiment will be described with reference to FIGS.

高輝度LED14cを点灯すると、高輝度LED14cの温度が上昇する。高輝度LED14cの熱がプリント回路基板14に伝わり、プリント回路基板14の温度が上昇する。また、円筒状ケース10の密閉空間へプリント回路基板14の熱や高輝度LED14cの熱が放熱し、この密閉空間の温度が上昇する。   When the high-intensity LED 14c is turned on, the temperature of the high-intensity LED 14c increases. The heat of the high-intensity LED 14c is transmitted to the printed circuit board 14, and the temperature of the printed circuit board 14 rises. Moreover, the heat of the printed circuit board 14 and the heat of the high-intensity LED 14c are radiated to the sealed space of the cylindrical case 10, and the temperature of the sealed space rises.

プリント回路基板14の下面14bは放熱板11の上面11gと接しているので、プリント回路基板14の熱は、放熱板11を介して放熱部材123の放熱空間に放熱される。
放熱部材123の放熱空間は、端部金具管21の小径の穴21bを介して外気と連通しているので放熱空間に放熱された熱は外気に放熱されることとなる。
つまり、密閉空間内の高輝度LED14cの熱が放熱板11を介して外気に直接放熱されることとなる。
この端部用金具15A,15Bは、防水のために放熱部材123と接合され、また端部金具管21,21の小径の穴21b,21bを介して円筒状ケース10の外部に露出している。
放熱部材11から熱伝導して端部用金具15A,15Bの温度が上昇し、この端部用金具15A,15Bの熱はさらに端部金具管21,21に熱伝導する。そして、端部用金具15A,15Bと端部金具管21,21から外気へ放熱される。
Since the lower surface 14 b of the printed circuit board 14 is in contact with the upper surface 11 g of the heat radiating plate 11, the heat of the printed circuit board 14 is radiated to the heat radiating space of the heat radiating member 123 through the heat radiating plate 11.
Since the heat radiating space of the heat radiating member 123 communicates with the outside air through the small-diameter hole 21b of the end fitting tube 21, the heat radiated to the heat radiating space is radiated to the outside air.
That is, the heat of the high-intensity LED 14 c in the sealed space is directly radiated to the outside air through the heat radiating plate 11.
The end fittings 15A and 15B are joined to the heat radiating member 123 for waterproofing, and are exposed to the outside of the cylindrical case 10 through the small diameter holes 21b and 21b of the end fitting pipes 21 and 21. .
Heat conduction from the heat dissipating member 11 raises the temperature of the end fittings 15A and 15B, and the heat of the end fittings 15A and 15B further conducts heat to the end fitting tubes 21 and 21. Then, heat is radiated from the end fittings 15A and 15B and the end fitting pipes 21 and 21 to the outside air.

このように、放熱空間内の熱を端部用金具15A,15B,21,21から円筒状ケース10外へ放熱させるものであるから、プリント回路基板14とこれに実装された高輝度LED14c,・・・等の電子部品の熱を効率良く放熱させることができる。   Thus, the heat in the heat radiation space is radiated from the end fittings 15A, 15B, 21, 21 to the outside of the cylindrical case 10, so that the printed circuit board 14 and the high-intensity LEDs 14c mounted on the printed circuit board 14 are provided.・ ・ Efficiently dissipates heat from electronic components such as

このため、使用中の高輝度LED14cの温度上昇を従来のものに比べて抑えることでき、高輝度LED14cやその周辺の電子部品が高温となることを抑制することができる。これにより使用中の高輝度LED14cやその周囲の電子部品の温度を各電子部品の許容値範囲内に維持できる。   For this reason, the temperature rise of the high-intensity LED 14c in use can be suppressed as compared with the conventional one, and the high-intensity LED 14c and the surrounding electronic components can be suppressed from becoming high temperature. Thereby, the temperature of the high-intensity LED 14c in use and the surrounding electronic components can be maintained within the allowable range of each electronic component.

この結果、高輝度LED14cの熱による高輝度LED14cとその他の電子部品の寿命の短命化を抑制できる。   As a result, it is possible to suppress the shortening of the lifetime of the high-brightness LED 14c and other electronic components due to the heat of the high-brightness LED 14c.

ところで、上記したように放熱効率を向上させることができることから、高輝度LEDの発熱を増加させても高輝度LED14cや他の電子部品の温度が許容値範囲内に収まるのであれば、高輝度LED14cの順電流を増やして照明装置100の照度を上げることもできる。   By the way, since the heat radiation efficiency can be improved as described above, if the temperature of the high-brightness LED 14c and other electronic components is within the allowable range even if the heat generation of the high-brightness LED is increased, the high-brightness LED 14c. It is also possible to increase the illuminance of the lighting device 100 by increasing the forward current.

図9は、実施例1の放熱板11に放熱フィン110c,・・・を一体形成し放熱空間に放熱フィン110c,・・・を突設させた実施例1の他の例である。   9 is another example of the first embodiment in which the heat radiation fins 110c,... Are integrally formed on the heat radiation plate 11 of the first embodiment and the heat radiation fins 110c,.

放熱フィン110c,・・・により放熱空間に放熱するための放熱部材124の表面積が実施例1の放熱部材123に比べて増加するので、高輝度LED14cからの熱の放熱効率をより高めることができる。この放熱フィン110c,・・・の代わりにヒートパイプ等を取り付けて放熱効率を高めてもよい。   Since the surface area of the heat radiating member 124 for radiating heat to the heat radiating space by the heat radiating fins 110c is increased as compared with the heat radiating member 123 of the first embodiment, the heat radiating efficiency of the heat from the high brightness LED 14c can be further increased. . Instead of the heat radiation fins 110c,..., Heat pipes or the like may be attached to increase the heat radiation efficiency.

図10は、実施例2の照明装置200を示す。   FIG. 10 illustrates an illumination device 200 according to the second embodiment.

この照明装置200は、3つのプリント回路基板140f,140g,140hを円筒ケース10の軸線に沿って並べ隣り合うプリント回路基板の縁部と縁部を当接させたプリント回路基板体140と、このプリント回路基板体140の裏面に当接した放熱板112とを有している。
プリント回路基板体140のプリント回路基板140f,140g,140hの表面には高輝度LED14cが実装され、各プリント回路基板140f,140g,140hはそれぞれ異なる外側方向に向けられている。
The lighting device 200 includes three printed circuit boards 140f, 140g, and 140h arranged along the axis of the cylindrical case 10, and a printed circuit board body 140 in which the edges of the adjacent printed circuit boards are in contact with each other. And a heat sink 112 in contact with the back surface of the printed circuit board body 140.
High-brightness LEDs 14c are mounted on the surface of the printed circuit boards 140f, 140g, and 140h of the printed circuit board body 140, and the printed circuit boards 140f, 140g, and 140h are directed in different outward directions.

この放熱板112の短手方向の両端間の距離は、実施例1と同様にプリント回路基板体140のそれに比べやや小さく設定されている。   The distance between both ends of the heat sink 112 in the short direction is set to be slightly smaller than that of the printed circuit board 140 as in the first embodiment.

150Bは後述する放熱部材の一端を保持する端部用金具であり、端部用金具150Bには、金属板12と放熱板112とで構成される放熱部材132の取り付け用の貫通穴150Bcが形成されている。この貫通穴150Bcは、放熱部材132の両端の6角形状の開口と略同一形状となっている。不図示の端部用金具150Aにも貫通穴150Bcと同様の貫通穴150Acが形成されている。   Reference numeral 150B denotes an end fitting for holding one end of a heat radiating member, which will be described later, and the end fitting 150B is formed with a through hole 150Bc for mounting the heat radiating member 132 composed of the metal plate 12 and the heat radiating plate 112. Has been. The through holes 150Bc have substantially the same shape as the hexagonal openings at both ends of the heat dissipation member 132. A through hole 150Ac similar to the through hole 150Bc is formed in the end fitting 150A (not shown).

なお、実施例1と同一の部材には同一符号を付してその説明を省略する。   In addition, the same code | symbol is attached | subjected to the member same as Example 1, and the description is abbreviate | omitted.

この実施例2の照明装置に拠れば、実施例1と同様な効果を得ることができる他に、プリント回路基板体140の各プリント回路基板140f,140g,140hが、それぞれ異なる外側方向に向けられているので、広範囲に亘って照明することができる。   According to the illumination device of the second embodiment, the same effects as in the first embodiment can be obtained, and the printed circuit boards 140f, 140g, and 140h of the printed circuit board body 140 are directed in different outer directions. Therefore, it can illuminate over a wide range.

また、放熱板112を屈曲形成して放熱空間との接触面積を大きくしたので、実施例1に比べて放熱板112の放熱効果が高まる。   Moreover, since the heat sink 112 is bent to increase the contact area with the heat dissipation space, the heat dissipation effect of the heat sink 112 is enhanced as compared with the first embodiment.

このため、高輝度LED14cから発した熱によるプリント回路基板140およびこれに実装された高輝度LED14c等の電子部品の温度上昇を抑えることができる。   For this reason, the temperature rise of electronic components, such as the printed circuit board 140 and the high-intensity LED 14c mounted in this, by the heat emitted from the high-intensity LED 14c can be suppressed.

この高輝度LED14cの温度上昇を抑えることができることにより、高輝度LED14cの順電流を実施例1より増加させることができる。このため、高輝度LED14cの数を減らしても実施例1と同じ照度を得ることができる。換言すれば、同数の高輝度LED14cで実施例1より高い照度を得ることができる。   By suppressing the temperature rise of the high-brightness LED 14c, the forward current of the high-brightness LED 14c can be increased as compared with the first embodiment. For this reason, even if the number of high-brightness LEDs 14c is reduced, the same illuminance as that of the first embodiment can be obtained. In other words, higher illuminance than that of the first embodiment can be obtained with the same number of high-brightness LEDs 14c.

実施例1のプリント回路基板を平面視で横幅を変えることなく円筒ケース10内に収まるように複数のプリント回路基板140f,140g,140hを図10に示すように配設したことにより、円筒状ケース10の寸法を変えることなく放熱部材123の放熱空間を広げることができるとともに実施例1のものに比べて放熱効率をより高めることができる。   A plurality of printed circuit boards 140f, 140g, and 140h are arranged as shown in FIG. 10 so that the printed circuit board of the first embodiment can be accommodated in the cylindrical case 10 without changing the lateral width in plan view. The heat dissipating space of the heat dissipating member 123 can be expanded without changing the size of 10 and the heat dissipating efficiency can be further increased as compared with that of the first embodiment.

実施例1の他の例のように、実施例2の放熱板112の内側面に放熱フィン110cを一体に設けても良いし、ヒートパイプを取り付けても良い。   As in another example of the first embodiment, the heat radiating fins 110c may be integrally provided on the inner surface of the heat radiating plate 112 of the second embodiment, or a heat pipe may be attached.

図11に実施例3の照明装置を示す。   FIG. 11 shows an illumination apparatus of Example 3.

実施例3の照明装置300は、図11に示すように、8枚のプリント回路基板141,・・・を円筒ケース10の軸線にそって環状に並べ互いの縁部を当接させて8角形の筒状としたプリント回路基板体141と、これらプリント回路基板141,・・・に対応して複数の平坦部を有し、この複数の平坦部が複数のプリント回路基板の内側面(裏面)141dに当接された放熱板113とを有している。この放熱板113は両端が開口した8角形の筒状に形成されている。   As shown in FIG. 11, the illumination device 300 according to the third embodiment arranges eight printed circuit boards 141,... In an annular shape along the axis of the cylindrical case 10, and makes the edges contact each other to form an octagon. , And a plurality of flat portions corresponding to the printed circuit boards 141,..., And the plurality of flat portions are inner side surfaces (back surfaces) of the plurality of printed circuit boards. And a heat radiating plate 113 in contact with 141d. The heat radiating plate 113 is formed in an octagonal cylindrical shape having both ends opened.

プリント回路基板体141の各外表面141cには、プリント回路基板体141の長手方向に沿って所定間隔で高輝度LED14c,・・・が実装され、各外表面141cは、それぞれ異なる外側方向へ向けられている。   High brightness LEDs 14c,... Are mounted on each outer surface 141c of the printed circuit board body 141 at predetermined intervals along the longitudinal direction of the printed circuit board body 141, and each outer surface 141c faces a different outer direction. It has been.

端部用金具151Bには、放熱板113の開口端と略同一形状の貫通穴151Bcが形成されている。不図示の151Aにも151Bcと同様の貫通穴151Acが形成されている。   A through hole 151Bc having substantially the same shape as the opening end of the heat dissipation plate 113 is formed in the end fitting 151B. A through hole 151Ac similar to 151Bc is also formed in 151A (not shown).

なお、実施例1,2と同一の部材には同一符号を付してその説明を省略する。   In addition, the same code | symbol is attached | subjected to the member same as Example 1, 2, and the description is abbreviate | omitted.

この実施例3の照明装置300によれば、第1,2実施例と同様な効果を得ることができる他に、プリント回路基板体141の各外表面141cがそれぞれ異なる外側方向へ向けられているので、さらに広範囲(360°の範囲)に亘って照明することができる。   According to the illumination device 300 of the third embodiment, the same effects as those of the first and second embodiments can be obtained, and the outer surfaces 141c of the printed circuit board body 141 are directed in different outward directions. Therefore, it can illuminate over a wider range (360 ° range).

プリント回路基板体141を八角形の筒状に形成したので、プリント回路基板体141の高輝度LED14cの搭載面積を大きくすることができ、このため、実装する高輝度LED14cの数を増加させることができる。   Since the printed circuit board body 141 is formed in an octagonal cylindrical shape, the mounting area of the high-brightness LEDs 14c on the printed circuit board body 141 can be increased, and therefore the number of high-brightness LEDs 14c to be mounted can be increased. it can.

実装する高輝度LED14cの数を増加させると、高輝度LED14cの総発熱量が増加するが、8角形の筒状に形成した放熱板113の放熱面積や放熱空間を大きくとることができるので、高輝度LED14cや他の電子部品の温度上昇の抑制を十分に図ることができる。   Increasing the number of high-brightness LEDs 14c to be mounted increases the total heat generation amount of the high-brightness LEDs 14c. However, since the heat radiation area and the heat radiation space of the heat sink 113 formed in an octagonal cylindrical shape can be increased, It is possible to sufficiently suppress the temperature rise of the luminance LED 14c and other electronic components.

実施例1〜実施例3では、円筒状の照明装置に対し多角形状の放熱部材を適用する例を示したが、発熱体を内包した密閉構造を有する装置であって、密閉構造の壁の一部を構成する放熱部材を装置内部に設置できる装置であれば他の装置でも適用できる。   In the first to third embodiments, the example in which the polygonal heat dissipation member is applied to the cylindrical lighting device has been described. However, the device has a sealed structure including a heating element, and includes a sealed structure wall. Other devices can be applied as long as the heat dissipating member constituting the unit can be installed inside the device.

10 円筒状ケース
11g 平坦部
14 プリント回路基板
14c 発光手段
100 照明装置
123 放熱部材
DESCRIPTION OF SYMBOLS 10 Cylindrical case 11g Flat part 14 Printed circuit board 14c Light emission means 100 Illuminating device 123 Heat dissipation member

Claims (4)

プリント回路基板と、このプリント回路基板に実装される発光手段と、この発光手段から発する熱を放熱させるための放熱部材と、前記プリント回路基板、前記発光手段および前記放熱部材を内部に配置する為の透光性の円筒状ケースを備えた照明装置であって、
前記放熱部材は、筒状で外周面に平坦部を有し、
この平坦部に前記プリント回路基板を接合させ、
前記円筒状ケースと前記放熱部材とにより前記円筒状ケース内に密閉空間を形成するとともに前記放熱部材の内部と外気とを連通させたことを特徴とする照明装置。
A printed circuit board, a light emitting means mounted on the printed circuit board, a heat radiating member for radiating heat generated from the light emitting means, and the printed circuit board, the light emitting means, and the heat radiating member are disposed inside. A lighting device having a translucent cylindrical case,
The heat dissipation member is cylindrical and has a flat portion on the outer peripheral surface,
Bonding the printed circuit board to the flat part,
An illuminating device characterized in that a sealed space is formed in the cylindrical case by the cylindrical case and the heat radiating member, and the inside of the heat radiating member communicates with the outside air.
前記プリント回路基板を、前記円筒状ケースの軸線に沿って複数並べて配置し、
前記放熱部材の平坦部を前記複数のプリント回路基板に対応して複数設け、この複数の平坦部に前記複数のプリント回路基板をそれぞれ接合させたことを特徴とする請求項1の照明装置。
A plurality of the printed circuit boards are arranged along the axis of the cylindrical case,
The lighting device according to claim 1, wherein a plurality of flat portions of the heat radiating member are provided corresponding to the plurality of printed circuit boards, and the plurality of printed circuit boards are joined to the plurality of flat portions, respectively.
前記放熱部材の内部空間に突出する放熱フィンを前記放熱部材の内面に一体形成したことを特徴とする請求項1または請求項2に記載の照明装置。   The illuminating device according to claim 1 or 2, wherein a radiating fin protruding into an internal space of the radiating member is integrally formed on an inner surface of the radiating member. 前記円筒状ケースの両端が開口し、
前記放熱部材は多角形であり、
開口を有する円板を一対設け、それぞれの開口に前記放熱部材の両端を嵌合させて前記円板を前記放熱部材の両端に取り付け、
金属製の一対の蓋部材を前記円筒状ケースの両端の開口に設けてこの開口を塞ぐとともにこの一対の蓋部材のそれぞれに開口を形成し、開口を介して前記放熱部材の内部空間を外気に連通させたことを特徴とする請求項1乃至請求項3の何れか1つに記載の照明装置。
Both ends of the cylindrical case are open,
The heat dissipating member is polygonal,
A pair of discs having openings is provided, and both ends of the heat radiating member are fitted to the respective openings, and the discs are attached to both ends of the heat radiating member,
A pair of metal lid members are provided at the openings at both ends of the cylindrical case to close the openings, and an opening is formed in each of the pair of lid members, and the internal space of the heat radiating member is opened to the outside via the openings. The lighting device according to claim 1, wherein the lighting device is in communication.
JP2009040646A 2009-02-24 2009-02-24 Lighting device Pending JP2010198828A (en)

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